WO2019113754A1

WO2019113754A1 - Touch-control panel, and pressure touch-control sensing structure and touch-control pressure determination method therefor

Info

Publication number: WO2019113754A1
Application number: PCT/CN2017/115498
Authority: WO
Inventors: 陈羿恺; 邱创弘
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-12-11
Filing date: 2017-12-11
Publication date: 2019-06-20
Also published as: TW201928634A; CN111356972A

Abstract

Provided are a touch-control panel, and a pressure touch-control sensing structure and a touch-control pressure determination method therefor. The touch-control panel (10) comprises a substrate (11), a TFT layer (12), an OLED layer (13) and a passivation layer (14) that are sequentially distributed in a laminated manner. The pressure touch-control sensing structure comprises a pressure sensing structure (15). The pressure sensing structure (15) comprises a first conductive layer (151), a dielectric layer (152) and a second conductive layer (153) that are sequentially distributed in a laminated manner. The first conductive layer (151), the dielectric layer (152) and the second conductive layer (153) are sequentially distributed in a region located between the substrate (11) and the passivation layer (14). When the passivation layer (14) is pressed, according to a change in the capacitance between the first conductive layer (151) and the second conductive layer (153) and a change in the capacitance between the second conductive layer (153) and a force application member (20) on the passivation layer (14), a touch-control pressure applied by the force application member (20) is obtained. The pressure sensing structure (15) can be entirely distributed on the touch-control panel (10), and can independently form a capacitance signal in a touch-control area, such that each location can sense a touch-control pressure during touch control.

Description

Touch panel and pressure touch sensing structure thereof and touch pressure judging method

Technical field

The present invention relates to the field of touch, and more particularly to a touch panel and a pressure touch sensing structure thereof and a touch pressure judging method.

Background technique

The function of the two-dimensional touch applied to the touch panel in the related art has been developed for many years. In order to meet the new demand of the consumer product, the American company proposed a third-dimensional touch concept, which adds pressure to the two-dimensional touch function. Measurement.

The main principle of the third dimension touch is to use a spacer design to mount the pressure sensing component on different layers of substrates. When the surface is subjected to the pressure channel, the gap between the adhesives of the internal optical adhesive (OCA) can be changed. Pressing the size and position of the force, improving the shortcomings of the screen edge may not be accurate and flexible, and with temperature compensation, can offset the impact of temperature changes on the sensing results.

The above method has the following problems:

1. Limited by the pressure sensing mechanism, the design of the product organization is more complicated, and the product as a whole cannot be thinned.

2. It is not possible to sense the pressure at each point on the display at the same time.

3. Cannot be applied to soft panels to achieve wrapable features.

The pressure sensing is a four-point sensing method. If the design of the shaped panel is performed, the accuracy of the sensing will be greatly reduced.

technical problem

The technical problem to be solved by the present invention is to provide a touch panel capable of sensing the touch pressure and a pressure touch sensing structure thereof and a touch pressure judging method.

Technical solution

The technical solution adopted by the present invention to solve the technical problem is to construct a pressure touch sensing structure of a touch panel, which comprises a substrate, a TFT layer, an OLED layer, and a passivation layer which are sequentially stacked and distributed. The pressure touch sensing structure includes a pressure sensing structure;

The pressure sensing structure includes a first conductive layer, a dielectric layer, and a second conductive layer which are sequentially stacked and distributed;

The first conductive layer, the dielectric layer, and the second conductive layer are sequentially disposed in a section between the substrate and the passivation layer;

When the passivation layer is pressed, according to a change in capacitance between the first conductive layer and the second conductive layer and a change in capacitance between the second conductive layer and a biasing member on the passivation layer The touch pressure applied by the force applying member is obtained.

Preferably, the first conductive layer, the dielectric layer, and the second conductive layer are sequentially stacked to form the pressure sensing layer, the substrate, the pressure sensing layer, the TFT layer, the OLED layer, and the passivation layer Stack settings in turn.

