WO2019083200A1 - Piezoelectric actuator-type precision control module and piezoelectric actuator-type precision control device - Google Patents

Piezoelectric actuator-type precision control module and piezoelectric actuator-type precision control device

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Publication number
WO2019083200A1
WO2019083200A1 PCT/KR2018/011979 KR2018011979W WO2019083200A1 WO 2019083200 A1 WO2019083200 A1 WO 2019083200A1 KR 2018011979 W KR2018011979 W KR 2018011979W WO 2019083200 A1 WO2019083200 A1 WO 2019083200A1
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WO
WIPO (PCT)
Prior art keywords
piezo
plate
chuck
pivot
precision control
Prior art date
Application number
PCT/KR2018/011979
Other languages
French (fr)
Korean (ko)
Inventor
정순종
구보근
김민수
김인성
임동환
Original Assignee
한국전기연구원
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Filing date
Publication date
Application filed by 한국전기연구원 filed Critical 한국전기연구원
Publication of WO2019083200A1 publication Critical patent/WO2019083200A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention relates to a piezo actuator-type precision control module and a piezo actuator-type precision control device, and more particularly, to a device for controlling a disk-shaped chuck for seating a semiconductor wafer using a piezoactuator.
  • the line width used in the latest microprocessor is about 0.18 ⁇ m, which is 1/500 of the thickness of the hair. In this case, And the reproducibility of 20 ⁇ m is required.
  • a technique of controlling a position using a piezo effect refers to a phenomenon in which a voltage is applied to a surface of a piezoelectric element by applying an external force to a specific crystal, and a displacement or a force is generated when a voltage is applied to the crystal.
  • Piezoelectric phenomenon is applied to ultra precise position control technology, electroacoustic transducer, piezoelectric purification, ultrasonic humidifier and so on.
  • multilayer piezoactuators have a strain range of about 10 [mu] m per centimeter, and it is necessary to amplify a small displacement of the piezoelectric element by using a flexible hinge for various applications.
  • the displacement amplification mechanism is divided into two methods: a lever-type flexible hinge mechanism and a bridge-type flexible hinge mechanism.
  • Such a position and angle control system using a multi-layer piezoelectric element includes Application Nos. 10-2009-003728, 10-2004-0062092, and 10-2001-0028892 filed in the Korean Intellectual Property Office.
  • the conventional angle and position control apparatus using a piezoelectric element has difficulty in adjusting the horizontal plate on a three-dimensional plane, and there is a problem in use that it is difficult to manufacture a control apparatus using a motor system in an extremely small size.
  • An object of the present invention is to provide a piezoactuator-type precision control module and a piezoactuator-type precision control device which can precisely control the flatness of a plane using a piezoelectric element.
  • a support plate formed at a lower portion apart from the operation plate;
  • a fixing module having one side connected to the operation plate and the other side connected to the support plate and having a tension spring for elastically restoring the engagement plate and the support plate;
  • the piezoelectric module includes a piezoelectric bracket fixed to the upper end of the piezoelectric module and pivoted on a side of the fixing module. Wherein the tension force is generated by the piezo, the tensile restoring force is generated by the tension spring, and the torsional restoring force of the piezo set-up shaft is transmitted to the pivot and the pivot groove,
  • a piezoelectric actuator type precision control module formed by fibrating the piezoelectric actuator.
  • a fixed body formed by screw holes formed in the center of the bottom portion and two through-holes formed in the body portion so as to face each other with the mouth facing each other; And a fastening pin inserted into the through hole of the fixed body and fastened to the coupling ring on both sides of the tension spring;
  • a piezo-electric bracket having a pivotal groove formed on a central axis thereof, the piezo- A supporting plate fixed to the screw hole at the lower portion of the fixed body by a lower screw and having the piezo bottom end receiving groove formed therein;
  • An operation plate fastened to the screw hole on the upper portion of the fixed body by an upper screw and pivotally coupled to the pivotal groove;
  • the tensile force is formed by the piezo
  • the tensile restoring force is formed by the tension spring
  • the restoring force of the piezo axis is formed by fibrating the pivot and the pivot groove. It is essential.
  • the piezoactuator precision control device includes a base plate having the support plate formed at an angle of 120 degrees with respect to the original plate; A chuck having an original plate formed at an angle of 120 ° with the actuating plate facing the supporting plate of the base plate; A pair of fixing modules fastened to the supporting plate of the base plate and the actuating plate of the chuck; And controls the normal axis of the chuck to be precisely controlled by tilting the piezo actuators.
  • a vacuum line is formed on the chuck to remove the wafer gap stuck to the chuck top, thereby improving the piezoelectric driving precision.
  • the piezoactuator-type precision control device is provided with a POGO pin board at the center of the chuck.
  • the pivot is formed with a chamfer and the chamfered portion is brought into contact with the pivot groove.
  • a piezoelectric actuator type precision control module and a piezoelectric actuator type precision control device capable of precisely controlling the flatness of a plane using a piezoelectric element.
  • FIG. 1 is a side cross-sectional view of a piezoactuator-type precision control module according to the present invention
  • Fig. 2 is a schematic cross-sectional structural view of the fixed module of the present invention
  • FIG. 3 shows the operation of the pivot grooves and pivots of the present invention
  • Fig. 4 is a top view of the piezoactuator precision control module of the present invention.
  • FIG. 6 is a bottom view of the chuck of the present invention
  • FIG. 1 is a side sectional view of a piezoactuator precision control module of the present invention
  • FIG. 2 is a front view of a fixed module of the present invention
  • FIG. 3 is an operation diagram of a pivot groove and a pivot of the present invention
  • 6 is a bottom view of the chuck according to the present invention
  • Fig. 7 is a side view of the chuck according to the present invention.
  • Fig. 7 is a side view of the piezoactuator- Sectional side view of the chuck part of the present invention.
