WO2019100976A1 - 一种长条银石墨电接触材料与焊料带材快速复合制备方法 - Google Patents

一种长条银石墨电接触材料与焊料带材快速复合制备方法 Download PDF

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WO2019100976A1
WO2019100976A1 PCT/CN2018/115333 CN2018115333W WO2019100976A1 WO 2019100976 A1 WO2019100976 A1 WO 2019100976A1 CN 2018115333 W CN2018115333 W CN 2018115333W WO 2019100976 A1 WO2019100976 A1 WO 2019100976A1
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Prior art keywords
electrical contact
silver
silver graphite
solder
strip
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PCT/CN2018/115333
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English (en)
French (fr)
Inventor
张泽忠
吴新合
穆成法
王开旭
吕鹏举
陈林驰
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温州宏丰电工合金股份有限公司
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Application filed by 温州宏丰电工合金股份有限公司 filed Critical 温州宏丰电工合金股份有限公司
Priority to US16/760,452 priority Critical patent/US10818447B2/en
Priority to ES18881487T priority patent/ES2908289T3/es
Priority to PL18881487T priority patent/PL3709327T3/pl
Priority to EP18881487.5A priority patent/EP3709327B1/en
Publication of WO2019100976A1 publication Critical patent/WO2019100976A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/027—Composite material containing carbon particles or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • H01H2011/067—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier by deforming, e.g. bending, folding or caulking, part of the contact or terminal which is being mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Definitions

  • the invention discloses a preparation method of an electrical contact material composite solder, in particular to a short-flow high-efficiency preparation method for quickly compounding a long silver-based electrical contact material and a solder strip material, belonging to the field of low-voltage electrical contact material preparation and material processing. .
  • the electrical contact material is responsible for switching on, breaking, carrying and isolating current in the switchgear, and is a key functional material in the switchgear.
  • a large number of brazing techniques are used, especially the electrical contacts of the large-capacity switch, the quality of the brazing is good for the reliability of the electrical appliance, and the arc of the electrical contact Burning and service life have a very important impact.
  • the performance and quality of electrical contact materials directly affect the safety, reliability and life of the switchgear.
  • the brazing material commonly used in electric contact materials is silver-based or copper-based materials.
  • AgWCC powder and Ag powder are placed in the cavity, and AgWCC/Ag is prepared by cold pressing technology.
  • Materials, Ag as a solder material, other similar such as AgNi/Ag, AgNi/CuNi, etc.
  • decarburization technology is usually used to remove graphite on the surface of silver graphite material to form a thin layer of nearly pure silver layer as the welding layer, and the thickness of the near pure silver layer is The uniformity depends mainly on the decarburization temperature, time and atmosphere.
  • the welding layer requiring electrical contact material has the thickness of the near pure silver layer to be controlled and the thickness consistency is good, etc., the process control point is high, and the equipment consumes a large amount of energy. Production time.
  • the decarburization technology is suitable for the manufacture of granular, small block silver graphite electrical contact materials, which is not suitable for continuous strips of silver graphite electrical contact materials or strips.
  • electrical contact materials with solder layers are easier to automate in the field of electrical contact materials, increasing production efficiency and reducing production costs.
  • Chinese invention patent ZL200910153565.2 discloses a method for preparing silver graphite electrical contact strip, which is coated with a silver layer on the outer side of the silver graphite spindle, and then subjected to extrusion pressure complex silver process to prepare the thickness of the silver layer to be controlled.
  • a complex silver-silver graphite strip with a complex silver layer is disclosed.
  • the above patent is wrapped with a silver layer on the periphery of a silver graphite spindle, and is extruded at 7207730 ° C for 273 h to prepare a silver graphite strip with a complex silver layer (the strip has a two-layer structure on the metallographic phase, that is, an AgC layer). With sterling silver layer).
  • the silver graphite spindle wraps the silver layer. During the thermal sintering process, it is difficult to combine the cylindrical interface of the silver graphite spindle with the pure silver layer. There are many unbonded regions, and there are many holes in the bonding region.
  • the interface that is not densified often causes the outer wrap layer, ie, the pure silver layer, to peel off and fall off, and the interface bonding strength is weak.
  • a continuous layer of pure silver cannot be formed on the extruded silver graphite strip. low.
