WO2019111707A1 - Epoxy resin composition and electronic device - Google Patents
Epoxy resin composition and electronic device Download PDFInfo
- Publication number
- WO2019111707A1 WO2019111707A1 PCT/JP2018/042951 JP2018042951W WO2019111707A1 WO 2019111707 A1 WO2019111707 A1 WO 2019111707A1 JP 2018042951 W JP2018042951 W JP 2018042951W WO 2019111707 A1 WO2019111707 A1 WO 2019111707A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- resin composition
- chlorine
- atm
- containing particles
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Definitions
- the present invention relates to an epoxy resin composition and an electronic device.
- Patent Document 1 describes that an epoxy compound produced by a method not using epichlorohydrin (epichlorohydrin) as a raw material is used to reduce the content of hydrolyzable chlorine derived from the raw material ( Paragraph 0012 of Patent Document 1).
- the inventors further studied and found that the properties of the epoxy resin composition can be modified by appropriately controlling the state of the chlorine contained in the epoxy resin composition.
- metal adhesion in an epoxy resin composition can be improved by incorporating chlorine-containing particles containing an organic substance in the epoxy resin composition, and the present invention is completed. It came to Although the detailed mechanism is not clear, the chlorine-containing particles have an oxidizing action on a metal such as Cu, and the oxidation action modifies the surface of the metal to improve the affinity to the epoxy resin composition, It is believed that metal adhesion is improved.
- An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler, An epoxy resin composition is provided which comprises organic containing chlorine containing particles.
- an electronic device comprising a cured product of the above epoxy resin composition.
- FIG. 2 is a cross-sectional view showing an example of a semiconductor device.
- FIG. 2 is a cross-sectional view showing an example of a semiconductor device. It is a sectional view showing an example of a structure.
- Epoxy resin composition The epoxy resin composition of the present embodiment can include an epoxy resin, a curing agent and an inorganic filler. This epoxy resin composition contains chlorine-containing particles containing an organic substance.
- chlorine-containing particles containing organic matter hereinafter sometimes simply referred to as “chlorine-containing particles”. It has been found that the chlorine of the chlorine-containing particles is different from the hydrolyzable chlorine and the chlorine derived from free chlorine in the form of presence, and is present locally to the epoxy resin composition, in the particles. It becomes high concentration.
- chlorine-containing particles can be confirmed significantly by, for example, element mapping of energy dispersive X-ray spectroscopy (EDX).
- EDX energy dispersive X-ray spectroscopy
- the surface of the metal is modified to have an affinity with the epoxy resin composition. It is thought that it can improve and the metal adhesiveness in an epoxy resin composition can be improved. Therefore, the metal adhesiveness in an epoxy resin composition can be improved by containing chlorine containing particle
- the chlorine-containing particles are obtained by mixing the epoxy resin composition in acetone to obtain a solution, and filtering the obtained solution through a filter with an opening size of 75 ⁇ m, and contained in the residue on the filter It can be
- chlorine-containing particles can be detected by the following inspection method (hereinafter sometimes referred to as inspection method of chlorine-containing particles).
- a raw material component for example, an epoxy resin, a curing agent, an inorganic filler, etc.
- an epoxy resin composition one obtained by mixing and kneading each raw material component and cooling the obtained kneaded product (epoxy resin composition in a B-stage state) is used.
- the epoxy resin composition one obtained by mixing and kneading each raw material component and cooling the obtained kneaded product (epoxy resin composition in a B-stage state) is used.
- the acetone to be used uses what was filtered by the filter of 12 micrometers of mesh sizes.
- the filter used is a nylon filter with an opening size of 75 ⁇ m, which has been subjected to ultrasonic cleaning.
- (4) The container shaken in (2) was allowed to stand, and then the solution in the container was poured from the top of the funnel of (3) and suction filtered through a filter. If the particle size of the filler such as the inorganic filler contained in the sample is larger than the pore size of the filter, the supernatant in the solution may be filtered by a filter.
- the inspection method of the above-mentioned chlorine content particles is a method of detecting stably chlorine content particles contained in an epoxy resin composition or its raw material component, and chlorine contained in the particles concerned, and the present invention It is a method newly established by the inspection method of the above-mentioned chlorine content particles.
- the organic substance in the above-mentioned chlorine-containing particles contained in the epoxy resin can include one or more selected from the group consisting of carbonates, amide compounds, and silicates. These organic substances may be a mixture with an epoxy resin.
- the organic substance in the above-mentioned chlorine-containing particles contained in the epoxy resin composition can contain one or more selected from the group consisting of cellulose, polyethylene terephthalate, polypropylene, silk, a silicone compound, and an amide compound. These may be used alone or in combination of two or more. Or it may be a mixture of these.
- the above-mentioned chlorine-containing particles may contain organic substances other than these. Organic substances can be identified from the spectrum results of chlorine-containing particles using FT-IR (Fourier transform infrared spectroscopy).
- the lower limit value of the chlorine concentration in the chlorine-containing particles is, for example, 0.01 Atm% or more, and may be 0.5 Atm% or more, or 0.1 Atm% or more. Thereby, metal adhesiveness can be improved.
- the upper limit of the chlorine concentration in the chlorine-containing particles is, for example, 20 Atm% or less, preferably 10 Atm% or less, and more preferably 7 Atm% or less. This can improve the reliability.
- the lower limit value of the carbon concentration in the chlorine-containing particles is, for example, 40 Atm% or more, preferably 50 Atm% or more, and more preferably 60 Atm% or more. This makes it possible to stably fix chlorine in the chlorine-containing particles.
- the upper limit value of the carbon concentration in the above-mentioned chlorine-containing particles may be appropriately changed depending on other constituent components and is not particularly limited, but may be 99 Atm% or less, 90 Atm% or less, or 85 Atm% or less It may be 70 Atm% or less.
- the chlorine-containing particles may contain an oxygen component.
- the oxygen concentration in the chlorine-containing particles may be, for example, 1 Atm% to 50 Atm%, 2 Atm% to 35 Atm%, 3 Atm% to 30 Atm%, or 3 Atm% to 28 Atm%. “ ⁇ ” indicates including upper limit value and lower limit value unless otherwise specified.
- the chlorine-containing particles contain one or more selected from the group consisting of Al element, Mg element, Si element, Fe element, Zn element, Ti element, Ca element, Na element, K element, S element, carbonate compound be able to. These may be used alone or in combination of two or more.
- the Al concentration in the chlorine-containing particles may be 0.1 Atm% to 4 Atm%, or 0.1 Atm% to 1.0 Atm%.
- the Mg concentration in the chlorine-containing particles may be 0.1 Atm% to 0.5 Atm%, or 0.1 Atm% to 0.4 Atm%.
- the Si concentration in the chlorine-containing particles may be 0.1 Atm% to 5 Atm%, 0.1 Atm% to 2.0 Atm%, or 0.1 Atm% to 1 Atm%.
- the Fe concentration in the chlorine-containing particles may be 0.1 Atm% to 4 Atm%, or may be 0.1 Atm% to 2.0 Atm%.
- the Zn concentration in the chlorine-containing particles may be 0.1 Atm% to 5 Atm%, or may be 0.1 Atm% to 1.0 Atm%.
- the Ti concentration in the chlorine-containing particles may be 0.01 Atm% to 1.0 Atm%, or may be 0.04 Atm% to 0.8 Atm%.
- the Ca concentration in the chlorine-containing particles may be 0.01 Atm% to 17 Atm%, may be 0.02 Atm% to 6 Atm%, and may be 0.1 Atm% to 3 Atm%.
- the concentration of Na in the chlorine-containing particles may be 0.01 Atm% to 2 Atm%, or 0.1 Atm% to 1.5 Atm%.
- the K concentration in the chlorine-containing particles may be 0.01 Atm% to 5 Atm%, or 0.1 Atm% to 1.0 Atm%.
- the S concentration in the chlorine-containing particles may be 0.01 Atm% to 2 Atm%, or may be 0.02 Atm% to 1.0 Atm%.
- 1 type or more may be sufficient, 2 types or more may be sufficient, or 5 or more types of other elements may be contained.
- the elemental composition and the elemental concentration in the chlorine-containing particles can be measured based on energy dispersive X-ray spectroscopy (EDX).
- EDX energy dispersive X-ray spectroscopy
- the number of chlorine-containing particles in the epoxy resin composition or the number of chlorine-containing particles in the epoxy resin can be measured by using the above-mentioned ⁇ Method for inspecting chlorine-containing particles>.
- the number of chlorine-containing particles in the 50 g of the epoxy resin composition can be one or more.
- the number of chlorine-containing particles in the epoxy resin composition may be, for example, 10 or less, 5 or less, 3 or less, or 2 or less. Thereby, when an epoxy resin composition is used as a sealing material which seals electronic parts, reliability can be improved. Regarding each component used for the above epoxy resin composition, for example, in 50 g of epoxy resin, the number of chlorine-containing particles may be 1 to 5 or less, 1 to 3 or less, or 1 to 2 or less. , May be one.
- thermosetting resin composition for example, types, blending amounts, preparation methods of each component contained in the thermosetting resin composition (production method or purification method after production), preparation method of the thermosetting resin composition, etc. are appropriately made.
- each component such as an epoxy resin and a curing agent
- filtering a liquid substance such as a solution dissolved in an organic solvent with a filter, and in that case using the filter with a small opening size
- the liquid is centrifuged to remove the lower layer containing foreign matter, and only the upper layer is used, or the HCL generated during the reaction is thoroughly removed to eradicate the chlorine source.
- Inorganic filler, reducing the size of the guarantee screen, selecting appropriate ones from a plurality of lots, and the like can be mentioned as factors for setting the amount of the above-mentioned chlorine-containing particles in the desired numerical range.
- the epoxy resin composition contains an epoxy resin.
- the epoxy resin is generally a monomer, an oligomer or a polymer having two or more epoxy groups in one molecule, and the molecular weight and molecular structure thereof are not particularly limited.
- the epoxy resin include bifunctional or crystalline epoxy resins such as biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilbene type epoxy resin, hydroquinone type epoxy resin; cresol novolac type epoxy resin Novolak type epoxy resin such as phenol novolac type epoxy resin and naphthol novolac type epoxy resin; Phenol aralkyl type such as phenylene skeleton containing phenol aralkyl type epoxy resin, biphenylene skeleton containing phenol aralkyl type epoxy resin, phenylene skeleton containing naphthol aralkyl type epoxy resin Epoxy resin; Trifunctional epoxy resin such as triphenolmethane epoxy resin and alkyl-modified triphenolmethane epoxy resin
- the lower limit of the content of the epoxy resin in the epoxy resin composition is, for example, preferably 8% by mass or more, and more preferably 10% by mass or more based on the total solid content of the epoxy resin composition. And 12% by mass or more is particularly preferable.
- the upper limit value of the content of the epoxy resin is, for example, preferably 30% by mass or less, and more preferably 20% by mass or less, based on the total solid content of the epoxy resin composition.
- the total solid content of the epoxy resin composition refers to the non-volatile content in the epoxy resin composition, and refers to the remainder excluding volatile components such as water and solvent.
- the content with respect to the entire epoxy resin composition refers to the content with respect to the entire solid content excluding the solvent in the resin composition when the solvent is included.
- the epoxy resin composition can include a curing agent.
- the curing agent is not particularly limited as long as it is generally used in epoxy resin compositions, but, for example, a phenol resin curing agent, an amine curing agent, an acid anhydride curing agent, a mercaptan curing agent, etc. , Is mentioned. Among these, from the viewpoint of balance such as flame resistance, moisture resistance, electric properties, curability, storage stability, etc., a phenol resin-based curing agent is preferable.
- the phenolic resin-based curing agent is not particularly limited as long as it is generally used in epoxy resin compositions, and examples thereof include phenol novolac resin, phenol including cresol novolac resin, cresol, resorcinol, catechol, Novolak resin obtained by condensation or cocondensation of phenols such as bisphenol A, bisphenol F, phenylphenol, aminophenol, ⁇ -naphthol, ⁇ -naphthol, dihydroxynaphthalene and formaldehyde or ketones under an acid catalyst, as described above
- a phenol aralkyl resin such as a phenol aralkyl resin having a phenylene skeleton synthesized from phenols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl and a phenol aralkyl resin having a biphenylene skeleton Lukil resin, a phenol resin having a trisphenylmethane ske
- amine-based curing agent examples include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA) and metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA) and diaminodiphenyl sulfone
- DETA diethylenetriamine
- TETA triethylenetetramine
- MXDA metaxylylenediamine
- DDM diaminodiphenylmethane
- MPDA m-phenylenediamine
- diaminodiphenyl sulfone In addition to aromatic polyamines such as (DDS), polyamine compounds containing dicyandiamide (DICY), organic acid dihydrazide and the like may be mentioned, and these may be used alone or in combination of two or more.
- ⁇ Acid anhydride curing agent examples include alicyclic anhydrides such as hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA) and maleic anhydride, trimellitic anhydride (TMA) and pyromellitic anhydride Examples thereof include acids (PMDA), benzophenonetetracarboxylic acids (BTDA), and aromatic acid anhydrides such as phthalic anhydride. These may be used alone or in combination of two or more.
- HHPA hexahydrophthalic anhydride
- MTHPA methyltetrahydrophthalic anhydride
- TMA trimellitic anhydride
- pyromellitic anhydride examples thereof include acids (PMDA), benzophenonetetracarboxylic acids (BTDA), and aromatic acid anhydrides such as phthalic anhydride. These may be used alone or in combination of two or more.
- mercaptan-based curing agent trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercaptobutyrate), etc. may be mentioned, and even if they are used alone, they may be used in combination of two or more. May be
- ⁇ Other curing agent> Other curing agents include isocyanate compounds such as isocyanate prepolymers and blocked isocyanates, organic acids such as carboxylic acid-containing polyester resins, etc. These may be used alone or in combination of two or more. . Moreover, you may use combining 2 or more types of the hardening agent of a different system among the above-mentioned.
