WO2019113754A1 - Écran à commande tactile, et structure de détection de commande tactile par pression et procédé de détermination de pression de commande tactile associés - Google Patents

Écran à commande tactile, et structure de détection de commande tactile par pression et procédé de détermination de pression de commande tactile associés Download PDF

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Publication number
WO2019113754A1
WO2019113754A1 PCT/CN2017/115498 CN2017115498W WO2019113754A1 WO 2019113754 A1 WO2019113754 A1 WO 2019113754A1 CN 2017115498 W CN2017115498 W CN 2017115498W WO 2019113754 A1 WO2019113754 A1 WO 2019113754A1
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WO
WIPO (PCT)
Prior art keywords
layer
touch
pressure
conductive layer
sensing structure
Prior art date
Application number
PCT/CN2017/115498
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English (en)
Chinese (zh)
Inventor
陈羿恺
邱创弘
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2017/115498 priority Critical patent/WO2019113754A1/fr
Priority to CN201780096978.4A priority patent/CN111356972A/zh
Priority to TW107144462A priority patent/TW201928634A/zh
Publication of WO2019113754A1 publication Critical patent/WO2019113754A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of touch, and more particularly to a touch panel and a pressure touch sensing structure thereof and a touch pressure judging method.
  • the main principle of the third dimension touch is to use a spacer design to mount the pressure sensing component on different layers of substrates.
  • OCA internal optical adhesive
  • the pressure sensing is a four-point sensing method. If the design of the shaped panel is performed, the accuracy of the sensing will be greatly reduced.
  • the technical problem to be solved by the present invention is to provide a touch panel capable of sensing the touch pressure and a pressure touch sensing structure thereof and a touch pressure judging method.
  • the technical solution adopted by the present invention to solve the technical problem is to construct a pressure touch sensing structure of a touch panel, which comprises a substrate, a TFT layer, an OLED layer, and a passivation layer which are sequentially stacked and distributed.
  • the pressure touch sensing structure includes a pressure sensing structure;
  • the pressure sensing structure includes a first conductive layer, a dielectric layer, and a second conductive layer which are sequentially stacked and distributed;
  • the first conductive layer, the dielectric layer, and the second conductive layer are sequentially disposed in a section between the substrate and the passivation layer;
  • the first conductive layer, the dielectric layer, and the second conductive layer are sequentially stacked to form the pressure sensing layer, the substrate, the pressure sensing layer, the TFT layer, the OLED layer, and the passivation layer Stack settings in turn.
  • the first conductive layer, the dielectric layer, and the second conductive layer are sequentially stacked to form the pressure sensing layer; the substrate, the TFT layer, the OLED layer, the pressure sensing layer, and the passivation layer Stack settings in turn.
  • the substrate, the first conductive layer, the TFT layer, the OLED layer, the second conductive layer, and the passivation layer are sequentially stacked, and the dielectric layer is formed on the TFT layer or the OLED layer.
  • the first conductive layer is formed by sputtering using at least one of an electrically conductive metal, a metal alloy, and a metal oxide;
  • the second conductive layer is formed by sputtering using at least one of an electrically conductive metal, a metal alloy, and a metal oxide.
  • the metal comprises one of aluminum, silver, copper, molybdenum, tin, zinc, gold, titanium, and antimony.
  • the metal oxide comprises at least one of indium tin oxide and indium zinc oxide.
  • the dielectric layer is formed of one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, and liquid deposition of an organic material; or
  • the dielectric layer is formed of one of physical material deposition, chemical vapor deposition, evaporation, sputtering, and liquid deposition from an inorganic material.
  • the passivation layer comprises one layer or is formed of a plurality of layers, and each layer is formed of one of physical material or inorganic material by physical vapor deposition, chemical vapor deposition, evaporation, sputtering, liquid deposition.
  • the organic material comprises at least one of polyethylene terephthalate, polyethylene, and polyethylene naphthalate.
  • the inorganic material comprises at least one of silicon oxide and silicon nitride.
  • the substrate is a glass substrate, or polyethylene terephthalate, polyethylene naphthalate, polyethylene succinate, polyimide, fiber reinforced composite A substrate formed from one of the materials.
