WO2019080397A1 - 摄像头感光组件、摄像头和摄像终端 - Google Patents

摄像头感光组件、摄像头和摄像终端

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Publication number
WO2019080397A1
WO2019080397A1 PCT/CN2018/074525 CN2018074525W WO2019080397A1 WO 2019080397 A1 WO2019080397 A1 WO 2019080397A1 CN 2018074525 W CN2018074525 W CN 2018074525W WO 2019080397 A1 WO2019080397 A1 WO 2019080397A1
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WIPO (PCT)
Prior art keywords
pixel
microprism
sub
color
pixels
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Ceased
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PCT/CN2018/074525
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English (en)
French (fr)
Inventor
李国盛
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Application filed by Beijing Xiaomi Mobile Software Co Ltd filed Critical Beijing Xiaomi Mobile Software Co Ltd
Priority to JP2018544922A priority Critical patent/JP6738904B2/ja
Priority to KR1020187037980A priority patent/KR102172944B1/ko
Priority to RU2018127558A priority patent/RU2686578C1/ru
Publication of WO2019080397A1 publication Critical patent/WO2019080397A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B1/00—Film strip handling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters

Definitions

  • Embodiments of the present disclosure relate to the field of imaging technologies, and in particular, to a camera photosensitive component, a camera, and an imaging terminal.
  • the camera photosensitive component includes red, green and blue RGB filters, and the light is filtered by the RGB filter and injected into the photosensitive surface of the pixel.
  • embodiments of the present disclosure provide a camera photosensitive component, a camera, and an imaging terminal.
  • a camera photosensitive assembly comprising: a silicon substrate layer, a pixel array layer attached to one side of the silicon substrate layer, and the pixel array a layer of microprisms arranged in parallel with each other;
  • the microprisms in the microprism layer are configured to decompose incident light into m color lights, and the n color lights of the emitted m color lights are respectively injected into subpixels of corresponding colors in pixels corresponding to the microprisms. , n ⁇ m.
  • each microprism corresponds to one pixel, and the pixel includes n sub-pixels;
  • the microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light are respectively incident into the sub-pixels of the corresponding color in the pixel.
  • a bottom surface of the microprism is perpendicular to a plane of the pixel array layer, and a refractive index of the corresponding color is sequentially set in a direction along a vertex of the microprism pointing to the bottom surface of the pixel. The n sub-pixels arranged in a large order.
  • each adjacent two microprisms corresponds to two adjacent pixels, wherein the first pixel and the second pixel each include n sub-pixels, and the first pixel and the second pixel The nth sub-pixel is adjacent;
  • the first microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light are respectively injected into the subpixels of the corresponding color in the first pixel
  • second The microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light are respectively incident into the subpixels of the corresponding color in the second pixel.
  • a bottom surface of the first microprism and a bottom surface of the second microprism are opposite and parallel, and a bottom surface of the first microprism is perpendicular to a plane of the pixel array layer, and the second microprism The bottom surface is perpendicular to the plane of the pixel array layer;
  • the n sub-pixels arranged in the order of decreasing refractive index of the corresponding color are sequentially arranged in a direction in which the apex of the first microprism is directed to the bottom surface
  • the second pixel The n sub-pixels arranged in the order of decreasing refractive index of the corresponding color are sequentially disposed in a direction in which the apex of the second microprism is directed to the bottom surface.
  • each two adjacent microprisms correspond to two adjacent pixels, the first pixel and the second pixel comprise a total of 2n-1 sub-pixels, and the first pixel and the second pixel share the same n sub-pixels;
  • the first microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light respectively enter the n-1 subpixels of the corresponding color in the first pixel and Among the nth sub-pixels shared, the second microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light are respectively incident on the second pixel.
  • the second microprism is configured to decompose the incident light into the m color lights, and the n color lights of the emitted m color light are respectively incident on the second pixel.
  • a bottom surface of the first microprism and a bottom surface of the second microprism are opposite and parallel, and a bottom surface of the first microprism is perpendicular to a plane of the pixel array layer, and the second microprism The bottom surface is perpendicular to the plane of the pixel array layer;
  • the n-1 sub-pixels and the common place arranged in the order of the refractive index of the corresponding color are sequentially arranged in the direction in which the vertex of the first microprism is directed to the bottom surface.
  • the camera photosensitive component further includes a microlens layer, the microlens layer being located between the pixel array layer and the microprism layer;
  • the microprism is configured to decompose the incident light into the m color lights and emit the light;
  • the microlens in the microlens layer is configured to emit n colors of the m kinds of color lights emitted by the microprisms, each of which is separately condensed and respectively injected into a corresponding color of the pixel corresponding to the microprism In the sub-pixels.
  • the camera photosensitive component further includes a microlens layer, the microlens layer is relatively parallel to the microprism layer, and the microlens layer is not adjacent to the pixel array layer;
  • the microlens in the microlens layer is configured to converge the incident light and emit it;
  • the microprism is configured to decompose the concentrated light emitted by the microlens into the m kinds of color lights, and emit the n kinds of color light into the corresponding color of the pixel corresponding to the microprism. In the sub-pixels.
  • the microprism layer is formed by arranging individual microprisms.
  • the microprism layer is formed by etching a substrate of a predetermined material.
  • a camera comprising the camera photosensitive assembly of the first aspect.
  • an image pickup terminal comprising the camera of the second aspect.
  • the incident light is decomposed into m kinds of color light by the microprism, and the n color lights of the emitted m color light are respectively injected into the sub-pixels of the corresponding color in the pixel corresponding to the microprism, so that n kinds of micro-prism can be decomposed.
  • Color light instead of absorbing a part of the color light through the RGB filter, can obtain n kinds of color light, which can improve the transmittance of the color light entering the pixel, thereby reducing the exposure time required for imaging, thereby improving the shooting effect under low light conditions. It can also improve the shooting effect on moving objects.
