WO2019097850A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2019097850A1
WO2019097850A1 PCT/JP2018/035807 JP2018035807W WO2019097850A1 WO 2019097850 A1 WO2019097850 A1 WO 2019097850A1 JP 2018035807 W JP2018035807 W JP 2018035807W WO 2019097850 A1 WO2019097850 A1 WO 2019097850A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
resin
display device
layer
extending
Prior art date
Application number
PCT/JP2018/035807
Other languages
French (fr)
Japanese (ja)
Inventor
浅田 智
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2019097850A1 publication Critical patent/WO2019097850A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/06Electrode terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device

Definitions

  • Embodiments of the present invention relate to a display device.
  • a resin substrate is formed on a glass substrate. Then, after various insulating layers, electrodes, and wirings are formed on the resin base, the resin base is peeled off from the glass substrate.
  • the resin substrate loses the support and slightly expands and contracts. If this expansion and contraction is not uniform throughout the resin substrate, distortion of the display surface or pitch deviation of the terminal portion on which the IC or wiring board is mounted may occur.
  • a manufacturing method in which elements corresponding to a plurality of display panels are formed on a resin substrate formed on a mother glass, and the resin substrates are peeled off from the mother glass and then individual display panels are cut out. May break the cutting line.
  • One of the objects of the present disclosure is to prevent a failure due to the expansion and contraction of a resin substrate in a display device including a flexible resin substrate.
  • the display device includes a plurality of flexible first resin substrates, a plurality of pixels disposed above the first resin substrate, and a plurality of scans extending to a display area including the plurality of pixels. And a plurality of signal lines extending to the display area and intersecting the plurality of signal lines.
  • the first resin base includes a linear first resin layer and a plate-like second resin layer covering at least a side surface of the first resin layer.
  • FIG. 1 is a plan view showing a configuration example of a display device in the first embodiment.
  • FIG. 2 is a view showing an example of a cross section of a display panel provided in the display device.
  • FIG. 3 is a schematic plan view showing the shapes of the first resin layer and the third resin layer provided in the display panel.
  • FIG. 4 is a plan view schematically showing the vicinity of the intersection of the first resin layer.
  • FIG. 5 is a schematic plan view of a mother glass on which a first substrate of the display panel is formed.
  • FIG. 6 is a schematic cross-sectional view of a display panel cut out from the mother glass.
  • FIG. 7 is a schematic cross-sectional view showing the manufacturing process subsequent to FIG.
  • FIG. 8 is a schematic cross-sectional view showing the manufacturing process subsequent to FIG. FIG.
  • FIG. 9 is a schematic cross-sectional view showing the manufacturing process continued from FIG.
  • FIG. 10 is a schematic plan view of the display panel in the second embodiment.
  • FIG. 11 is a schematic plan view of the display panel in the third embodiment.
  • FIG. 12 is a schematic plan view of the display panel in the fourth embodiment.
  • FIG. 13 is a schematic plan view of the display panel in the fifth embodiment.
  • FIG. 14 is a schematic plan view of the display panel in the sixth embodiment.
  • FIG. 15 is a schematic plan view of the display panel in the seventh embodiment.
  • FIG. 16 is a schematic cross-sectional view of the display panel in the eighth embodiment.
  • FIG. 17 is a plan view showing a configuration example of a display device in the ninth embodiment.
  • FIG. 18 is a diagram showing an example of a circuit configuration of a sub-pixel included in the display device.
  • FIG. 19 is a view showing an example of a cross section of a display panel provided in the display device.
  • FIG. 20 is a schematic plan view of the display panel.
  • a liquid crystal display and an organic electroluminescence (EL) display are disclosed as an example of the display.
  • EL organic electroluminescence
  • each embodiment does not prevent the application of the individual technical idea disclosed in each embodiment to other types of display devices.
  • an electronic paper type display device having an electrophoretic element or the like a display device to which MEMS (Micro Electro Mechanical System) is applied, or a display device to which electrochromism is applied is assumed.
  • MEMS Micro Electro Mechanical System
  • FIG. 1 is a plan view showing a configuration example of a liquid crystal display device DSP1 (hereinafter referred to as a display device DSP1) according to the first embodiment.
  • a first direction X, a second direction Y, and a third direction Z are defined.
  • the respective directions X, Y and Z are directions orthogonal to each other in the present embodiment, but may intersect at angles other than perpendicular.
  • the display device DSP1 includes a display panel PNL1, a flexible circuit board FPC, and a controller CT.
  • the display panel PNL1 includes a first substrate SUB1 (array substrate), a second substrate SUB2 (counter substrate), and a liquid crystal layer LC disposed between the substrates SUB1 and SUB2.
  • the display panel PNL1 has a display area DA in which the pixels PX are arranged in a matrix along the first direction X and the second direction Y, and a peripheral area SA around the display area DA.
  • the peripheral area SA includes a terminal area TA in which a terminal T for external connection is disposed.
  • the first substrate SUB1 is larger than the second substrate SUB2.
  • the terminal area TA corresponds to an area where the first substrate SUB1 is exposed from the second substrate SUB2.
  • the first substrate SUB1 includes a plurality of scanning lines G and a plurality of signal lines S intersecting the scanning lines G.
  • the plurality of scanning lines G extend in the first direction X and are arranged in the second direction Y.
  • the plurality of signal lines S extend in the second direction Y and are arranged in the first direction X.
  • the pixel PX includes a plurality of sub-pixels SP of different colors.
  • the pixel PX can be configured by red, green, and blue sub-pixels SP.
  • the pixels PX may include sub-pixels SP of other colors, such as white sub-pixels SP.
  • the sub-pixel SP may be simply referred to as a pixel.
  • the first substrate SUB1 includes the switching element SW and the pixel electrode PE disposed in each sub-pixel SP. Further, the first substrate SUB1 includes a common electrode CE facing the respective pixel electrodes PE.
  • the common electrode CE may be disposed on the second substrate SUB2.
  • the switching element SW is driven by the scanning line G and the signal line S.
  • the pixel electrode PE is connected to the switching element SW. A common voltage is applied to the common electrode CE.
  • the first substrate SUB1 includes scanning line drivers GD1 and GD2 and a signal line driver SD.
  • the scanning line drivers GD1 and GD2 supply scanning signals to the plurality of scanning lines G.
  • the signal line driver SD supplies video signals to the plurality of signal lines S.
  • a plurality of scanning lines G are alternately connected to the scanning line drivers GD1 and GD2.
  • the first substrate SUB1 may have only one of the scanning line drivers GD1 and GD2, and all the scanning lines G may be connected to the one.
  • the flexible circuit board FPC is connected to the terminal T.
  • the controller CT is mounted on the flexible circuit board FPC.
  • the controller CT controls the scanning line drivers GD1 and GD2 and the signal line driver SD.
  • the controller CT may be mounted at a position different from the flexible printed circuit FPC, such as the terminal area TA, for example.
  • the first substrate SUB1 has a rectangular shape having a first side E11, a second side E12, a third side E13, and a fourth side E14.
  • the second substrate SUB2 has a rectangular shape having a first side E21, a second side E22, a third side E23, and a fourth side E24.
  • Each side E11, E12, E21, E22 is parallel to the second direction Y.
  • Each side E13, E14, E23, E24 is parallel to the first direction X.
  • the first sides E11 and E21 overlap each other.
  • the second sides E12 and E22 overlap each other.
  • the third sides E13 and E23 overlap each other.
  • the fourth sides E14 and E24 are located on the terminal area TA side and are offset from each other.
  • the first substrate SUB1 and the second substrate SUB2 are not limited to the rectangular shape as illustrated.
  • FIG. 2 is a view showing an example of a cross section along the first direction X of the display panel PNL1.
  • a part of the display area DA corresponding to one sub-pixel SP and a part of the peripheral area SA on the side of the first side E11, E21 are shown.
  • the first substrate SUB1 includes a flexible first resin base 10, a first insulating layer 13, a second insulating layer 14, a third insulating layer 15, a fourth insulating layer 16, and a first alignment film.
  • a pixel electrode PE, a common electrode CE, a signal line S, and a metal wiring ML are provided.
  • the first resin base 10 has a first surface 10A and a second surface 10B parallel to each other.
  • the first insulating layer 13 covers the first surface 10A.
  • the second insulating layer 14 covers the first insulating layer 13.
  • the signal line S is disposed on the second insulating layer 14.
  • the scanning line G shown in FIG. 1 is disposed, for example, between the first insulating layer 13 and the second insulating layer 14.
  • the third insulating layer 15 covers the signal line S and the second insulating layer 14.
  • the common electrode CE is disposed on the third insulating layer 15.
  • the metal wiring ML is disposed on the common electrode CE and is opposed to the signal line S.
  • the fourth insulating layer 16 covers the metal interconnect ML and the common electrode CE.
  • the pixel electrode PE is disposed on the fourth insulating layer 16.
  • the first alignment film 17 covers the pixel electrode PE and the fourth insulating layer 16.
  • Each insulating layer 13, 14, 16 is formed of, for example, an inorganic material.
  • the third insulating layer 15 is formed of, for example, an organic material.
  • the common electrode CE and the pixel electrode PE are formed of, for example, a transparent conductive material such as indium tin oxide (ITO).
  • the configuration of the first substrate SUB1 is not limited to the illustrated example.
  • the first substrate SUB1 may not include the metal wiring ML.
  • the positions of the pixel electrode PE and the common electrode CE may be switched, or the pixel electrode PE and the common electrode CE may be disposed in the same layer.
  • the common electrode CE can also be disposed on the second substrate SUB2.
  • the second substrate SUB2 is provided with a flexible second resin base 20, a fifth insulating layer 23, a light shielding layer 24, a color filter 25, an overcoat layer 26, and a second alignment film 27. There is.
  • the second resin base 20 has a first surface 20A and a second surface 20B parallel to each other.
  • the fifth insulating layer 23 is formed of, for example, an inorganic material, and covers the first surface 20A.
  • the light shielding layer 24 is disposed below the fifth insulating layer 23.
  • the color filter 25 covers the light shielding layer 24 and the fifth insulating layer 23.
  • the overcoat layer 26 covers the color filter 25.
  • the second alignment film 27 covers the overcoat layer 26.
  • the light shielding layer 24 overlaps the signal line S, the metal wiring ML, and the scanning line G in the display area DA, and has an opening corresponding to each sub-pixel SP. In addition, the light shielding layer 24 is disposed in the entire peripheral area SA.
  • the first substrate SUB1 and the second substrate SUB2 are bonded together by a frame-shaped sealing material SL disposed in the peripheral area SA.
  • a liquid crystal layer LC is disposed in a space surrounded by the first alignment film 17, the second alignment film 27, and the sealing material SL.
  • the first polarizing plate PL1 is attached to the second surface 10B of the first resin base 10.
  • the second polarizing plate PL2 is attached to the second surface 20B of the second resin base 20.
  • a backlight is disposed below the first polarizing plate PL1.
  • the display panel PNL1 may be a reflective type that displays an image using external light, or may have both transmissive and reflective functions.
  • the display panel PNL1 can be bent into any shape.
  • the terminal area TA may be bent so that the fourth side E14 shown in FIG. 1 is located below the first polarizing plate PL1.
  • other sides may be bent in the same manner.
  • the first resin base 10 includes a first resin layer 11 and a second resin layer 12.
  • the first resin layer 11 is formed of, for example, polyimide.
  • the second resin layer 12 is made of, for example, a different type of polyimide from the first resin layer 11.
  • the Young's modulus of the first resin layer 11 is larger than the Young's modulus of the second resin layer 12.
  • the thickness T11 of the first resin layer 11 in the third direction Z is smaller than the thickness T12 of the second resin layer 12 in the third direction Z.
  • the thickness T11 is preferably 1/3 or more of the thickness T12, and more preferably 2/3 or more.
  • the first resin layer 11 is linear as described later with reference to FIG. 3, and the second resin layer 12 is in the form of a plate covering the entire first resin base 10.
  • the first surface 10A of the first resin base 10 corresponds to the upper surface of the second resin layer 12.
  • the second surface 10 B of the first resin base 10 is constituted by the lower surfaces of the first resin layer 11 and the second resin layer 12.
  • the first resin layer 11 may have a shape extending from the first surface 10A to the second surface 10B. In this case, the first surface 10A is formed by the upper surfaces of the first resin layer 11 and the second resin layer 12.
  • the first resin layer 11 includes a frame portion 11a disposed in the peripheral area SA and an extended portion 11y disposed in the display area DA (see FIG. 3 for a planar shape).
  • the upper surface and the side surface on the display area DA side of the frame portion 11 a are covered with the second resin layer 12.
  • the extended portion 11 y is covered with the second resin layer 12 except for the lower surface.
  • the second resin base 20 includes a third resin layer 21 and a fourth resin layer 22.
  • the material and shape of the third resin layer 21 and the fourth resin layer 22 are the same as those of the first resin layer 11 and the second resin layer 12. That is, the third resin layer 21 and the fourth resin layer 22 are formed of, for example, different types of polyimide, and the Young's modulus of the third resin layer 21 is larger than the Young's modulus of the fourth resin layer 22.
  • the thickness T21 of the third resin layer 21 is smaller than the thickness T22 of the fourth resin layer 22. For example, the thickness T21 is preferably 1/3 or more of the thickness T22, and more preferably 2/3 or more.
  • the first surface 20A of the second resin base 20 corresponds to the lower surface of the fourth resin layer 22.
  • the second surface 20 B of the second resin base 20 is constituted by the upper surfaces of the third resin layer 21 and the fourth resin layer 22.
  • the third resin layer 21 includes a frame portion 21a disposed in the peripheral area SA and an extended portion 21y disposed in the display area DA (see FIG. 3 for a plan view).
  • the lower surface and the side surface on the display area DA side of the frame portion 21 a are covered with the fourth resin layer 22.
  • the extended portion 21 y is covered with the fourth resin layer 22 except for the upper surface.
  • the first resin layer 11 and the third resin layer 21 face each other. However, the first resin layer 11 and the third resin layer 21 may not be opposed at least in part.
  • FIG. 3 is a schematic plan view of the display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21.
  • the first resin layer 11 has a frame portion 11 a, an extension portion 11 x extending in the first direction X, and an extension portion 11 y extending in the second direction Y.
  • the third resin layer 21 has a frame portion 21 a, an extension portion 21 x extending in the first direction X, and an extension portion 21 y extending in the second direction Y. Note that the number of the extended portions 11x, 11y, 21x, 21y illustrated is an example, and may be more or less.
  • the frame portions 11a and 21a are an example of a first frame portion.
  • the frame portion 11a is provided in a frame shape along the edge (each side E11 to E14) of the first resin base body 10.
  • the frame portion 21a is provided in a frame shape along the edge (each side E21 to E24) of the second resin base 20. Regions along the sides E21 to E23 of the frame portion 21a overlap the frame portion 11a in plan view. Therefore, in FIG. 3, a part of the frame portion 11a is hidden by the frame portion 21a.
  • Each extending portion 11x is connected to the frame portion 11a at both ends.
  • each extension portion 21x is connected to the frame portion 21a at both ends.
  • the extending portion 21x crossing the display area DA overlaps the extending portion 11x in a plan view.
  • the extended portion 11x is disposed below the frame portion 21a along the fourth side E24. Therefore, in FIG. 3, the extending portion 11x is hidden by the extending portion 21x or the frame portion 21a.
  • Each extension portion 11y is connected to the frame portion 11a at both ends. Similarly, both ends of each extension portion 21y are connected to the frame portion 21a.
  • the extending portion 21 y overlaps with the extending portion 11 y in plan view. Therefore, in FIG. 3, a part of the extension 11y is hidden by the extension 21y.
  • the extended portion 11y may not be disposed in the terminal area TA.
  • the frame portion 11a and the extension portions 11x and 11y have, for example, a lattice shape in which the pitch in the first direction X and the second direction Y is constant as a whole. However, at least one of the pitches in the first direction X and the second direction Y may not be constant. Similarly, the frame portion 21a and the extension portions 21x and 21y are also in the form of a lattice having a constant pitch in the first direction X and the second direction Y as a whole, for example. .