  • a touch panel includes the pressure touch sensing structure.
  • the touch panel is a flexible flexible touch panel.
  • the touch panel further includes a processor electrically connected to the first conductive layer and the second conductive layer, respectively, the processor acquires a capacitance signal, and calculates a touch pressure.
  • a touch pressure sensing method is adopted, and the touch pressure sensing method includes:
  • the touch pressure applied by the force applying member is obtained.
  • the method further comprises the steps of:
  • the touch panel and the pressure touch sensing structure and the touch pressure determining method of the present invention have the following beneficial effects: the touch panel and the pressure touch sensing structure thereof in the embodiment of the present invention are externally disposed on the passivation layer.
  • the touch panel and the pressure touch sensing structure thereof in the embodiment of the present invention are externally disposed on the passivation layer.
  • the coordinates of the touch position on the touch panel can be obtained, so that three dimensions can be sensed by the touch.
  • the pressure sensing structure can be distributed on the touch panel over the entire surface, and the capacitance signal can be separately formed in the touch area, so that each position on the hard touch panel and the flexible touch panel can be touched. The touch pressure is sensed.
  • FIG. 1 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure according to a first embodiment of the present invention
  • FIG. 2 is a schematic view showing the capacitance of the touch panel of FIG. 1 before and after being touched;
  • FIG. 3 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure in a second embodiment of the present invention
  • FIG. 4 is a schematic diagram of capacitance of the touch panel of FIG. 3 before and after being touched;
  • FIG. 5 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure according to a third embodiment of the present invention.
  • FIG. 6 is a schematic diagram of capacitance of the touch panel of FIG. 5 before and after being touched;
  • FIG. 7 is a schematic flow chart of a touch pressure judging method using a pressure touch sensing structure according to the present invention.
  • the touch panel 10 in a preferred embodiment of the present invention includes a substrate 11 , a TFT layer 12 (TFT: Thin Film Transistor), and an OLED layer 13 (OLED: Organic Light-).
  • the touch panel 10 further includes a pressure touch sensing structure 15 including a pressure sensing structure, and the pressure sensing structure includes a stacking structure.
  • the first conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially distributed in a section between the substrate 11 and the passivation layer 14.
  • the passivation layer 14 is pressed, according to the change in capacitance between the first conductive layer 151 and the second conductive layer 153 and the capacitance change between the second conductive layer 153 and the biasing member 20 on the passivation layer 14, The touch pressure applied by the force applying member 20 is released.
  • the substrate 11 is a glass substrate, and other components on the touch panel 10 can be formed on the glass substrate.
  • the substrate 11 may be made of polyethylene terephthalate (abbreviation: PET), polyethylene naphthalate (PEN), polyethylene succinate ( Abbreviation: PES), polyimide (abbreviation: PI), fiber reinforced composite material (abbreviation: FRP) formed in one of the materials.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PES polyethylene succinate
  • PI polyimide
  • FRP fiber reinforced composite material
  • the process of the TFT layer 12 and the OLED layer 13 can be a common process of the TFT and the OLED, and the ordinary touch panel 10 and the flexible flexible touch panel 10 can be satisfied.
  • the passivation layer 14 is formed of an insulating material such as an organic material or an inorganic material, and is disposed on the outermost layer of the panel to protect the panel and withstand external touch pressure.
  • the first conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially stacked to form a pressure sensing layer 15', and the first conductive layer 151 and the second conductive layer 153 are formed. They are respectively formed of a conductive material and can conduct electricity.
  • the dielectric layer 152 is usually formed of an insulating material, and a capacitance can be formed between the first conductive layer 151 and the second conductive layer 153.
  • the touch panel 10 further includes a processor electrically connected to the first conductive layer 151 and the second conductive layer 153, respectively, the processor acquires a capacitance signal, and calculates a touch pressure, and at the same time, according to the touch
  • the processor acquires a capacitance signal, and calculates a touch pressure, and at the same time, according to the touch
  • the horizontal and vertical coordinates of the touch position on the touch panel and the position change in the thickness direction of the touch panel 10 are obtained, thereby enabling Touch can achieve three dimensions of sensing.
