WO2019089411A1 - Systèmes et procédés pour méthode sol-gel rouleau à rouleau - Google Patents

Systèmes et procédés pour méthode sol-gel rouleau à rouleau Download PDF

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Publication number
WO2019089411A1
WO2019089411A1 PCT/US2018/057915 US2018057915W WO2019089411A1 WO 2019089411 A1 WO2019089411 A1 WO 2019089411A1 US 2018057915 W US2018057915 W US 2018057915W WO 2019089411 A1 WO2019089411 A1 WO 2019089411A1
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WO
WIPO (PCT)
Prior art keywords
sol
gel
gel layer
partially cured
release liner
Prior art date
Application number
PCT/US2018/057915
Other languages
English (en)
Inventor
Sean Matthew Garner
Michael Lesley Sorensen
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2019089411A1 publication Critical patent/WO2019089411A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing

Definitions

  • Embodiments are related to manufacturing using sol-gel materials and, more particularly, to systems and methods for forming structural elements using sol -gel material.
  • Various devices rely on forming layers and surface structures as part of the device manufacturing process.
  • a base structure is formed and a photolithographic material is formed thereon using one of a variety of processes including, for example, spin on or spray coating.
  • the photolithographic material is then patterned and etched to remove select portions of the photolithographic material leaving desired structures.
  • the aforementioned processes suffer from a variety of limitations including, but not limited to, a lack of uniform thickness of the applied photolithographic material. This lack of uniformity results in inconsistencies in the final structures and is particularly problematic where the base structure is not flat.
  • the base structure on which the photolithographic material is to be formed includes tight bend radii, achieving desired structures after patterning and etching is very complicated, if it can even be done.
  • achieving desired structures after patterning and etching is very complicated, if it can even be done.
  • As another limitation of the aforementioned subtractive process often rely on highly toxic chemicals.
  • Embodiments are related to manufacturing using sol-gel materials and, more particularly, to systems and methods for forming structural elements using sol -gel material.
  • This summary provides only a general outline of some embodiments of the invention.
  • the phrases “in one embodiment,” “according to one embodiment,” “in various embodiments”, “in one or more embodiments”, “in particular embodiments” and the like generally mean the particular feature, structure, or characteristic following the phrase is included in at least one embodiment of the present invention, and may be included in more than one embodiment of the present invention. Importantly, such phrases do not necessarily refer to the same embodiment. Many other embodiments of the invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
  • Figs, la-lc depict a roll-to-roll sol -gel based structure forming system in accordance with one or more embodiments of the present inventions
  • Fig. Id is a top view of a structural layer formed using the roll-to-roll sol-gel based structure forming system of Figs, la-lc.
  • Figs. 2a-2b depict a device having a curvilinear surface upon which a sol -gel based structural layer is formed in accordance with various embodiments of the present inventions;
  • Fig. 6 is a flow diagram showing a method in accordance with various embodiments of the present inventions for manufacturing a sol-gel material susceptible to the first and second cure processes used to form dimensionally sensitive structures.
  • Embodiments are related to manufacturing using sol-gel materials and, more particularly, to systems and methods for forming structural elements using sol -gel material.
  • This sol-gel surface apparatus may then be applied to a device, and the combination of the device exposed to a thermal cure process causing the sol-gel surface apparatus to harden such that it loses tack, and in some cases forms a secure bond with a surface of the device.
  • the thermal cure can be in the form of exposure to a heat source or indirectly through methods such as flashlamp curing. In the flashlamp example, the photonic energy is locally absorbed and converted to heat.
  • a side view 200 of a device 210 and a sol-gel surface apparatus 228 is shown.
  • device 210 includes a curvilinear surface 232.
  • Device 210 may be designed to perform any number of functions including, but not limited to, lighting or displays. Based upon the disclosure provided herein, one of ordinary skill in the art will recognize a variety of devices to which a sol-gel surface apparatus in accordance with embodiments of the present invention may be applied. The function of device 210 is not of primary importance to this application, but rather device 210 is chosen to show an example of applying a sol-gel surface apparatus 228 to a surface that is not flat.
  • Attaching sol -gel surface apparatus 228 to device 210 may be accomplished by lamination or integration using a peel and stick (pressure sensitive adhesive) process where sol-gel surface apparatus 228 is peeled away from a release liner and attached, application of a liquid adhesive, or by direct thermal lamination.
  • a heated press, autoclave, or heated roller can be used to join sol -gel surface apparatus 228 to device 210.
  • sol -gel surface apparatus 228 attached to device 210 the combination of device 210 and sol -gel surface apparatus 228 is exposed to a thermal cure process.
  • This material exhibits great patternability with micro-replication, can withstand the condensation and post cure temperature requirements, has a cure that is not inhibited by oxygen, and remains clear throughout the process.
  • sol -gel materials suitable for two different curing processes are discussed below in relation to Fig. 6.
  • a pattern is rolled into the sol-gel material to yield an initially patterned sol -gel layer on the release liner (block 415). This includes pressing a pattern into the sol -gel material leaving a pattern of structures that extend into or entirely though the initially patterned sol-gel layer.