  • the above patent is to obtain a layer of pure silver with controllable thickness.
  • a part of the layer of pure silver will become waste and form a hollow cylindrical pure silver material, and the remaining wrapping layer After extrusion, a layer of pure silver is formed, and the utilization rate of the layer of pure silver is low.
  • the above-mentioned patented silver graphite strip with a pure silver layer obtained after extruding the spindle can be inferred to have three layers, and the silver graphite material is between the upper and lower layers of pure silver, ie Ag/AgC/Ag. Structure, which leads to the need to remove a layer of pure silver, such as subsequent polishing, which is similar to the removal of pure silver layer after silver decarburization as a whole, and the silver graphite is exposed as a working layer, which is difficult and time-consuming to process.
  • the above patented sterling silver layer is wrapped with a silver graphite spindle, and extruded to obtain a silver graphite strip with a layer of pure silver.
  • a higher level of extrusion and operational skill are required.
  • the object of the present invention is to provide a short-flow high-efficiency preparation method for quickly combining a long silver graphite electrical contact material with a solder strip material, which can solve the above-mentioned technical problems, and has simple operation and simplified flow. And the rate of finished products is high.
  • the method for rapidly compounding a long strip of silver graphite electrical contact material and a solder strip according to the present invention comprises the following steps:
  • the silver graphite spindle is prepared into a silver graphite electrical contact plate by an extrusion process
  • the solder strip is electrically combined with the silver graphite sheet to be sintered and composited to obtain a composite blank
  • the composite blank is subjected to rolling and heat treatment, and the rolling and heat treatment are performed one or more times to complete the composite of the long silver graphite electrical contact material and the solder strip.
  • the extrusion is hot extrusion
  • the spindle sintering temperature is at 600-700 ° C
  • the sintering time is 1-5 h.
  • the silver graphite electrical contact sheet has a U-shaped structure with a card slot.
  • the silver graphite electrically contacts the sheet material and has a length of 5 to 50 m.
  • the card slot holds the long strip of silver graphite sheet and the solder strip so that the faces of the two are in close contact with the surface, and the solder strip can cover the card slot to form a good solder layer during sintering. .
  • the extruded silver graphite sheet in the invention has a long degree of 5-50 m, and the silver graphite is soft. After the solder strip is stuck in the card slot, the silver graphite sheet can be rolled into a bundle for sintering and compounding, and the long strip silver is improved. The production efficiency of graphite. In addition, the card slot prevents solder from falling out.
  • silver graphite wire or strip is obtained by extrusion of silver graphite spindle, and then punched to obtain granular or flake-like silver graphite, and then decarburized to form a near-silver layer to obtain silver graphite electrical contact material.
  • the thickness of the decarburized layer is not uniform, that is, the wire is prepared by extrusion-punching into small pieces-decarburization-subsequent treatment (such as removing the pure silver layer of the working surface, densification of the whole type, etc.) to obtain a finished product.
  • the invention adopts a long strip of silver graphite sheet, and after sintering the composite solder, the thickness of the solder layer can be made uniform by rolling, and the thickness can be controlled, that is, the sheet is prepared by extrusion-composite solder-punching to obtain a finished product.
  • the whole method is simple in operation, simplified in process, and high in yield.
  • the solder strip is stuck on the card slot for sintering the composite solder, the sintering temperature is 600-700 ° C, and the protective atmosphere is hydrogen.
  • the sintering temperature selected here reaches the melting point of the solder strip so that the solder melts over the card slot and forms a solder layer after cooling.
  • the rolling is cold rolling, so that the silver graphite sheet is combined with the solder strip to form a compact, and the composite silver graphite is rolled to a desired thickness of the finished product.
  • the heat treatment is diffusion annealing, wherein the temperature is 400-600 ° C, and the time is 0.5-3 h.
  • diffusion annealing can eliminate internal stress during rolling and eliminate defects such as deformation and cracking caused by stress release.
  • the punching is to punch the silver graphite material rolled to the finished thickness into the outer dimensions of the desired product.
  • the present invention has the following beneficial effects:
  • the method for rapidly compounding a long silver graphite electrical contact material and a solder material strip provided by the invention wherein the melting point of the solder strip is 600-700 ° C lower than the melting point of silver (about 961 ° C), and further, the silver content can be selected.