- the ratio of the epoxy resin to the curing agent equivalent ratio that is, the ratio of the number of epoxy groups in the epoxy resin / the number of phenolic hydroxyl groups in the phenol resin-based curing agent is particularly
- the range of 0.5 or more and 2 or less is preferable, and the range of 0.6 or more and 1.8 or less is more preferable, 0.8
- the range of not less than 1.5 is the most preferable.
- the epoxy resin composition can contain an inorganic filler.
- the inorganic filler include fused silica such as fused and crushed silica and fused spherical silica, silica such as crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. These may be used alone or in combination of two or more. Among these, preferred are silicas such as fused and crushed silica, fused spherical silica, and crystalline silica, and more preferably fused spherical silica can be used.
- the lower limit of the average particle diameter (D50) of the inorganic filler may be, for example, 0.01 ⁇ m or more, 1 ⁇ m or more, or 5 ⁇ m or more.
- the flowability of the epoxy resin composition can be improved, and the moldability can be more effectively improved.
- the upper limit of the average particle diameter (D50) of an inorganic filler is 50 micrometers or less, for example, Preferably it is 40 micrometers or less. Thereby, the occurrence of non-filling and the like can be reliably suppressed.
- the inorganic filler of the present embodiment can include at least an inorganic filler having an average particle diameter (D50) of 1 ⁇ m or more and 50 ⁇ m or less. Thereby, the fluidity can be made better.
- the average particle diameter (D50) of the inorganic filler is measured on a volume basis of the particle size distribution of particles using a commercially available laser diffraction type particle size distribution measuring apparatus (for example, SALD-7000 manufactured by Shimadzu Corporation), and its median The diameter (D50) can be an average particle diameter.
- the said inorganic filler may use together the 2 or more types of filler of a different average particle diameter (D50), for example.
- D50 average particle diameter
- a filler having an average particle diameter of 0.01 ⁇ m or more and 1 ⁇ m or less and a filler having an average particle diameter of 1 ⁇ m to 50 ⁇ m or less improve the filling property of the epoxy resin composition. And may be used as an example.
- the inorganic filler of the present embodiment from the viewpoint of further improving the filling property of the epoxy resin composition, for example, a first filler having an average particle diameter of 0.01 ⁇ m or more and 1 ⁇ m or less and an average particle diameter of 1 ⁇ m
- the second filler may be larger than 15 ⁇ m
- the third filler may be larger than 15 ⁇ m and 50 ⁇ m or less.
- the lower limit of the content of the inorganic filler is, for example, preferably 70% by mass or more, more preferably 73% by mass or more, and more preferably 75% by mass, based on the total solid content of the epoxy resin composition. It is especially preferable that it is more than. Thereby, low moisture absorption and low thermal expansion can be improved, and the temperature cycle resistance and the reflow resistance of the semiconductor device and the other structures can be more effectively improved.
- the upper limit value of the content of the inorganic filler is, for example, preferably 95% by mass or less, more preferably 93% by mass or less, based on the total solid content of the epoxy resin composition. It is particularly preferable that the content is less than or equal to mass%. This makes it possible to more effectively improve the flowability and the fillability at the time of molding of the epoxy resin composition.
- the said epoxy resin composition can further contain a hardening accelerator as needed.
- a hardening accelerator any curing accelerator may be used as long as it accelerates the crosslinking reaction of the epoxy resin and the curing agent, and those used for general epoxy resin compositions can be used.
- curing accelerator examples include diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof; organic phosphines such as triphenylphosphine and methyl diphenylphosphine; Imidazole compounds such as imidazole (imidazole-based curing accelerator); tetra-substituted phosphonium tetra-substituted borates such as tetraphenyl phosphonium tetraphenyl borate and the like. These may be used alone or in combination of two or more.
- imidazole-based curing accelerator examples include imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole.
- 2-phenyl-4-methylimidazole 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4 Diamino-6- [2′-methylimidazolyl (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl (1 ′)]-ethyl-s-triazine, 2 , 4-Diamino-6- [2′-ethyl-4-methylimidazoly
- the lower limit of the content of the curing accelerator is, for example, preferably 0.20% by mass or more, and more preferably 0.40% by mass or more, with respect to the total solid content of the epoxy resin composition. It is especially preferable that it is 0.70 mass% or more.
- the upper limit value of the content of the curing accelerator is, for example, preferably 3.0% by mass or less, and more preferably 2.0% by mass or less based on the total solid content of the epoxy resin composition. preferable.
- content of a hardening accelerator below the said upper limit, the improvement of the fluidity
- the said epoxy resin composition can contain a coupling agent as needed.
- the coupling agent include various silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane and methacrylsilane, titanium compounds, aluminum chelates and aluminum / zirconium compounds. Coupling agents can be used.
- vinyltrichlorosilane vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxy Silane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ -glycidoxypropylmethyldimethoxysilane, ⁇ -methacryloxypropylmethyldiethoxysilane, ⁇ -methacryloxypropyltriethoxysilane , Vinyltriacetoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -anilinopropyltrimethoxysilane, ⁇ -an
- silane compounds of epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane or vinylsilane are more preferable.
- a secondary aminosilane represented by phenylaminopropyltrimethoxysilane is particularly preferable.
- the lower limit value of the content of the coupling agent is preferably 0.1% by mass or more, and more preferably 0.15% by mass or more based on the total solid content of the epoxy resin composition.
- the upper limit value of the content of the coupling agent is preferably 1% by mass or less and more preferably 0.5% by mass or less based on the total solid content of the epoxy resin composition.
- the said epoxy resin composition can contain the low stress agent as needed.
- the low stress agent include silicone oil, silicone rubber, polyisoprene, polybutadiene such as 1,2-polybutadiene and 1,4-polybutadiene, styrene-butadiene rubber, acrylonitrile-butadiene rubber, polychloroprene, poly (oxypropylene), It may contain one or more selected from thermoplastic elastomers such as poly (oxytetramethylene) glycol, polyolefin glycol, poly- ⁇ -caprolactone, polysulfide rubber, and fluororubber.
- containing at least one of silicone rubber, silicone oil, and acrylonitrile-butadiene rubber controls the elastic modulus within a desired range, and the temperature cycle resistance of the obtained semiconductor package and other structures.
- silicone rubber silicone oil, and acrylonitrile-butadiene rubber controls the elastic modulus within a desired range, and the temperature cycle resistance of the obtained semiconductor package and other structures.
- it can be selected as a particularly preferred embodiment.
- content of the low stress agent whole is 0.05 mass% or more with respect to the total solid of an epoxy resin composition, and it is 0.10 mass% or more More preferable.
- the content of the low stress agent is preferably 2% by mass or less, and more preferably 1% by mass or less, based on the total solid content of the epoxy resin composition.
- the epoxy resin composition of the present embodiment can further contain other components, if necessary.
- Other components include, for example, ion capturing agents such as hydrotalcite and aluminum-magnesium inorganic ion exchangers; colorants such as carbon black and bengala; natural waxes such as carnauba wax; montanic acid ester wax; diethanolamine / dimontanic acid Esters, synthetic waxes such as tolylene diisocyanate-modified oxidized waxes, higher fatty acids such as zinc stearate and metal salts thereof or mold release agents such as paraffin; various additives such as antioxidants can be mentioned. These additives may be blended appropriately.
- the manufacturing method of the epoxy resin composition of this embodiment is demonstrated.
- the method for producing the epoxy resin composition can include a lot sorting step and a mixing step. First, a plurality of epoxy resins a having different lots are prepared, and the number of chlorine-containing particles of the prepared epoxy resin a is measured using the above-described inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a containing chlorine-containing particles is selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition (lot selection step). An epoxy resin composition can be obtained by mixing other raw material components with the epoxy resin A (mixing step).
- curing agent b and inorganic filler c are also subjected to lot selection in the same manner as epoxy resin a, and curing agent b and inorganic filler c containing chlorine-containing particles are used as raw materials. You may use as a component (hardener B and the inorganic filler C). Moreover, it is possible to add the method of controlling the quantity of the above-mentioned chlorine containing particle
- the mixture is obtained by mixing by a known means. Furthermore, the mixture is melt-kneaded to obtain a kneaded product.
- a kneading method for example, an extrusion kneader such as a single-screw kneading extruder or a twin-screw kneading extruder, or a roll kneader such as a mixing roll can be used, but a twin-screw kneading extruder is used. Is preferred.
- the kneaded product can be made into powder, granules, tablets, or sheets.
- a method of pulverizing a kneaded material by a pulverizing apparatus for example, a method of pulverizing a kneaded material by a pulverizing apparatus may be mentioned.
- the kneaded material may be formed into a sheet and pulverized.
- a grinding device for example, a hammer mill, a millstone type grinder, a roll crusher or the like can be used.
- a die having a small diameter is installed at the outlet of a kneading apparatus, and a molten material in a molten state discharged from the dies is given a predetermined length by a cutter or the like. It is also possible to use a granulation method typified by a hot cut method of cutting into pieces. In this case, after obtaining a granular or powdery resin composition by a granulation method such as a hot cut method, it is preferable to carry out degassing while the temperature of the resin composition is not lowered so much.
- the epoxy resin composition of the present embodiment can be used in various applications.
- the epoxy resin composition of the present embodiment can be used for a sealing resin composition or a fixing resin composition.
- a sealing resin composition (a sealing resin composition for sealing an electronic component) according to the present embodiment, an electronic component such as a semiconductor chip can be sealed, and it is used for the above semiconductor package Resin composition for encapsulating a semiconductor, resin composition for encapsulating an electronic control unit for automobile sealing a substrate on which an electronic component or the like is mounted, or for a sensor, for a sensor module, for a camera, for a camera module, a module with a display It is applicable to the resin composition for module sealing with dry cells and coin cells.
- a resin composition for fixation which concerns on this embodiment, it can be used also for fixation of motor components, For example, it is applicable to the resin composition for stator core fixation, a stator fixation, etc.
- the structure (for example, an electronic device) of the present embodiment is provided with a cured product of the above epoxy resin composition.
- the structure include an electronic control unit in which a semiconductor package, a substrate on which electronic components and the like are mounted are sealed, a sensor, a sensor module, a camera, a camera module, a module with a display, a module with a dry cell / coin cell, a motor, etc. Can be mentioned.
- FIG. 1 is a view showing a cross-sectional structure of an example of a semiconductor device using the epoxy resin composition of the present embodiment.
- the semiconductor element 1 is fixed on the die pad 3 via the die bonding material curing body 2.
- the electrode pads of the semiconductor element 1 and the lead frame 5 are connected by bonding wires 4.
- the semiconductor element 1 is sealed by the cured body 6 of the epoxy resin composition of the present embodiment.
- FIG. 2 is a view showing a cross-sectional structure of an example of a single-sided sealed type semiconductor device using the epoxy resin composition of the present embodiment.
- the semiconductor element 1 is fixed on the solder resist 7 of the laminated body in which the layer of the solder resist 7 is formed on the surface of the substrate 8 via the die bonding material cured body 2.
- the solder resist 7 on the electrode pad is removed by a developing method so that the electrode pad of the substrate 8 is exposed.
- the electrode pads of the semiconductor element 1 and the electrode pads of the substrate 8 are connected by bonding wires 4. Only one side of the substrate 8 on which the semiconductor element 1 is mounted is sealed by the cured product 6 of the epoxy resin composition of the present embodiment.
- the electrode pads on the substrate 8 are internally joined to the solder balls 9 on the non-sealing surface side on the substrate 8.
- FIG. 3 is a schematic cross-sectional view showing an example of the structure (vehicle-mounted electronic control unit 10) of the present embodiment.
- the in-vehicle electronic control unit 10 is used to control an engine, various in-vehicle devices, and the like.
- the on-vehicle electronic control unit 10 includes, for example, a substrate 12, an electronic component 16 mounted on the substrate 12, and a sealing resin layer 14 for sealing the substrate 12 and the electronic component 16.
- the substrate 12 has a connection terminal 18 for connecting to the outside on at least one side.
- the on-vehicle electronic control unit 10 according to an example of the present embodiment is electrically connected to the mating connector via the connecting terminal 18 by fitting the connecting terminal 18 and the mating connector.
- the substrate 12 is, for example, a wiring substrate provided with a circuit wiring on one or both of one surface and the other surface opposite to the one surface. As shown in FIG. 3, the substrate 12 has, for example, a flat plate shape. In the present embodiment, for example, an organic substrate formed of an organic material such as polyimide can be employed as the substrate 12.
- the thickness of the substrate 12 is not particularly limited, but may be, for example, 0.1 mm or more and 5 mm or less, and preferably 0.5 mm or more and 3 mm or less.
- a through hole 120 may be provided in the substrate 12, for example, penetrating the substrate 12 to connect one surface to the other surface.
- the wiring provided on one surface of the substrate 12 and the wiring provided on the other surface are electrically connected via the conductor pattern provided in the through hole 120.
- the conductive pattern is formed along the wall surface of through hole 120. That is, the conductive pattern in through hole 120 is formed in a cylindrical shape.
- the void holes formed on the inner wall surface of the conductive pattern are filled with the cured product (sealing resin layer 14) of the epoxy resin composition of the present embodiment.
- an electronic component 16 is mounted on one or both of one surface and the other surface of the substrate 12.
- the electronic component 16 is not particularly limited as long as it can be mounted on a vehicle-mounted electronic control unit, and for example, a microcomputer may be mentioned.
- the substrate 12 may be mounted, for example, on a metal base.
- the metal base can function as a heat sink for dissipating heat generated from the electronic component 16, for example.
- the on-vehicle electronic control unit 10 can be formed by integrally sealing and molding, for example, a metal base and the substrate 12 mounted on the metal base using an epoxy resin composition.
- a metal material which comprises a metal base For example, iron, copper, and aluminum, and the alloy etc. which contain 1 or 2 types of these, etc. can be included.
- the on-vehicle electronic control unit 10 may not have a metal base.