  • the pressure sensing structure can be distributed on the touch panel and can form a separate capacitive signal in the touch area, so that each position on the hard touch panel and the flexible touch panel can be sensed during touch. Touch pressure.
  • the substrate 11, the pressure sensing layer 15', the TFT layer 12, the OLED layer 13, and the passivation layer 14 are sequentially stacked, and when the passivation layer 14 is pressed by an external touch, according to the first conductive layer 151, The change in capacitance between the second conductive layer 153 and the change in capacitance between the second conductive layer 153 and the urging member 20 on the passivation layer 14 yield the touch pressure applied by the urging member 20.
  • the pressure sensing mechanism of the pressure sensing structure is as follows: when the passivation layer 14 is pressed by an external force, the deformation caused by the dielectric layer 152 causes a change in the capacitance value to perform force. Discrimination.
  • the process is as follows: when no pressure is applied initially, the single point capacitance value between the first conductive layer 151 and the second conductive layer 153 is C1;
  • the capacitance between the force applying member 20 and the second conductive layer 153 is C3, between the first conductive layer 151 and the second conductive layer 153.
  • the capacitance of the capacitor is C2. Therefore, the capacitance of the single point at the position of the urging member 20 is C2+C3, and the capacitance of the single conductive layer 151 is 1/C2+1/C3.
  • the values of C2 and C3 follow the capacitance formula:
  • ⁇ dielectric coefficient, which changes with the material of the dielectric layer 152
  • the force exerted by the area in turn, the force value of the pressure sensing structure.
  • Another more precise way is to establish a database of pressures for the pressure-sensing structure that is produced, and then establish a relationship between the capacitance value and the force to determine the force received.
  • the first conductive layer 151 is formed by sputtering of an electrically conductive metal
  • the second conductive layer 153 is also formed by sputtering of a conductive metal
  • the metal for sputtering includes aluminum, silver, One of copper, molybdenum, tin, zinc, gold, titanium, and antimony.
  • the material used to form the first conductive layer 151 and the second conductive layer 153 is a metal material commonly used in semiconductor manufacturing.
  • the conductive metal alloy may be formed by a sputtering process to form the first conductive layer 151, the second conductive layer 153, and the metal alloy.
  • the components may include two or more of aluminum, silver, copper, molybdenum, tin, zinc, gold, titanium, ruthenium, and the like.
  • the conductive metal oxide may be formed by a sputtering process to form the first conductive layer 151, the second conductive layer 153, and the metal oxide.
  • the metal oxide may be included, and a combination of plural kinds may also be included.
  • the dielectric layer 152 is formed by an organic material using a physical vapor deposition process.
  • the dielectric layer 152 can also be one of chemical vapor deposition, evaporation, sputtering, and liquid deposition. Process formation.
  • the dielectric layer 152 is formed of an inorganic material by one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition.
  • the passivation layer 14 may be formed of one of physical material or inorganic material by physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition, and the passivation layer 14 may be formed only by one layer or organic material or inorganic. The material is formed into a multilayer stack to form a passivation layer 14.
  • the above organic materials include one of polyethylene terephthalate (abbreviation: PET), polyethylene (abbreviation: PE), and polyethylene naphthalate (abbreviation: PEN).
  • PET polyethylene terephthalate
  • PE polyethylene
  • PEN polyethylene naphthalate
  • a plurality of combinations may be employed; the inorganic material includes one of silicon oxide and silicon nitride, or a combination of the two.
  • the pressure touch sensing structure After the pressure touch sensing structure obtains the horizontal and vertical coordinates of the touch position on the touch panel 10, the position change in the thickness direction of the touch panel 10, and the touch pressure of the touch position, the information is transmitted to the read.
  • the chip, the read chip is passed to the motherboard, and the motherboard transmits the information to the processor for processing, and then transmits it to the display screen for corresponding display on the display screen.
  • the pressure sensing structure also includes a first conductive layer 151, a dielectric layer 152, and a second conductive layer 153, with respect to the first embodiment.