  • the solder strip the solder melted at medium temperature has good wettability with silver graphite, and can be spread on the surface of silver graphite to form a solder layer with good surface quality.
  • the card slot can confine the molten solder to the card slot without flowing to the side of the board, without solder on the side, and the appearance is beautiful.
  • the sintering of the long silver graphite sheet is not only the uniform distribution of the solder layer on the surface of the silver graphite but also the thickness controllable.
  • silver graphite prepared by decarburization technology is generally used, and the decarburized layer can be used as a soldering layer, the thickness of the soldering layer is not uniform, or the composite solder is used as a soldering layer after decarburization, and the process is cumbersome; the present invention is sintered.
  • Composite solder instead of decarburizing or rolling composite solder, streamlined process and high production efficiency.
  • the invention first prepares a silver graphite plate with solder, and obtains a finished product by punching, and the finished product has high dimensional precision, and no need for size screening, and automatic welding can be realized.
  • the invention can realize high-efficiency continuous compounding of long silver graphite electric contact plates and solder strips, and produce products with good interface bonding quality and high product dimensional precision, high consistency of welding layer thickness, continuous process and process can be realized Short, conducive to the realization of welding automation, with significant economic benefits.
  • FIG. 1 is a flow chart of a preparation method according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the main structure of an AgC plate having a U-shaped card slot structure formed by hot extrusion of an AgC spindle according to an embodiment of the present invention
  • FIG 3 is a cross-sectional metallographic photograph (left) of a strip of AgC3 sheet sintered composite solder strip according to an embodiment of the present invention, and a metallographic photograph of the solder layer and the card slot portion 200 ⁇ (right);
  • FIG. 4 is a finished metallographic photograph of an AgC4 electrical contact material in accordance with an embodiment of the present invention.
  • the specific preparation is composed of the following steps:
  • AgC4 spindle with diameter of 90mm was prepared by powder metallurgy technology. After sintering at 750 °C for 3h, hot extrusion was carried out to obtain long continuous AgC4 sheet with card slot structure of Figure 2. The thickness of the sheet was 2.1mm and the length was 35-45m;
  • the rolling deformation amount is 12%-16%
  • the annealing temperature is 500 ° C
  • the annealing time is 1 h
  • the protective atmosphere is hydrogen
  • the specific preparation is composed of the following steps:
  • AgC3 spindle with diameter of 100mm was prepared by powder metallurgy technology. After sintering at 740 °C for 3.5h, it was hot extruded to obtain a long AgC3 plate with U-shaped card slot structure. The thickness of the plate was 3.3mm. The length is 25-35m;
  • the rolling deformation amount is 15%-20%
  • the annealing temperature is 490 ° C
  • the annealing time is 1.5 h
  • the protective atmosphere is hydrogen
  • the finished AgC3 electrical contact material of the required specifications such as bubble point
  • the specific preparation includes the following steps:
  • AgC5 spindle with diameter of 100mm was prepared by powder metallurgy technology. After sintering at 760 °C for 3h, it was hot extruded to obtain long AgC5 sheet with U-shaped card slot structure. The thickness of the sheet was 3.4mm and the length was 3.4mm. 25-35m;
  • the rolling deformation amount is 15%-20%
  • the annealing temperature is 495 ° C
  • the annealing time is 2 h
  • the protective atmosphere is hydrogen
  • FIG. 2 it is a hot extruded silver graphite sheet in the embodiment of the present invention.
  • the sheet is U-shaped and has a card slot structure.
  • the height of the card slot depends on the thickness of the solder strip, in an embodiment. In the middle, the thickness of the strip can be +0.0270.04mm, which ensures that the strip is clamped, and the interface between the silver graphite and the strip is tightly combined when the composite strip is sintered.
  • the card slot can hold the long strip of silver graphite sheet and the solder strip so that the faces of the two are in close contact with the surface, and the solder strip can cover the card slot to form a good solder layer during sintering.
  • the silver extruded graphite sheet of the invention has a long degree, and the silver graphite is soft.
  • the silver graphite sheet can be rolled into a bundle for sintering and compounding, thereby improving the production efficiency of the long strip of silver graphite.
  • the card slot prevents solder from falling out.
  • the thickness of the soldering layer can be made uniform by rolling, and the thickness can be controlled, that is, the extruded sheet material-composite solder-punching is used to obtain the finished product.