- Colorant 1 carbon black (carbon # 5, manufactured by Mitsubishi Chemical Corporation)
- Curing accelerator 1 represented by the following formula [Method of synthesizing curing accelerator 1] In a flask containing 1800 g of methanol, 249.5 g of phenyltrimethoxysilane and 384.0 g of 2,3-dihydroxynaphthalene were added and dissolved, and then 231.5 g of a 28% sodium methoxide-methanol solution was added dropwise while stirring at room temperature. Further, a solution of 503.0 g of tetraphenylphosphonium bromide prepared in advance in 600 g of methanol was added dropwise thereto under stirring at room temperature to precipitate crystals. The precipitated crystals were filtered, washed with water and vacuum dried to obtain the above-mentioned curing accelerator 1 of pinkish white crystals.
- Hardening accelerator 2 Hardening accelerator 2 represented by the following formula
- Coupling agent 1 N-phenyl-3-aminopropyltrimethoxysilane (CF-4083, manufactured by Toray Dow Corning)
- Coupling agent 2 3-mercaptopropyltrimethoxysilane (S810, manufactured by Chisso)
- Epoxy resin A Epoxy resin a1: phenol-aralkyl epoxy resin containing biphenylene skeleton (NC 3000 L, manufactured by Nippon Kayaku Co., Ltd.)
- Epoxy resin a2 Bisphenol A epoxy resin (YL 6810, manufactured by Mitsubishi Chemical Corporation)
- Epoxy resin a3 biphenyl type epoxy resin (YX4000K, manufactured by Mitsubishi Chemical Corporation)
- Epoxy resin 4 Epoxy resin synthesized without using epichlorohydrin (glycidyl ether type liquid epoxy resin, manufactured by DIC EPICLON EXA-4880, total chlorine: 0 ppm)
- Epoxy resin 5 Epoxy resin synthesized without using epichlorohydrin (alicyclic epoxy resin, manufactured by Daisel Co. EHPE 3150, total chlorine: 0 ppm)
- Inorganic filler C Inorganic filler C, Inorganic filler c1: fused spherical silica (FB-100XFC, manufactured by Denka, average particle size 13 ⁇ m) Inorganic filler c2: fused spherical silica (MSV-SC3, manufactured by Ryumori, average particle diameter 19 ⁇ m) Inorganic filler c3: spherical silica (SD 2500-SQ, manufactured by Admatex, average particle size 0.5 ⁇ m) Inorganic filler c4: spherical silica (SC-2500-SQ, manufactured by Admatex Co., Ltd., average particle size 0.5 ⁇ m) Inorganic filler c5: fused spherical silica (FB-950FC, manufactured by Denka, average particle diameter 22 ⁇ m)
- Flame retardant 1 Aluminum hydroxide (BE043, manufactured by Nippon Light Metal Co., Ltd.)
- Flame retardant 2 Aluminum hydroxide (CL-303, manufactured by Sumitomo Chemical Co., Ltd.)
- Hardening agent b1 biphenylene skeleton-containing phenol aralkyl resin (MEH-7851 SS, manufactured by Meiwa Kasei Co., Ltd.)
- Hardening agent b2 Novolak type phenol resin (PR-HF-3, manufactured by Sumitomo Bakelite Co., Ltd.)
- Ion capture agent Ion scavenger 1: Hydrotalcite (DHT-4H, manufactured by Kyowa Chemical Industry Co., Ltd.)
- Ion trapping agent 2 Aluminum-magnesium inorganic ion exchanger (IXE-700F, manufactured by Toagosei Co., Ltd.)
- Low stress agent 1 Acrylonitrile-butadiene copolymer compound (CTBN 1008SP, manufactured by PTI Japan Ltd.)
- Low stress agent 2 Melt reactant A (silicone) obtained by the following synthesis method [Method of synthesizing molten reactant A] 66.1 parts by weight of a bisphenol A-type epoxy resin (JERB Epoxy Resins Co., Ltd., jER (registered trademark) YL 6810, softening point 45 ° C., epoxy equivalent 172) represented by the following formula (8) Then, 33.1 parts by weight of organopolysiloxane represented by the following formula (7) and 0.8 parts by weight of triphenylphosphine were added and melt mixed for 30 minutes to obtain a molten reactant A.
- Low stress agent 3 Alkyl group-containing silicone (Silsoft 034, manufactured by Momentive)
- Releasing agent 1 Montanic acid ester wax (WE-4, manufactured by Clariant Japan Ltd.)
- Releasing agent 2 Diethanolamine / zimontanic acid ester (NC-133, manufactured by Ito Oil Co., Ltd.)
- Releasing agent 3 Tolylene diisocyanate-modified oxidized wax (NPS-6010, manufactured by Nippon Seiwa Co., Ltd.)
- Release agent 4 Stearic acid (SR-Sakura, manufactured by NOF Corporation)
- Example 1 A plurality of epoxy resins a1 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a1 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a1 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition .
- the curing agent b1 was used as the curing agent B, and the inorganic fillers c1 and c3 were used as the inorganic filler C.
- Example 2 A plurality of epoxy resins a2 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a2 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a2 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition An epoxy resin composition was obtained in the same manner as Example 1 except for the above.
- Example 3 An epoxy resin composition was obtained in the same manner as in Example 1 except that inorganic fillers c2 and c3 were used as the inorganic filler C.
- Example 4 The same procedure as in Example 1 was repeated except that the solution obtained by dissolving in an organic solvent and filtering it with a 1 ⁇ m filter was used as a raw material component (curing agent B) for the same lot of curing agent b1 as in Example 1.
- the epoxy resin composition was obtained.
- Example 5 A plurality of epoxy resins a3 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a3 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a3 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition .
- the curing agent b1 was used as the curing agent B, and the inorganic fillers c4 and c5 were used as the inorganic filler C.
- Example 6 The curing agent b2 is used in place of the curing agent b1 of Example 2, and the solution obtained by dissolving the solution in an organic solvent is filtered through a 1 ⁇ m filter for the curing agent b2 as a raw material component (curing agent B) An epoxy resin composition was obtained in the same manner as in Example 5 except that it was used.
- Example 7 The solution obtained by dissolving in an organic solvent was filtered with a 1 ⁇ m filter for epoxy resin a3 of a lot different from Example 5 and the number of chlorines shown in Table 2 was measured using the following inspection method of chlorine-containing particles An epoxy resin composition was obtained in the same manner as in Example 5, except that the epoxy resin a3 containing the containing particles was used as a raw material component (epoxy resin A).
- Comparative Example 1 An epoxy resin composition was obtained in the same manner as in Example 1 except that the epoxy resin 4 was used as the epoxy resin A.
- Comparative Example 2 An epoxy resin composition was obtained in the same manner as in Example 5, except that the epoxy resin 5 was used as the epoxy resin A.
- Comparative Example 3 The solution obtained by dissolving in an organic solvent was filtered through a 1 ⁇ m filter for epoxy resin a2 of a lot different from Example 2 and the number of chlorine-containing particles measured using the following method for inspecting chlorine-containing particles is 0 An epoxy resin composition was obtained in the same manner as in Example 2 except that the epoxy resin a2 was used as the raw material component (epoxy resin A).
- the raw material component which comprises an epoxy resin composition or an epoxy resin composition was prepared.
- the epoxy resin composition used what cooled and obtained the kneaded material which mixed and knead
- 50 g of the sample of (1) is put into a cleaned 1000 ml container made of polypropylene, 300 ml of acetone is added, the container is covered, and using a shaker, room temperature 25 ° C., 300 reciprocations / minute Shake (mix) for 50 minutes.
- the acetone to be used used what was filtered by the filter of 12 micrometers of mesh sizes.
- the above acetone-washed filter was placed in a funnel set (filtering device).
- the filter used was a nylon filter with an opening size of 75 ⁇ m, which was subjected to ultrasonic cleaning.
- the container shaken in (2) was allowed to stand, and then the solution in the container was poured from the top of the funnel of (3) and suction filtered through a filter.
- the funnel was removed and the residue on the filter was dried with suction.
- the adhesive surface of the measurement sheet was attached to the filter surface of (5), and the residue was collected on the adhesive surface of the measurement sheet.
- the measurement sheet of (6) was peeled off from the filter, and a composite photograph was created using a digital microscope for the entire surface of the adhesive surface. After adjusting the visual field magnification to be 50 times, the entire surface was observed, and the position where the residue was present was recorded and printed.
- the organic substance of chlorine-containing particles 1A-1 is a mixture of epoxy resin and carbonate
- the organic substance of chlorine-containing particles 1A-2 is a carbonate
- the organic substance of chlorine-containing particles 2A-1 is an amide compound
- Organic substances of 1 are carbonates
- organic substances of chlorine-containing particles 5A-2 are carbonates and silicates
- organic substances of chlorine-containing particles 1-4 are cellulose
- organic substances of chlorine-containing particles 2-1 are cellulose
- chlorine-containing particles 3- The organic substance of 4 was identified to contain cellulose.
- the epoxy resin compositions of Examples 1 to 7 were found to be excellent in metal adhesion as compared with the epoxy resin compositions of Comparative Examples 1 to 3, because the adhesion to the Cu frame was improved.
Abstract
Description
詳細なメカニズムは定かでないが、Cu等の金属に対する酸化作用を塩素含有粒子が有しており、かかる酸化作用により金属の表面が改質され、エポキシ樹脂組成物との親和性が向上するため、金属密着性が向上するものと考えられる。 The inventors further studied and found that the properties of the epoxy resin composition can be modified by appropriately controlling the state of the chlorine contained in the epoxy resin composition. As a result of further intensive studies based on such findings, it is found that metal adhesion in an epoxy resin composition can be improved by incorporating chlorine-containing particles containing an organic substance in the epoxy resin composition, and the present invention is completed. It came to
Although the detailed mechanism is not clear, the chlorine-containing particles have an oxidizing action on a metal such as Cu, and the oxidation action modifies the surface of the metal to improve the affinity to the epoxy resin composition, It is believed that metal adhesion is improved.
エポキシ樹脂、硬化剤および無機充填材を含むエポキシ樹脂組成物であって、
有機物を含有する塩素含有粒子を含む、エポキシ樹脂組成物が提供される。 According to the invention
An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler,
An epoxy resin composition is provided which comprises organic containing chlorine containing particles.
本実施形態のエポキシ樹脂組成物は、エポキシ樹脂、硬化剤および無機充填材を含むことができる。このエポキシ樹脂組成物は、有機物を含有する塩素含有粒子を含むものである。 [Epoxy resin composition]
The epoxy resin composition of the present embodiment can include an epoxy resin, a curing agent and an inorganic filler. This epoxy resin composition contains chlorine-containing particles containing an organic substance.
従来、エポキシ樹脂組成物中における全塩素や加水分解性塩素を対象とし、対象の含有量を指標として検査する方法が知られている。従来対象としていた加水分解性塩素や遊離塩素はエポキシ樹脂組成物(例えば封止材)全体に均一に存在している。
これに対して、有機物を含有する塩素含有粒子(以下、単に「塩素含有粒子」と呼称することがある。)という、塩素の新たな存在形態が見出された。この塩素含有粒子の塩素は、加水分解性塩素や遊離塩素に由来する塩素とは存在形態が相違することが判明しており、エポキシ樹脂組成物に対して局所的に存在し、当該粒子中において高濃度となる。例えばエネルギー分散型X線分光法(EDX)の元素マッピングなどで有意に、塩素含有粒子中の塩素の存在を確認することができる。
詳細なメカニズムは定かでないが、このような塩素含有粒子は、Cu等の金属に対する酸化作用を有しており、かかる酸化作用により金属の表面を改質し、エポキシ樹脂組成物との親和性を向上させ、エポキシ樹脂組成物における金属密着性を向上できるものと考えられる。
したがって、有機物を含有する塩素含有粒子をエポキシ樹脂組成物中に含ませることにより、エポキシ樹脂組成物における金属密着性を向上できる。 According to the findings of the inventor of the present invention, the following has been found.
Conventionally, there is known a method in which total chlorine or hydrolyzable chlorine in an epoxy resin composition is used as a target and the content of the target is used as an index. Hydrolyzable chlorine and free chlorine which have been conventionally targeted are uniformly present in the entire epoxy resin composition (for example, sealing material).
On the other hand, a new form of existence of chlorine has been discovered: chlorine-containing particles containing organic matter (hereinafter sometimes simply referred to as “chlorine-containing particles”). It has been found that the chlorine of the chlorine-containing particles is different from the hydrolyzable chlorine and the chlorine derived from free chlorine in the form of presence, and is present locally to the epoxy resin composition, in the particles. It becomes high concentration. For example, the presence of chlorine in the chlorine-containing particles can be confirmed significantly by, for example, element mapping of energy dispersive X-ray spectroscopy (EDX).
Although the detailed mechanism is not clear, such chlorine-containing particles have an oxidizing effect on metals such as Cu, and by such oxidizing action, the surface of the metal is modified to have an affinity with the epoxy resin composition. It is thought that it can improve and the metal adhesiveness in an epoxy resin composition can be improved.
Therefore, the metal adhesiveness in an epoxy resin composition can be improved by containing chlorine containing particle | grains containing an organic substance in an epoxy resin composition.