  • FIG. 4 is a plan view schematically showing the vicinity of the intersection of the extension portions 11x and 11y.
  • the scanning line G, the signal line S, the light shielding layer 24, and the extending portions 11x and 11y are shown, and illustration of other elements is omitted.
  • the extended portion 11x overlaps the scanning line G.
  • the extended portion 11 y overlaps the signal line S.
  • the scanning line G, the signal line S, and the extended portions 11x and 11y all overlap the light shielding layer 24.
  • the extension portions 11x and 11y are connected to each other at a position where the scanning line G and the signal line S intersect.
  • the relationship between the extended portions 21 x and 21 y, the scanning line G, the signal line S, and the light shielding layer 24 is also the same as in the illustrated example.
  • the frame portions 11a and 21a overlap the light shielding layer 24 disposed in the peripheral area SA (see FIG. 2).
  • a manufacturing process of the display panel PNL1 First, a plurality of first substrates SUB1 are formed on a mother glass. Similarly, a plurality of second substrates SUB2 are formed on another mother glass.
  • FIG. 5 is a schematic plan view of a mother glass MG on which a plurality of first substrates SUB1 are formed.
  • the mother glass MG is cut along a cut line CL in the shape of the first substrate SUB1 in a later manufacturing process.
  • the first resin base 10 is formed on substantially the entire mother glass MG.
  • the first resin layer 11 is formed in a lattice shape over the entire first resin base 10.
  • the cut line CL overlaps the first resin layer 11.
  • the first resin layer 11 can be formed of, for example, photosensitive polyimide.
  • the material that is the source of the first resin layer 11 is applied to substantially the entire mother glass MG, and this is exposed and developed to be patterned into the shape of the first resin layer 11.
  • the first resin layer 11 can also be formed of non-photosensitive polyimide.
  • the material that is the source of the first resin layer 11 is applied to substantially the entire mother glass MG, and this is cured by heating to form a polyimide layer.
  • a photosensitive resist is formed on the polyimide layer, exposed and developed to open it in the shape of the first resin layer 11.
  • the polyimide layer is patterned in the shape of the first resin layer 11 by etching through the openings of the resist.
  • the second substrate SUB2 can also be formed by the same method as the above-described first substrate SUB1.
  • the two mother glasses MG on which the substrates SUB1 and SUB2 are respectively formed are bonded to each other via the above-described seal material SL.
  • the liquid crystal layer LC can be formed by dropping a liquid crystal material inside the sealing material SL and bonding two mother glasses MG in a vacuum atmosphere. Thereafter, by cutting the two mother glasses MG along the cut line CL, the individual display panels PNL1 are cut out.
  • FIG. 6, FIG. 7, FIG. 8 and FIG. 9 are schematic cross sectional views sequentially showing the subsequent manufacturing steps of the display panel PNL1 cut out from the mother glass MG.
  • first resin base 10 the second resin base 20
  • sealing material SL the sealing material SL
  • liquid crystal layer LC the liquid crystal layer LC
  • the glass substrate GS1 cut out from the mother glass MG is attached to the second surface 10B of the first resin base 10. Further, the glass substrate GS2 cut out from the mother glass MG is attached to the second surface 20B of the second resin base 20.
  • the glass substrate GS2 is removed by laser lift off (LLO). Specifically, laser light from the laser light source LS is irradiated from the side of the glass substrate GS2, and the interface between the glass substrate GS2 and the second resin base 20 is peeled off.
  • this laser beam for example, an excimer laser or YAG laser in the ultraviolet region can be used.
  • the terminal area TA is formed on the first substrate SUB1.
  • the second polarizing plate PL2 is attached to the second surface 20B of the second resin base 20. Furthermore, similarly to the glass substrate GS2, the glass substrate GS1 is removed by LLO using the laser light source LS.
  • the first polarizing plate PL1 is attached to the second surface 10B of the first resin base 10.
  • the display panel PNL1 is completed.
  • the first resin substrate 10 is a uniform polyimide film
  • the first resin substrate 10 and the glass substrate GS1 are peeled off
  • the first resin substrate 10 is not supported by the glass substrate GS1, so the first resin substrate 10 is May stretch.
  • the second resin base 20 is a uniform polyimide film
  • the second resin base 20 may expand and contract.
  • the first resin base 10 is provided with the linear first resin layer 11. Since the Young's modulus of the first resin layer 11 is larger than the Young's modulus of the second resin layer 12, the first resin layer 11 is less likely to expand and contract when the glass substrate GS1 is peeled off, as compared to the second resin layer 12. Therefore, expansion and contraction of the first resin base 10 can be suppressed.
  • the influence of the expansion and contraction of the second resin layer 12 remains in the lattice. Therefore, the overall deformation of the first resin base 10 is reduced.
  • the outer shape of the first substrate SUB1 can be stabilized. Furthermore, by disposing the extension portions 11x and 11y in the display area DA, it is possible to suppress the displacement of the sub-pixel SP in the display area DA.
  • the transmittance of the display area DA is hardly affected.
  • the thickness T11 of the first resin layer 11 is set to 1/3 or more of the thickness T12 of the second resin layer 12 as described above, a favorable effect of suppressing the expansion and contraction of the first resin substrate 10 can be obtained. . If the thickness T11 is 2/3 or more of the thickness T12, the effect can be further enhanced.
  • first resin base 10 can be obtained similarly for the second resin base 20 as well.
  • second resin base 20 By suppressing the expansion and contraction in both the first resin base 10 and the second resin base 20, the deviation between each element of the first substrate SUB1 and each element of the second substrate SUB2 is suppressed, and color mixing of adjacent subpixels SP Can be prevented.
  • FIG. 6 to 9 illustrate the manufacturing method of removing the glass substrates GS1 and GS2 which were a part of the mother glass MG after the display panel PNL1 is cut out from the two mother glasses MG bonded to each other.
  • the first resin base 10 and the second resin base 20 may be peeled off from the mother glass MG by the above-described LLO.
  • the first resin substrate 10 is a uniform polyimide film
  • the first resin substrate 10 may expand and contract when the mother glass MG is removed, and the cut line CL may deviate from the original position. There is.
  • the first resin layer 11 suppresses the expansion and contraction of the first resin base 10
  • the shift of the cut line CL can be suppressed. The same applies to the second resin base 20.
  • the first resin substrate 10 has a two-layer structure of the first resin layer 11 and the second resin layer 12, and the second resin substrate 20 has the third resin layer 21 and the fourth resin layer 22.
  • An example has been disclosed that is a two-layer structure.
  • the first resin base 10 may have a two-layer structure, and the second resin base 20 may be a uniform base.
  • the first resin base 10 may be a uniform base, and the second resin base 20 may have a two-layer structure.
  • planar shapes of the first resin layer 11 and the third resin layer 21 are not limited to those shown in FIG. In the following second to seventh embodiments, other shapes applicable to the first resin layer 11 and the third resin layer 21 are shown. The planar shapes of the first resin layer 11 and the third resin layer 21 disclosed in each embodiment can be combined as appropriate.
  • FIG. 10 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the second embodiment.
  • the first resin layer 11 has a frame portion 11a
  • the third resin layer 21 has a frame portion 21a.
  • the first resin layer 11 has, in the terminal area TA, a plurality of extending portions 11 x which extend in the first direction X and are arranged at regular intervals in the second direction Y. Each extending portion 11x is connected to the frame portion 11a at both ends.
  • the fourth side E11 is The terminal area TA can be easily bent so as to be located on the back side of the display panel PNL1.
  • FIG. 11 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the third embodiment.
  • the first resin layer 11 has a frame portion 11a and an extended portion 11x in the terminal area TA
  • the third resin layer 21 has a frame portion 21a.
  • the first resin layer 11 has a frame portion 11b along the edge of the display area DA.
  • the third resin layer 21 has a frame portion 21b along the edge of the display area DA.
  • the frame portion 11 b and the frame portion 21 b overlap in a plan view. Therefore, in FIG. 11, the frame portion 11b is hidden by the frame portion 21b.
  • the frame portions 11 b and 21 b are an example of a second frame portion.
  • the frame portions 11 b and 21 b are provided as in the present embodiment, the expansion and contraction of the first resin base 10 and the second resin base 20 in the peripheral area SA hardly affect the display area DA.
  • FIG. 12 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the fourth embodiment.
  • the first resin layer 11 has frame portions 11a and 11b and an extension portion 11x in the terminal area TA
  • the third resin layer 21 has frame portions 21a and 21b.
  • the first resin layer 11 has, in the display area DA, an extension portion 11 x extending in the first direction X and an extension portion 11 y extending in the second direction Y.
  • the third resin layer 21 has an extended portion 21 x extending in the first direction X and an extended portion 21 y extending in the second direction Y in the display area DA.
  • both ends of the extension portions 11x and 11y are connected to the frame portion 11b. Both ends of the extension portions 21x and 21y are connected to the frame portion 21b.
  • the extending portion 21x overlaps with the extending portion 11x in a plan view.
  • the extending portion 21 y overlaps with the extending portion 11 y in plan view. Therefore, in FIG. 12, the extended portions 11x and 11y are hidden by the extended portions 21x and 21y.
  • the display area DA is divided into a plurality of areas by the extended portions 11x, 11y, 21x, 21y as in the present embodiment, the influence of the expansion and contraction of the second resin layer 12 and the fourth resin layer 22 is within each area. Stay. Therefore, before and after peeling of the glass substrate, the overall deformation amount of the first resin base 10 and the second resin base 20 in the display area DA is reduced.
  • FIG. 13 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the fifth embodiment.
  • the first resin layer 11 has frame portions 11a and 11b and extension portions 11x and 11y
  • the third resin layer 21 has frame portions 21a and 21b and extension portions 21x and 21y. ing.
  • the first resin layer 11 has extended portions 11p and 11q extending in a direction intersecting the first direction X and the second direction Y in the display area DA.
  • the third resin layer 21 has extended portions 21p and 21q extending in a direction intersecting the first direction X and the second direction Y in the display area DA.
  • the extension parts 11p and 11q extend in the diagonal direction of the area divided by the extension parts 11x and 11y and the frame part 11b.
  • the extended portions 21p and 21q overlap with the extended portions 11p and 11q in plan view, respectively. Therefore, in FIG. 13, the extension portions 11 p and 11 q are hidden by the extension portions 21 p and 21 q.
  • FIG. 14 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the sixth embodiment.
  • the first resin layer 11 has frame portions 11a and 11b and extension portions 11x and 11y
  • the third resin layer 21 has frame portions 21a and 21b and extension portions 21x and 21y. ing.
  • the extension portions 11 x and 21 x are respectively disposed between the sub-pixels SP in the second direction Y, and the extension portions 11 y and 21 y are in the first direction X. Are respectively disposed between.
  • the sub-pixels SP are partitioned in a grid shape by the extension portions 11x, 11y, 21x, 21y.
  • the extended portions 11x and 21x overlap the scanning line G and the light shielding layer 24, and the extended portions 11y and 21y overlap the signal line S and the light shielding layer 24.
  • the extending portions 11x, 11y, 21x, 21y are provided at high density as in the present embodiment, expansion and contraction of the first resin base 10 and the second resin base 20 can be extremely well suppressed.
  • the extension portions 11x, 11y, 21x, and 21y may divide an area for each pixel PX configured by a plurality of sub-pixels SP, for example.
  • the size of the area divided by the extended portions 11x, 11y, 21x, 21y can be appropriately determined.
  • FIG. 15 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the seventh embodiment.
  • the first resin layer 11 and the third resin layer 21 are lattice-like as in the example of FIG. 3, but gaps are provided in portions corresponding to the intersections of the lattices.
  • the frame portion 11a is disposed intermittently along the sides E11 to E14, and the frame portion 21a is disposed intermittently along the sides E21 to E24.
  • the extension portions 11x and 21x are intermittently disposed along the first direction X, and the extension portions 11y and 21y are disposed intermittently along the second direction Y.
  • the extension 11x and the extension 11y are separated from each other at a position corresponding to the intersection of the grids.
  • the frame portion 11a and the extension portion 11x, the frame portion 11a and the extension portion 11y, the extension portion 21x and the extension portion 21y, the frame portion 21a and the extension portion 21x, and the frame portion 21a and the extension portion 21y They are spaced apart from one another at positions corresponding to the intersections of the grids.
  • the first resin layer 11 and the third resin layer 21 are formed in a lattice, before the curing of the second resin layer 12 and the fourth resin layer 22 when the display panel PNL 1 is manufactured.
  • the material may not spread uniformly.
  • the first resin layer 11 and the third resin layer 21 are continuous over the entire length of the first resin base 10 and the second resin base 20, the amount of expansion and contraction of the resin layers 11 and 21 is also increased.
  • the material before curing which is the source of the second resin layer 12 and the fourth resin layer 22 is the intersection point of the lattice of the first resin layer 11 and the third resin layer 21 It spreads uniformly through the gap of the position equivalent to.
  • the first resin layer 11 and the third resin layer 21 are subdivided, the expansion and contraction of the resin layers 11 and 21 can be also within a local range, and as a result, the overall amount of expansion and contraction is reduced. it can.
  • the first resin layer 11 is separated at a position corresponding to each intersection of the first resin layer 11 having a planar shape shown in FIG. 3, and the third resin layer 21 having a planar shape shown in FIG.
  • the example which spaces apart the 3rd resin layer 21 in the position corresponded to each intersection was shown.
  • the configuration in which the first resin layer 11 and the third resin layer 21 are separated at the positions corresponding to the respective intersections can also be applied to the first resin layer 11 and the third resin layer 21 having a planar shape shown in FIGS. it can.
  • FIG. 16 is a schematic cross-sectional view of a display panel PNL1 according to the present embodiment. Here, as in FIG. 6, the state before peeling of the glass substrates GS1 and GS2 is shown.
  • the first resin base 10 includes two resin layers 12 a and 12 b instead of the second resin layer 12.
  • the resin layers 12 a and 12 b are formed of polyimide having a Young's modulus smaller than that of the first resin layer 11.
  • the resin layer 12a is formed on the glass substrate GS1.
  • the first resin layer 11 is formed on the resin layer 12a.
  • the resin layer 12 b covers the first resin layer 11 and the resin layer 12 a.
  • the second resin base 20 includes two resin layers 22 a and 22 b instead of the fourth resin layer 22.
  • the resin layers 22 a and 22 b are formed of polyimide having a Young's modulus smaller than that of the third resin layer 21.
  • the resin layer 22a is formed under the glass substrate GS2.
  • the third resin layer 21 is formed under the resin layer 22a.
  • the resin layer 22 b covers the third resin layer 21 and the resin layer 22 a.
  • the absorptivity of laser light tends to be smaller as the Young's modulus is larger. Therefore, when the first resin layer 11 is in contact with the glass substrate GS1 as in the first embodiment, there is a possibility that the first resin base 10 and the glass substrate GS1 can not be peeled off smoothly in the LLO. On the other hand, in the case of the structure of the present embodiment, the resin layer 12a having a Young's modulus smaller than that of the first resin layer 11 is in contact with the glass substrate GS1. And it becomes easy to peel off. The same applies to the second resin base 20.
  • the liquid crystal display device DSP1 is disclosed.
  • an organic EL display device is disclosed.
  • FIG. 17 is a plan view showing a configuration example of an organic EL display device DSP2 (hereinafter, referred to as a display device DSP2) according to the present embodiment. Elements similar to those of the first embodiment are assigned the same reference numerals and explanation thereof is omitted.
  • the display device DSP2 includes a display panel PNL2.
  • the display panel PNL2 has a rectangular shape having a first side E1, a second side E2, a third side E3, and a fourth side E4. Each side E1, E2 is parallel to the second direction Y. Each side E3, E4 is parallel to the first direction X.
  • the display panel PNL2 is not limited to the rectangular shape.
  • the pixels PX arranged in the display area DA can be configured by red, green and blue sub-pixels SP.
  • the pixels PX may include sub-pixels SP of other colors, such as white sub-pixels SP.
  • FIG. 18 is a diagram showing an example of the circuit configuration of the sub-pixel SP.