  • the present invention comprises a fixing module 20, a piezo 10, a support plate 30, and an actuating plate 500.
  • the fixing module 20 of the present invention comprises a fixed body 21 and a tension spring 22.
  • the fixed body 21 has two cups, So as to face each other.
  • a screw hole 24 is formed in the center of the bottom of the cup forming the fixed body 21 and a through hole 230 is formed in the body of the cup.
  • the fixed body 21 has the same structure as that of cutting the central portion of the cylinder with both ends closed, and has threaded holes 24 at both ends in the cylindrical axial direction, 230 are formed.
  • the tension spring 22 is inserted into the fixed body 21 and formed with coupling rings 220 on both sides thereof to be restored against the pulling motion.
  • the tension spring 22 fastens the fastening pins 23 to the fastening bosses 220 on both sides through the through holes 230 of the fastening body 21, 21).
  • a piezo bracket 11 having a pivot groove 110 formed at its upper end is coupled to the piezo 10 of the present invention.
  • the pivot groove 110 is formed at the center of the piezo-electric bracket 11.
  • the piezo 10 and the fixing module 20 are supported by the support plate 30 and the actuating plate 500 as shown in FIG.
  • a lower screw fastening hole 31 is formed in the support plate 30 so as to be fastened to the screw hole 24 in the lower portion of the fixed body 21 with a lower screw 80.
  • a seating groove 32 into which the lower end of the piezo is inserted is formed.
  • the operation plate 500 is provided with a first upper screw fastening hole 700-1 and a pivot 60 is fastened to the upper plate 100 through a screw hole 24 in the upper portion of the fixed body 21. [ And the pivot 60 is pivotally coupled to the pivot groove 110. [
  • the tensile force is formed by the piezo 10
  • the tensile restoring force is formed by the tension spring 22, (10) is fixed.
  • the chamfer 600 may be formed on the pivot 60 to improve the recovery of the standing axis A.
  • the chamfer 600 may be linearly contacted to the pivot 110.
  • the present invention is characterized in that the piezoelectric module 10 and the fixing module 20 are formed parallel to each other in the vicinity of the supporting plate 30 and the actuating plate 500 to form a pair of fixing modules and a piezo Actuator-type precision control module.
  • the present invention can be further extended to form an actuator module for controlling the balance of the disk-shaped chuck 50 supported on three legs.
  • the piezo-actuator 50 which controls the normal axis of the disk-shaped chuck 50, And becomes an expression precision control device.
  • the piezoelectric actuator type precision control device for controlling the normal axis of the disk-shaped chuck 50 is composed of the base plate 40, the chuck 50, and three piezoactuator precision control modules as shown in FIG.
  • each of the piezoactuator-type precision control modules is equiangularly coupled at 120 degrees between the chuck 50 and the base plate as a leg of the disk-shaped chuck 50 as shown in Fig.
  • a second upper screw coupling hole 700 and a pivot 60 of the piezoactuator-type precision control module are formed at an angle of 120 ° below the chuck 50.
  • the chuck 50 is an actuating plate shared by the three piezoactuator precision control modules arranged at an angle of 120 degrees. This is because when the present invention is applied to the disk- It is not meant to exclude the structure in which the actuating plate 500 of each piezoactuator type precision control module is independently coupled to the lower portion of the actuating plate 500. In order to improve the balance control precision of the chuck plate 50, It is merely adopting a shared structure.
  • the piezoactuator-type precision control device for precisely controlling the normal axis of the chuck 50 by precisely driving each piezoactuator-type precision control module is constituted.
  • a vacuum line 510 is formed on the chuck 50 to vacuum-adsorb the wafer placed on the upper end of the chuck 50 to remove the gap between the upper end of the chuck 50 and the wafer
  • the balance of the chuck 50 by piezo driving can be connected to the equilibrium of the wafer so that the wafer balance control precision can be improved.
  • the vacuum line 510 of the chuck 50 is designed to have a square structure of 1 mm x 1 mm and is not a wafer target,
  • a POGO pin board 520 is formed at the center of the chuck 50 so that the POGO pin board 520 can be contacted to the wafer to be mounted.
  • the chuck 50 is made of Al and has a diameter of 306 mm so that a cartridge for mounting a wafer having a diameter of 300 mm can be tilted.
  • the center of the chuck 50 is connected to an arc
  • the POGO pin board 520 with the interposable POGO pin can be seated to receive and transmit the POGO pin.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

The present invention relates to a piezoelectric actuator-type precision control device comprising: a holding module comprising a holding portion body having a screw hole formed at the center portion of the bottom thereof and having two cups formed opposite each other such that entrances thereof face each other, each cup having a through-hole formed in the body portion thereof, the holding module comprising a tension spring inserted into the holding portion body, coupling rings being formed on both sides of the tension spring, the holding module comprising a fastening pin inserted into the through-hole of the holding portion body and fastened to the coupling rings on both sides of the tension spring; a piezoelectric element provided upright on a side surface of the holding module, a piezoelectric bracket being fastened to the upper end of the piezoelectric element, a pivot groove being formed on the center shaft of the piezoelectric bracket; a support plate fastened to a screw hole in the lower portion of the holding portion body by a lower screw, a seating groove for the lower end of the piezoelectric element being formed on the support plate; and an operation plate fastened to a screw hole in the upper portion of the holding portion body by an upper screw, the operation plate having a pivot that is pivoting-coupled to the pivot groove, wherein tension force is formed by the piezoelectric element, tension restoring force is formed by the tension spring, and piezoelectric shaft restoring force is formed by pivoting of the pivot and the pivot groove.