  • the silver-graphite electrical contact plate after the sintered composite solder strip prepared by the invention has a tight interface with the solder ribbon, and the middle portion is a porous structure after the sintering of the strip. Subsequent rolling can compact the strip.
  • FIG. 4 it is a finished metallographic photograph of the AgC4 electrical contact material in the embodiment of the present invention, the interface is densely combined, and the thickness uniformity of the solder layer is high.
  • the above embodiment of the invention is prepared by extrusion + sintering + cold rolling + heat treatment, which is beneficial to shortening the cycle, improving production efficiency and saving production cost.
  • the invention can obtain a good dense silver graphite plate by extruding a pure silver graphite spindle, and the plate is sintered and composited with a solder strip, and the desired silver graphite material can be obtained by rolling and heat treatment.
  • the method of the invention is simple in operation, simplified in flow, and high in yield.
  • the invention can realize high-efficiency continuous compounding of the long silver graphite electric contact plate and the solder strip, and produces a product with good interface bonding quality and high product dimensional precision, and the welding layer has high thickness consistency, can realize continuous, short process, and is favorable for the process. Achieving welding automation has significant economic benefits.

Abstract

一种长条银石墨电接触材料与焊料带材快速复合制备方法，步骤为：第一步，采用挤压工艺将银石墨锭子制备成银石墨电接触板材；第二步，将焊料带材与该银石墨电接触板材进行烧结复合，得到复合坯料；第三步，对该复合坯料进行轧制与热处理，该轧制与热处理为一次或多次，完成长条银石墨电接触材料与焊料带材的复合。可实现长条银石墨电接触板材与焊料带材的高效快速复合，生产出界面结合质量好、产品尺寸精度高的产品，可实现连续化、流程短、利于实现焊接自动化。

Description

一种长条银石墨电接触材料与焊料带材快速复合制备方法 技术领域
本发明公开了一种电接触材料复合焊料的制备方法，特别是一种长条银基电接触材料与焊料带材快速复合的短流程高效制备方法，属于低压电接触材料制备领域与材料加工领域。
背景技术
电触头材料在开关电器中担负着接通、分断、承载与隔离电流的任务，是开关电器中关键的功能材料。为了实现电触头材料与触桥、接触板的有效焊接，大量使用钎焊技术，尤其是大容量开关的电触头，钎焊质量的好坏对电器的可靠性、对电触头的电弧烧损与使用寿命有着非常重要的影响，电触头材料的性能与焊接质量直接影响着开关电器运行的安全、可靠性与寿命。