  • the first pixel and the second pixel share the nth sub-pixel. Since the area of the shared sub-pixel is larger, the photosensitive area of the sub-pixel can be increased, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging. .
  • the microlens layer is located between the pixel array layer and the microprism layer, such that the microlens lens layer can separately converge each of the n color lights emitted by the microprism layer into the corresponding pixels of the microprism.
  • the microlens lens layer can separately converge each of the n color lights emitted by the microprism layer into the corresponding pixels of the microprism.
  • the microprism layer is formed by etching a substrate of a predetermined material, so that it is not necessary to fabricate and arrange microprisms similar in size to the pixel, which can reduce the difficulty in realizing the microprism layer.
  • FIG. 1 is a schematic structural view of a camera photosensitive member according to related art
  • FIG. 2 is a schematic structural diagram of a camera photosensitive assembly according to an exemplary embodiment
  • FIG. 3 is a schematic structural diagram of a camera photosensitive assembly according to an exemplary embodiment
  • FIG. 4 is a schematic structural diagram of a camera photosensitive assembly according to an exemplary embodiment
  • FIG. 5 is a schematic structural diagram of a camera photosensitive assembly according to an exemplary embodiment
  • FIG. 6 is a schematic structural diagram of a camera photosensitive assembly according to an exemplary embodiment
  • FIG. 7 is a block diagram of an apparatus equipped with a camera photosensitive assembly, according to an exemplary embodiment.
  • FIG. 1 is a schematic structural view of a camera photosensitive assembly according to the related art, the camera photosensitive assembly including a silicon substrate layer, a pixel array layer attached to one side of the silicon substrate layer, and being disposed in parallel with the pixel array layer
  • the RGB filter layer is a microlens layer disposed in parallel with the RGB filter layer, and the microlens layer is not adjacent to the pixel array layer.
  • one pixel may include three or four or even more sub-pixels, and one pixel includes three sub-pixels as an example, and the three sub-pixels are a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively.
  • one RGB filter includes three filters, a red filter, a green filter and a blue filter. A microlens is disposed above each of the filters.
  • the incident light rays are perpendicularly incident on each of the microlenses in the microlens layer, and each microlens refracts the incident light into a corresponding filter below, the red filter absorbs light other than the red light, and the red light is incident on the red light.
  • the green filter absorbs light other than green light and emits green light into the green sub-pixel;
  • the blue filter absorbs light other than blue light and emits blue light into blue In the sub-pixel.
  • the transmittance of incident light passing through the RGB filter is very low, about 40% on average, and the remaining 60% of the light is absorbed, resulting in a longer exposure time required for imaging.
  • This application is through Figures 2-6.
  • the illustrated embodiment addresses the above problems.
  • FIG. 2 is a schematic structural diagram of a camera photosensitive component according to an exemplary embodiment.
  • the camera photosensitive component can be implemented as a camera.
  • the camera is applied to a camera terminal.
  • the camera photosensitive component includes: silicon. a substrate layer 210, a pixel array layer 220 attached to one side of the silicon substrate layer 210, and a microprism layer 230 disposed opposite to the pixel array layer 220;
  • the microprisms 231 in the microprism layer 230 are arranged to decompose incident light into m color lights, and the n color lights of the emitted m color light are respectively incident into the subpixels of the corresponding colors in the pixels corresponding to the microprisms 231, n ⁇ m.
  • the value of m may be 7 or other values, which is not limited in this embodiment.
  • the microprism 231 can decompose the incident light into seven colors of light.
  • one pixel may include three or four or even more sub-pixels. Taking one pixel including three sub-pixels as an example for description, each microprism 231 in the microprism layer 230 is configured to decompose incident light. After the seven colors of light are emitted, the emitted red light is incident on the red sub-pixel 221 of the pixel corresponding to the microprism 231, the emitted green light is incident on the green sub-pixel 222 of the pixel, and the emitted blue light is incident on the blue of the pixel. In the sub-pixel 223.
  • the camera photosensitive assembly decomposes the incident light into m color lights through the microprism, and the n color lights of the emitted m color lights are respectively injected into the corresponding colors of the pixels corresponding to the microprism.
  • n kinds of color lights can be decomposed by the microprism, instead of absorbing a part of the color light by the RGB filter to obtain n kinds of color lights, the transmittance of the color light entering the pixel can be improved, thereby reducing the imaging required.
  • the exposure time can further improve the shooting effect under low light conditions, and can also improve the shooting effect on moving objects.
  • the camera photosensitive component comprises: a silicon substrate layer 210, a pixel array layer 220 attached to one side of the silicon substrate layer 210, and a microprism layer 230 disposed opposite to the pixel array layer 220.
  • Pixel array layer 220 includes an array of pixels, each pixel comprising three or four or even more sub-pixels.
  • the three sub-pixels may be a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively.
  • the four sub-pixels are a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a yellow sub-pixel, respectively, or the four sub-pixels are a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively.
  • a side on which the silicon substrate layer 210 and the pixel array layer 220 are attached is provided with a groove, and each sub-pixel in each pixel is located in one groove.
  • the microprisms 231 in the microprism layer 230 are arranged to decompose incident light into m color lights, and the n color lights of the emitted m color light are respectively incident into the subpixels of the corresponding colors in the pixels corresponding to the microprisms 231, n ⁇ m.
  • the value of m may be 7 or other values, which is not limited in this embodiment.
  • the microprism 231 can decompose the incident light into seven colors of light.
  • each microprism 231 in the microprism layer 230 is configured to decompose incident light into seven colors of light and emit the emitted red light into the pixel corresponding to the microprism 231.
  • the emitted green light is incident on the green sub-pixel 222 of the pixel
  • the emitted blue light is incident on the blue sub-pixel 223 of the pixel.
