WO2019100414A1 - 柔性oled显示面板的制备方法 - Google Patents

柔性oled显示面板的制备方法 Download PDF

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WO2019100414A1
WO2019100414A1 PCT/CN2017/113250 CN2017113250W WO2019100414A1 WO 2019100414 A1 WO2019100414 A1 WO 2019100414A1 CN 2017113250 W CN2017113250 W CN 2017113250W WO 2019100414 A1 WO2019100414 A1 WO 2019100414A1
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oled display
display panel
flexible
conductive layer
panel according
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王超梁
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible OLED display panel.
  • OLED display panels have the advantages of self-luminous, high contrast, thin thickness, wide viewing angle and fast response speed. They are representative of the new generation of flat display technology and are increasingly being accepted by the industry. Admired.
  • a flexible OLED display panel is one of the important development trends.
  • a flexible OLED display panel includes a flexible substrate and an OLED display unit formed on the flexible substrate, and the OLED display unit includes a film sequentially formed on the flexible substrate. a transistor array layer, an anode layer, an organic light emitting layer, a cathode layer, and an encapsulation layer.
  • the flexible OLED display panel not only can be thinner and lighter in volume, but also can reduce power consumption, thereby helping to improve the endurance of the corresponding product. At the same time, due to the flexibility and flexibility of the flexible OLED display panel, it is also more durable than ordinary hard display panels. Flexible OLED display panels can be widely used in various products with display functions, such as tablet computers, televisions, mobile terminals, and various types of wearable devices.
  • the flexible OLED display panel has its own drawbacks while bringing a series of advantages. Due to the flexibility and thermal expansion of the flexible substrate, the processing of the display device is inconvenient, and the substrate is prone to sag, or even wrinkles or breaks. It is difficult to accurately carry out the subsequent film preparation process. In order to solve this problem, it is necessary to connect a flexible substrate to a rigid substrate such as a glass substrate to support and fix the flexible substrate to facilitate film formation. After the layers of the display panel are formed on the flexible substrate, the rigid substrate is peeled off from the flexible substrate by a lift-off process, thereby completing the preparation work of the flexible display panel.
  • a flexible lift off (LLO) process is commonly used to separate a flexible substrate from a glass substrate.
  • the laser is irradiated from the back surface of the glass substrate, and the molecular force between the glass substrate and the flexible substrate absorbs the laser energy and then breaks, thereby causing the flexible substrate and the glass substrate. Separated from each other.
  • the material used to prepare the flexible substrate is usually a polymer organic material, such as polyimide (PI), which is ionized after absorption of laser energy to generate positive and negative ions.
  • PI polyimide
  • the conductivity of the glass substrate and the polymer organic material (flexible substrate) is relatively weak. Therefore, when the laser stripping process is performed, the positive and negative ions generated by ionization are collected at the interface between the glass substrate and the flexible substrate, and the positive and negative ions are concentrated. At a certain amount, discharge occurs between positive and negative ions, and there is a risk of damage to the circuit structure in the flexible OLED display panel.
  • the present invention provides a method for preparing a flexible OLED display panel for improving production efficiency and reducing production cost.
  • a method for preparing a flexible OLED display panel comprising: providing a support substrate, preparing a conductive layer on a first surface of the support substrate; preparing a flexible substrate on the conductive layer; and forming the flexible substrate on the conductive substrate Forming and forming an OLED display unit; irradiating the support substrate with a laser from a second surface of the support substrate opposite to the first surface to peel the flexible substrate from the support substrate.
  • the conductive layer is a patterned wire, and the wires are alternately connected to each other to form a conductive layer of a mesh structure having a through hole.
  • the wires are vertically and horizontally staggered, and the through holes are square through holes.
  • the light transmittance of the conductive layer is 90% or more.
  • the wire extends to a side surface of the support substrate.
  • the process for preparing the conductive layer of the mesh structure includes: depositing a conductive film on the first surface of the support substrate; etching the conductive film to form a patterned wire by using a photolithography process, and obtaining the mesh A conductive layer of a structure.
  • the material of the conductive film is indium tin oxide.