电触头材料中常用的钎焊材料为银基或铜基材料，如制备AgWCC类电接触材料时，在模腔里铺上AgWCC粉体与Ag粉体，通过冷等压制技术制备AgWCC/Ag材料，Ag作为焊接材料，其他类似的如AgNi/Ag、AgNi/CuNi等。
对粉末冶金制备的粒状或块状银石墨电接触触头材料，通常采用脱碳技术在银石墨材料表面脱去石墨，形成一薄层近纯银层作为焊接层，近纯银层的厚度与均匀性主要取决于脱碳温度、时间与气氛。为确保银石墨电接触材料具有焊接质量可靠且一致性高，需要电接触材料的焊接层具有近纯银层厚度可控与厚度一致性好等，对工艺控制点要求高，设备耗能大，生产费时。脱碳技术适合制造粒状、小块状银石墨电触头材料，对连续的长条银石墨电接触材料板材或带材不适用。
相对于电接触触头与焊剂或焊膏，带有焊接层的电接触触头材料在电接触材料领域，更易实现焊接自动化，提高生产效率与降低生产成本。
经检索，中国发明专利ZL200910153565.2，公开一种银石墨电接触带材制备方法，其将银石墨锭子外侧包裹一层银层，然后进行挤压压力复银工艺，制备出银层厚度可控的带有复银层的复银银石墨带材。但存在以下不足：
1.上述专利在银石墨锭子外围包裹银层，通过7207730℃下保温273h后进行挤压制备带有复银层的银石墨带材(该带材在金相上为两层结构，即AgC层与纯银层)。银石墨锭子包裹银层，在热烧结过程中，很难将银石墨锭子与纯银层两者的圆柱形界面结合紧密，存在很多的未结合区，在结合区也将存在很多的孔洞。在挤压时，未致密化的界面往往导致外围的包裹层即纯银层出现脱皮、脱落，界面结合强度弱，在挤压后的银石墨带材上不能形成连续的纯银层，成材率低。
2.上述专利要获得厚度可控的纯银层，外围的包裹层纯银层在挤压时，一部分包裹层纯银层会变成废料形成空心圆柱状的纯银料，剩下的包裹层挤压后形成纯银层，包裹层纯银层的利用率较低。
3.上述专利挤压锭子后获得的带有纯银层的银石墨带材，可以推断其结构为三层，银石墨材料处在上下两层的纯银层之间，即Ag/AgC/Ag结构，这导致需要将一个面的纯银层去除，如后续的抛光，这与银石墨整体脱碳后去除纯银层类似，将银石墨裸露作为工作层，后续处理困难费时。
4.上述专利纯银层包裹银石墨锭子，挤压后获得带有纯银层的银石墨带材。要使带材具有厚度均匀且厚度可控的纯银层，需要较高的挤压水平与操作技巧。
发明内容
针对现有技术的缺陷，本发明的目的是提供一种长条银石墨电接触材料与焊料带材快速复合的短流程高效制备方法，能解决上述存在的技术问题，且操作简单，流程简化，且成材率高。
为实现上述目的，本发明所述的长条银石墨电接触材料与焊料带材快速复合制备方法，包括以下步骤：
第一步，采用挤压工艺将银石墨锭子制备成银石墨电接触板材；
第二步，将焊料带材与所述银石墨电接触板材进行烧结复合，得到复合坯料；
第三步，对所述复合坯料进行轧制与热处理，所述轧制与热处理为一次或多次，完成长条银石墨电接触材料与焊料带材的复合。
优选地，第一步中，所述挤压为热挤压，锭子烧结温度为在600-700℃，烧结时间为1-5h。
优选地，第一步中，所述银石墨电接触板材具有呈U型带有卡槽的结构。
优选地，第一步中，所述银石墨电接触板材，长度为5-50m。
更优选地，所述卡槽将长条的银石墨板材与焊料带材卡住，使得两者的面与面紧密接触，在烧结时，焊料带材可以覆盖在卡槽中形成良好的焊接层。
本发明中的挤压银石墨板材的程度较长，为5-50m，银石墨质软，将焊料带材卡在卡槽后，可以将银石墨板材卷成捆进行烧结复合，提高长条银石墨的生产效率。此外，卡槽可以防止焊料脱落。通常在批量生产中，大多采用挤压银石墨锭子获得银石墨丝材或带材，然后进行冲制得到粒状、片状的银石墨，然后脱碳形成近纯银层，获得银石墨电接触材料，脱碳层的厚度不均匀，即采用挤压制备丝材-冲制成小块-脱碳-后续处理(如除去工作面纯银层，整型致密化等)得到成品。而本发明采用长条银石墨板材，在烧结复焊料后，通过轧制可使得焊接层厚度均匀，且厚度可控，即采用挤压制备板材-复合焊料-冲制得到成品。整个方法操作简单，流程简化，且成材率高。
优选地，第二步中，将焊料带材卡在板材卡槽上进行烧结复合焊料，烧结温度为600-700℃，保护气氛为氢气。此处选择的烧结温度达到焊料带材的熔点，使得焊料熔化覆盖在卡槽部位，冷却后形成焊接层。
优选地，第三步中，所述轧制为冷轧，使得银石墨板材与焊料带材复合后结合致密，且将复合后的银石墨轧到成品所需厚度。
优选地，第三步中，所述热处理为扩散退火，其中温度为400-600℃，时间为0.5-3h。采用扩散退火可以消除轧制过程中的内应力，消除应力释放产生的变形与开裂等缺陷。
