WO2019103553A1 - Flexible circuit board assembly having fixing means and lamp unit using same - Google Patents

Flexible circuit board assembly having fixing means and lamp unit using same Download PDF

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Publication number
WO2019103553A1
WO2019103553A1 PCT/KR2018/014623 KR2018014623W WO2019103553A1 WO 2019103553 A1 WO2019103553 A1 WO 2019103553A1 KR 2018014623 W KR2018014623 W KR 2018014623W WO 2019103553 A1 WO2019103553 A1 WO 2019103553A1
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WO
WIPO (PCT)
Prior art keywords
protruding portion
circuit board
penetrating
board assembly
flexible circuit
Prior art date
Application number
PCT/KR2018/014623
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French (fr)
Korean (ko)
Inventor
허정욱
박범균
임광조
Original Assignee
엘이디라이텍(주)
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Priority claimed from KR1020180146323A external-priority patent/KR102148019B1/en
Application filed by 엘이디라이텍(주) filed Critical 엘이디라이텍(주)
Publication of WO2019103553A1 publication Critical patent/WO2019103553A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to a flexible circuit board assembly having fixing means and a lamp unit using the flexible circuit board assembly. More specifically, the present invention relates to a flexible circuit board assembly having fixing means capable of fixing a flexible circuit board assembly without a stacking process, .
  • Stacking is one of the coupling techniques between parts.
  • a staking boss having a protruding shape made of a thermoplastic material is inserted and fixed in a hole portion of a part to be joined. Then, the joining boss is squeezed or heated by a staking jig to spread the joining boss portion to join the two parts.
  • a typical LED module is a printed circuit board assembly that is fixed to an injection molded back plate and a back plate.
  • the printed circuit board assembly generally comprises a heat-radiating layer, a printed circuit board, and an LED.
  • the above-described stacking process is usually used. That is, the protrusion formed on the back plate is inserted into the printed circuit board assembly, and then the back cover and the printed circuit board assembly are coupled through a stacking process of compressing or deforming the printed circuit board assembly into heat to complete the LED module.
  • 1 and 2 are views showing a process in which the printed circuit board assembly 10 is combined with the back plate 20 for a conventional stacking process.
  • a protruding portion 23 protruding in the same direction as the direction in which an LED (not shown) located on the upper portion of the printed circuit board 15 is protruded from the protruding portion 23 Is pressed or heated to fix the printed circuit board assembly 10 to the back plate 20 (hereinafter referred to as a fastening member).
  • the distance between the LED and the protrusion 23 is set to be It was necessary to secure it.
  • the present invention is directed to a flexible printed circuit board assembly having a fixing unit that can be fixed to a fastening member without a stacking process to reduce the distance between LEDs and protrusions, and a lamp unit using the same.
  • a flexible circuit board assembly for an LED lamp having fixing means for achieving the above object comprises a resin layer; A conductive signal line layer formed on the resin layer; A through portion is formed at a lower portion of the resin layer to emit heat generated from the LED mounted on the conductive signal line layer and a protrusion formed on a fastening member coupled to the lower side for fixing the through hole, A heat dissipation layer; Wherein the fixing means is fixed to the protrusion so that the heat dissipation layer can be fixed to the protrusion penetrating the penetration portion of the heat dissipation layer when the protrusion penetrates the penetration portion, And an interference part which is interposed in the protrusion part while being bent in the protrusion penetrating direction and is fixed to the protrusion part to fix the position of the heat radiation layer.
  • the interference portion is formed in a plurality of radial directions with respect to the protruding portion penetrating the penetrating portion, and a plurality of the interference portions are protruded from the central side of each inner circumferential surface of the penetrating portion penetrating in a rectangular shape, And a bending guide groove extending upward in the bottom surface to be bent and guided in the penetrating direction and having a thickness smaller than an end portion extending in the width direction and interfering with the protruding portion.
  • the penetrating portion may be formed in a circular shape having an inner diameter smaller than that of the protruding portion, and the cutout portion may be formed at regular intervals in the circumferential direction so that the protruding portion is bent in the protruding portion penetrating direction when the protruding portion penetrates,
  • a plurality of the interference portions are formed in a circumferential direction with respect to the protrusions, and a plurality of the interference portions are formed in an upward direction on the bottom surface so as to be bent in the protrusion penetration direction when interfering with the protrusions, It is preferable that each of the bending guide grooves has a thickness.
  • a lamp unit including a resin layer, a conductive signal line layer formed on the resin layer, and a light emitting layer formed on the conductive signal line layer, A flexible circuit board assembly including a heat dissipation layer disposed below the resin layer; A coupling member having a protrusion formed through the penetration formed in the heat dissipation layer to fix the flexible circuit board assembly; And a reflector for reflecting and diffusing the light of the LED, wherein the flexible circuit board assembly includes fixing means that can be fixed to the protruding portion, and the fixing means is a fixing means for fixing the heat dissipation layer to the penetration portion of the heat dissipation layer And an interference part which is fixed to the protruding part and interferes with the protruding part when the protruding part penetrates the penetrating part to be bent in the protruding part penetrating direction and is fixed to the protruding part to fix the position of the heat dissipating layer .
  • the protruding portion further includes a release preventing groove that extends in the circumferential direction and extends in the circumferential direction to bend and contact the bottom portion of the end portion of the interference portion formed in the penetrating portion.
  • the lamp unit of the present invention is formed into a ring shape having a through hole formed therethrough and is positioned on one surface of the coupling member through the protrusion and bent to elastically support the interference unit in a direction away from the coupling member It is preferable to further include an elastic pressing member.
  • the flexible circuit board assembly having the fixing means of the present invention and the lamp unit using the same can be fixed to the fastening member using the shape of the heat radiation layer of the flexible circuit board assembly without a separate stacking process, And it is possible to prevent the damage of the LED, thereby reducing the defect rate.
  • FIGS. 1 and 2 are views showing that a printed circuit board assembly is fixed to a fastening portion through a conventional stacking process
  • FIG. 3 is a partial perspective view of a lamp unit showing a state before a flexible circuit board assembly having fixing means according to a first embodiment of the present invention is mounted on a fastening member,
  • FIG. 4 is a partial side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of FIG. 3 is mounted on the fastening member,
  • Fig. 5 is a partial cross-sectional view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of Fig. 3 is in contact with the reflector,
  • FIG. 6 is a partial cross-sectional view of the lamp unit showing a state before the flexible circuit board assembly having the fixing means of FIG. 3 is fixed to the fastening member
  • FIG. 7 is a partial cross-sectional side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of FIG. 3 is fixed to the fastening portion,
  • FIG. 8 is a partial cross-sectional side view of the lamp unit showing a state before the flexible circuit board assembly having the fixing means according to the second embodiment of the present invention is fixed to the fastening member,
  • Fig. 9 is a partial cross-sectional side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of Fig. 8 is fixed to the fastening portion,
  • FIG. 10 is a partial cross-sectional side view of a lamp unit showing a state where a flexible circuit board assembly having fixing means according to a third embodiment of the present invention is fixed to a fastening portion,
  • FIG. 11 is a partial cross-sectional view of a lamp unit showing a state where a flexible circuit board assembly having fixing means according to a fourth embodiment of the present invention is fixed to a fastening portion.
  • FIG. 3 to 7 show a lamp unit 50 according to a first embodiment of the present invention.
  • the lamp unit 50 includes a fastening member 200, a flexible circuit board assembly 100 fixed to the upper portion of the fastening member, an LED mounted on the flexible printed circuit board assembly 100, A reflector 300 that reflects the light of the light emitting device 130 to diffuse it and a housing (not shown) that covers the flexible printed circuit board assembly 100 and the reflector 300 and can transmit light.
  • the flexible circuit board assembly 100 can be used in a combination lamp of an automobile, an indoor lamp, and various electronic products.
  • the flexible circuit board assembly 100 is fixedly coupled to the fastening member 200, Respectively.
  • the lamp unit 50 according to the first embodiment of the present invention is applied to an automobile and the fastening member 200 can be installed in an automobile body as shown in FIG. And a flatly formed back plate portion 210 for fixing the flexible circuit board assembly 100 to the direction side to be wished.
  • the fastening member 200 may be shaped differently depending on the purpose of use of the flexible circuit board assembly 100.
  • the fastening member 200 is mounted on a lamp unit having a predetermined curvature on the outer side of the vehicle, So that light from the LED 130 can be radiated toward the rear of the vehicle.
  • the shape of the fastening member 200 is not limited to that shown in the drawing and a general back plate formed in a plate shape for fixing the flexible circuit board assembly 100 may be applied.
  • the back plate portion 210 of the fastening member 200 facing rearward is formed in a step shape, and a protrusion for fixing the flexible circuit board assembly 100 is formed.