  • the sub-pixel SP includes an organic EL element OLED, a first switching element SW1, and a second switching element SW2.
  • the pixel electrode PE (anode electrode) of the organic EL element OLED is connected to the power supply line PS via the first switching element SW1.
  • a storage capacitor C is formed between the gate electrode and the source electrode (or drain electrode) of the first switching element SW1.
  • the gate of the first switching element SW1 is connected to the signal line S via the second switching element SW2.
  • the gate of the second switching element SW2 is connected to the scanning line G.
  • the organic light emitting layer ORG emits light in a color corresponding to each sub-pixel SP.
  • the light emitted from the organic light emitting layers ORG of the sub-pixels SP of each color may be the same color (for example, white), and a color filter may be disposed in each sub-pixel SP.
  • FIG. 19 is a diagram showing an example of a cross section of the display panel PNL2. Here, a part of the display area DA corresponding to one sub-pixel SP is shown.
  • the display panel PNL2 includes a flexible resin base 30, a barrier layer 33, a first insulating layer 34, a second insulating layer 35, a first passivation layer 36, and a second passivation layer 37. A layer 38 and a third passivation layer 39 are provided. Further, the display panel PNL includes the organic light emitting layer ORG and the pixel electrode PE disposed in each sub-pixel SP, the bank 40 disposed at the boundary of the sub-pixel SP, and the common electrode CE.
  • the resin base 30 has a first surface 30A and a second surface 30B parallel to each other.
  • the barrier layer 33 covers the first surface 30A.
  • the first insulating layer 34 covers the barrier layer 33.
  • the signal line S is disposed on the first insulating layer 34.
  • the second insulating layer 35 covers the signal line S and the first insulating layer 34.
  • the first passivation layer 36 covers the second insulating layer 35.
  • the pixel electrode PE is disposed on the first passivation layer 36.
  • the organic light emitting layer ORG is disposed on the pixel electrode PE.
  • the bank 40 is disposed between the pixel electrode PE of the adjacent subpixel SP and the organic light emitting layer ORG.
  • the common electrode CE covers the organic light emitting layer ORG and the bank 40.
  • the second passivation layer 37 covers the common electrode CE.
  • the sealing layer 38 covers the second passivation layer 37.
  • the third passivation layer 39 covers the sealing layer 38.
  • a polarizing plate PL is adhered on the third passivation layer 39.
  • the resin base 30 includes a first resin layer 31 and a second resin layer 32.
  • the first resin layer 31 is formed of, for example, polyimide.
  • the second resin layer 32 is formed of, for example, a different type of polyimide from the first resin layer 31.
  • the Young's modulus of the first resin layer 31 is larger than the Young's modulus of the second resin layer 32.
  • the thickness T31 of the first resin layer 31 in the third direction Z is smaller than the thickness T32 of the second resin layer 32 in the third direction Z.
  • the thickness T31 is preferably 1/3 or more of the thickness T32, and more preferably 2/3 or more.
  • the first resin layer 31 is linear as described later with reference to FIG. 20, and the second resin layer 32 is in the form of a plate covering the entire resin base 30.
  • the illustrated first resin layer 31 is covered with the second resin layer 32 except for the lower surface.
  • the first surface 30A of the resin base 30 corresponds to the upper surface of the second resin layer 32.
  • the second surface 30 B of the resin base 30 is constituted by the lower surfaces of the first resin layer 31 and the second resin layer 32.
  • a member such as a support film may be attached to the second surface 30B.
  • the substrate of the display panel PNL2 is formed of a resin material, the display panel PNL2 can be bent into any shape.
  • FIG. 20 is a schematic plan view of the display panel PNL2 showing the shape of the first resin layer 31.
  • the example which applied the planar shape similar to the 1st resin layer 11 shown in FIG. 14 to the 1st resin layer 31 is shown.
  • the planar shape of the first resin layer 31 for example, the planar shape of the first resin layer 11 disclosed in FIG. 3, FIG. 10 to FIG. 13, and FIG.
  • the first resin layer 31 has frame portions 31a and 31b.
  • the frame portion 31 a is provided in a frame shape along the edge (each side E 1 to E 4) of the resin base 30.
  • the frame portion 31 b is provided in a frame shape along the edge of the display area DA.
  • the first resin layer 31 has a plurality of extending portions 31 x extending in the first direction X and a plurality of extending portions 31 y extending in the second direction Y.
  • a part of the plurality of extended portions 31x is arranged at a constant interval in the second direction Y in the terminal area TA between the display area DA and the fourth side E4. Both ends of each of the extension portions 31x are connected to the frame portion 31a.
  • the plurality of extended portions 31x and the plurality of extended portions 31y are arranged in a lattice. Both ends of each of the extension portions 31x and 31y are connected to the frame portion 31b.
  • the extended portions 31x are respectively disposed between the sub-pixels SP arranged in the second direction Y.
  • the extension portions 31y are respectively disposed between the sub-pixels SP in the first direction X. Thereby, the sub-pixels SP are partitioned in a grid shape by the extension portions 31x and 31y.
  • the extended portion 31x overlaps, for example, the scanning line G.
  • the extended portion 31 y overlaps, for example, the signal line S.
  • the resin base 30 may have a structure in which the first resin layer 31 is sandwiched between two resin layers, similarly to the first resin base 10 shown in FIG.
  • DSP1 display device
  • PNL1 display panel
  • SUB1 first substrate
  • SUB2 second substrate
  • LC liquid crystal layer
  • SA peripheral region
  • PX pixel
  • SP subpixel
  • G scanning line S: signal line
  • GS1, GS2 glass substrate
  • 10 first resin base
  • 11 first resin layer
  • 12 second resin layer
  • 20 second resin base
  • 21 third resin layer
  • 22 Fourth resin layer
  • 24 ... light shielding layer.

Abstract

A display device according to one embodiment is provided with: a first resin substrate which is flexible; a plurality of pixels disposed above the first resin substrate; a plurality of scanning lines which extend in a display region including the plurality of pixels; and a plurality of signal lines which extend in the display region and intersect the plurality of scanning lines. The first resin substrate includes a filamentous first resin layer, and a plate-shaped second resin layer which covers at least a side surface of the first resin layer.

Description

表示装置Display device
 本発明の実施形態は、表示装置に関する。 Embodiments of the present invention relate to a display device.
 従来、液晶表示装置や有機エレクトロルミネッセンス表示装置などの表示装置においては、表示パネルの基体にガラス基体が用いられている。近年では、表示パネルの基体に樹脂基体を用いることで、表示パネルに可撓性を与えた表示装置が開発されている。 Conventionally, in display devices such as liquid crystal display devices and organic electroluminescent display devices, glass substrates are used as the substrates of display panels. In recent years, a display device in which flexibility is given to a display panel has been developed by using a resin base for the base of the display panel.
 このような表示パネルの製造時には、樹脂基体がガラス基板の上に形成される。そして、各種の絶縁層、電極および配線が樹脂基体の上に形成された後、樹脂基体がガラス基板から剥離される。 At the time of manufacturing such a display panel, a resin substrate is formed on a glass substrate. Then, after various insulating layers, electrodes, and wirings are formed on the resin base, the resin base is peeled off from the glass substrate.
 ガラス基板から剥離されたことで、樹脂基体は支持体を失い僅かに伸縮する。この伸縮が樹脂基体の全体で不均一であれば、表示面の歪みや、ICあるいは配線基板が実装される端子部のピッチずれを生じ得る。また、マザーガラスに形成された樹脂基体の上に複数の表示パネルに対応する要素を形成し、マザーガラスから樹脂基体を剥離してから個々の表示パネルを切り出す製造方法においては、樹脂基体の伸縮により割断ラインがずれる可能性がある。 By peeling from the glass substrate, the resin substrate loses the support and slightly expands and contracts. If this expansion and contraction is not uniform throughout the resin substrate, distortion of the display surface or pitch deviation of the terminal portion on which the IC or wiring board is mounted may occur. In addition, in a manufacturing method in which elements corresponding to a plurality of display panels are formed on a resin substrate formed on a mother glass, and the resin substrates are peeled off from the mother glass and then individual display panels are cut out. May break the cutting line.
 さらに、液晶表示装置のアレイ基板と対向基板の双方に樹脂基体を用いる場合において、各樹脂基体の伸縮が場所によって異なれば、アレイ基板の配線や画素電極と、対向基板の遮光層やカラーフィルタとがずれる可能性がある。このようなずれが生じると、隣接する画素の間で混色が生じ得る。 Furthermore, in the case where resin substrates are used for both the array substrate and the counter substrate of the liquid crystal display device, if the expansion and contraction of each resin substrate differs depending on the location, wiring of the array substrate and pixel electrodes There is a possibility of shifting. When such a shift occurs, color mixing may occur between adjacent pixels.
特開平11-231325号公報Japanese Patent Application Laid-Open No. 11-231325 特開2015-26055号公報JP, 2015-26055, A
 本開示の目的の一つは、可撓性を有する樹脂基体を備える表示装置において、樹脂基体の伸縮に起因した不具合を防止することである。 One of the objects of the present disclosure is to prevent a failure due to the expansion and contraction of a resin substrate in a display device including a flexible resin substrate.
 一実施形態における表示装置は、可撓性を有する第1樹脂基体と、前記第1樹脂基体の上方に配置された複数の画素と、前記複数の画素を含む表示領域に延在する複数の走査線と、前記表示領域に延在し、前記複数の信号線と交差する複数の信号線と、を備えている。前記第1樹脂基体は、線状の第1樹脂層と、前記第1樹脂層の少なくとも側面を覆う板状の第2樹脂層と、を含む。 The display device according to one embodiment includes a plurality of flexible first resin substrates, a plurality of pixels disposed above the first resin substrate, and a plurality of scans extending to a display area including the plurality of pixels. And a plurality of signal lines extending to the display area and intersecting the plurality of signal lines. The first resin base includes a linear first resin layer and a plate-like second resin layer covering at least a side surface of the first resin layer.
図1は、第1実施形態における表示装置の構成例を示す平面図である。FIG. 1 is a plan view showing a configuration example of a display device in the first embodiment. 図2は、上記表示装置が備える表示パネルの断面の一例を示す図である。FIG. 2 is a view showing an example of a cross section of a display panel provided in the display device. 図3は、上記表示パネルが備える第1樹脂層および第3樹脂層の形状を表す概略的な平面図である。FIG. 3 is a schematic plan view showing the shapes of the first resin layer and the third resin layer provided in the display panel. 図4は、上記第1樹脂層の交点近傍を概略的に示す平面図である。FIG. 4 is a plan view schematically showing the vicinity of the intersection of the first resin layer. 図5は、上記表示パネルの第1基板が形成されたマザーガラスの概略的な平面図である。FIG. 5 is a schematic plan view of a mother glass on which a first substrate of the display panel is formed. 図6は、上記マザーガラスから切り出された表示パネルの概略的な断面図である。FIG. 6 is a schematic cross-sectional view of a display panel cut out from the mother glass. 図7は、図6に続く製造工程を示す概略的な断面図である。FIG. 7 is a schematic cross-sectional view showing the manufacturing process subsequent to FIG. 図8は、図7に続く製造工程を示す概略的な断面図である。FIG. 8 is a schematic cross-sectional view showing the manufacturing process subsequent to FIG. 図9は、図8に続く製造工程を示す概略的な断面図である。FIG. 9 is a schematic cross-sectional view showing the manufacturing process continued from FIG. 図10は、第2実施形態における表示パネルの概略的な平面図である。FIG. 10 is a schematic plan view of the display panel in the second embodiment. 図11は、第3実施形態における表示パネルの概略的な平面図である。FIG. 11 is a schematic plan view of the display panel in the third embodiment. 図12は、第4実施形態における表示パネルの概略的な平面図である。FIG. 12 is a schematic plan view of the display panel in the fourth embodiment. 図13は、第5実施形態における表示パネルの概略的な平面図である。FIG. 13 is a schematic plan view of the display panel in the fifth embodiment. 図14は、第6実施形態における表示パネルの概略的な平面図である。FIG. 14 is a schematic plan view of the display panel in the sixth embodiment. 図15は、第7実施形態における表示パネルの概略的な平面図である。FIG. 15 is a schematic plan view of the display panel in the seventh embodiment. 図16は、第8実施形態における表示パネルの概略的な断面図である。FIG. 16 is a schematic cross-sectional view of the display panel in the eighth embodiment. 図17は、第9実施形態における表示装置の構成例を示す平面図である。FIG. 17 is a plan view showing a configuration example of a display device in the ninth embodiment. 図18は、上記表示装置が備える副画素の回路構成例を示す図である。FIG. 18 is a diagram showing an example of a circuit configuration of a sub-pixel included in the display device. 図19は、上記表示装置が備える表示パネルの断面の一例を示す図である。FIG. 19 is a view showing an example of a cross section of a display panel provided in the display device. 図20は、上記表示パネルの概略的な平面図である。FIG. 20 is a schematic plan view of the display panel.
 いくつかの実施形態につき、図面を参照しながら説明する。 
 なお、開示はあくまで一例に過ぎず、当業者において、発明の主旨を保っての適宜変更について容易に想到し得るものについては、当然に本発明の範囲に含有される。また、図面は、説明をより明確にするため、実際の態様に比べて模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。各図において、連続して配置される同一又は類似の要素については符号を省略することがある。また、本明細書と各図において、既出の図に関して前述したものと同一又は類似した機能を発揮する構成要素には同一の参照符号を付し、重複する詳細な説明を省略することがある。
Several embodiments will be described with reference to the drawings.
The disclosure is merely an example, and those that can be easily conceived of as appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematically represented as compared to the actual embodiment in order to clarify the description, but are merely examples and do not limit the interpretation of the present invention. In each of the drawings, reference numerals may be omitted for identical or similar elements arranged in succession. In addition, in the present specification and the drawings, components having the same or similar functions as those described above with reference to the drawings already described may be denoted by the same reference symbols, and overlapping detailed descriptions may be omitted.
 各実施形態においては、表示装置の一例として、液晶表示装置および有機エレクトロルミネッセンス(EL)表示装置を開示する。ただし、各実施形態は、他種の表示装置に対する、各実施形態にて開示される個々の技術的思想の適用を妨げるものではない。他種の表示装置としては、例えば、電気泳動素子等を有する電子ペーパ型の表示装置、MEMS(Micro Electro Mechanical System)を応用した表示装置、或いはエレクトロクロミズムを応用した表示装置等が想定される。 In each embodiment, a liquid crystal display and an organic electroluminescence (EL) display are disclosed as an example of the display. However, each embodiment does not prevent the application of the individual technical idea disclosed in each embodiment to other types of display devices. As another type of display device, for example, an electronic paper type display device having an electrophoretic element or the like, a display device to which MEMS (Micro Electro Mechanical System) is applied, or a display device to which electrochromism is applied is assumed.
 [第1実施形態] 
 図1は、第1実施形態に係る液晶表示装置DSP1(以下、表示装置DSP1と呼ぶ)の構成例を示す平面図である。本実施形態においては、図示したように第1方向X、第2方向Yおよび第3方向Zを定義する。各方向X,Y,Zは、本実施形態においては互いに直交する方向であるが、垂直以外の角度で交わってもよい。
First Embodiment
FIG. 1 is a plan view showing a configuration example of a liquid crystal display device DSP1 (hereinafter referred to as a display device DSP1) according to the first embodiment. In the present embodiment, as illustrated, a first direction X, a second direction Y, and a third direction Z are defined. The respective directions X, Y and Z are directions orthogonal to each other in the present embodiment, but may intersect at angles other than perpendicular.
 表示装置DSP1は、表示パネルPNL1と、フレキシブル回路基板FPCと、コントローラCTとを備えている。表示パネルPNL1は、第1基板SUB1(アレイ基板)と、第2基板SUB2(対向基板)と、これら基板SUB1,SUB2の間に配置された液晶層LCとを備えている。 The display device DSP1 includes a display panel PNL1, a flexible circuit board FPC, and a controller CT. The display panel PNL1 includes a first substrate SUB1 (array substrate), a second substrate SUB2 (counter substrate), and a liquid crystal layer LC disposed between the substrates SUB1 and SUB2.