  • the microprism layer 230 is configured to decompose the incident light into the pixel, so that the n kinds of color lights can be decomposed by the microprism 231, instead of absorbing a part of the color light through the RGB filter to obtain n kinds of color lights, thereby improving the color light incident.
  • the transmittance of the pixel thereby reducing the exposure time required for imaging, thereby improving the shooting effect under low light conditions, and also improving the shooting effect on moving objects.
  • the positional relationship between the microprisms 231 and the pixels may be various. This embodiment is described by taking three of them as an example.
  • each microprism 231 corresponds to one pixel, and the pixel includes n sub-pixels.
  • the microprism 231 is configured to decompose incident light into m color lights and emit it, and the emitted m
  • the n color lights of the color light are respectively incident into the sub-pixels of the corresponding color in the pixel.
  • the red light emitted by the microprism 231 is incident on the red sub-pixel 221 of the pixel, and the emitted green light is incident on the green sub-pixel 222 of the pixel, and the emitted blue light is emitted.
  • the blue sub-pixel 223 of the pixel is incident on the red sub-pixel 221 of the pixel.
  • FIG. 2 wherein the bottom surface 232 of the microprism 231 is perpendicular to the plane of the pixel array layer 220, and the refractive index of the corresponding color is sequentially set in the pixel along the direction from the vertex 233 of the microprism 231 to the bottom surface 232.
  • the direction of the dotted arrow in the figure is the direction in which the vertex 233 of the microprism 231 points toward the bottom surface 232.
  • the red sub-pixels are sequentially arranged in the pixel along the vertex 233 of the microprism 231 pointing in the direction of the bottom surface 232.
  • each adjacent two microprisms 231 correspond to two adjacent pixels, wherein the first pixel and the second pixel each include n sub-pixels, and the first pixel and the second pixel
  • the nth sub-pixel in the pixel is adjacent to each other;
  • the first microprism 231 is configured to decompose the incident light into m color lights, and the n color lights of the emitted m color light are respectively injected into the sub-pixels of the corresponding color in the first pixel.
  • the second microprism 231 is configured to decompose the incident light into m color lights, and the n color lights of the emitted m color light are respectively incident on the sub-pixels of the corresponding color in the second pixel.
  • the red light emitted by the first microprism 231 is incident on the red sub-pixel 221 of the first pixel, and the emitted green light is incident on the green sub-pixel 222 of the first pixel.
  • the emitted blue light is incident on the blue sub-pixel 223 of the first pixel;
  • the red light emitted by the second microprism 231 is incident on the red sub-pixel 221 of the second pixel, and the emitted green light is incident on the green of the second pixel.
  • the blue light emitted from the sub-pixel 222 is incident on the blue sub-pixel 223 of the second pixel.
  • the bottom surface 232 of the first microprism 231 and the bottom surface 232 of the second microprism 231 are opposite and parallel, and the bottom surface 232 of the first microprism 231 is perpendicular to the plane of the pixel array layer 220, and the second microprism
  • the bottom surface 232 of the 231 is perpendicular to the plane of the pixel array layer 220.
  • the first pixel is arranged in the order of the refractive index of the corresponding color from the smallest to the largest in the direction of the vertex 233 of the first microprism 231 pointing toward the bottom surface 232.
  • n sub-pixels arranged in the order of decreasing refractive index of the corresponding color are sequentially disposed in the direction of the vertex 233 of the second microprism 231 pointing toward the bottom surface 232.
  • the direction of the dotted arrow on the left side of the figure is the direction in which the vertex 233 of the first microprism 231 points toward the bottom surface 232
  • the direction of the dotted arrow on the right side is the direction in which the vertex 233 of the second microprism 231 points toward the bottom surface 232.
  • the first pixel is sequentially oriented in the direction of the bottom surface 232 along the vertex 233 of the first microprism 231.
  • a red sub-pixel 221, a green sub-pixel 222, and a blue sub-pixel 223 are disposed.
  • the second sub-pixel 221 and the green sub-pixel 222 are disposed in the second pixel along the direction in which the vertex 233 of the second microprism 231 points toward the bottom surface 232.
  • the blue sub-pixel 223 has a blue sub-pixel 223 in the first pixel adjacent to the blue sub-pixel 223 in the second pixel.
  • each adjacent two microprisms 231 correspond to two adjacent pixels, the first pixel and the second pixel comprise a total of 2n-1 sub-pixels, and the first pixel and the second pixel
  • the first microprism 231 is configured to decompose the incident light into m color lights, and the n color lights of the emitted m color light respectively enter the n-1 sub-pixels of the corresponding color in the first pixel and
  • the second microprism 231 is configured to decompose the incident light into m color lights, and the n color lights of the emitted m color light respectively enter the n-1 sub-pixels of the corresponding color in the second pixel.
  • the nth sub-pixel shared is configured to decompose the incident light into m color lights, and the n color lights of the emitted m color light respectively enter the n-1 sub-pixels of the corresponding color in the second pixel.
  • the red light emitted by the first microprism 231 is incident on the red sub-pixel 221 of the first pixel, and the emitted green light is incident on the green sub-pixel 222 of the first pixel.
  • the emitted blue light is incident on the common blue sub-pixel 223;
  • the red light emitted by the second microprism 231 is incident on the red sub-pixel 221 of the second pixel, and the emitted green light is incident on the green sub-pixel of the second pixel.
  • the blue light emitted from 222 is incident on the common blue sub-pixel 223.
  • the first pixel and the second pixel share the nth sub-pixel. Since the area of the shared sub-pixel is larger, the photosensitive area of the sub-pixel can be increased, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging. .
  • the bottom surface 232 of the first microprism 231 and the bottom surface 232 of the second microprism 231 are opposite and parallel, and the bottom surface 232 of the first microprism 231 is perpendicular to the plane of the pixel array layer 220, and the second microprism 231 is The bottom surface 232 is perpendicular to the plane of the pixel array layer 220.