  • the protruding portion is divided into a first fixing protrusion 211 protruding in a circular shape toward the rear side of the back plate portion 210 and a second fixing protrusion 216 protruding in a circular shape on the side intersecting the back.
  • the flexible circuit board assembly 100 having the fixing means includes a resin layer 110 on the strip, a conductive signal line layer 115 formed on the resin layer 110 in a predetermined pattern, And a heat dissipation layer 130 disposed at a lower portion of the conductive signal line layer 115 to emit heat generated from the LED 120 mounted on the conductive signal line layer 115.
  • the conductive signal line layer 115 and the heat dissipation layer 130 are preferably made of one of copper, aluminum, a copper alloy, and an aluminum alloy.
  • the conductive signal line layer 115 supplies power to the LED 120 to be mounted, and is formed as a thin film layer which can be energized.
  • terminals of the LED lamp and a pad layer for surface mounting may be formed.
  • the resin layer 110 may be formed of a polyimide resin, but not limited thereto, and may be made of a material having insulation and flexibility.
  • Through holes are formed in the conductive signal line layer 115 and the resin layer 110, respectively.
  • the through holes are filled with a thermally conductive layer (not shown) made of a non-conductive material.
  • the heat dissipation layer 130 is formed in a continuous strip shape extending in the direction of the resin layer 110.
  • the heat dissipation layer 130 extends in a stepped shape of the back plate portion 210 and is in contact with the back plate portion 210.
  • the heat dissipation layer 130 is preferably formed of an aluminum material.
  • the heat dissipation layer 130 is formed with a penetration portion through which the first fixing protrusion 211 or the second fixing protrusion 216 passes.
  • the penetration portion of the heat dissipation layer 130 is formed in a position corresponding to the first fixing protrusion 211 of the back plate portion 210 when the heat dissipation layer 130 is in contact with the back plate portion 210, And a second penetrating portion 141 formed so as to penetrate through the second fixing protrusion 216 at a position corresponding to the second fixing protrusion 216.
  • the second fixing protrusion 216 has a first through hole 131 formed therethrough so as to penetrate the first fixing protrusion 211, ).
  • the resin layer 100 is formed in a thin plate shape extending in the extending direction of the heat dissipation layer 130 and seated on the upper surface of the heat dissipation layer 130 and is disposed at a position corresponding to the first penetration portion 131 of the heat dissipation layer 130
  • a portion 116 is formed.
  • the resin layer 100 is formed with a contact rib through hole 118 through which the contact rib 310 penetrates so that the contact rib 310 of the reflector 300 contacts the heat dissipation layer.
  • the first through-hole 131 and the second through-hole 141 are provided with fixing means for fixing the flexible circuit board assembly for the LED lamp according to the first embodiment of the present invention.
  • the fixing means may protrude from the inner circumferential surface of the first penetrating portion 131 or the second penetrating portion 141 so that when the first fixing protrusion 211 or the second fixing protrusion 216 penetrates the first fixing protrusion 211 or the second fixing protrusion 216, The first fixing protrusions 211 or the second fixing protrusions 216 are bent in the penetrating direction to be supported on the outer circumferential surfaces of the first fixing protrusions 211 or the second fixing protrusions 216, And a plurality of interference portions 150 for fixing the layer 130 and the resin layer and the LEDs.
  • the plurality of interference portions 150 are formed in the radial direction about the first fixing protrusions 211 or the second fixing protrusions 216.
  • the first through holes 131 or the second through holes 141 on the inner circumferential surface side.
  • the plurality of interfering portions 150 are formed such that the protruding end portions are bent in the direction of penetrating the first fixing protrusions 211 or the second fixing protrusions 216 when interfering with the first fixing protrusions 211 or the second fixing protrusions 216
  • Each of the first and second fixing protrusions 211 and 216 has a bent guide groove 156 that is upwardly extended from the bottom surface and extends in the width direction and has a smaller thickness than an end portion that interferes with the first fixing protrusion 211 or the second fixing protrusion 216.
  • the lamp unit according to the first embodiment of the present invention is provided with fixing means on the flexible circuit board assembly so that the flexible circuit board assembly 100 can be easily assembled with the fastening member 200
  • the manufacturing process can be simplified and productivity can be improved, and damage to the LED can be prevented, thereby reducing the defect rate.
  • the flexible circuit board assembly 100 having the fixing means according to the first embodiment of the present invention is fixed by the reflector 300 of the lamp unit 50, have.
  • FIG. 8 and 9 show a lamp unit according to a second embodiment of the present invention.
  • Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
  • the lamp unit according to the second embodiment of the present invention is the same as the structure of the lamp unit 50 according to the first embodiment of the present invention except for the flexible circuit board assembly 102.
  • the flexible circuit board assembly 102 includes the flexible circuit board assembly 100 according to the first embodiment of the present invention except for the first through hole 231 and the second through hole 241 formed in the heat dissipation layer 130 100).
  • the first penetrating portion 231 and the second penetrating portion 241 may be formed in the first fixing protrusions 211 or the second fixing protrusions 211 when the heat dissipation layer 130 is in contact with the back plate portion 210, 216 for fixing the flexible circuit board assembly 102 for an LED lamp according to the second embodiment of the present invention to the back plate portion 210 is provided.
  • the first penetrating portion 231 is a portion through which the first fixing protruding portion 211 penetrates and the second penetrating portion 241 is a portion through which the second fixing protruding portion 216 penetrates.
  • the first penetrating portion 231 and the second penetrating portion 241 are formed in a circular shape having an inner diameter smaller than the diameter of the first fixing protrusions 211 or the second fixing protrusions 216, 211 or the second fixing protrusions 216 interfere with the first fixing protrusions 211 or the second fixing protrusions 216 when they pass therethrough.
  • the first penetrating part 231 is formed with a plurality of first cut-out parts 233 at predetermined intervals in the circumferential direction so that the first penetrating part 211 is bent in the penetrating direction of the first fixing protruding part 211, A plurality of first interfering parts 255 which are bent in the penetrating direction of the first fixing protrusions 211 and supported on the outer circumferential surface of the first fixing protrusions 211 to fix the position of the heat dissipation layer 130 to fix the resin layer and the LEDs Respectively.
  • the plurality of first interfering parts 255 extend upward in the bottom surface and extend in the width direction so that the protruding end portions can easily bend in the direction of penetrating the first fixing protrusions 211 when interfering with the first fixing protrusions 211 And a first bending guide groove 256 having a thickness smaller than an end portion of the first fixing protrusion 211 interfering with each other.
  • a plurality of second cut-out portions 243 are formed at regular intervals in the circumferential direction so that the second through-holes 241 are bent in the passing direction of the second fixing protrusions 216 when the second fixing protrusions 216 penetrate,
  • a plurality of second interfering parts 257 which are bent in the penetrating direction of the second fixing protrusions 216 and supported on the outer circumferential surface of the second fixing protrusions 216 to fix the position of the heat dissipation layer 130 to fix the resin layer and the LEDs Respectively.
  • the plurality of second interfering portions 257 extend upward in the bottom surface and extend in the width direction so that the protruding ends easily bend in the direction of penetrating the second fixing protrusions 216 when interfering with the second fixing protrusions 216, And the second fixing protrusion 216 has a second bending guide groove 258 having a thickness smaller than the interference end.
  • FIG. 10 shows a lamp unit according to a third embodiment of the present invention.
  • Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
  • the lamp unit according to the third embodiment of the present invention is the same as the structure of the lamp unit 50 according to the first embodiment of the present invention except that the lamp unit 50 further includes a release preventing groove in the protrusion of the fastening member 200 .
  • the separation preventing groove is divided into a first separation preventing groove 213 formed in the first fixing protrusion 211 and a second separation preventing groove 218 formed in the second fixing protrusion 216.
  • the first release preventing groove 213 is extended in the circumferential direction to the inner side of the outer circumferential surface of the first fixing protrusion 211 and extends in the circumferential direction so that the ends of the plurality of interfering parts 150 of the first penetrating part 131, And the lower side is engaged with each other so that the bent state is maintained.
  • the second release preventing groove 216 extends in the circumferential direction to the inside of the second fixing protrusion 216 and extends in the circumferential direction so that the ends of the plurality of interference portions 150 of the second through- And the lower side is engaged with each other so that the bent state is maintained.
  • FIG. 11 shows a lamp unit according to a fourth embodiment of the present invention.
  • Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
  • the lamp unit according to the fourth embodiment of the present invention further includes an elastic pressing member 180 in the structure of the lamp unit according to the third embodiment of the present invention.
  • the elastic pressing member 180 is formed into a ring shape having an inner through hole and is seated on the upper surface of the back plate portion 210 through the first fixing protrusion or the second fixing protrusion.
