JPWO2019131669A1 - Encapsulation composition and semiconductor device - Google Patents
Encapsulation composition and semiconductor device Download PDFInfo
- Publication number
- JPWO2019131669A1 JPWO2019131669A1 JP2019562046A JP2019562046A JPWO2019131669A1 JP WO2019131669 A1 JPWO2019131669 A1 JP WO2019131669A1 JP 2019562046 A JP2019562046 A JP 2019562046A JP 2019562046 A JP2019562046 A JP 2019562046A JP WO2019131669 A1 JPWO2019131669 A1 JP WO2019131669A1
- Authority
- JP
- Japan
- Prior art keywords
- inorganic filler
- particle size
- sealing composition
- mass
- alumina
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 238000005538 encapsulation Methods 0.000 title description 3
- 239000002245 particle Substances 0.000 claims abstract description 113
- 239000011256 inorganic filler Substances 0.000 claims abstract description 98
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 98
- 238000007789 sealing Methods 0.000 claims abstract description 63
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 42
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- 239000010954 inorganic particle Substances 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 37
- -1 aldehyde compound Chemical class 0.000 description 19
- 239000000377 silicon dioxide Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 15
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
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- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
封止組成物は、エポキシ樹脂と、硬化剤と、無機充填材とを含有し、前記無機充填材の粒度分布が、少なくとも3つのピークを有し、前記無機充填材が、粒子径が1μm以下のアルミナを含む。The sealing composition contains an epoxy resin, a curing agent, and an inorganic filler, and the particle size distribution of the inorganic filler has at least three peaks, and the inorganic filler has a particle size of 1 μm or less. Contains alumina.
Description
本発明は、封止組成物及び半導体装置に関する。 The present invention relates to a sealing composition and a semiconductor device.
近年、小型化及び高集積化に伴い、半導体パッケージ内部の発熱が懸念されている。発熱により、半導体パッケージを有する電気部品又は電子部品の性能低下が生じる恐れがあるため、半導体パッケージに使用される部材には、高い熱伝導性が求められている。そのため、半導体パッケージの封止材を高熱伝導化することが求められている。
封止材を高熱伝導化する手法の一つとして、封止材に含まれる無機充填材に高熱伝導性フィラーであるアルミナを用いる方法が挙げられる(例えば、特許文献1参照)。In recent years, there is a concern about heat generation inside a semiconductor package due to miniaturization and high integration. High thermal conductivity is required for the members used in the semiconductor package because the heat generation may cause the performance of the electric component or the electronic component having the semiconductor package to deteriorate. Therefore, it is required to make the encapsulant of the semiconductor package highly thermally conductive.
As one of the methods for increasing the thermal conductivity of the encapsulant, there is a method of using alumina which is a high thermal conductive filler for the inorganic filler contained in the encapsulant (see, for example, Patent Document 1).
しかし、特許文献1に記載の方法では、封止材の流動性が悪化することがある。例えば、半導体素子と基板とをワイヤを介して接続するワイヤボンディング構造と呼ばれる方法を採用した半導体パッケージは、半導体素子と、基板と、これらを電気的に接続しているワイヤとを樹脂組成物で封止することにより形成される。その際、封止材の流動によりワイヤに圧力がかかり、ワイヤの位置ずれ(ワイヤ流れ)が生じたり、半導体素子の保護が充分にされないことがある。
このように、封止材の流動性と高熱伝導性とを両立することは、困難な場合がある。However, the method described in Patent Document 1 may deteriorate the fluidity of the encapsulant. For example, in a semiconductor package that employs a method called a wire bonding structure in which a semiconductor element and a substrate are connected via wires, the semiconductor element, the substrate, and the wire that electrically connects them are made of a resin composition. It is formed by sealing. At that time, pressure is applied to the wire due to the flow of the sealing material, which may cause the wire to be displaced (wire flow) or the semiconductor element may not be sufficiently protected.
As described above, it may be difficult to achieve both the fluidity of the encapsulant and the high thermal conductivity.
本発明の一形態は、上記従来の事情に鑑みてなされたものであり、流動性に優れ高い熱伝導性を有する封止組成物及びそれを用いた半導体装置を提供することを目的とする。 One embodiment of the present invention has been made in view of the above-mentioned conventional circumstances, and an object of the present invention is to provide a sealing composition having excellent fluidity and high thermal conductivity, and a semiconductor device using the same.
前記課題を達成するための具体的手段は以下の通りである。
<1> エポキシ樹脂と、硬化剤と、無機充填材とを含有し、
前記無機充填材の粒度分布が、少なくとも3つのピークを有し、
前記無機充填材が、粒子径が1μm以下のアルミナを含む封止組成物。
<2> 前記無機充填材の粒度分布が、0.3μm〜0.7μmの範囲、7μm〜20μmの範囲及び30μm〜70μmの範囲にピークを有する<1>に記載の封止組成物。
<3> 前記無機充填材に含まれる粒子径が1μm以下の無機粒子に占めるアルミナの割合が、1体積%〜40体積%である<1>又は<2>に記載の封止組成物。
<4> 前記無機充填材の平均円形度が、0.80以上である<1>〜<3>のいずれか1項に記載の封止組成物。
<5> 半導体素子と、前記半導体素子を封止してなる<1>〜<4>のいずれか1項に記載の封止組成物の硬化物と、を含む半導体装置。Specific means for achieving the above-mentioned problems are as follows.
<1> Contains an epoxy resin, a curing agent, and an inorganic filler.
The particle size distribution of the inorganic filler has at least three peaks.
A sealing composition in which the inorganic filler contains alumina having a particle size of 1 μm or less.
<2> The sealing composition according to <1>, wherein the particle size distribution of the inorganic filler has peaks in the range of 0.3 μm to 0.7 μm, the range of 7 μm to 20 μm, and the range of 30 μm to 70 μm.
<3> The sealing composition according to <1> or <2>, wherein the proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler is 1% by volume to 40% by volume.
<4> The sealing composition according to any one of <1> to <3>, wherein the average circularity of the inorganic filler is 0.80 or more.
<5> A semiconductor device including a semiconductor element and a cured product of the sealing composition according to any one of <1> to <4>, which is obtained by sealing the semiconductor element.
本発明の一形態によれば、流動性に優れ高い熱伝導性を有する封止組成物及びそれを用いた半導体装置を提供することができる。 According to one embodiment of the present invention, it is possible to provide a sealing composition having excellent fluidity and high thermal conductivity, and a semiconductor device using the same.
以下、本発明の封止組成物及び半導体装置を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素(要素ステップ等も含む)は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。
本開示において「〜」を用いて示された数値範囲には、「〜」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示においては、各成分に該当する粒子を複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。Hereinafter, a mode for carrying out the sealing composition and the semiconductor device of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.
The numerical range indicated by using "~" in the present disclosure includes the numerical values before and after "~" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content rate or content of each component is the total content rate or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, a plurality of types of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
<封止組成物>
本開示の封止組成物は、エポキシ樹脂と、硬化剤と、無機充填材とを含有し、前記無機充填材の粒度分布が、少なくとも3つのピークを有し、前記無機充填材が、粒子径が1μm以下のアルミナを含む。
本開示の封止組成物は、流動性に優れ高い熱伝導性を有する。その理由は明確ではないが、以下のように推察される。
封止組成物に含まれる無機充填材は、少なくとも3つのピークを有する粒度分布を示す。つまり、無機充填材は、少なくとも、大粒子径の無機粒子と中粒子径の無機粒子と小粒子径の無機粒子とを含んで構成される。無機充填材が大粒子径の無機粒子と中粒子径の無機粒子と小粒子径の無機粒子とを含むため、本開示の封止組成物は流動性に優れると考えられる。
また、無機充填材は、粒子径が1μm以下のアルミナを含むところ、アルミナは上述のように、高い熱伝導性を示す。また、粒子径が1μm以下のアルミナは、封止組成物に含まれる無機充填材としては、小粒子径の無機粒子に該当する。小粒子径の無機粒子としてアルミナを含むことで、大粒子径の無機粒子及び中粒子径の無機粒子の間に小粒子径の無機粒子であるアルミナが介在しやすくなる。高い熱伝導性を示すアルミナが大粒子径の無機粒子及び中粒子径の無機粒子の間に介在することで、大粒子径の無機粒子及び中粒子径の無機粒子の間の熱伝導を促進することができる。その結果として、本開示の封止組成物は高い熱伝導性を有すると推察される。<Encapsulation composition>
The sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, and the particle size distribution of the inorganic filler has at least three peaks, and the inorganic filler has a particle diameter. Contains alumina of 1 μm or less.