(1) 試料(サンプル)として、エポキシ樹脂組成物またはエポキシ樹脂組成物を構成する原料成分(例えば、エポキシ樹脂、硬化剤、無機充填材など)を準備する。エポキシ樹脂組成物は、各原料成分を混合・混練し、得られた混練物を冷却したもの(Bステージ状態のエポキシ樹脂組成物)を使用する。
(2) (1)の試料50gを、洗浄済みのポリプロピレン製の1000ml容器に投入し、アセトン300mlを加え、容器に蓋をした後、室温25℃、シェーカーを用いて、300往復/分の条件で50分間シェーク(混合)する。使用するアセトンは、目開きサイズが12μmのフィルターで濾過したものを使用する。
(3) ファンネルセット(濾過器具)に、上記アセトンで洗浄したフィルターを設置する。フィルターは、目開きサイズが75μmのナイロン製フィルターに、超音波洗浄したものを使用する。
(4) (2)においてシェークした容器を静置し、その後、容器中における溶液を、(3)のファンネル上部から注ぎ入れ、フィルターを介して吸引濾過した。試料中含まれる無機充填材等のフィラーの粒径がフィルターの目開きよりも大きな粒径を使用する場合、該溶液中の上澄みをフィルターで濾過してもよい。
(5) ファンネルを取り外し、吸引したままフィルター上の残渣を乾燥させる。
(6) (5)のフィルター表面に測定用シートの粘着性表面を貼り付けて、測定用シートの粘着性表面に残渣を回収する。
(7) (6)の測定用シートをフィルターから剥離し、その粘着性表面における全面について、デジタルマイクロスコープを用いて合成写真を作成する。視野倍率が50倍になる様に調整した後、全面観察し、残渣が存在する位置を記録して印刷する。
(8) (7)の印刷物で残渣の位置を確認するとともに、走査型電子顕微鏡(SEM)/エネルギー分散形X線分析装置(EDS)を用いて、当該残渣について組成分析を実施する。
(9) (8)のエネルギー分散型X線分光法(EDX)に基づく残渣の組成分析結果から、エポキシ樹脂組成物またはそれを構成する原料成分中に含有される塩素含有粒子の個数をカウントするとともに、塩素含有粒子中の元素成分を特定する。必要に応じて、塩素含有粒子について各種の分析を実施してもよい。 In the present embodiment, chlorine-containing particles can be detected by the following inspection method (hereinafter sometimes referred to as inspection method of chlorine-containing particles).
(1) As a sample (sample), a raw material component (for example, an epoxy resin, a curing agent, an inorganic filler, etc.) which comprises an epoxy resin composition or an epoxy resin composition is prepared. As the epoxy resin composition, one obtained by mixing and kneading each raw material component and cooling the obtained kneaded product (epoxy resin composition in a B-stage state) is used.
(2) Put 50 g of the sample of (1) into a cleaned 1000 ml container made of polypropylene, add 300 ml of acetone, cap the container, and use a shaker at room temperature 25 ° C. for 300 reciprocations / minute Shake (mix) for 50 minutes. The acetone to be used uses what was filtered by the filter of 12 micrometers of mesh sizes.
(3) Install the above acetone-washed filter in a funnel set (filtration device). The filter used is a nylon filter with an opening size of 75 μm, which has been subjected to ultrasonic cleaning.
(4) The container shaken in (2) was allowed to stand, and then the solution in the container was poured from the top of the funnel of (3) and suction filtered through a filter. If the particle size of the filler such as the inorganic filler contained in the sample is larger than the pore size of the filter, the supernatant in the solution may be filtered by a filter.
(5) Remove the funnel and dry the residue on the filter while suctioning.
(6) Stick the adhesive surface of the measurement sheet to the filter surface of (5), and collect the residue on the adhesive surface of the measurement sheet.
(7) The measurement sheet of (6) is peeled off from the filter, and a composite photograph is made of the entire surface of the adhesive surface using a digital microscope. After adjusting the visual field magnification to be 50 times, the entire surface is observed, and the position where the residue is present is recorded and printed.
(8) While confirming the position of the residue in the printed matter of (7), composition analysis is performed on the residue using a scanning electron microscope (SEM) / energy dispersive X-ray analyzer (EDS).
(9) From the compositional analysis result of the residue based on energy dispersive X-ray spectroscopy (EDX) of (8), count the number of chlorine-containing particles contained in the epoxy resin composition or the raw material component constituting it. And identify the elemental component in the chlorine-containing particles. If desired, various analyzes may be performed on the chlorine-containing particles.
これに対して、上記塩素含有粒子の検査方法は、エポキシ樹脂組成物やその原料成分中に含有される塩素含有粒子や当該粒子に含有される塩素について安定的に検出する方法であり、本発明者によって新たに確立された手法である。 Conventional methods for measuring total chlorine content are inorganic chlorine and hydrolyzable chlorine derived from raw materials of epoxy resin, so the above-mentioned chlorine-containing particles can not be measured. The
On the other hand, the inspection method of the above-mentioned chlorine content particles is a method of detecting stably chlorine content particles contained in an epoxy resin composition or its raw material component, and chlorine contained in the particles concerned, and the present invention It is a method newly established by the
エポキシ樹脂組成物中に含有される上記塩素含有粒子中の有機物は、セルロース、ポリエチレンテレフタレート、ポリプロピレン、絹、シリコーン化合物、およびアミド化合物からなる群から選択される一種以上を含むことができる。これらを単独で用いても2種以上を組み合わせて用いてもよい。またはこれらの混合物であってもよい。
上記塩素含有粒子は、これら以外の有機物を含有していてもよい。FT-IR(フーリエ変換型赤外分光)を用いた塩素含有粒子のスペクトル結果から有機物を同定することができる。 The organic substance in the above-mentioned chlorine-containing particles contained in the epoxy resin can include one or more selected from the group consisting of carbonates, amide compounds, and silicates. These organic substances may be a mixture with an epoxy resin.
The organic substance in the above-mentioned chlorine-containing particles contained in the epoxy resin composition can contain one or more selected from the group consisting of cellulose, polyethylene terephthalate, polypropylene, silk, a silicone compound, and an amide compound. These may be used alone or in combination of two or more. Or it may be a mixture of these.
The above-mentioned chlorine-containing particles may contain organic substances other than these. Organic substances can be identified from the spectrum results of chlorine-containing particles using FT-IR (Fourier transform infrared spectroscopy).
また複数の塩素含有粒子が存在する場合、塩素濃度の最大値を低減させることにより、信頼性を高めることが可能である。 The lower limit value of the chlorine concentration in the chlorine-containing particles is, for example, 0.01 Atm% or more, and may be 0.5 Atm% or more, or 0.1 Atm% or more. Thereby, metal adhesiveness can be improved. On the other hand, the upper limit of the chlorine concentration in the chlorine-containing particles is, for example, 20 Atm% or less, preferably 10 Atm% or less, and more preferably 7 Atm% or less. This can improve the reliability.
In addition, when a plurality of chlorine-containing particles are present, it is possible to improve the reliability by reducing the maximum value of the chlorine concentration.
この場合、上記塩素含有粒子中のAl濃度は、0.1Atm%~4Atm%でもよく、0.1Atm%~1.0Atm%でもよい。
上記塩素含有粒子中のMg濃度は、0.1Atm%~0.5Atm%でもよく、0.1Atm%~0.4Atm%でもよい。
上記塩素含有粒子中のSi濃度は、0.1Atm%~5Atm%でもよく、0.1Atm%~2.0Atm%でもよく、0.1Atm%~1Atm%でもよい。
上記塩素含有粒子中のFe濃度は、0.1Atm%~4Atm%でもよく、0.1Atm%~2.0Atm%でもよい。
上記塩素含有粒子中のZn濃度は、0.1Atm%~5Atm%でもよく、0.1Atm%~1.0Atm%でもよい。
上記塩素含有粒子中のTi濃度は、0.01Atm%~1.0Atm%でもよく、0.04Atm%~0.8Atm%でもよい。
上記塩素含有粒子中のCa濃度は、0.01Atm%~17Atm%でもよく、0.02Atm%~6Atm%でもよく、0.1Atm%~3Atm%でもよい。
上記塩素含有粒子中のNa濃度は、0.01Atm%~2Atm%でもよく、0.1Atm%~1.5Atm%でもよい。
上記塩素含有粒子中のK濃度は、0.01Atm%~5Atm%でもよく、0.1Atm%~1.0Atm%でもよい。
上記塩素含有粒子中のS濃度は、0.01Atm%~2Atm%でもよく、0.02Atm%~1.0Atm%でもよい。
上記塩素含有粒子における元素成分としては、塩素元素および炭素元素の他に、1種以上でもよく、2種以上でもよく、または5種以上の他の元素を含有してもよい。 The chlorine-containing particles contain one or more selected from the group consisting of Al element, Mg element, Si element, Fe element, Zn element, Ti element, Ca element, Na element, K element, S element, carbonate compound be able to. These may be used alone or in combination of two or more.
In this case, the Al concentration in the chlorine-containing particles may be 0.1 Atm% to 4 Atm%, or 0.1 Atm% to 1.0 Atm%.
The Mg concentration in the chlorine-containing particles may be 0.1 Atm% to 0.5 Atm%, or 0.1 Atm% to 0.4 Atm%.
The Si concentration in the chlorine-containing particles may be 0.1 Atm% to 5 Atm%, 0.1 Atm% to 2.0 Atm%, or 0.1 Atm% to 1 Atm%.
The Fe concentration in the chlorine-containing particles may be 0.1 Atm% to 4 Atm%, or may be 0.1 Atm% to 2.0 Atm%.
The Zn concentration in the chlorine-containing particles may be 0.1 Atm% to 5 Atm%, or may be 0.1 Atm% to 1.0 Atm%.
The Ti concentration in the chlorine-containing particles may be 0.01 Atm% to 1.0 Atm%, or may be 0.04 Atm% to 0.8 Atm%.
The Ca concentration in the chlorine-containing particles may be 0.01 Atm% to 17 Atm%, may be 0.02 Atm% to 6 Atm%, and may be 0.1 Atm% to 3 Atm%.
The concentration of Na in the chlorine-containing particles may be 0.01 Atm% to 2 Atm%, or 0.1 Atm% to 1.5 Atm%.
The K concentration in the chlorine-containing particles may be 0.01 Atm% to 5 Atm%, or 0.1 Atm% to 1.0 Atm%.
The S concentration in the chlorine-containing particles may be 0.01 Atm% to 2 Atm%, or may be 0.02 Atm% to 1.0 Atm%.
As an element component in the above-mentioned chlorine content particles, in addition to chlorine element and carbon element, 1 type or more may be sufficient, 2 types or more may be sufficient, or 5 or more types of other elements may be contained.
上記50gのエポキシ樹脂組成物における塩素含有粒子の個数は、1個以上とすることができる。これにより、電子部品を封止する封止材(封止用エポキシ樹脂組成物)としてエポキシ樹脂組成物を用いた場合に、金属回路、金属パット、金属ワイヤなどの金属部材との密着性を高めることができる。とくにCu等の金属部材との密着性を向上させることができる。また、エポキシ樹脂組成物における塩素含有粒子の個数は、例えば、10個以下としてもよく、5個以下としてもよく、3個以下でもよく、2個以下でもよい。これにより、電子部品を封止する封止材としてエポキシ樹脂組成物を用いた場合に、信頼性を向上させることができる。
上記エポキシ樹脂組成物に用いる各成分に関し、例えば、50gのエポキシ樹脂中において、塩素含有粒子の個数は、1~5個以下でもよく、1~3個以下でもよく、1~2個以下でもよく、1個でもよい。 In the present embodiment, the number of chlorine-containing particles in the epoxy resin composition or the number of chlorine-containing particles in the epoxy resin can be measured by using the above-mentioned <Method for inspecting chlorine-containing particles>.
The number of chlorine-containing particles in the 50 g of the epoxy resin composition can be one or more. Thereby, when using an epoxy resin composition as a sealing material (an epoxy resin composition for sealing) which seals electronic parts, adhesiveness with metal members, such as a metal circuit, a metal pad, and a metal wire, is improved. be able to. In particular, the adhesion to a metal member such as Cu can be improved. The number of chlorine-containing particles in the epoxy resin composition may be, for example, 10 or less, 5 or less, 3 or less, or 2 or less. Thereby, when an epoxy resin composition is used as a sealing material which seals electronic parts, reliability can be improved.
Regarding each component used for the above epoxy resin composition, for example, in 50 g of epoxy resin, the number of chlorine-containing particles may be 1 to 5 or less, 1 to 3 or less, or 1 to 2 or less. , May be one.
上記エポキシ樹脂組成物は、エポキシ樹脂を含む。
上記エポキシ樹脂としては、1分子内にエポキシ基を2個以上有するモノマー、オリゴマー、ポリマー全般であり、その分子量、分子構造を特に限定するものではない。
上記エポキシ樹脂としては、たとえば、ビフェニル型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、スチルベン型エポキシ樹脂、ハイドロキノン型エポキシ樹脂等の2官能性または結晶性エポキシ樹脂;クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂;フェニレン骨格含有フェノールアラルキル型エポキシ樹脂、ビフェニレン骨格含有フェノールアラルキル型エポキシ樹脂、フェニレン骨格含有ナフトールアラルキル型エポキシ樹脂等のフェノールアラルキル型エポキシ樹脂;トリフェノールメタン型エポキシ樹脂およびアルキル変性トリフェノールメタン型エポキシ樹脂等の3官能型エポキシ樹脂;ジシクロペンタジエン変性フェノール型エポキシ樹脂、テルペン変性フェノール型エポキシ樹脂等の変性フェノール型エポキシ樹脂;トリアジン核含有エポキシ樹脂等の複素環含有エポキシ樹脂等が挙げられる。これらは1種類を単独で用いても2種類以上を組み合わせて用いてもよい。 [Epoxy resin]
The epoxy resin composition contains an epoxy resin.
The epoxy resin is generally a monomer, an oligomer or a polymer having two or more epoxy groups in one molecule, and the molecular weight and molecular structure thereof are not particularly limited.
Examples of the epoxy resin include bifunctional or crystalline epoxy resins such as biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilbene type epoxy resin, hydroquinone type epoxy resin; cresol novolac type epoxy resin Novolak type epoxy resin such as phenol novolac type epoxy resin and naphthol novolac type epoxy resin; Phenol aralkyl type such as phenylene skeleton containing phenol aralkyl type epoxy resin, biphenylene skeleton containing phenol aralkyl type epoxy resin, phenylene skeleton containing naphthol aralkyl type epoxy resin Epoxy resin; Trifunctional epoxy resin such as triphenolmethane epoxy resin and alkyl-modified triphenolmethane epoxy resin Dicyclopentadiene-modified phenol type epoxy resins, modified phenol type epoxy resins such as terpene-modified phenol type epoxy resins; heterocycle-containing epoxy resins such as triazine nucleus-containing epoxy resins. One of these may be used alone, or two or more of these may be used in combination.