  • the preparation process of the conductive layer of the mesh structure includes: preparing a nano metal electronic ink; printing the patterned wire on the first surface of the support substrate by using the electronic ink as a printing material by using an electronic printing process; Obtaining a conductive layer of the mesh structure.
  • the electronic ink is a nano silver electronic ink.
  • the material of the flexible substrate is polyimide, polycarbonate, polyether sulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate or glass fiber reinforced plastic.
  • the method for preparing a flexible OLED display panel provided by the embodiment of the invention provides a conductive layer between the support substrate and the flexible substrate.
  • the conductive layer can timely derive the positive and negative ions generated by ionization to avoid occurrence.
  • the discharge causes damage to the circuit structure in the flexible OLED display panel, improving the yield of the product.
  • FIG. 1 is a process flow diagram of a method for fabricating a flexible OLED display panel according to an embodiment of the present invention
  • FIGS. 2a-2d are exemplary illustrations of device structures obtained by corresponding steps in a method for fabricating a flexible OLED display panel according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of a conductive layer in an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an OLED display unit in an embodiment of the present invention.
  • the embodiment provides a method for preparing a flexible OLED display panel. Specifically, referring to FIG. 1 and FIGS. 2a to 2d, the preparation method includes the following steps:
  • Step S101 referring to FIG. 2a and FIG. 3, a support substrate 1 is provided, and a conductive layer 2 is formed on the first surface 1a of the support substrate 1.
  • the support substrate 1 is selected as a glass substrate.
  • the conductive layer 2 is a patterned wire 21, and the wires 21 are alternately connected to each other to form a conductive layer 2 having a mesh structure of the through holes 22.
  • the wire 21 is vertically and horizontally staggered, and the through hole 22 is a square through hole.
  • the light transmittance of the conductive layer 2 is required to be 90% or more.
  • the preparation process of the conductive layer 2 of the mesh structure includes: firstly depositing a conductive film, preferably an indium tin oxide (ITO) film on the first surface 1a of the support substrate 1; The process etches the conductive film to form a patterned wire 21 to obtain the conductive layer 2 of the mesh structure.
  • a conductive film preferably an indium tin oxide (ITO) film
  • the preparation process of the conductive layer 2 of the mesh structure may also be as follows: firstly, a nano metal electronic ink, preferably a nano silver electronic ink; and then the electronic ink is used as a printing material.
  • the electronic printing process prints a patterned wire 21 on the first surface 1a of the support substrate 1 to obtain the conductive layer 2 of the mesh structure.
  • the electronic printing process may be selected to be an inkjet printing process or a screen printing process, preferably using an inkjet printing process.
  • a flexible substrate 3 is formed on the conductive layer 2.
  • a flexible substrate 3 is formed on the conductive layer 2 by applying a coating process, and the material of the flexible substrate 3 is polyimide (PI), polycarbonate (PC), polyethersulfone (PES). ), polymer materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP).
  • the coating process may be selected as a slit coating process or a spin coating process or a spray coating process, and a slit coating process is preferably used in this embodiment.
  • an OLED display unit 4 is formed on the flexible substrate 3.
  • 4 exemplarily shows a cross-sectional view of one of the OLED display units 4, as shown in FIG. 4, the OLED display unit 4 including a thin film crystal array layer 41 and an anode layer 42 sequentially formed on the flexible substrate 3.
  • the organic light-emitting layer 43 and the cathode layer 44 and the like are also provided with an encapsulation layer (not shown in the drawing).
  • the thin film transistor array layer 41 is provided with respective structural film layers such as a thin film transistor, a data line, and a scanning line.
  • the organic light-emitting layer 43 includes a hole transport layer (HTL) 431 formed by an organic material, an espressive layer (EML) 432, and an electron transport layer (ETL). 433 and so on.
  • HTL hole transport layer
  • EML espressive layer
  • ETL electron transport layer
  • the OLED display unit 4 may further be provided with other functional structure film layers such as a touch panel (TP), a polarizer, and a protective cover.