Description

피에조 엑츄에이터식 정밀 제어모듈과 피에조 엑츄에이터식 정밀 제어장치Piezo actuator type precision control module and piezo actuator type precision control device
본 발명은 피에조 엑츄에이터식 정밀 제어모듈과 피에조 엑츄에이터식 정밀 제어장치에 관한 것으로서, 보다 상세하게는 반도체 웨이퍼를 안착시키는 원판형 척을 피에조 엑츄에이터를 이용하여 평형 제어시키는 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezo actuator-type precision control module and a piezo actuator-type precision control device, and more particularly, to a device for controlling a disk-shaped chuck for seating a semiconductor wafer using a piezoactuator.
반도체 기술과 같은 산업현장의 각 분야에서 초정밀급 위치결정기술의 중요성은 날로 증대되고 있다. 특히, 반도체 기술의 발전은 회로의 고집적화를 불러온 결과, 최신 마이크로프로세서의 경우 사용되는 선폭이 0.18μm 수준으로 머리카락 굵기의 1/500수준이며, 이 경우 웨이퍼를 제작하는 스테이지에 요구되는 정밀도는 선폭의 1/10수준으로 20μm의 재현성(Reproducibility)이 요구된다.The importance of ultra-precise positioning technology is increasing day by day in various fields of industry such as semiconductor technology. In particular, as the development of semiconductor technology has led to the high integration of circuits, the line width used in the latest microprocessor is about 0.18 μm, which is 1/500 of the thickness of the hair. In this case, And the reproducibility of 20 μm is required.
일반적으로 초정밀 위치제어기술 분야에서는 압전효과(piezo effect)를 이용하여 위치를 제어하는 기술을 사용하고 있다. 이러한 압전 효과란, 압전 소자의 특수한 결정에 외부적인 힘을 가하여 변형을 주면 그 표면에 전압이 발생하고, 반대로 결정에 전압을 걸면 변위나 힘이 발생하는 현상을 말한다. 이러한 압전 현상을 나타내는 소자로는 수정, 전기석, 티탄, 산바륨 등이 있으며, 압전 현상은 초정밀 위치제어기술, 전기음향 변환기, 압전정화, 초음파 가습기 등에 응용되고 있다.Generally, in the field of ultra precise position control technology, a technique of controlling a position using a piezo effect is used. Such a piezoelectric effect refers to a phenomenon in which a voltage is applied to a surface of a piezoelectric element by applying an external force to a specific crystal, and a displacement or a force is generated when a voltage is applied to the crystal. Piezoelectric phenomenon is applied to ultra precise position control technology, electroacoustic transducer, piezoelectric purification, ultrasonic humidifier and so on.
특히, 다계층 압전소자(multilayer piezoactuators)는 센티미터 당 약 10μm의 변형 범위를 가지며, 다양한 분야에 적용하기 위해서는 유연성있는 힌지를 사용하여 압전소자의 작은 변위를 증폭시킬 필요가 있다.In particular, multilayer piezoactuators have a strain range of about 10 [mu] m per centimeter, and it is necessary to amplify a small displacement of the piezoelectric element by using a flexible hinge for various applications.
또한, 일반적으로 변위 증폭 메커니즘은 지렛대 방식의 유연성 힌지 메커니즘과 브릿지 방식의 유연성 힌지 메커니즘의 두가지 방법으로 나누어진다.Generally, the displacement amplification mechanism is divided into two methods: a lever-type flexible hinge mechanism and a bridge-type flexible hinge mechanism.
이와 같은 다계층 압전 소자를 이용한 위치 및 각도 제어 시스템에는 대한민국 특허청에 출원된 출원번호 제10-2009-003728호, 제10-2004-0062092호, 10-2001-0028892호, 등이 있다.Such a position and angle control system using a multi-layer piezoelectric element includes Application Nos. 10-2009-003728, 10-2004-0062092, and 10-2001-0028892 filed in the Korean Intellectual Property Office.
그러나, 종래의 압전 소자를 이용한 각도 및 위치 제어장치는 3차원 평면상의 수평판을 조절하기 힘들고, 모터방식을 이용하는 제어 장치는 초소형으로 제작하기 힘들다는 사용상의 문제점이 존재한다.However, the conventional angle and position control apparatus using a piezoelectric element has difficulty in adjusting the horizontal plate on a three-dimensional plane, and there is a problem in use that it is difficult to manufacture a control apparatus using a motor system in an extremely small size.
이러한 문제점을 해결하기 위하여 특허등록 10-1617284 '압전 소자를 이용한 수평판 조절 장치'가 출원된 바 있으며, 이에 관한 연구가 지속되고 있다.In order to solve such a problem, a patent application No. 10-1617284 entitled " Horizontal Plate Control Apparatus Using Piezoelectric Element " has been filed.
본 발명은 압전 소자를 이용하여 평면의 평형을 정밀 제어할 수 있는 피에조 엑츄에이터식 정밀 제어모듈과 피에조 엑츄에이터식 정밀 제어장치를 제공하는 것을 목적으로 한다.An object of the present invention is to provide a piezoactuator-type precision control module and a piezoactuator-type precision control device which can precisely control the flatness of a plane using a piezoelectric element.
