WO2019104647A1 - 显示屏和电子器件的组装方法、显示屏组件及终端 - Google Patents
显示屏和电子器件的组装方法、显示屏组件及终端 Download PDFInfo
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- WO2019104647A1 WO2019104647A1 PCT/CN2017/113967 CN2017113967W WO2019104647A1 WO 2019104647 A1 WO2019104647 A1 WO 2019104647A1 CN 2017113967 W CN2017113967 W CN 2017113967W WO 2019104647 A1 WO2019104647 A1 WO 2019104647A1
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- WIPO (PCT)
- Prior art keywords
- electronic device
- display screen
- area
- fingerprint chip
- display
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
Definitions
- the present application relates to the field of terminals, and more particularly, to a method of assembling a display screen and an electronic device, a display screen assembly, and a terminal.
- the conventional front button type fingerprint chip needs to be installed under the display screen to form an under glass. UG) structure.
- the assembly of the electronic device and the display screen requires a high assembly process between the devices.
- the present application provides a method of assembling a display screen and an electronic device, a display screen assembly and a terminal, and an assembly process suitable for assembling an electronic device and a display screen.
- a method of assembling a display screen and an electronic device comprising: providing the display screen; providing the electronic device, the surface of the electronic device is provided with a frame-shaped adhesive region; The adhesive region of the device is bonded to the inner surface of the display screen, such that the electronic device, the display screen and the adhesive region together form a closed air layer; a display screen to which the electronic device is to be attached The pressure is placed in a confined space strong against the air laminate to activate the backing in the backing area.
- the display screen to which the electronic device is attached is placed in a sealed space which is stronger than the air laminate, and the sealed space and the air layer form a pressure difference.
- This pressure difference produces a uniform force to activate the backing in the backing area, thereby reducing damage to the display.
- the method further includes: attaching to the The electronic device on the inner surface of the display screen applies a pre-pressure.
- the above technical solution ensures that the adhesive layer of the electronic device and the inner surface of the display screen are sufficiently adhered by applying a pre-pressure to the electronic device to ensure the airtightness of the air layer.
- the pre-pressure has a magnitude of 2 to 5N.
- the pre-pressure is smaller than the mechanical activation pressure and can reduce damage to the screen.
- the pressure difference between the sealed space and the air layer is 3 to 5 standard atmospheric pressures.
- the pressure difference within this range can activate the backing in the gummed area without causing damage to the screen.
- the electronic device is located in an operable area of the display screen.
- the electronic device is a fingerprint chip, and a sensing area of the fingerprint chip is located The frame-shaped interior of the gummed area.
- the fingerprint chip is an optical fingerprint chip.
- the providing the electronic device includes: providing the electronic device body; and providing a backing on a surface of the electronic device body to form the frame-shaped adhesive region.
- the bonding of the electronic device to the display screen can be more conveniently realized.
- a display screen assembly includes: a display screen; an electronic device, the surface of the electronic device is provided with a frame-shaped adhesive backing area, and the adhesive backing area is adhered to the inner surface of the display screen The electronic device, the display screen, and the backing region together form a closed air layer. .
- the electronic device is located in an operable area of the display screen.
- the electronic device is a fingerprint chip, and a sensing area of the fingerprint chip is located inside a frame shape of the adhesive region. .
- the fingerprint chip is an optical fingerprint chip.
- a terminal comprising: a housing; and a display screen assembly in any possible implementation of the second aspect, the display screen assembly being disposed within the housing.
- the terminal is a mobile terminal.
- the assembled display screen is placed in a high-pressure environment, so that the pressure in the sealed space is stronger than the air laminate, thereby forming a pressure difference.
- This pressure difference can produce a uniform force on the adhesive, which can reduce the damage to the display during the activation of the adhesive.
- FIG. 1 is a structural block diagram of a mobile phone according to an embodiment of the present application.
- FIG. 2 is a schematic flow chart of a display screen and an electronic device assembly method provided by an embodiment of the present application.
- FIG. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
- FIG. 4 is a schematic view showing the assembled structure of a display screen and an electronic device according to an embodiment of the present application.
- FIG. 5 is a structural diagram of an assembly of an electronic device and a display screen according to an embodiment of the present application.
- FIG. 6 is a schematic structural diagram of a display screen assembly according to an embodiment of the present application.
- FIG. 7 is a schematic structural diagram of a terminal according to an embodiment of the present application.
- the method of assembling the display screen and the electronic device referred to in the present application can be applied to the field of mobile terminals, and can be applied to any other field in which electronic devices and display screens need to be assembled.
- the mobile terminal is taken as an example for illustration.
- the embodiment of the present application relates to a method for assembling a display screen and an electronic device, a display screen assembly and a terminal, and the display screen may be a display screen of the mobile terminal.
- the mobile terminal may include a mobile phone, a tablet computer, a personal digital assistant (PDA), a point of sales (POS), a car computer, and the like.
- PDA personal digital assistant
- POS point of sales
- FIG. 1 is a block diagram showing a partial structure of a mobile phone 100 related to an embodiment of the present application.
- a mobile phone 100 includes a radio frequency (RF) circuit 110, a memory 120, other input devices 130, a display 140, a sensor 150, an audio circuit 160, an I/O subsystem 170, a processor 180, and a power supply. 190 and other components.
- RF radio frequency
- Those skilled in the art can understand that the mobile phone structure shown in FIG. 1 does not constitute a mobile phone.
- the definition may include more or fewer components than those illustrated, or some components may be combined, or some components may be split, or different component arrangements.
- display 140 is a User Interface (UI) and that handset 100 may include more or fewer user interfaces than illustrated.