  • TP touch panel
  • polarizer polarizer
  • protective cover a protective cover
  • each functional film layer of the OLED display unit 4 can be performed by any one of the process technologies known in the art.
  • Step S104 referring to FIG. 2d, applying the laser lift off (LLO) process to the soft
  • the substrate 3 and the support substrate 1 are separated from each other.
  • the support substrate 1 is irradiated from the second surface 1b of the support substrate 1 opposite to the first surface 1a by using a laser 5, and the flexible substrate 3 is removed from the conductive layer 2
  • the support substrates 1 are separated from each other, thereby preparing a flexible OLED display panel including a flexible substrate 3 and an OLED display unit 4 on the flexible substrate 3.
  • the dotted arrow in Fig. 2d indicates the laser light.
  • the method for preparing a flexible OLED display panel provided by the above embodiment, by providing the conductive layer 2 between the support substrate 1 and the flexible substrate 3, the conductive layer 2 can positively generate ionization when performing a laser lift-off (LLO) process.
  • the negative ions are derived in time to avoid the occurrence of damage, resulting in damage to the circuit structure in the flexible OLED display panel (for example, the thin film transistor on the flexible substrate 3), thereby improving the yield of the product.
  • the conductive layer 2 is designed as a conductive layer of a mesh structure, and the light transmittance is increased as much as possible while achieving good electrical conductivity to ensure smooth operation of the LLO process.
  • the flexible substrate 3 absorbs laser energy to generate heat, thereby forming thermal stress, and the conductive layer 2 of the mesh structure can release the partial stress well, not only the conductive layer 2 can be avoided due to the thermal stress. The occurrence of breakage does not reach the electrical conductivity requirement, and the thermal stress is released in time to avoid a large deformation of the flexible substrate 3.