상기한 목적을 달성하기 위한 본 발명은, 상부에 형성된 작동판과; 상기 작동판과 이격되게 하부에 형성된 지지판과; 일측은 상기 작동판에 결합되고 타측은 상기 지지판에 결합되어 상기 결합판과 지지판을 탄성 복원시키는 인장스프링이 형성된 고정 모듈; 그리고, 일측은 상기 작동판에 피벗 결합되고 타측은 상기 지지판에 안착 결합되며, 중심축에 피벗(pivot)홈이 형성된 피에조 브라켓이 상단에 체결되고 상기 고정 모듈의 측면에 세워지는 피에조;를 포함하여 구성되어, 상기 고정 모듈로 상기 지지판과 작동판 사이에 피에조를 기립 고정시켜, 인장력은 상기 피에조가 형성시키고, 인장 복원력은 상기 인장스프링이 형성시키며, 상기 피에조 기립축의 뒤틀림 복원력은 상기 피벗과 피벗홈의 피버팅에 의해 형성되는 피에조 엑츄에이터식 정밀 제어모듈을 기술적 요지로 한다.According to an aspect of the present invention, A support plate formed at a lower portion apart from the operation plate; A fixing module having one side connected to the operation plate and the other side connected to the support plate and having a tension spring for elastically restoring the engagement plate and the support plate; The piezoelectric module includes a piezoelectric bracket fixed to the upper end of the piezoelectric module and pivoted on a side of the fixing module. Wherein the tension force is generated by the piezo, the tensile restoring force is generated by the tension spring, and the torsional restoring force of the piezo set-up shaft is transmitted to the pivot and the pivot groove, A piezoelectric actuator type precision control module formed by fibrating the piezoelectric actuator.
그리고 본 발명은, 바닥 중심부에는 나사홀이 형성되고, 몸체부에는 관통홀이 형성된 컵 2개를 입구가 마주보게 대향시켜 형성시킨 고정부 몸체와, 상기 고정부 몸체 내부에 삽입되며 양측에 결합고리가 형성된 인장스프링과, 상기 고정부 몸체의 관통홀에 삽입되어 상기 인장스프링 양측의 결합고리에 체결되는 체결핀으로 구성된 고정 모듈과; 중심축에 피벗(pivot)홈이 형성된 피에조 브라켓이 상단에 체결되며, 상기 고정 모듈의 측면에 세워지는 피에조와; 상기 고정부 몸체 하부의 나사홀에 하부나사로 체결되고, 상기 피에조 하단 안착홈이 형성된 지지판과; 상기 고정부 몸체 상부의 나사홀에 상부나사로 체결되고, 상기 피벗홈에 피벗이 피버팅(pivoting) 결합된 작동판으로; 구성되어 인장력은 상기 피에조가 형성시키고, 인장 복원력은 상기 인장스프링이 형성시키며, 상기 피에조 축의 복원력은 상기 피벗과 피벗홈의 피버팅에 의해 형성되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어모듈을 또한 기술적 요지로 한다.According to the present invention, there are provided a fixed body formed by screw holes formed in the center of the bottom portion and two through-holes formed in the body portion so as to face each other with the mouth facing each other; And a fastening pin inserted into the through hole of the fixed body and fastened to the coupling ring on both sides of the tension spring; A piezo-electric bracket having a pivotal groove formed on a central axis thereof, the piezo- A supporting plate fixed to the screw hole at the lower portion of the fixed body by a lower screw and having the piezo bottom end receiving groove formed therein; An operation plate fastened to the screw hole on the upper portion of the fixed body by an upper screw and pivotally coupled to the pivotal groove; Wherein the tensile force is formed by the piezo, the tensile restoring force is formed by the tension spring, and the restoring force of the piezo axis is formed by fibrating the pivot and the pivot groove. It is essential.
이때, 상기 피에조 엑츄에이터식 정밀 제어장치는 원판에 상기 지지판을 120°각도로 형성시킨 베이스 플레이트와; 원판에 상기 베이스 플레이트의 지지판에 대향되게 상기 작동판을 120°각도로 형성시킨 척과; 상기 베이스 플레이트의 지지판과 상기 척의 작동판에 체결되는 1조의 고정 모듈과 피에조 3개로; 구성되어 상기 피에조들을 틸딩 구동시켜 상기 척의 법선축을 정밀제어시키는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치로 되는 것이 바람직하다.In this case, the piezoactuator precision control device includes a base plate having the support plate formed at an angle of 120 degrees with respect to the original plate; A chuck having an original plate formed at an angle of 120 ° with the actuating plate facing the supporting plate of the base plate; A pair of fixing modules fastened to the supporting plate of the base plate and the actuating plate of the chuck; And controls the normal axis of the chuck to be precisely controlled by tilting the piezo actuators.
또한, 상기 척에는 진공 라인이 형성되어 상기 척 상단에 거치하는 웨이퍼 유격을 제거하여 피에조 구동 정밀도를 향상시키는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치로 되는 것이 바람직하다.In addition, it is preferable that a vacuum line is formed on the chuck to remove the wafer gap stuck to the chuck top, thereby improving the piezoelectric driving precision.
또한, 상기 척 중심부에는 POGO 핀 보드가 형성되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치로 되는 것이 바람직하다.In addition, it is preferable that the piezoactuator-type precision control device is provided with a POGO pin board at the center of the chuck.
또한, 상기 피벗은 모따기가 형성되어 상기 피벗홈에 모따기 부분이 접촉되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치로 되는 것이 바람직하다.Preferably, the pivot is formed with a chamfer and the chamfered portion is brought into contact with the pivot groove.
상기한 본 발명에 의하면 압전 소자를 이용하여 평면의 평형을 정밀 제어할 수 있는 피에조 엑츄에이터식 정밀 제어모듈과 피에조 엑츄에이터식 정밀 제어장치가 제공되는 이익이 있다.According to the present invention, there is provided a piezoelectric actuator type precision control module and a piezoelectric actuator type precision control device capable of precisely controlling the flatness of a plane using a piezoelectric element.