 表示パネルPNL1は、画素PXが第1方向Xおよび第2方向Yに沿ってマトリクス状に配列された表示領域DAと、表示領域DAの周囲の周辺領域SAとを有している。周辺領域SAは、外部接続用の端子Tが配置された端子領域TAを含む。図示した例においては、第1基板SUB1が第2基板SUB2よりも大きい。端子領域TAは、第1基板SUB1が第2基板SUB2から露出した領域に相当する。 The display panel PNL1 has a display area DA in which the pixels PX are arranged in a matrix along the first direction X and the second direction Y, and a peripheral area SA around the display area DA. The peripheral area SA includes a terminal area TA in which a terminal T for external connection is disposed. In the illustrated example, the first substrate SUB1 is larger than the second substrate SUB2. The terminal area TA corresponds to an area where the first substrate SUB1 is exposed from the second substrate SUB2.
 表示領域DAにおいて、第1基板SUB1は、複数の走査線Gと、これら走査線Gと交差する複数の信号線Sとを備えている。複数の走査線Gは、第1方向Xに延びるとともに、第2方向Yに並んでいる。複数の信号線Sは、第2方向Yに延びるとともに、第1方向Xに並んでいる。 In the display area DA, the first substrate SUB1 includes a plurality of scanning lines G and a plurality of signal lines S intersecting the scanning lines G. The plurality of scanning lines G extend in the first direction X and are arranged in the second direction Y. The plurality of signal lines S extend in the second direction Y and are arranged in the first direction X.
 隣り合う走査線Gと、隣り合う信号線Sとで区画された領域が、副画素SPに相当する。画素PXは、異なる色の複数の副画素SPを含む。例えば、画素PXは、赤色、緑色、青色の副画素SPによって構成することができる。画素PXは、白色の副画素SPなど、他の色の副画素SPを含んでもよい。本開示においては、副画素SPを単に画素と呼ぶことがある。 An area divided by the adjacent scanning line G and the adjacent signal line S corresponds to the sub-pixel SP. The pixel PX includes a plurality of sub-pixels SP of different colors. For example, the pixel PX can be configured by red, green, and blue sub-pixels SP. The pixels PX may include sub-pixels SP of other colors, such as white sub-pixels SP. In the present disclosure, the sub-pixel SP may be simply referred to as a pixel.
 第1基板SUB1は、各副画素SPに配置されたスイッチング素子SWおよび画素電極PEを備えている。さらに、第1基板SUB1は、各画素電極PEと対向する共通電極CEを備えている。共通電極CEは、第2基板SUB2に配置されてもよい。スイッチング素子SWは、走査線Gおよび信号線Sによって駆動される。画素電極PEは、スイッチング素子SWに接続されている。共通電極CEには共通電圧が印加される。 The first substrate SUB1 includes the switching element SW and the pixel electrode PE disposed in each sub-pixel SP. Further, the first substrate SUB1 includes a common electrode CE facing the respective pixel electrodes PE. The common electrode CE may be disposed on the second substrate SUB2. The switching element SW is driven by the scanning line G and the signal line S. The pixel electrode PE is connected to the switching element SW. A common voltage is applied to the common electrode CE.
 第1基板SUB1は、走査線ドライバGD1,GD2と、信号線ドライバSDとを備えている。走査線ドライバGD1,GD2は、複数の走査線Gに走査信号を供給する。信号線ドライバSDは、複数の信号線Sに映像信号を供給する。図1の例においては、走査線ドライバGD1,GD2に対して複数の走査線Gが交互に接続されている。他の例として、第1基板SUB1は、走査線ドライバGD1,GD2の一方のみを有し、当該一方に全ての走査線Gが接続されてもよい。 The first substrate SUB1 includes scanning line drivers GD1 and GD2 and a signal line driver SD. The scanning line drivers GD1 and GD2 supply scanning signals to the plurality of scanning lines G. The signal line driver SD supplies video signals to the plurality of signal lines S. In the example of FIG. 1, a plurality of scanning lines G are alternately connected to the scanning line drivers GD1 and GD2. As another example, the first substrate SUB1 may have only one of the scanning line drivers GD1 and GD2, and all the scanning lines G may be connected to the one.
 フレキシブル回路基板FPCは、端子Tに接続されている。コントローラCTは、フレキシブル回路基板FPCに実装されている。コントローラCTは、走査線ドライバGD1,GD2および信号線ドライバSDを制御する。コントローラCTは、例えば端子領域TAなど、フレキシブル回路基板FPCとは異なる位置に実装されてもよい。 The flexible circuit board FPC is connected to the terminal T. The controller CT is mounted on the flexible circuit board FPC. The controller CT controls the scanning line drivers GD1 and GD2 and the signal line driver SD. The controller CT may be mounted at a position different from the flexible printed circuit FPC, such as the terminal area TA, for example.
 第1基板SUB1は、第1辺E11と、第2辺E12と、第3辺E13と、第4辺E14とを有した矩形状である。第2基板SUB2は、第1辺E21と、第2辺E22と、第3辺E23と、第4辺E24とを有した矩形状である。各辺E11,E12,E21,E22は、第2方向Yと平行である。各辺E13,E14,E23,E24は、第1方向Xと平行である。第1辺E11,E21は、互いに重なっている。第2辺E12,E22は、互いに重なっている。第3辺E13,E23は、互いに重なっている。第4辺E14,E24は、端子領域TA側に位置し、互いにずれている。なお、第1基板SUB1および第2基板SUB2は、図示したような矩形状に限られない。 The first substrate SUB1 has a rectangular shape having a first side E11, a second side E12, a third side E13, and a fourth side E14. The second substrate SUB2 has a rectangular shape having a first side E21, a second side E22, a third side E23, and a fourth side E24. Each side E11, E12, E21, E22 is parallel to the second direction Y. Each side E13, E14, E23, E24 is parallel to the first direction X. The first sides E11 and E21 overlap each other. The second sides E12 and E22 overlap each other. The third sides E13 and E23 overlap each other. The fourth sides E14 and E24 are located on the terminal area TA side and are offset from each other. The first substrate SUB1 and the second substrate SUB2 are not limited to the rectangular shape as illustrated.
 図2は、表示パネルPNL1の第1方向Xに沿う断面の一例を示す図である。ここでは、1つの副画素SPに相当する表示領域DAの一部と、第1辺E11,E21側の周辺領域SAの一部とを示している。 FIG. 2 is a view showing an example of a cross section along the first direction X of the display panel PNL1. Here, a part of the display area DA corresponding to one sub-pixel SP and a part of the peripheral area SA on the side of the first side E11, E21 are shown.
 第1基板SUB1は、可撓性を有する第1樹脂基体10と、第1絶縁層13と、第2絶縁層14と、第3絶縁層15と、第4絶縁層16と、第1配向膜17と、画素電極PEと、共通電極CEと、信号線Sと、金属配線MLとを備えている。 The first substrate SUB1 includes a flexible first resin base 10, a first insulating layer 13, a second insulating layer 14, a third insulating layer 15, a fourth insulating layer 16, and a first alignment film. A pixel electrode PE, a common electrode CE, a signal line S, and a metal wiring ML are provided.
 第1樹脂基体10は、互いに平行な第1面10Aおよび第2面10Bを有している。第1絶縁層13は、第1面10Aを覆っている。第2絶縁層14は、第1絶縁層13を覆っている。信号線Sは、第2絶縁層14の上に配置されている。図1に示した走査線Gは、例えば第1絶縁層13と第2絶縁層14の間に配置される。第3絶縁層15は、信号線Sおよび第2絶縁層14を覆っている。共通電極CEは、第3絶縁層15の上に配置されている。金属配線MLは、共通電極CEの上に配置され、信号線Sと対向している。第4絶縁層16は、金属配線MLおよび共通電極CEを覆っている。画素電極PEは、第4絶縁層16の上に配置されている。第1配向膜17は、画素電極PEおよび第4絶縁層16を覆っている。 The first resin base 10 has a first surface 10A and a second surface 10B parallel to each other. The first insulating layer 13 covers the first surface 10A. The second insulating layer 14 covers the first insulating layer 13. The signal line S is disposed on the second insulating layer 14. The scanning line G shown in FIG. 1 is disposed, for example, between the first insulating layer 13 and the second insulating layer 14. The third insulating layer 15 covers the signal line S and the second insulating layer 14. The common electrode CE is disposed on the third insulating layer 15. The metal wiring ML is disposed on the common electrode CE and is opposed to the signal line S. The fourth insulating layer 16 covers the metal interconnect ML and the common electrode CE. The pixel electrode PE is disposed on the fourth insulating layer 16. The first alignment film 17 covers the pixel electrode PE and the fourth insulating layer 16.
 各絶縁層13,14,16は、例えば無機材料で形成されている。第3絶縁層15は、例えば有機材料で形成されている。共通電極CEおよび画素電極PEは、例えばインジウム・ティン・オキサイド(ITO)などの透明導電材料で形成されている。 Each insulating layer 13, 14, 16 is formed of, for example, an inorganic material. The third insulating layer 15 is formed of, for example, an organic material. The common electrode CE and the pixel electrode PE are formed of, for example, a transparent conductive material such as indium tin oxide (ITO).
 第1基板SUB1の構成は、図示した例に限られない。例えば、第1基板SUB1は、金属配線MLを備えなくてもよい。また、画素電極PEと共通電極CEの位置が入れ替わってもよいし、画素電極PEと共通電極CEが同じ層に配置されてもよい。共通電極CEは、第2基板SUB2に配置することもできる。 The configuration of the first substrate SUB1 is not limited to the illustrated example. For example, the first substrate SUB1 may not include the metal wiring ML. Further, the positions of the pixel electrode PE and the common electrode CE may be switched, or the pixel electrode PE and the common electrode CE may be disposed in the same layer. The common electrode CE can also be disposed on the second substrate SUB2.
 第2基板SUB2は、可撓性を有する第2樹脂基体20と、第5絶縁層23と、遮光層24と、カラーフィルタ25と、オーバーコート層26と、第2配向膜27とを備えている。 The second substrate SUB2 is provided with a flexible second resin base 20, a fifth insulating layer 23, a light shielding layer 24, a color filter 25, an overcoat layer 26, and a second alignment film 27. There is.
 第2樹脂基体20は、互いに平行な第1面20Aおよび第2面20Bを有している。第5絶縁層23は、例えば無機材料で形成され、第1面20Aを覆っている。遮光層24は、第5絶縁層23の下に配置されている。カラーフィルタ25は、遮光層24および第5絶縁層23を覆っている。オーバーコート層26は、カラーフィルタ25を覆っている。第2配向膜27は、オーバーコート層26を覆っている。 The second resin base 20 has a first surface 20A and a second surface 20B parallel to each other. The fifth insulating layer 23 is formed of, for example, an inorganic material, and covers the first surface 20A. The light shielding layer 24 is disposed below the fifth insulating layer 23. The color filter 25 covers the light shielding layer 24 and the fifth insulating layer 23. The overcoat layer 26 covers the color filter 25. The second alignment film 27 covers the overcoat layer 26.
 遮光層24は、表示領域DAにおいては信号線S、金属配線MLおよび走査線Gと重畳し、各副画素SPに対応する開口を有している。また、遮光層24は、周辺領域SAの全体に配置されている。 The light shielding layer 24 overlaps the signal line S, the metal wiring ML, and the scanning line G in the display area DA, and has an opening corresponding to each sub-pixel SP. In addition, the light shielding layer 24 is disposed in the entire peripheral area SA.
 第1基板SUB1と第2基板SUB2は、周辺領域SAに配置された枠状のシール材SLによって貼り合わされている。第1配向膜17、第2配向膜27およびシール材SLで囲われた空間には、液晶層LCが配置されている。 The first substrate SUB1 and the second substrate SUB2 are bonded together by a frame-shaped sealing material SL disposed in the peripheral area SA. A liquid crystal layer LC is disposed in a space surrounded by the first alignment film 17, the second alignment film 27, and the sealing material SL.
 第1樹脂基体10の第2面10Bには、第1偏光板PL1が貼り付けられている。第2樹脂基体20の第2面20Bには、第2偏光板PL2が貼り付けられている。表示パネルPNL1が透過型である場合には、第1偏光板PL1の下方にバックライトが配置される。表示パネルPNL1は、外光を利用して画像を表示する反射型であってもよいし、透過型と反射型の双方の機能を備えてもよい。 The first polarizing plate PL1 is attached to the second surface 10B of the first resin base 10. The second polarizing plate PL2 is attached to the second surface 20B of the second resin base 20. When the display panel PNL1 is transmissive, a backlight is disposed below the first polarizing plate PL1. The display panel PNL1 may be a reflective type that displays an image using external light, or may have both transmissive and reflective functions.
 各基板SUB1,SUB2の基体が可撓性を有する樹脂材料で形成されているために、表示パネルPNL1は、任意の形状に曲げることが可能である。例えば、図1に示した第4辺E14が第1偏光板PL1の下方に位置するように端子領域TAを曲げてもよい。また、他の辺を同様に曲げてもよい。 Since the substrates of the substrates SUB1 and SUB2 are formed of a flexible resin material, the display panel PNL1 can be bent into any shape. For example, the terminal area TA may be bent so that the fourth side E14 shown in FIG. 1 is located below the first polarizing plate PL1. Also, other sides may be bent in the same manner.
 第1樹脂基体10は、第1樹脂層11と、第2樹脂層12とを備えている。第1樹脂層11は、例えばポリイミドで形成されている。第2樹脂層12は、例えば第1樹脂層11と異なる種類のポリイミドで形成されている。第1樹脂層11のヤング率は、第2樹脂層12のヤング率よりも大きい。 The first resin base 10 includes a first resin layer 11 and a second resin layer 12. The first resin layer 11 is formed of, for example, polyimide. The second resin layer 12 is made of, for example, a different type of polyimide from the first resin layer 11. The Young's modulus of the first resin layer 11 is larger than the Young's modulus of the second resin layer 12.
 第1樹脂層11の第3方向Zにおける厚さT11は、第2樹脂層12の第3方向Zにおける厚さT12よりも小さい。例えば、厚さT11は、厚さT12の1/3以上であることが好ましく、2/3以上であれば一層好適である。 The thickness T11 of the first resin layer 11 in the third direction Z is smaller than the thickness T12 of the second resin layer 12 in the third direction Z. For example, the thickness T11 is preferably 1/3 or more of the thickness T12, and more preferably 2/3 or more.
 第1樹脂層11は図3を用いて後述するように線状であり、第2樹脂層12は第1樹脂基体10の全体にわたる板状である。第1樹脂基体10の第1面10Aは、第2樹脂層12の上面に相当する。第1樹脂基体10の第2面10Bは、第1樹脂層11および第2樹脂層12の下面によって構成されている。第1樹脂層11は、第1面10Aから第2面10Bにわたる形状を有してもよい。この場合には、第1面10Aが第1樹脂層11および第2樹脂層12の上面によって構成される。 The first resin layer 11 is linear as described later with reference to FIG. 3, and the second resin layer 12 is in the form of a plate covering the entire first resin base 10. The first surface 10A of the first resin base 10 corresponds to the upper surface of the second resin layer 12. The second surface 10 B of the first resin base 10 is constituted by the lower surfaces of the first resin layer 11 and the second resin layer 12. The first resin layer 11 may have a shape extending from the first surface 10A to the second surface 10B. In this case, the first surface 10A is formed by the upper surfaces of the first resin layer 11 and the second resin layer 12.
 図示した例において、第1樹脂層11は、周辺領域SAに配置された枠部分11aと、表示領域DAに配置された延在部分11yとを含む(平面形状は図3参照)。枠部分11aは、上面および表示領域DA側の側面が第2樹脂層12で覆われている。延在部分11yは、下面を除き、第2樹脂層12で覆われている。 In the illustrated example, the first resin layer 11 includes a frame portion 11a disposed in the peripheral area SA and an extended portion 11y disposed in the display area DA (see FIG. 3 for a planar shape). The upper surface and the side surface on the display area DA side of the frame portion 11 a are covered with the second resin layer 12. The extended portion 11 y is covered with the second resin layer 12 except for the lower surface.