  • the resilient urging member 180 is bent to be inserted into the interference portion 150 of the first penetrating portion 131 fixed to the first detachment preventing groove 213 or the second penetrating portion 150 fixed to the second detaching preventing groove 218 141 in the direction away from the back plate portion 210.
  • the flexible circuit board assembly 100 can prevent the first and second separation preventing grooves 213, It can be prevented that it is detached from the main body 216.
  • the flexible circuit board assembly having the fixing means according to the present invention and the lamp unit using the same can be fixed to the fastening member using the shape of the heat radiation layer of the flexible circuit board assembly without a separate stacking process, It is possible to improve the productivity and to prevent the damage of the LED, thereby reducing the defect rate.

Abstract

The present invention relates to a flexible circuit board assembly having a fixing means and a lamp unit using the same. More specifically, the present invention relates to a flexible circuit board assembly having a fixing means capable of fixing a flexible circuit board assembly without a stacking process and a lamp unit using the same. Since the flexible circuit board assembly having a fixing means and the lamp unit using the same, according to the present invention, can be fixed to a fastening member by using the form of a heat dissipation layer of the flexible circuit board assembly without a separate stacking process, the manufacturing process thereof is simplified and thus productivity can be improved, and it is possible to prevent damage to LEDs, thereby reducing a defect rate.

Description

고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛A flexible circuit board assembly having fixing means and a lamp unit using the same
본 발명은 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛에 관한 것으로서, 구체적으로는 스태킹 공정없이 연성회로기판조립체가 고정될 수 있는 고정수단을 구비 연성회로기판조립체와 이를 이용한 램프유닛에 관한 것이다.The present invention relates to a flexible circuit board assembly having fixing means and a lamp unit using the flexible circuit board assembly. More specifically, the present invention relates to a flexible circuit board assembly having fixing means capable of fixing a flexible circuit board assembly without a stacking process, .
스태킹 공정(staking)은 부품 간의 결합 기술 중 하나이다. 일반적으로 열가소성 재질로 되어 있는 돌출 형상을 갖는 결합 보스(staking boss)를 결합하고자 하는 부품의 홀 부분에 삽입 및 고정시킨다. 그리고 스태킹 지그(staking jig)로 결합 보스를 압착하거나 가열하여 결합 보스 부분을 넓게 퍼지게 하여 두 부품을 결합한다.Stacking is one of the coupling techniques between parts. In general, a staking boss having a protruding shape made of a thermoplastic material is inserted and fixed in a hole portion of a part to be joined. Then, the joining boss is squeezed or heated by a staking jig to spread the joining boss portion to join the two parts.
일반적인 전장용 엘이디 모듈(LED module)은 사출형성된 백플레이트(back plate)와, 백플레이트(back plate)에 고정되는 인쇄회로기판 조립체로 구성된다. 이때 일반적으로 인쇄회로기판 조립체는 방열층, 인쇄회로기판, 그리고 엘이디로 구성된다.A typical LED module is a printed circuit board assembly that is fixed to an injection molded back plate and a back plate. At this time, the printed circuit board assembly generally comprises a heat-radiating layer, a printed circuit board, and an LED.
백플레이트에 인쇄회로기판 조립체를 고정하기 위해서는 보통 위에서 설명한 스태킹 공정이 사용된다. 즉, 백플레이트에 형성된 돌기부를 인쇄회로기판 어셈블리에 삽입한 후 이를 압축하거나 열로 변형시키는 스태킹 공정을 통해 백커버와 인쇄회로기판 조립체를 결합하여 엘이디 모듈을 완성한다.In order to secure the printed circuit board assembly to the back plate, the above-described stacking process is usually used. That is, the protrusion formed on the back plate is inserted into the printed circuit board assembly, and then the back cover and the printed circuit board assembly are coupled through a stacking process of compressing or deforming the printed circuit board assembly into heat to complete the LED module.
도 1 및 도 2는 종래의 스태킹 공정을 위해 인쇄회로기판 조립체(10)가 백플레이트(20)와 결합된 공정을 도시한 도면이다. 도 1 및 도2를 참고하면, 종래에는 인쇄회로기판(15) 상부에 위치한 엘이디(미도시)의 형성방향과 같은 방향으로 돌출된 돌기부(23)를 스태킹 지그(30)를 이용하여 돌기부(23)를 가압하거나 가열하여 인쇄회로기판 조립체(10)를 백플레이트(20)(이하, 체결부재라 함)에 고정하였다. 1 and 2 are views showing a process in which the printed circuit board assembly 10 is combined with the back plate 20 for a conventional stacking process. 1 and 2, a protruding portion 23 protruding in the same direction as the direction in which an LED (not shown) located on the upper portion of the printed circuit board 15 is protruded from the protruding portion 23 Is pressed or heated to fix the printed circuit board assembly 10 to the back plate 20 (hereinafter referred to as a fastening member).
그런데, 스태킹 공정은 엘이디가 파손될 위험이 있어 공정과정이 번거러운 단점이 있었고, 엘이디 모듈의 배광을 만족시키기 위한 부품인 베젤(bezel)과의 간섭문제를 해결하기 위하여 엘이디와 돌기부(23)와의 간격을 확보할 필요가 있었다.In order to solve the problem of interference with the bezel, which is a component for satisfying the light distribution of the LED module, the distance between the LED and the protrusion 23 is set to be It was necessary to secure it.
본 발명은 상기와 같은 문제점을 해결하기 위하여 스태킹 공정 없이 체결부재에 고정될 수 있어 엘이디와 돌기부간 간격을 줄일 수 있는 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛를 제공하고자 한다.SUMMARY OF THE INVENTION The present invention is directed to a flexible printed circuit board assembly having a fixing unit that can be fixed to a fastening member without a stacking process to reduce the distance between LEDs and protrusions, and a lamp unit using the same.
상기와 같은 목적을 달성하기 위한 고정수단을 구비한 엘이디 램프용 연성회로기판조립체는 수지층과; 상기 수지층의 상부에 형성되는 도전성 시그널라인층과; 상기 도전성 시그널라인층에 실장되는 엘이디로부터 발생된 열을 방출하기 위해 상기 수지층의 하부에 설치되며 고정을 위해 하방측에서 결합되는 체결부재에 형성된 돌기부가 상기 수지층을 관통할 수 있도록 관통부가 형성된 방열층과; 상기 돌기부에 고정될 수 있는 고정수단;을 구비하고, 상기 고정수단은 상기 방열층이 상기 방열층의 상기 관통부를 관통한 상기 돌기부에 고정될 수 있도록, 상기 돌기부가 상기 관통부에 관통시 상기 돌기부에 간섭되어 상기 돌기부 관통방향으로 절곡되면서 상기 돌기부에 지지되어 상기 방열층을 위치고정하는 간섭부를 구비하는 것을 특징으로 한다.A flexible circuit board assembly for an LED lamp having fixing means for achieving the above object comprises a resin layer; A conductive signal line layer formed on the resin layer; A through portion is formed at a lower portion of the resin layer to emit heat generated from the LED mounted on the conductive signal line layer and a protrusion formed on a fastening member coupled to the lower side for fixing the through hole, A heat dissipation layer; Wherein the fixing means is fixed to the protrusion so that the heat dissipation layer can be fixed to the protrusion penetrating the penetration portion of the heat dissipation layer when the protrusion penetrates the penetration portion, And an interference part which is interposed in the protrusion part while being bent in the protrusion penetrating direction and is fixed to the protrusion part to fix the position of the heat radiation layer.
상기 간섭부는 상기 관통부를 관통한 상기 돌기부에 대해 방사방향으로 다수 개 형성되며, 다수의 상기 간섭부는 사각 형상으로 관통형성된 상기 관통부의 각 내주면 중심측에서 각각 돌출형성되며, 상기 돌기부와 간섭시 상기 돌기부 관통방향으로 절곡유도되도록 저면에 상방으로 인입 형성되고폭 방향으로 연장되어 상기 돌기부와 간섭되는 단부보다 작든 두께를 갖는 절곡유도홈를 각각 구비하는 것이 바람직하다.Wherein the interference portion is formed in a plurality of radial directions with respect to the protruding portion penetrating the penetrating portion, and a plurality of the interference portions are protruded from the central side of each inner circumferential surface of the penetrating portion penetrating in a rectangular shape, And a bending guide groove extending upward in the bottom surface to be bent and guided in the penetrating direction and having a thickness smaller than an end portion extending in the width direction and interfering with the protruding portion.
