WO2019109416A1 - Module de dispositif d'émission de son et appareil électronique - Google Patents

Module de dispositif d'émission de son et appareil électronique Download PDF

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Publication number
WO2019109416A1
WO2019109416A1 PCT/CN2017/118691 CN2017118691W WO2019109416A1 WO 2019109416 A1 WO2019109416 A1 WO 2019109416A1 CN 2017118691 W CN2017118691 W CN 2017118691W WO 2019109416 A1 WO2019109416 A1 WO 2019109416A1
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WO
WIPO (PCT)
Prior art keywords
hole
cavity
module
device module
module housing
Prior art date
Application number
PCT/CN2017/118691
Other languages
English (en)
Chinese (zh)
Inventor
高远
李承伟
李振军
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2019109416A1 publication Critical patent/WO2019109416A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application belongs to the field of acoustic and electrical transducing technologies, and more particularly, the present invention relates to a sound emitting device module and an electronic device.
  • the sounding device module is an important acoustic device of modern electronic equipment, and is used for converting between electrical signals and acoustic signals. It is an energy conversion device and is widely used in electronic devices, such as mobile phones, walkie-talkies, notebooks, and the like. With the advancement of market consumption, product design and production and processing technology, electronic devices are becoming smaller and lighter, which also requires the sound-emitting device modules to be more and more miniaturized to meet the needs of electronic products. In this case of the prior art, the design requirements for the thickness of the sounding device module are becoming more and more strict. How to effectively utilize the internal space of the sounding device module, and improve the acoustic performance of the sounding device module by designing and digging out the cavity space of the larger sound cavity in the same space. The design of the sounding device module is of great significance.
  • a sound emitting device module includes a module housing having a receiving cavity therein, and a module housing on one side of the receiving cavity is provided with a through hole, and the through hole is accommodated
  • the cavity is in communication, and the receiving cavity communicates with the outside through the through hole, the through hole being configured such that, in use, the side of the through hole away from the receiving cavity is closed by the outer component.
  • the module housing is provided with a metal plate, and the through hole is disposed on the metal plate.
  • the metal plate is integrally molded with the module housing.
  • the metal plate is adhesively fixed on the module housing.
  • the sounding device unit is further disposed in the accommodating cavity, the accommodating cavity is divided into a front cavity and a rear cavity, and the module housing is further provided with an sound hole. The sound hole is communicated with the front cavity.
  • the through hole is in communication with the front cavity.
  • the through hole is disposed on a side away from the receiving cavity, and a sealing layer is disposed around the through hole.
  • the sealing layer is configured to seal the through hole to the external component when the through hole is closed by the external component. gap.
  • the present application further provides an electronic device including a closure member and the above-described sounding device module, the closure member covering the through hole and closing the through hole.
  • the sealing member is provided with a sealing layer corresponding to the through hole, and the sealing layer is configured to seal the through hole and the sealing member when the through hole is closed by the closing member Connect the gap.
  • the enclosure is an outer casing of an electronic device or a circuit board inside the electronic device.
  • One technical effect of the present application is to increase the volume of the cavity inside the module housing under certain conditions of the module housing.
  • FIG. 1 is a structural exploded view of a specific embodiment of the present application.
  • FIG. 2 is a schematic perspective view of a specific embodiment of the present application.
  • FIG 3 is a top plan view of a specific embodiment of the present application.
  • Figure 4 is a cross-sectional structural view taken along line A-A of Figure 3;
  • module housing 11 housing cavity, 12 through holes, 13 front cavity, 14 rear cavity, 2 metal plates, 3 external components, 4 diaphragms.
  • the sounding device module provided by the present application can increase the volume of the cavity of the module housing under certain conditions of the module housing.
  • the increase of the cavity space in the module housing can effectively improve the acoustic performance of the sounding device module.
  • a sound emitting device module provided by the present application, as shown in FIG. 1-2, includes a module housing 1.
  • the module housing 1 has a receiving chamber 11 for accommodating internal components of the sounding device module, such as a magnetic circuit assembly, a diaphragm assembly, and the like.
  • the module housing 1 on one side of the accommodating chamber 11 is provided with a through hole 12, and the through hole 12 communicates with the accommodating chamber 11.
  • the accommodating chamber 11 can communicate with the outside of the module housing 1 through the through hole 12.
  • the application When the application is used, it is not used alone, but is integrated in a specific application environment, such as a mobile device such as a mobile phone; after assembling and integrating the application, the side of the through hole 12 away from the accommodating cavity 11 can be It is closed by the outer component 3, thereby achieving the closing of the accommodating cavity 11, and preventing the clogging of the accommodating cavity 11 to cause noise or the like.
  • the external component 3 is another component in a specific application environment.
  • the external component 3 may be a casing of the mobile phone or other components (such as a circuit board, etc.) adjacent to the sounding device module inside the mobile phone to form a mating relationship.
  • the external component 3 shown in Figures 1-2 is only partially schematic and is not necessarily a complete component.
  • the present application is the same sound emitting device module as the module housing 1 does not have the through hole 12, and the volume enlarged by the receiving cavity 11 is the volume of the through hole 12, and the surface area of the through hole 12 is multiplied by the corresponding one.
  • the thickness of the outer casing of the module housing 1 on one side can also be understood that in the case where the volume in the accommodating chamber is the same, the present application can be made smaller in size and thinner in shape.
  • the number and size of the through holes 12 may be different, and those skilled in the art may select according to the requirements and the strength requirements of the module housing when designing; for example, it may be as shown in FIG.
  • the opening of an approximately rectangular through hole may be a plurality of through holes, triangular through holes, a plurality of diamond shaped through holes, a plurality of circular through holes, and the like in other embodiments. Accordingly, those skilled in the art will appreciate that the number and shape of the through holes 12 shown in FIG. 1 do not constitute a limitation of the present application.
  • the module housing 1 is provided with a metal plate 2.
  • the metal plate 2 has a smaller thickness at the same strength, and the metal plate 2 covers the receiving cavity as a part of the module casing 1, which is advantageous for increasing the volume of the accommodating cavity.
  • the metal plate 2 can play a structural support for the module housing 1 and improve the structural strength of the module housing 1.
  • the through hole 12 may be disposed on the metal plate 2.
  • the metal plate 2 is an annular metal plate of a hollow structure, and the through hole 12 is the hollow portion.
  • the volume of the accommodating chamber 11 is enlarged while ensuring that the strength of the module case 1 is satisfactory.
  • the metal plate 2 and the module case 1 are formed by integral injection molding.
  • the metal plate can be embedded in the module housing 1 to be more tightly coupled with the module housing 1.
  • the metal plate 2 is fixed to the module housing 1 by bonding.
  • a large opening can be opened or injection molded on the module housing 1 , a card slot is reserved in the opening, the metal plate 2 is glued and then snapped into the card slot, and the glue is used for fixing and sealing, which simplifies the processing.
  • the sounding device module shown in Figures 3-4 further includes a sounding device unit, and the sounding device unit usually includes a diaphragm 4, and the diaphragm 4 can emit sound when in operation.
  • the sounding device unit is located in the accommodating chamber, and divides the accommodating chamber 11 into a front chamber 13 and a rear chamber 14.
  • One side of the diaphragm 4 is a front chamber 13 and the other side is a rear chamber 14.
  • the size of the front chamber 13 and the rear chamber 14 can significantly affect the acoustic performance of the sounding device module.
  • the module housing 1 is further provided with an sound hole, and the sound hole communicates with the front cavity 13 so that the sound emitted by the sounding device module can be externally transmitted from the sound hole.
  • the through hole 12 is in communication with the front chamber 13.
  • the vibration space of the front cavity 13 can be effectively improved, the acoustic performance of the sounding device module can be further improved, and the sound quality transmitted from the sound hole can be improved.
  • the through hole 12 is on a side away from the accommodating cavity 11, and a sealing layer (not shown in FIGS. 1-4) is disposed around the through hole 12.
  • the sealing layer is used to seal the connection gap between the through hole 12 and the outer component 3 when the through hole 12 is closed by the outer component 3, preventing sound from leaking from the joint between the through hole 12 and the outer component 3, affecting sound generation. Acoustic performance of the device module.
  • the outer component 3 can be well fitted with the through hole 12, a good seal can be formed, and the sealing layer can also be omitted.
  • the present application also provides an electronic device, as shown in FIGS. 1-4, including a closure and the sounding device module described above.
  • the closure is the aforementioned outer component 3.
  • the closure can cover the through hole 12 and close the through hole 12.
  • an integrated design can be formed between the sounding device module and the electronic device, and the volume size is further optimized and controlled under the premise of ensuring the performance of the electronic device product.
  • the sealing member is provided with a sealing layer corresponding to the through hole, and the sealing layer is configured to seal the through hole and the sealing member when the through hole is closed by the closing member.
  • the enclosure is an outer casing of an electronic device or a circuit board inside the electronic device.
  • the closure member can be formed in a mating relationship with the through hole in the electronic device as long as it is adjacent to the sounding device module, which is not limited in this application.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