一方、エポキシ樹脂の含有量の上限値は、エポキシ樹脂組成物の全固形分に対して、例えば30質量%以下であることが好ましく、20質量%以下であることがより好ましい。エポキシ樹脂の含有量を上記上限値以下とすることにより、エポキシ樹脂組成物を用いて形成される硬化物を備える半導体装置およびその他の構造体について、耐湿信頼性や耐リフロー性、耐温度サイクル性を向上させることができる。 The lower limit of the content of the epoxy resin in the epoxy resin composition is, for example, preferably 8% by mass or more, and more preferably 10% by mass or more based on the total solid content of the epoxy resin composition. And 12% by mass or more is particularly preferable. By making content of an epoxy resin more than the said lower limit, the fluidity | liquidity of an epoxy resin composition can be improved and the further improvement of a moldability can be aimed at.
On the other hand, the upper limit value of the content of the epoxy resin is, for example, preferably 30% by mass or less, and more preferably 20% by mass or less, based on the total solid content of the epoxy resin composition. By setting the content of the epoxy resin to the above upper limit value or less, the moisture resistance, the reflow resistance, and the temperature cycle resistance of the semiconductor device and the other structures provided with the cured product formed using the epoxy resin composition Can be improved.
上記エポキシ樹脂組成物は、硬化剤を含むことができる。
上記硬化剤は、エポキシ樹脂組成物に一般に使用されているものであれば特に制限はないが、例えば、フェノール樹脂系硬化剤、アミン系硬化剤、酸無水物系硬化剤、メルカプタン系硬化剤等、が挙げられる。これらの中でも、耐燃性、耐湿性、電気特性、硬化性、保存安定性等のバランスの点からフェノール樹脂系硬化剤が好ましい。 [Hardener]
The epoxy resin composition can include a curing agent.
The curing agent is not particularly limited as long as it is generally used in epoxy resin compositions, but, for example, a phenol resin curing agent, an amine curing agent, an acid anhydride curing agent, a mercaptan curing agent, etc. , Is mentioned. Among these, from the viewpoint of balance such as flame resistance, moisture resistance, electric properties, curability, storage stability, etc., a phenol resin-based curing agent is preferable.
上記フェノール樹脂系硬化剤としては、エポキシ樹脂組成物に一般に使用されているものであれば特に制限はないが、例えば、フェノールノボラック樹脂、クレゾールノボラック樹脂をはじめとするフェノール、クレゾール、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF、フェニルフェノール、アミノフェノール、α-ナフトール、β-ナフトール、ジヒドロキシナフタレン等のフェノール類とホルムアルデヒドやケトン類とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂、上記したフェノール類とジメトキシパラキシレン又はビス(メトキシメチル)ビフェニルから合成されるフェニレン骨格を有するフェノールアラルキル樹脂、ビフェニレン骨格を有するフェノールアラルキル樹脂などのフェノールアラルキル樹脂、トリスフェニルメタン骨格を有するフェノール樹脂、などが挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。 <Phenolic resin curing agent>
The phenolic resin-based curing agent is not particularly limited as long as it is generally used in epoxy resin compositions, and examples thereof include phenol novolac resin, phenol including cresol novolac resin, cresol, resorcinol, catechol, Novolak resin obtained by condensation or cocondensation of phenols such as bisphenol A, bisphenol F, phenylphenol, aminophenol, α-naphthol, β-naphthol, dihydroxynaphthalene and formaldehyde or ketones under an acid catalyst, as described above A phenol aralkyl resin such as a phenol aralkyl resin having a phenylene skeleton synthesized from phenols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl and a phenol aralkyl resin having a biphenylene skeleton Lukil resin, a phenol resin having a trisphenylmethane skeleton, and the like can be mentioned, and these may be used alone or in combination of two or more.
上記アミン系硬化剤としては、ジエチレントリアミン(DETA)やトリエチレンテトラミン(TETA)やメタキシリレンジアミン(MXDA)などの脂肪族ポリアミン、ジアミノジフェニルメタン(DDM)やm-フェニレンジアミン(MPDA)やジアミノジフェニルスルホン(DDS)などの芳香族ポリアミンのほか、ジシアンジアミド(DICY)や有機酸ジヒドララジドなどを含むポリアミン化合物などが挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。 <Amine curing agent>
Examples of the amine-based curing agent include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA) and metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA) and diaminodiphenyl sulfone In addition to aromatic polyamines such as (DDS), polyamine compounds containing dicyandiamide (DICY), organic acid dihydrazide and the like may be mentioned, and these may be used alone or in combination of two or more.
上記酸無水物系硬化剤としては、ヘキサヒドロ無水フタル酸(HHPA)やメチルテトラヒドロ無水フタル酸(MTHPA)や無水マレイン酸などの脂環族酸無水物、無水トリメリット酸(TMA)や無水ピロメリット酸(PMDA)やベンゾフェノンテトラカルボン酸(BTDA)、無水フタル酸などの芳香族酸無水物などが挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。 <Acid anhydride curing agent>
Examples of the acid anhydride-based curing agent include alicyclic anhydrides such as hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA) and maleic anhydride, trimellitic anhydride (TMA) and pyromellitic anhydride Examples thereof include acids (PMDA), benzophenonetetracarboxylic acids (BTDA), and aromatic acid anhydrides such as phthalic anhydride. These may be used alone or in combination of two or more.
上記メルカプタン系硬化剤としては、トリメチロールプロパントリス(3-メルカプトブチレート)、トリメチロールエタントリス(3-メルカプトブチレート)などが挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。 <Mercaptan-based curing agent>
As the above-mentioned mercaptan-based curing agent, trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercaptobutyrate), etc. may be mentioned, and even if they are used alone, they may be used in combination of two or more. May be
その他の硬化剤としては、イソシアネートプレポリマーやブロック化イソシアネートなどのイソシアネート化合物、カルボン酸含有ポリエステル樹脂などの有機酸類などが挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。
また、上記のうち異なる系の硬化剤の2種以上を組み合わせて用いてもよい。 <Other curing agent>
Other curing agents include isocyanate compounds such as isocyanate prepolymers and blocked isocyanates, organic acids such as carboxylic acid-containing polyester resins, etc. These may be used alone or in combination of two or more. .
Moreover, you may use combining 2 or more types of the hardening agent of a different system among the above-mentioned.
上記エポキシ樹脂組成物は、無機充填材を含有することができる。
上記無機充填材としては、たとえば、溶融破砕シリカ及び溶融球状シリカ等の溶融シリカ、結晶シリカ等のシリカ、アルミナ、水酸化アルミニウム、窒化珪素、および窒化アルミ等が挙げられる。これらを単独で用いても2種以上を組み合わせて用いてもよい。この中でも、好ましくは、溶融破砕シリカ、溶融球状シリカ、結晶シリカ等のシリカであり、より好ましくは溶融球状シリカを使用することができる。 [Inorganic filler]
The epoxy resin composition can contain an inorganic filler.
Examples of the inorganic filler include fused silica such as fused and crushed silica and fused spherical silica, silica such as crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. These may be used alone or in combination of two or more. Among these, preferred are silicas such as fused and crushed silica, fused spherical silica, and crystalline silica, and more preferably fused spherical silica can be used.
また、本実施形態の無機充填材の一例としては、エポキシ樹脂組成物の充填性をさらに向上させる観点から、たとえば、平均粒径0.01μm以上1μm以下の第一充填材と、平均粒径1μmより大きく15μm以下の第二充填材、平均粒径15μmより大きく50μm以下の第三充填材を含むことができる。 Moreover, the said inorganic filler may use together the 2 or more types of filler of a different average particle diameter (D50), for example. Thereby, the fillability of the inorganic filler to the total solid content of the epoxy resin composition can be more effectively enhanced. Moreover, in the present embodiment, a filler having an average particle diameter of 0.01 μm or more and 1 μm or less and a filler having an average particle diameter of 1 μm to 50 μm or less improve the filling property of the epoxy resin composition. And may be used as an example.
Moreover, as an example of the inorganic filler of the present embodiment, from the viewpoint of further improving the filling property of the epoxy resin composition, for example, a first filler having an average particle diameter of 0.01 μm or more and 1 μm or less and an average particle diameter of 1 μm The second filler may be larger than 15 μm, and the third filler may be larger than 15 μm and 50 μm or less.
上記エポキシ樹脂組成物は、必要に応じて、硬化促進剤をさらに含むことができる。
上記硬化促進剤は、上記エポキシ樹脂と、上記硬化剤と、の架橋反応を促進させるものであればよく、一般のエポキシ樹脂組成物に使用するものを用いることができる。 [Hardening accelerator]
The said epoxy resin composition can further contain a hardening accelerator as needed.
As the curing accelerator, any curing accelerator may be used as long as it accelerates the crosslinking reaction of the epoxy resin and the curing agent, and those used for general epoxy resin compositions can be used.
上記エポキシ樹脂組成物は、必要に応じて、カップリング剤を含むことができる。
上記カップリング剤としては、たとえばエポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン、メタクリルシラン等の各種シラン系化合物、チタン系化合物、アルミニウムキレート類、アルミニウム/ジルコニウム系化合物等の公知のカップリング剤を用いることができる。これらを例示すると、ビニルトリクロロシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリス(β-メトキシエトキシ)シラン、γ-メタクリロキシプロピルトリメトキシシラン、β-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-グリシドキシプロピルトリエトキシシラン、γ-グリシドキシプロピルメチルジメトキシシラン、γ-メタクリロキシプロピルメチルジエトキシシラン、γ-メタクリロキシプロピルトリエトキシシラン、ビニルトリアセトキシシラン、γ-メルカプトプロピルトリメトキシシラン、γ-アミノプロピルトリエトキシシラン、γ-アニリノプロピルトリメトキシシラン、γ-アニリノプロピルメチルジメトキシシラン、γ-[ビス(β-ヒドロキシエチル)]アミノプロピルトリエトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリメトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリエトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルメチルジメトキシシラン、フェニルアミノプロピルトリメトキシシラン、γ-(β-アミノエチル)アミノプロピルジメトキシメチルシラン、N-(トリメトキシシリルプロピル)エチレンジアミン、N-(ジメトキシメチルシリルイソプロピル)エチレンジアミン、メチルトリメトキシシラン、ジメチルジメトキシシラン、メチルトリエトキシシラン、N-β-(N-ビニルベンジルアミノエチル)-γ-アミノプロピルトリメトキシシラン、γ-クロロプロピルトリメトキシシラン、ヘキサメチルジシラン、ビニルトリメトキシシラン、γ-メルカプトプロピルメチルジメトキシシラン、3-イソシアネートプロピルトリエトキシシラン、3-アクリロキシプロピルトリメトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミンの加水分解物等のシラン系カップリング剤、イソプロピルトリイソステアロイルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、イソプロピルトリ(N-アミノエチル-アミノエチル)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2-ジアリルオキシメチル-1-ブチル)ビス(ジトリデシル)ホスファイトチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)エチレンチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリ(ジオクチルホスフェート)チタネート、イソプロピルトリクミルフェニルチタネート、テトライソプロピルビス(ジオクチルホスファイト)チタネート等のチタネート系カップリング剤が挙げられる。これらは、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。これらの中でも、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシランまたはビニルシランのシラン系化合物がより好ましい。また、充填性や成形性をより効果的に向上させる観点からは、フェニルアミノプロピルトリメトキシシランに代表される2級アミノシランを用いることが特に好ましい。 [Coupling agent]
The said epoxy resin composition can contain a coupling agent as needed.
Examples of the coupling agent include various silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane and methacrylsilane, titanium compounds, aluminum chelates and aluminum / zirconium compounds. Coupling agents can be used. These are exemplified by vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxy Silane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane , Vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropylmethyldimethoxysilane, -[Bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, phenylaminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (Dimethoxymethylsilylisopropyl) ethylenediamine, methyltrimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysila , Hexamethyldisilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl) Silane-based coupling agents such as hydrolyzate of (butylidene) propylamine, isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditriethyl) Decyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxide Tate titanate, bis (dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylic isostearoyl titanate, isopropyl tridodecyl benzene sulfonyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumyl Titanate coupling agents such as phenyl titanate and tetraisopropyl bis (dioctyl phosphite) titanate are mentioned. One of these may be used alone, or two or more of these may be used in combination. Among these, silane compounds of epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane or vinylsilane are more preferable. Further, from the viewpoint of more effectively improving the filling property and the moldability, it is particularly preferable to use a secondary aminosilane represented by phenylaminopropyltrimethoxysilane.
上記低応力剤は、たとえばシリコーンオイル、シリコーンゴム、ポリイソプレン、1,2-ポリブタジエン、1,4-ポリブタジエン等のポリブタジエン、スチレン-ブタジエンゴム、アクリロニトリル-ブタジエンゴム、ポリクロロプレン、ポリ(オキシプロピレン)、ポリ(オキシテトラメチレン)グリコール、ポリオレフィングリコール、ポリ-ε-カプロラクトン等の熱可塑性エラストマー、ポリスルフィドゴム、およびフッ素ゴムから選択される一種または二種以上を含むことができる。これらの中でも、シリコーンゴム、シリコーンオイル、およびアクリロニトリル-ブタジエンゴムのうちの少なくとも一方を含むことが、弾性率を所望の範囲に制御して、得られる半導体パッケージ及びその他の構造体の耐温度サイクル性、耐リフロー性を向上させる観点から、とくに好ましい態様として選択し得る。 Moreover, the said epoxy resin composition can contain the low stress agent as needed.