The sealing composition of the present disclosure has excellent fluidity and high thermal conductivity. The reason is not clear, but it can be inferred as follows.
The inorganic filler contained in the encapsulation composition exhibits a particle size distribution having at least three peaks. That is, the inorganic filler is composed of at least inorganic particles having a large particle diameter, inorganic particles having a medium particle diameter, and inorganic particles having a small particle diameter. Since the inorganic filler contains inorganic particles having a large particle diameter, inorganic particles having a medium particle diameter, and inorganic particles having a small particle diameter, the sealing composition of the present disclosure is considered to have excellent fluidity.
Further, where the inorganic filler contains alumina having a particle size of 1 μm or less, the alumina exhibits high thermal conductivity as described above. Alumina having a particle size of 1 μm or less corresponds to inorganic particles having a small particle size as the inorganic filler contained in the sealing composition. By containing alumina as the inorganic particles having a small particle size, alumina, which is an inorganic particle having a small particle size, is likely to be interposed between the inorganic particles having a large particle size and the inorganic particles having a medium particle size. Alumina showing high thermal conductivity intervenes between large particle size inorganic particles and medium particle size inorganic particles to promote heat conduction between large particle size inorganic particles and medium particle size inorganic particles. be able to. As a result, it is presumed that the sealing composition of the present disclosure has high thermal conductivity.
以下、封止組成物を構成する各成分について説明する。本開示の封止組成物は、エポキシ樹脂と、硬化剤と、無機充填材とを含有し、必要に応じてその他の成分を含有してもよい。 Hereinafter, each component constituting the sealing composition will be described. The sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, and may contain other components if necessary.
−エポキシ樹脂−
封止組成物は、エポキシ樹脂を含有する。エポキシ樹脂の種類は特に限定されず、公知のエポキシ樹脂を使用することができる。
具体的には、例えば、フェノール化合物(例えば、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールA及びビスフェノールF)並びにナフトール化合物(例えば、α−ナフトール、β−ナフトール及びジヒドロキシナフタレン)からなる群より選択される少なくとも1種と、アルデヒド化合物(例えば、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド及びサリチルアルデヒド)と、を酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したもの(例えば、フェノールノボラック型エポキシ樹脂及びオルソクレゾールノボラック型エポキシ樹脂);ビスフェノール(例えば、ビスフェノールA、ビスフェノールAD、ビスフェノールF及びビスフェノールS)及びビフェノール(例えば、アルキル置換及び非置換のビフェノール)からなる群より選択される少なくとも1種のジグリシジルエーテル;フェノール・アラルキル樹脂のエポキシ化物;フェノール化合物とジシクロペンタジエン及びテルペン化合物からなる群より選択される少なくとも1種との付加物又は重付加物のエポキシ化物;多塩基酸(例えば、フタル酸及びダイマー酸)とエピクロルヒドリンの反応により得られるグリシジルエステル型エポキシ樹脂;ポリアミン(例えば、ジアミノジフェニルメタン及びイソシアヌル酸)とエピクロルヒドリンとの反応により得られるグリシジルアミン型エポキシ樹脂;オレフィン結合を過酸(例えば、過酢酸)で酸化して得られる線状脂肪族エポキシ樹脂;並びに脂環族エポキシ樹脂が挙げられる。エポキシ樹脂は、1種類を単独で使用しても、2種類以上を併用してもよい。-Epoxy resin-
The sealing composition contains an epoxy resin. The type of epoxy resin is not particularly limited, and known epoxy resins can be used.
Specifically, for example, it is selected from the group consisting of phenol compounds (eg, phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F) and naphthol compounds (eg, α-naphthol, β-naphthol and dihydroxynaphthalene). Epoxy of novolak resin obtained by condensing or co-condensing at least one of the above and an aldehyde compound (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst (for example, phenol). Novolak type epoxy resin and orthocresol novolak type epoxy resin); at least selected from the group consisting of bisphenol (eg, bisphenol A, bisphenol AD, bisphenol F and bisphenol S) and biphenol (eg, alkyl-substituted and unsubstituted biphenol). One diglycidyl ether; an epoxie of a phenol-aralkyl resin; an epoxidate of an adduct or a heavy adduct of a phenol compound and at least one selected from the group consisting of dicyclopentadiene and terpen compounds; polybasic acid ( For example, a glycidyl ester type epoxy resin obtained by the reaction of phthalic acid and dimer acid) and epichlorohydrin; a glycidylamine type epoxy resin obtained by the reaction of polyamine (for example, diaminodiphenylmethane and isocyanuric acid) and epichlorohydrin; Examples include linear aliphatic epoxy resins obtained by oxidation with (for example, peracetic acid); and alicyclic epoxy resins. One type of epoxy resin may be used alone, or two or more types may be used in combination.
集積回路(Integrated Circuit、IC)等の素子上のアルミニウム配線又は銅配線の腐食防止の観点から、エポキシ樹脂の純度は高い方が好ましく、加水分解性塩素量は少ない方が好ましい。封止組成物の耐湿性の向上の観点からは、加水分解性塩素量は質量基準で500ppm以下であることが好ましい。 From the viewpoint of preventing corrosion of aluminum wiring or copper wiring on an element such as an integrated circuit (IC), the purity of the epoxy resin is preferably high, and the amount of hydrolyzable chlorine is preferably small. From the viewpoint of improving the moisture resistance of the sealing composition, the amount of hydrolyzable chlorine is preferably 500 ppm or less on a mass basis.
ここで、加水分解性塩素量は、試料のエポキシ樹脂1gをジオキサン30mLに溶解し、1N−KOHメタノール溶液5mLを添加して30分間リフラックスした後、電位差滴定により求めた値である。 Here, the amount of hydrolyzable chlorine is a value obtained by dissolving 1 g of the epoxy resin of the sample in 30 mL of dioxane, adding 5 mL of a 1N-KOH methanol solution, refluxing for 30 minutes, and then performing potentiometric titration.
封止組成物に占めるエポキシ樹脂の含有率は、1.5質量%〜20質量%であることが好ましく、2.0質量%〜15質量%であることがより好ましく、3.0質量%〜10質量%であることがさらに好ましい。
無機充填材を除く封止組成物に占めるエポキシ樹脂の含有率は、30質量%〜65質量%であることが好ましく、35質量%〜60質量%であることがより好ましく、40質量%〜55質量%であることがさらに好ましい。The content of the epoxy resin in the sealing composition is preferably 1.5% by mass to 20% by mass, more preferably 2.0% by mass to 15% by mass, and 3.0% by mass to 30% by mass. It is more preferably 10% by mass.
The content of the epoxy resin in the sealing composition excluding the inorganic filler is preferably 30% by mass to 65% by mass, more preferably 35% by mass to 60% by mass, and 40% by mass to 55% by mass. It is more preferably by mass%.