进一步的，在完成长条银石墨电接触材料与焊料带材的复合后，进一步进行冲制，得到带有焊接层的电接触触头材料。
所述冲制是将轧制到成品厚度的银石墨材料冲制成所需产品的外围尺寸。
与现有技术相比，本发明具有以下有益效果：
1.本发明提供的长条银石墨电接触材料与焊料料带材快速复合方法，其中焊料带材的熔点600-700℃较银的熔点(约961℃)低，进一步的，可以选择银含量较高的焊料带材，中温下熔化后的焊料与银石墨具有良好的润湿性，可以在银石墨的表面铺展开来，形成表面质量良好的焊接层。
2.卡槽可以将熔化的焊料局限在卡槽部位，而不会流动到板材的侧面，侧面 无焊料，外表美观。
3.由于制备的焊料带材的厚度均匀且厚度可控，对长条银石墨板材进行烧结复焊料，不仅使得银石墨表面的焊接层分布均匀且厚度可控。
4.现有技术中，通常采用脱碳技术制备的银石墨，脱碳层可作为焊接层，焊接层厚度不均匀，或脱碳后再进行复合焊料作为焊接层，流程繁琐；本发明以烧结复合焊料，取代脱碳或轧制复合焊料，流程简化，生产效率高。
5.本发明先制备带有焊料的银石墨板材，通过冲制后获得成品，成品的尺寸精度高，无需进行尺寸筛选，可以实现自动化焊接。
综上，本发明可实现长条银石墨电接触板材与焊料带材的高效连续复合，生产出界面结合质量好、产品尺寸精度高的产品，焊接层厚度一致性高，可实现连续化、流程短、利于实现焊接自动化，具有显著的经济效益。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显：
图1为本发明一实施例中制备方法流程图；
图2是本发明一实施例中的AgC锭子热挤压后形成的呈U型带卡槽结构的AgC板材的主要结构示意图；
图3为本发明一实施例长条AgC3板材烧结复合焊料带材后的横截面金相照片(左图)，及焊料层与卡槽部位200×下金相照片(右图)；
图4是本发明一实施例中的AgC4电接触材料的成品金相照片。
具体实施方式
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明，但不以任何形式限制本发明。应当指出的是，对本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进。这些都属于本发明的保护范围。
如图1所示，本发明以下实施例中的制备方法按照图1中所示的流程进行实施。
实施例1：
以AgC4电接触材料制备为例，具体制备由以下步骤构成：
(1)通过粉末冶金技术制备了直径为90mm的AgC4锭子，在750℃下烧结3h后进行热挤压，得到具有图2卡槽结构的长条连续AgC4板材，板材厚度为2.1mm，长度为35-45m；
(2)将BCu77PAg料带均匀地卡在AgC4卡槽中，进行烧结复合焊料，烧结温度为730℃，保护气氛为氢气，使得AgC4与焊料结合紧密；
(3)将复合料带后的AgC4板材进行多次冷轧与退火热处理，然后轧制至成品所需厚度。
本步骤中，每道轧制变形量为12％-16％，退火温度为500℃，退火时间为1h，保护气氛为氢气；
(4)经冲制后获得所需外围尺寸的成品AgC4电接触材料。
实施例2：
以AgC3电接触材料制备为例，具体制备由以下步骤构成：
(1)通过粉末冶金技术制备了直径为100mm的AgC3锭子，740℃下烧结3.5h后进行热挤压，得到具有呈U型带有卡槽结构的长条AgC3板材，板材厚度为3.3mm，长度为25-35m；
(2)将BAg25CuZn焊料料带均匀平整地卡在AgC3卡槽中进行烧结复合焊料，温度为740℃，保护气氛为氢气，使得AgC3与料带之间结合紧密；
(3)将复合料带后的AgC3板材进行多次冷轧与退火热处理，再轧制至成品所需厚度。
本步骤中，每道轧制变形量为15％-20％，退火温度为490℃，退火时间为1.5h，保护气氛为氢气；
(4)经冲制后获得所需规格的成品AgC3电接触材料，如泡点等。
实施例3：
以AgC5电接触材料制备为例，具体制备包括以下步骤：
(1)通过粉末冶金技术制备了直径为100mm的AgC5锭子，760℃下烧结 3h后进行热挤压，得到具有呈U型带有卡槽结构的长条AgC5板材，板材厚度为3.4mm，长度为25-35m；
(2)将BAg30CuZnSn焊料料带均匀平整地卡在AgC5卡槽中进行烧结复合焊料，温度为770℃，保护气氛为氢气，使得AgC5与料带之间结合紧密；
(3)将复合料带后的AgC5板材进行多次冷轧与退火热处理，再轧制至成品所需厚度。
本步骤中，每道轧制变形量为15％-20％，退火温度为495℃，退火时间为2h，保护气氛为氢气；
(4)经冲制后获得所需规格的成品AgC5电接触材料。
