WO2019098078A1 - Feuille de résine - Google Patents

Feuille de résine Download PDF

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Publication number
WO2019098078A1
WO2019098078A1 PCT/JP2018/041082 JP2018041082W WO2019098078A1 WO 2019098078 A1 WO2019098078 A1 WO 2019098078A1 JP 2018041082 W JP2018041082 W JP 2018041082W WO 2019098078 A1 WO2019098078 A1 WO 2019098078A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
resin composition
less
resin sheet
bisphenol
Prior art date
Application number
PCT/JP2018/041082
Other languages
English (en)
Japanese (ja)
Inventor
裕介 根津
和浩 菊池
貴志 杉野
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to KR1020197037953A priority Critical patent/KR20200081336A/ko
Priority to JP2019554173A priority patent/JPWO2019098078A1/ja
Priority to CN201880049577.8A priority patent/CN110997765A/zh
Publication of WO2019098078A1 publication Critical patent/WO2019098078A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Definitions

  • the present invention relates to a resin sheet that can be suitably used for sealing of electronic components by panel level packaging.
  • an electronic component such as a semiconductor chip is sealed using a resin sheet provided with a curable resin composition layer.
  • the resin composition layer is pressurized to embed the electronic component in the resin composition layer.
  • the resin composition layer is cured to form a cured layer, whereby a sealed body in which the electronic component is sealed by the cured layer is obtained, and the sealed body is cut as necessary.
  • a semiconductor device can be obtained by singulation.
  • the hardened layer formed as described above is usually prone to shrinkage in a direction parallel to its main surface.
  • shrinkage is less likely to occur compared to the cured layer. Therefore, a difference occurs between the amount of contraction of the cured layer and the amount of contraction of the electronic component and the support, which may cause warpage in the sealed body.
  • the sealed body in which such a warpage has occurred may not be able to appropriately apply the process (post-process) after sealing, or may not be able to apply accurate printing.
  • Patent Documents 1 to 3 disclose resin sheets for the purpose of suppressing such warpage of the sealing body.
  • Patent Document 1 discloses a sheet-like laminate material formed using a resin composition containing an epoxy resin, a curing agent, and an inorganic filler which has been subjected to a predetermined surface treatment.
  • the thermosetting sheet is a resin sheet which satisfy
  • Patent Document 3 discloses a resin sheet containing an inorganic filler at a predetermined content and having a predetermined minimum viscosity.
  • a fan-out type semiconductor package As a method of manufacturing a fan-out type semiconductor package, a panel level fan-out packaging technology (FOPLP) manufactured with a substrate size of about 300 to 700 mm square has attracted attention.
  • FOPLP panel level fan-out packaging technology
  • Patent Documents 1 to 3 can not sufficiently obtain the effect of suppressing the warpage of the obtained sealed body, and in particular, such as large panel level packaging.
  • the resin sheet of an area the said curvature was not fully able to be suppressed.
  • the present invention has been made in view of such a situation, and a resin sheet capable of favorably suppressing the warpage of the resulting sealed body even when a resin sheet having a relatively large area is used. Intended to provide.
  • the present invention is a resin sheet used for sealing an electronic component, wherein the resin sheet is a curable resin composition formed from a resin composition containing an epoxy resin Storage elastic modulus at 150 ° C. of the cured layer formed by curing the curable resin composition layer is 0.1 MPa or more and 1000 MPa or less, and a cured product obtained by curing the resin composition
  • a resin sheet having a glass transition temperature of 30 ° C. or more and 160 ° C. or less is provided (Invention 1).
  • the said epoxy resin contains a bisphenol F-type epoxy resin (invention 2).
  • the epoxy equivalent of the said bisphenol F-type epoxy resin is 150 g / eq or more and 10000 g / eq or less (invention 3).
  • the bisphenol F-type epoxy resin has an epoxy group at both ends (Invention 4).
  • the ratio of the total value of the content of the epoxy resin other than the bisphenol F-type epoxy resin to the content of the bisphenol F-type epoxy resin in the resin composition is a mass ratio And 0 or more and 10 or less (invention 5).