−硬化剤−
封止組成物は、硬化剤を含有する。硬化剤の種類は特に限定されず、公知の硬化剤を使用することができる。
具体的には、例えば、フェノール化合物(例えば、フェノール、クレゾール、レゾルシン、カテコール、ビスフェノールA及びビスフェノールF)並びにナフトール化合物(例えば、α−ナフトール、β−ナフトール及びジヒドロキシナフタレン)からなる群より選択される少なくとも1種と、アルデヒド化合物(例えば、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド及びサリチルアルデヒド)とを、酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂;フェノール・アラルキル樹脂;ビフェニル・アラルキル樹脂;並びにナフトール・アラルキル樹脂;が挙げられる。硬化剤は1種類を単独で使用しても、2種類以上を併用してもよい。中でも、硬化剤としては、耐リフロー性向上の観点から、フェノール・アラルキル樹脂が好ましい。硬化剤は、1種類を単独で使用しても、2種類以上を併用してもよい。-Hardener-
The sealing composition contains a curing agent. The type of curing agent is not particularly limited, and known curing agents can be used.
Specifically, it is selected from the group consisting of, for example, phenolic compounds (eg, phenol, cresol, resorcin, catechol, bisphenol A and bisphenol F) and naphthol compounds (eg, α-naphthol, β-naphthol and dihydroxynaphthalene). A novolak resin obtained by condensing or cocondensing at least one of an aldehyde compound (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst; phenol-aralkyl resin; biphenyl-aralkyl resin; In addition, naphthol-aralkyl resin; can be mentioned. One type of curing agent may be used alone, or two or more types may be used in combination. Among them, as the curing agent, a phenol / aralkyl resin is preferable from the viewpoint of improving reflow resistance. One type of curing agent may be used alone, or two or more types may be used in combination.
硬化剤の官能基(例えば、ノボラック樹脂の場合にはフェノール性水酸基)の当量がエポキシ樹脂のエポキシ基1当量に対して0.5当量〜1.5当量になるように、硬化剤が配合されることが好ましく、特に、0.7当量〜1.2当量になるように硬化剤が配合されることが好ましい。 The curing agent is blended so that the equivalent of the functional group of the curing agent (for example, phenolic hydroxyl group in the case of novolak resin) is 0.5 equivalent to 1.5 equivalent with respect to 1 equivalent of the epoxy group of the epoxy resin. It is preferable that the curing agent is blended so as to have an amount of 0.7 equivalent to 1.2 equivalent.
−無機充填材−
封止組成物は、無機充填材を含む。無機充填材を含むことで、封止組成物の吸湿性が低減し、硬化状態での強度が向上する傾向にある。-Inorganic filler-
The sealing composition comprises an inorganic filler. By including the inorganic filler, the hygroscopicity of the sealing composition tends to be reduced, and the strength in the cured state tends to be improved.
無機充填材は、1種類を単独で使用しても、2種類以上を併用してもよい。
無機充填材を2種類以上併用する場合としては、例えば、成分、平均粒子径、形状等が異なる無機充填材を2種類以上用いる場合が挙げられる。
無機充填材の形状は特に制限されず、例えば、粉状、球状、繊維状等が挙げられる。封止組成物の成形時の流動性及び金型摩耗性の点からは、球状であることが好ましい。As the inorganic filler, one type may be used alone, or two or more types may be used in combination.
Examples of the case where two or more kinds of inorganic fillers are used in combination include the case where two or more kinds of inorganic fillers having different components, average particle diameters, shapes and the like are used.
The shape of the inorganic filler is not particularly limited, and examples thereof include powder, spherical, and fibrous. From the viewpoint of fluidity during molding and mold wear resistance of the sealing composition, it is preferably spherical.
無機充填材の平均円形度は、0.80以上であることが好ましく、0.85以上であることがより好ましく、0.90以上であることがさらに好ましく、0.93以上であることが特に好ましい。また、無機充填材の平均円形度は、1.0以下であってもよい。
無機充填材の円形度とは、無機充填材の投影面積と同じ面積を持つ円の直径である円相当径から算出される円としての周囲長を、無機充填材の投影像から測定される周囲長(輪郭線の長さ)で除して得られる数値であり、下記式で求められる。尚、円形度は真円では1.00となる。
円形度=(相当円の周囲長)/(粒子断面像の周囲長)
具体的に平均円形度は、走査型電子顕微鏡で倍率1000倍に拡大した画像を観察し、任意に10個の無機充填材を選択し、上記方法にて個々の無機充填材の円形度を測定し、その算術平均値として算出される値である。なお、円形度、相当円の周囲長及び粒子の投影像の周囲長は、市販されている画像解析ソフトによって求めることが可能である。
無機充填材として2種類以上が併用される場合、無機充填材の平均円形度は、2種類以上の無機充填材の混合物としての値をいう。The average circularity of the inorganic filler is preferably 0.80 or more, more preferably 0.85 or more, further preferably 0.90 or more, and particularly preferably 0.93 or more. preferable. Further, the average circularity of the inorganic filler may be 1.0 or less.
The circularity of the inorganic filler is the circumference measured from the projected image of the inorganic filler as the circumference as a circle calculated from the diameter equivalent to a circle, which is the diameter of a circle having the same area as the projected area of the inorganic filler. It is a numerical value obtained by dividing by the length (length of the contour line), and is calculated by the following formula. The circularity is 1.00 in a perfect circle.
Circularity = (peripheral length of equivalent circle) / (peripheral length of particle cross-sectional image)
Specifically, for the average circularity, an image magnified at a magnification of 1000 times is observed with a scanning electron microscope, 10 inorganic fillers are arbitrarily selected, and the circularity of each inorganic filler is measured by the above method. However, it is a value calculated as the arithmetic mean value. The circularity, the peripheral length of the equivalent circle, and the peripheral length of the projected image of the particles can be obtained by commercially available image analysis software.
When two or more kinds of inorganic fillers are used in combination, the average circularity of the inorganic fillers means a value as a mixture of two or more kinds of inorganic fillers.
無機充填材としては、粒度分布が、少なくとも3つのピークを有し、粒子径が1μm以下のアルミナを含むものであれば、材質、粒子径等について特に限定されるものではない。
無機充填材としては、球状シリカ、結晶シリカ等のシリカ、アルミナ、ジルコン、酸化マグネシウム、珪酸カルシウム、炭酸カルシウム、チタン酸カリウム、炭化珪素、窒化珪素、窒化ホウ素、窒化アルミニウム、ベリリア、ジルコニアなどが挙げられる。さらに、難燃効果のある無機充填材としては水酸化アルミニウム、硼酸亜鉛等が挙げられる。これらの中でも、高熱伝導性の観点からはアルミナが好ましい。
無機充填材に占めるアルミナの割合は、60質量%〜95質量%であることが好ましく、60質量%〜92質量%であることがより好ましく、60質量%〜90質量%であることがさらに好ましい。
無機充填材としては、アルミナとシリカとを併用してもよい。無機充填材としてアルミナとシリカとを併用する場合、無機充填材に占めるアルミナの割合が80質量%〜95質量%であり、シリカの割合が5質量%〜20質量%であることが好ましく、アルミナの割合が82質量%〜92質量%であり、シリカの割合が8質量%〜18質量%であることがより好ましく、アルミナの割合が85質量%〜90質量%であり、シリカの割合が10質量%〜15質量%であることがさらに好ましい。The inorganic filler is not particularly limited in terms of material, particle size and the like as long as the particle size distribution has at least three peaks and contains alumina having a particle size of 1 μm or less.
Examples of the inorganic filler include spherical silica, silica such as crystalline silica, alumina, zircon, magnesium oxide, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, boron nitride, aluminum nitride, beryllium, and zirconia. Be done. Further, examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide and zinc borate. Among these, alumina is preferable from the viewpoint of high thermal conductivity.
The proportion of alumina in the inorganic filler is preferably 60% by mass to 95% by mass, more preferably 60% by mass to 92% by mass, and further preferably 60% by mass to 90% by mass. ..