도 1은 본 발명의 피에조 엑츄에이터식 정밀 제어모듈에 대한 측단면 구조도BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view of a piezoactuator-type precision control module according to the present invention;
도 2는 본 발명의 고정 모듈 정단면 구조도Fig. 2 is a schematic cross-sectional structural view of the fixed module of the present invention
도 3은 본 발명의 피벗홈과 피벗의 작동도Figure 3 shows the operation of the pivot grooves and pivots of the present invention
도 4는 본 발명의 피에조 엑츄에이터식 정밀 제어모듈에서 작동판을 제거한 평면도Fig. 4 is a top view of the piezoactuator precision control module of the present invention,
도 5는 본 발명의 피에조 엑츄에이터식 정밀 제어장치에 대한 측면도5 is a side view of the piezoactuator-type precision control device of the present invention
도 6은 본 발명의 척에 대한 저면도6 is a bottom view of the chuck of the present invention
도 7은 본 발명의 척 부분 측단면 구조도7 is a cross-sectional view of the chuck portion side of the present invention
이하 도면을 참조하여 본 발명에 관하여 살펴보기로 하며, 본 발명을 설명함에 있어서 관련된 공지기술 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략할 것이다. Hereinafter, the present invention will be described with reference to the drawings. In the following description of the present invention, a detailed description of related arts or configurations will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured will be.
그리고 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례 등에 따라 달라질 수 있으므로 그 정의는 본 발명을 설명하는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to be exemplary, self-explanatory, allowing for equivalent explanations of the present invention.
도 1은 본 발명의 피에조 엑츄에이터식 정밀 제어모듈에 대한 측단면 구조도이며, 도 2는 본 발명의 고정 모듈 정단면 구조도이며, 도 3은 본 발명의 피벗홈과 피벗의 작동도이며, 도 4는 본 발명의 피에조 엑츄에이터식 정밀 제어모듈에서 작동판을 제거한 평면도이며, 도 5는 본 발명의 피에조 엑츄에이터식 정밀 제어장치에 대한 측면도이며, 도 6은 본 발명의 척에 대한 저면도이며, 도 7은 본 발명의 척 부분 측단면 구조도이다.FIG. 1 is a side sectional view of a piezoactuator precision control module of the present invention, FIG. 2 is a front view of a fixed module of the present invention, FIG. 3 is an operation diagram of a pivot groove and a pivot of the present invention, 6 is a bottom view of the chuck according to the present invention, and Fig. 7 is a side view of the chuck according to the present invention. Fig. 7 is a side view of the piezoactuator- Sectional side view of the chuck part of the present invention.
도면에 도시된 바와 같이 본 발명은 고정 모듈(20)과 피에조(10)와 지지판(30)과 작동판(500)으로 구성된다.As shown in the drawing, the present invention comprises a fixing module 20, a piezo 10, a support plate 30, and an actuating plate 500.
본 발명의 고정 모듈(20)은 도 1과 도 2에 도시된 바와 같이 고정부 몸체(21)와 인장스프링(22)으로 구성되는데, 상기 고정부 몸체(21)는 2개의 컵을 입구가 마주보게 대향시켜 형성된다.1 and 2, the fixing module 20 of the present invention comprises a fixed body 21 and a tension spring 22. The fixed body 21 has two cups, So as to face each other.
상기 고정부 몸체(21)를 형성하는 컵은 바닥 중심부에는 나사홀(24)이 형성되고, 몸체부에는 관통홀(230)이 형성된다.A screw hole 24 is formed in the center of the bottom of the cup forming the fixed body 21 and a through hole 230 is formed in the body of the cup.
즉, 고정부 몸체(21)는 도 1에 도시된 바와 같이 양단이 막힌 원통의 중심부를 절단시킨 것과 동일 구조로서, 원통축 방향의 양단에 나사홀(24)이 개통되고, 원주에는 관통홀(230)이 형성된다.That is, as shown in Fig. 1, the fixed body 21 has the same structure as that of cutting the central portion of the cylinder with both ends closed, and has threaded holes 24 at both ends in the cylindrical axial direction, 230 are formed.
상기 인장스프링(22)은 고정부 몸체(21) 내부에 삽입되며 양측에 결합고리(220)가 형성되어 당김운동에 대항하여 복원되는 스프링이다.The tension spring 22 is inserted into the fixed body 21 and formed with coupling rings 220 on both sides thereof to be restored against the pulling motion.
상기 인장스프링(22)은 도 2에 도시된 바와 같이 체결핀(23)을 상기 고정부 몸체(21)의 관통홀(230)을 통해 양측의 결합고리(220)에 체결시킴으로써 상기 고정부 몸체(21) 내부에 결합된다.2, the tension spring 22 fastens the fastening pins 23 to the fastening bosses 220 on both sides through the through holes 230 of the fastening body 21, 21).
본 발명의 피에조(10)에는 상단에 피벗(pivot)홈(110)이 형성된 피에조 브라켓(11)이 체결되는데, 상기 피벗 홈(110)은 상기 피에조 브라켓(11) 중심에 형성된다.A piezo bracket 11 having a pivot groove 110 formed at its upper end is coupled to the piezo 10 of the present invention. The pivot groove 110 is formed at the center of the piezo-electric bracket 11.
상기 피에조(10)와 고정 모듈(20)은 도 1에 도시된 바와 같이 지지판(30)과 작동판(500)에 지지되어 이웃하여 나란히 세워진다.The piezo 10 and the fixing module 20 are supported by the support plate 30 and the actuating plate 500 as shown in FIG.
도 1과 도 2에 도시된 바와 같이 상기 지지판(30)에는 이를 위하여 하부나사 체결통공(31)이 형성되어 상기 고정부 몸체(21) 하부의 나사홀(24)에 하부나사(80)로 체결되고, 상기 피에조 하단이 삽입되는 안착홈(32)이 형성된다.1 and 2, a lower screw fastening hole 31 is formed in the support plate 30 so as to be fastened to the screw hole 24 in the lower portion of the fixed body 21 with a lower screw 80. [ And a seating groove 32 into which the lower end of the piezo is inserted is formed.