Preferably, the first conductive layer, the dielectric layer, and the second conductive layer are sequentially stacked to form the pressure sensing layer; the substrate, the TFT layer, the OLED layer, the pressure sensing layer, and the passivation layer Stack settings in turn.

The substrate, the first conductive layer, the TFT layer, the OLED layer, the second conductive layer, and the passivation layer are sequentially stacked, and the dielectric layer is formed on the TFT layer or the OLED layer.

Preferably, the first conductive layer is formed by sputtering using at least one of an electrically conductive metal, a metal alloy, and a metal oxide;

The second conductive layer is formed by sputtering using at least one of an electrically conductive metal, a metal alloy, and a metal oxide.

Preferably, the metal comprises one of aluminum, silver, copper, molybdenum, tin, zinc, gold, titanium, and antimony.

Preferably, the metal oxide comprises at least one of indium tin oxide and indium zinc oxide.

Preferably, the dielectric layer is formed of one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, and liquid deposition of an organic material; or

The dielectric layer is formed of one of physical material deposition, chemical vapor deposition, evaporation, sputtering, and liquid deposition from an inorganic material.

Preferably, the passivation layer comprises one layer or is formed of a plurality of layers, and each layer is formed of one of physical material or inorganic material by physical vapor deposition, chemical vapor deposition, evaporation, sputtering, liquid deposition.

Preferably, the organic material comprises at least one of polyethylene terephthalate, polyethylene, and polyethylene naphthalate.

Preferably, the inorganic material comprises at least one of silicon oxide and silicon nitride.

Preferably, the substrate is a glass substrate, or polyethylene terephthalate, polyethylene naphthalate, polyethylene succinate, polyimide, fiber reinforced composite A substrate formed from one of the materials.

A touch panel includes the pressure touch sensing structure.

Preferably, the touch panel is a flexible flexible touch panel.

Preferably, the touch panel further includes a processor electrically connected to the first conductive layer and the second conductive layer, respectively, the processor acquires a capacitance signal, and calculates a touch pressure.

A touch pressure sensing method is adopted, and the touch pressure sensing method includes:

Touching the outside of the passivation layer;

Obtaining a change in capacitance between the first conductive layer and the second conductive layer before and after the touch and a change in capacitance between the second conductive layer and the force applying member on the touch position;

According to the change of the capacitance, the touch pressure applied by the force applying member is obtained.

Preferably, the method further comprises the steps of:

Determining a coordinate position of the pressed position on the touch panel according to the corresponding sensing point on the first conductive layer and the second conductive layer of the touch position.

Beneficial effect

The touch panel and the pressure touch sensing structure and the touch pressure determining method of the present invention have the following beneficial effects: the touch panel and the pressure touch sensing structure thereof in the embodiment of the present invention are externally disposed on the passivation layer. When the touch is pressed, according to the change of the capacitance between the first conductive layer and the second conductive layer and the change of the capacitance between the second conductive layer and the force applying member on the passivation layer, the corresponding calculation can be used to obtain the application. The touch pressure applied by the force member.

At the same time, according to the position of the sensing point triggered by the touch to the first conductive layer and the second conductive layer, the coordinates of the touch position on the touch panel can be obtained, so that three dimensions can be sensed by the touch.

Further, the pressure sensing structure can be distributed on the touch panel over the entire surface, and the capacitance signal can be separately formed in the touch area, so that each position on the hard touch panel and the flexible touch panel can be touched. The touch pressure is sensed.

DRAWINGS

The present invention will be further described below in conjunction with the accompanying drawings and embodiments, in which:

1 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure according to a first embodiment of the present invention;

2 is a schematic view showing the capacitance of the touch panel of FIG. 1 before and after being touched;

3 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure in a second embodiment of the present invention;

4 is a schematic diagram of capacitance of the touch panel of FIG. 3 before and after being touched;

5 is a cross-sectional structural view of a touch panel with a pressure touch sensing structure according to a third embodiment of the present invention;

6 is a schematic diagram of capacitance of the touch panel of FIG. 5 before and after being touched;

FIG. 7 is a schematic flow chart of a touch pressure judging method using a pressure touch sensing structure according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

For a better understanding of the technical features, objects and effects of the present invention, the embodiments of the present invention are described in detail with reference to the accompanying drawings.