As the inorganic filler, alumina and silica may be used in combination. When alumina and silica are used in combination as the inorganic filler, the proportion of alumina in the inorganic filler is preferably 80% by mass to 95% by mass, and the proportion of silica is preferably 5% by mass to 20% by mass, preferably alumina. Is more preferably 82% by mass to 92% by mass, silica is more preferably 8% by mass to 18% by mass, alumina is 85% by mass to 90% by mass, and silica is 10% by mass. It is more preferably mass% to 15% by mass.
無機充填材の粒度分布は、少なくとも3つのピークを有するものであり、3つのピークを有することが好ましい。無機充填材の粒度分布におけるピークの位置は特に限定されるものではなく、例えば、0.3μm〜0.7μmの範囲、7μm〜20μmの範囲及び30μm〜70μmの範囲にピークを有することが好ましく、0.3μm〜0.6μmの範囲、7μm〜15μmの範囲及び40μm〜70μmの範囲にピークを有することがより好ましい。 The particle size distribution of the inorganic filler has at least three peaks, and preferably has three peaks. The position of the peak in the particle size distribution of the inorganic filler is not particularly limited, and for example, it is preferable to have a peak in the range of 0.3 μm to 0.7 μm, the range of 7 μm to 20 μm, and the range of 30 μm to 70 μm. It is more preferable to have peaks in the range of 0.3 μm to 0.6 μm, the range of 7 μm to 15 μm, and the range of 40 μm to 70 μm.
無機充填材の粒度分布は、下記方法で求めることができる。
溶媒(純水)に、測定対象の無機充填材を0.02質量%〜0.08質量%の範囲内で添加し、110Wのバス式超音波洗浄機で1分〜10分振動し、無機充填材を分散する。分散液の約40mL程度を測定セルに注入して25℃で測定する。測定装置は、レーザー回折/散乱式粒子径分布測定装置(例えば、株式会社堀場製作所、LA920(商品名))にて、体積基準の粒度分布を測定する。なお、屈折率はアルミナの屈折率を用いる。無機充填材がアルミナとアルミナ以外の無機充填材の混合物である場合においても、屈折率はアルミナの屈折率を用いるものとする。The particle size distribution of the inorganic filler can be obtained by the following method.
The inorganic filler to be measured is added to the solvent (pure water) in the range of 0.02% by mass to 0.08% by mass, and vibrated with a 110 W bath type ultrasonic cleaner for 1 to 10 minutes to be inorganic. Disperse the filler. About 40 mL of the dispersion is injected into the measuring cell and measured at 25 ° C. The measuring device measures the volume-based particle size distribution with a laser diffraction / scattering type particle size distribution measuring device (for example, Horiba Seisakusho Co., Ltd., LA920 (trade name)). The refractive index of alumina is used as the refractive index. Even when the inorganic filler is a mixture of alumina and an inorganic filler other than alumina, the refractive index of alumina shall be used as the refractive index.
無機充填材に含まれる粒子径が1μm以下の無機粒子に占めるアルミナの割合は、1体積%〜40体積%であることが好ましく、10体積%〜35体積%であることがより好ましく、15体積%〜30体積%であることがさらに好ましい。
無機充填材に含まれる粒子径が1μm以下の無機粒子に占めるアルミナの割合は、以下の方法により測定することができる。
走査型電子顕微鏡により粒子径が1μm以下と確認された各無機粒子について、エネルギー分散型X線分析(Energy dispersive X−ray spectrometry)により構成元素を同定し、無機粒子の材質を確定する。1μm以下の無機粒子50個に占めるアルミナの体積基準の割合を求めることで、無機充填材に含まれる粒子径が1μm以下の無機粒子に占めるアルミナの割合を求めることができる。各無機粒子の粒子径は、投影面積と同じ面積を持つ円の直径である円相当径とする。The ratio of alumina to the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler is preferably 1% by volume to 40% by volume, more preferably 10% by volume to 35% by volume, and 15 volumes. It is more preferably% to 30% by volume.
The ratio of alumina to the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler can be measured by the following method.
For each inorganic particle whose particle size is confirmed to be 1 μm or less by a scanning electron microscope, constituent elements are identified by energy dispersive X-ray spectrum, and the material of the inorganic particle is determined. By determining the volume-based ratio of alumina to 50 inorganic particles of 1 μm or less, the ratio of alumina to the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler can be determined. The particle diameter of each inorganic particle is a circle-equivalent diameter, which is the diameter of a circle having the same area as the projected area.
無機充填材に含まれる粒子径が10μm以上の無機粒子に占めるアルミナの割合は、20体積%〜60体積%であることが好ましく、25体積%〜55体積%であることがより好ましく、30体積%〜50体積%であることがさらに好ましい。
無機充填材に含まれる粒子径が10μm以上の無機粒子に占めるアルミナの割合は、無機充填材に含まれる粒子径が1μm以下の無機粒子に占めるアルミナの割合と同様にして求めることができる。The proportion of alumina in the inorganic particles having a particle diameter of 10 μm or more contained in the inorganic filler is preferably 20% by volume to 60% by volume, more preferably 25% by volume to 55% by volume, and 30% by volume. It is more preferably% to 50% by volume.
The proportion of alumina in the inorganic particles having a particle diameter of 10 μm or more contained in the inorganic filler can be determined in the same manner as the proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler.
無機充填材の配合量としては、吸湿性、線膨張係数の低減、強度向上及びはんだ耐熱性の観点から、封止組成物全体に対して75質量%〜97質量%の範囲内であることが好ましく、80質量%〜95質量%の範囲内であることがより好ましい。 The blending amount of the inorganic filler shall be in the range of 75% by mass to 97% by mass with respect to the entire sealing composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement and solder heat resistance. It is preferably in the range of 80% by mass to 95% by mass, more preferably.
無機充填材が少なくとも3つのピークを有する粒度分布を示すためには、例えば、平均粒子径の異なる3種類の無機充填材を配合する方法が挙げられるが、これに限定されることはない。例えば、平均粒子径が0.3μm〜0.7μmの無機充填材と、平均粒子径が7μm〜20μmの無機充填材と、平均粒子径が30μm〜70μmの無機充填材とを併用してもよい。
無機充填材全体としての平均粒子径は、4μm〜30μmであることが好ましく、5μm〜25μmであることがより好ましく、6μm〜20μmであることがさらに好ましい。
無機充填材の平均粒子径は、無機充填材の粒度分布の測定の場合と同様にして調製した無機充填材の分散液を用い、レーザー回折/散乱式粒子径分布測定装置(例えば、株式会社堀場製作所、LA920(商品名))にて測定される体積基準の粒度分布において、小径側からの累積が50%となるときの粒子径(D50%)として求められる。In order to show a particle size distribution in which the inorganic filler has at least three peaks, for example, a method of blending three types of inorganic fillers having different average particle diameters can be mentioned, but the method is not limited thereto. For example, an inorganic filler having an average particle diameter of 0.3 μm to 0.7 μm, an inorganic filler having an average particle diameter of 7 μm to 20 μm, and an inorganic filler having an average particle diameter of 30 μm to 70 μm may be used in combination. ..
The average particle size of the inorganic filler as a whole is preferably 4 μm to 30 μm, more preferably 5 μm to 25 μm, and even more preferably 6 μm to 20 μm.
The average particle size of the inorganic filler is a laser diffraction / scattering type particle size distribution measuring device (for example, Horiba Co., Ltd.) using a dispersion of the inorganic filler prepared in the same manner as in the case of measuring the particle size distribution of the inorganic filler. In the volume-based particle size distribution measured by LA920 (trade name) manufactured by Mfg. Co., Ltd., it is determined as the particle size (D50%) when the accumulation from the small diameter side is 50%.