  • the initially patterned sol -gel layer is exposed to a photonic cure to yield a partially cured sol-gel layer having fixed structure geometry (block 420). Exposure to photonic energy causes the sol-gel material to transition from a liquid to a solid such that the dimensions of structures formed in the partially cured sol-gel layer to become substantially fixed. While the edges of structures formed in the partially cured sol-gel layer are
  • the partially cured sol-gel layer is separated from the release liner to yield a sol-gel surface apparatus (block 425), and the sol-gel surface apparatus is attached to the surface of a device (block 430). It should be noted that the partially cured sol-gel layer may be separated from the release liner either before or after application to the device. Attaching the sol-gel surface apparatus (or the partially cured sol-gel layer where the partially cured sol-gel layer is attached to the device before the release liner is separated from the partially cured sol -gel layer) to the device may be accomplished by lamination or integration using a peel and stick (pressure sensitive adhesive) process where the sol-gel surface apparatus is peeled away from a release liner and attached, application of a liquid adhesive, or by direct thermal lamination.
  • a peel and stick pressure sensitive adhesive
  • the partially cured sol-gel layer is separated from the release liner to yield a sol-gel surface apparatus (block 520), and the sol-gel surface apparatus is attached to the surface of a device (block 525). It should be noted that the partially cured sol-gel layer may be separated from the release liner either before or after application to the device.
  • Attaching the sol-gel surface apparatus (or the partially cured sol-gel layer where the partially cured sol -gel layer is attached to the device before the release liner is separated from the partially cured sol -gel layer) to the device may be accomplished by lamination or integration using a peel and stick (pressure sensitive adhesive) process where the sol-gel surface apparatus is peeled away from a release liner and attached, application of a liquid adhesive, or by direct thermal lamination.
  • a heated press, autoclave, or heated roller can be used to join the sol-gel surface apparatus to the device.
  • Both the device and the attached sol-gel surface apparatus are exposed to a thermal cure to yield a fully cured sol-gel structure layer on the device (block 530).
  • the thermal cure process causes the sol-gel surface apparatus to harden such that it loses tack, and in some cases forms a secure bond with the surface of the device.
  • the chemistry of the sol-gel material and the surface of the device are compatible (i.e., Si-OH)
  • a chemical bonding of the sol-gel surface apparatus and the surface of the device occurs resulting in a strong bond.
  • a flow diagram 600 shows a method in accordance with various embodiments of the present inventions for manufacturing a sol-gel material susceptible to the first and second cure processes used to form dimensionally sensitive structures.
  • a thiol containing sol-gel is combined with a vinyl containing sol-gel to yield a sol-gel base (block 605).
  • a variety of different materials may be used to make the aforementioned sol-gel base material are set forth in Table 1 below.
  • Example formulations of various sol-gel materials (Thioll, Thiol2, Vinyll, Vinyl2) created from the aforementioned materials are set forth in Table 2 below. Based upon the disclosure provided herein, one of ordinary skill in the art will recognize other thiol containing sol-gel materials and vinyl containing sol -gel materials that may be used in relation to different embodiments of the present inventions.
  • Thiol containing sol-gels e.g., Thioll or Thiol2
  • the vinyl containing sol-gels e.g., Vinyl 1 or Vinyl 2
  • the respective component materials are weighed, in the case of DPSD, or volumetrically measured (for all of TEMS, TEPS, TEOS, HPDMS, Water, TAMS, MPTMS, and VTMS) and added to a round bottom flask (RBF).
  • a pipette with disposable tips for example, can be used.
  • a stir bar can added to the flask and the RBF placed in an oil bath preheated to one hundred (100) degrees Celsius and the solution stirred with, for example, a magnetic stirrer.
  • the top of the RBF is left open to the air to allow for the evaporation of any methanol, ethanol, water, or acetic acid generated during the reaction.
  • the reaction is allowed to continue for between two and one half (2 1/2) to four (4) hours.
  • the reaction is deemed complete when materials no longer condense at the top of the RBF and run down the inside wall.
  • the materials can then be removed from the vial with a pipette with disposable tips, and stored in NalgeneTM bottles.
  • combining the thiol containing sol-gel with the vinyl containing sol -gel to yield a sol-gel base includes combining one of Thioll or Thiol2 with one of Vinyl 1 or Vinyl 2 to yield the yield the sol-gel base.
  • the desired viscosity will be achieved during the reaction described above in relation to block 605. That said, it is possible to increase viscosity by mixing the thiol/vinyl components and allowing them to slowly react before adding the initiator and stabilizer.
  • a stabilizer is added to yield the sol-gel material that can be used as discussed above in relation to Figs. 1 -3 (block 615).
  • the stabilizer is pyrogallol in an amount of between ten (10) and thirty (30) mM (based on thiol content of the sol-gel).
  • DMPA and VPA can be added to the sol-gel material.
  • DMPA is a second initiator that can be used in conjunction with or instead of the aforementioned benzophenone.
  • VPA is a stabilizer that can be used in conjunction with the pyrogallol.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Des modes de réalisation se rapportent à des matériaux sol-gel et, plus particulièrement, des systèmes et des procédés de formation d'éléments structuraux à l'aide de matériau sol-gel.
PCT/US2018/057915 2017-10-30 2018-10-29 Systèmes et procédés pour méthode sol-gel rouleau à rouleau WO2019089411A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762578870P 2017-10-30 2017-10-30
US62/578,870 2017-10-30