参照图2所示，是本发明实施例中的热挤压后的银石墨板材，该板材呈U型且带有卡槽结构，卡槽的高度取决于焊料料带的厚度，在一实施例中，可以为料带厚度+0.0270.04mm，确保将料带卡紧，在烧结复合料带时使得银石墨与料带的界面结合紧密。本发明中，卡槽可以将长条的银石墨板材与焊料带材卡住，使得两者的面与面紧密接触，在烧结时，焊料带材可以覆盖在卡槽中形成良好的焊接层。同时，本发明挤压银石墨板材的程度较长，银石墨质软，将焊料带材卡在卡槽后，可以将银石墨板材卷成捆进行烧结复合，提高长条银石墨的生产效率。此外，卡槽可以防止焊料脱落。
本发明中的长条银石墨板材，在烧结复焊料后，通过轧制可使得焊接层厚度均匀，且厚度可控，即采用挤压制备板材-复合焊料-冲制得到成品。
参照图3所示，根据上述实施例，本发明制备的烧结复合焊料料带后的银石墨电接触板材，银石墨板材与焊料料带界面结合紧密，中间部分呈料带烧结后的多孔结构，后续的轧制可将料带轧致密。
参照图4所示，为本发明实施例中的AgC4电接触材料的成品金相照片，界面结合致密，焊接层厚度均匀性高。
本发明上述实施例采用挤压+烧结+冷轧+热处理制备，有利于缩短周期，提高生产效率与节约生产成本。
本发明通过挤压纯的银石墨锭子，可以获得良好的致密银石墨板材，将该板材与焊料带材烧结复合，通过轧制与热处理即可获得所需的银石墨材料。相对于现有技术(包括ZL200910153565.2)，本发明方法操作简单，流程简化，且成材 率高。
本发明可实现长条银石墨电接触板材与焊料带材的高效连续复合，生产出界面结合质量好、产品尺寸精度高的产品，焊接层厚度一致性高，可实现连续化、流程短、利于实现焊接自动化，具有显著的经济效益。
以上对本发明的具体实施例进行了描述。需要理解的是，本发明并不局限于上述特定实施方式，本领域技术人员可以在权利要求的范围内做出各种变形或修改，这并不影响本发明的实质内容。

Claims (10)

  1. 一种长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，包括以下步骤：
    第一步，采用挤压工艺将银石墨锭子制备成银石墨电接触板材；
    第二步，将焊料带材与所述银石墨电接触板材进行烧结复合，得到复合坯料；
    第三步，对所述复合坯料进行轧制与热处理，所述轧制与热处理为一次或多次，完成长条银石墨电接触材料与焊料带材的复合。
  2. 如权利要求1所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，第一步中，所述挤压为热挤压，其中银石墨锭子烧结温度为600-700℃，烧结时间为1-5h。
  3. 如权利要求1所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，第一步中，所述银石墨电接触板材具有呈U型带有卡槽的结构，所述卡槽将长条的银石墨板材与所述焊料带材卡住，使得两者的面与面紧密接触，在第二步烧结时，所述焊料带材能覆盖在所述卡槽中形成良好的焊接层。
  4. 如权利要求3所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，所述银石墨电接触板材，长度为5-50m。
  5. 如权利要求3所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，第二步中，将焊料带材卡在板材卡槽上进行烧结复合。
  6. 如权利要求1所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，第二步中，所述烧结复合，其中烧结温度为600-700℃，保护气氛为氢气。
  7. 如权利要求1所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，第三步中，所述轧制为冷轧，使得银石墨板材与焊料带材复合后结合致密，且将复合后的银石墨轧到成品所需厚度。
  8. 如权利要求7所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，所述热处理为扩散退火，其中温度为400-600℃，时间为0.5-3h。
  9. 如权利要求1-7任一项所述的长条银石墨电接触材料与焊料带材快速复合制备方法，其特征在于，在完成长条银石墨电接触材料与焊料带材的复合后， 进一步进行冲制，得到带有焊接层的电接触触头材料，所述冲制是将轧制到成品厚度的银石墨材料冲制成所需的外围尺寸。
  10. 一种权利要求1-9任一项所述方法制备的带有焊接层的电接触触头材料。
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