(硬化促進剤)
封止組成物は、硬化促進剤をさらに含有してもよい。硬化促進剤の種類は特に制限されず、公知の硬化促進剤を使用することができる。
具体的には、1,8−ジアザ−ビシクロ[5.4.0]ウンデセン−7、1,5−ジアザ−ビシクロ[4.3.0]ノネン、5,6−ジブチルアミノ−1,8−ジアザ−ビシクロ[5.4.0]ウンデセン−7等のシクロアミジン化合物;シクロアミジン化合物に無水マレイン酸、1,4−ベンゾキノン、2,5−トルキノン、1,4−ナフトキノン、2,3−ジメチルベンゾキノン、2,6−ジメチルベンゾキノン、2,3−ジメトキシ−5−メチル−1,4−ベンゾキノン、2,3−ジメトキシ−1,4−ベンゾキノン、フェニル−1,4−ベンゾキノン等のキノン化合物、ジアゾフェニルメタン、フェノール樹脂などのπ結合をもつ化合物を付加してなる分子内分極を有する化合物;ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス(ジメチルアミノメチル)フェノール等の3級アミン化合物、3級アミン化合物の誘導体;2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール等のイミダゾール化合物、イミダゾール化合物の誘導体;トリブチルホスフィン、メチルジフェニルホスフィン、トリフェニルホスフィン、トリス(4−メチルフェニル)ホスフィン、ジフェニルホスフィン、フェニルホスフィン等の有機ホスフィン化合物;有機ホスフィン化合物に無水マレイン酸、上記キノン化合物、ジアゾフェニルメタン、フェノール樹脂等のπ結合をもつ化合物を付加してなる分子内分極を有するリン化合物;テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレート、2−エチル−4−メチルイミダゾールテトラフェニルボレート、N−メチルモルホリンテトラフェニルボレート等のテトラフェニルボロン塩、テトラフェニルボロン塩の誘導体;トリフェニルホスホニウム−トリフェニルボラン、N−メチルモルホリンテトラフェニルホスホニウム−テトラフェニルボレート等のホスフィン化合物とテトラフェニルボロン塩との付加物などが挙げられる。硬化促進剤は、1種類を単独で使用しても、2種類以上を併用してもよい。(Curing accelerator)
The sealing composition may further contain a curing accelerator. The type of the curing accelerator is not particularly limited, and a known curing accelerator can be used.
Specifically, 1,8-diaza-bicyclo [5.4.0] undecene-7, 1,5-diaza-bicyclo [4.3.0] nonene, 5,6-dibutylamino-1,8- Cycloamidine compounds such as diaza-bicyclo [5.4.0] undecene-7; maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethyl as cycloamidine compounds Kinone compounds such as benzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, diazo Compounds with intramolecular polarization formed by adding compounds with π bonds such as phenylmethane and phenol resins; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol, Derivatives of tertiary amine compounds; imidazole compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, derivatives of imidazole compounds; tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4- Methylphenyl) Organic phosphine compounds such as phosphine, diphenylphosphine, and phenylphosphine; Intramolecular polarization formed by adding a compound having a π bond such as maleic anhydride, the above quinone compound, diazophenylmethane, and phenol resin to the organic phosphin compound. Phosphorus compounds; tetraphenylborone salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, N-methylmorpholin tetraphenylborate, and derivatives of tetraphenylborone salts. Examples thereof include additions of a phosphine compound such as triphenylphosphonium-triphenylboran and N-methylmorpholintetraphenylphosphonium-tetraphenylborate and a tetraphenylborone salt. As the curing accelerator, one type may be used alone, or two or more types may be used in combination.
硬化促進剤の含有率は、エポキシ樹脂と硬化剤の合計量に対して、0.1質量%〜8質量%であることが好ましい。 The content of the curing accelerator is preferably 0.1% by mass to 8% by mass with respect to the total amount of the epoxy resin and the curing agent.
(イオントラップ剤)
封止組成物は、イオントラップ剤をさらに含有してもよい。
本開示において使用可能なイオントラップ剤は、半導体装置の製造用途に用いられる封止材において、一般的に使用されているイオントラップ剤であれば特に制限されるものではなく、ハイドロタルサイト等が挙げられる。イオントラップ剤としては、下記一般式(II−1)又は下記一般式(II−2)で表される化合物を用いてもよい。(Ion trap agent)
The sealing composition may further contain an ion trap agent.
The ion trapping agent that can be used in the present disclosure is not particularly limited as long as it is a generally used ion trapping agent in the encapsulant used for manufacturing semiconductor devices, and hydrotalcite and the like are used. Can be mentioned. As the ion trapping agent, a compound represented by the following general formula (II-1) or the following general formula (II-2) may be used.
Mg1−aAla(OH)2(CO3)a/2・uH2O (II−1)
(一般式(II−1)中、aは0<a≦0.5であり、uは正数である。)
BiOb(OH)c(NO3)d (II−2)
(一般式(II−2)中、bは0.9≦b≦1.1、cは0.6≦c≦0.8、dは0.2≦d≦0.4である。)Mg 1-a Al a (OH) 2 (CO 3 ) a / 2 · uH 2 O (II-1)
(In the general formula (II-1), a is 0 <a≤0.5 and u is a positive number.)
BiO b (OH) c (NO 3 ) d (II-2)
(In the general formula (II-2), b is 0.9 ≦ b ≦ 1.1, c is 0.6 ≦ c ≦ 0.8, and d is 0.2 ≦ d ≦ 0.4.)
イオントラップ剤は、市販品として入手可能である。一般式(II−1)で表される化合物としては、例えば、「DHT−4A」(協和化学工業株式会社、商品名)が市販品として入手可能である。また、一般式(II−2)で表される化合物としては、例えば、「IXE500」(東亞合成株式会社、商品名)が市販品として入手可能である。 The ion trap agent is available as a commercial product. As the compound represented by the general formula (II-1), for example, "DHT-4A" (Kyowa Chemical Industry Co., Ltd., trade name) is available as a commercially available product. Further, as a compound represented by the general formula (II-2), for example, "IXE500" (Toagosei Co., Ltd., trade name) is available as a commercially available product.
また、上記以外のイオントラップ剤として、マグネシウム、アルミニウム、チタン、ジルコニウム、アンチモン等から選ばれる元素の含水酸化物などが挙げられる。
イオントラップ剤は、1種類を単独で使用しても、2種類以上を併用してもよい。Examples of ion trapping agents other than the above include hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony and the like.
One type of ion trapping agent may be used alone, or two or more types may be used in combination.
封止組成物がイオントラップ剤を含有する場合、イオントラップ剤の含有量は、充分な耐湿信頼性を実現する観点からは、封止組成物中のエポキシ樹脂100質量部に対し、1質量部以上であることが好ましい。他の成分の効果を充分に発揮する観点からは、イオントラップ剤の含有量は、封止組成物中のエポキシ樹脂100質量部に対し、15質量部以下であることが好ましい。 When the sealing composition contains an ion trapping agent, the content of the ion trapping agent is 1 part by mass with respect to 100 parts by mass of the epoxy resin in the sealing composition from the viewpoint of realizing sufficient moisture resistance and reliability. The above is preferable. From the viewpoint of fully exerting the effects of the other components, the content of the ion trap agent is preferably 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin in the sealing composition.
また、イオントラップ剤の平均粒子径は0.1μm〜3.0μmであることが好ましく、最大粒子径は10μm以下であることが好ましい。イオントラップ剤の平均粒子径は、無機充填材の場合と同様にして測定することができる。 The average particle size of the ion trap agent is preferably 0.1 μm to 3.0 μm, and the maximum particle size is preferably 10 μm or less. The average particle size of the ion trap agent can be measured in the same manner as in the case of the inorganic filler.
(カップリング剤)
封止組成物は、カップリング剤をさらに含有してもよい。カップリング剤の種類は、特に制限されず、公知のカップリング剤を使用することができる。カップリング剤としては、例えば、シランカップリング剤及びチタンカップリング剤が挙げられる。カップリング剤は、1種類を単独で使用しても、2種類以上を併用してもよい。(Coupling agent)
The sealing composition may further contain a coupling agent. The type of coupling agent is not particularly limited, and known coupling agents can be used. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent. One type of coupling agent may be used alone, or two or more types may be used in combination.