La présente invention concerne un module de dispositif d'émission de son et un appareil électronique. Le module de dispositif d'émission de son comprend un boîtier de module. Le boîtier de module comporte une cavité de réception dans celui-ci. Un trou traversant est agencé au niveau d'un côté du boîtier de module où la cavité de réception est agencée. Le trou traversant est en communication avec la cavité de réception. La cavité de réception est en communication avec un environnement externe au moyen du trou traversant. Le trou traversant est configuré de sorte qu'un côté de celui-ci à l'opposé de la cavité de réception soit scellé par un composant externe lorsque le module de dispositif d'émission de son est en cours d'utilisation. La présente invention permet d'obtenir un effet technique d'augmentation de la taille d'une cavité interne d'un boîtier de module comportant des dimensions limitées.
PCT/CN2017/118691 2017-12-04 2017-12-26 Module de dispositif d'émission de son et appareil électronique WO2019109416A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201721668553.X 2017-12-04
CN201721668553 2017-12-04

Publications (1)

Publication Number Publication Date
WO2019109416A1 true WO2019109416A1 (fr) 2019-06-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110784816A (zh) * 2019-09-29 2020-02-11 歌尔科技有限公司 声学装置及电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096843A (ja) * 2005-09-29 2007-04-12 Kyocera Corp 携帯端末装置
CN204681568U (zh) * 2015-06-05 2015-09-30 歌尔声学股份有限公司 一种扬声器模组装配结构
CN106131757A (zh) * 2016-07-20 2016-11-16 瑞声科技(新加坡)有限公司 发声器件及用于发声器件的前腔和后腔的密封方法
CN107222817A (zh) * 2017-06-30 2017-09-29 歌尔股份有限公司 扬声器模组外壳以及扬声器模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096843A (ja) * 2005-09-29 2007-04-12 Kyocera Corp 携帯端末装置
CN204681568U (zh) * 2015-06-05 2015-09-30 歌尔声学股份有限公司 一种扬声器模组装配结构
CN106131757A (zh) * 2016-07-20 2016-11-16 瑞声科技(新加坡)有限公司 发声器件及用于发声器件的前腔和后腔的密封方法
CN107222817A (zh) * 2017-06-30 2017-09-29 歌尔股份有限公司 扬声器模组外壳以及扬声器模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110784816A (zh) * 2019-09-29 2020-02-11 歌尔科技有限公司 声学装置及电子设备

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