  • the carrying platform of the laser stripping apparatus when performing the LLO process, usually has a grounding member, in order to make the conductive layer 2 more convenient to introduce positive and negative ions into the ground end, in this embodiment, as shown in FIG.
  • the wires 22 in the conductive layer 2 extend to the peripheral sides of the support substrate 1.
  • the wires 22 extending to the peripheral sides of the support substrate 1 can be easily connected to the grounding member of the carrying platform, thereby introducing positive and negative ions generated by ionization into the ground.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种柔性OLED显示面板的制备方法,其包括:提供支撑基板,在所述支撑基板的第一表面上制备形成导电层;在所述导电层上制备形成柔性衬底;在所述柔性衬底上制备形成OLED显示单元;采用激光从所述支撑基板的与所述第一表面相对的第二表面对所述支撑基板进行照射,将所述柔性衬底从所述支撑基板上剥离。通过在支撑基板和柔性衬底之间设置导电层,在进行激光剥离工艺时,该导电层可以将电离产生的正负离子及时导出,避免发生放电导致柔性OLED显示面板中的电路结构发生损坏。

Description

柔性OLED显示面板的制备方法 技术领域
本发明涉及显示技术领域,尤其涉及一种柔性OLED显示面板的制备方法。
背景技术
有机电致发光二极管(Organic light-emitting diodes,OLED)显示面板具备自发光、对比度高、厚度薄、视角广和反应速度快等优点,是新一代平面显示技术的代表,越来越受到业界的推崇。柔性OLED显示面板是其中的一个重要发展趋势,通常地,柔性OLED显示面板包括柔性基底和形成在所述柔性基底上的OLED显示单元,所述OLED显示单元包括依次形成在所述柔性基底上薄膜晶体管阵列层、阳极层、有机发光层、阴极层和封装层。
柔性OLED显示面板不仅能够在体积上更加轻薄,而且能够降低功耗,从而有助于提升相应产品的续航能力。同时,由于柔性OLED显示面板的可弯曲性和柔韧性,其耐用程度也高于普通硬质显示面板。柔性OLED显示面板可广泛应用于各种带显示功能的产品中,例如可以应用于平板电脑、电视、移动终端和各类可穿戴式设备中。
柔性OLED显示面板在带来一系列优点的同时也具有其本身的缺陷,由于柔性基板具有挠性和热膨胀性等问题,给显示器件的加工带来不便,容易出现基板下垂,甚至产生褶皱或断裂,很难精准的进行后续膜层的制备工序。为了解决该问题,需要将柔性基板连接于刚性的基板如玻璃基板上,用以支撑和固定柔性基板以利于薄膜的形成。在柔性基板上制备形成显示面板的各层元件之后,再通过剥离工艺,将刚性基板从柔性基板上剥离开来,从而完成柔性显示面板的制备工作。
现有技术中,通常使用激光剥离(Laser lift off,LLO)工艺将柔性基板与玻璃基板分离。具体是,在玻璃基板上制备得到柔性OLED显示面板之后,采用激光从玻璃基板的背面进行照射,玻璃基板与柔性基板之间的分子作用力吸收激光能量后发生断裂,从而使得柔性基板和玻璃基板相互分离。
目前,用于制备形成柔性基板的材料通常是高分子有机材料,例如聚酰亚胺(PI),高分子有机材料在吸收激光能量后会发生电离,产生正负离子。而玻璃基板与高分子有机材料(柔性基板)的导电能力都比较弱,因此,在进行激光剥离工艺时,玻璃基板与柔性基板的连接界面上会聚集电离产生的正负离子,当正负离子聚集到一定量时,正负离子之间发生放电,存在对柔性OLED显示面板中的电路结构造成损坏的风险。
因此,现有技术还有待于改进和发展。
发明内容
鉴于现有技术的不足,本发明提供了一种柔性OLED显示面板的制备方法,用于提高生成效率并降低生产成本。
为了实现上述目的,本发明采用了如下的技术方案:
一种柔性OLED显示面板的制备方法,其包括:提供支撑基板,在所述支撑基板的第一表面上制备形成导电层;在所述导电层上制备形成柔性衬底;在所述柔性衬底上制备形成OLED显示单元;采用激光从所述支撑基板的与所述第一表面相对的第二表面对所述支撑基板进行照射,将所述柔性衬底从所述支撑基板上剥离。
其中,所述导电层为图案化的导线,所述导线相互交错连接形成具有通孔的网状结构的导电层。
其中,所述导线纵横垂直交错连接,所述通孔为方形通孔。
其中,所述导电层的光线透过率为90%以上。