또는, 상기 관통부는 상기 돌기부보다 작은 내경을 갖는 원형상으로 관통형성되고, 상기 돌기부가 관통시 상기 돌기부 관통방향으로 절곡되게 원주방향으로 일정간격마다 절재부가 형성되어, 상기 간섭부가 상기 관통부를 관통한 상기 돌기부에 대해 원주방향으로 다수 개 형성되며, 다수의 상기 간섭부는 상기 돌기부와 간섭시 상기 돌기부 관통방향으로 절곡 유도되도록 저면에 상방으로 인입 형성되고폭 방향으로 연장되어 상기 돌기부와 간섭되는 단부보다 작든 두께를 갖는 절곡유도홈를 각각 구비하는 것이 바람직하다.Alternatively, the penetrating portion may be formed in a circular shape having an inner diameter smaller than that of the protruding portion, and the cutout portion may be formed at regular intervals in the circumferential direction so that the protruding portion is bent in the protruding portion penetrating direction when the protruding portion penetrates, A plurality of the interference portions are formed in a circumferential direction with respect to the protrusions, and a plurality of the interference portions are formed in an upward direction on the bottom surface so as to be bent in the protrusion penetration direction when interfering with the protrusions, It is preferable that each of the bending guide grooves has a thickness.
그리고, 상기와 같은 목적을 달성하기 위한 본 발명의 램프유닛은 수지층과, 상기 수지층의 상부에 형성되는 도전성 시그널라인층과, 상기 도전성 시그널라인층에 실장되는 엘이디로부터 발생된 열을 방출하기 위해 상기 수지층의 하부에 설치되는 방열층을 포함하는 연성회로기판조립체와; 상기 연성회로기판조립체를 고정하기 위해 상기 방열층에 형성된 관통부를 관통하는 돌기부가 형성된 체결부재와; 상기 엘이디의 광을 반사하여 확산시키는 리플렉터;를 구비하고, 상기 연성회로기판조립체는 상기 돌기부에 고정될 수 있는 고정수단을 구비하고, 상기 고정수단은 상기 방열층이 상기 방열층의 상기 관통부를 관통한 상기 돌기부에 고정될 수 있도록, 상기 돌기부가 상기 관통부에 관통시 상기 돌기부에 간섭되어 상기 돌기부 관통방향으로 절곡되면서 상기 돌기부에 지지되어 상기 방열층을 위치고정하는 간섭부를 구비하는 것을 특징으로 한다.According to an aspect of the present invention, there is provided a lamp unit including a resin layer, a conductive signal line layer formed on the resin layer, and a light emitting layer formed on the conductive signal line layer, A flexible circuit board assembly including a heat dissipation layer disposed below the resin layer; A coupling member having a protrusion formed through the penetration formed in the heat dissipation layer to fix the flexible circuit board assembly; And a reflector for reflecting and diffusing the light of the LED, wherein the flexible circuit board assembly includes fixing means that can be fixed to the protruding portion, and the fixing means is a fixing means for fixing the heat dissipation layer to the penetration portion of the heat dissipation layer And an interference part which is fixed to the protruding part and interferes with the protruding part when the protruding part penetrates the penetrating part to be bent in the protruding part penetrating direction and is fixed to the protruding part to fix the position of the heat dissipating layer .
상기 돌기부는 외주면에 내측으로 인입되며 원주방향으로 연장되어 절곡되어 접촉되는 상기 관통부에 형성된 상기 간섭부의 단부측 하부가 걸려 절곡된 상태를 유지시키는 이탈방지홈을 더 구비하는 것이 바람직하다.Preferably, the protruding portion further includes a release preventing groove that extends in the circumferential direction and extends in the circumferential direction to bend and contact the bottom portion of the end portion of the interference portion formed in the penetrating portion.
본 발명의 램프유닛은 내부가 관통형성된 링 형상으로 형성되어 상기 돌기부를 관통하여 상기 체결부재의 일면에 안착되어 절곡되어 상기 이탈방지홈에 고정된 상기 간섭부를 상기 체결부재에 멀어지는 방향으로 탄성지지하는 탄성가압부재를 더 구비하는 것이 바람직하다.The lamp unit of the present invention is formed into a ring shape having a through hole formed therethrough and is positioned on one surface of the coupling member through the protrusion and bent to elastically support the interference unit in a direction away from the coupling member It is preferable to further include an elastic pressing member.
본 발명의 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛은 별도의 스태킹 공정 없이 연성회로기판조립체의 방열층의 형상을 이용하여 체결부재에 고정될 수 있으므로 제작공정이 간소화 되어 생산성을 향상시킬 수 있고 엘이디의 손상을 방지할 수 있어 불량률을 줄일 수 있는 이점이 있다.The flexible circuit board assembly having the fixing means of the present invention and the lamp unit using the same can be fixed to the fastening member using the shape of the heat radiation layer of the flexible circuit board assembly without a separate stacking process, And it is possible to prevent the damage of the LED, thereby reducing the defect rate.
도 1과 도 2는 종래의 스태킹 공정을 통해 인쇄회로기판 조립체가 체결부에 고정되는 것을 도시한 도면이고,FIGS. 1 and 2 are views showing that a printed circuit board assembly is fixed to a fastening portion through a conventional stacking process,
도 3는 본 발명의 제1실시 예에 따른 고정수단을 구비한 연성회로기판 조립체가 체결부재에 장착되기 전 상태를 도시한 램프유닛의 일부 사시도이고,3 is a partial perspective view of a lamp unit showing a state before a flexible circuit board assembly having fixing means according to a first embodiment of the present invention is mounted on a fastening member,
도 4는 도 3의 고정수단을 구비한 연성회로기판 조립체가 체결부재에 장착된 상태를 도시한 램프유닛의 일부 측면도이고,FIG. 4 is a partial side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of FIG. 3 is mounted on the fastening member,
도 5는 도 3의 고정수단을 구비한 연성회로기판조립체가 리플렉터에 접촉된 상태를 도시한 램프유닛의 일부 단면도이고,Fig. 5 is a partial cross-sectional view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of Fig. 3 is in contact with the reflector,
도 6은 도 3의 고정수단을 구비한 연성회로기판 조립체가 체결부재에 고정되기 전 상태를 도시한 램프유닛의 일부 측단면도이고,FIG. 6 is a partial cross-sectional view of the lamp unit showing a state before the flexible circuit board assembly having the fixing means of FIG. 3 is fixed to the fastening member,
도 7은 도 3의 고정수단을 구비한 연성회로기판 조립체가 체결부에 고정된 상태를 도시한 램프유닛의 일부 측단면도이고,FIG. 7 is a partial cross-sectional side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of FIG. 3 is fixed to the fastening portion,
도 8은 본 발명의 제2실시 예에 따른 고정수단을 구비한 연성회로기판 조립체가 체결부재에 고정되기 전 상태를 도시한 램프유닛의 일부 측단면도이고,8 is a partial cross-sectional side view of the lamp unit showing a state before the flexible circuit board assembly having the fixing means according to the second embodiment of the present invention is fixed to the fastening member,
도 9는 도 8의 고정수단을 구비한 연성회로기판 조립체가 체결부에 고정된 상태를 도시한 램프유닛의 일부 측단면도이고,Fig. 9 is a partial cross-sectional side view of the lamp unit showing a state where the flexible circuit board assembly having the fixing means of Fig. 8 is fixed to the fastening portion,
도 10은 본 발명의 제3실시 예에 따른 고정수단을 구비한 연성회로기판 조립체가 체결부에 고정된 상태를 도시한 램프유닛의 일부 측단면도이고,10 is a partial cross-sectional side view of a lamp unit showing a state where a flexible circuit board assembly having fixing means according to a third embodiment of the present invention is fixed to a fastening portion,
도 11은 본 발명의 제4실시 예에 따른 고정수단을 구비한 연성회로기판 조립체가 체결부에 고정된 상태를 도시한 램프유닛의 일부 측단면도이다.11 is a partial cross-sectional view of a lamp unit showing a state where a flexible circuit board assembly having fixing means according to a fourth embodiment of the present invention is fixed to a fastening portion.
이하, 첨부된 도면을 참고하면 본 발명의 일 실시 예에 따른 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛를 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a flexible circuit board assembly having fixing means according to an embodiment of the present invention and a lamp unit using the same will be described with reference to the accompanying drawings.
도 3 내지 도 7에는 본 발명의 제1 실시 예에 따른 램프유닛(50)이 도시되어 있다. 3 to 7 show a lamp unit 50 according to a first embodiment of the present invention.
본 발명에 제1 실시 예에 따른 램프유닛(50)은 체결부재(200)와, 체결부재의 상부에 고정되는 연성회로기판조립체(100)와, 연성인쇄회로기판 조립체(100)에 실장된 엘이디(130)의 광이 확산되게 반사시키는 리플렉터(reflector)(300)와, 연성인쇄회로기판조립체(100)와 리플렉터(300)를 덮으며 광이 투과될 수 있는 하우징(미도시)으로 구성된다.The lamp unit 50 according to the first embodiment of the present invention includes a fastening member 200, a flexible circuit board assembly 100 fixed to the upper portion of the fastening member, an LED mounted on the flexible printed circuit board assembly 100, A reflector 300 that reflects the light of the light emitting device 130 to diffuse it and a housing (not shown) that covers the flexible printed circuit board assembly 100 and the reflector 300 and can transmit light.