- UI User Interface
- the RF circuit 110 can be used for transmitting and receiving information or during a call, and receiving and transmitting the signal. Specifically, after receiving the downlink information of the base station, the processor 180 processes the data. In addition, the uplink data is designed to be sent to the base station.
- RF circuits include, but are not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like.
- LNA Low Noise Amplifier
- RF circuitry 110 can also communicate with the network and other devices via wireless communication.
- the wireless communication may use any communication standard or protocol, including but not limited to Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code). Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), E-mail, Short Messaging Service (SMS), etc.
- GSM Global System of Mobile communication
- GPRS General Packet
- the memory 120 can be used to store software programs and modules, and the processor 180 executes various functional applications and data processing of the mobile phone 100 by running software programs and modules stored in the memory 120.
- the memory 120 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application required for at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may be stored. Data created according to the use of the mobile phone 100 (such as audio data, phone book, etc.).
- memory 120 can include high speed random access memory, and can also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
- Other input devices 130 can be used to receive input numeric or character information, as well as generate key signal inputs related to user settings and function controls of the handset 100.
- other input devices 130 may include, but are not limited to, a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and light mice (the light mouse is not sensitive to display visual output).
- function keys such as volume control buttons, switch buttons, etc.
- trackballs mice, joysticks, and light mice (the light mouse is not sensitive to display visual output).
- Other input devices 130 are coupled to other input device controllers 171 of I/O subsystem 170 for signal interaction with processor 180 under the control of other device input controllers 171.
- the display screen 140 can be used to display information input by the user or information provided to the user as well as various menus of the mobile phone 100, and can also accept user input.
- the specific display screen 140 may include a display panel 141 and a touch panel 142.
- the display panel 141 can be configured by using a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.
- the touch panel 142 also referred to as a touch screen, a touch sensitive screen, etc., can collect contact or non-contact operations on or near the user (eg, the user uses any suitable object or accessory such as a finger, a stylus, etc. on the touch panel 142.
- the operation in the vicinity of the touch panel 142 may also include a somatosensory operation; the operation includes a single-point control operation, a multi-point control operation, and the like, and drives the corresponding connection device according to a preset program.
- the touch panel 142 may include two parts: a touch detection device and a touch controller. Wherein, the touch detection device detects the touch orientation and posture of the user, and detects a signal brought by the touch operation, and transmits a signal to the touch controller; the touch controller receives the touch information from the touch detection device, and converts the signal into a processor. The processed information is sent to the processor 180 and can receive commands from the processor 180 and execute them.
- the touch panel 142 can be implemented by using various types such as resistive, capacitive, infrared, and surface acoustic waves, and the touch panel 142 can be implemented by any technology developed in the future. Further, the touch panel 142 can cover the display surface Board 141. The user can operate on or near the touch panel 142 covered on the display panel 141 according to the content displayed by the display panel 141 (including, but not limited to, a soft keyboard, a virtual mouse, a virtual button, an icon, etc.).
- the touch panel 142 After the touch panel 142 detects an operation thereon or nearby, it is transmitted to the processor 180 through the I/O subsystem 170 to determine user input, and then the processor 180 passes through the I/O subsystem 170 on the display panel 141 according to the user input. Provide corresponding visual output on it.
- the touch panel 142 and the display panel 141 are used as two separate components to implement the input and input functions of the mobile phone 100 in FIG. 1, in some embodiments, the touch panel 142 may be integrated with the display panel 141. The input and output functions of the mobile phone 100 are implemented.
- the handset 100 can also include at least one type of sensor 150, such as a light sensor, motion sensor, and other sensors.
- the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 141 according to the brightness of the ambient light, and the proximity sensor may close the display panel 141 when the mobile phone 100 moves to the ear. / or backlight.
- the accelerometer sensor can detect the magnitude of acceleration in all directions (usually three axes). When it is stationary, it can detect the magnitude and direction of gravity. It can be used to identify the gesture of the mobile phone (such as horizontal and vertical screen switching, related Game, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping), etc.
- the mobile phone 100 can also be configured with gyroscopes, barometers, hygrometers, thermometers, infrared sensors and other sensors, here Let me repeat.
- the audio circuit 160, the speaker 161, and the microphone 162 can provide an audio interface between the user and the handset 100.
- the audio circuit 160 can transmit the converted audio data to the speaker 161 for conversion to the sound signal output by the speaker 161; on the other hand, the microphone 162 converts the collected sound signal into a signal, which is received by the audio circuit 160.
- the audio data is converted to audio data, which is then output to the RF circuit 108 for transmission to, for example, another mobile phone, or the audio data is output to the memory 120 for further processing.
- the I/O subsystem 170 is used to control external devices for input and output, and may include other device input controllers 171, sensor controllers 172, and display controllers 173.
- one or more other input control device controllers 171 receive signals from other input devices 130 and/or send signals to other input devices 130.
- Other input devices 130 may include physical buttons (press buttons, rocker buttons, etc.) , dial, slide switch, joystick, click wheel, light mouse (light mouse is a touch-sensitive surface that does not display visual output, or an extension of a touch-sensitive surface formed by a touch screen). It is worth noting that other input control device controllers 171 can be connected to any one or more of the above devices.
- Display controller 173 in I/O subsystem 170 receives signals from display 140 and/or transmits signals to display 140. After the display 140 detects the user input, the display controller 173 converts the detected user input into an interaction with the user interface object displayed on the display screen 140, ie, implements human-computer interaction. Sensor controller 172 can receive signals from one or more sensors 150 and/or send signals to one or more sensors 150.