其中,所述导线延伸至所述支撑基板的四周侧面。
其中,所述网状结构的导电层的制备工艺包括:在所述支撑基板的第一表面上沉积导电薄膜;应用光刻工艺将所述导电薄膜刻蚀形成图案化的导线,获得所述网状结构的导电层。
其中,所述导电薄膜的材料为氧化铟锡。
其中,所述网状结构的导电层的制备工艺包括:配制纳米金属电子墨水;以所述电子墨水为打印材料,应用电子印刷工艺在所述支撑基板的第一表面上打印出图案化的导线,获得所述网状结构的导电层。
其中,所述电子墨水为纳米银电子墨水。
其中,所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
本发明实施例提供的柔性OLED显示面板的制备方法,通过在支撑基板和柔性衬底之间设置导电层,在进行激光剥离工艺时,该导电层可以将电离产生的正负离子及时导出,避免发生放电导致柔性OLED显示面板中的电路结构发生损坏,提高产品的良率。
附图说明
图1是本发明实施例提供的柔性OLED显示面板的制备方法的工艺流程图;
图2a~2d是本发明实施例提供柔性OLED显示面板的制备方法中,各个步骤对应获得的器件结构的示例性图示;
图3是本发明实施例中的导电层的结构示意图;
图4是本发明实施例中的OLED显示单元的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的,并且本发明并不限于这些实施方式。
在此,还需要说明的是,为了避免因不必要的细节而模糊了本发明,在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤,而省略了与本发明关系不大的其他细节。
本实施例提供了一种柔性OLED显示面板的制备方法,具体地,参阅图1以及图2a~2d,所述制备方法包括步骤:
步骤S101、参阅图2a和图3,提供支撑基板1,在所述支撑基板1的第一表面1a上制备形成导电层2。其中,所述支撑基板1选择为玻璃基板。
其中,如图3所示,所述导电层2为图案化的导线21,所述导线21相互交错连接形成具有通孔22的网状结构的导电层2。具体到本实施例中,所述导线 21纵横垂直交错连接,所述通孔22为方形通孔。
进一步地,所述导电层2的光线透过率要求为90%以上。
本实施例中,所述网状结构的导电层2的制备工艺包括:首先在所述支撑基板1的第一表面1a上沉积导电薄膜,优选为氧化铟锡(ITO)薄膜;然后应用光刻工艺将所述导电薄膜刻蚀形成图案化的导线21,获得所述网状结构的导电层2。
在另外的一些实施例中,所述网状结构的导电层2的制备工艺也可以是这样:首先配制纳米金属电子墨水,优选为纳米银电子墨水;然后以所述电子墨水为打印材料,应用电子印刷工艺在所述支撑基板1的第一表面1a上打印出图案化的导线21,获得所述网状结构的导电层2。所述电子印刷工艺可以选择为喷墨印刷工艺或丝网印刷工艺,优选使用喷墨印刷工艺。
步骤S102、参阅图2b,在所述导电层2上制备形成柔性衬底3。具体地,应用涂布工艺在所述导电层2上制备形成柔性衬底3,所述柔性衬底3的材料为聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料。所述涂布工艺可以选择为狭缝涂布工艺或旋涂工艺或喷涂工艺,本实施例中优选使用狭缝涂布工艺。
步骤S103、参阅图2c和图4,在所述柔性衬底3上制备形成OLED显示单元4。图4示例性地示出了其中一个OLED显示单元4的剖面图,如图4所示,所述OLED显示单元4包括依次形成在所述柔性衬底3上薄膜晶体阵列层41、阳极层42、有机发光层43和阴极层44等,所述阴极层44还设置有封装层(附图中未示出)。其中,所述薄膜晶体管阵列层41中设置有薄膜晶体管、数据线和扫描线等各个结构膜层。所述有机发光层43则包括由有机材料制备形成的空穴传输功能层(Hole Transport Layer,HTL)431、发光材料层(Emissive Layer,EML)432以及电子传输功能层(Electron Transport Layer,ETL)433等。
进一步地,所述OLED显示单元4上还可以依次设置有触控屏(Touch panel,TP)、偏光片、保护盖板等其他功能结构膜层。
需要说明的是,所述OLED显示单元4的各个功能膜层的具体制备方法可以选择本领域中已知的任意一种工艺技术进行。
步骤S104、参阅图2d,应用激光剥离(Laser lift off,LLO)工艺将所述柔 性基板3与所述支撑基板1相互分离。具体地,采用激光5从所述支撑基板1的与所述第一表面1a相对的第二表面1b对所述支撑基板1进行照射,将所述柔性衬底3从所述导电层2上与所述支撑基板1相互分离,从而制备得到柔性OLED显示面板,其包括柔性衬底3和位于柔性衬底3上的OLED显示单元4。其中,图2d中虚线箭头表示激光光线。
如上实施例提供的柔性OLED显示面板的制备方法,通过在支撑基板1和柔性衬底3之间设置导电层2,在进行激光剥离(LLO)工艺时,该导电层2可以将电离产生的正负离子及时导出,避免发生放电导致柔性OLED显示面板中的电路结构(例如柔性衬底3上的薄膜晶体管)发生损坏,提高产品的良率。