 第2樹脂基体20は、第3樹脂層21と、第4樹脂層22とを備えている。第3樹脂層21および第4樹脂層22の材質および形状は、第1樹脂層11および第2樹脂層12と同様である。すなわち、第3樹脂層21と第4樹脂層22は例えば異なる種類のポリイミドで形成され、第3樹脂層21のヤング率は第4樹脂層22のヤング率よりも大きい。また、第3樹脂層21の厚さT21は第4樹脂層22の厚さT22よりも小さい。例えば、厚さT21は、厚さT22の1/3以上であることが好ましく、2/3以上であれば一層好適である。第2樹脂基体20の第1面20Aは、第4樹脂層22の下面に相当する。第2樹脂基体20の第2面20Bは、第3樹脂層21および第4樹脂層22の上面によって構成されている。 The second resin base 20 includes a third resin layer 21 and a fourth resin layer 22. The material and shape of the third resin layer 21 and the fourth resin layer 22 are the same as those of the first resin layer 11 and the second resin layer 12. That is, the third resin layer 21 and the fourth resin layer 22 are formed of, for example, different types of polyimide, and the Young's modulus of the third resin layer 21 is larger than the Young's modulus of the fourth resin layer 22. The thickness T21 of the third resin layer 21 is smaller than the thickness T22 of the fourth resin layer 22. For example, the thickness T21 is preferably 1/3 or more of the thickness T22, and more preferably 2/3 or more. The first surface 20A of the second resin base 20 corresponds to the lower surface of the fourth resin layer 22. The second surface 20 B of the second resin base 20 is constituted by the upper surfaces of the third resin layer 21 and the fourth resin layer 22.
 図示した例において、第3樹脂層21は、周辺領域SAに配置された枠部分21aと、表示領域DAに配置された延在部分21yとを含む(平面形状は図3参照)。枠部分21aは、下面および表示領域DA側の側面が第4樹脂層22で覆われている。延在部分21yは、上面を除き、第4樹脂層22で覆われている。 In the illustrated example, the third resin layer 21 includes a frame portion 21a disposed in the peripheral area SA and an extended portion 21y disposed in the display area DA (see FIG. 3 for a plan view). The lower surface and the side surface on the display area DA side of the frame portion 21 a are covered with the fourth resin layer 22. The extended portion 21 y is covered with the fourth resin layer 22 except for the upper surface.
 第1樹脂層11と第3樹脂層21は、互いに対向している。ただし、第1樹脂層11と第3樹脂層21が少なくとも一部において対向しなくてもよい。 The first resin layer 11 and the third resin layer 21 face each other. However, the first resin layer 11 and the third resin layer 21 may not be opposed at least in part.
 図3は、第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。第1樹脂層11は、枠部分11aと、第1方向Xに延びる延在部分11xと、第2方向Yに延びる延在部分11yとを有している。第3樹脂層21は、枠部分21aと、第1方向Xに延びる延在部分21xと、第2方向Yに延びる延在部分21yとを有している。なお、図示した延在部分11x,11y,21x,21yの数は一例であり、より多くても少なくてもよい。枠部分11a,21aは、第1枠部分の一例である。 FIG. 3 is a schematic plan view of the display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21. As shown in FIG. The first resin layer 11 has a frame portion 11 a, an extension portion 11 x extending in the first direction X, and an extension portion 11 y extending in the second direction Y. The third resin layer 21 has a frame portion 21 a, an extension portion 21 x extending in the first direction X, and an extension portion 21 y extending in the second direction Y. Note that the number of the extended portions 11x, 11y, 21x, 21y illustrated is an example, and may be more or less. The frame portions 11a and 21a are an example of a first frame portion.
 枠部分11aは、第1樹脂基体10の縁(各辺E11~E14)に沿って枠状に設けられている。同様に、枠部分21aは、第2樹脂基体20の縁(各辺E21~E24)に沿って枠状に設けられている。枠部分21aの各辺E21~E23に沿う領域は、枠部分11aと平面視において重畳している。したがって、図3においては、枠部分21aによって枠部分11aの一部が隠されている。 The frame portion 11a is provided in a frame shape along the edge (each side E11 to E14) of the first resin base body 10. Similarly, the frame portion 21a is provided in a frame shape along the edge (each side E21 to E24) of the second resin base 20. Regions along the sides E21 to E23 of the frame portion 21a overlap the frame portion 11a in plan view. Therefore, in FIG. 3, a part of the frame portion 11a is hidden by the frame portion 21a.
 各延在部分11xは、両端がそれぞれ枠部分11aに接続されている。同様に、各延在部分21xは、両端がそれぞれ枠部分21aに接続されている。表示領域DAを横切る延在部分21xは、延在部分11xと平面視において重畳している。また、第4辺E24に沿う枠部分21aの下方にも延在部分11xが配置されている。したがって、図3においては、延在部分21xまたは枠部分21aによって延在部分11xが隠されている。 Each extending portion 11x is connected to the frame portion 11a at both ends. Similarly, each extension portion 21x is connected to the frame portion 21a at both ends. The extending portion 21x crossing the display area DA overlaps the extending portion 11x in a plan view. In addition, the extended portion 11x is disposed below the frame portion 21a along the fourth side E24. Therefore, in FIG. 3, the extending portion 11x is hidden by the extending portion 21x or the frame portion 21a.
 各延在部分11yは、両端がそれぞれ枠部分11aに接続されている。同様に、各延在部分21yは、両端がそれぞれ枠部分21aに接続されている。延在部分21yは、延在部分11yと平面視において重畳している。したがって、図3においては、延在部分21yによって延在部分11yの一部が隠されている。なお、延在部分11yは、端子領域TAに配置されなくてもよい。 Each extension portion 11y is connected to the frame portion 11a at both ends. Similarly, both ends of each extension portion 21y are connected to the frame portion 21a. The extending portion 21 y overlaps with the extending portion 11 y in plan view. Therefore, in FIG. 3, a part of the extension 11y is hidden by the extension 21y. The extended portion 11y may not be disposed in the terminal area TA.
 枠部分11aおよび延在部分11x,11yは、例えば全体として第1方向Xおよび第2方向Yにおけるピッチが一定の格子状である。ただし、第1方向Xおよび第2方向Yにおけるピッチの少なくとも一方が一定でなくてもよい。枠部分21aおよび延在部分21x,21yも同様に、例えば全体として第1方向Xおよび第2方向Yにおけるピッチが一定の格子状であるが、これらのピッチの少なくとも一方が一定でなくてもよい。 The frame portion 11a and the extension portions 11x and 11y have, for example, a lattice shape in which the pitch in the first direction X and the second direction Y is constant as a whole. However, at least one of the pitches in the first direction X and the second direction Y may not be constant. Similarly, the frame portion 21a and the extension portions 21x and 21y are also in the form of a lattice having a constant pitch in the first direction X and the second direction Y as a whole, for example. .
 図4は、延在部分11x,11yの交点近傍を概略的に示す平面図である。ここでは、走査線G、信号線S、遮光層24および延在部分11x,11yを示し、他の要素の図示を両略している。 FIG. 4 is a plan view schematically showing the vicinity of the intersection of the extension portions 11x and 11y. Here, the scanning line G, the signal line S, the light shielding layer 24, and the extending portions 11x and 11y are shown, and illustration of other elements is omitted.
 延在部分11xは、走査線Gと重畳している。延在部分11yは、信号線Sと重畳している。さらに、走査線G、信号線Sおよび延在部分11x,11yは、いずれも遮光層24と重畳している。延在部分11x,11yは、走査線Gおよび信号線Sが交差する位置において、互いに接続されている。延在部分21x,21yと、走査線G、信号線Sおよび遮光層24との関係も、図示した例と同様である。なお、枠部分11a,21aは、周辺領域SAに配置された遮光層24と重畳している(図2参照)。 The extended portion 11x overlaps the scanning line G. The extended portion 11 y overlaps the signal line S. Furthermore, the scanning line G, the signal line S, and the extended portions 11x and 11y all overlap the light shielding layer 24. The extension portions 11x and 11y are connected to each other at a position where the scanning line G and the signal line S intersect. The relationship between the extended portions 21 x and 21 y, the scanning line G, the signal line S, and the light shielding layer 24 is also the same as in the illustrated example. The frame portions 11a and 21a overlap the light shielding layer 24 disposed in the peripheral area SA (see FIG. 2).
 続いて、表示パネルPNL1の製造工程の一例について説明する。先ず、マザーガラスの上に複数の第1基板SUB1が形成される。同様に、他のマザーガラスの上に複数の第2基板SUB2が形成される。 Subsequently, an example of a manufacturing process of the display panel PNL1 will be described. First, a plurality of first substrates SUB1 are formed on a mother glass. Similarly, a plurality of second substrates SUB2 are formed on another mother glass.
 図5は、複数の第1基板SUB1が形成されたマザーガラスMGの概略的な平面図である。このマザーガラスMGは、後の製造工程において、第1基板SUB1の形状のカットラインCLに沿って切断される。 FIG. 5 is a schematic plan view of a mother glass MG on which a plurality of first substrates SUB1 are formed. The mother glass MG is cut along a cut line CL in the shape of the first substrate SUB1 in a later manufacturing process.
 第1樹脂基体10は、マザーガラスMGの略全体に形成されている。第1樹脂層11は、第1樹脂基体10の全体にわたって格子状に形成されている。カットラインCLは、第1樹脂層11と重畳している。 The first resin base 10 is formed on substantially the entire mother glass MG. The first resin layer 11 is formed in a lattice shape over the entire first resin base 10. The cut line CL overlaps the first resin layer 11.
 第1樹脂層11は、例えば感光性のポリイミドにより形成することができる。この場合、第1樹脂層11の元となる材料をマザーガラスMGの略全体に塗布し、これを露光および現像して第1樹脂層11の形状にパターニングする。第1樹脂層11は、非感光性のポリイミドにより形成することもできる。この場合には、先ず第1樹脂層11の元となる材料をマザーガラスMGの略全体に塗布し、これを加熱により硬化させてポリイミド層を形成する。次いで感光性のレジストをポリイミド層の上方に形成し、これを露光および現像して第1樹脂層11の形状に開口させる。その後、レジストの開口を通じたエッチングにより、ポリイミド層を第1樹脂層11の形状にパターニングする。 The first resin layer 11 can be formed of, for example, photosensitive polyimide. In this case, the material that is the source of the first resin layer 11 is applied to substantially the entire mother glass MG, and this is exposed and developed to be patterned into the shape of the first resin layer 11. The first resin layer 11 can also be formed of non-photosensitive polyimide. In this case, first, the material that is the source of the first resin layer 11 is applied to substantially the entire mother glass MG, and this is cured by heating to form a polyimide layer. Next, a photosensitive resist is formed on the polyimide layer, exposed and developed to open it in the shape of the first resin layer 11. Thereafter, the polyimide layer is patterned in the shape of the first resin layer 11 by etching through the openings of the resist.
 このように第1樹脂層11を形成した後、第1樹脂層11の上から第2樹脂層12の元となる材料を塗布し、これを加熱により硬化させることで、第2樹脂層12を形成する。これにより、図2に示したような第1樹脂基体10を得ることができる。 
 第2基板SUB2も、以上の第1基板SUB1と同様の方法により形成することができる。
After the first resin layer 11 is formed in this manner, a material that is the source of the second resin layer 12 is applied from above the first resin layer 11 and the second resin layer 12 is cured by curing the same by heating. Form. Thereby, the first resin base 10 as shown in FIG. 2 can be obtained.
The second substrate SUB2 can also be formed by the same method as the above-described first substrate SUB1.
 各基板SUB1,SUB2がそれぞれ形成された2つのマザーガラスMGは、上述のシール材SLを介して貼り合わされる。例えばシール材SLの内側に液晶材料を滴下し、真空雰囲気中で2つのマザーガラスMGを貼り合わせることで、上述の液晶層LCを形成することができる。その後、カットラインCLに沿って2つのマザーガラスMGを切断することにより、個々の表示パネルPNL1が切り出される。 The two mother glasses MG on which the substrates SUB1 and SUB2 are respectively formed are bonded to each other via the above-described seal material SL. For example, the liquid crystal layer LC can be formed by dropping a liquid crystal material inside the sealing material SL and bonding two mother glasses MG in a vacuum atmosphere. Thereafter, by cutting the two mother glasses MG along the cut line CL, the individual display panels PNL1 are cut out.
 図6、図7、図8および図9は、マザーガラスMGから切り出された表示パネルPNL1のその後の製造工程を順に示す概略的な断面図である。各図においては、表示パネルPNL1の要素として第1樹脂基体10、第2樹脂基体20、シール材SLおよび液晶層LCのみを示し、他の要素を省略している。 FIG. 6, FIG. 7, FIG. 8 and FIG. 9 are schematic cross sectional views sequentially showing the subsequent manufacturing steps of the display panel PNL1 cut out from the mother glass MG. In each of the drawings, only the first resin base 10, the second resin base 20, the sealing material SL and the liquid crystal layer LC are shown as elements of the display panel PNL1, and the other elements are omitted.
 図6においては、第1樹脂基体10の第2面10BにマザーガラスMGから切り出されたガラス基板GS1が貼り付いている。また、第2樹脂基体20の第2面20BにマザーガラスMGから切り出されたガラス基板GS2が貼り付いている。この状態で、レーザ・リフト・オフ(LLO)によりガラス基板GS2を取り除く。具体的には、レーザ光源LSからのレーザ光をガラス基板GS2側から照射し、ガラス基板GS2と第2樹脂基体20の界面を剥離させる。このレーザ光としては、例えば紫外域のエキシマレーザやYAGレーザを用いることができる。 In FIG. 6, the glass substrate GS1 cut out from the mother glass MG is attached to the second surface 10B of the first resin base 10. Further, the glass substrate GS2 cut out from the mother glass MG is attached to the second surface 20B of the second resin base 20. In this state, the glass substrate GS2 is removed by laser lift off (LLO). Specifically, laser light from the laser light source LS is irradiated from the side of the glass substrate GS2, and the interface between the glass substrate GS2 and the second resin base 20 is peeled off. As this laser beam, for example, an excimer laser or YAG laser in the ultraviolet region can be used.
 ガラス基板GS2を取り除いた後、図7に示すように、第2基板SUB2の一部を切断する。これにより、第1基板SUB1に端子領域TAが形成される。 After removing the glass substrate GS2, as shown in FIG. 7, a part of the second substrate SUB2 is cut. Thus, the terminal area TA is formed on the first substrate SUB1.
 端子領域TAを形成した後、図8に示すように、第2樹脂基体20の第2面20Bに第2偏光板PL2を貼り付ける。さらに、ガラス基板GS2と同様に、レーザ光源LSを用いたLLOによりガラス基板GS1を取り除く。 After the terminal area TA is formed, as shown in FIG. 8, the second polarizing plate PL2 is attached to the second surface 20B of the second resin base 20. Furthermore, similarly to the glass substrate GS2, the glass substrate GS1 is removed by LLO using the laser light source LS.
 ガラス基板GS1を取り除いた後、図9に示すように、第1樹脂基体10の第2面10Bに第1偏光板PL1を貼り付ける。以上で表示パネルPNL1が完成する。 After removing the glass substrate GS1, as shown in FIG. 9, the first polarizing plate PL1 is attached to the second surface 10B of the first resin base 10. Thus, the display panel PNL1 is completed.
 第1樹脂基体10が一様なポリイミド膜である場合、第1樹脂基体10とガラス基板GS1とを剥離すると、第1樹脂基体10がガラス基板GS1により支持されなくなるので、第1樹脂基体10が伸縮することがある。同様に、第2樹脂基体20が一様なポリイミド膜である場合、第2樹脂基体20とガラス基板GS2とを剥離すると、第2樹脂基体20が伸縮することがある。 When the first resin substrate 10 is a uniform polyimide film, when the first resin substrate 10 and the glass substrate GS1 are peeled off, the first resin substrate 10 is not supported by the glass substrate GS1, so the first resin substrate 10 is May stretch. Similarly, when the second resin base 20 is a uniform polyimide film, when the second resin base 20 and the glass substrate GS2 are peeled off, the second resin base 20 may expand and contract.