또한, 상기 작동판(500)에는 제1 상부나사 체결통공(700-1)이 마련되고 피벗(60)이 체결되어, 고정부 몸체(21) 상부의 나사홀(24)을 통해 상부나사(70)로 체결되고, 상기 피벗 홈(110)에 피벗(60)이 피버팅(pivoting) 결합된다.The operation plate 500 is provided with a first upper screw fastening hole 700-1 and a pivot 60 is fastened to the upper plate 100 through a screw hole 24 in the upper portion of the fixed body 21. [ And the pivot 60 is pivotally coupled to the pivot groove 110. [
이와 같이 구성되는 본 발명에 의하면, 인장력은 상기 피에조(10)가 형성시키고, 인장 복원력은 상기 인장스프링(22)이 형성시키며, 상기 인장스프링(22)의 작용으로 고정 모듈(20)에 의해 피에조(10)가 고정된 장치가 제공된다.According to the present invention configured as described above, the tensile force is formed by the piezo 10, the tensile restoring force is formed by the tension spring 22, (10) is fixed.
특히, 도 3에 도시된 바와 같이 상기 피벗 홈(110)과 피벗(60)의 피버팅 결합에 의하여 피에조(10)의 인장, 복원에 의한 기립축(A) 변동이 발생되어도 상기 인장스프링(22)에 의한 복원력(C)과 피벗(60)과 피벗 홈(110)의 피버팅 운동(D)에 의해 축 복원이 형성된다.Particularly, as shown in FIG. 3, even if the rising shaft A fluctuates due to the tension and restoration of the piezo 10 due to the fitting engagement of the pivot groove 110 and the pivot 60, the tension spring 22 The restoring force C by the pivot 60 and the firing motion D of the pivot groove 110 are formed.
즉, 피에조(10)의 기립축(A)이 뒤틀어져도 상기 인장스프링(22)에 의한 복원력(C)이 피벗(60)과 피벗 홈(110)에 피버팅 운동(D)으로 작동되어 피벗 홈(110) 중심으로 피벗(60)이 미끌림 운동되어 기립축 복원이 이루어진다.That is, even if the standing axis A of the piezo 10 is distorted, the restoring force C by the tension spring 22 is acted on the pivot 60 and the pivot groove 110 as a moving motion D, The pivot 60 is slid to the center of the pivot shaft 110 to restore the standing axis.
본 발명은 상기 기립축(A) 복원을 향상시키기 위하여 상기 피벗(60)에는 모따기(600)를 형성시켜 상기 피벗 홈(110)에 모따기(600) 부분이 선접촉되게 한다.The chamfer 600 may be formed on the pivot 60 to improve the recovery of the standing axis A. The chamfer 600 may be linearly contacted to the pivot 110.
이에 따라 상기 피벗(60) 모따기(600) 경사와 피벗 홈(110) 경사에 의한 미끌림 운동이 가속되는 효과가 있으므로 피에조(10)가 기립축에서 벗어나는 경우에 신속한 복원이 이루어진다.Accordingly, since the slope of the pivot 60 chamfer 600 and the slope of the pivot groove 110 are accelerated, rapid restoration can be performed when the piezo 10 deviates from the standing axis.
본 발명은 이와 같이 피에조(10)와 고정 모듈(20)을 지지판(30)과 작동판(500)으로 이웃하여 평행하게 기립형성시킴으로써, 1조의 고정 모듈과 피에조로 구성되어 피에조 기립축을 제어하는 피에조 엑츄에이터식 정밀 제어모듈이 된다.The present invention is characterized in that the piezoelectric module 10 and the fixing module 20 are formed parallel to each other in the vicinity of the supporting plate 30 and the actuating plate 500 to form a pair of fixing modules and a piezo Actuator-type precision control module.
본 발명은 이를 더 확장하여 3 다리(leg)에 지지되는 원판형 척(50)의 평형을 제어하는 엑츄에이터 모듈로 형성시킬 수 있는데, 이 경우에는 원판형 척(50)의 법선축을 제어하는 피에조 엑츄에이터식 정밀 제어장치가 된다.The present invention can be further extended to form an actuator module for controlling the balance of the disk-shaped chuck 50 supported on three legs. In this case, the piezo-actuator 50, which controls the normal axis of the disk-shaped chuck 50, And becomes an expression precision control device.
이와 같은 원판형 척(50)의 법선축을 제어하는 피에조 엑츄에이터식 정밀 제어장치는 도 5에 도시된 바와 같이 베이스 플레이트(40)와 척(50)과 상기 피에조 엑츄에이터식 정밀 제어모듈 3개로 구성된다.The piezoelectric actuator type precision control device for controlling the normal axis of the disk-shaped chuck 50 is composed of the base plate 40, the chuck 50, and three piezoactuator precision control modules as shown in FIG.
이때, 각 피에조 엑츄에이터식 정밀 제어모듈은 원판형 척(50)의 다리가 되어 도 5에 도시된 바와 같이 척(50)과 베이스 플레이트 사이에 120°각도로 등각 결합된다.At this time, each of the piezoactuator-type precision control modules is equiangularly coupled at 120 degrees between the chuck 50 and the base plate as a leg of the disk-shaped chuck 50 as shown in Fig.
이를 위하여 상기 척(50)의 하부에는 상기 피에조 엑츄에이터식 정밀 제어모듈의 제2 상부나사 체결통공(700)과 피벗(60)이 120°각도로 형성되어진다. To this end, a second upper screw coupling hole 700 and a pivot 60 of the piezoactuator-type precision control module are formed at an angle of 120 ° below the chuck 50.