- the processor 180 is the control center of the handset 100, connecting various portions of the entire handset with various interfaces and lines, by running or executing software programs and/or modules stored in the memory 120, and recalling data stored in the memory 120, The various functions and processing data of the mobile phone 100 are executed to perform overall monitoring of the mobile phone.
- the processor 180 may include one or more processing units; preferably, the processor 180 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, an application, and the like.
- the modem processor primarily handles wireless communications. It can be understood that the above modem processor may not be integrated into the processor 180.
- the handset 100 also includes a power source 190 (such as a battery) that supplies power to the various components.
- a power source 190 such as a battery
- the power source can be logically coupled to the processor 180 via a power management system to manage functions such as charging, discharging, and power consumption through the power management system.
- the mobile phone 100 may further include a camera module, a Bluetooth module, an infrared module, and the like, and details are not described herein again.
- the mobile phone 100 can also include a fingerprint chip.
- the fingerprint chip can be, for example, an optical fingerprint chip, or a capacitive fingerprint chip, a radio frequency fingerprint chip, a temperature difference sensing fingerprint chip, an ultrasonic fingerprint chip, or the like.
- the fingerprint chip is generally set to a front-mounted fingerprint structure, including a front button type fingerprint structure and an under glass fingerprint structure.
- the front button type fingerprint structure For the front button type fingerprint structure, a through hole is required on the screen cover, and then the fingerprint chip is embedded therein. In the position where the fingerprint chip is placed at the home button, there is the following problem: the home button is easily damaged, and the seal between the fingerprint chip and the screen cover is not suitable for dustproof and waterproof. These problems make the cancellation of the home button a trend.
- the cancel of the home button means that the screen cover is not broken.
- the fingerprint chip is placed under the screen cover, thus creating a front under glass fingerprint structure.
- the front under glass fingerprint structure is mainly a capacitive fingerprint structure.
- the fingerprint module is assembled under the display screen by a glue of a specific dielectric constant. Taking a liquid crystal display as an example, the liquid crystal display usually includes a screen cover, a touch layer and a display layer, and the electronic device can be mounted, for example, on the inner side of the display screen, that is, below the display layer of the display screen.
- the electronic device is attached to the object to be adhered by the pressure sensitive adhesive, and then the electronic device is pressurized by mechanical pressure. Under the combined action of increasing pressure and pressing time, the pressure sensitive adhesive is brought to the corresponding bonding strength, and finally the pressure sensitive adhesive is activated.
- the preloading process of this assembly method requires the parallelism of the indenter, the head speed, and the pressure uniformity. Therefore, during the pre-pressing process, the pressing scene is easily affected by factors such as the parallelism of the indenter, the head speed, and the pressure uniformity. These factors place relatively high demands on the strength of the object to be bonded.
- FIG. 2 is a schematic flow chart of a display screen and an electronic device assembly method provided by an embodiment of the present application.
- the method of FIG. 2 may include steps 210-240, which are described in detail below.
- step S210 a display screen is provided.
- step S220 an electronic device is provided, the surface of which is provided with a frame-shaped backing area.
- the electronic device in the embodiment of the present application may be a fingerprint chip, or may be a lens module, an infrared module, or the like.
- the fingerprint chip usually includes a sensing area and an edge area.
- a conventional fingerprint chip generally includes a substrate, and an intermediate position of the substrate is a sensing area of the chip, and the sensing area is used to identify an input signal of a user's fingerprint.
- the edge region of the fingerprint chip is provided with a frame-shaped adhesive region, and the adhesive region is usually disposed at a position outside the sensing region. The setting of the adhesive area should avoid the sensing area, so as to ensure that the sensing function of the sensing area is not affected.
- the adhesive region in the embodiment of the present application may be any shape, as long as the region can constitute a closed region, which can be understood as a frame-shaped adhesive region.
- the shape of the adhesive region may be square, round, or elliptical, diamond, etc., this application This is not specifically limited.
- FIG. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
- the backing area of the electronic device can be used to set the backing 310.
- the shape of the adhesive can be square, circular, or elliptical or diamond-shaped, which is not specifically limited in the present application.
- the adhesive can be set by the electronic device with the adhesive before leaving the factory, or it can be set during the installation process. This embodiment of the present application does not specifically limit this.
- the electronic device is provided with a double-sided tape before leaving the factory, and the release paper can be used before being peeled off.
- the glue may be applied to the surface of the electronic device before the bonding, or the double-sided tape may be provided on the surface of the electronic device to be bonded by using glue or double-sided tape.
- the material of the adhesive is not specifically limited in the embodiment of the present application, and may be any adhesive adhesive.
- the backing may be rubber or a resin type rubber or the like.
- step S230 the adhesive backing area of the electronic device is bonded to the inner surface of the display screen, so that the electronic device, the display screen and the adhesive backing area together form a sealed air layer.
- a closed air layer 420 is formed by the sidewall of the adhesive 430, the display screen 440, and the inner surface of the electronic device 410. Since the adhesive 430 is tacky, the air layer 420 between the back-bonded display screen 440 and the electronic device 410 is sealed such that the pressure within the enclosed air layer 420 remains unchanged.
- the backing area of the electronic device is attached to the inner surface of the display screen, which is not specifically limited in the embodiment of the present application.
- the backing area of the electronic device in a normal pressure environment, can be manually attached to the inner surface of the display screen.
- the glue backing area of the electronic device can also be attached to the inner surface of the display screen by a machine.
- the air layer communicates with the outside air pressure.
- the air layer is a closed air layer, and the pressure of the air layer is the same as the external atmospheric pressure.
- the pressure of the air layer is standard atmospheric pressure.
- step S240 the display screen to which the electronic device is attached is placed in a sealed space that is stronger than the air laminate to activate the adhesive in the adhesive region.