As shown in FIG. 1 , the touch panel 10 in a preferred embodiment of the present invention includes a substrate 11 , a TFT layer 12 (TFT: Thin Film Transistor), and an OLED layer 13 (OLED: Organic Light-). The touch panel 10 further includes a pressure touch sensing structure 15 including a pressure sensing structure, and the pressure sensing structure includes a stacking structure. The first conductive layer 151, the dielectric layer 152, and the second conductive layer 153.

The first conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially distributed in a section between the substrate 11 and the passivation layer 14. When the passivation layer 14 is pressed, according to the change in capacitance between the first conductive layer 151 and the second conductive layer 153 and the capacitance change between the second conductive layer 153 and the biasing member 20 on the passivation layer 14, The touch pressure applied by the force applying member 20 is released.

Generally, the substrate 11 is a glass substrate, and other components on the touch panel 10 can be formed on the glass substrate.

In other embodiments, the substrate 11 may be made of polyethylene terephthalate (abbreviation: PET), polyethylene naphthalate (PEN), polyethylene succinate ( Abbreviation: PES), polyimide (abbreviation: PI), fiber reinforced composite material (abbreviation: FRP) formed in one of the materials.

The process of the TFT layer 12 and the OLED layer 13 can be a common process of the TFT and the OLED, and the ordinary touch panel 10 and the flexible flexible touch panel 10 can be satisfied.

The passivation layer 14 is formed of an insulating material such as an organic material or an inorganic material, and is disposed on the outermost layer of the panel to protect the panel and withstand external touch pressure.

In the first embodiment of the present invention, the first conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially stacked to form a pressure sensing layer 15', and the first conductive layer 151 and the second conductive layer 153 are formed. They are respectively formed of a conductive material and can conduct electricity. The dielectric layer 152 is usually formed of an insulating material, and a capacitance can be formed between the first conductive layer 151 and the second conductive layer 153.

Further, the touch panel 10 further includes a processor electrically connected to the first conductive layer 151 and the second conductive layer 153, respectively, the processor acquires a capacitance signal, and calculates a touch pressure, and at the same time, according to the touch When the position of the sensing point of the first conductive layer 151 and the second conductive layer 153 is triggered, the horizontal and vertical coordinates of the touch position on the touch panel and the position change in the thickness direction of the touch panel 10 are obtained, thereby enabling Touch can achieve three dimensions of sensing.

The pressure sensing structure can be distributed on the touch panel and can form a separate capacitive signal in the touch area, so that each position on the hard touch panel and the flexible touch panel can be sensed during touch. Touch pressure.

Further, the substrate 11, the pressure sensing layer 15', the TFT layer 12, the OLED layer 13, and the passivation layer 14 are sequentially stacked, and when the passivation layer 14 is pressed by an external touch, according to the first conductive layer 151, The change in capacitance between the second conductive layer 153 and the change in capacitance between the second conductive layer 153 and the urging member 20 on the passivation layer 14 yield the touch pressure applied by the urging member 20.

As shown in FIG. 2, the pressure sensing mechanism of the pressure sensing structure is as follows: when the passivation layer 14 is pressed by an external force, the deformation caused by the dielectric layer 152 causes a change in the capacitance value to perform force. Discrimination.

Specifically, the process is as follows: when no pressure is applied initially, the single point capacitance value between the first conductive layer 151 and the second conductive layer 153 is C1;

When a certain pressure is applied to the passivation layer 14 by the finger or other force applying member 20, the capacitance between the force applying member 20 and the second conductive layer 153 is C3, between the first conductive layer 151 and the second conductive layer 153. The capacitance of the capacitor is C2. Therefore, the capacitance of the single point at the position of the urging member 20 is C2+C3, and the capacitance of the single conductive layer 151 is 1/C2+1/C3. The values of C2 and C3 follow the capacitance formula:

C=εε ₀ A/d

among them:

ε: dielectric coefficient, which changes with the material of the dielectric layer 152

ε ₀ : vacuum dielectric coefficient

A: Capacitance area

d: the thickness of the dielectric sandwiched

From the originally known capacitance area A and the dielectric coefficient ε of the material, and the measured capacitance value signal, the thickness change amount Δd of the electric layer 152 can be reversed, and the unit is obtained by the mechanical formula F=kΔd. The force exerted by the area, in turn, the force value of the pressure sensing structure.