  • the resin composition preferably contains inorganic fine particles in an amount of 50% by mass to 90% by mass (Invention 6).
  • the resin composition preferably contains a thermoplastic resin in an amount of 1% by mass to 30% by mass (Invention 7).
  • the average linear expansion coefficient at 25 to 180 ° C. of the cured layer is preferably 200 ppm / K or less (Invention 8).
  • the warpage of the resulting sealed body can be favorably suppressed.
  • Curable resin composition layer The resin sheet which concerns on this embodiment is provided with the curable resin composition layer formed from the resin composition containing an epoxy resin.
  • the curable resin composition layer can be cured by heating or the like. That is, the curable resin composition layer is uncured in the state of constituting the resin sheet.
  • the curable resin composition layer may be thermosetting or may be active energy ray curable, but is preferably thermosetting. Even when it is difficult to irradiate the energy ray to the laminated curable resin composition layer by being thermosetting, the curable resin composition layer can be favorably cured by heating. it can.
  • the storage elastic modulus at 150 ° C. of the cured layer obtained by curing the curable resin composition layer is 0.1 MPa or more and 1000 MPa or less.
  • the stress which arose in the hardened layer can be relieved favorable.
  • Such a stress is a main cause of the warpage of the sealed body, and it is possible to suppress the warpage of the sealed body by relieving the stress.
  • the curable resin composition layer is thermosetting, the curable resin composition layer is usually heated to about 180 ° C. to be cured, and then the formed cured layer is cooled to room temperature .
  • the stress in the hardened layer is easily generated during the cooling, when the storage elastic modulus described above is in the above range, the stress can be favorably relieved, whereby the warpage of the sealing body is obtained. It can be effectively suppressed.
  • the storage elastic modulus is less than 0.1 MPa, when a load is applied to a sealed body in which the electronic component is sealed by the cured layer, the cured layer is easily deformed, and damage to the electronic component And electronic components are easily displaced from a predetermined position. Moreover, when the said storage elastic modulus exceeds 1000 Mpa, the stress which arose in the hardened layer can not fully be relieve
  • curing a resin composition is 30 degreeC or more and 160 degrees C or less.
  • shrinkage stress is less likely to occur in the cured layer formed by curing the curable resin composition layer, whereby the occurrence of warpage of the sealing body is favorably suppressed. it can.
  • the warpage of the sealed body can be favorably suppressed, and in particular, even when a resin sheet having a relatively large area is used, the warpage of the sealed body is favorable. Suppressed.
  • the glass transition temperature is preferably 45 ° C. or higher, and more preferably 60 ° C. or higher.
  • the said glass transition temperature is 150 degrees C or less, and it is preferable that it is especially 140 degrees C or less.
  • the detail of the measuring method of the said glass transition temperature is as having described in the test example mentioned later.
  • the average linear expansion coefficient of the cured layer in the present embodiment may be a large value as compared with the average linear expansion coefficient of a cured layer formed using a conventional resin sheet.
  • the storage elastic modulus and the glass transition temperature described above are in the above-described ranges, respectively, it becomes difficult to generate shrinkage stress in the cured layer, and the generated stress can be favorably relaxed. Thereby, the warpage of the sealing body can be suppressed. Therefore, in the cured layer in the present embodiment, even if the average linear expansion coefficient is a relatively large value, it is possible to suppress the warpage of the sealing body.
  • the average linear expansion coefficient at 25 to 180 ° C. of the cured layer obtained by curing the curable resin composition layer is preferably 1 ppm / K or more, particularly 5 ppm. / K or more is preferable, and 10 ppm / K or more is more preferable.
  • the average linear expansion coefficient is preferably 200 ppm / K or less, particularly preferably 180 ppm / K or less, and further preferably 150 ppm / K or less.
  • flexibility of a resin sheet is improved by the average linear expansion coefficient mentioned above being 1 ppm / K or more, and the more superior handling property is achieved.