이와 같은 구성에 의하면 도 5와 도 6에 도시된 바와 같이 상기 척(50)은 3개의 피에조 엑츄에이터식 정밀 제어모듈이 120°각도로 배치되어 공유하는 작동판이 되는데, 이는 본 발명이 상기 원판형 척(50)의 하부에 각 피에조 엑츄에이터식 정밀 제어모듈의 작동판(500)을 독립 결합시키는 구조를 배제하는 의미가 아니라, 원판형 척(50)의 평형 제어 정밀도 향상을 위하여 작동판(500)을 공유하는 구조를 채택한 것일 뿐이다.5 and 6, the chuck 50 is an actuating plate shared by the three piezoactuator precision control modules arranged at an angle of 120 degrees. This is because when the present invention is applied to the disk- It is not meant to exclude the structure in which the actuating plate 500 of each piezoactuator type precision control module is independently coupled to the lower portion of the actuating plate 500. In order to improve the balance control precision of the chuck plate 50, It is merely adopting a shared structure.
이와 같은 구조에 의하면, 각 피에조 엑츄에이터식 정밀 제어모듈들을 정밀 틸딩 구동시켜 상기 척(50)의 법선축을 정밀제어시키는 피에조 엑츄에이터식 정밀 제어장치가 구성된다.According to this structure, the piezoactuator-type precision control device for precisely controlling the normal axis of the chuck 50 by precisely driving each piezoactuator-type precision control module is constituted.
이때, 상기 척(50)에는 도 7에 도시된 바와 같이 진공 라인(510)을 형성시켜 상기 척(50) 상단에 거치하는 웨이퍼를 진공 흡착시킴으로써, 척(50) 상단과 웨이퍼간 유격을 제거하여 피에조 구동에 의한 척(50)의 평형이 웨이퍼의 평형으로 연결될 수 있게 하여 웨이퍼 평형제어 정밀도가 향상될 수 있게 한다.7, a vacuum line 510 is formed on the chuck 50 to vacuum-adsorb the wafer placed on the upper end of the chuck 50 to remove the gap between the upper end of the chuck 50 and the wafer The balance of the chuck 50 by piezo driving can be connected to the equilibrium of the wafer so that the wafer balance control precision can be improved.
척(50)의 진공 라인(510)은 1mm × 1mm 정방구조로 설계하며 웨이퍼 대상이 아니기 때문에 Single 구조로 드릴링을 하면 된다,The vacuum line 510 of the chuck 50 is designed to have a square structure of 1 mm x 1 mm and is not a wafer target,
또한, 상기 척(50) 중심부에는 POGO 핀 보드(520)가 형성되어 거치되는 웨이퍼에 접촉될 수 있게 하는 것이 바람직하다.In addition, it is preferable that a POGO pin board 520 is formed at the center of the chuck 50 so that the POGO pin board 520 can be contacted to the wafer to be mounted.
일실시예로서 상기 척(50)은 Al 재질로 제작되며, 지름 300mm 웨이퍼를 탑재하는 카트리지를 틸팅시킬 수 있도록 306mm로 하며, 척(50)의 정 중앙은 카트리지로부터 전달되는 대신호(전원 및 쉴드선)를 송수신할 수 있도록 Interpose가 가능한 POGO 핀이 세팅된 POGO 핀 보드(520)를 안착할 수 있도록 하는 구조로 설계 제작된다.The chuck 50 is made of Al and has a diameter of 306 mm so that a cartridge for mounting a wafer having a diameter of 300 mm can be tilted. The center of the chuck 50 is connected to an arc The POGO pin board 520 with the interposable POGO pin can be seated to receive and transmit the POGO pin.
이상 본 발명의 설명을 위하여 도시된 도면은 본 발명이 구체화되는 하나의 실시예로서 도면에 도시된 바와 같이 본 발명의 요지가 실현되기 위하여 다양한 형태의 조합이 가능함을 알 수 있다.It will be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.
따라서 본 발명은 상기한 실시예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 바와 같이 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경실시가 가능한 범위까지 본 발명의 기술적 정신이 있다고 할 것이다. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that the technical spirit of the present invention is to the extent possible.

Claims (7)

  1. 상부에 형성된 작동판과;An operation plate formed on the upper portion;
    상기 작동판과 이격되게 하부에 형성된 지지판과;A support plate formed at a lower portion apart from the operation plate;
    일측은 상기 작동판에 결합되고 타측은 상기 지지판에 결합되어 상기 결합판과 지지판을 탄성 복원시키는 인장스프링이 형성된 고정 모듈; 그리고, A fixing module having one side connected to the operation plate and the other side connected to the support plate and having a tension spring for elastically restoring the engagement plate and the support plate; And,
    일측은 상기 작동판에 피벗 결합되고 타측은 상기 지지판에 안착 결합되며, 중심축에 피벗(pivot)홈이 형성된 피에조 브라켓이 상단에 체결되고 상기 고정 모듈의 측면에 세워지는 피에조;를 포함하여 구성되어, And a piezo-electric bracket fixed to the upper end of the piezo-electric module and pivotally mounted on the support plate, the piezo- ,
    상기 고정 모듈로 상기 지지판과 작동판 사이에 피에조를 기립 고정시켜, 인장력은 상기 피에조가 형성시키고, 인장 복원력은 상기 인장스프링이 형성시키며, 상기 피에조 기립축의 뒤틀림 복원력은 상기 피벗과 피벗홈의 피버팅에 의해 형성되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어모듈.Wherein the piezoelectric module is fixed by the fixed module between the support plate and the actuating plate so that the tensile force is formed by the piezo and the tensile restoring force is generated by the tension spring and the twist restoring force of the piezo- Wherein the piezoelectric actuator is formed by a piezoelectric actuator.