Another more precise way is to establish a database of pressures for the pressure-sensing structure that is produced, and then establish a relationship between the capacitance value and the force to determine the force received.

Further, in this embodiment, the first conductive layer 151 is formed by sputtering of an electrically conductive metal, and the second conductive layer 153 is also formed by sputtering of a conductive metal, and the metal for sputtering includes aluminum, silver, One of copper, molybdenum, tin, zinc, gold, titanium, and antimony. Generally, the material used to form the first conductive layer 151 and the second conductive layer 153 is a metal material commonly used in semiconductor manufacturing.

It can be understood that, in order to make the first conductive layer 151 and the second conductive layer 153 conductive, the conductive metal alloy may be formed by a sputtering process to form the first conductive layer 151, the second conductive layer 153, and the metal alloy. The components may include two or more of aluminum, silver, copper, molybdenum, tin, zinc, gold, titanium, ruthenium, and the like.

Further, in order to make the first conductive layer 151 and the second conductive layer 153 conductive, the conductive metal oxide may be formed by a sputtering process to form the first conductive layer 151, the second conductive layer 153, and the metal oxide. One of indium tin oxide and indium zinc oxide may be included, and a combination of plural kinds may also be included.

In this embodiment, the dielectric layer 152 is formed by an organic material using a physical vapor deposition process. Of course, it can be understood that the dielectric layer 152 can also be one of chemical vapor deposition, evaporation, sputtering, and liquid deposition. Process formation.

The dielectric layer 152 is formed of an inorganic material by one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition.

The passivation layer 14 may be formed of one of physical material or inorganic material by physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition, and the passivation layer 14 may be formed only by one layer or organic material or inorganic. The material is formed into a multilayer stack to form a passivation layer 14.

Further, the above organic materials include one of polyethylene terephthalate (abbreviation: PET), polyethylene (abbreviation: PE), and polyethylene naphthalate (abbreviation: PEN). A plurality of combinations may be employed; the inorganic material includes one of silicon oxide and silicon nitride, or a combination of the two.

After the pressure touch sensing structure obtains the horizontal and vertical coordinates of the touch position on the touch panel 10, the position change in the thickness direction of the touch panel 10, and the touch pressure of the touch position, the information is transmitted to the read. The chip, the read chip is passed to the motherboard, and the motherboard transmits the information to the processor for processing, and then transmits it to the display screen for corresponding display on the display screen.

As shown in FIG. 3, in the second embodiment of the present invention, the pressure sensing structure also includes a first conductive layer 151, a dielectric layer 152, and a second conductive layer 153, with respect to the first embodiment. The conductive layer 151, the dielectric layer 152, and the second conductive layer 153 are sequentially stacked to form a pressure sensing layer 15'.

Different from the first embodiment, the pressure sensing layer 15' in this embodiment is disposed between the OLED layer 13 and the passivation layer 14, the substrate 11, the TFT layer 12, the OLED layer 13, and the pressure sensing layer 15'. And the passivation layer 14 is laminated in this order.

When the passivation layer 14 is pressed, according to the change in capacitance between the first conductive layer 151 and the second conductive layer 153 and the capacitance change between the second conductive layer 153 and the biasing member 20 on the passivation layer 14, The touch pressure applied by the force applying member 20 is released.