연성회로기판 조립체(100)는 자동차의 콤비네이션램프, 실내램프, 각종 전자제품 등에 사용될 수 있는 것으로, 체결부재(200)와 결합되어 고정되는데 스태킹 공정 없이 체결부재(200)에 고정될 수 있는 고정수단을 구비한다.The flexible circuit board assembly 100 can be used in a combination lamp of an automobile, an indoor lamp, and various electronic products. The flexible circuit board assembly 100 is fixedly coupled to the fastening member 200, Respectively.
연성회로기판 조립체(100) 설명에 앞서, 체결부재(200)에 대해 먼저 설명한다. 본 발명의 제1 실시 예에 따른 램프유닛(50)은 자동차에 적용되는 것을 예로 든 것으로서, 체결부재(200)는 도 1 내 도 3에 도시된 바와 같이 자동차 차체에 설치될 수 있으며 광을 조사하고자 하는 방향 측에 연성회로기판 조립체(100) 고정을 위한 평평하게 형성된 백플레이트부(210)를 구비한다.Prior to the description of the flexible circuit board assembly 100, the fastening member 200 will be described first. The lamp unit 50 according to the first embodiment of the present invention is applied to an automobile and the fastening member 200 can be installed in an automobile body as shown in FIG. And a flatly formed back plate portion 210 for fixing the flexible circuit board assembly 100 to the direction side to be wished.
체결부재(200)는 연성회로기판 조립체(100)의 사용 목적에 따라 고정을 위한 형상이 달라질 수 있는데, 본 발명에서는 자동차의 후단측에 외측이 소정곡률을 갖도록 형성된 램프유닛에 장착된 것을 예로 들고 있어 자동차의 후방을 향해 엘이디(130)의 광이 나란하게 조사될 수 있도록 계단 형태로 형성된다.The fastening member 200 may be shaped differently depending on the purpose of use of the flexible circuit board assembly 100. In the present invention, the fastening member 200 is mounted on a lamp unit having a predetermined curvature on the outer side of the vehicle, So that light from the LED 130 can be radiated toward the rear of the vehicle.
체결부재(200)의 형상은 도시된 것에 한정되지 않고, 연성회로기판조립체(100)를 고정하기 위한 판상으로 형성된 일반적인 백플레이트(Back plate)가 적용될 수도 있다.The shape of the fastening member 200 is not limited to that shown in the drawing and a general back plate formed in a plate shape for fixing the flexible circuit board assembly 100 may be applied.
그리고, 체결부재(200)가 자동차에 장착 시, 후방을 향하는 체결부재(200)의 백플레이트부(210)는 계단형태로 형성되는데 연성회로기판 조립체(100) 고정을 위한 돌기부가 형성된다. When the fastening member 200 is mounted on a vehicle, the back plate portion 210 of the fastening member 200 facing rearward is formed in a step shape, and a protrusion for fixing the flexible circuit board assembly 100 is formed.
돌기부는 백플레이트부(210)의 후방을 향하는 측에 원형상으로 돌출된 제1고정돌기부(211)와, 후방에 교차하는 측에 원형상으로 돌출된 제2고정돌기부(216)로 구분된다.The protruding portion is divided into a first fixing protrusion 211 protruding in a circular shape toward the rear side of the back plate portion 210 and a second fixing protrusion 216 protruding in a circular shape on the side intersecting the back.
고정수단을 구비한 연성회로기판 조립체(100)는 스트립 상의 수지층(110)과, 수지층(110)의 상부에 설치되는 소정의 패턴으로 형성되는 도전성 시그널 라인층(115)과, 수지층(110)의 하부에 설치되며 도전성 시그널 라인층(115)에 실장되는 엘이디(120)로부터 발생된 열을 방출하기 위한 방열층(130)을 구비한다. 도전성 시그널라인층(115)과 방열층(130)은 동, 알루미늄 또는 동합금, 알루미늄합금 중 하나의 재질로 이루어지는 것이 바람직하다.The flexible circuit board assembly 100 having the fixing means includes a resin layer 110 on the strip, a conductive signal line layer 115 formed on the resin layer 110 in a predetermined pattern, And a heat dissipation layer 130 disposed at a lower portion of the conductive signal line layer 115 to emit heat generated from the LED 120 mounted on the conductive signal line layer 115. The conductive signal line layer 115 and the heat dissipation layer 130 are preferably made of one of copper, aluminum, a copper alloy, and an aluminum alloy.
도전성 시그널 라인층(115)은 실장되는 엘이디(120)에 전원을 공급하는 것으로, 통전이 가능한 박막층으로 형성된다. 그리고 도전성 시그널라인층(115)에는 엘이디램프의 단자들과 표면실장을 위한 패드층이 형성될 수 있다. The conductive signal line layer 115 supplies power to the LED 120 to be mounted, and is formed as a thin film layer which can be energized. In the conductive signal line layer 115, terminals of the LED lamp and a pad layer for surface mounting may be formed.
수지층(110)은 폴리마이드 수지로 형성될 수 있는데, 이에 한정되지 않고, 절연성 및 유연성을 갖는 재질로 이루어질 수도 있다. The resin layer 110 may be formed of a polyimide resin, but not limited thereto, and may be made of a material having insulation and flexibility.
도전성 시그널라인층(115)과 수지층(110)에 각각 관통홀(미도시)이 형성되는데, 관통홀에는 비도전성 물질로 이루어진 열전도층(미도시)이 채워진다. 방열층(130)은 수지층(110) 방향으로 연장된 연속된 스트립 형태로 이루어진다. Through holes (not shown) are formed in the conductive signal line layer 115 and the resin layer 110, respectively. The through holes are filled with a thermally conductive layer (not shown) made of a non-conductive material. The heat dissipation layer 130 is formed in a continuous strip shape extending in the direction of the resin layer 110.
방열층(130)은 백플레이트부(210)의 계단형태로 연장된 방향으로 연장되며 백플레이트부(210)에 접하는 것으로서 판상으로 형성되는데 알루미늄 소재로 형성되는 것이 바람직하다.The heat dissipation layer 130 extends in a stepped shape of the back plate portion 210 and is in contact with the back plate portion 210. The heat dissipation layer 130 is preferably formed of an aluminum material.
방열층(130)은 제1고정돌기부(211) 또는 제2고정돌기부(216)가 관통되는 관통부가 형성된다. 방열층(130)가 계단형태로 형성된 백플레이트부(210)에 대응되게 접할 때, 방열층(130)의 관통부는 백플레이트부(210)의 제1고정돌기부(211)에 대응되는 위치에 제1고정돌기부(211)가 관통되게 관통형성된 제1관통부(131)와, 제2고정돌기부(216)에 대응되는 위치에 제2고정돌기부(216)가 관통되게 관통형성된 제2관통부(141)로 구분된다.The heat dissipation layer 130 is formed with a penetration portion through which the first fixing protrusion 211 or the second fixing protrusion 216 passes. The penetration portion of the heat dissipation layer 130 is formed in a position corresponding to the first fixing protrusion 211 of the back plate portion 210 when the heat dissipation layer 130 is in contact with the back plate portion 210, And a second penetrating portion 141 formed so as to penetrate through the second fixing protrusion 216 at a position corresponding to the second fixing protrusion 216. The second fixing protrusion 216 has a first through hole 131 formed therethrough so as to penetrate the first fixing protrusion 211, ).
수지층(100)은 방열층(130) 연장방향으로 연장되어 방열층(130)의 상면에 안착되게 얇은 판상으로 형성되며, 방열층(130)의 제1관통부(131)에 대응되는 위치에 제1관통부(131)보다 크게 관통 형성된 제1수지층관통부(111)와, 제2관통부(141)에 대응되는 위치에 제2관통부(141)보다 크게 관통 형성된 제2수지층관통부(116)가 형성된다. 또한, 수지층(100)은 리플렉터(300)의 접촉리브(310)가 방열층에 접하도록 접촉리브(310)가 관통되는 접촉리브관통공(118)이 형성된다.The resin layer 100 is formed in a thin plate shape extending in the extending direction of the heat dissipation layer 130 and seated on the upper surface of the heat dissipation layer 130 and is disposed at a position corresponding to the first penetration portion 131 of the heat dissipation layer 130 A first resin layer penetrating portion 111 formed so as to pass through the first penetrating portion 131 and a second resin layer penetrating portion formed to penetrate the second penetrating portion 141 at a position corresponding to the second penetrating portion 141 A portion 116 is formed. The resin layer 100 is formed with a contact rib through hole 118 through which the contact rib 310 penetrates so that the contact rib 310 of the reflector 300 contacts the heat dissipation layer.