  • the first pixel is sequentially provided with n-1 in the order of the refractive index of the corresponding color in the direction of the bottom surface 232 along the vertex 233 of the first microprism 231. a sub-pixel and a common n-th sub-pixel.
  • n-1 sub-arrays arranged in the order of the refractive index of the corresponding color are arranged in the direction of the bottom surface 232 along the vertex 233 of the second microprism 231.
  • the pixel and the shared nth sub-pixel are the direction in which the vertex 233 of the first microprism 231 points toward the bottom surface 232, and the direction of the dotted arrow on the right side is the direction in which the vertex 233 of the second microprism 231 points toward the bottom surface 232.
  • the first pixel is sequentially oriented in the direction of the bottom surface 232 along the vertex 233 of the first microprism 231.
  • a red sub-pixel 221, a green sub-pixel 222, and a common blue sub-pixel 223 are disposed.
  • a red sub-pixel 221 and a green sub-pixel are sequentially disposed along a direction in which the vertex 233 of the second microprism 231 points to the bottom surface 232.
  • a microlens layer 240 may be disposed between the pixel array layer 220 and the microprism layer 230.
  • the microlens layer 240 is configured to converge light without affecting the transmittance of the light.
  • the positional relationship between the microlens layer 240 and the microprism layer 230 can be various. This embodiment is described by taking two of them as an example.
  • the camera photosensitive assembly further includes a microlens layer 240 between the pixel array layer 220 and the microprism layer 230; the microprism 231 is configured to decompose incident light into m color lights
  • the microlens 241 in the microlens layer 240 is disposed as n of the m color lights emitted by the microprism 231, and each of the color lights is separately condensed and then incident on the corresponding color of the pixel corresponding to the microprism 231. In the sub-pixel.
  • each microlens 241 corresponds to one sub-pixel, please refer to FIG. Still taking one pixel as three sub-pixels as an example, the red light emitted by the microprism 231 is concentrated by the microlens 241 and then incident on the red sub-pixel 221 of the pixel corresponding to the microprism 231, and the emitted green light passes through the microlens. After being concentrated, the 241 is incident on the green sub-pixel 222 of the pixel, and the emitted blue light is concentrated by the microlens 241 and then incident on the blue sub-pixel 223 of the pixel.
  • the microlens layer 240 Since the microlens layer 240 is located between the pixel array layer 220 and the microprism layer 230, the microlens layer 240 can separately condense each of the n color lights emitted by the microprism layer 230 into the micro. Among the sub-pixels of the corresponding color among the pixels corresponding to the prism 231, it can be ensured that each color light is completely incident into the sub-pixel of the corresponding color, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging.
  • the camera photosensitive assembly further includes a microlens layer 240, the microlens layer 240 and the microprism layer 230 are relatively parallel, and the microlens layer 240 is not adjacent to the pixel array layer 220; the microlens layer 240
  • the microlens 241 is configured to converge the incident light and then emit the light.
  • the microprism 231 is configured to decompose the concentrated light emitted by the microlens 241 into m color lights, and the n color lights of the emitted m color light are respectively incident into the microprism 231. Among the corresponding pixels in the corresponding pixel.
  • each microlens 241 corresponds to one microprism 231, please refer to FIG. Still taking one pixel as three sub-pixels as an example, the microprism 231 decomposes the incident light that has been concentrated by the microlens 241 into seven colors of light, and the emitted red light is incident on the red sub-pixel of the pixel corresponding to the microprism 231. In 221, the emitted green light is incident on the green sub-pixel 222 of the pixel, and the emitted blue light is incident on the blue sub-pixel 223 of the pixel.
  • microprism layer 230 There are many ways to fabricate the microprism layer 230. In this embodiment, two of them are taken as an example for description.
  • the microprism layer 230 is formed by arranging the respective microprisms 231. At this time, the microprisms 231 having a pixel size close to each other can be formed and arranged in accordance with the positional relationship between the respective microprisms 231 and the pixels to form the microprism layer 230.
  • the microprism layer 230 is formed by etching the substrate of the predetermined material. At this time, etching may be performed in accordance with the positional relationship between the microprism 231 and the pixel to form the microprism layer 230.
  • the preset material may be optical glass, quartz glass, alkali metal halide crystal, plastic, or the like, which is not limited in this embodiment.
  • the camera photosensitive assembly decomposes the incident light into m color lights through the microprism, and the n color lights of the emitted m color lights are respectively injected into the corresponding colors of the pixels corresponding to the microprism.
  • n kinds of color lights can be decomposed by the microprism, instead of absorbing a part of the color light by the RGB filter to obtain n kinds of color lights, the transmittance of the color light entering the pixel can be improved, thereby reducing the imaging required.
  • the exposure time can further improve the shooting effect under low light conditions, and can also improve the shooting effect on moving objects.
  • the first pixel and the second pixel share the nth sub-pixel. Since the area of the shared sub-pixel is larger, the photosensitive area of the sub-pixel can be increased, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging. .
  • the microlens layer is located between the pixel array layer and the microprism layer, such that the microlens layer can separately converge each of the n color lights emitted by the microprism layer into the corresponding pixels of the microprism. In the sub-pixels of the color, it is ensured that each color light is completely incident into the sub-pixel of the corresponding color, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging.
  • the microprism layer is formed by etching a substrate of a predetermined material, so that it is not necessary to fabricate and arrange microprisms similar in size to the pixel, which can reduce the difficulty in realizing the microprism layer.
  • FIG. 7 is a block diagram of an apparatus 700 equipped with a camera photosensitive assembly, according to an exemplary embodiment.
  • device 700 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a gaming console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.
  • apparatus 700 can include one or more of the following components: processing component 702, memory 704, power component 706, multimedia component 708, audio component 710, input/output (I/O) interface 712, sensor component 714, and Communication component 716.