 これらの伸縮が生じると、表示領域DAに歪みが生じて、表示品位に悪影響を与え得る。また、端子Tにピッチずれが生じて、フレキシブル回路基板FPCとの接続に不具合が生じ得る。さらに、第1樹脂基体10と第2樹脂基体20で伸縮の態様が異なれば、第1基板SUB1の走査線G、信号線Sおよび画素電極PEと、第2基板SUB2の遮光層24およびカラーフィルタ25とがずれる可能性がある。このようなずれが生じると、隣接する副画素SPの間で混色が生じ得る。 When these expansions and contractions occur, distortion occurs in the display area DA, which may adversely affect the display quality. Moreover, a pitch shift may occur in the terminals T, which may cause a failure in connection with the flexible circuit board FPC. Furthermore, if the first resin base 10 and the second resin base 20 have different expansion and contraction modes, the scanning line G, the signal line S and the pixel electrode PE of the first substrate SUB1, the light shielding layer 24 of the second substrate SUB2 and the color filter There is a possibility that 25 may be shifted. When such a shift occurs, color mixing may occur between adjacent sub-pixels SP.
 これに対し、本実施形態においては、第1樹脂基体10が線状の第1樹脂層11を備えている。第1樹脂層11のヤング率は第2樹脂層12のヤング率よりも大きいので、第1樹脂層11は第2樹脂層12に比べ、ガラス基板GS1を剥離した際に伸縮しにくい。したがって、第1樹脂基体10の伸縮を抑制できる。 On the other hand, in the present embodiment, the first resin base 10 is provided with the linear first resin layer 11. Since the Young's modulus of the first resin layer 11 is larger than the Young's modulus of the second resin layer 12, the first resin layer 11 is less likely to expand and contract when the glass substrate GS1 is peeled off, as compared to the second resin layer 12. Therefore, expansion and contraction of the first resin base 10 can be suppressed.
 図3に示すように第1樹脂層11を格子状に形成した場合、第2樹脂層12が伸縮してもその影響は格子内にとどまる。したがって、第1樹脂基体10の全体的な変形量は小さくなる。 When the first resin layer 11 is formed in a lattice as shown in FIG. 3, the influence of the expansion and contraction of the second resin layer 12 remains in the lattice. Therefore, the overall deformation of the first resin base 10 is reduced.
 図3に示すように第1基板SUB1の縁に沿って枠部分11aを配置したことで、第1基板SUB1の外形を安定させることができる。さらに、表示領域DAに延在部分11x,11yを配置したことで、表示領域DAにおける副画素SPのずれを抑制することができる。 By arranging the frame portion 11a along the edge of the first substrate SUB1 as shown in FIG. 3, the outer shape of the first substrate SUB1 can be stabilized. Furthermore, by disposing the extension portions 11x and 11y in the display area DA, it is possible to suppress the displacement of the sub-pixel SP in the display area DA.
 第1樹脂層11は、ヤング率が第2樹脂層12より大きいため、第2樹脂層12より透過率が劣る可能性がある。しかしながら、延在部分11x,11yはそれぞれ走査線G、信号線Sおよび遮光層24と重畳しているために、表示領域DAの透過率にほとんど影響を与えない。 Since the first resin layer 11 has a Young's modulus greater than that of the second resin layer 12, the transmittance may be inferior to that of the second resin layer 12. However, since the extension portions 11x and 11y overlap with the scanning line G, the signal line S, and the light shielding layer 24, respectively, the transmittance of the display area DA is hardly affected.
 上述のように第1樹脂層11の厚さT11を第2樹脂層12の厚さT12の1/3以上とすれば、第1樹脂基体10の伸縮を抑制する良好な効果を得ることができる。厚さT11を厚さT12の2/3以上とすれば、当該効果をより高めることができる。 If the thickness T11 of the first resin layer 11 is set to 1/3 or more of the thickness T12 of the second resin layer 12 as described above, a favorable effect of suppressing the expansion and contraction of the first resin substrate 10 can be obtained. . If the thickness T11 is 2/3 or more of the thickness T12, the effect can be further enhanced.
 以上、第1樹脂基体10について述べた効果は、第2樹脂基体20においても同様に得ることができる。第1樹脂基体10と第2樹脂基体20の双方において伸縮が抑制されることにより、第1基板SUB1の各要素と第2基板SUB2の各要素のずれが抑制され、隣接する副画素SPの混色を防止できる。 The effects described above for the first resin base 10 can be obtained similarly for the second resin base 20 as well. By suppressing the expansion and contraction in both the first resin base 10 and the second resin base 20, the deviation between each element of the first substrate SUB1 and each element of the second substrate SUB2 is suppressed, and color mixing of adjacent subpixels SP Can be prevented.
 なお、図6ないし図9においては、貼り合わされた2つのマザーガラスMGから表示パネルPNL1を切り出した後に、マザーガラスMGの一部であったガラス基板GS1,GS2を取り除く製造方法を例示した。他の例として、表示パネルPNL1を切り出す前に、上述のLLOにより第1樹脂基体10および第2樹脂基体20をそれぞれマザーガラスMGから剥離してもよい。 6 to 9 illustrate the manufacturing method of removing the glass substrates GS1 and GS2 which were a part of the mother glass MG after the display panel PNL1 is cut out from the two mother glasses MG bonded to each other. As another example, before cutting out the display panel PNL1, the first resin base 10 and the second resin base 20 may be peeled off from the mother glass MG by the above-described LLO.
 この製造方法においては、仮に第1樹脂基体10が一様なポリイミド膜である場合、マザーガラスMGを取り除いた際に第1樹脂基体10が伸縮し、カットラインCLが本来の位置からずれる可能性がある。これに対し、本実施形態の構成においては第1樹脂層11により第1樹脂基体10の伸縮が抑制されるので、カットラインCLのずれを抑制できる。第2樹脂基体20についても同様である。 In this manufacturing method, if the first resin substrate 10 is a uniform polyimide film, the first resin substrate 10 may expand and contract when the mother glass MG is removed, and the cut line CL may deviate from the original position. There is. On the other hand, in the configuration of the present embodiment, since the first resin layer 11 suppresses the expansion and contraction of the first resin base 10, the shift of the cut line CL can be suppressed. The same applies to the second resin base 20.
 なお、本実施形態においては、第1樹脂基体10が第1樹脂層11と第2樹脂層12の2層構造であり、第2樹脂基体20が第3樹脂層21と第4樹脂層22の2層構造である例を開示した。しかしながら、第1樹脂基体10が2層構造であり、第2樹脂基体20が一様な基体であってもよい。また、第1樹脂基体10が一様な基体であり、第2樹脂基体20が2層構造であってもよい。 In the present embodiment, the first resin substrate 10 has a two-layer structure of the first resin layer 11 and the second resin layer 12, and the second resin substrate 20 has the third resin layer 21 and the fourth resin layer 22. An example has been disclosed that is a two-layer structure. However, the first resin base 10 may have a two-layer structure, and the second resin base 20 may be a uniform base. In addition, the first resin base 10 may be a uniform base, and the second resin base 20 may have a two-layer structure.
 第1樹脂層11および第3樹脂層21の平面形状は、図3に示したものに限られない。以下の第2ないし第7実施形態においては、第1樹脂層11および第3樹脂層21に適用し得る他の形状を示す。各実施形態にて開示する第1樹脂層11および第3樹脂層21の平面形状は、適宜に組み合わせることができる。 The planar shapes of the first resin layer 11 and the third resin layer 21 are not limited to those shown in FIG. In the following second to seventh embodiments, other shapes applicable to the first resin layer 11 and the third resin layer 21 are shown. The planar shapes of the first resin layer 11 and the third resin layer 21 disclosed in each embodiment can be combined as appropriate.
 [第2実施形態] 
 図10は、第2実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図3の例と同じく、第1樹脂層11は枠部分11aを有し、第3樹脂層21は枠部分21aを有している。
Second Embodiment
FIG. 10 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the second embodiment. As in the example of FIG. 3, the first resin layer 11 has a frame portion 11a, and the third resin layer 21 has a frame portion 21a.
 第1樹脂層11は、端子領域TAにおいて、第1方向Xに延びるとともに第2方向Yに一定の間隔で並ぶ複数の延在部分11xを有している。各延在部分11xは、両端がそれぞれ枠部分11aに接続されている。 The first resin layer 11 has, in the terminal area TA, a plurality of extending portions 11 x which extend in the first direction X and are arranged at regular intervals in the second direction Y. Each extending portion 11x is connected to the frame portion 11a at both ends.
 本実施形態のように、端子領域TAにおいて第1方向X、すなわち表示領域DAから端子Tに向かう方向と交差する方向に第1樹脂層11が延在する構成であれば、第4辺E11が表示パネルPNL1の裏面側に位置するように端子領域TAを曲げやすくなる。 As in the present embodiment, in the configuration in which the first resin layer 11 extends in the first direction X in the terminal area TA, that is, in the direction intersecting the direction from the display area DA to the terminal T, the fourth side E11 is The terminal area TA can be easily bent so as to be located on the back side of the display panel PNL1.
 [第3実施形態] 
 図11は、第3実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図10の例と同じく、第1樹脂層11は枠部分11aおよび端子領域TAにおける延在部分11xを有し、第3樹脂層21は枠部分21aを有している。
Third Embodiment
FIG. 11 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the third embodiment. As in the example of FIG. 10, the first resin layer 11 has a frame portion 11a and an extended portion 11x in the terminal area TA, and the third resin layer 21 has a frame portion 21a.
 さらに、第1樹脂層11は、表示領域DAの縁に沿う枠部分11bを有している。また、第3樹脂層21は、表示領域DAの縁に沿う枠部分21bを有している。枠部分11bと枠部分21bは、平面視において重畳している。したがって、図11においては、枠部分21bによって枠部分11bが隠されている。枠部分11b,21bは、第2枠部分の一例である。 Furthermore, the first resin layer 11 has a frame portion 11b along the edge of the display area DA. In addition, the third resin layer 21 has a frame portion 21b along the edge of the display area DA. The frame portion 11 b and the frame portion 21 b overlap in a plan view. Therefore, in FIG. 11, the frame portion 11b is hidden by the frame portion 21b. The frame portions 11 b and 21 b are an example of a second frame portion.
 本実施形態のように枠部分11b,21bを設ければ、周辺領域SAにおける第1樹脂基体10および第2樹脂基体20の伸縮が表示領域DAに影響しにくくなる。 If the frame portions 11 b and 21 b are provided as in the present embodiment, the expansion and contraction of the first resin base 10 and the second resin base 20 in the peripheral area SA hardly affect the display area DA.
 [第4実施形態] 
 図12は、第4実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図11の例と同じく、第1樹脂層11は枠部分11a,11bおよび端子領域TAにおける延在部分11xを有し、第3樹脂層21は枠部分21a,21bを有している。
Fourth Embodiment
FIG. 12 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the fourth embodiment. As in the example of FIG. 11, the first resin layer 11 has frame portions 11a and 11b and an extension portion 11x in the terminal area TA, and the third resin layer 21 has frame portions 21a and 21b.
 第1樹脂層11は、表示領域DAにおいて、第1方向Xに延びる延在部分11xと、第2方向Yに延びる延在部分11yとを有している。第3樹脂層21は、表示領域DAにおいて、第1方向Xに延びる延在部分21xと、第2方向Yに延びる延在部分21yとを有している。 The first resin layer 11 has, in the display area DA, an extension portion 11 x extending in the first direction X and an extension portion 11 y extending in the second direction Y. The third resin layer 21 has an extended portion 21 x extending in the first direction X and an extended portion 21 y extending in the second direction Y in the display area DA.
 表示領域DAにおいて、延在部分11x,11yは、いずれも両端が枠部分11bに接続されている。延在部分21x,21yは、いずれも両端が枠部分21bに接続されている。延在部分21xは、延在部分11xと平面視において重畳している。延在部分21yは、延在部分11yと平面視において重畳している。したがって、図12においては、延在部分21x,21yによって延在部分11x,11yが隠されている。 In the display area DA, both ends of the extension portions 11x and 11y are connected to the frame portion 11b. Both ends of the extension portions 21x and 21y are connected to the frame portion 21b. The extending portion 21x overlaps with the extending portion 11x in a plan view. The extending portion 21 y overlaps with the extending portion 11 y in plan view. Therefore, in FIG. 12, the extended portions 11x and 11y are hidden by the extended portions 21x and 21y.
 本実施形態のように、延在部分11x,11y,21x,21yにより表示領域DAを複数の領域に区画すれば、第2樹脂層12および第4樹脂層22の伸縮の影響が各領域内にとどまる。したがって、ガラス基板の剥離前後で、表示領域DAにおける第1樹脂基体10および第2樹脂基体20の全体的な変形量は小さくなる。 If the display area DA is divided into a plurality of areas by the extended portions 11x, 11y, 21x, 21y as in the present embodiment, the influence of the expansion and contraction of the second resin layer 12 and the fourth resin layer 22 is within each area. Stay. Therefore, before and after peeling of the glass substrate, the overall deformation amount of the first resin base 10 and the second resin base 20 in the display area DA is reduced.
 [第5実施形態] 
 図13は、第5実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図12の例と同じく、第1樹脂層11は枠部分11a,11bおよび延在部分11x,11yを有し、第3樹脂層21は枠部分21a,21bおよび延在部分21x,21yを有している。
Fifth Embodiment
FIG. 13 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the fifth embodiment. As in the example of FIG. 12, the first resin layer 11 has frame portions 11a and 11b and extension portions 11x and 11y, and the third resin layer 21 has frame portions 21a and 21b and extension portions 21x and 21y. ing.
 さらに、第1樹脂層11は、表示領域DAにおいて、第1方向Xおよび第2方向Yと交差する方向に延びる延在部分11p,11qを有している。また、第3樹脂層21は、表示領域DAにおいて、第1方向Xおよび第2方向Yと交差する方向に延びる延在部分21p,21qを有している。 Furthermore, the first resin layer 11 has extended portions 11p and 11q extending in a direction intersecting the first direction X and the second direction Y in the display area DA. In addition, the third resin layer 21 has extended portions 21p and 21q extending in a direction intersecting the first direction X and the second direction Y in the display area DA.
 延在部分11p,11qは、例えば図示したように、延在部分11x,11yおよび枠部分11bで区画された領域の対角方向にそれぞれ延びている。延在部分21p,21qも同様である。延在部分21p,21qは、それぞれ延在部分11p,11qと平面視において重畳している。したがって、図13においては、延在部分21p,21qによって延在部分11p,11qが隠されている。 For example, as illustrated, the extension parts 11p and 11q extend in the diagonal direction of the area divided by the extension parts 11x and 11y and the frame part 11b. The same applies to the extended portions 21p and 21q. The extended portions 21p and 21q overlap with the extended portions 11p and 11q in plan view, respectively. Therefore, in FIG. 13, the extension portions 11 p and 11 q are hidden by the extension portions 21 p and 21 q.
 本実施形態のように延在部分11p,11q,21p,21qを設ければ、多方向における第1樹脂基体10および第2樹脂基体20の伸縮を効果的に抑制することができる。 By providing the extending portions 11p, 11q, 21p, 21q as in the present embodiment, expansion and contraction of the first resin base 10 and the second resin base 20 in multiple directions can be effectively suppressed.
 [第6実施形態] 
 図14は、第6実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図12の例と同じく、第1樹脂層11は枠部分11a,11bおよび延在部分11x,11yを有し、第3樹脂層21は枠部分21a,21bおよび延在部分21x,21yを有している。
Sixth Embodiment
FIG. 14 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the sixth embodiment. As in the example of FIG. 12, the first resin layer 11 has frame portions 11a and 11b and extension portions 11x and 11y, and the third resin layer 21 has frame portions 21a and 21b and extension portions 21x and 21y. ing.