Referring to the process description of the mechanism of pressure sensing of the pressure sensing structure in the first embodiment of FIG. 2, as shown in FIG. 4, the pressure sensing in the second embodiment is specifically as follows;

When no pressure is applied initially, the single point capacitance value between the first conductive layer 151 and the second conductive layer 153 is C1;

C=εε ₀ A/d

among them:

ε ₀ : vacuum dielectric coefficient

A: Capacitance area

d: the thickness of the dielectric sandwiched

As shown in FIG. 5, in the third embodiment of the present invention, the pressure sensing structure includes a first conductive layer 151, a dielectric layer 152, and a second conductive layer 153 with respect to the first and second embodiments. Different from the first and second embodiments, the substrate 11, the first conductive layer 151, the TFT layer 12, the OLED layer 13, the second conductive layer 153, and the passivation layer 14 are sequentially stacked, and the dielectric layer is laminated. 152 is formed on the TFT layer 12 or the OLED layer 13.

After the first conductive layer 151 is formed on the substrate 11, the TFT layer 12 and the OLED layer 13 are sequentially formed on the first conductive layer 151. When the TFT layer 12 or the OLED layer 13 is formed, there is a one-step process for the organic material. Or the inorganic material is formed into a dielectric layer 152 by one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, or liquid deposition, and the dielectric layer 152 is formed in the TFT layer 12 or the OLED layer 13.

The second conductive layer 153 is formed on the OLED layer 13, and finally the passivation layer 14 is formed on the second conductive layer 153.

The dielectric layer 152 in this embodiment belongs to the TFT layer 12 or the OLED layer 13 and may be located on the side of the TFT layer 12 adjacent to the first conductive layer 151, in contact with the first conductive layer 151, or in the OLED layer 13. The side surface adjacent to the second conductive layer 153 may be in contact with the second conductive layer 153 or may not be in contact with the first conductive layer 151 and the second conductive layer 153.

When the passivation layer 14 is touched, the dielectric layer 152 in this embodiment may form a capacitance between the first conductive layer 151 and the second conductive layer 153. Referring to FIG. 2 and FIG. 4, the process description of the mechanism of pressure sensing on the pressure sensing structure in the first and second embodiments is as shown in FIG. 6. The pressure sensing in the third embodiment is specifically as follows;

C=εε ₀ A/d

among them:

ε ₀ : vacuum dielectric coefficient

A: Capacitance area

d: the thickness of the dielectric sandwiched

As shown in FIG. 7, further, the touch pressure determination method using the pressure touch sensing structure includes the following steps:

Touching the outside of the passivation layer 14;

Obtaining a change in capacitance between the first conductive layer 151 and the second conductive layer 153 before and after the touch and a change in capacitance between the second conductive layer 153 and the biasing member 20 at the touch position;

According to the change in capacitance, the touch pressure applied by the urging member 20 is obtained.

According to the obtained touch pressure, the position change in the direction of the touch pressure can be obtained, that is, the position change in the thickness direction of the touch panel 10 can be obtained.

In addition, the touch pressure determination method may further include the following steps:

Determining the coordinate position of the pressed position on the touch panel 10 according to the corresponding sensing point on the first conductive layer 151 and the second conductive layer 153 of the touch position, that is, while determining the touch pressure, The horizontal and vertical coordinates of the touch position on the touch panel.

It will be understood that each of the above technical features may be used in any combination without limitation.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformation of the present invention and the contents of the drawings may be directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of the present invention.

Claims

A touch touch sensing structure of a touch panel, characterized in that the touch panel (10) comprises a substrate (11), a TFT layer (12), an OLED layer (13), and a blunt layer which are sequentially stacked. The layer (14), the pressure touch sensing structure (15) comprises a pressure sensing structure;

The pressure sensing structure includes a first conductive layer (151), a dielectric layer (152), and a second conductive layer (153) which are sequentially stacked and distributed;

The first conductive layer (151), the dielectric layer (152), and the second conductive layer (153) are sequentially disposed between the substrate (11) and the passivation layer (14). Interval