シランカップリング剤としては、例えば、ビニルトリクロロシラン、ビニルトリエトキシシラン、ビニルトリス(β−メトキシエトキシ)シラン、γ−メタクリロキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、ビニルトリアセトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−[ビス(β−ヒドロキシエチル)]アミノプロピルトリエトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−(β−アミノエチル)アミノプロピルジメトキシメチルシラン、N−(トリメトキシシリルプロピル)エチレンジアミン、N−(ジメトキシメチルシリルイソプロピル)エチレンジアミン、メチルトリメトキシシラン、メチルトリエトキシシラン、N−β−(N−ビニルベンジルアミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−クロロプロピルトリメトキシシラン、ヘキサメチルジシラン、γ−アニリノプロピルトリメトキシシラン、ビニルトリメトキシシラン及びγ−メルカプトプロピルメチルジメトキシシランが挙げられる。 Examples of the silane coupling agent include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. , Γ-Glysidoxypropyltrimethoxysilane, Vinyltriacetoxysilane, γ-Mercaptopropyltrimethoxysilane, γ-Aminopropyltriethoxysilane, γ- [bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N -Β- (Aminoethyl) -γ-aminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, Methyltrimethoxysilane, Methyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-anilinopropyltrimethoxy Examples include silane, vinyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane.
チタンカップリング剤としては、例えば、イソプロピルトリイソステアロイルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、イソプロピルトリ(N−アミノエチル−アミノエチル)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2−ジアリルオキシメチル−1−ブチル)ビス(ジトリデシルホスファイト)チタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)エチレンチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリ(ジオクチルホスフェート)チタネート、イソプロピルトリクミルフェニルチタネート及びテトライソプロピルビス(ジオクチルホスファイト)チタネートが挙げられる。 Examples of the titanium coupling agent include isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecylphosphite) titanate, and tetra (ditridecylphosphite) titanate. 2,2-Diallyloxymethyl-1-butyl) bis (ditridecylphosphite) titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylic iso Examples thereof include stearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl diacrylic titanate, isopropyltri (dioctyl phosphate) titanate, isopropyltricylphenyl titanate and tetraisopropylbis (dioctyl phosphate) titanate.
封止組成物がカップリング剤を含有する場合、カップリング剤の含有率は、封止組成物の全体に対して3質量%以下であることが好ましく、その効果を発揮させる観点からは、0.1質量%以上であることが好ましい。 When the sealing composition contains a coupling agent, the content of the coupling agent is preferably 3% by mass or less with respect to the entire sealing composition, and from the viewpoint of exerting the effect, it is 0. It is preferably 1% by mass or more.
(離型剤)
封止組成物は、離型剤をさらに含有してもよい。離型剤の種類は特に制限されず、公知の離型剤を使用することができる。具体的には、例えば、高級脂肪酸、高級脂肪酸エステル、カルナバワックス及びポリエチレン系ワックスが挙げられる。離型剤は、1種類を単独で使用しても、2種類以上を併用してもよい。
封止組成物が離型剤を含有する場合、離型剤の含有率は、エポキシ樹脂と硬化剤の合計量に対して、10質量%以下であることが好ましく、その効果を発揮させる観点からは、0.5質量%以上であることが好ましい。(Release agent)
The sealing composition may further contain a release agent. The type of release agent is not particularly limited, and a known release agent can be used. Specific examples thereof include higher fatty acids, higher fatty acid esters, carnauba wax and polyethylene wax. As the release agent, one type may be used alone, or two or more types may be used in combination.
When the sealing composition contains a release agent, the content of the release agent is preferably 10% by mass or less with respect to the total amount of the epoxy resin and the curing agent, and from the viewpoint of exerting the effect. Is preferably 0.5% by mass or more.
(着色剤及び改質剤)
封止組成物は、着色剤(例えば、カーボンブラック)を含有してもよい。また、封止組成物は、改質剤(例えば、シリコーン及びシリコーンゴム)を含有してもよい。着色剤及び改質剤は、それぞれ、1種類を単独で使用しても、2種類以上を併用してもよい。(Colorants and modifiers)
The sealing composition may contain a colorant (eg, carbon black). In addition, the sealing composition may contain a modifier (for example, silicone and silicone rubber). As the colorant and the modifier, one type may be used alone, or two or more types may be used in combination.
着色剤としてカーボンブラック等の導電性粒子を用いる場合、導電性粒子は、粒子径10μm以上の粒子の含有率が1質量%以下であることが好ましい。
封止組成物が導電性粒子を含有する場合、導電性粒子の含有率は、エポキシ樹脂と硬化剤の合計量に対して4質量%以下であることが好ましい。When conductive particles such as carbon black are used as the colorant, the content of the conductive particles is preferably 1% by mass or less of particles having a particle diameter of 10 μm or more.
When the sealing composition contains conductive particles, the content of the conductive particles is preferably 4% by mass or less with respect to the total amount of the epoxy resin and the curing agent.
<封止組成物の作製方法>
封止組成物の作製方法は特に制限されず、公知の方法により行うことができる。例えば、所定の配合量の原材料の混合物をミキサー等によって充分混合した後、熱ロール、押出機等によって混練し、冷却、粉砕等の処理を経ることによって作製することができる。封止組成物の状態は特に制限されず、粉末状、固体状、液体状等であってよい。<Method for producing sealing composition>
The method for producing the sealing composition is not particularly limited, and a known method can be used. For example, it can be produced by sufficiently mixing a mixture of raw materials in a predetermined blending amount with a mixer or the like, kneading the mixture with a hot roll, an extruder or the like, cooling, pulverizing or the like. The state of the sealing composition is not particularly limited and may be powdery, solid, liquid or the like.
<半導体装置>
本開示の半導体装置は、半導体素子と、前記半導体素子を封止してなる本開示の封止組成物の硬化物と、を含む。<Semiconductor device>
The semiconductor device of the present disclosure includes a semiconductor element and a cured product of the sealing composition of the present disclosure obtained by sealing the semiconductor element.
封止組成物を用いて半導体素子を封止する方法は特に限定されず、公知の方法を適用することが可能である。例えば、トランスファーモールド法が一般的であるが、コンプレッションモールド法、インジェクション成形法等を用いてもよい。 The method of sealing the semiconductor element using the sealing composition is not particularly limited, and a known method can be applied. For example, the transfer molding method is generally used, but a compression molding method, an injection molding method, or the like may be used.
本開示の半導体装置は、IC、LSI(Large−Scale Integration、大規模集積回路)等として好適である。 The semiconductor device of the present disclosure is suitable as an IC, an LSI (Large-Scale Integration, a large-scale integrated circuit), or the like.
以下に本発明の実施例について説明するが、本発明はこれに限定されるものではない。また、表中の数値は特に断りのない限り「質量部」を意味する。 Examples of the present invention will be described below, but the present invention is not limited thereto. The values in the table mean "parts by mass" unless otherwise specified.
(実施例1〜11並びに比較例1及び2)
表1〜表3に示す配合の材料を予備混合(ドライブレンド)した後、二軸ロール(ロール表面温度:約80℃)で約15分間混練し、冷却粉砕して粉末状の封止組成物を製造した。(Examples 1 to 11 and Comparative Examples 1 and 2)
After premixing (dry blending) the materials having the formulations shown in Tables 1 to 3, they are kneaded with a biaxial roll (roll surface temperature: about 80 ° C.) for about 15 minutes, cooled and pulverized to form a powdery sealing composition. Manufactured.
表中の材料の詳細は、それぞれ以下の通りである。また表中の「−」は、該当する成分を含有しないことを示す。 The details of the materials in the table are as follows. Further, "-" in the table indicates that the corresponding component is not contained.