  • Processing component 702 typically controls the overall operation of device 700, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations.
  • Processing component 702 can include one or more processors 718 to execute instructions to perform all or part of the steps of the methods described above.
  • processing component 702 can include one or more modules to facilitate interaction between component 702 and other components.
  • processing component 702 can include a multimedia module to facilitate interaction between multimedia component 708 and processing component 702.
  • Memory 704 is configured to store various types of data to support operation at device 700. Examples of such data include instructions, contact data, phone book data, messages, pictures, videos, etc., of any application or method configured to operate on device 700.
  • Memory 704 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read only memory (EEPROM), erasable Programmable read only memory (EPROM), programmable read only memory (PROM), read only memory (ROM), magnetic memory, flash memory, magnetic or optical disk.
  • SRAM static random access memory
  • EEPROM electrically erasable programmable read only memory
  • EPROM erasable Programmable read only memory
  • PROM programmable read only memory
  • ROM read only memory
  • magnetic memory flash memory
  • flash memory magnetic or optical disk.
  • Power component 706 provides power to various components of device 700.
  • Power component 706 can include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for device 700.
  • the multimedia component 708 includes a screen between the device 700 and the user that provides an output interface.
  • the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user.
  • the touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor may sense not only the boundary of the touch or sliding action, but also the duration and pressure associated with the touch or slide operation.
  • the multimedia component 708 includes a front camera and/or a rear camera. When the device 700 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.
  • the audio component 710 is configured to output and/or input an audio signal.
  • audio component 710 includes a microphone (MIC) that is configured to receive an external audio signal when device 700 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode.
  • the received audio signal may be further stored in memory 704 or transmitted via communication component 716.
  • the audio component 710 also includes a speaker configured to output an audio signal.
  • the I/O interface 712 provides an interface between the processing component 702 and the peripheral interface module, which may be a keyboard, a click wheel, a button, or the like. These buttons may include, but are not limited to, a home button, a volume button, a start button, and a lock button.
  • Sensor assembly 714 includes one or more sensors configured to provide a status assessment of various aspects of device 700.
  • sensor assembly 714 can detect an open/closed state of device 700, relative positioning of components, such as the display and keypad of device 700, and sensor component 714 can also detect a change in position of one component of device 700 or device 700. The presence or absence of user contact with device 700, device 700 orientation or acceleration/deceleration, and temperature variation of device 700.
  • Sensor assembly 714 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact.
  • Sensor component 714 can also include a light sensor, such as a CMOS or CCD image sensor, configured for use in imaging applications.
  • the sensor component 714 can also include an acceleration sensor, a gyro sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
  • Communication component 716 is configured to facilitate wired or wireless communication between device 700 and other devices.
  • the device 700 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof.
  • communication component 716 receives broadcast signals or broadcast associated information from an external broadcast management system via a broadcast channel.
  • the communication component 716 also includes a near field communication (NFC) module to facilitate short range communication.
  • NFC near field communication
  • the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
  • RFID radio frequency identification
  • IrDA infrared data association
  • UWB ultra wideband
  • Bluetooth Bluetooth
  • apparatus 700 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable A gate array (FPGA), controller, microcontroller, microprocessor, or other electronic component implementation configured to perform the above methods.
  • ASICs application specific integrated circuits
  • DSPs digital signal processors
  • DSPDs digital signal processing devices
  • PLDs programmable logic devices
  • FPGA field programmable A gate array
  • controller microcontroller, microprocessor, or other electronic component implementation configured to perform the above methods.
  • non-transitory computer readable storage medium comprising instructions, such as a memory 704 comprising instructions executable by processor 718 of apparatus 700 to perform the above method.
  • the non-transitory computer readable storage medium may be a ROM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, or the like.
  • the technical solution provided by the embodiment of the present disclosure may include the following effects: the incident light is decomposed into m color lights by the microprism, and the n color lights of the emitted m color lights are respectively injected into the corresponding colors of the pixels corresponding to the microprism.
  • n kinds of color lights can be decomposed by the microprism, instead of absorbing a part of the color light by the RGB filter to obtain n kinds of color lights, the transmittance of the color light entering the pixel can be improved, thereby reducing the imaging required.
  • the exposure time can further improve the shooting effect under low light conditions, and can also improve the shooting effect on moving objects.
  • the first pixel and the second pixel share the nth sub-pixel. Since the area of the shared sub-pixel is larger, the photosensitive area of the sub-pixel can be increased, thereby increasing the light transmittance of the sub-pixel and reducing the exposure time required for imaging. .
  • the microlens layer is located between the pixel array layer and the microprism layer, such that the microlens lens layer can separately converge each of the n color lights emitted by the microprism layer into the corresponding pixels of the microprism.
  • the microlens lens layer can separately converge each of the n color lights emitted by the microprism layer into the corresponding pixels of the microprism.
  • the microprism layer is formed by etching a substrate of a predetermined material, so that it is not necessary to fabricate and arrange microprisms similar in size to the pixel, which can reduce the difficulty in realizing the microprism layer.