제1관통부(131)와 제2관통부(141)에는 본 발명의 제1실시 예에 따른 엘이디 램프용 연성회로기판 조립체를 고정하기 위한 고정수단이 마련된다.The first through-hole 131 and the second through-hole 141 are provided with fixing means for fixing the flexible circuit board assembly for the LED lamp according to the first embodiment of the present invention.
고정수단은 제1관통부(131) 또는 제2관통부(141)의 내주면에 돌출되어 제1고정돌기부(211) 또는 제2고정돌기부(216)가 관통시 제1고정돌기부(211) 또는 제2고정돌기부(216)에 간섭되면서 제1고정돌기부(211) 또는 제2고정돌기부(216) 관통방향을 절곡되어 제1고정돌기부(211) 또는 제2고정돌기부(216)의 외주면에 지지되어 방열층(130)을 위치 고정하여 수지층 및 엘이디를 위치고정하는 다수의 간섭부(150)가 구비된다.The fixing means may protrude from the inner circumferential surface of the first penetrating portion 131 or the second penetrating portion 141 so that when the first fixing protrusion 211 or the second fixing protrusion 216 penetrates the first fixing protrusion 211 or the second fixing protrusion 216, The first fixing protrusions 211 or the second fixing protrusions 216 are bent in the penetrating direction to be supported on the outer circumferential surfaces of the first fixing protrusions 211 or the second fixing protrusions 216, And a plurality of interference portions 150 for fixing the layer 130 and the resin layer and the LEDs.
다수의 간섭부(150)는 제1고정돌기부(211) 또는 제2고정돌기부(216)를 중심으로 방사방향으로 형성되는데, 사각형상으로 관통형성된 제1관통부(131) 또는 제2관통부(141)의 각 내주면 중심측에 각각 돌출형성된다.The plurality of interference portions 150 are formed in the radial direction about the first fixing protrusions 211 or the second fixing protrusions 216. The first through holes 131 or the second through holes 141 on the inner circumferential surface side.
다수의 간섭부(150)는 돌출된 단부가 제1고정돌기부(211) 또는 제2고정돌기부(216)와 간섭시 제1고정돌기부(211) 또는 제2고정돌기부(216) 관통방향으로 절곡 되도록 저면에 상방으로 인입되고 폭 방향으로 연장되어, 제1고정돌기부(211) 또는 제2고정돌기부(216)와 간섭되는 단부보다 작은 두께를 갖는 절곡유도홈(156)를 각각 구비한다.The plurality of interfering portions 150 are formed such that the protruding end portions are bent in the direction of penetrating the first fixing protrusions 211 or the second fixing protrusions 216 when interfering with the first fixing protrusions 211 or the second fixing protrusions 216 Each of the first and second fixing protrusions 211 and 216 has a bent guide groove 156 that is upwardly extended from the bottom surface and extends in the width direction and has a smaller thickness than an end portion that interferes with the first fixing protrusion 211 or the second fixing protrusion 216.
본 발명의 제1 실시 예에 따른 램프유닛은 연성회로기판조립체에 고정수단이 마련되어 있어, 별도의 스태킹 공정 없이 방열층(130)의 형상을 이용하여 연성회로기판조립체(100)가 체결부재(200)에 고정될 수 있으므로 제작공정이 간소화 되어 생산성을 향상시킬 수 있고 LED의 손상을 방지할 수 있어 불량률을 줄일 수 있는 이점이 있다.The lamp unit according to the first embodiment of the present invention is provided with fixing means on the flexible circuit board assembly so that the flexible circuit board assembly 100 can be easily assembled with the fastening member 200 The manufacturing process can be simplified and productivity can be improved, and damage to the LED can be prevented, thereby reducing the defect rate.
본 발명의 제1 실시 예에 따른 고정수단을 구비한 연성회로기판 조립체(100)는 도 5에 도시된 바와 같이, 램프유닛(50)의 리플렉터(300)에 의해 이차고정되므로 고정력이 강화될 수 있다.As shown in FIG. 5, the flexible circuit board assembly 100 having the fixing means according to the first embodiment of the present invention is fixed by the reflector 300 of the lamp unit 50, have.
한편, 도 8 및 도 9에는 본 발명의 제2실시 예에 따른 램프유닛이 도시되어 있다. 앞서 도시한 도면에서와 동일 기능을 갖는 구성요소는 동일부호로 표기한다.8 and 9 show a lamp unit according to a second embodiment of the present invention. Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
본 발명의 제2실시 예에 따른 램프유닛은 연성회로기판조립체(102)를 제외하고, 본 발명의 제1실시 예에 따른 램프유닛(50)의 구조와 동일하다.The lamp unit according to the second embodiment of the present invention is the same as the structure of the lamp unit 50 according to the first embodiment of the present invention except for the flexible circuit board assembly 102. [
그리고, 연성회로기판조립체(102)는 방열층(130)에 형성된 제1관통부(231)와 제2관통부(241)를 제외하고, 본 발명의 제1실시 예에 따른 연성회로기판조립체(100)의 구조와 동일하다.The flexible circuit board assembly 102 includes the flexible circuit board assembly 100 according to the first embodiment of the present invention except for the first through hole 231 and the second through hole 241 formed in the heat dissipation layer 130 100).
제1관통부(231)와 제2관통부(241)는 방열층(130)이 계단형태로 형성된 백플레이트부(210)에 대응되게 접할 때 제1고정돌기부(211) 또는 제2고정돌기부(216)가 관통되는 부분으로, 본 발명의 제2실시 예에 따른 엘이디 램프용 연성회로기판 조립체(102)를 백플레이트부(210)에 고정하기 위한 고정수단이 구비된다.The first penetrating portion 231 and the second penetrating portion 241 may be formed in the first fixing protrusions 211 or the second fixing protrusions 211 when the heat dissipation layer 130 is in contact with the back plate portion 210, 216 for fixing the flexible circuit board assembly 102 for an LED lamp according to the second embodiment of the present invention to the back plate portion 210 is provided.
제1관통부(231)는 제1고정돌기부(211)가 관통되는 부분이며, 제2관통부(241)는 제2고정돌기부(216)가 관통되는 부분이다.The first penetrating portion 231 is a portion through which the first fixing protruding portion 211 penetrates and the second penetrating portion 241 is a portion through which the second fixing protruding portion 216 penetrates.
제1관통부(231)와 제2관통부(241)는 제1고정돌기부(211) 또는 제2고정돌기부(216)의 직경보다 작은 내경을 갖는 원형상으로 관통형성되어, 제1고정돌기부(211) 또는 제2고정돌기부(216)가 관통시 제1고정돌기부(211) 또는 제2고정돌기부(216)에 간섭된다.The first penetrating portion 231 and the second penetrating portion 241 are formed in a circular shape having an inner diameter smaller than the diameter of the first fixing protrusions 211 or the second fixing protrusions 216, 211 or the second fixing protrusions 216 interfere with the first fixing protrusions 211 or the second fixing protrusions 216 when they pass therethrough.
제1관통부(231)는 제1고정돌기부(211)가 관통시 제1고정돌기부(211) 관통방향을 절곡되게 원주방향으로 일정간격마다 다수의 제1절재부(233)가 형성되어, 제1고정돌기부(211) 관통방향을 절곡되어 제1고정돌기부(211)의 외주면에 지지되어 방열층(130)을 위치 고정하여 수지층 및 엘이디를 위치고정하는 다수의 제1간섭부(255)가 구비된다.The first penetrating part 231 is formed with a plurality of first cut-out parts 233 at predetermined intervals in the circumferential direction so that the first penetrating part 211 is bent in the penetrating direction of the first fixing protruding part 211, A plurality of first interfering parts 255 which are bent in the penetrating direction of the first fixing protrusions 211 and supported on the outer circumferential surface of the first fixing protrusions 211 to fix the position of the heat dissipation layer 130 to fix the resin layer and the LEDs Respectively.
다수의 제1간섭부(255)는 돌출된 단부가 제1고정돌기부(211)와 간섭시 제1고정돌기부(211) 관통방향으로 절곡이 용이하도도록 저면에 상방으로 인입되고 폭 방향으로 연장되어, 제1고정돌기부(211) 간섭되는 단부보다 작은 두께를 갖는 제1절곡유도홈(256)를 각각 구비한다.The plurality of first interfering parts 255 extend upward in the bottom surface and extend in the width direction so that the protruding end portions can easily bend in the direction of penetrating the first fixing protrusions 211 when interfering with the first fixing protrusions 211 And a first bending guide groove 256 having a thickness smaller than an end portion of the first fixing protrusion 211 interfering with each other.