(エポキシ樹脂)
・エポキシ樹脂1:ビフェニル型エポキシ樹脂、エポキシ当量:186g/eq
・エポキシ樹脂2:多官能エポキシ樹脂、エポキシ当量:167g/eq
・エポキシ樹脂3:ビスフェノール型結晶性エポキシ樹脂、エポキシ当量:192g/eq
・エポキシ樹脂4:ビスF型エポキシ樹脂、エポキシ当量:159g/eq(Epoxy resin)
-Epoxy resin 1: Biphenyl type epoxy resin, epoxy equivalent: 186 g / eq
-Epoxy resin 2: Polyfunctional epoxy resin, epoxy equivalent: 167 g / eq
-Epoxy resin 3: Bisphenol type crystalline epoxy resin, epoxy equivalent: 192 g / eq
-Epoxy resin 4: Epoxy F type epoxy resin, epoxy equivalent: 159 g / eq
(硬化剤)
・硬化剤1:多官能フェノール樹脂、水酸基当量が102g/eqのトリフェニルメタン型フェノール樹脂
・硬化剤2:多官能フェノール樹脂、水酸基当量が205g/eqのビフェニル・アラルキル樹脂
・硬化剤3:フェノール・アラルキル樹脂、水酸基当量:170g/eq(Hardener)
-Curing agent 1: Polyfunctional phenol resin, triphenylmethane-type phenol resin having a hydroxyl group equivalent of 102 g / eq-Curing agent 2: Polyfunctional phenol resin, biphenyl-aralkyl resin having a hydroxyl equivalent of 205 g / eq-Curing agent 3: Phenol -Aralkyl resin, hydroxyl group equivalent: 170 g / eq
・硬化促進剤:リン系硬化促進剤
・カップリング剤:エポキシシラン(γ−グリシドキシプロピルトリメトキシシラン)
・離型剤:モンタン酸エステル
・着色剤:カーボンブラック
・イオントラップ剤:ハイドロタルサイト
・改質剤:シリコーン-Curing accelerator: Phosphorus-based curing accelerator-Coupling agent: Epoxysilane (γ-glycidoxypropyltrimethoxysilane)
-Release agent: Montanic acid ester-Colorant: Carbon black-Ion trap agent: Hydrotalcite-Modifier: Silicone
(無機充填材)
・無機充填材1:アルミナとシリカの混合物(平均粒子径:8.6μm)
・無機充填材2:シリカ(平均粒子径:9.5μm)
・無機充填材3:アルミナ(平均粒子径:0.4μm)
・無機充填材4:シリカ(平均粒子径:0.8μm)
・無機充填材5:シリカ(平均粒子径:0.1μm)
・無機充填材6:シリカ(平均粒子径:13.0μm)
・無機充填材7:シリカ(平均粒子径:2.2μm)
・無機充填材8:シリカ(平均粒子径:0.8μm)
・無機充填材9:アルミナとシリカの混合物(平均粒子径:7.4μm)
・無機充填材10:シリカ(平均粒子径:1.5μm)
・無機充填材11:シリカ(平均粒子径:22.0μm)
・無機充填材12:アルミナ(平均粒子径:14.9μm)
・無機充填材13:アルミナ(平均粒子径:10.4μm)
・無機充填材14:アルミナ(平均粒子径:2.0μm)
・無機充填材15:アルミナとシリカの混合物(平均粒子径:43.9μm)(Inorganic filler)
-Inorganic filler 1: Mixture of alumina and silica (average particle size: 8.6 μm)
-Inorganic filler 2: silica (average particle size: 9.5 μm)
-Inorganic filler 3: Alumina (average particle size: 0.4 μm)
-Inorganic filler 4: silica (average particle size: 0.8 μm)
-Inorganic filler 5: silica (average particle size: 0.1 μm)
-Inorganic filler 6: silica (average particle size: 13.0 μm)
-Inorganic filler 7: silica (average particle size: 2.2 μm)
-Inorganic filler 8: silica (average particle size: 0.8 μm)
-Inorganic filler 9: Mixture of alumina and silica (average particle size: 7.4 μm)
-Inorganic filler 10: silica (average particle size: 1.5 μm)
-Inorganic filler 11: silica (average particle size: 22.0 μm)
-Inorganic filler 12: Alumina (average particle size: 14.9 μm)
-Inorganic filler 13: Alumina (average particle size: 10.4 μm)
-Inorganic filler 14: Alumina (average particle size: 2.0 μm)
-Inorganic filler 15: Mixture of alumina and silica (average particle size: 43.9 μm)
実施例1〜11の無機充填材の粒度分布におけるピークの位置は、以下の通りであり、
3つのピークを有していた。また、実施例1〜11に係る封止組成物は全て粒子径が1μm以下のアルミナを含んでいた。合わせて、無機充填材全体の平均粒子径を以下に示す。
実施例1:0.45μm、10μm及び40μm (平均粒子径:8.1μm)
実施例2:0.5μm、10μm及び50μm (平均粒子径:8.7μm)
実施例3:0.5μm、10μm及び50μm (平均粒子径:7.6μm)
実施例4:0.5μm、10μm及び50μm (平均粒子径:7.7μm)
実施例5:0.5μm、10μm及び50μm (平均粒子径:6.6μm)
実施例6:0.5μm、10μm及び51μm (平均粒子径:6.2μm)
実施例7:0.5μm、10μm及び51μm (平均粒子径:7.7μm)
実施例8:0.5μm、10μm及び51μm (平均粒子径:6.6μm)
実施例9:0.5μm、10μm及び51μm (平均粒子径:10.8μm)
実施例10:0.45μm、10μm及び51μm (平均粒子径:6.4μm)
実施例11:0.4μm、9μm及び45μm (平均粒子径:7.8μm)
一方、比較例1の無機充填材の粒度分布におけるピークの位置は、以下の通りであり、2つのピークを有していた。また、比較例1に係る封止組成物は粒子径が1μm以下のアルミナを含んでいた。合わせて、無機充填材全体の平均粒子径を以下に示す。
比較例1:1.5μm及び10μm (平均粒子径:11.3μm)
また、比較例2の無機充填材の粒度分布におけるピークの位置は、以下の通りであり、3つのピークを有していた。また、比較例2に係る封止組成物は粒子径が1μm以下のアルミナを含んでいなかった。合わせて、無機充填材全体の平均粒子径を以下に示す。
比較例2:0.5μm、10μm及び50μm (平均粒子径:6.5μm)The positions of the peaks in the particle size distribution of the inorganic fillers of Examples 1 to 11 are as follows.
It had three peaks. In addition, all the sealing compositions according to Examples 1 to 11 contained alumina having a particle size of 1 μm or less. In addition, the average particle size of the entire inorganic filler is shown below.
Example 1: 0.45 μm, 10 μm and 40 μm (average particle size: 8.1 μm)
Example 2: 0.5 μm, 10 μm and 50 μm (average particle size: 8.7 μm)
Example 3: 0.5 μm, 10 μm and 50 μm (average particle size: 7.6 μm)
Example 4: 0.5 μm, 10 μm and 50 μm (average particle size: 7.7 μm)
Example 5: 0.5 μm, 10 μm and 50 μm (average particle size: 6.6 μm)
Example 6: 0.5 μm, 10 μm and 51 μm (average particle size: 6.2 μm)
Example 7: 0.5 μm, 10 μm and 51 μm (average particle size: 7.7 μm)
Example 8: 0.5 μm, 10 μm and 51 μm (average particle size: 6.6 μm)
Example 9: 0.5 μm, 10 μm and 51 μm (average particle size: 10.8 μm)
Example 10: 0.45 μm, 10 μm and 51 μm (average particle size: 6.4 μm)
Example 11: 0.4 μm, 9 μm and 45 μm (average particle size: 7.8 μm)
On the other hand, the positions of the peaks in the particle size distribution of the inorganic filler of Comparative Example 1 were as follows, and had two peaks. Further, the sealing composition according to Comparative Example 1 contained alumina having a particle size of 1 μm or less. In addition, the average particle size of the entire inorganic filler is shown below.