其中,将所述导电层2设计为网状结构的导电层,在达到良好的导电性能的同时,尽可能大的提高其光线透过率,以保证LLO工艺能够顺利进行。另外,在进行LLO工艺时,柔性衬底3吸收激光能量产生热量,进而形成热应力,网格式结构的导电层2可以很好地释放该部分应力,不仅可以避免导电层2因所述热应力发生断裂而达不到导电要求,并且所述热应力得到及时释放也可以避免所述柔性衬底3产生较大的形变。
进一步地,在进行LLO工艺时,激光剥离设备的承载平台通常都有接地部件,为了使得所述导电层2可以更便利地将正负离子导入地端,在本实施例中,如图3所示,所述导电层2中的导线22延伸至所述支撑基板1的四周侧面。在进行LLO工艺,延伸至所述支撑基板1的四周侧面的导线22可以很方便的连接到承载平台的接地部件,由此将电离产生的正负离子导入地端。
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本申请的保护范围。

Claims (19)

  1. 一种柔性OLED显示面板的制备方法,其中,包括:
    提供支撑基板,在所述支撑基板的第一表面上制备形成导电层;
    在所述导电层上制备形成柔性衬底;
    在所述柔性衬底上制备形成OLED显示单元;
    采用激光从所述支撑基板的与所述第一表面相对的第二表面对所述支撑基板进行照射,将所述柔性衬底从所述支撑基板上剥离。
  2. 根据权利要求1所述的柔性OLED显示面板的制备方法,其中,所述导电层为图案化的导线,所述导线相互交错连接形成具有通孔的网状结构的导电层。
  3. 根据权利要求2所述的柔性OLED显示面板的制备方法,其中,所述导线纵横垂直交错连接,所述通孔为方形通孔。
  4. 根据权利要求2所述的柔性OLED显示面板的制备方法,其中,所述导电层的光线透过率为90%以上。
  5. 根据权利要求2所述的柔性OLED显示面板的制备方法,其中,所述导线延伸至所述支撑基板的四周侧面。
  6. 根据权利要求2所述的柔性OLED显示面板的制备方法,其中,所述网状结构的导电层的制备工艺包括:
    在所述支撑基板的第一表面上沉积导电薄膜;
    应用光刻工艺将所述导电薄膜刻蚀形成图案化的导线,获得所述网状结构的导电层。
  7. 根据权利要求6所述的柔性OLED显示面板的制备方法,其中,所述导电薄膜的材料为氧化铟锡。
  8. 根据权利要求1所述的柔性OLED显示面板的制备方法,其特征在于,所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
  9. 根据权利要求8所述的柔性OLED显示面板的制备方法,其特征在于,应用涂布工艺在所述导电层上制备形成所述柔性衬底。
  10. 根据权利要求9所述的柔性OLED显示面板的制备方法,其特征在于,所述涂布工艺为狭缝涂布工艺或旋涂工艺或喷涂工艺。
  11. 一种柔性OLED显示面板的制备方法,其中,包括:
    提供支撑基板;
    配制纳米金属电子墨水,以所述电子墨水为打印材料,应用电子印刷工艺在所述支撑基板的第一表面上打印出导电层;
    在所述导电层上制备形成柔性衬底;
    在所述柔性衬底上制备形成OLED显示单元;
    采用激光从所述支撑基板的与所述第一表面相对的第二表面对所述支撑基板进行照射,将所述柔性衬底从所述支撑基板上剥离。
  12. 根据权利要求11所述的柔性OLED显示面板的制备方法,其中,所述导电层为图案化的导线,应用电子印刷工艺在所述支撑基板的第一表面上打印出图案化的导线,所述导线相互交错连接形成具有通孔的网状结构的导电层。
  13. 根据权利要求12所述的柔性OLED显示面板的制备方法,其中,所述电子墨水为纳米银电子墨水。
  14. 根据权利要求12所述的柔性OLED显示面板的制备方法,其中,所述导线纵横垂直交错连接,所述通孔为方形通孔。
  15. 根据权利要求12所述的柔性OLED显示面板的制备方法,其中,所述导电层的光线透过率为90%以上。
  16. 根据权利要求12所述的柔性OLED显示面板的制备方法,其中,所述导线延伸至所述支撑基板的四周侧面。
  17. 根据权利要求11所述的柔性OLED显示面板的制备方法,其特征在于,所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
  18. 根据权利要求17所述的柔性OLED显示面板的制备方法,其特征在于, 应用涂布工艺在所述导电层上制备形成所述柔性衬底。
  19. 根据权利要求18所述的柔性OLED显示面板的制备方法,其特征在于,所述涂布工艺为狭缝涂布工艺或旋涂工艺或喷涂工艺。
PCT/CN2017/113250 2017-11-22 2017-11-28 柔性oled显示面板的制备方法 Ceased WO2019100414A1 (zh)

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