- step S240 there are many implementations of step S240, and the pressure difference can be achieved by increasing the pressure of the sealed space.
- the display screen to which the electronic device is attached can be placed in a sealed space of normal pressure, and then the sealed space is filled with gas.
- the pressure in the closed space after the gas is filled is increased, so that the pressure in the closed space is stronger than the pressure in the air layer.
- the pressure can be increased by compressing the volume of the closed space such that the pressure of the closed space is stronger than the pressure of the air layer.
- the electronic device is attached to the inner surface of the display screen in a normal pressure environment.
- the pressure of the air layer sealed after bonding is the same as the external atmospheric pressure, which is 1 standard atmospheric pressure.
- the display assembly can be placed in a confined space with a pressure of 4 to 6 standard atmospheres. Therefore, the pressure of the sealed space and the air lamination strongly form a pressure difference between the upper and lower surfaces of the electronic device, and the pressure difference is 3 to 5 standard atmospheres.
- the pressure in the closed space is stronger than the pressure in the air layer, so that there is a pressure difference between the pressure of the closed space and the pressure of the air layer.
- the pressure difference acts on the electronic device, and can generate a uniform force on the adhesive, so that the adhesive receives sufficient bonding force and finally activates the adhesive.
- Activation is more uniform using the differential pressure method. It is not affected by mechanical pressure, the pressure head is not parallel, the pressure is unstable, and the speed is not uniform, which can reduce the damage to the screen.
- a pre-stress may be applied to the electronic device that is attached to the inner surface of the display screen.
- the electronic device may be pre-pressed by manual means, or may be pre-compressed by mechanical pressure. This embodiment of the present application does not specifically limit this. As an example, after the electronic device is attached to the inner surface of the display screen, a certain pre-stress can be applied to the electronic device manually, so that the adhesive on the electronic device can fully conform to the display screen. As another example, the electronic device may be pre-compressed using mechanical pre-pressure after the electronic device is attached to the inner surface of the display screen, such that the adhesive on the electronic device is sufficiently conformable to the display screen.
- pre-pressure lamination adhesive ensures that the adhesive area of the electronic device is fully adhered to the inner surface of the display screen, further ensuring a constant pressure difference between the sealed space and the air layer, thereby generating a uniform force to activate the adhesive area.