제2관통부(241)는 제2고정돌기부(216)가 관통시 제2고정돌기부(216) 관통방향을 절곡되게 원주방향으로 일정 간격마다 다수의 제2절재부(243)가 형성되어,제2고정돌기부(216) 관통방향을 절곡되어 제2고정돌기부(216)의 외주면에 지지되어 방열층(130)을 위치 고정하여 수지층 및 엘이디를 위치고정하는 다수의 제2간섭부(257)가 구비된다.A plurality of second cut-out portions 243 are formed at regular intervals in the circumferential direction so that the second through-holes 241 are bent in the passing direction of the second fixing protrusions 216 when the second fixing protrusions 216 penetrate, A plurality of second interfering parts 257 which are bent in the penetrating direction of the second fixing protrusions 216 and supported on the outer circumferential surface of the second fixing protrusions 216 to fix the position of the heat dissipation layer 130 to fix the resin layer and the LEDs Respectively.
다수의 제2간섭부(257)는 돌출된 단부가 제2고정돌기부(216)와 간섭시 제2고정돌기부(216) 관통방향으로 절곡이 용이하도록 저면에 상방으로 인입되고 폭 방향으로 연장되어, 제2고정돌기부(216) 간섭되는 단부보다 작은 두께를 갖는 제2절곡유도홈(258)를 각각 구비한다.The plurality of second interfering portions 257 extend upward in the bottom surface and extend in the width direction so that the protruding ends easily bend in the direction of penetrating the second fixing protrusions 216 when interfering with the second fixing protrusions 216, And the second fixing protrusion 216 has a second bending guide groove 258 having a thickness smaller than the interference end.
한편, 한편, 도 10에는 본 발명의 제3실시 예에 따른 램프유닛이 도시되어 있다. 앞서 도시한 도면에서와 동일 기능을 갖는 구성요소는 동일부호로 표기한다.Meanwhile, FIG. 10 shows a lamp unit according to a third embodiment of the present invention. Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
본 발명의 제3실시 예에 따른 램프유닛은 체결부재(200)의 돌기부에 이탈방지홈을 더 구비하는 것을 제외하고, 본 발명의 제1실시 예에 따른 램프유닛(50)의 구조와 동일하다.The lamp unit according to the third embodiment of the present invention is the same as the structure of the lamp unit 50 according to the first embodiment of the present invention except that the lamp unit 50 further includes a release preventing groove in the protrusion of the fastening member 200 .
이탈방지홈은 제1고정돌기부(211)에 형성된 제1이탈방지홈(213)과 제2고정돌기부(216)에 형성된 제2이탈방지홈(218)으로 구분된다.The separation preventing groove is divided into a first separation preventing groove 213 formed in the first fixing protrusion 211 and a second separation preventing groove 218 formed in the second fixing protrusion 216.
제1이탈방지홈(213)은 제1고정돌기부(211)의 외주면에 내측으로 인입되며 원주방향으로 연장되어, 절곡되어 접촉되는 제1관통부(131)의 다수의 간섭부(150)의 단부측 하부가 각각 걸려 절곡된 상태가 유지되게 한다. 제2이탈방지홈(216)은 제2고정돌기부(216)의 외주면에 내측으로 인입되며 원주방향으로 연장되어, 절곡되어 접촉되는 제2관통부(141)의 다수의 간섭부(150)의 단부측 하부가 각각 걸려 절곡된 상태가 유지되게 한다.The first release preventing groove 213 is extended in the circumferential direction to the inner side of the outer circumferential surface of the first fixing protrusion 211 and extends in the circumferential direction so that the ends of the plurality of interfering parts 150 of the first penetrating part 131, And the lower side is engaged with each other so that the bent state is maintained. The second release preventing groove 216 extends in the circumferential direction to the inside of the second fixing protrusion 216 and extends in the circumferential direction so that the ends of the plurality of interference portions 150 of the second through- And the lower side is engaged with each other so that the bent state is maintained.
본 발명의 제3실시 예에 따른 램프유닛은 제1관통부(131) 및 제2관통부(141)의 각 간섭부(150)가 절곡시, 제1고정돌기부(211)의 이탈방지홈(213)와 제2고정돌기부(216)의 이탈방지홈(218)에 고정되므로 연속회로기판조립체(100)와 체결부재(200)의 상호 결속력이 강화될 수 있다.In the lamp unit according to the third embodiment of the present invention, when each of the interference parts 150 of the first penetration part 131 and the second penetration part 141 is bent, 213 of the first circuit board 200 and the release preventing recess 218 of the second fixing protrusion 216 so that mutual coupling strength between the circuit board assembly 100 and the fastening member 200 can be enhanced.
한편, 한편, 도 11에는 본 발명의 제4실시 예에 따른 램프유닛이 도시되어 있다. 앞서 도시한 도면에서와 동일 기능을 갖는 구성요소는 동일부호로 표기한다.On the other hand, FIG. 11 shows a lamp unit according to a fourth embodiment of the present invention. Components having the same functions as those in the drawings shown above are denoted by the same reference numerals.
본 발명의 제4실시 예에 따른 램프유닛은 본 발명의 제3실시 예에 따른 램프유닛의 구조에 탄성가압부재(180)를 더 구비한다.The lamp unit according to the fourth embodiment of the present invention further includes an elastic pressing member 180 in the structure of the lamp unit according to the third embodiment of the present invention.
탄성가압부재(180)는 내부가 관통형성된 링 형상으로 형성되어 제1고정돌기부 또는 제2고정돌기부를 관통하여 백플레이트부(210)의 상면에 안착된다.The elastic pressing member 180 is formed into a ring shape having an inner through hole and is seated on the upper surface of the back plate portion 210 through the first fixing protrusion or the second fixing protrusion.
탄성가압부재(180)는 절곡되어 제1이탈방지홈(213)에 고정된 제1관통부(131)의 간섭부(150) 또는 제2이탈방지홈(218)에 고정된 제2관통부(141)의 간섭부(150)를 백플레이트부(210)에 멀어지는 방향으로 탄성지지한다.The resilient urging member 180 is bent to be inserted into the interference portion 150 of the first penetrating portion 131 fixed to the first detachment preventing groove 213 or the second penetrating portion 150 fixed to the second detaching preventing groove 218 141 in the direction away from the back plate portion 210. [0051]
이에 따라 연성회로기판조립체(100)는 간섭부(150)가 탄성가압부재(180)에 백플레이트부(210)에 멀어지는 방향으로 탄성지지되므로 제1이탈방지홈(213) 또는 제2이탈방지홈(216)으로부터 이탈되는 것이 방지될 수 있다.Accordingly, since the interfering portion 150 is resiliently supported by the elastic pressing member 180 in a direction away from the back plate portion 210, the flexible circuit board assembly 100 can prevent the first and second separation preventing grooves 213, It can be prevented that it is detached from the main body 216.
지금까지 본 발명에 따른 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛은 별도의 스태킹 공정 없이 연성회로기판조립체의 방열층의 형상을 이용하여 체결부재에 고정될 수 있으므로 제작공정이 간소화 되어 생산성을 향상시킬 수 있고 LED의 손상을 방지할 수 있어 불량률을 줄일 수 있는 이점이 있다.The flexible circuit board assembly having the fixing means according to the present invention and the lamp unit using the same can be fixed to the fastening member using the shape of the heat radiation layer of the flexible circuit board assembly without a separate stacking process, It is possible to improve the productivity and to prevent the damage of the LED, thereby reducing the defect rate.
이상에서 본 발명에 따른 고정수단을 구비한 연성회로기판조립체와 이를 이용한 램프유닛은 도면에 도시된 일 예를 참조로 설명하였으나 이는 예시적인 것에 불과하며, 당해 기술분야에서 통상의 지식을 가진자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호의 범위는 첨부된 청구범위의 기술적 사상에 의해서 정해져야 할 것이다.While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and equivalent embodiments are possible. Therefore, the scope of the true technical protection of the present invention should be determined by the technical idea of the appended claims.

Claims (6)

  1. 수지층과; 상기 수지층의 상부에 형성되는 도전성 시그널라인층과; 상기 도전성 시그널라인층에 실장되는 엘이디로부터 발생된 열을 방출하기 위해 상기 수지층의 하부에 설치되며 고정을 위해 하방 측에서 결합되는 체결부재에 형성된 돌기부가 상기 수지층을 관통할 수 있도록 관통부가 형성된 방열층과; 상기 돌기부에 고정될 수 있는 고정수단;을 구비하고,A resin layer; A conductive signal line layer formed on the resin layer; A through portion is formed at a lower portion of the resin layer to emit heat generated from the LED mounted on the conductive signal line layer and a protrusion formed on a fastening member coupled to the lower side for fixing the through hole, A heat dissipation layer; And fixing means which can be fixed to the protruding portion,
    상기 고정수단은The fixing means
    상기 방열층이 상기 방열층의 상기 관통부를 관통한 상기 돌기부에 고정될 수 있도록, 상기 돌기부가 상기 관통부에 관통시 상기 돌기부에 간섭되어 상기 돌기부 관통방향으로 절곡되면서 상기 돌기부에 지지되어 상기 방열층을 위치고정하는 간섭부를 구비하는 것을 특징으로 하는 고정수단을 구비한 연성회로기판조립체.The protruding portion interferes with the protruding portion when the protruding portion penetrates the penetrating portion and is bent in the protruding portion passing direction so that the protruding portion penetrates through the penetrating portion of the heat dissipating layer, And an interfering part for fixing the position of the fixing part to the fixing part.