Examples of the low stress agent include silicone oil, silicone rubber, polyisoprene, polybutadiene such as 1,2-polybutadiene and 1,4-polybutadiene, styrene-butadiene rubber, acrylonitrile-butadiene rubber, polychloroprene, poly (oxypropylene), It may contain one or more selected from thermoplastic elastomers such as poly (oxytetramethylene) glycol, polyolefin glycol, poly-ε-caprolactone, polysulfide rubber, and fluororubber. Among these, containing at least one of silicone rubber, silicone oil, and acrylonitrile-butadiene rubber controls the elastic modulus within a desired range, and the temperature cycle resistance of the obtained semiconductor package and other structures. In terms of improving the reflow resistance, it can be selected as a particularly preferred embodiment.
本実施形態のエポキシ樹脂組成物には、さらに必要に応じて、その他の成分を含むことができる。その他の成分として、例えば、ハイドロタルサイト、アルミニウム-マグネシウム系無機イオン交換体等のイオン捕捉剤;カーボンブラック、ベンガラ等の着色剤;カルナバワックス等の天然ワックス、モンタン酸エステルワックス、ジエタノールアミン・ジモンタン酸エステル、トリレンジイソシアネート変性酸化ワックス等の合成ワックス、ステアリン酸亜鉛等の高級脂肪酸およびその金属塩類もしくはパラフィン等の離型剤;酸化防止剤等の各種添加剤が挙げられる。これらの添加剤は適宜配合されてもよい。 [Other ingredients]
The epoxy resin composition of the present embodiment can further contain other components, if necessary. Other components include, for example, ion capturing agents such as hydrotalcite and aluminum-magnesium inorganic ion exchangers; colorants such as carbon black and bengala; natural waxes such as carnauba wax; montanic acid ester wax; diethanolamine / dimontanic acid Esters, synthetic waxes such as tolylene diisocyanate-modified oxidized waxes, higher fatty acids such as zinc stearate and metal salts thereof or mold release agents such as paraffin; various additives such as antioxidants can be mentioned. These additives may be blended appropriately.
本実施形態のエポキシ樹脂組成物の製造方法について説明する。
上記エポキシ樹脂組成物の製造方法としては、ロット選別工程、混合工程を含むことができる。まず、ロットが異なる複数のエポキシ樹脂aを準備し、上記の塩素含有粒子の検査方法を用いて、準備したエポキシ樹脂aの塩素含有粒子の個数を測定する。得られた測定結果に基づいて、複数のロットの中から、塩素含有粒子を含有するエポキシ樹脂aを選択し、エポキシ樹脂組成物の原料成分(エポキシ樹脂A)として使用する(ロット選別工程)。このエポキシ樹脂Aとともに、他の原料成分を混合して(混合工程)、エポキシ樹脂組成物を得ることができる。
また、他の成分(例えば、硬化剤bや無機充填材c)についても、エポキシ樹脂aと同様にして、ロット選別を行い、塩素含有粒子を含有する硬化剤bや無機充填材cを、原料成分(硬化剤Bや無機充填材C)として使用してもよい。また、上述の塩素含有粒子の量を制御する方法を適宜追加することが可能である。 [Method of producing epoxy resin composition]
The manufacturing method of the epoxy resin composition of this embodiment is demonstrated.
The method for producing the epoxy resin composition can include a lot sorting step and a mixing step. First, a plurality of epoxy resins a having different lots are prepared, and the number of chlorine-containing particles of the prepared epoxy resin a is measured using the above-described inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a containing chlorine-containing particles is selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition (lot selection step). An epoxy resin composition can be obtained by mixing other raw material components with the epoxy resin A (mixing step).
In addition, other components (for example, curing agent b and inorganic filler c) are also subjected to lot selection in the same manner as epoxy resin a, and curing agent b and inorganic filler c containing chlorine-containing particles are used as raw materials. You may use as a component (hardener B and the inorganic filler C). Moreover, it is possible to add the method of controlling the quantity of the above-mentioned chlorine containing particle | grains suitably.
図3は、本実施形態の構造体(車載用電子制御ユニット10)の一例を示す断面模式図である。
車載用電子制御ユニット10は、エンジンや各種車載機器等を制御するために用いられる。図3に示すように、車載用電子制御ユニット10は、たとえば基板12と、基板12上に搭載された電子部品16と、基板12および電子部品16を封止する封止樹脂層14と、を備えている。基板12は、少なくとも一辺において、外部と接続するための接続端子18を有している。本実施形態の一例に係る車載用電子制御ユニット10は、接続端子18と相手方コネクタを嵌合することによって、接続端子18を介して上記相手方コネクタに電気的に接続されることとなる。 The epoxy resin composition of the present embodiment can be used as a sealing resin composition for sealing an on-vehicle electronic control unit.
FIG. 3 is a schematic cross-sectional view showing an example of the structure (vehicle-mounted electronic control unit 10) of the present embodiment.
The in-vehicle
着色剤1:カーボンブラック(カーボン#5、三菱化学社製) (Colorant)
Colorant 1: carbon black (
硬化促進剤1:下記式で表される硬化促進剤1
メタノール1800gを入れたフラスコに、フェニルトリメトキシシラン249.5g、2,3-ジヒドロキシナフタレン384.0gを加えて溶かし、次に室温攪拌下28%ナトリウムメトキシド-メタノール溶液231.5gを滴下した。さらにそこへ予め用意したテトラフェニルホスホニウムブロマイド503.0gをメタノール600gに溶かした溶液を室温攪拌下滴下すると結晶が析出した。析出した結晶を濾過、水洗、真空乾燥し、桃白色結晶の上記硬化促進剤1を得た。 (Hardening accelerator)
Curing accelerator 1: Curing
In a flask containing 1800 g of methanol, 249.5 g of phenyltrimethoxysilane and 384.0 g of 2,3-dihydroxynaphthalene were added and dissolved, and then 231.5 g of a 28% sodium methoxide-methanol solution was added dropwise while stirring at room temperature. Further, a solution of 503.0 g of tetraphenylphosphonium bromide prepared in advance in 600 g of methanol was added dropwise thereto under stirring at room temperature to precipitate crystals. The precipitated crystals were filtered, washed with water and vacuum dried to obtain the above-mentioned
冷却管及び攪拌装置付きのセパラブルフラスコに2,3-ジヒドロキシナフタレン12.81g(0.080mol)、テトラフェニルホスホニウムブロミド16.77g(0.040mol)及びメタノール100mlを仕込み攪拌し、均一に溶解させた。予め水酸化ナトリウム1.60g(0.04ml)を10mlのメタノールに溶解した水酸化ナトリウム溶液をフラスコ内に徐々に滴下すると結晶が析出した。析出した結晶をろ過、水洗、真空乾燥し、上記式で表される硬化促進剤2を得た。 [Method of synthesizing curing accelerator 2]
In a separable flask equipped with a condenser and a stirrer, 12.81 g (0.080 mol) of 2,3-dihydroxynaphthalene, 16.77 g (0.040 mol) of tetraphenylphosphonium bromide and 100 ml of methanol are charged and uniformly dissolved. The A sodium hydroxide solution prepared by previously dissolving 1.60 g (0.04 ml) of sodium hydroxide in 10 ml of methanol was gradually dropped into the flask to precipitate crystals. The precipitated crystals were filtered, washed with water and vacuum dried to obtain a hardening
カップリング剤1:N-フェニル-3-アミノプロピルトリメトキシシラン(CF-4083、東レ・ダウコーニング社製)
カップリング剤2:3-メルカプトプロピルトリメトキシシラン(S810、チッソ社製) (Coupling agent)
Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (CF-4083, manufactured by Toray Dow Corning)
Coupling agent 2: 3-mercaptopropyltrimethoxysilane (S810, manufactured by Chisso)
エポキシ樹脂a1:ビフェニレン骨格含有フェノールアラルキル型エポキシ樹脂(NC3000L、日本化薬社製)
エポキシ樹脂a2:ビスフェノールA型エポキシ樹脂(YL6810、三菱化学社製)
エポキシ樹脂a3:ビフェニル型エポキシ樹脂(YX4000K、三菱化学社製)
エポキシ樹脂4:エピクロロヒドリンを使用しないで合成されたエポキシ樹脂(グリシジルエーテル型液状エポキシ樹脂、DIC社製 EPICLON EXA-4880、全塩素:0ppm)
エポキシ樹脂5:エピクロロヒドリンを使用しないで合成されたエポキシ樹脂(脂環式エポキシ樹脂、ダイゼル社製 EHPE3150、全塩素:0ppm) (Epoxy resin A)
Epoxy resin a1: phenol-aralkyl epoxy resin containing biphenylene skeleton (NC 3000 L, manufactured by Nippon Kayaku Co., Ltd.)
Epoxy resin a2: Bisphenol A epoxy resin (YL 6810, manufactured by Mitsubishi Chemical Corporation)
Epoxy resin a3: biphenyl type epoxy resin (YX4000K, manufactured by Mitsubishi Chemical Corporation)
Epoxy resin 4: Epoxy resin synthesized without using epichlorohydrin (glycidyl ether type liquid epoxy resin, manufactured by DIC EPICLON EXA-4880, total chlorine: 0 ppm)
Epoxy resin 5: Epoxy resin synthesized without using epichlorohydrin (alicyclic epoxy resin, manufactured by Daisel Co. EHPE 3150, total chlorine: 0 ppm)
無機充填材c1:溶融球状シリカ(FB-100XFC、デンカ社製、平均粒径13μm)
無機充填材c2:溶融球状シリカ(MSV-SC3、龍森社製、平均粒径19μm)
無機充填材c3:球状シリカ(SD2500-SQ、アドマテックス社製、平均粒径0.5μm)
無機充填材c4:球状シリカ(SC-2500-SQ、アドマテックス社製、平均粒径0.5μm)
無機充填材c5:溶融球状シリカ(FB-950FC、デンカ社製、平均粒径22μm) (Inorganic filler C)
Inorganic filler c1: fused spherical silica (FB-100XFC, manufactured by Denka, average particle size 13 μm)
Inorganic filler c2: fused spherical silica (MSV-SC3, manufactured by Ryumori, average particle diameter 19 μm)
Inorganic filler c3: spherical silica (SD 2500-SQ, manufactured by Admatex, average particle size 0.5 μm)
Inorganic filler c4: spherical silica (SC-2500-SQ, manufactured by Admatex Co., Ltd., average particle size 0.5 μm)
Inorganic filler c5: fused spherical silica (FB-950FC, manufactured by Denka, average particle diameter 22 μm)
難燃剤1:水酸化アルミニウム(BE043、日本軽金属社製)
難燃剤2:水酸化アルミニウム(CL-303、住友化学社製) (Flame retardants)
Flame retardant 1: Aluminum hydroxide (BE043, manufactured by Nippon Light Metal Co., Ltd.)
Flame retardant 2: Aluminum hydroxide (CL-303, manufactured by Sumitomo Chemical Co., Ltd.)
硬化剤b1:ビフェニレン骨格含有フェノールアラルキル樹脂(MEH-7851SS、明和化成社製)
硬化剤b2:ノボラック型フェノール樹脂(PR-HF-3、住友ベークライト社製) (Hardener B)
Hardening agent b1: biphenylene skeleton-containing phenol aralkyl resin (MEH-7851 SS, manufactured by Meiwa Kasei Co., Ltd.)
Hardening agent b2: Novolak type phenol resin (PR-HF-3, manufactured by Sumitomo Bakelite Co., Ltd.)
イオン捕捉剤1:ハイドロタルサイト(DHT-4H、協和化学工業社製)
イオン捕捉剤2:アルミニウム-マグネシウム系無機イオン交換体(IXE-700F、東亞合成社製) (Ion capture agent)
Ion scavenger 1: Hydrotalcite (DHT-4H, manufactured by Kyowa Chemical Industry Co., Ltd.)
Ion trapping agent 2: Aluminum-magnesium inorganic ion exchanger (IXE-700F, manufactured by Toagosei Co., Ltd.)
低応力剤1:アクリロニトリル-ブタジエン共重合体化合物(CTBN1008SP、PTIジャパン社製)
低応力剤2:下記の合成方法で得られた溶融反応物A(シリコーン)
[溶融反応物Aの合成方法]
下記式(8)で表されるビスフェノールA型エポキシ樹脂(ジャバンエポキシレジン社製、jER(登録商標)YL6810、軟化点45℃、エポキシ当量172)66.1重量部を140℃で加温溶融し、下記式(7)で示されるオルガノポリシロキサン33.1重量部及びトリフェニルホスフィン0.8重量部を添加して、30分間溶融混合して溶融反応物Aを得た。
Low stress agent 1: Acrylonitrile-butadiene copolymer compound (CTBN 1008SP, manufactured by PTI Japan Ltd.)
Low stress agent 2: Melt reactant A (silicone) obtained by the following synthesis method
[Method of synthesizing molten reactant A]
66.1 parts by weight of a bisphenol A-type epoxy resin (JERB Epoxy Resins Co., Ltd., jER (registered trademark) YL 6810, softening point 45 ° C., epoxy equivalent 172) represented by the following formula (8) Then, 33.1 parts by weight of organopolysiloxane represented by the following formula (7) and 0.8 parts by weight of triphenylphosphine were added and melt mixed for 30 minutes to obtain a molten reactant A.
離型剤1:モンタン酸エステルワックス(WE-4、クラリアント・ジャパン社製)
離型剤2:ジエタノールアミン・ジモンタン酸エステル(NC-133、伊藤製油社製)
離型剤3:トリレンジイソシアネート変性酸化ワックス(NPS-6010、日本精蝋社製)
離型剤4:ステアリン酸(SR-サクラ、日油社製) (Release agent)
Releasing agent 1: Montanic acid ester wax (WE-4, manufactured by Clariant Japan Ltd.)
Releasing agent 2: Diethanolamine / zimontanic acid ester (NC-133, manufactured by Ito Oil Co., Ltd.)