  • the thickness of the curable resin composition layer in the present embodiment is preferably 5 ⁇ m or more, particularly preferably 10 ⁇ m or more, and further preferably 20 ⁇ m or more.
  • the thickness of the curable resin composition layer is preferably 500 ⁇ m or less, particularly preferably 300 ⁇ m or less, and further preferably 200 ⁇ m or less.
  • the thickness of the curable resin composition layer is 5 ⁇ m or more, the embedding property to the electronic component becomes excellent.
  • miniaturization and thinning of a semiconductor device as a sealed body obtained using the resin sheet according to the present embodiment become easy.
  • the resin composition in this embodiment contains an epoxy resin as a thermosetting resin. Moreover, the resin composition in this embodiment may contain thermosetting resins other than an epoxy resin. Furthermore, the resin composition in the present embodiment preferably contains a thermoplastic resin, inorganic fine particles, and a curing catalyst. (2-1) Thermosetting resin When the resin composition contains a thermosetting resin, it can be favorably cured by heating the curable resin composition layer formed from the resin composition, It becomes possible to seal electronic parts firmly.
  • An epoxy resin as a thermosetting resin generally has a property of being three-dimensional reticulated when heated and forming a strong cured product.
  • various known epoxy resins can be used. Specifically, glycidyl ethers of phenols such as bisphenol F, bisphenol A, resorcinol, phenyl novolac, cresol novolac; butanediol, polyethylene Glycidyl ethers of alcohols such as glycol and polypropylene glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; Glycidyl type in which an active hydrogen bonded to a nitrogen atom such as aniline isocyanurate is substituted with a glycidyl group or Epoxy resins of the alkyl glycidyl type; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dic
  • Type epoxides can be mentioned.
  • an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton and the like can also be used. These epoxy resins can be used singly or in combination of two or more.
  • the epoxy resins described above it is preferable to use glycidyl ether of bisphenol F (bisphenol F type epoxy resin) from the viewpoint of easily adjusting the storage elastic modulus and the glass transition temperature described above to the above-described ranges.
  • bisphenol F-type epoxy resin may have an epoxy group only at one end, it becomes easy to adjust the above-mentioned storage elastic modulus and glass transition temperature according to the above-mentioned ranges, whereby It is preferable that it is what has an epoxy group in both ends from a viewpoint that curvature can be suppressed effectively.
  • the epoxy equivalent of the bisphenol F-type epoxy resin is preferably 150 g / eq or more, particularly preferably 250 g / eq or more, and further preferably 400 g / eq or more.
  • the epoxy equivalent is preferably 10000 g / eq or less, particularly preferably 5000 g / eq or less, and more preferably 2000 g / eq or less.
  • a glycidyl ether of bisphenol A bisphenol A epoxy resin
  • an epoxy resin having a biphenyl skeleton bisphenol F epoxy resin
  • a naphthalene skeleton as an epoxy resin together with the bisphenol F epoxy resin
  • the epoxy resin naphthalene type epoxy resin
  • thermosetting resin other than the epoxy resin is not particularly limited as long as the resin composition layer can be cured, and, for example, a resin generally contained in a sealing material can be used.
  • a resin generally contained in a sealing material can be used.
  • phenol resin, melamine resin, urea resin, polyester resin, urethane resin, acrylic resin, polyimide resin, benzoxazine resin, phenoxy resin, acid anhydride compound, amine compound, naphthol resin, active ester resin And benzoxazine resins, cyanate ester resins and the like can be used singly or in combination of two or more.
  • phenol resin for example, bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane type phenol, tetrakis phenol, novolac type phenol, cresol novolac resin, biphenylaralkyl skeleton A phenol (biphenyl type phenol) etc. are mentioned, It is preferable to use a biphenyl type phenol among these. These phenolic resins can be used singly or in combination of two or more.
  • the content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and further preferably 20% by mass or more.
  • the content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less.