- the adhesive in the middle reduces the indentation caused by the display.
- the pre-pressure has a size of 2 to 5N.
- the pre-stress not only ensures that the electronic device and the display screen are sufficiently fitted, but also that the pre-pressure is less than the mechanical activation pressure, and the damage to the screen can be reduced.
- the electronic device is located in an operable area of the display screen.
- the display screen of the mobile phone is getting bigger and bigger, and the user demand pushes the display screen to the full screen.
- the fingerprint chip needs to be turned to the operable area of the display for setting.
- the assembly method of the embodiment of the present application can be applied to an operable area of a mobile phone display screen, and can reduce damage to the screen.
- the display screen assembly of the embodiment of the present application may be a display screen assembly obtained by the assembly method described in any of the above embodiments.
- the display assembly includes a display screen 520 and electronics 510.
- the electronic device 510 is disposed below the display screen 520.
- the display assembly can include a display screen 640 and electronics 610.
- the surface of the electronic device 610 is provided with a frame-shaped backing area 630.
- the adhesive region 630 is bonded to the inner surface of the display screen 640, and the electronic device 610, the display screen 640 and the adhesive backing region 630 together form a closed air layer 620.
- the display panel assembly provided by the embodiment of the present application assembles the electronic device and the display screen by means of lamination, and the processing process is simple.
- the embodiment of the present application further provides a terminal.
- the terminal can include a housing 710 and a display assembly 720 disposed on the housing 710.
- the display assembly 720 includes electronics 730 located below the display.
- the display assembly can employ the display assembly described in any of the above embodiments.
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Abstract
本申请提供了一种显示屏和电子器件的组装方法,包括:提供所述显示屏;提供所述电子器件,所述电子器件的表面设置有框形的背胶区域;将所述电子器件的背胶区域与所述显示屏的内表面贴合,使所述电子器件、所述显示屏和所述背胶区域共同形成密闭的空气层;将贴合了所述电子器件的显示屏放置到压强大于所述空气层压强的密闭空间中,以激活所述背胶区域中的背胶。根据本申请提供的显示屏和电子器件的组装方法,能够产生均匀的作用力来激活背胶区域中的背胶,从而减少加工过程对屏幕造成的损伤。
Description
本申请涉及终端领域,并且更具体地,涉及一种显示屏和电子器件的组装方法、显示屏组件及终端。
随着技术的发展,越来越多的电子器件需要与显示屏组装在一起。以移动终端为例,目前,移动终端的用户对显示屏的占屏比要求越来越高,因此,传统的前置按键型指纹芯片需要安装在显示屏的下方,形成玻璃下方(under glass,UG)结构。
由于显示屏具有易损伤的特性,因此,电子器件与显示屏的组装对器件之间的组装工艺要求较高。
发明内容
本申请提供一种显示屏和电子器件的组装方法、显示屏组件及终端,提供一种适于对电子器件和显示屏进行组装的组装工艺。
第一方面,提供了一种显示屏和电子器件的组装方法,包括:提供所述显示屏;提供所述电子器件,所述电子器件的表面设置有框形的背胶区域;将所述电子器件的背胶区域与所述显示屏的内表面贴合,使所述电子器件、所述显示屏和所述背胶区域共同形成密闭的空气层;将贴合了所述电子器件的显示屏放置到压强大于所述空气层压强的密闭空间中,以激活所述背胶区域中的背胶。
上述技术方案将贴合了电子器件的显示屏放置在压强大于空气层压强的密闭空间中,进而该密闭空间与空气层形成压强差。该压强差能够产生均匀的作用力来激活背胶区域中的背胶,从而能够减少对显示屏造成损伤。
在一种可能的实现方式中,在所述将贴合了所述电子器件的显示屏放置到压强大于所述空气层压强的密闭空间中之前,所述方法还包括:对贴合在所述显示屏内表面的所述电子器件施加预压力。
上述技术方案通过对电子器件施加预压力,从而确保电子器件的背胶区域与显示屏的内表面充分贴合,保证空气层的密闭性。