  • the conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially stacked to form a pressure sensing layer 15'.
  • the pressure sensing layer 15' in this embodiment is disposed between the OLED layer 13 and the passivation layer 14, the substrate 11, the TFT layer 12, the OLED layer 13, and the pressure sensing layer 15'. And the passivation layer 14 is laminated in this order.
  • the pressure sensing in the second embodiment is specifically as follows;
  • the single point capacitance value between the first conductive layer 151 and the second conductive layer 153 is C1;
  • the capacitance between the force applying member 20 and the second conductive layer 153 is C3, between the first conductive layer 151 and the second conductive layer 153.
  • the capacitance of the capacitor is C2. Therefore, the capacitance of the single point at the position of the urging member 20 is C2+C3, and the capacitance of the single conductive layer 151 is 1/C2+1/C3.
  • the values of C2 and C3 follow the capacitance formula:
  • ⁇ dielectric coefficient, which changes with the material of the dielectric layer 152
  • the force exerted by the area in turn, the force value of the pressure sensing structure.
  • the pressure sensing structure includes a first conductive layer 151, a dielectric layer 152, and a second conductive layer 153 with respect to the first and second embodiments.
  • the substrate 11, the first conductive layer 151, the TFT layer 12, the OLED layer 13, the second conductive layer 153, and the passivation layer 14 are sequentially stacked, and the dielectric layer is laminated.
  • 152 is formed on the TFT layer 12 or the OLED layer 13.
  • the TFT layer 12 and the OLED layer 13 are sequentially formed on the first conductive layer 151.
  • the TFT layer 12 or the OLED layer 13 there is a one-step process for the organic material.
  • the inorganic material is formed into a dielectric layer 152 by one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition, and the dielectric layer 152 is formed in the TFT layer 12 or the OLED layer 13.
  • the second conductive layer 153 is formed on the OLED layer 13, and finally the passivation layer 14 is formed on the second conductive layer 153.
  • the dielectric layer 152 in this embodiment belongs to the TFT layer 12 or the OLED layer 13 and may be located on the side of the TFT layer 12 adjacent to the first conductive layer 151, in contact with the first conductive layer 151, or in the OLED layer 13.
  • the side surface adjacent to the second conductive layer 153 may be in contact with the second conductive layer 153 or may not be in contact with the first conductive layer 151 and the second conductive layer 153.
  • the dielectric layer 152 in this embodiment may form a capacitance between the first conductive layer 151 and the second conductive layer 153.
  • FIG. 6 and FIG. 4 the process description of the mechanism of pressure sensing on the pressure sensing structure in the first and second embodiments is as shown in FIG. 6.
  • the pressure sensing in the third embodiment is specifically as follows;
  • the single point capacitance value between the first conductive layer 151 and the second conductive layer 153 is C1;
  • the capacitance between the force applying member 20 and the second conductive layer 153 is C3, between the first conductive layer 151 and the second conductive layer 153.
  • the capacitance of the capacitor is C2. Therefore, the capacitance of the single point at the position of the urging member 20 is C2+C3, and the capacitance of the single conductive layer 151 is 1/C2+1/C3.
  • the values of C2 and C3 follow the capacitance formula:
  • ⁇ dielectric coefficient, which changes with the material of the dielectric layer 152
  • the force exerted by the area in turn, the force value of the pressure sensing structure.
  • the touch pressure determination method using the pressure touch sensing structure includes the following steps:
  • the touch pressure applied by the urging member 20 is obtained.
  • the position change in the direction of the touch pressure can be obtained, that is, the position change in the thickness direction of the touch panel 10 can be obtained.