  2. 바닥 중심부에는 나사홀이 형성되고, 몸체부에는 관통홀이 형성된 컵 2개를 입구가 마주보게 대향시켜 형성시킨 고정부 몸체와, 상기 고정부 몸체 내부에 삽입되며 양측에 결합고리가 형성된 인장스프링과, 상기 고정부 몸체의 관통홀에 삽입되어 상기 인장스프링 양측의 결합고리에 체결되는 체결핀으로 구성된 고정모듈과;A fixed body formed by screw holes formed in the center of the bottom portion and having two through holes formed in the body portion so as to face the inlet so as to face each other; a tension spring inserted into the fixed body and formed with coupling rings on both sides; And a fastening pin inserted into the through hole of the fixed body and fastened to the coupling ring on both sides of the tension spring;
    중심축에 피벗(pivot)홈이 형성된 피에조 브라켓이 상단에 체결되며, 상기 고정 모듈의 측면에 세워지는 피에조와;A piezo-electric bracket having a pivotal groove formed on a central axis thereof, the piezo-
    상기 고정부 몸체 하부의 나사홀에 연통되는 하부나사 체결통공이 형성되어 하부나사로 상기 고정부 몸체 하부와 체결되고, 상기 피에조 하단 안착홈이 형성된 지지판과;A supporting plate formed with a lower screw coupling hole communicating with a screw hole at a lower portion of the fixed body and fastened to a lower portion of the fixed body with a lower screw, the lower groove receiving groove being formed;
    제1 상부나사 체결통공과 피벗이 형성된 판으로서, 상기 고정부 몸체 상부의 나사홀에 관통하여 상기 제1 상부나사 체결통공에 상부나사로 체결되고, 상기 피벗홈에 상기 피벗이 피버팅(pivoting) 결합된 작동판으로;A plate having a first upper screw fastening hole and a pivot formed thereon, the plate fastening to the first upper screw fastening hole through a threaded hole in the upper portion of the fastening body and fastened to the upper screw by the upper screw, With a working plate;
    구성되어 상기 고정 모듈로 상기 지지판과 작동판 사이에 피에조를 기립 고정시켜, 인장력은 상기 피에조가 형성시키고, 인장 복원력은 상기 인장스프링이 형성시키며, 상기 피에조 기립축의 뒤틀림 복원력은 상기 피벗과 피벗홈의 피버팅에 의해 형성되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어모듈.Wherein the tension force is generated by the piezo, the tensile restoring force is generated by the tension spring, and the distortion restoring force of the piezo-standing axis is transmitted to the pivot and the pivot groove Wherein the piezoelectric actuator is formed by fibrating.
  3. 제1항 또는 제2항에 있어서,       3. The method according to claim 1 or 2,
    원판형 척과 원판형 베이스 플레이트 사이에 제1항의 피에조 엑츄에이터식 정밀 제어모듈 3개를 120°각도로 결합시켜 Three piezoactuator precision control modules of the first claim are interposed between the disk-shaped chuck and the disk-shaped base plate at an angle of 120 °
    상기 피에조 엑츄에이터식 정밀 제어모듈의 틸딩 구동으로 상기 척의 법선축을 정밀제어시키는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치.Wherein the normal axis of the chuck is precisely controlled by tilting drive of the piezoactuator-type precision control module.
  4. 제3항에 있어서The method of claim 3, wherein
    상기 척의 하부에는 상기 피에조 엑츄에이터식 정밀 제어모듈의 제2 상부나사 체결통공과 피벗이 120°각도로 형성되어 And a second upper screw fastening hole and a pivot of the piezoactuator-type precision control module are formed at an angle of 120 degrees at a lower portion of the chuck
    상기 척이 3개의 피에조 엑츄에이터식 정밀 제어모듈의 공통 작동판이 되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치.Wherein the chuck is a common operating plate of three piezoactuator precision control modules.
  5. 제4항에 있어서 The method of claim 4, wherein
    상기 척에는 진공 라인이 형성되어 상기 척 상단에 거치하는 웨이퍼 유격을 제거하여 피에조 구동 정밀도를 향상시키는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치.Wherein a vacuum line is formed on the chuck to remove a wafer gap stuck to an upper end of the chuck to improve the piezoelectric driving precision.
  6. 제5항에 있어서 상기 척 중심부에는6. The chuck according to claim 5,
    POGO 핀 보드가 형성되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치.And a POGO pin board is formed on the piezoelectric actuator.
  7. 제4항 내지 제6항 중 어느 하나의 항에 있어서 상기 피벗은7. A device according to any one of claims 4 to 6,
    모따기가 형성되어 상기 피벗홈에 모따기 부분이 접촉되는 것을 특징으로 하는 피에조 엑츄에이터식 정밀 제어장치.Wherein a chamfer is formed and the chamfered portion is brought into contact with the pivot groove.
PCT/KR2018/011979 2017-10-25 2018-10-11 Piezoelectric actuator-type precision control module and piezoelectric actuator-type precision control device WO2019083200A1 (en)

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Publication number Priority date Publication date Assignee Title
US3858440A (en) * 1972-11-29 1975-01-07 Productronix Inc Stress transducer mounting and method of adjustment
JP2001022445A (en) * 1999-07-13 2001-01-26 Olympus Optical Co Ltd Displacement enlarging mechanism
KR20020061236A (en) * 2001-01-15 2002-07-24 박영필 Stack Type Piezoelectric Actuator
JP2007530922A (en) * 2004-02-20 2007-11-01 トーラブズ・インコーポレーテッド Positioning device
KR101221945B1 (en) * 2011-07-05 2013-01-15 한국기계연구원 Displacement amplifying device capable of compensating micro deformation according to applying pre-load

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3858440A (en) * 1972-11-29 1975-01-07 Productronix Inc Stress transducer mounting and method of adjustment
JP2001022445A (en) * 1999-07-13 2001-01-26 Olympus Optical Co Ltd Displacement enlarging mechanism
KR20020061236A (en) * 2001-01-15 2002-07-24 박영필 Stack Type Piezoelectric Actuator
JP2007530922A (en) * 2004-02-20 2007-11-01 トーラブズ・インコーポレーテッド Positioning device
KR101221945B1 (en) * 2011-07-05 2013-01-15 한국기계연구원 Displacement amplifying device capable of compensating micro deformation according to applying pre-load

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