Comparative Example 1: 1.5 μm and 10 μm (average particle size: 11.3 μm)
The positions of the peaks in the particle size distribution of the inorganic filler of Comparative Example 2 were as follows, and had three peaks. Further, the sealing composition according to Comparative Example 2 did not contain alumina having a particle size of 1 μm or less. In addition, the average particle size of the entire inorganic filler is shown below.
Comparative Example 2: 0.5 μm, 10 μm and 50 μm (average particle size: 6.5 μm)
<流動性の評価>
封止組成物の流動性の評価は、スパイラルフロー試験により行った。
具体的には、EMMI−1−66に準じたスパイラルフロー測定用金型を用いて封止組成物を成形し、封止組成物の成形物の流動距離(cm)を測定した。封止組成物の成形は、トランスファー成形機を用い、金型温度180℃、成形圧力6.9MPa、硬化時間120秒の条件下で行った。
また、流動性は160cm以上をAとし、150cm以上160cm未満をB、150cm未満をCとした。<Evaluation of liquidity>
The fluidity of the sealing composition was evaluated by a spiral flow test.
Specifically, the sealing composition was molded using a spiral flow measuring mold according to EMMI-1-66, and the flow distance (cm) of the molded product of the sealing composition was measured. The sealing composition was molded using a transfer molding machine under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds.
Further, the fluidity was defined as A for 160 cm or more, B for 150 cm or more and less than 160 cm, and C for less than 150 cm.
<熱伝導率の評価>
封止組成物の熱伝導率の評価は、下記の方法により行った。
具体的には、調製した封止組成物を用いて、金型温度180℃、成形圧力7MPa、硬化時間300秒間の条件でトランスファー成形を行い、金型形状の硬化物を得た。得られた硬化物をアルキメデス法により測定した密度は2.8g/cm3〜3.0g/cm3であった。また硬化物の熱拡散率を熱拡散率測定装置(NETZSCH社、LFA467)を用いてレーザーフラッシュ法により測定した。上記で測定された熱拡散率、アルキメデス法で測定した密度及びDSC(示差熱量計)により測定した比熱の積から熱伝導率(W/(m・K))を算出した。
また、熱伝導率は2.5W/(m・K)以上をAとし、2.5W/(m・K)未満をBとした。<Evaluation of thermal conductivity>
The thermal conductivity of the sealing composition was evaluated by the following method.
Specifically, using the prepared sealing composition, transfer molding was performed under the conditions of a mold temperature of 180 ° C., a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a cured product having a mold shape. The cured product obtained was measured by the Archimedes method and the density was 2.8g / cm 3 ~3.0g / cm 3 . Further, the thermal diffusivity of the cured product was measured by a laser flash method using a thermal diffusivity measuring device (NETZSCH, LFA467). The thermal conductivity (W / (m · K)) was calculated from the product of the thermal diffusivity measured above, the density measured by the Archimedes method, and the specific heat measured by DSC (differential calorimetry).
Further, the thermal conductivity was defined as A for 2.5 W / (m · K) or more and B for less than 2.5 W / (m · K).
表4〜表6に示されるように、3つのピークを有する実施例1〜11と2つのピークを有する比較例1の結果より、無機充填材に占めるアルミナの割合に関わらず、無機充填材の粒度分布でピークを3つ有さないことにより、流動性は極端に低下し、熱伝導率は低下した。
また、無機充填材の中に粒子径が1μm以下のアルミナを含まない比較例2は、無機充填材の中に粒子径が1μm以下のアルミナを特に多く有する実施例1、5、6、8、10及び11と比較し、流動性は同等か又は低下し、熱伝導率は低下する結果となった。As shown in Tables 4 to 6, from the results of Examples 1 to 11 having three peaks and Comparative Example 1 having two peaks, the inorganic filler was prepared regardless of the ratio of alumina to the inorganic filler. By not having three peaks in the particle size distribution, the fluidity was extremely lowered and the thermal conductivity was lowered.
Further, in Comparative Example 2 in which the inorganic filler does not contain alumina having a particle diameter of 1 μm or less, Examples 1, 5, 6 and 8 which have a particularly large amount of alumina having a particle diameter of 1 μm or less in the inorganic filler, Compared with 10 and 11, the fluidity was equal to or lower, and the thermal conductivity was lower.
2017年12月28日に出願された日本国特許出願2017−254883号の開示は、その全体が参照により本明細書に取り込まれる。
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。The disclosure of Japanese Patent Application No. 2017-254883, filed December 28, 2017, is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated herein by reference.
Claims (5)
前記無機充填材の粒度分布が、少なくとも3つのピークを有し、
前記無機充填材が、粒子径が1μm以下のアルミナを含む封止組成物。Contains an epoxy resin, a curing agent, and an inorganic filler,
The particle size distribution of the inorganic filler has at least three peaks.
A sealing composition in which the inorganic filler contains alumina having a particle size of 1 μm or less.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07278415A (en) * | 1994-04-13 | 1995-10-24 | Shin Etsu Chem Co Ltd | Resin composition for semiconductor sealing and semiconductor device sealed therewith |
JP2005290076A (en) * | 2004-03-31 | 2005-10-20 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2010024464A (en) * | 2009-11-04 | 2010-02-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2014122364A (en) * | 2014-03-20 | 2014-07-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition, semiconductor device using the same, organically modified inorganic filler, and method of producing epoxy resin composition |
JP2015205796A (en) * | 2014-04-21 | 2015-11-19 | 新日鉄住金マテリアルズ株式会社 | Spherical particle and production method therefor, and resin composition containing the same |
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JP4774778B2 (en) | 2005-03-28 | 2011-09-14 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
KR101398732B1 (en) * | 2006-10-06 | 2014-05-27 | 스미토모 베이클리트 컴퍼니 리미티드 | Epoxy resin composition for sealing of semiconductor and semiconductor device |
SG190615A1 (en) * | 2008-04-30 | 2013-06-28 | Denki Kagaku Kogyo Kk | Alumina powder, process for production of the same, and resin compositions containing the same |
CN102382422B (en) * | 2010-09-01 | 2013-01-02 | 北京科化新材料科技有限公司 | Epoxy resin composition with hydrated alumina |
JP6282390B2 (en) * | 2010-12-16 | 2018-02-21 | 日立化成株式会社 | Epoxy resin molding material for sealing and semiconductor device using the same |
JP2013028659A (en) * | 2011-07-26 | 2013-02-07 | Hitachi Chemical Co Ltd | Epoxy resin liquid sealing material for underfill and electric component apparatus using the same |
CN104221140B (en) * | 2012-03-29 | 2017-08-25 | 住友电木株式会社 | Resin combination and semiconductor device |
JP2014031460A (en) * | 2012-08-06 | 2014-02-20 | Panasonic Corp | Epoxy resin composition for encapsulation and semiconductor device using the same |
WO2015104917A1 (en) * | 2014-01-08 | 2015-07-16 | 信越化学工業株式会社 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
JP6501211B2 (en) * | 2016-01-13 | 2019-04-17 | エルジー・ケム・リミテッド | Thermosetting resin composition for semiconductor package and prepreg using the same |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07278415A (en) * | 1994-04-13 | 1995-10-24 | Shin Etsu Chem Co Ltd | Resin composition for semiconductor sealing and semiconductor device sealed therewith |
JP2005290076A (en) * | 2004-03-31 | 2005-10-20 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2010024464A (en) * | 2009-11-04 | 2010-02-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2014122364A (en) * | 2014-03-20 | 2014-07-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition, semiconductor device using the same, organically modified inorganic filler, and method of producing epoxy resin composition |
JP2015205796A (en) * | 2014-04-21 | 2015-11-19 | 新日鉄住金マテリアルズ株式会社 | Spherical particle and production method therefor, and resin composition containing the same |
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