  • the total value of content of epoxy resins other than bisphenol F-type epoxy resin with respect to content of bisphenol F-type epoxy resin in resin composition The weight ratio is preferably 10 or less, particularly preferably 7 or less, and more preferably 5 or less.
  • the lower limit value of the above ratio is not particularly limited, and for example, the mass ratio is preferably 0 or more, and particularly preferably 0.1 or more.
  • the resin composition in the present embodiment preferably contains a thermoplastic resin.
  • the thermoplastic resin includes, for example, phenoxy resin, olefin resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, amide resin, styrene-isobutylene-styrene copolymer (SIS), etc.
  • Styrene resin silane resin, rubber resin, polyvinyl acetal resin, polyvinyl butyral resin, polyimide resin, polyamide imide resin, polyether sulfone resin, polysulfone resin, fluorine resin and the like can be mentioned. These can be used alone or in combination of two or more. Moreover, these thermoplastic resins may have a curable functional group.
  • the phenoxy resin is not particularly limited, but, for example, bisphenol A type, bisphenol F type, bisphenol A / bisphenol F copolymer type, bisphenol S type, bisphenol acetophenone type, novolac type, fluorene type, dicyclopentadiene type, Examples thereof include norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type and biphenyl type. Among these, it is preferable to use a bisphenol A type phenoxy resin.
  • the content of the thermoplastic resin in the resin composition is preferably 1% by mass or more, particularly preferably 3% by mass or more, and further preferably 5% by mass or more.
  • the content is preferably 30% by mass or less, particularly preferably 20% by mass or less, and further preferably 10% by mass or less.
  • the said content of a thermoplastic resin is solid content conversion value.
  • the resin composition in the present embodiment preferably contains inorganic fine particles. As a result, a cured layer obtained by curing the curable resin composition layer effectively exerts excellent mechanical strength.
  • the inorganic fine particles for example, silica, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, magnesium oxide, aluminum oxide, aluminum nitride, Inorganic fine particles composed of aluminum borate, boron nitride, crystalline silica, amorphous silica, mullite, cordierite and other composite oxides, montmorillonite, smectite, boehmite, talc, iron oxide, silicon carbide, zirconium oxide, etc. These can be used alone or in combination of two or more. Among these, it is preferable to use silica fine particles and alumina fine particles, and it is particularly preferable to use silica fine particles.
  • the inorganic fine particles are preferably surface-treated with a surface treatment agent.
  • a surface treatment agent include epoxysilanes, vinylsilanes, silazane compounds, alkoxysilanes and silane coupling agents. These may be used alone or in combination.
  • Preferred examples of the surface treatment agent include epoxysilanes such as 3-glycidoxypropyltrimethoxysilane and vinylsilanes such as vinyltrimethoxysilane.
  • the average particle diameter of the inorganic fine particles is preferably 0.01 ⁇ m or more, particularly preferably 0.1 ⁇ m or more, and further preferably 0.3 ⁇ m or more.
  • the average particle diameter of the silica filler is preferably 5.0 ⁇ m or less, particularly preferably 3.0 ⁇ m or less, and further preferably 1.0 ⁇ m or less.
  • the average particle diameter of the inorganic fine particles in the present specification is a value measured by a dynamic light scattering method, and for example, using a particle size distribution measuring device (product name “Nanotrac Wave-UT 151” manufactured by Nikkiso Co., Ltd.) It can be measured.
  • the maximum particle size of the inorganic fine particles is preferably 0.05 ⁇ m or more, and more preferably 0.5 ⁇ m or more. Further, the maximum particle size is preferably 10 ⁇ m or less, and particularly preferably 5 ⁇ m or less. When the maximum particle size of the inorganic fine particles is in the above range, the hardened layer can be easily filled with the inorganic fine particles, and the hardened layer has more excellent mechanical strength.
  • the maximum particle size of the inorganic fine particles in the present specification is a value measured by a dynamic light scattering method, and for example, using a particle size distribution measuring apparatus (product name “Nanotrac Wave-UT 151” manufactured by Nikkiso Co., Ltd.) It can be measured.