在一种可能的实现方式中,所述预压力的大小为2~5N。
该预压力的大小较机械激活压力小,能够减少对屏幕的损伤。
在一种可能的实现方式中,所述密闭空间与所述空气层的压强差为3~5个标准大气压。
在该范围内的压强差能够激活背胶区域中的背胶,并且不会对屏幕造成损伤。
在一种可能的实现方式中,所述电子器件位于所述显示屏的可操作区。
在一种可能的实现方式中,所述电子器件为指纹芯片,所述指纹芯片的传感区域位于
所述背胶区域的框形的内部。
在一种可能的实现方式中,所述指纹芯片为光学指纹芯片。
在一种可能的实现方式中,所述提供所述电子器件,包括:提供所述电子器件本体;在所述电子器件本体的表面设置背胶,以形成所述框形的背胶区域。
通过在电子器件的本体上设置背胶,能够更方便地实现电子器件与显示屏的贴合。
第二方面,提供了一种显示屏组件,包括:显示屏;电子器件,所述电子器件的表面设置有框形的背胶区域,所述背胶区域与所述显示屏的内表面贴合,所述电子器件、所述显示屏和所述背胶区域共同形成了密闭的空气层。。
在一种可能的实现方式中,所述电子器件位于所述显示屏的可操作区。
在一种可能的实现方式中,所述电子器件为指纹芯片,所述指纹芯片的传感区域位于所述背胶区域的框形的内部。。
在一种可能的实现方式中,所述指纹芯片为光学指纹芯片。
第三方面,提供了一种终端,包括:壳体;以及第二方面的任意可能的实现方式中的显示屏组件,所述显示屏组件设置在所述壳体内。
在一种可能的实现方式中,所述终端为移动终端。
本申请通过将组装后的显示屏幕设置在高压环境中,使得密闭空间的压强大于空气层压强,从而形成压强差。该压强差能够对背胶产生均匀的作用力,该均匀的作用力在激活背胶的过程中,能够减少对显示屏造成损伤。
图1是本申请实施例提供的手机的结构框图。
图2是本申请实施例提供的显示屏和电子器件组装方法的示意性流程图。
图3是本申请实施例提供的电子器件的结构示意图。
图4是本申请实施例的显示屏与电子器件的组装结构示意图。
图5是本申请实施例提供的一种电子器件与显示屏的组装的结构图。
图6是本申请实施例的显示屏组件的结构示意图。
图7是本申请实施例的终端的结构示意图。
本申请提及的显示屏和电子器件的组装方法可应用于移动终端领域,也可应用于需要将电子器件和显示屏进行组装的任意其他领域。
下面以移动终端为例进行举例说明。
本申请实施例涉及一种显示屏和电子器件的组装方法、显示屏组件及终端,所述显示屏可以为移动终端的显示屏。所述移动终端可以包括手机、平板电脑、个人数字助理(Personal Digital Assistant,PDA)、销售终端(Point of Sales,POS)、车载电脑等。
以移动终端为手机为例,图1示出的是与本申请实施例相关的手机100的部分结构的框图。参考图1,手机100包括、射频(Radio Frequency,RF)电路110、存储器120、其他输入设备130、显示屏140、传感器150、音频电路160、I/O子系统170、处理器180、以及电源190等部件。本领域技术人员可以理解,图1中示出的手机结构并不构成对手机
的限定,可以包括比图示更多或更少的部件,或者组合某些部件,或者拆分某些部件,或者不同的部件布置。本领领域技术人员可以理解显示屏140属于用户界面(User Interface,UI),且手机100可以包括比图示更多或者更少的用户界面。
下面结合图1,对手机100的各个构成部件进行具体的介绍:
RF电路110可用于收发信息或通话过程中,信号的接收和发送,特别地,将基站的下行信息接收后,给处理器180处理;另外,将设计上行的数据发送给基站。通常,RF电路包括但不限于天线、至少一个放大器、收发信机、耦合器、低噪声放大器(Low Noise Amplifier,LNA)、双工器等。此外,RF电路110还可以通过无线通信与网络和其他设备通信。所述无线通信可以使用任一通信标准或协议,包括但不限于全球移动通讯系统(Global System of Mobile communication,GSM)、通用分组无线服务(General Packet Radio Service,GPRS)、码分多址(Code Division Multiple Access,CDMA)、宽带码分多址(Wideband Code Division Multiple Access,WCDMA)、长期演进(Long Term Evolution,LTE)、电子邮件、短消息服务(Short Messaging Service,SMS)等。
存储器120可用于存储软件程序以及模块,处理器180通过运行存储在存储器120的软件程序以及模块,从而执行手机100的各种功能应用以及数据处理。存储器120可主要包括存储程序区和存储数据区,其中,存储程序区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能、图象播放功能等)等;存储数据区可存储根据手机100的使用所创建的数据(比如音频数据、电话本等)等。此外,存储器120可以包括高速随机存取存储器,还可以包括非易失性存储器,例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。
其他输入设备130可用于接收输入的数字或字符信息,以及产生与手机100的用户设置以及功能控制有关的键信号输入。具体地,其他输入设备130可包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆、光鼠(光鼠是不显示可视输出的触摸敏感表面,或者是由触摸屏形成的触摸敏感表面的延伸)等中的一种或多种。其他输入设备130与I/O子系统170的其他输入设备控制器171相连接,在其他设备输入控制器171的控制下与处理器180进行信号交互。
显示屏140可用于显示由用户输入的信息或提供给用户的信息以及手机100的各种菜单,还可以接受用户输入。具体的显示屏140可包括显示面板141,以及触控面板142。其中显示面板141可以采用液晶显示器(Liquid Crystal Display,LCD)、有机发光二极管(Organic Light-Emitting Diode,OLED)等形式来配置显示面板141。触控面板142,也称为触摸屏、触敏屏等,可收集用户在其上或附近的接触或者非接触操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板142上或在触控面板142附近的操作,也可以包括体感操作;该操作包括单点控制操作、多点控制操作等操作类型。),并根据预先设定的程式驱动相应的连接装置。可选的,触控面板142可包括触摸检测装置和触摸控制器两个部分。其中,触摸检测装置检测用户的触摸方位、姿势,并检测触摸操作带来的信号,将信号传送给触摸控制器;触摸控制器从触摸检测装置上接收触摸信息,并将它转换成处理器能够处理的信息,再送给处理器180,并能接收处理器180发来的命令并加以执行。此外,可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板142,也可以采用未来发展的任何技术实现触控面板142。进一步的,触控面板142可覆盖显示面