When the passivation layer (14) is pressed, according to a change in capacitance between the first conductive layer (151) and the second conductive layer (153) and the second conductive layer (153) to the blunt The change in capacitance between the force applying members (20) on the layer (14) results in the touch pressure applied by the force applying member (20).
The pressure touch sensing structure according to claim 1, wherein the first conductive layer (151), the dielectric layer (152), and the second conductive layer (153) are sequentially stacked to form a structure. Pressure sensing layer (15');

The substrate (11), the pressure sensing layer (15'), the TFT layer (12), the OLED layer (13), and the passivation layer (14) are sequentially stacked.
The pressure touch sensing structure according to claim 1, wherein the first conductive layer (151), the dielectric layer (152), and the second conductive layer (153) are sequentially stacked to form a structure. Pressure sensing layer (15');

The substrate (11), the TFT layer (12), the OLED layer (13), the pressure sensing layer (15'), and the passivation layer (14) are laminated in this order.
The pressure touch sensing structure according to claim 1, wherein the substrate (11), the first conductive layer (151), the TFT layer (12), the OLED layer (13), and the second conductive layer are provided. (153), and a passivation layer (14) are sequentially stacked, and the dielectric layer (152) is formed on the TFT layer (12) or the OLED layer (13).
The pressure touch sensing structure according to any one of claims 1 to 4, wherein the first conductive layer (151) is made of at least one of a conductive metal, a metal alloy, and a metal oxide. Sputtering formation;

The second conductive layer (153) is formed by sputtering using at least one of an electrically conductive metal, a metal alloy, and a metal oxide.
The pressure touch sensing structure according to claim 5, wherein the metal comprises one of aluminum, silver, copper, molybdenum, tin, zinc, gold, titanium, and tantalum.
The pressure touch sensing structure according to claim 5, wherein the metal oxide comprises at least one of indium tin oxide and indium zinc oxide.
The pressure touch sensing structure according to claim 1, wherein the dielectric layer (152) is made of organic materials by physical vapor deposition, chemical vapor deposition, evaporation, sputtering, liquid deposition. a form; or,

The dielectric layer (152) is formed of an inorganic material by one of physical vapor deposition, chemical vapor deposition, evaporation, sputtering, and liquid deposition.
The pressure touch sensing structure according to claim 1, wherein the passivation layer (14) comprises one layer or is formed of a plurality of layers, and each layer is formed by physical vapor deposition or chemistry from an organic material or an inorganic material. One of vapor deposition, evaporation, sputtering, and liquid deposition.
The pressure touch sensing structure according to claim 8 or 9, wherein the organic material comprises at least one of polyethylene terephthalate, polyethylene, and polyethylene naphthalate. Kind.
The pressure touch sensing structure according to claim 8 or 9, wherein the inorganic material comprises at least one of silicon oxide and silicon nitride.
The pressure touch sensing structure according to any one of claims 1 to 4, 8, or 9, wherein the substrate (11) is a glass substrate, or polyethylene terephthalate, A substrate (11) formed of one of polyethylene naphthalate, polyethylene succinate, polyimide, and fiber reinforced composite.
A touch panel comprising the pressure touch sensing structure according to any one of claims 1 to 12.
The touch panel according to claim 13, wherein the touch panel (10) is a flexible flexible touch panel (10).
The touch panel according to claim 13 or 14, wherein the touch panel (10) further comprises an electrical connection with the first conductive layer (151) and the second conductive layer (153), respectively. a processor that acquires a capacitive signal and calculates a touch pressure.
A touch pressure sensing method according to any one of claims 1 to 12, wherein the touch pressure determining method comprises:

Touching the outside of the passivation layer (14);

Obtaining a change in capacitance between the first conductive layer (151) and the second conductive layer (153) before and after the touch, and between the second conductive layer (153) to the force applying member (20) at the touch position Capacitance change;

According to the change of the capacitance, the touch pressure applied by the force applying member (20) is obtained.
The touch pressure judging method according to claim 16, further comprising the steps of:

The coordinate position of the pressed position on the touch panel (10) is determined according to the corresponding sensing points on the first conductive layer (151) and the second conductive layer (153) of the touch position.