Releasing agent 3: Tolylene diisocyanate-modified oxidized wax (NPS-6010, manufactured by Nippon Seiwa Co., Ltd.)
Release agent 4: Stearic acid (SR-Sakura, manufactured by NOF Corporation)
[実施例1]
ロットが異なる複数のエポキシ樹脂a1を準備し、下記の塩素含有粒子の検査方法を用いて、準備したエポキシ樹脂a1の塩素含有粒子の個数を測定した。得られた測定結果に基づいて、複数のロットの中から、表2に示す個数の塩素含有粒子を含有するエポキシ樹脂a1を選択し、エポキシ樹脂組成物の原料成分(エポキシ樹脂A)として使用した。硬化剤Bとして、硬化剤b1を使用し、無機充填材Cとして、無機充填材c1、c3を使用した。
続いて、上記のエポキシ樹脂A、硬化剤B、無機充填材Cとともに、表1に記載の他の原料成分を使用し、表1に示す配合比率に基づいて常温でミキサーを用いて混合した後、70~90℃でロール混練した。次いで、得られた混練物を冷却した後、これを粉砕してエポキシ樹脂組成物を得た。
得られたエポキシ樹脂組成物について、下記の塩素含有粒子の検査方法を用いて塩素含有粒子の個数を測定した。結果を表2に示す。 <Preparation of Epoxy Resin Composition>
Example 1
A plurality of epoxy resins a1 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a1 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a1 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition . The curing agent b1 was used as the curing agent B, and the inorganic fillers c1 and c3 were used as the inorganic filler C.
Subsequently, after using the other raw material components described in Table 1 together with the above-mentioned epoxy resin A, curing agent B and inorganic filler C, after mixing using a mixer at normal temperature based on the compounding ratio shown in Table 1 The mixture was roll-kneaded at 70 to 90.degree. Subsequently, after cooling the obtained kneaded material, this was pulverized to obtain an epoxy resin composition.
About the obtained epoxy resin composition, the number of objects of chlorine containing particles was measured using the inspection method of the following chlorine containing particles. The results are shown in Table 2.
ロットが異なる複数のエポキシ樹脂a2を準備し、下記の塩素含有粒子の検査方法を用いて、準備したエポキシ樹脂a2の塩素含有粒子の個数を測定した。得られた測定結果に基づいて、複数のロットの中から、表2に示す個数の塩素含有粒子を含有するエポキシ樹脂a2を選択し、エポキシ樹脂組成物の原料成分(エポキシ樹脂A)として使用した以外は、実施例1と同様にして、エポキシ樹脂組成物を得た。 Example 2
A plurality of epoxy resins a2 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a2 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a2 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition An epoxy resin composition was obtained in the same manner as Example 1 except for the above.
無機充填材Cとして、無機充填材c2、c3を使用した以外は、実施例1と同様にして、エポキシ樹脂組成物を得た。 [Example 3]
An epoxy resin composition was obtained in the same manner as in Example 1 except that inorganic fillers c2 and c3 were used as the inorganic filler C.
実施例1と同じロットの硬化剤b1について、有機溶剤に溶解し得られた溶液を1μmのフィルターで濾過したものを、原料成分(硬化剤B)として使用した以外は、実施例1と同様にして、エポキシ樹脂組成物を得た。 Example 4
The same procedure as in Example 1 was repeated except that the solution obtained by dissolving in an organic solvent and filtering it with a 1 μm filter was used as a raw material component (curing agent B) for the same lot of curing agent b1 as in Example 1. The epoxy resin composition was obtained.
ロットが異なる複数のエポキシ樹脂a3を準備し、下記の塩素含有粒子の検査方法を用いて、準備したエポキシ樹脂a3の塩素含有粒子の個数を測定した。得られた測定結果に基づいて、複数のロットの中から、表2に示す個数の塩素含有粒子を含有するエポキシ樹脂a3を選択し、エポキシ樹脂組成物の原料成分(エポキシ樹脂A)として使用した。硬化剤Bとして、硬化剤b1を使用し、無機充填材Cとして、無機充填材c4、c5を使用した。
続いて、上記のエポキシ樹脂A、硬化剤B、無機充填材Cとともに、表1に記載の他の原料成分を使用し、表1に示す配合比率に基づいて常温でミキサーを用いて混合した後、70~90℃でロール混練した。次いで、得られた混練物を冷却した後、これを粉砕してエポキシ樹脂組成物を得た。
得られたエポキシ樹脂組成物について、下記の塩素含有粒子の検査方法を用いて塩素含有粒子の個数を測定した。結果を表2に示す。 [Example 5]
A plurality of epoxy resins a3 having different lots were prepared, and the number of chlorine-containing particles of the prepared epoxy resin a3 was measured using the following inspection method of chlorine-containing particles. Based on the obtained measurement results, an epoxy resin a3 containing a number of chlorine-containing particles shown in Table 2 was selected from a plurality of lots and used as a raw material component (epoxy resin A) of the epoxy resin composition . The curing agent b1 was used as the curing agent B, and the inorganic fillers c4 and c5 were used as the inorganic filler C.
Subsequently, after using the other raw material components described in Table 1 together with the above-mentioned epoxy resin A, curing agent B and inorganic filler C, after mixing using a mixer at normal temperature based on the compounding ratio shown in Table 1 The mixture was roll-kneaded at 70 to 90.degree. Subsequently, after cooling the obtained kneaded material, this was pulverized to obtain an epoxy resin composition.
About the obtained epoxy resin composition, the number of objects of chlorine containing particles was measured using the inspection method of the following chlorine containing particles. The results are shown in Table 2.
実施例2の硬化剤b1に代えて硬化剤b2を使用し、当該硬化剤b2について、有機溶剤に溶解し得られた溶液を1μmのフィルターで濾過したものを、原料成分(硬化剤B)として使用した以外は、実施例5と同様にして、エポキシ樹脂組成物を得た。 [Example 6]
The curing agent b2 is used in place of the curing agent b1 of Example 2, and the solution obtained by dissolving the solution in an organic solvent is filtered through a 1 μm filter for the curing agent b2 as a raw material component (curing agent B) An epoxy resin composition was obtained in the same manner as in Example 5 except that it was used.
実施例5と異なるロットのエポキシ樹脂a3について、有機溶剤に溶解し得られた溶液を1μmフィルターで濾過し、下記の塩素含有粒子の検査方法を用いて測定された、表2に示す個数の塩素含有粒子を含有するエポキシ樹脂a3を、原料成分(エポキシ樹脂A)として使用した以外は、実施例5と同様にして、エポキシ樹脂組成物を得た。 [Example 7]
The solution obtained by dissolving in an organic solvent was filtered with a 1 μm filter for epoxy resin a3 of a lot different from Example 5 and the number of chlorines shown in Table 2 was measured using the following inspection method of chlorine-containing particles An epoxy resin composition was obtained in the same manner as in Example 5, except that the epoxy resin a3 containing the containing particles was used as a raw material component (epoxy resin A).
エポキシ樹脂Aとして、エポキシ樹脂4を使用した以外は、実施例1と同様にして、エポキシ樹脂組成物を得た。
[比較例2]
エポキシ樹脂Aとして、エポキシ樹脂5を使用した以外は、実施例5と同様にして、エポキシ樹脂組成物を得た。 Comparative Example 1
An epoxy resin composition was obtained in the same manner as in Example 1 except that the
Comparative Example 2
An epoxy resin composition was obtained in the same manner as in Example 5, except that the
実施例2と異なるロットのエポキシ樹脂a2について、有機溶剤に溶解し得られた溶液を1μmのフィルターで濾過し、下記の塩素含有粒子の検査方法を用いて測定された塩素含有粒子の個数が0個であるエポキシ樹脂a2を、原料成分(エポキシ樹脂A)として使用した以外は、実施例2と同様にして、エポキシ樹脂組成物を得た。 Comparative Example 3
The solution obtained by dissolving in an organic solvent was filtered through a 1 μm filter for epoxy resin a2 of a lot different from Example 2 and the number of chlorine-containing particles measured using the following method for inspecting chlorine-containing particles is 0 An epoxy resin composition was obtained in the same manner as in Example 2 except that the epoxy resin a2 was used as the raw material component (epoxy resin A).
(1) 試料として、エポキシ樹脂組成物またはエポキシ樹脂組成物を構成する原料成分を準備した。エポキシ樹脂組成物は、各原料成分を混合・混練し、得られた混練物を冷却したものを使用した。
(2) (1)の試料50gを、洗浄済みのポリプロピレン製の1000ml容器に投入し、アセトン300mlを加え、容器に蓋をした後、シェーカーを用いて、室温25℃、300往復/分の条件で50分間シェーク(混合)する。使用するアセトンは、目開きサイズが12μmのフィルターで濾過したものを使用した。
(3) ファンネルセット(濾過器具)に、上記アセトンで洗浄したフィルターを設置した。フィルターは、目開きサイズが75μmのナイロン製フィルターに、超音波洗浄したものを使用した。
(4) (2)においてシェークした容器を静置し、その後、容器中における溶液を、(3)のファンネル上部から注ぎ入れ、フィルターを介して吸引濾過した。
(5) ファンネルを取り外し、吸引したままフィルター上の残渣を乾燥させた。
(6) (5)のフィルター表面に測定用シートの粘着性表面を貼り付けて、測定用シートの粘着性表面に残渣を回収した。
(7) (6)の測定用シートをフィルターから剥離し、その粘着性表面における全面について、デジタルマイクロスコープを用いて合成写真を作成した。視野倍率が50倍になる様に調整した後、全面観察し、残渣が存在する位置を記録して印刷した。
(8) (7)の印刷物で残渣の位置を確認するとともに、走査型電子顕微鏡(SEM)/エネルギー分散形X線分析装置(EDS)を用いて、当該残渣について組成分析を実施した。SEM画像観察の結果、粒子状の残渣が存在することを確認した。
(9) (8)のエネルギー分散型X線分光法(EDX)に基づく残渣の組成分析結果から、エポキシ樹脂組成物またはエポキシ樹脂組成物を構成する原料成分中に含有される塩素含有粒子の個数を測定(カウント)した。 (Test method of chlorine-containing particles)
(1) As a sample, the raw material component which comprises an epoxy resin composition or an epoxy resin composition was prepared. The epoxy resin composition used what cooled and obtained the kneaded material which mixed and knead | mixed each raw material component.
(2) 50 g of the sample of (1) is put into a cleaned 1000 ml container made of polypropylene, 300 ml of acetone is added, the container is covered, and using a shaker, room temperature 25 ° C., 300 reciprocations / minute Shake (mix) for 50 minutes. The acetone to be used used what was filtered by the filter of 12 micrometers of mesh sizes.
(3) The above acetone-washed filter was placed in a funnel set (filtering device). The filter used was a nylon filter with an opening size of 75 μm, which was subjected to ultrasonic cleaning.
(4) The container shaken in (2) was allowed to stand, and then the solution in the container was poured from the top of the funnel of (3) and suction filtered through a filter.
(5) The funnel was removed and the residue on the filter was dried with suction.
(6) The adhesive surface of the measurement sheet was attached to the filter surface of (5), and the residue was collected on the adhesive surface of the measurement sheet.
(7) The measurement sheet of (6) was peeled off from the filter, and a composite photograph was created using a digital microscope for the entire surface of the adhesive surface. After adjusting the visual field magnification to be 50 times, the entire surface was observed, and the position where the residue was present was recorded and printed.
(8) The position of the residue was confirmed by the printed matter of (7), and composition analysis was performed on the residue using a scanning electron microscope (SEM) / energy dispersive X-ray analyzer (EDS). As a result of SEM image observation, it was confirmed that particulate residue was present.
(9) From the compositional analysis result of the residue based on energy dispersive X-ray spectroscopy (EDX) of (8), the number of chlorine-containing particles contained in the epoxy resin composition or the raw material component constituting the epoxy resin composition Was measured (counted).
得られたエポキシ樹脂組成物について、以下の評価を行った。評価結果を表2に示す。 <Evaluation>
The following evaluation was performed about the obtained epoxy resin composition. The evaluation results are shown in Table 2.
得られたエポキシ樹脂組成物に対しスパイラルフロー測定を行った。スパイラルフロー測定は、低圧トランスファー成形機(コータキ精機(株)製「KTS-15」)を用いて、EMMI-1-66に準じたスパイラルフロー測定用の金型に金型温度175℃、注入圧力6.9MPa、硬化時間120秒の条件でエポキシ樹脂組成物を注入し、流動長を測定することにより行った。結果を表2に示す。 (Spiral flow)
Spiral flow measurement was performed on the obtained epoxy resin composition. Spiral flow measurement is performed using a low-pressure transfer molding machine ("KTS-15" manufactured by Kotaki Seiki Co., Ltd.) in a mold for spiral flow measurement according to EMMI-1-66 at a mold temperature of 175 ° C, injection pressure The epoxy resin composition was injected under the conditions of 6.9 MPa and a curing time of 120 seconds, and the flow length was measured. The results are shown in Table 2.
175℃としたホットプレート上に、得られたエポキシ樹脂組成物からなる試料を置き、試料が溶融後、へらで練りながら硬化するまでの時間を測定した。単位は秒(sec)である。結果を表2に示す。 (Gel time)
The sample consisting of the obtained epoxy resin composition was placed on a hot plate at 175 ° C., and after melting the sample, the time until curing while kneading with a spatula was measured. The unit is seconds (sec). The results are shown in Table 2.