板141。用户可以根据显示面板141显示的内容(该显示内容包括但不限于,软键盘、虚拟鼠标、虚拟按键、图标等),在显示面板141上覆盖的触控面板142上或者附近进行操作。触控面板142检测到在其上或附近的操作后,通过I/O子系统170传送给处理器180以确定用户输入,随后处理器180根据用户输入通过I/O子系统170在显示面板141上提供相应的视觉输出。虽然在图1中,触控面板142与显示面板141是作为两个独立的部件来实现手机100的输入和输入功能,但是在某些实施例中,可以将触控面板142与显示面板141集成而实现手机100的输入和输出功能。
手机100还可包括至少一种传感器150,比如光传感器、运动传感器以及其他传感器。具体地,光传感器可包括环境光传感器及接近传感器,其中,环境光传感器可根据环境光线的明暗来调节显示面板141的亮度,接近传感器可在手机100移动到耳边时,关闭显示面板141和/或背光。作为运动传感器的一种,加速计传感器可检测各个方向上(一般为三轴)加速度的大小,静止时可检测出重力的大小及方向,可用于识别手机姿态的应用(比如横竖屏切换、相关游戏、磁力计姿态校准)、振动识别相关功能(比如计步器、敲击)等;至于手机100还可配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器,在此不再赘述。
音频电路160、扬声器161,麦克风162可提供用户与手机100之间的音频接口。音频电路160可将接收到的音频数据转换后的信号,传输到扬声器161,由扬声器161转换为声音信号输出;另一方面,麦克风162将收集的声音信号转换为信号,由音频电路160接收后转换为音频数据,再将音频数据输出至RF电路108以发送给比如另一手机,或者将音频数据输出至存储器120以便进一步处理。
I/O子系统170用来控制输入输出的外部设备,可以包括其他设备输入控制器171、传感器控制器172、显示控制器173。可选的,一个或多个其他输入控制设备控制器171从其他输入设备130接收信号和/或者向其他输入设备130发送信号,其他输入设备130可以包括物理按钮(按压按钮、摇臂按钮等)、拨号盘、滑动开关、操纵杆、点击滚轮、光鼠(光鼠是不显示可视输出的触摸敏感表面,或者是由触摸屏形成的触摸敏感表面的延伸)。值得说明的是,其他输入控制设备控制器171可以与任一个或者多个上述设备连接。所述I/O子系统170中的显示控制器173从显示屏140接收信号和/或者向显示屏140发送信号。显示屏140检测到用户输入后,显示控制器173将检测到的用户输入转换为与显示在显示屏140上的用户界面对象的交互,即实现人机交互。传感器控制器172可以从一个或者多个传感器150接收信号和/或者向一个或者多个传感器150发送信号。
处理器180是手机100的控制中心,利用各种接口和线路连接整个手机的各个部分,通过运行或执行存储在存储器120内的软件程序和/或模块,以及调用存储在存储器120内的数据,执行手机100的各种功能和处理数据,从而对手机进行整体监控。可选的,处理器180可包括一个或多个处理单元;优选的,处理器180可集成应用处理器和调制解调处理器,其中,应用处理器主要处理操作系统、用户界面和应用程序等,调制解调处理器主要处理无线通信。可以理解的是,上述调制解调处理器也可以不集成到处理器180中。
手机100还包括给各个部件供电的电源190(比如电池),优选的,电源可以通过电源管理系统与处理器180逻辑相连,从而通过电源管理系统实现管理充电、放电、以及功耗等功能。
尽管未示出,手机100还可以包括摄像头模块、蓝牙模块、红外模块等,在此不再赘述。
此外,手机100还可以包含指纹芯片。指纹芯片例如可以是光学指纹芯片,也可以是电容式指纹芯片、射频式指纹芯片、温差感应式指纹芯片、超声波式指纹芯片等。
传统技术中,指纹芯片一般设为前置式指纹结构,包括前置按键型指纹结构和under glass指纹结构。
前置按键型指纹结构,需要在屏幕盖板上设置一个通孔,然后将指纹芯片嵌入其中。这种将指纹芯片放在主(home)键的位置,会存在以下问题:home键容易损坏,指纹芯片与屏幕盖板之间的密封不宜做到防尘防水。这些问题使得取消home键成为发展趋势。
home键的取消,意味着屏幕盖板不破孔。将指纹芯片放置到屏幕盖板的下方,于是便产生了前置under glass指纹结构。前置under glass指纹结构,主要为电容式指纹结构。通过特定介电常数的胶,将指纹模组组装在显示屏的下方。以液晶显示屏为例,液晶显示屏通常包含屏幕盖板、触控层以及显示层,该电子器件例如可以安装在显示屏的内侧,即显示屏的显示层的下方。
随着用户对手机屏占比的需求,手机趋近于全屏化。留给指纹识别的区域越来越小,将指纹芯片设置在显示屏的下方成为发展趋势。如何将指纹芯片安装在显示屏的下方成为亟需解决的问题。
传统技术提供了一种基于粘结的电子器件的组装方式,这种方式大致过程如下:
通过压敏胶使电子器件与被粘物体贴合,然后采用机械加压的方式对电子器件施加压力。在增加压力和压合时间的共同作用下,使压敏胶达到相应的粘接强度,最终激活压敏胶。
但是,这种组装方式的预压过程对压头平行度,压头速度,压力均匀性均有要求。因此,在预压过程中,压合场景容易受压头平行度,压头速度,压力均匀性等因素的影响。这些因素对被粘物体的强度提出了比较高的要求。
考虑到显示屏具有易损伤的特性,采用上述方式组装电子器件和显示屏,容易对显示屏造成损伤。如在显示屏表面产生压痕等,降低显示屏的性能,且影响外观。
下面结合图2,详细描述本申请实施例提供的显示屏和电子器件的组装方法,可以有效避免组装过程带来的显示屏的损伤。
图2是本申请实施例提供的显示屏和电子器件组装方法的示意性流程图。图2的方法可以包括步骤210-240,下面分别对步骤210-240进行详细描述。
在步骤S210中,提供显示屏。
在步骤S220中,提供电子器件,所述电子器件的表面设置有框形的背胶区域。
本申请实施例的电子器件可以为指纹芯片,也可以为镜头模块、红外模块等。以电子器件为指纹芯片为例,指纹芯片通常包含感测区域和边缘区域。传统的指纹芯片一般包括基板,基板的中间位置为芯片的感测区域,该感测区域用来识别用户指纹的输入信号。指纹芯片的边缘区域设置有框形的背胶区域,背胶区域通常设置在感测区域之外的位置。背胶区域的设置要避开感测区域,从而能够保证不影响感测区域的感测功能。本申请实施例中的背胶区域可以是任意形状,只要该区域能构成一个封闭区域,都可以理解为框形的背胶区域。例如,该背胶区域的形状可以为方形、圆形,还可以为椭圆形、菱形等,本申请
对此不做具体限定。
图3是本申请实施例的电子器件的结构示意图。电子器件的背胶区域可以用来设置背胶310。结合上文对背胶区域的描述可以看出,背胶的形状可以为方形、圆形,也可以为椭圆形、菱形,本申请对此不做具体限定。
背胶的设置方式可以是在出厂前电子器件就自带有背胶,也可以是在安装过程再进行设置。本申请实施例对此不做具体限定。作为一个示例,该电子器件在出厂前就自带有双面胶,在进行贴合前将隔离纸剥离即可使用。作为另一个示例,在进行贴合前,可以在电子器件的表面涂抹胶水,也可以在电子器件的表面设置双面胶,以利用胶水或双面胶进行贴合。