  2. 제 1항에 있어서, 상기 간섭부는The apparatus of claim 1,
    상기 관통부를 관통한 상기 돌기부에 대해 방사방향으로 다수 개 형성되며,A plurality of protrusions penetrating through the penetration portion are formed in the radial direction,
    다수의 상기 간섭부는A plurality of said interfering portions
    사각 형상으로 관통형성된 상기 관통부의 각 내주면 중심측에서 각각 돌출형성되며,Wherein the through-hole is formed in a rectangular shape and protrudes from a center side of each inner circumferential surface of the through-
    상기 돌기부와 간섭시 상기 돌기부 관통방향으로 절곡유도되도록 저면에 상방으로 인입 형성되고폭 방향으로 연장되어 상기 돌기부와 간섭되는 단부보다 작든 두께를 갖는 절곡유도홈을 각각 구비하는 것을 특징으로 하는 고정수단을 구비한 연성회로기판조립체.And a bending guide groove extending upward in the bottom surface to be bent in the protruding portion penetrating direction when interfering with the protruding portion and having a thickness smaller than an end portion extending in the width direction and interfering with the protruding portion, And a flexible circuit board assembly.
  3. 제 1항에 있어서, 상기 관통부는2. The apparatus of claim 1, wherein the through-
    상기 돌기부보다 작은 내경을 갖는 원형상으로 관통형성되고, 상기 돌기부가 관통시 상기 돌기부 관통방향으로 절곡되게 원주방향으로 일정간격마다 절재부가 형성되어, 상기 간섭부가 상기 관통부를 관통한 상기 돌기부에 대해 원주방향으로 다수 개 형성되며,Wherein the cutout portion is formed in a circular shape having an inner diameter smaller than that of the protruding portion and is formed at regular intervals in the circumferential direction so that the protruding portion is bent in the protruding portion penetrating direction when the protruding portion penetrates, Direction,
    다수의 상기 간섭부는A plurality of said interfering portions
    상기 돌기부와 간섭시 상기 돌기부 관통방향으로 절곡 유도되도록 저면에 상방으로 인입 형성되고폭 방향으로 연장되어 상기 돌기부와 간섭되는 단부보다 작든 두께를 갖는 절곡유도홈을 각각 구비하는 것을 특징으로 하는 고정수단을 구비한 연성회로기판조립체.And a bending guide groove extending upward in the bottom surface to be bent in the protruding portion penetrating direction when interfering with the protruding portion and having a thickness smaller than an end portion extending in the width direction and interfering with the protruding portion, And a flexible circuit board assembly.
  4. 수지층과, 상기 수지층의 상부에 형성되는 도전성 시그널라인층과, 상기 도전성 시그널라인층에 실장되는 엘이디로부터 발생된 열을 방출하기 위해 상기 수지층의 하부에 설치되는 방열층을 포함하는 연성회로기판조립체와;A conductive signal line layer formed on the resin layer, and a heat radiation layer provided on a lower portion of the resin layer to emit heat generated from the LED mounted on the conductive signal line layer, A substrate assembly;
    상기 연성회로기판조립체를 고정하기 위해 상기 방열층에 형성된 관통부를 관통하는 돌기부가 형성된 체결부재와;A coupling member having a protrusion formed through the penetration formed in the heat dissipation layer to fix the flexible circuit board assembly;
    상기 엘이디의 광을 반사하여 확산시키는 리플렉터;를 구비하고,And a reflector for reflecting and diffusing the light of the LED,
    상기 연성회로기판조립체는 상기 돌기부에 고정될 수 있는 고정수단을 구비하고,Wherein the flexible circuit board assembly has fixing means that can be fixed to the protruding portion,
    상기 고정수단은The fixing means
    상기 방열층이 상기 방열층의 상기 관통부를 관통한 상기 돌기부에 고정될 수 있도록, 상기 돌기부가 상기 관통부에 관통시 상기 돌기부에 간섭되어 상기 돌기부 관통방향으로 절곡되면서 상기 돌기부에 지지되어 상기 방열층을 위치고정하는 간섭부를 구비하고,The protruding portion interferes with the protruding portion when the protruding portion penetrates the penetrating portion and is bent in the protruding portion passing direction so that the protruding portion penetrates through the penetrating portion of the heat dissipating layer, And an interfering portion for fixing the position of the light-
    상기 간섭부는The interference unit
    상기 돌기부와 간섭시 상기 돌기부 관통방향으로 절곡 유도되도록 저면에 상방으로 인입 형성되도록 방향으로 연장되어 상기 돌기부와 간섭되는 단부보다 작은 두께를 갖는 절곡유도홈을 각각 구비하는 것을 특징으로 하는 램프유닛.And a bent guide groove having a thickness smaller than that of an end portion extending in a direction so as to be pulled upward on a bottom surface so as to be bent in the protruding portion penetrating direction when interfering with the protruding portion and interfering with the protruding portion.
  5. 제 1항에 있어서, 상기 돌기부는 2. The apparatus according to claim 1,
    외주면에 내측으로 인입되며 원주방향으로 연장되어 절곡되어 접촉되는 상기 관통부에 형성된 상기 간섭부의 단부측 하부가 걸려 절곡된 상태를 유지시키는 이탈방지홈을 더 구비하는 것을 특징으로 하는 램프유닛.Further comprising a release preventing groove for retaining a bent state of the lower portion of the end portion side of the interference portion formed in the penetrating portion which is inserted into the outer circumferential surface and extends in the circumferential direction and is bent and contacted.
  6. 제5항에 있어서, 6. The method of claim 5,
    내부가 관통형성된 링 형상으로 형성되어 상기 돌기부를 관통하여 상기 체결부재의 일면에 안착되어 절곡되어 상기 이탈방지홈에 고정된 상기 간섭부를 상기 체결부재에 멀어지는 방향으로 탄성지지하는 탄성가압부재를 더 구비하는 것을 특징으로 하는 램프유닛.And an elastic pressing member which is formed in a ring shape having a through hole penetrating the protruding portion and which is seated on one surface of the coupling member and bent to elastically support the interference portion fixed to the release preventing groove in a direction away from the coupling member And the lamp unit.
PCT/KR2018/014623 2017-11-24 2018-11-26 Flexible circuit board assembly having fixing means and lamp unit using same WO2019103553A1 (en)

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KR10-2018-0146323 2018-11-23
KR1020180146323A KR102148019B1 (en) 2017-11-24 2018-11-23 Lamp unit utilizing flexible printed circuit board having fixing means for bcak plate and

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3139880A1 (en) * 2022-09-20 2024-03-22 Valeo Vision motor vehicle lighting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238988A (en) * 2008-03-27 2009-10-15 Furukawa Electric Co Ltd:The Heat sink fixing member
JP2014063975A (en) * 2012-08-31 2014-04-10 Nidec Copal Corp Flexible printed wiring board and apparatus equipped with the same
KR101501163B1 (en) * 2008-06-30 2015-03-12 서울반도체 주식회사 Light generating structure
KR101679673B1 (en) * 2016-05-16 2016-11-25 주식회사 창우 Illuminating light for roadway lighting
KR20170084800A (en) * 2016-01-13 2017-07-21 세종머티리얼즈 주식회사 Metal PCB Assembly for lamp of vehicle and method for assembling the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238988A (en) * 2008-03-27 2009-10-15 Furukawa Electric Co Ltd:The Heat sink fixing member
KR101501163B1 (en) * 2008-06-30 2015-03-12 서울반도체 주식회사 Light generating structure
JP2014063975A (en) * 2012-08-31 2014-04-10 Nidec Copal Corp Flexible printed wiring board and apparatus equipped with the same
KR20170084800A (en) * 2016-01-13 2017-07-21 세종머티리얼즈 주식회사 Metal PCB Assembly for lamp of vehicle and method for assembling the same
KR101679673B1 (en) * 2016-05-16 2016-11-25 주식회사 창우 Illuminating light for roadway lighting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3139880A1 (en) * 2022-09-20 2024-03-22 Valeo Vision motor vehicle lighting device
WO2024061502A1 (en) * 2022-09-20 2024-03-28 Valeo Vision Motor vehicle lighting device

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