 図14の例では、表示領域DAにおいて、延在部分11x,21xが第2方向Yに並ぶ副画素SPの間にそれぞれ配置され、延在部分11y,21yが第1方向Xに並ぶ副画素SPの間にそれぞれ配置されている。これにより、副画素SPが延在部分11x,11y,21x,21yによって格子状に区画されている。図4に示したように、延在部分11x,21xは走査線Gおよび遮光層24と重畳し、延在部分11y,21yは信号線Sおよび遮光層24と重畳している。 In the example of FIG. 14, in the display area DA, the extension portions 11 x and 21 x are respectively disposed between the sub-pixels SP in the second direction Y, and the extension portions 11 y and 21 y are in the first direction X. Are respectively disposed between. Thereby, the sub-pixels SP are partitioned in a grid shape by the extension portions 11x, 11y, 21x, 21y. As shown in FIG. 4, the extended portions 11x and 21x overlap the scanning line G and the light shielding layer 24, and the extended portions 11y and 21y overlap the signal line S and the light shielding layer 24.
 本実施形態のように高密度で延在部分11x,11y,21x,21yを設ければ、第1樹脂基体10および第2樹脂基体20の伸縮を極めて良好に抑制することができる。 If the extending portions 11x, 11y, 21x, 21y are provided at high density as in the present embodiment, expansion and contraction of the first resin base 10 and the second resin base 20 can be extremely well suppressed.
 なお、延在部分11x,11y,21x,21yは、例えば複数の副画素SPで構成される画素PXごとに領域を区画するものであってもよい。その他にも、延在部分11x,11y,21x,21yで区画する領域の大きさは、適宜に定めることができる。 The extension portions 11x, 11y, 21x, and 21y may divide an area for each pixel PX configured by a plurality of sub-pixels SP, for example. In addition, the size of the area divided by the extended portions 11x, 11y, 21x, 21y can be appropriately determined.
 [第7実施形態] 
 図15は、第7実施形態に係る第1樹脂層11および第3樹脂層21の形状を表す表示パネルPNL1の概略的な平面図である。図3の例と同じく第1樹脂層11および第3樹脂層21は格子状であるが、格子の交点に相当する部分に隙間が設けられている。
Seventh Embodiment
FIG. 15 is a schematic plan view of a display panel PNL1 showing the shapes of the first resin layer 11 and the third resin layer 21 according to the seventh embodiment. The first resin layer 11 and the third resin layer 21 are lattice-like as in the example of FIG. 3, but gaps are provided in portions corresponding to the intersections of the lattices.
 具体的には、枠部分11aは各辺E11~E14に沿って断続的に配置され、枠部分21aは各辺E21~E24に沿って断続的に配置されている。各延在部分11x,21xは第1方向Xに沿って断続的に配置され、各延在部分11y,21yは第2方向Yに沿って断続的に配置されている。 Specifically, the frame portion 11a is disposed intermittently along the sides E11 to E14, and the frame portion 21a is disposed intermittently along the sides E21 to E24. The extension portions 11x and 21x are intermittently disposed along the first direction X, and the extension portions 11y and 21y are disposed intermittently along the second direction Y.
 他の観点からいうと、延在部分11xと延在部分11yは、格子の交点に相当する位置において、互いに離間している。枠部分11aと延在部分11x、枠部分11aと延在部分11y、延在部分21xと延在部分21y、枠部分21aと延在部分21x、枠部分21aと延在部分21yについても同様に、格子の交点に相当する位置において、互いに離間している。 From another point of view, the extension 11x and the extension 11y are separated from each other at a position corresponding to the intersection of the grids. Similarly, the frame portion 11a and the extension portion 11x, the frame portion 11a and the extension portion 11y, the extension portion 21x and the extension portion 21y, the frame portion 21a and the extension portion 21x, and the frame portion 21a and the extension portion 21y They are spaced apart from one another at positions corresponding to the intersections of the grids.
 図3に示すように第1樹脂層11および第3樹脂層21を格子状に形成した場合、表示パネルPNL1の製造時において第2樹脂層12および第4樹脂層22の元となる硬化前の材料を塗布した際に、当該材料が均一に広がらない可能性がある。また、第1樹脂層11および第3樹脂層21がそれぞれ第1樹脂基体10および第2樹脂基体20の全長にわたって連続しているため、これら樹脂層11,21の伸縮量も大きくなる。 As shown in FIG. 3, when the first resin layer 11 and the third resin layer 21 are formed in a lattice, before the curing of the second resin layer 12 and the fourth resin layer 22 when the display panel PNL 1 is manufactured. When the material is applied, the material may not spread uniformly. Further, since the first resin layer 11 and the third resin layer 21 are continuous over the entire length of the first resin base 10 and the second resin base 20, the amount of expansion and contraction of the resin layers 11 and 21 is also increased.
 これに対し、本実施形態の構成であれば、第2樹脂層12および第4樹脂層22の元となる硬化前の材料が、それぞれ第1樹脂層11および第3樹脂層21の格子の交点に相当する位置の隙間を通じて均一に広がる。また、第1樹脂層11および第3樹脂層21が細分化されているので、これら樹脂層11,21の伸縮も局所的な範囲内に収めることができ、結果として全体的な伸縮量を低減できる。 On the other hand, in the case of the configuration of the present embodiment, the material before curing which is the source of the second resin layer 12 and the fourth resin layer 22 is the intersection point of the lattice of the first resin layer 11 and the third resin layer 21 It spreads uniformly through the gap of the position equivalent to. In addition, since the first resin layer 11 and the third resin layer 21 are subdivided, the expansion and contraction of the resin layers 11 and 21 can be also within a local range, and as a result, the overall amount of expansion and contraction is reduced. it can.
 なお、本実施形態では、図3に示す平面形状の第1樹脂層11の各交点に相当する位置で第1樹脂層11を離間させ、さらに図3に示す平面形状の第3樹脂層21の各交点に相当する位置で第3樹脂層21を離間させる例を示した。第1樹脂層11および第3樹脂層21を各交点に相当する位置で離間させる構成は、図10ないし図14に示す平面形状の第1樹脂層11および第3樹脂層21に適用することもできる。 In the present embodiment, the first resin layer 11 is separated at a position corresponding to each intersection of the first resin layer 11 having a planar shape shown in FIG. 3, and the third resin layer 21 having a planar shape shown in FIG. The example which spaces apart the 3rd resin layer 21 in the position corresponded to each intersection was shown. The configuration in which the first resin layer 11 and the third resin layer 21 are separated at the positions corresponding to the respective intersections can also be applied to the first resin layer 11 and the third resin layer 21 having a planar shape shown in FIGS. it can.
 [第8実施形態] 
 第8実施形態においては、第1樹脂基体10および第2樹脂基体20に適用し得る他の構造を開示する。図16は、本実施形態に係る表示パネルPNL1の概略的な断面図である。ここでは、図6と同じく、ガラス基板GS1,GS2の剥離前の状態を示している。
Eighth Embodiment
In the eighth embodiment, another structure applicable to the first resin base 10 and the second resin base 20 is disclosed. FIG. 16 is a schematic cross-sectional view of a display panel PNL1 according to the present embodiment. Here, as in FIG. 6, the state before peeling of the glass substrates GS1 and GS2 is shown.
 第1樹脂基体10は、第2樹脂層12に代えて、2つの樹脂層12a,12bを備えている。これら樹脂層12a,12bは、第1樹脂層11よりもヤング率が小さいポリイミドで形成されている。樹脂層12aは、ガラス基板GS1の上に形成されている。第1樹脂層11は、樹脂層12aの上に形成されている。樹脂層12bは、第1樹脂層11および樹脂層12aを覆っている。 The first resin base 10 includes two resin layers 12 a and 12 b instead of the second resin layer 12. The resin layers 12 a and 12 b are formed of polyimide having a Young's modulus smaller than that of the first resin layer 11. The resin layer 12a is formed on the glass substrate GS1. The first resin layer 11 is formed on the resin layer 12a. The resin layer 12 b covers the first resin layer 11 and the resin layer 12 a.
 同様に、第2樹脂基体20は、第4樹脂層22に代えて、2つの樹脂層22a,22bを備えている。これら樹脂層22a,22bは、第3樹脂層21よりもヤング率が小さいポリイミドで形成されている。樹脂層22aは、ガラス基板GS2の下に形成されている。第3樹脂層21は、樹脂層22aの下に形成されている。樹脂層22bは、第3樹脂層21および樹脂層22aを覆っている。 Similarly, the second resin base 20 includes two resin layers 22 a and 22 b instead of the fourth resin layer 22. The resin layers 22 a and 22 b are formed of polyimide having a Young's modulus smaller than that of the third resin layer 21. The resin layer 22a is formed under the glass substrate GS2. The third resin layer 21 is formed under the resin layer 22a. The resin layer 22 b covers the third resin layer 21 and the resin layer 22 a.
 ポリイミドは、ヤング率が大きいほどレーザ光の吸収率が小さくなる傾向がある。したがって、第1実施形態のようにガラス基板GS1に第1樹脂層11が接していると、LLOの際に第1樹脂基体10とガラス基板GS1とをスムーズに剥離できない可能性がある。これに対し、本実施形態の構造であれば、第1樹脂層11よりもヤング率が小さい樹脂層12aがガラス基板GS1に接しているので、LLOの際に第1樹脂基体10とガラス基板GS1とを剥離しやすくなる。第2樹脂基体20についても同様である。 In the case of polyimide, the absorptivity of laser light tends to be smaller as the Young's modulus is larger. Therefore, when the first resin layer 11 is in contact with the glass substrate GS1 as in the first embodiment, there is a possibility that the first resin base 10 and the glass substrate GS1 can not be peeled off smoothly in the LLO. On the other hand, in the case of the structure of the present embodiment, the resin layer 12a having a Young's modulus smaller than that of the first resin layer 11 is in contact with the glass substrate GS1. And it becomes easy to peel off. The same applies to the second resin base 20.
 [第9実施形態] 
 上述の各実施形態においては、液晶表示装置DSP1を開示した。第9実施形態においては、有機EL表示装置を開示する。
[Ninth embodiment]
In each of the embodiments described above, the liquid crystal display device DSP1 is disclosed. In a ninth embodiment, an organic EL display device is disclosed.
 図17は、本実施形態に係る有機EL表示装置DSP2(以下、表示装置DSP2と呼ぶ)の構成例を示す平面図である。第1実施形態と類似する要素には同一の符号を付して説明を省略する。 FIG. 17 is a plan view showing a configuration example of an organic EL display device DSP2 (hereinafter, referred to as a display device DSP2) according to the present embodiment. Elements similar to those of the first embodiment are assigned the same reference numerals and explanation thereof is omitted.
 表示装置DSP2は、表示パネルPNL2を備えている。表示パネルPNL2は、第1辺E1と、第2辺E2と、第3辺E3と、第4辺E4とを有した矩形状である。各辺E1,E2は、第2方向Yと平行である。各辺E3,E4は、第1方向Xと平行である。なお、表示パネルPNL2は、矩形状に限られない。 The display device DSP2 includes a display panel PNL2. The display panel PNL2 has a rectangular shape having a first side E1, a second side E2, a third side E3, and a fourth side E4. Each side E1, E2 is parallel to the second direction Y. Each side E3, E4 is parallel to the first direction X. The display panel PNL2 is not limited to the rectangular shape.
 表示領域DAに配列された画素PXは、赤色、緑色、青色の副画素SPによって構成することができる。画素PXは、白色の副画素SPなど、他の色の副画素SPを含んでもよい。 The pixels PX arranged in the display area DA can be configured by red, green and blue sub-pixels SP. The pixels PX may include sub-pixels SP of other colors, such as white sub-pixels SP.
 図18は、副画素SPの回路構成の一例を示す図である。副画素SPは、有機EL素子OLEDと、第1スイッチング素子SW1と、第2スイッチング素子SW2とを備えている。 FIG. 18 is a diagram showing an example of the circuit configuration of the sub-pixel SP. The sub-pixel SP includes an organic EL element OLED, a first switching element SW1, and a second switching element SW2.
 有機EL素子OLEDの画素電極PE(アノード電極)は、第1スイッチング素子SW1を介して電源線PSに接続されている。第1スイッチング素子SW1のゲート電極とソース電極(或いはドレイン電極)との間には、保持容量Cが形成されている。第1スイッチング素子SW1のゲートは、第2スイッチング素子SW2を介して信号線Sに接続されている。第2スイッチング素子SW2のゲートは、走査線Gに接続されている。 The pixel electrode PE (anode electrode) of the organic EL element OLED is connected to the power supply line PS via the first switching element SW1. A storage capacitor C is formed between the gate electrode and the source electrode (or drain electrode) of the first switching element SW1. The gate of the first switching element SW1 is connected to the signal line S via the second switching element SW2. The gate of the second switching element SW2 is connected to the scanning line G.
 第1スイッチング素子SW1を介して画素電極PEに映像信号が供給されると、画素電極PEと共通電極CE(カソード電極)との間に所定の電位差が生じる。この電位差により、有機発光層ORGが各副画素SPに対応する色に発光する。各色の副画素SPの有機発光層ORGが放つ光をいずれも同一色(例えば白色)とし、各副画素SPにカラーフィルタを配置してもよい。 When a video signal is supplied to the pixel electrode PE via the first switching element SW1, a predetermined potential difference is generated between the pixel electrode PE and the common electrode CE (cathode electrode). Due to this potential difference, the organic light emitting layer ORG emits light in a color corresponding to each sub-pixel SP. The light emitted from the organic light emitting layers ORG of the sub-pixels SP of each color may be the same color (for example, white), and a color filter may be disposed in each sub-pixel SP.
 図19は、表示パネルPNL2の断面の一例を示す図である。ここでは、1つの副画素SPに相当する表示領域DAの一部を示している。表示パネルPNL2は、可撓性を有する樹脂基体30と、バリア層33と、第1絶縁層34と、第2絶縁層35と、第1パッシベーション層36と、第2パッシベーション層37と、封止層38と、第3パッシベーション層39とを備えている。さらに、表示パネルPNLは、各副画素SPに配置された有機発光層ORGおよび画素電極PEと、副画素SPの境界に配置されたバンク40と、共通電極CEとを備えている。 FIG. 19 is a diagram showing an example of a cross section of the display panel PNL2. Here, a part of the display area DA corresponding to one sub-pixel SP is shown. The display panel PNL2 includes a flexible resin base 30, a barrier layer 33, a first insulating layer 34, a second insulating layer 35, a first passivation layer 36, and a second passivation layer 37. A layer 38 and a third passivation layer 39 are provided. Further, the display panel PNL includes the organic light emitting layer ORG and the pixel electrode PE disposed in each sub-pixel SP, the bank 40 disposed at the boundary of the sub-pixel SP, and the common electrode CE.
 樹脂基体30は、互いに平行な第1面30Aおよび第2面30Bを有している。バリア層33は、第1面30Aを覆っている。第1絶縁層34は、バリア層33を覆っている。信号線Sは、第1絶縁層34の上に配置されている。第2絶縁層35は、信号線Sおよび第1絶縁層34を覆っている。第1パッシベーション層36は、第2絶縁層35を覆っている。 The resin base 30 has a first surface 30A and a second surface 30B parallel to each other. The barrier layer 33 covers the first surface 30A. The first insulating layer 34 covers the barrier layer 33. The signal line S is disposed on the first insulating layer 34. The second insulating layer 35 covers the signal line S and the first insulating layer 34. The first passivation layer 36 covers the second insulating layer 35.
 画素電極PEは、第1パッシベーション層36の上に配置されている。有機発光層ORGは、画素電極PEの上に配置されている。バンク40は、隣り合う副画素SPの画素電極PEおよび有機発光層ORGの間に配置されている。共通電極CEは、有機発光層ORGおよびバンク40を覆っている。第2パッシベーション層37は、共通電極CEを覆っている。封止層38は、第2パッシベーション層37を覆っている。第3パッシベーション層39は、封止層38を覆っている。第3パッシベーション層39の上には、偏光板PLが接着されている。 The pixel electrode PE is disposed on the first passivation layer 36. The organic light emitting layer ORG is disposed on the pixel electrode PE. The bank 40 is disposed between the pixel electrode PE of the adjacent subpixel SP and the organic light emitting layer ORG. The common electrode CE covers the organic light emitting layer ORG and the bank 40. The second passivation layer 37 covers the common electrode CE. The sealing layer 38 covers the second passivation layer 37. The third passivation layer 39 covers the sealing layer 38. A polarizing plate PL is adhered on the third passivation layer 39.