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Abstract

本公开实施例关于一种摄像头感光组件、摄像头和摄像终端。所述摄像头感光组件包括：硅基片层、贴附于所述硅基片层的一面的像素阵列层、与所述像素阵列层相对平行设置的微棱镜层；所述微棱镜层中的每个微棱镜配置为将入射光线分解成m种色光后射出，射出的所述m种色光中n种色光分别射入所述微棱镜对应的像素中对应颜色的子像素中，n≤m。

Description

摄像头感光组件、摄像头和摄像终端
相关申请的交叉引用
本申请基于申请号为201711025227.1、申请日为2017年10月27日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开实施例涉及摄像技术领域，特别涉及一种摄像头感光组件、摄像头和摄像终端。
背景技术
光线射入摄像头感光组件中像素的感光面上形成图像，所以，光线的透过率是成像的关键。
相关技术中，摄像头感光组件包括红绿蓝RGB滤光片，光线通过RGB滤光片过滤后射入像素的感光面上。
发明内容
为解决相关技术中的问题，本公开实施例提供了一种摄像头感光组件、摄像头和摄像终端。
根据本公开实施例的第一方面，提供一种摄像头感光组件，所述摄像头感光组件包括：硅基片层、贴附于所述硅基片层的一面的像素阵列层、与所述像素阵列层相对平行设置的微棱镜层；
所述微棱镜层中的微棱镜配置为将入射光线分解成m种色光后射出，射出的所述m种色光中n种色光分别射入所述微棱镜对应的像素中对应颜 色的子像素中，n≤m。
可选的，每个微棱镜对应于一个像素，且所述像素包括n个子像素；
所述微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述像素中对应颜色的子像素中。
可选的，所述微棱镜的底面与所述像素阵列层所在平面垂直，且所述像素中沿所述微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素。
可选的，每相邻的两个微棱镜对应于两个相邻的像素，其中，第一像素和第二像素均包括n个子像素，且所述第一像素和所述第二像素中的第n个子像素相邻；
第一微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第一像素中对应颜色的子像素中，第二微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第二像素中对应颜色的子像素中。
可选的，所述第一微棱镜的底面和所述第二微棱镜的底面相对且平行，且所述第一微棱镜的底面与所述像素阵列层所在平面垂直，所述第二微棱镜的底面与所述像素阵列层所在平面垂直；
所述第一像素中沿所述第一微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素，所述第二像素中沿所述第二微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素。
可选的，每两个相邻的微棱镜对应于两个相邻的像素，第一像素和第二像素共包括2n-1个子像素，且所述第一像素和所述第二像素共用第n个子像素；
第一微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出 的所述m种色光中n种色光分别射入所述第一像素中对应颜色的n-1个子像素和共用的所述第n个子像素中，第二微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第二像素中对应颜色的n-1个子像素和共用的所述第n个子像素中。
可选的，所述第一微棱镜的底面和所述第二微棱镜的底面相对且平行，且所述第一微棱镜的底面与所述像素阵列层所在平面垂直，所述第二微棱镜的底面与所述像素阵列层所在平面垂直；
所述第一像素中沿所述第一微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n-1个子像素和共用的所述第n个子像素，所述第二像素中沿所述第二微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n-1个子像素和共用的所述第n个子像素。
可选的，所述摄像头感光组件还包括微透镜层，所述微透镜层位于所述像素阵列层和所述微棱镜层之间；
所述微棱镜配置为将所述入射光线分解成所述m种色光后射出；
所述微透镜层中的微透镜配置为将所述微棱镜射出的所述m种色光中的n种色光中，每一种色光单独会聚后分别射入所述微棱镜对应的像素中对应颜色的子像素中。
可选的，所述摄像头感光组件还包括微透镜层，所述微透镜层与所述微棱镜层相对平行，且所述微透镜层与所述像素阵列层不相邻；
所述微透镜层中的微透镜配置为将入射光线会聚后射出；
所述微棱镜配置为将所述微透镜射出的会聚的光线分解成所述m种色光后射出，射出的所述m种色光中n种色光射分别入所述微棱镜对应的像素中对应颜色的子像素中。
可选的，所述微棱镜层由各个微棱镜排列形成。
可选的，所述微棱镜层由预设材料的基板蚀刻形成。
根据本公开实施例的第二方面，提供一种摄像头，所述摄像头包括如第一方面所述的摄像头感光组件。
根据本公开实施例的第三方面，提供一种摄像终端，所述摄像终端包括第二方面所述的摄像头。
本公开的实施例提供的技术方案可以包括以下有益效果：
通过微棱镜将入射光线分解成m种色光后射出，且射出的m种色光中n种色光分别射入微棱镜对应的像素中对应颜色的子像素中，这样，可以通过微棱镜分解出n种色光，而不是通过RGB滤光片吸收部分色光之后得到n种色光，可以提高色光射入像素的透过率，从而减少成像所需的曝光时间，进而可以提高对低光照条件下的拍摄效果，也可以提高对运动物体的拍摄效果。
第一像素和第二像素共用第n个子像素，由于共用的子像素的面积较大，所以，可以增加子像素的感光面积，从而增加子像素的光线透过率，减少成像所需的曝光时间。
微透镜层位于像素阵列层和微棱镜层之间，这样，微棱透镜层可以将微棱镜层射出的n种色光中的每一种色光单独会聚后分别射入所述微棱镜对应的像素中对应颜色的子像素中，可以保证每一种色光全部射入对应颜色的子像素中，从而增加子像素的光线透过率，减少成像所需的曝光时间。
微棱镜层是由预设材料的基板蚀刻形成的，这样，无需制作出与像素大小相近的微棱镜并排列，可以降低微棱镜层的实现难度。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本公开说明书的一部分，示出了符 合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是根据相关技术示出的一种摄像头感光组件的结构示意图；