得られたエポキシ樹脂組成物を使用し、低圧トランスファー成形機(山城精機社製、「AV-600-50-TF」)を用いて、金型温度175℃、注入圧力10MPa、硬化時間180秒の条件で、9×29mmの短冊状の試験用銅リードフレーム上に3.6mmφ×3mmの密着強度試験片を1水準当たり10個成形した。続いて、自動ダイシェア測定装置(ノードソン・アドバンスド・テクノロジー社製、DAGE4000型)を用いて、室温にて試験片とフレームとのダイシェア強度を測定した。10個の試験片のダイシェア強度(MPa)の平均値を表2に示す。 (Metal adhesion)
Using the obtained epoxy resin composition, using a low pressure transfer molding machine ("AV-600-50-TF" manufactured by Yamashiro Seiki Co., Ltd.), the mold temperature is 175 ° C, the injection pressure is 10 MPa, and the curing time is 180 seconds. Under the conditions, 10 pieces of adhesion strength test pieces of 3.6 mmφ × 3 mm were formed per level on a 9 × 29 mm strip-like test copper lead frame. Subsequently, the die shear strength of the test piece and the frame was measured at room temperature using an automatic die shear measurement apparatus (DAGE 4000 type manufactured by Nordson Advanced Technology). The average value of die shear strength (MPa) of 10 test pieces is shown in Table 2.
Claims (11)
- エポキシ樹脂、硬化剤および無機充填材を含むエポキシ樹脂組成物であって、
有機物を含有する塩素含有粒子を含む、エポキシ樹脂組成物。 An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler,
An epoxy resin composition containing chlorine-containing particles containing an organic substance. - 請求項1に記載のエポキシ樹脂組成物であって、
エネルギー分散型X線分光法(EDX)に基づいて測定される前記塩素含有粒子中の塩素濃度が、0.01Atm%以上20Atm%以下である、エポキシ樹脂組成物。 The epoxy resin composition according to claim 1, wherein
The epoxy resin composition whose chlorine concentration in the said chlorine containing particle | grains measured based on energy dispersive X ray spectroscopy (EDX) is 0.01 Atm% or more and 20 Atm% or less. - 請求項1または2に記載のエポキシ樹脂組成物であって、
前記塩素含有粒子が、Al元素、Mg元素、Si元素、Fe元素、Zn元素、Ti元素、Ca元素、Na元素、K元素、S元素、炭酸化合物からなる群から選択される一種以上を含有する、エポキシ樹脂組成物。 The epoxy resin composition according to claim 1 or 2, wherein
The chlorine-containing particles contain one or more selected from the group consisting of Al element, Mg element, Si element, Fe element, Zn element, Ti element, Ca element, Na element, K element, S element, carbonic acid compound , Epoxy resin composition. - 請求項1から3のいずれか1項に記載のエポキシ樹脂組成物であって、
エネルギー分散型X線分光法(EDX)に基づいて測定される前記塩素含有粒子中の炭素濃度が、40Atm%以上99Atm%以下である、エポキシ樹脂組成物。 The epoxy resin composition according to any one of claims 1 to 3, wherein
The epoxy resin composition whose carbon concentration in the said chlorine containing particle | grains measured based on energy dispersive X ray spectroscopy (EDX) is 40 Atm%-99 Atm%. - 請求項1から4のいずれか1項に記載のエポキシ樹脂組成物であって、
エネルギー分散型X線分光法(EDX)に基づいて測定される前記塩素含有粒子中の酸素濃度が、1Atm%以上50Atm%以下である、エポキシ樹脂組成物。 It is the epoxy resin composition of any one of Claim 1 to 4, Comprising:
The epoxy resin composition whose oxygen concentration in the said chlorine containing particle | grains measured based on energy dispersive X ray spectroscopy (EDX) is 1 Atm% or more and 50 Atm% or less. - 請求項1から5のいずれか1項に記載のエポキシ樹脂組成物であって、
前記有機物が、炭酸塩、アミド化合物、およびケイ酸塩からなる群から選択される一種以上を含む、エポキシ樹脂組成物。 The epoxy resin composition according to any one of claims 1 to 5, wherein
The epoxy resin composition in which the said organic substance contains 1 or more types selected from the group which consists of carbonate, an amide compound, and a silicate. - 請求項1から6のいずれか1項に記載のエポキシ樹脂組成物であって、
前記塩素含有粒子は、当該エポキシ樹脂組成物をアセトンに混合して溶液を得、得られた前記溶液を目開きサイズが75μmのフィルターで濾過し、前記フィルター上の残渣中に含まれるものである、エポキシ樹脂組成物。 The epoxy resin composition according to any one of claims 1 to 6, wherein
The chlorine-containing particles are obtained by mixing the epoxy resin composition with acetone to obtain a solution, filtering the obtained solution through a filter with an opening size of 75 μm, and being contained in the residue on the filter , Epoxy resin composition. - 請求項1から7のいずれか1項に記載のエポキシ樹脂組成物であって、
当該エポキシ樹脂組成物を用いて50gのサンプルを得て、前記50gのサンプル中における前記塩素含有粒子の個数は、1個以上10個以下である、エポキシ樹脂組成物。 It is the epoxy resin composition of any one of Claim 1 to 7, Comprising:
The epoxy resin composition which obtains a 50-g sample using the said epoxy resin composition, and the number of objects of the said chlorine-containing particle in the said 50-g sample is one or more and 10 or less. - 請求項1から8のいずれか1項に記載のエポキシ樹脂組成物であって、
電子部品を封止するための封止用樹脂組成物に用いる、エポキシ樹脂組成物。 The epoxy resin composition according to any one of claims 1 to 8, wherein
The epoxy resin composition used for the resin composition for sealing for sealing an electronic component. - 請求項1から9のいずれか1項に記載のエポキシ樹脂組成物であって、
車載用電子制御ユニットを封止するための封止用樹脂組成物に用いる、エポキシ樹脂組成物。 The epoxy resin composition according to any one of claims 1 to 9, wherein
The epoxy resin composition used for the resin composition for sealing for sealing a vehicle-mounted electronic control unit. - 請求項1から10のいずれか1項に記載のエポキシ樹脂組成物の硬化物を備える電子装置。 The electronic device provided with the hardened | cured material of the epoxy resin composition of any one of Claims 1-10.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207018977A KR102244206B1 (en) | 2017-12-06 | 2018-11-21 | Epoxy resin composition and electronic device |
JP2019558122A JP6677360B2 (en) | 2017-12-06 | 2018-11-21 | Epoxy resin composition and electronic device |
CN201880079022.8A CN111433284B (en) | 2017-12-06 | 2018-11-21 | Epoxy resin composition and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017234008 | 2017-12-06 | ||
JP2017-234008 | 2017-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019111707A1 true WO2019111707A1 (en) | 2019-06-13 |
Family
ID=66750501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/042951 WO2019111707A1 (en) | 2017-12-06 | 2018-11-21 | Epoxy resin composition and electronic device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6677360B2 (en) |
KR (1) | KR102244206B1 (en) |
CN (1) | CN111433284B (en) |
TW (1) | TW201936773A (en) |
WO (1) | WO2019111707A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019099726A (en) * | 2017-12-06 | 2019-06-24 | 住友ベークライト株式会社 | Epoxy resin and electronic apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202402865A (en) * | 2022-06-14 | 2024-01-16 | 南韓商新亚T&C公司 | Tetramethylbiphenol epoxy resin and method for preparing the same, tetramethylbiphenol epoxy resin composition, and cured product |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009203294A (en) * | 2008-02-26 | 2009-09-10 | Panasonic Electric Works Co Ltd | Sealing epoxy resin composition and semiconductor device |
JP2010031119A (en) * | 2008-07-28 | 2010-02-12 | Panasonic Electric Works Co Ltd | Semiconductor-sealing epoxy resin composition and semiconductor device using it |
JP2010090216A (en) * | 2008-10-06 | 2010-04-22 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing, and electronic part device |
JP2016113566A (en) * | 2014-12-16 | 2016-06-23 | 住友ベークライト株式会社 | Resin composition for encapsulation, semiconductor device, and structure |
US20160237303A1 (en) * | 2015-02-16 | 2016-08-18 | Samsung Electro-Mechanics Co., Ltd. | Resin composition for printed circuit board, insulating film, and printed circuit board using the same |
WO2016151733A1 (en) * | 2015-03-23 | 2016-09-29 | 住友ベークライト株式会社 | Resin composition for encapsulation, semiconductor device, and process for producing semiconductor device |
JP2017084995A (en) * | 2015-10-29 | 2017-05-18 | 住友ベークライト株式会社 | Resin composition for forming high voltage protective member |
JP2017171925A (en) * | 2017-04-20 | 2017-09-28 | 味の素株式会社 | Resin composition |
JP2017179185A (en) * | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | Epoxy resin composition for sealing semiconductor, and semiconductor device |
JP2017179346A (en) * | 2016-03-28 | 2017-10-05 | 味の素株式会社 | Resin composition |
JP2017197620A (en) * | 2016-04-26 | 2017-11-02 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4803417B2 (en) | 2004-09-16 | 2011-10-26 | Dic株式会社 | Epoxy resin, epoxy resin composition, and alkali development type photosensitive resin composition |
JP5213017B2 (en) | 2007-09-28 | 2013-06-19 | 株式会社伏見製薬所 | Epoxy compound composition |
CN108192293B (en) * | 2009-03-31 | 2021-04-09 | 昭和电工材料株式会社 | Liquid resin composition for electronic component and electronic component device |
JP2012092247A (en) | 2010-10-28 | 2012-05-17 | Showa Denko Kk | Liquid-form curable composition |
JP6090784B2 (en) | 2013-04-19 | 2017-03-08 | 日本化薬株式会社 | Epoxy resin varnish, epoxy resin composition, curable sheet, prepreg, laminate, printed wiring board, and semiconductor device |
SG11201704514XA (en) * | 2014-12-04 | 2017-07-28 | Mitsubishi Chem Corp | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material |
-
2018
- 2018-11-21 KR KR1020207018977A patent/KR102244206B1/en active IP Right Grant
- 2018-11-21 JP JP2019558122A patent/JP6677360B2/en active Active
- 2018-11-21 WO PCT/JP2018/042951 patent/WO2019111707A1/en active Application Filing
- 2018-11-21 CN CN201880079022.8A patent/CN111433284B/en active Active
- 2018-11-27 TW TW107142143A patent/TW201936773A/en unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009203294A (en) * | 2008-02-26 | 2009-09-10 | Panasonic Electric Works Co Ltd | Sealing epoxy resin composition and semiconductor device |
JP2010031119A (en) * | 2008-07-28 | 2010-02-12 | Panasonic Electric Works Co Ltd | Semiconductor-sealing epoxy resin composition and semiconductor device using it |
JP2010090216A (en) * | 2008-10-06 | 2010-04-22 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing, and electronic part device |
JP2016113566A (en) * | 2014-12-16 | 2016-06-23 | 住友ベークライト株式会社 | Resin composition for encapsulation, semiconductor device, and structure |
US20160237303A1 (en) * | 2015-02-16 | 2016-08-18 | Samsung Electro-Mechanics Co., Ltd. | Resin composition for printed circuit board, insulating film, and printed circuit board using the same |
WO2016151733A1 (en) * | 2015-03-23 | 2016-09-29 | 住友ベークライト株式会社 | Resin composition for encapsulation, semiconductor device, and process for producing semiconductor device |
JP2017084995A (en) * | 2015-10-29 | 2017-05-18 | 住友ベークライト株式会社 | Resin composition for forming high voltage protective member |
JP2017179346A (en) * | 2016-03-28 | 2017-10-05 | 味の素株式会社 | Resin composition |
JP2017179185A (en) * | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | Epoxy resin composition for sealing semiconductor, and semiconductor device |
JP2017197620A (en) * | 2016-04-26 | 2017-11-02 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device |
JP2017171925A (en) * | 2017-04-20 | 2017-09-28 | 味の素株式会社 | Resin composition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019099726A (en) * | 2017-12-06 | 2019-06-24 | 住友ベークライト株式会社 | Epoxy resin and electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW201936773A (en) | 2019-09-16 |
CN111433284A (en) | 2020-07-17 |
KR20200084371A (en) | 2020-07-10 |
JP6677360B2 (en) | 2020-04-08 |
CN111433284B (en) | 2021-01-05 |
KR102244206B1 (en) | 2021-04-26 |
JPWO2019111707A1 (en) | 2020-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6753378B2 (en) | Epoxy resin molding material for sealing and electronic component equipment | |
US8232355B2 (en) | Liquid resin composition for electronic components and electronic component device | |
EP3536745B1 (en) | Epoxy resin composition and structure | |
JP7155929B2 (en) | Mold underfill materials and electronic devices | |
JP6980986B2 (en) | Resin compositions for semiconductor encapsulation and semiconductor devices | |
JP6677360B2 (en) | Epoxy resin composition and electronic device | |
JP5579764B2 (en) | Liquid epoxy resin composition for underfill and semiconductor device sealed with the composition | |
JP2022003130A (en) | Sealing resin composition, semiconductor device, and method for manufacturing semiconductor device | |
JP6950299B2 (en) | Resin composition for encapsulant and electronic device using it | |
JP5101860B2 (en) | Epoxy resin composition and semiconductor device | |
JP4967353B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
JP6950501B2 (en) | Inspection method and manufacturing method of epoxy resin composition | |
JP7139598B2 (en) | Method for producing encapsulating resin composition and method for producing electronic device | |
JP5167587B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
JP2019099726A (en) | Epoxy resin and electronic apparatus | |
JP3649524B2 (en) | Epoxy resin composition and semiconductor device | |
JP3649540B2 (en) | Epoxy resin composition | |
JP2008106182A (en) | Epoxy resin composition and adhesive | |
JPWO2019131669A1 (en) | Encapsulation composition and semiconductor device | |
JP2021038311A (en) | Resin composition for semiconductor encapsulation and semiconductor device | |
JP6838345B2 (en) | Epoxy resin composition for encapsulation, semiconductor device and its manufacturing method | |
JP2023033936A (en) | Sealing resin composition and electronic apparatus | |
JP2021138864A (en) | Sealing resin composition and electronic device | |
JP2021147453A (en) | Resin composition for semiconductor sealing, and semiconductor device | |
JP2021155731A (en) | Semiconductor encapsulating resin composition and semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18886766 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019558122 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20207018977 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18886766 Country of ref document: EP Kind code of ref document: A1 |