Publications (1)

Publication Number Publication Date
WO2019089411A1 true WO2019089411A1 (fr) 2019-05-09

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140004276A1 (en) * 2010-04-02 2014-01-02 Advenira Enterprises, Inc. Roll coatings sol-gel precursors
WO2014054678A1 (fr) * 2012-10-05 2014-04-10 Ｊｘ日鉱日石エネルギー株式会社 Procédé de fabrication de substrat optique utilisant un moule pelliculaire, dispositif de fabrication et substrat optique ainsi obtenu
US20140227507A1 (en) * 2013-02-08 2014-08-14 Enki Technology, Inc. Coating and curing apparatus and methods
WO2015092135A1 (fr) * 2013-12-16 2015-06-25 Teknologian Tutkimuskeskus Vtt Oy Revêtement sol-gel assisté par plasma pour structures alvéolaires et tissus non tissés
WO2016128494A1 (fr) * 2015-02-13 2016-08-18 Morphotonics Holding Bv Procédé de texturation de substrats individuels

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140004276A1 (en) * 2010-04-02 2014-01-02 Advenira Enterprises, Inc. Roll coatings sol-gel precursors
WO2014054678A1 (fr) * 2012-10-05 2014-04-10 Ｊｘ日鉱日石エネルギー株式会社 Procédé de fabrication de substrat optique utilisant un moule pelliculaire, dispositif de fabrication et substrat optique ainsi obtenu
US20140227507A1 (en) * 2013-02-08 2014-08-14 Enki Technology, Inc. Coating and curing apparatus and methods
WO2015092135A1 (fr) * 2013-12-16 2015-06-25 Teknologian Tutkimuskeskus Vtt Oy Revêtement sol-gel assisté par plasma pour structures alvéolaires et tissus non tissés
WO2016128494A1 (fr) * 2015-02-13 2016-08-18 Morphotonics Holding Bv Procédé de texturation de substrats individuels

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