 樹脂基体30は、第1樹脂層31と、第2樹脂層32とを備えている。第1樹脂層31は、例えばポリイミドで形成されている。第2樹脂層32は、例えば第1樹脂層31と異なる種類のポリイミドで形成されている。第1樹脂層31のヤング率は、第2樹脂層32のヤング率よりも大きい。 The resin base 30 includes a first resin layer 31 and a second resin layer 32. The first resin layer 31 is formed of, for example, polyimide. The second resin layer 32 is formed of, for example, a different type of polyimide from the first resin layer 31. The Young's modulus of the first resin layer 31 is larger than the Young's modulus of the second resin layer 32.
 第1樹脂層31の第3方向Zにおける厚さT31は、第2樹脂層32の第3方向Zにおける厚さT32よりも小さい。例えば、厚さT31は、厚さT32の1/3以上であることが好ましく、2/3以上であれば一層好適である。 The thickness T31 of the first resin layer 31 in the third direction Z is smaller than the thickness T32 of the second resin layer 32 in the third direction Z. For example, the thickness T31 is preferably 1/3 or more of the thickness T32, and more preferably 2/3 or more.
 第1樹脂層31は図20を用いて後述するように線状であり、第2樹脂層32は樹脂基体30の全体にわたる板状である。図示した第1樹脂層31は、下面を除き、第2樹脂層32で覆われている。樹脂基体30の第1面30Aは、第2樹脂層32の上面に相当する。樹脂基体30の第2面30Bは、第1樹脂層31および第2樹脂層32の下面によって構成されている。第2面30Bに支持フィルムなどの部材が貼り付けられてもよい。 The first resin layer 31 is linear as described later with reference to FIG. 20, and the second resin layer 32 is in the form of a plate covering the entire resin base 30. The illustrated first resin layer 31 is covered with the second resin layer 32 except for the lower surface. The first surface 30A of the resin base 30 corresponds to the upper surface of the second resin layer 32. The second surface 30 B of the resin base 30 is constituted by the lower surfaces of the first resin layer 31 and the second resin layer 32. A member such as a support film may be attached to the second surface 30B.
 表示パネルPNL2の基体が樹脂材料で形成されているために、表示パネルPNL2は、任意の形状に曲げることが可能である。 Since the substrate of the display panel PNL2 is formed of a resin material, the display panel PNL2 can be bent into any shape.
 図20は、第1樹脂層31の形状を表す表示パネルPNL2の概略的な平面図である。ここでは、図14に示した第1樹脂層11と同様の平面形状を第1樹脂層31に適用した例を示している。その他にも、第1樹脂層31の平面形状としては、例えば図3、図10ないし図13、および図15に開示した第1樹脂層11の平面形状を適用できる。 FIG. 20 is a schematic plan view of the display panel PNL2 showing the shape of the first resin layer 31. As shown in FIG. Here, the example which applied the planar shape similar to the 1st resin layer 11 shown in FIG. 14 to the 1st resin layer 31 is shown. Besides, as the planar shape of the first resin layer 31, for example, the planar shape of the first resin layer 11 disclosed in FIG. 3, FIG. 10 to FIG. 13, and FIG.
 図20の例において、第1樹脂層31は、枠部分31a,31bを有している。枠部分31aは、樹脂基体30の縁(各辺E1~E4)に沿って枠状に設けられている。枠部分31bは、表示領域DAの縁に沿って枠状に設けられている。 In the example of FIG. 20, the first resin layer 31 has frame portions 31a and 31b. The frame portion 31 a is provided in a frame shape along the edge (each side E 1 to E 4) of the resin base 30. The frame portion 31 b is provided in a frame shape along the edge of the display area DA.
 さらに、第1樹脂層31は、第1方向Xに延びる複数の延在部分31xと、第2方向Yに延びる複数の延在部分31yとを有している。複数の延在部分31xの一部は、表示領域DAと第4辺E4の間の端子領域TAにおいて、第2方向Yに一定の間隔をあけて配列されている。これら延在部分31xの両端部は、それぞれ枠部分31aに接続されている。 Furthermore, the first resin layer 31 has a plurality of extending portions 31 x extending in the first direction X and a plurality of extending portions 31 y extending in the second direction Y. A part of the plurality of extended portions 31x is arranged at a constant interval in the second direction Y in the terminal area TA between the display area DA and the fourth side E4. Both ends of each of the extension portions 31x are connected to the frame portion 31a.
 表示領域DAにおいては、複数の延在部分31xと複数の延在部分31yとが格子状に配置されている。各延在部分31x,31yの両端部は、それぞれ枠部分31bに接続されている。各延在部分31xは、第2方向Yに並ぶ副画素SPの間にそれぞれ配置されている。各延在部分31yは、が第1方向Xに並ぶ副画素SPの間にそれぞれ配置されている。これにより、副画素SPが延在部分31x,31yによって格子状に区画されている。延在部分31xは、例えば走査線Gと重畳している。延在部分31yは、例えば信号線Sと重畳している。 In the display area DA, the plurality of extended portions 31x and the plurality of extended portions 31y are arranged in a lattice. Both ends of each of the extension portions 31x and 31y are connected to the frame portion 31b. The extended portions 31x are respectively disposed between the sub-pixels SP arranged in the second direction Y. The extension portions 31y are respectively disposed between the sub-pixels SP in the first direction X. Thereby, the sub-pixels SP are partitioned in a grid shape by the extension portions 31x and 31y. The extended portion 31x overlaps, for example, the scanning line G. The extended portion 31 y overlaps, for example, the signal line S.
 本実施形態のような有機EL表示装置DSP2であっても、上述の各実施形態と同様の効果を得ることができる。また、自発光型の表示装置DSP2においては、図13の延在部分11p,11qと同様に第1樹脂層31が走査線Gまたは信号線Sと交差しない態様で配置されたとしても、表示品位に影響がない。 Even if it is organic EL display DSP2 like this embodiment, the same effect as each above-mentioned embodiment can be acquired. Further, in the self-luminous display device DSP2, even if the first resin layer 31 is arranged in a mode not to intersect the scanning line G or the signal line S as in the extended portions 11p and 11q of FIG. There is no impact on
 樹脂基体30は、図16に示す第1樹脂基体10と同様に、第1樹脂層31が2つの樹脂層により挟まれた構造であってもよい。 The resin base 30 may have a structure in which the first resin layer 31 is sandwiched between two resin layers, similarly to the first resin base 10 shown in FIG.
 本発明の実施形態として説明した表示装置を基にして、当業者が適宜設計変更して実施し得る全ての表示装置も、本発明の要旨を包含する限り、本発明の範囲に属する。 
 本発明の思想の範疇において、当業者であれば、各種の変形例に想到し得るものであり、それら変形例についても本発明の範囲に属するものと解される。例えば、上述の各実施形態に対して、当業者が適宜、構成要素の追加、削除、もしくは設計変更を行ったもの、又は、工程の追加、省略もしくは条件変更を行ったものも、本発明の要旨を備えている限り、本発明の範囲に含まれる。 
 また、各実施形態において述べた態様によりもたらされる他の作用効果について、本明細書の記載から明らかなもの、または当業者において適宜想到し得るものについては、当然に本発明によりもたらされるものと解される。
All display devices that can be appropriately designed and changed by those skilled in the art based on the display devices described as the embodiments of the present invention also fall within the scope of the present invention as long as they include the subject matter of the present invention.
Within the scope of the concept of the present invention, those skilled in the art can conceive of various modifications, which are considered to be within the scope of the present invention. For example, those in which a person skilled in the art appropriately adds, deletes, or changes the design of the components or adds, omits, or changes the steps of the above-described embodiments may be included in the present invention. As long as it comprises the gist, it is included in the scope of the present invention.
In addition, with regard to the other effects brought about by the aspects described in each embodiment, what is obvious from the description of the present specification or that which can be appropriately conceived by those skilled in the art is naturally solved as the present invention. Be done.
 DSP1…表示装置、PNL1…表示パネル、SUB1…第1基板、SUB2…第2基板、LC…液晶層、DA…表示領域、SA…周辺領域、PX…画素、SP…副画素、G…走査線、S…信号線、GS1,GS2…ガラス基板、10…第1樹脂基体、11…第1樹脂層、12…第2樹脂層、20…第2樹脂基体、21…第3樹脂層、22…第4樹脂層、24…遮光層。 DSP1: display device, PNL1: display panel, SUB1: first substrate, SUB2: second substrate, LC: liquid crystal layer, DA: display region, SA: peripheral region, PX: pixel, SP: subpixel, G: scanning line S: signal line, GS1, GS2: glass substrate, 10: first resin base, 11: first resin layer, 12: second resin layer, 20: second resin base, 21: third resin layer, 22: Fourth resin layer, 24 ... light shielding layer.

Claims (20)

  1.  可撓性を有する第1樹脂基体と、
     前記第1樹脂基体の上方に配置された複数の画素と、
     前記複数の画素を含む表示領域に延在する複数の走査線と、
     前記表示領域に延在し、前記複数の信号線と交差する複数の信号線と、を備え、
     前記第1樹脂基体は、線状の第1樹脂層と、前記第1樹脂層の少なくとも側面を覆う板状の第2樹脂層と、を含む
     表示装置。
    A flexible first resin substrate,
    A plurality of pixels disposed above the first resin base,
    A plurality of scan lines extending to a display area including the plurality of pixels;
    A plurality of signal lines extending to the display area and intersecting the plurality of signal lines;
    A display device, wherein the first resin base includes a linear first resin layer and a plate-like second resin layer covering at least a side surface of the first resin layer.
  2.  前記第1樹脂層のヤング率は、前記第2樹脂層のヤング率よりも大きい、
     請求項1に記載の表示装置。
    The Young's modulus of the first resin layer is larger than the Young's modulus of the second resin layer,
    The display device according to claim 1.
  3.  前記第1樹脂層は、前記第1樹脂基体の縁に沿う部分および前記表示領域の縁に沿う部分を含む、
     請求項1に記載の表示装置。
    The first resin layer includes a portion along an edge of the first resin substrate and a portion along an edge of the display area.
    The display device according to claim 1.
  4.  前記第1樹脂層は、前記第1樹脂基体の縁に沿う枠状の第1枠部分を含む、
     請求項1に記載の表示装置。
    The first resin layer includes a frame-shaped first frame portion along an edge of the first resin base,
    The display device according to claim 1.
  5.  前記第1樹脂層は、前記表示領域の縁に沿う枠状の第2枠部分を含む、
     請求項1に記載の表示装置。
    The first resin layer includes a frame-shaped second frame portion along an edge of the display area,
    The display device according to claim 1.
  6.  前記表示領域の外の周辺領域に配置された外部接続用の端子を備え、
     前記第1樹脂層は、前記表示領域と前記端子の間において、前記表示領域から前記端子に向かう方向と交差する方向に延在する部分を含む、
     請求項1に記載の表示装置。
    A terminal for external connection disposed in a peripheral area outside the display area;
    The first resin layer includes a portion extending between the display area and the terminal in a direction intersecting the direction from the display area to the terminal.
    The display device according to claim 1.
  7.  前記第1樹脂層は、前記走査線または前記信号線と重畳する部分を含む、
     請求項1に記載の表示装置。
    The first resin layer includes a portion overlapping with the scanning line or the signal line.
    The display device according to claim 1.
  8.  前記第1樹脂層は、第1方向に延在する第1延在部分と、前記第1方向と交差する第2方向に延在する第2延在部分と、を含み、
     前記第1延在部分および前記第2延在部分は、格子状に配置されている、
     請求項1に記載の表示装置。
    The first resin layer includes a first extending portion extending in a first direction, and a second extending portion extending in a second direction intersecting the first direction,
    The first extending portion and the second extending portion are arranged in a grid shape.
    The display device according to claim 1.
  9.  前記第1延在部分と前記第2延在部分は、格子の交点に相当する位置において、互いに離間している、
     請求項8に記載の表示装置。
    The first extension and the second extension are spaced apart from each other at a position corresponding to the intersection point of the grid.
    The display device according to claim 8.
  10.  前記第1延在部分は、前記走査線と重畳している、
     請求項8に記載の表示装置。
    The first extension portion overlaps the scan line.
    The display device according to claim 8.
  11.  前記第2延在部分は、前記信号線と重畳している、
     請求項8に記載の表示装置。
    The second extension portion overlaps the signal line.
    The display device according to claim 8.
  12.  前記走査線および前記信号線と重畳する遮光層をさらに備え、
     前記第1延在部分または前記第2延在部分は、前記遮光層と重畳している、
     請求項8に記載の表示装置。
    And a light shielding layer overlapping the scanning line and the signal line,
    The first extending portion or the second extending portion overlaps the light shielding layer.
    The display device according to claim 8.
  13.  前記第1樹脂層は、前記第1方向および前記第2方向と交差する方向に延在する第3延在部分をさらに含む、
     請求項8に記載の表示装置。
    The first resin layer further includes a third extending portion extending in a direction intersecting the first direction and the second direction.
    The display device according to claim 8.
  14.  前記第3延在部分は、前記第1延在部分および前記第2延在部分を含む格子の対角方向に延在する、
     請求項13に記載の表示装置。
    The third extension portion extends in a diagonal direction of a grid including the first extension portion and the second extension portion.
    The display device according to claim 13.
  15.  前記第1樹脂層の厚さは、前記第2樹脂層の厚さの1/3以上である、
     請求項1に記載の表示装置。
    The thickness of the first resin layer is 1/3 or more of the thickness of the second resin layer,
    The display device according to claim 1.
  16.  前記第1樹脂層の厚さは、前記第2樹脂層の厚さの2/3以上である、
     請求項1に記載の表示装置。
    The thickness of the first resin layer is 2/3 or more of the thickness of the second resin layer,
    The display device according to claim 1.
  17.  前記第1樹脂層の厚さは、前記第2樹脂層の厚さよりも小さい、
     請求項1に記載の表示装置。
    The thickness of the first resin layer is smaller than the thickness of the second resin layer,
    The display device according to claim 1.
  18.  前記第1樹脂基体と対向する第2樹脂基体と、
     前記第1樹脂基体と前記第2樹脂基体の間に配置された液晶層と、をさらに備え、
     前記第2樹脂基体は、線状の第3樹脂層と、前記第3樹脂層の少なくとも側面を覆う板状の第4樹脂層と、を含み、
     前記第3樹脂層のヤング率は、前記第4樹脂層のヤング率よりも大きい、
     請求項1に記載の表示装置。
    A second resin base facing the first resin base;
    And a liquid crystal layer disposed between the first resin base and the second resin base,
    The second resin base includes a linear third resin layer, and a plate-like fourth resin layer covering at least a side surface of the third resin layer,
    The Young's modulus of the third resin layer is larger than the Young's modulus of the fourth resin layer,
    The display device according to claim 1.
  19.  前記複数の画素の各々に配置された画素電極と、
     前記画素電極と対向する共通電極と、
     前記複数の画素の各々に配置され、前記画素電極と前記共通電極の電位差に応じて発光する発光層と、を備える、
     請求項1に記載の表示装置。
    A pixel electrode disposed in each of the plurality of pixels;
    A common electrode facing the pixel electrode;
    A light emitting layer disposed in each of the plurality of pixels and emitting light according to a potential difference between the pixel electrode and the common electrode;
    The display device according to claim 1.
  20.  前記第2樹脂層は、一対の樹脂層を含み、
     前記第1樹脂層は、前記一対の樹脂層の間に配置されている、
     請求項1に記載の表示装置。
    The second resin layer includes a pair of resin layers,
    The first resin layer is disposed between the pair of resin layers.
    The display device according to claim 1.
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