本申请实施例对背胶的材质不做具体限定,可以是任意具有粘性的背胶。例如,该背胶可以为橡胶,也可以为树脂型胶等。
在步骤S230中,将电子器件的背胶区域与显示屏的内表面贴合,使所述电子器件、所述显示屏和所述背胶区域共同形成密闭的空气层。
如图4所示,在将电子器件410与显示屏440的内表面贴合之后,由背胶430的侧壁、显示屏440和电子器件410的内表面构成一个密闭的空气层420。由于背胶430具有粘性,由背胶粘结的显示屏440和电子器件410之间的空气层420被密封,使得该密闭的空气层420内的压强保持不变。
电子器件的背胶区域与显示屏的内表面贴合方式有多种,本申请实施例对此不做具体限定。作为一个示例,在常压环境下,可以人工将电子器件的背胶区域与显示屏的内表面贴合。作为另一个示例,也可以通过机器将电子器件的背胶区域与显示屏的内表面贴合。
在该背胶区域与显示屏的内表面贴合的过程中,空气层与外界气压相通。在贴合之后,由于背胶具有密封性能,该空气层为密闭的空气层,该空气层的压强与外界大气压相同。例如,在标准大气压下进行贴合时,该空气层的压强为标准大气压。
在步骤S240中,将贴合了电子器件的显示屏放置到压强大于空气层压强的密闭空间中,以激活背胶区域中的背胶。
步骤S240的实现方式有很多种,可以通过增大密闭空间的压强来实现压强差。本申请实施例对此不做具体限定。作为一个示例,可以将贴合了电子器件的显示屏放到一个常压的密闭空间中,然后在该密闭空间中充入气体。充入气体后的密闭空间压强增大,使得该密闭空间的压强大于空气层的压强。作为另一个示例,可以通过压缩该密闭空间的体积来增大压强,使该密闭空间的压强大于空气层的压强。
如图4所示,作为一个示例,在常压的环境下,将电子器件与显示屏的内表面进行贴合。贴合后密闭的空气层的压强与外界大气压相同,为1个标准大气压。
将贴合后的显示屏组件放置到压强大于空气层压强的密闭空间。作为一个示例,可以将显示屏组件放置到压强为4~6个标准大气压的密闭空间中。从而,该密闭空间的压强与空气层压强在电子器件的上下表面形成压强差,该压强差的大小为3~5个标准大气压。
密闭空间的压强大于空气层的压强,使密闭空间的压强与空气层的压强之间存在压强差。该压强差作用在电子器件上,能够对背胶产生均匀的作用力,使得背胶接收到足够的粘结外力,最终激活背胶。采用压差法的激活方式,激活更均匀。不受机械压力激活压头不平行,压力不稳定,速度不均匀等影响,能够减少对屏幕造成损伤。
可选地,作为一个实施例,在步骤S240之前,可以对贴合在显示屏内表面的电子器件施加预压力。
本申请实施例可以采用人工的方式对电子器件进行预压,也可以通过机械压力进行预压。本申请实施例对此不做具体限定。作为一个示例,在将电子器件与显示屏的内表面贴合之后,可以采用人工的方式对电子器件施加一定的预压力,使得电子器件上的背胶能够与显示屏充分贴合。作为另一个示例,也可以在电子器件与显示屏的内表面贴合之后,使用机械预压力对电子器件进行预压,使得电子器件上的背胶能够与显示屏充分贴合。
使用预压力压合背胶,能够确保电子器件的背胶区域与显示屏的内表面充分贴合,进一步保证密闭空间与空气层形成固定的压强差,进而产生均匀的作用力来激活背胶区域中的背胶,减少对显示屏造成的压痕。
可选地,作为一个实施例,该预压力的大小为2~5N。该预压力不仅能保证电子器件与显示屏充分贴合,而且该预压力较机械激活压力小,能够减少对屏幕的损伤。
可选地,作为一个实施例,该电子器件位于显示屏的可操作区。
以移动终端为例,手机的显示屏越做越大,用户需求推动显示屏向全屏化的方向发展。指纹芯片需要转向显示屏的可操作区进行设置。本申请实施例的组装方法可以应用于手机显示屏的可操作区,并且能够减少对屏幕的损伤。
图5和图6是该显示屏组件的结构示意图。本申请实施例的显示屏组件可以是由上述任一实施例描述的组装方法得到的显示屏组件。
如图5所示,该显示屏组件包括显示屏520和电子器件510。该电子器件510设置在显示屏520的下方。
作为一个示例,如图6所示。该显示屏组件可以包括显示屏640和电子器件610。该电子器件610的表面设置有框形的背胶区域630。该背胶区域630与显示屏640的内表面贴合,所述电子器件610、所述显示屏640和所述背胶区域630共同形成了密闭的空气层620。
本申请实施例提供的显示屏组件,采用贴合的方式将电子器件和显示屏组装在一起,加工工艺简单。
本申请实施例还提供了一种终端。如图7所示,该终端可以包括壳体710以及设置在壳体710上的显示屏组件720。该显示屏组件720包括位于显示屏下方的电子器件730。该显示屏组件可以采用上文任意实施例描述的显示屏组件。
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。
Claims (14)
- 一种显示屏和电子器件的组装方法,其特征在于,包括:提供所述显示屏;提供所述电子器件,所述电子器件的表面设置有框形的背胶区域;将所述电子器件的背胶区域与所述显示屏的内表面贴合,使所述电子器件、所述显示屏和所述背胶区域共同形成密闭的空气层;将贴合了所述电子器件的显示屏放置到压强大于所述空气层压强的密闭空间中,以激活所述背胶区域中的背胶。
- 如权利要求1所述的方法,其特征在于,在所述将贴合了所述电子器件的显示屏放置到压强大于所述空气层压强的密闭空间中之前,所述方法还包括:对贴合在所述显示屏内表面的所述电子器件施加预压力。
- 如权利要求2所述的方法,其特征在于,所述预压力的大小为2~5N。
- 如权利要求1至3中任一项所述的方法,其特征在于,所述密闭空间与所述空气层的压强差为3~5个标准大气压。
- 如权利要求1至4中任一项所述的方法,其特征在于,所述电子器件位于所述显示屏的可操作区。
- 如权利要求1至5中任一项所述的方法,其特征在于,所述电子器件为指纹芯片,所述指纹芯片的传感区域位于所述背胶区域的框形的内部。
- 如权利要求6所述的方法,其特征在于,所述指纹芯片为光学指纹芯片。
- 如权利要求1至7中任一项所述的方法,其特征在于,所述提供所述电子器件,包括:提供所述电子器件本体;在所述电子器件本体的表面设置背胶,以形成所述框形的背胶区域。
- 一种显示屏组件,其特征在于,包括:显示屏;电子器件,所述电子器件的表面设置有框形的背胶区域,所述背胶区域与所述显示屏的内表面贴合,所述电子器件、所述显示屏和所述背胶区域共同形成了密闭的空气层。
- 如权利要求9所述的显示屏组件,其特征在于,所述电子器件位于所述显示屏的可操作区。
- 如权利要求9或10所述的显示屏组件,其特征在于,所述电子器件为指纹芯片,所述指纹芯片的传感区域位于所述背胶区域的框形的内部。
- 如权利要求11所述的显示屏组件,其特征在于,所述指纹芯片为光学指纹芯片。
- 一种终端,其特征在于,包括:壳体;如权利要求9至12中任一项所述的显示屏组件,所述显示屏组件设置在所述壳体内。
- 根据权利要求13所述的终端,其特征在于,所述终端为移动终端。
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