  • the content of the inorganic fine particles in the resin composition is preferably 50% by mass or more, particularly preferably 60% by mass or more, and further preferably 70% by mass or more.
  • the content is preferably 90% by mass or less, particularly preferably 85% by mass or less, and further preferably 80% by mass or less.
  • a cured layer obtained by curing the curable resin composition layer has a better mechanical strength.
  • the content of the inorganic fine particles is 90% by mass or less, the curable resin composition layer is easily cured, and the semiconductor device as a sealed body to be obtained has a better quality.
  • the said content of inorganic fine particles is a solid content conversion value.
  • the content of inorganic fine particles is relatively increased from the viewpoint of suppressing the warpage of the sealed body by controlling the linear expansion coefficient of the cured layer.
  • the storage elastic modulus and the glass transition temperature described above are in the above-described ranges, respectively, shrinkage stress is less likely to occur in the hardened layer, and the generated stress is favorably relieved.
  • warpage of the sealing body can be effectively suppressed. Therefore, in the resin composition in the present embodiment, the content of the inorganic fine particles is suppressed to 90% by mass or less to achieve the excellent curability of the curable resin composition layer, and the warpage of the obtained sealed body It is possible to easily suppress the occurrence of
  • the resin composition in the present embodiment preferably contains a curing catalyst.
  • a curing catalyst examples include imidazole curing catalysts, amine curing catalysts, phosphorus curing catalysts and the like.
  • imidazole-based curing catalyst examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl -2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-di (hydroxymethyl) imidazole, etc. From the viewpoint of sex It is preferred to use 2-ethyl-4-methylimidazole.
  • the amine curing catalyst include triazine compounds such as 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 1,8-diazabicyclo [5,4, 0] Undecene-7 (DBU), triethylenediamine, benzyldimethylamine, tertiary amine compounds such as triethanolamine and the like.
  • triazine compounds such as 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine
  • DBU Undecene-7
  • DBU Undecene-7
  • 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine is preferred.
  • phosphorus-based curing catalyst examples include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine and the like.
  • the curing catalysts described above may be used alone or in combination of two or more.
  • the content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, particularly preferably 0.05% by mass or more, and further preferably 0.1% by mass or more preferable.
  • the content is preferably 2.0% by mass or less, particularly preferably 1.5% by mass or less, and further preferably 1.0% by mass or less.
  • the resin composition can be cured more favorably.
  • the said content of a curing catalyst is a solid content conversion value.
  • the resin composition in the present embodiment may further contain a plasticizer, a stabilizer, a tackifier, a coupling agent, an antistatic agent, an antioxidant, and the like.
  • the resin sheet according to the present embodiment may include a release sheet laminated on at least one surface of the curable resin composition layer.
  • the configuration of the release sheet is arbitrary, and examples thereof include plastic films such as polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene. It is preferable that the peeling process is performed to these peeling surfaces (surface which contact
  • the release agent used for the release treatment include silicone-based, fluorine-based, long-chain alkyl-based, alkyd-based, olefin-based and rubber-based release agents.
  • the thickness of the resin sheet is not particularly limited, but usually, it is preferably 5 ⁇ m or more, particularly preferably 10 ⁇ m or more, and further preferably 20 ⁇ m or more.
  • the thickness is usually preferably 500 ⁇ m or less, particularly preferably 300 ⁇ m or less, and more preferably 200 ⁇ m or less.
  • the manufacturing method of the resin sheet which concerns on this embodiment is not specifically limited,
  • the coating liquid containing the resin composition mentioned above is prepared, and the resin composition by coating of the said coating liquid
  • a resin sheet may be manufactured by forming a layer, or a resin sheet may be manufactured by extruding the above-mentioned resin composition and forming a resin composition layer.
  • the coating liquid which contains a resin composition, and also a solvent or a dispersion medium if desired is prepared, for example, on the peeling surface of a peeling sheet. Then, the coating solution is applied by a die coater, a curtain coater, a spray coater, a slit coater, a knife coater or the like to form a coated film, and the coated film can be dried to produce a resin sheet.