图2是根据一示例性实施例示出的一种摄像头感光组件的结构示意图；
图3是根据一示例性实施例示出的一种摄像头感光组件的结构示意图；
图4是根据一示例性实施例示出的一种摄像头感光组件的结构示意图；
图5是根据一示例性实施例示出的一种摄像头感光组件的结构示意图；
图6是根据一示例性实施例示出的一种摄像头感光组件的结构示意图；
图7是根据一示例性实施例示出的一种搭载有摄像头感光组件的装置的框图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开实施例的一些方面相一致的装置和方法的例子。
图1是根据相关技术示出的一种摄像头感光组件的结构示意图，该摄像头感光组件包括硅基片层、贴附于硅基片层的一面的像素阵列层，与像素阵列层相对平行设置的RGB滤光片层，与RGB滤光片层相对平行设置的微透镜层，微透镜层与像素阵列层不相邻。
其中，一个像素可以包括三个或四个甚至更多个子像素，以一个像素包括三个子像素为例进行说明，则这三个子像素分别是红色子像素、绿色子像素和蓝色子像素。对应的，一个RGB滤光片包括三个滤光片，分别是红色滤光片、绿色滤光片和蓝色滤光片。每个滤光片的上方设置有一个微透镜。
入射光线垂直射入微透镜层中的每个微透镜，每个微透镜将入射光线 折射入下方对应的滤光片，红色滤光片吸收除红色光线以外的光线，并将红色光线射入红色子像素中；绿色滤光片吸收除绿色光线以外的光线，并将绿色光线射入绿色子像素中；蓝色滤光片吸收除蓝色光线以外的光线，并将蓝色光线射入蓝色子像素中。
入射光线透过RGB滤光片的透过率很低，平均在40％左右，剩余60％的光线都被吸收掉了，导致成像所需的曝光时间变长，本申请通过图2至图6所示的实施例来解决上述问题。
图2是根据一示例性实施例示出的一种摄像头感光组件的结构示意图，该摄像头感光组件可以实现为摄像头，该摄像头应用于摄像终端中，如图2所示，该摄像头感光组件包括：硅基片层210、贴附于硅基片层210的一面的像素阵列层220、与像素阵列层220相对平行设置的微棱镜层230；
微棱镜层230中的微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入微棱镜231对应的像素中对应颜色的子像素中，n≤m。
其中，m可以为7，也可以为其它数值，本实施例不作限定。当m为7时，微棱镜231可以将入射光线分解成七色光。
本实施例中，一个像素可以包括三个或四个甚至更多个子像素，以一个像素包括三个子像素为例进行说明，则微棱镜层230中的每个微棱镜231配置为将入射光线分解成七色光后射出，射出的红色光射入与微棱镜231对应的像素的红色子像素221中、射出的绿色光射入像素的绿色子像素222中、射出的蓝色光射入像素的蓝色子像素223中。
综上所述，本公开实施例提供的摄像头感光组件，通过微棱镜将入射光线分解成m种色光后射出，且射出的m种色光中n种色光分别射入微棱镜对应的像素中对应颜色的子像素中，这样，可以通过微棱镜分解出n种色光，而不是通过RGB滤光片吸收部分色光之后得到n种色光，可以提高 色光射入像素的透过率，从而减少成像所需的曝光时间，进而可以提高对低光照条件下的拍摄效果，也可以提高对运动物体的拍摄效果。
请参考图2，该摄像头感光组件包括：硅基片层210、贴附于硅基片层210的一面的像素阵列层220、与像素阵列层220相对平行设置的微棱镜层230。
像素阵列层220包括一个像素阵列，每个像素包括三个或四个甚至更多个子像素。当像素包括三个子像素时，这三个子像素可以分别是红色子像素、绿色子像素和蓝色子像素。当像素包括四个子像素时，这四个子像素分别是红色子像素、绿色子像素、蓝色子像素和黄色子像素，或者，这四个子像素分别是红色子像素、绿色子像素、蓝色子像素和白色子像素等等。本实施例不对像素所包括的子像素的数量及子像素作限定。
硅基片层210与像素阵列层220贴附的一面设置有凹槽，每个像素中的各个子像素均位于一个凹槽内。
微棱镜层230中的微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入微棱镜231对应的像素中对应颜色的子像素中，n≤m。
其中，m可以为7，也可以为其它数值，本实施例不作限定。当m为7时，微棱镜231可以将入射光线分解成七色光。
以一个像素包括三个子像素为例进行说明，则微棱镜层230中的每个微棱镜231配置为将入射光线分解成七色光后射出，射出的红色光射入与微棱镜231对应的像素的红色子像素221中、射出的绿色光射入像素的绿色子像素222中、射出的蓝色光射入像素的蓝色子像素223中。
微棱镜层230配置为将入射光线分解后射入像素中，这样，可以通过微棱镜231分解出n种色光，而不是通过RGB滤光片吸收部分色光之后得到n种色光，可以提高色光射入像素的透过率，从而减少成像所需的曝光 时间，进而可以提高对低光照条件下的拍摄效果，也可以提高对运动物体的拍摄效果。
本实施例中，微棱镜231与像素的位置关系可以有多种，本实施例以其中的三种为例进行说明。
1)在第一种位置关系中，每个微棱镜231对应于一个像素，且该像素包括n个子像素，此时，微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入该像素中对应颜色的子像素中。
仍然以一个像素包括三个子像素为例进行说明，则微棱镜231射出的红色光射入像素的红色子像素221中、射出的绿色光射入像素的绿色子像素222中、射出的蓝色光射入像素的蓝色子像素223中。
请参考图2，其中，微棱镜231的底面232与像素阵列层220所在平面垂直，且像素中沿微棱镜231的顶点233指向底面232的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的n个子像素。图中虚线箭头的方向即为微棱镜231的顶点233指向底面232的方向。
仍然以一个像素包括三个子像素为例进行说明，由于红色光的折射率最小，蓝色光的折射率最大，所以，像素中沿微棱镜231的顶点233指向底面232的方向上依次设置有红色子像素221、绿色子像素222和蓝色子像素223。