  • touch pressure determination method may further include the following steps:

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

L'invention concerne un écran à commande tactile, et une structure de détection de commande tactile par pression et un procédé de détermination de pression de commande tactile associés. L'écran à commande tactile (10) comprend un substrat (11), une couche TFT (12), une couche OLED (13) et une couche de passivation (14) qui sont distribuées séquentiellement d'une manière stratifiée. La structure de détection de commande tactile par pression comprend une structure de détection de pression (15). La structure de détection de pression (15) comprend une première couche conductrice (151), une couche diélectrique (152) et une seconde couche conductrice (153) qui sont distribuées séquentiellement d'une manière stratifiée. La première couche conductrice (151), la couche diélectrique (152) et la seconde couche conductrice (153) sont distribuées séquentiellement dans une région située entre le substrat (11) et la couche de passivation (14). Lorsqu'on exerce une pression sur la couche de passivation (14), en fonction d'un changement de la capacité entre la première couche conductrice (151) et la seconde couche conductrice (153) et d'un changement de la capacité entre la seconde couche conductrice (153) et un élément d'application de force (20) sur la couche de passivation (14), une pression de commande tactile appliquée par l'élément d'application de force (20) est obtenue. La structure de détection de pression (15) peut être distribuée entièrement sur l'écran à commande tactile (10), et peut former indépendamment un signal de capacité dans une zone de commande tactile, de sorte que chaque emplacement puisse détecter une pression de commande tactile pendant une commande tactile.
PCT/CN2017/115498 2017-12-11 2017-12-11 Écran à commande tactile, et structure de détection de commande tactile par pression et procédé de détermination de pression de commande tactile associés WO2019113754A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/CN2017/115498 WO2019113754A1 (fr) 2017-12-11 2017-12-11 Écran à commande tactile, et structure de détection de commande tactile par pression et procédé de détermination de pression de commande tactile associés
CN201780096978.4A CN111356972A (zh) 2017-12-11 2017-12-11 触控面板及其压力触控传感结构和触控压力判断方法
TW107144462A TW201928634A (zh) 2017-12-11 2018-12-11 觸控面板及其壓力觸控傳感結構和觸控壓力判斷方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/115498 WO2019113754A1 (fr) 2017-12-11 2017-12-11 Écran à commande tactile, et structure de détection de commande tactile par pression et procédé de détermination de pression de commande tactile associés

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WO2019113754A1 true WO2019113754A1 (fr) 2019-06-20

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CN (1) CN111356972A (fr)
TW (1) TW201928634A (fr)
WO (1) WO2019113754A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN204759388U (zh) * 2015-03-12 2015-11-11 财团法人工业技术研究院 触控装置
CN106775134A (zh) * 2017-03-31 2017-05-31 京东方科技集团股份有限公司 柔性基板、触控显示基板及其制作方法、触控显示装置
CN107045406A (zh) * 2017-02-07 2017-08-15 南昌欧菲显示科技有限公司 电子设备、触摸显示屏及压力感应触摸屏
KR20170104857A (ko) * 2016-03-08 2017-09-18 주식회사 지니틱스 뮤추얼 방식을 이용한 터치압력 감지ic
CN107193144A (zh) * 2017-04-26 2017-09-22 武汉华星光电技术有限公司 Ltps阵列基板及其制作方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485590B (zh) * 2012-12-18 2015-05-21 Unidisplay Inc 觸控面板及其製造方法
CN105700738B (zh) * 2015-12-21 2021-09-14 联想(北京)有限公司 一种触控显示屏及电子设备
CN107305447A (zh) * 2016-04-18 2017-10-31 群创光电股份有限公司 触控显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204759388U (zh) * 2015-03-12 2015-11-11 财团法人工业技术研究院 触控装置
KR20170104857A (ko) * 2016-03-08 2017-09-18 주식회사 지니틱스 뮤추얼 방식을 이용한 터치압력 감지ic
CN107045406A (zh) * 2017-02-07 2017-08-15 南昌欧菲显示科技有限公司 电子设备、触摸显示屏及压力感应触摸屏
CN106775134A (zh) * 2017-03-31 2017-05-31 京东方科技集团股份有限公司 柔性基板、触控显示基板及其制作方法、触控显示装置
CN107193144A (zh) * 2017-04-26 2017-09-22 武汉华星光电技术有限公司 Ltps阵列基板及其制作方法

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CN111356972A (zh) 2020-06-30
TW201928634A (zh) 2019-07-16

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