  • the coating liquid is not particularly limited in its properties as long as it can be applied, and may contain a component for forming a resin composition layer as a solute or a dispersoid.
  • the solvent include organic solvents such as cyclohexanone, toluene, ethyl acetate, methyl ethyl ketone, acetone, xylene and the like.
  • the release sheet may be released as a process material, may protect the resin composition layer until the resin sheet is used, or may be released after curing the resin composition layer.
  • the resin sheet according to the present embodiment is used to seal electronic components in a method of manufacturing a semiconductor device. For example, after laminating a resin composition layer in a resin sheet on an electronic component provided on a substrate or on a temporary fixing material such as an adhesive sheet, the curable resin composition layer is cured to form a cured layer. Thus, a sealed body in which the electronic component is sealed in the cured layer can be obtained. A semiconductor device can be manufactured by cutting the sealed body into pieces as needed.
  • the shrinkage stress is less likely to occur in the hardened layer, and the generated stress can be favorably alleviated.
  • the warpage of the sealing body can be effectively suppressed. Therefore, even in the case of sealing of an electronic component using a large-area resin sheet as in panel level packaging, it is possible to well suppress the warpage of the sealing body. Therefore, the resin sheet according to the present embodiment can be suitably used for sealing an electronic component by panel level packaging.
  • Curing of the curable resin composition layer is preferably performed by heating the curable resin composition layer.
  • the heating temperature is preferably 100 ° C. or more, particularly preferably 120 ° C. or more.
  • the temperature is preferably 240 ° C. or less, and particularly preferably 200 ° C. or less.
  • the heating time is preferably 15 minutes or more, and particularly preferably 20 minutes or more. Further, the time is preferably 300 minutes or less, and more preferably 100 minutes or less.
  • the heating in this case is preferably performed in two or more separate steps, and in particular, a first heat treatment to be thermally cured at a temperature T1 and a second heat treatment to be thermally cured at a temperature T2 higher than the temperature T1. It is more preferable that the heat treatment be performed by a two-stage heating process.
  • the temperature T1 is preferably 100 ° C. or more and 130 ° C. or less, and the heat treatment time is preferably 15 minutes or more and 60 minutes or less.
  • the temperature T2 is preferably 150 ° C. or more and 220 ° C. or less, and the heat treatment time is preferably 30 minutes or more and 120 minutes or less.
  • Examples 1 to 4 and Comparative Example 1 By mixing the components shown in Table 1 in cyclohexanone, a coating liquid of a resin composition having a solid content concentration of 58% by mass was obtained. The coating liquid is coated on the peeling surface of a peeling film (made by Lintec Co., Ltd., product name "PET 38 AL-5", hereinafter referred to as "first peeling film") on one side of which the alkyd peeling treatment is performed. The coated film obtained was dried in an oven at 100 ° C. for 1 minute to form a 50 ⁇ m thick curable resin composition layer.
  • a peeling film made by Lintec Co., Ltd., product name "PET 38 AL-5", hereinafter referred to as "first peeling film
  • a peelable film manufactured by Lintec Co., Ltd., product name “PET 38X”, hereinafter “a second release film”
  • a second release film may be referred to as “a second release film”
  • the viscoelasticity in the tensile mode was measured when the temperature was raised to 300 ° C., and the temperature at the maximum point of tan ⁇ (loss elastic modulus / storage elastic modulus) obtained by this measurement was taken as the glass transition temperature Tg (° C.) .
  • the measurement results are shown in Table 1.
  • Test Example 2 (Measurement of Storage Modulus) From the measurement results of the viscoelasticity of the hardened layer in Test Example 1, the storage elastic modulus (MPa) at 150 ° C. of the hardened layer was read. The results are shown in Table 1.
  • Test Example 3 (Measurement of Average Linear Expansion Coefficient) Using a thermomechanical analyzer (product name "TMA4030SA” manufactured by Bruker AXS), a hardened layer obtained in the same manner as in Test Example 1 was used with a load of 2 g, a temperature range of 0 to 300 ° C, a temperature rise rate of 5 ° C / The linear expansion coefficient was measured under the condition of min. From the results obtained, the average linear expansion coefficient at 25 to 180 ° C. was calculated. The results are shown in Table 1.
  • the surface on the silicon wafer side was placed down on the surface in a table having a flat and horizontal surface.
  • the surface on the cured layer side in the second laminate is It becomes concave and the surface on the silicon wafer side is convex. Therefore, when the second laminate in which warpage has occurred is placed on the table with the surface on the silicon wafer side facing down, as described above, the vicinity of the center of the second laminate contacts the table, At least a portion of the peripheral edge of the second laminate floats from the pedestal.
  • the height of the second laminate (the distance from the surface to the surface on the cured layer side of the second laminate) relative to the surface of the table on which the second laminate is placed is The measurement was made along the circumference of the laminate, and the largest one of the measured heights was taken as the amount of warpage (mm) of the sealing body. The results are shown in Table 1.
  • the curvature of the sealing body was evaluated based on the following references
  • ⁇ The amount of warpage was less than 5 mm.
  • Good The amount of warpage was less than 7 mm and 5 mm or more.
  • X The amount of warpage was 7 mm or more.
  • the resin sheet according to the present invention can be suitably used for manufacturing a semiconductor device using a resin sheet of a relatively large size, such as a fan-out type panel level package.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une feuille de résine utilisée pour assurer l'étanchéité d'un composant électronique. La feuille de résine est pourvue d'une couche de composition de résine durcissable constituée d'une composition de résine contenant une résine époxyde, le module de conservation à 150 °C d'une couche durcie formée par durcissement de la couche de composition de résine durcissable étant compris entre 0,1 MPa et 1 000 MPa, et la température de transition vitreuse d'un matériau durci obtenu par durcissement de la composition de résine étant compris entre 30 °C et 160 °C. Grâce à cette feuille de résine, le gauchissement d'un corps étanche obtenu peut être supprimé de manière satisfaisante même lorsqu'une feuille de résine ayant une surface relativement grande est utilisée.
PCT/JP2018/041082 2017-11-17 2018-11-06 Feuille de résine WO2019098078A1 (fr)

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US11286386B1 (en) 2021-01-15 2022-03-29 Wuhan Choice Technology Co., Ltd. Circuit build-up film for wafer-level packaging, and fabrication method and use thereof
CN112375340B (zh) * 2021-01-15 2021-03-26 武汉市三选科技有限公司 晶圆级封装密封用电路积层膜、其制备方法及应用

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WO2014156837A1 (fr) * 2013-03-28 2014-10-02 日東電工株式会社 Feuille de résine de scellage creuse et procédé de fabrication de conditionnement creux
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JP2014197670A (ja) 2013-03-07 2014-10-16 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート
JP6320239B2 (ja) 2013-09-24 2018-05-09 日東電工株式会社 半導体チップ封止用熱硬化性樹脂シート及び半導体パッケージの製造方法
JP6409362B2 (ja) 2014-06-25 2018-10-24 味の素株式会社 樹脂組成物
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WO2014156837A1 (fr) * 2013-03-28 2014-10-02 日東電工株式会社 Feuille de résine de scellage creuse et procédé de fabrication de conditionnement creux
JP2017092103A (ja) * 2015-11-04 2017-05-25 日東電工株式会社 中空型電子デバイス封止用シート、及び、中空型電子デバイスパッケージの製造方法
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CN114080427A (zh) * 2019-07-12 2022-02-22 日东电工株式会社 密封用树脂片
CN114080427B (zh) * 2019-07-12 2023-08-25 日东电工株式会社 密封用树脂片

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KR20200081336A (ko) 2020-07-07
JPWO2019098078A1 (ja) 2020-10-01
TW201932571A (zh) 2019-08-16

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