2)在第二种位置关系中，每相邻的两个微棱镜231对应于两个相邻的像素，其中，第一像素和第二像素均包括n个子像素，且第一像素和第二像素中的第n个子像素相邻；第一微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入第一像素中对应颜色的子像素中，第二微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入第二像素中对应颜色的子像素中。
仍然以一个像素包括三个子像素为例进行说明，则第一微棱镜231射 出的红色光射入第一像素的红色子像素221中、射出的绿色光射入第一像素的绿色子像素222中、射出的蓝色光射入第一像素的蓝色子像素223中；第二微棱镜231射出的红色光射入第二像素的红色子像素221中、射出的绿色光射入第二像素的绿色子像素222中、射出的蓝色光射入第二像素的蓝色子像素223中。
请参考图3，其中，第一微棱镜231的底面232和第二微棱镜231的底面232相对且平行，且第一微棱镜231的底面232与像素阵列层220所在平面垂直，第二微棱镜231的底面232与像素阵列层220所在平面垂直；第一像素中沿第一微棱镜231的顶点233指向底面232的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的n个子像素，第二像素中沿第二微棱镜231的顶点233指向底面232的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的n个子像素。图中左侧的虚线箭头的方向即为第一微棱镜231的顶点233指向底面232的方向，右侧的虚线箭头的方向即为第二微棱镜231的顶点233指向底面232的方向。
仍然以一个像素包括三个子像素为例进行说明，由于红色光的折射率最小，蓝色光的折射率最大，所以，第一像素中沿第一微棱镜231的顶点233指向底面232的方向上依次设置有红色子像素221、绿色子像素222和蓝色子像素223，第二像素中沿第二微棱镜231的顶点233指向底面232的方向上依次设置有红色子像素221、绿色子像素222和蓝色子像素223，且第一像素中的蓝色子像素223与第二像素中的蓝色子像素223相邻。
3)在第三种位置关系中，每相邻的两个微棱镜231对应于两个相邻的像素，第一像素和第二像素共包括2n-1个子像素，且第一像素和第二像素共用第n个子像素；第一微棱镜231配置为将入射光线分解成m种色光后射出，射出的m种色光中n种色光分别射入第一像素中对应颜色的n-1个子像素和共用的第n个子像素中，第二微棱镜231配置为将入射光线分解 成m种色光后射出，射出的m种色光中n种色光分别射入第二像素中对应颜色的n-1个子像素和共用的第n个子像素中。
仍然以一个像素包括三个子像素为例进行说明，则第一微棱镜231射出的红色光射入第一像素的红色子像素221中、射出的绿色光射入第一像素的绿色子像素222中、射出的蓝色光射入共用的蓝色子像素223中；第二微棱镜231射出的红色光射入第二像素的红色子像素221中、射出的绿色光射入第二像素的绿色子像素222中、射出的蓝色光射入共用的蓝色子像素223中。
第一像素和第二像素共用第n个子像素，由于共用的子像素的面积较大，所以，可以增加子像素的感光面积，从而增加子像素的光线透过率，减少成像所需的曝光时间。
请参考图4，第一微棱镜231的底面232和第二微棱镜231的底面232相对且平行，且第一微棱镜231的底面232与像素阵列层220所在平面垂直，第二微棱镜231的底面232与像素阵列层220所在平面垂直；第一像素中沿第一微棱镜231的顶点233指向底面232的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的n-1个子像素和共用的第n个子像素，第二像素中沿第二微棱镜231的顶点233指向底面232的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的n-1个子像素和共用的第n个子像素。图中左侧的虚线箭头的方向即为第一微棱镜231的顶点233指向底面232的方向，右侧的虚线箭头的方向即为第二微棱镜231的顶点233指向底面232的方向。
仍然以一个像素包括三个子像素为例进行说明，由于红色光的折射率最小，蓝色光的折射率最大，所以，第一像素中沿第一微棱镜231的顶点233指向底面232的方向上依次设置有红色子像素221、绿色子像素222和共用的蓝色子像素223，第二像素中沿第二微棱镜231的顶点233指向底面 232的方向上依次设置有红色子像素221、绿色子像素222和共用的蓝色子像素223。
本实施例中，还可以在像素阵列层220和微棱镜层230之间设置微透镜层240，该微透镜层240配置为对光线进行会聚，并不会影响光线的透过率。其中，微透镜层240与微棱镜层230之间的位置关系可以有多种，本实施例以其中的两种为例进行说明。
1)在第一种位置关系中，摄像头感光组件还包括微透镜层240，微透镜层240位于像素阵列层220和微棱镜层230之间；微棱镜231配置为将入射光线分解成m种色光后射出；微透镜层240中的微透镜241配置为将微棱镜231射出的m种色光中的n种色光中，每一种色光单独会聚后分别射入微棱镜231对应的像素中对应颜色的子像素中。
在一种实现方式中，每个微透镜241对应于一个子像素，请参考图5。仍然以一个像素包括三个子像素为例进行说明，则微棱镜231射出的红色光经过微透镜241会聚后射入与微棱镜231对应的像素的红色子像素221中、射出的绿色光经过微透镜241会聚后射入像素的绿色子像素222中、射出的蓝色光经过微透镜241会聚后射入像素的蓝色子像素223中。
由于微透镜层240位于像素阵列层220和微棱镜层230之间，这样，微透镜层240可以将微棱镜层230射出的n种色光中的每一种色光单独会聚后分别射入所述微棱镜231对应的像素中对应颜色的子像素中，可以保证每一种色光全部射入对应颜色的子像素中，从而增加子像素的光线透过率，减少成像所需的曝光时间。
2)在第二种位置关系中，摄像头感光组件还包括微透镜层240，微透镜层240与微棱镜层230相对平行，且微透镜层240与像素阵列层220不相邻；微透镜层240中的微透镜241配置为将入射光线会聚后射出；微棱镜231配置为将微透镜241射出的会聚的光线分解成m种色光后射出，射 出的m种色光中n种色光射分别入微棱镜231对应的像素中对应颜色的子像素中。
在一种实现方式中，每个微透镜241对应于一个微棱镜231，请参考图6。仍然以一个像素包括三个子像素为例进行说明，则微棱镜231将微透镜241会聚后的入射光线分解成七色光后射出，射出的红色光射入与微棱镜231对应的像素的红色子像素221中、射出的绿色光射入像素的绿色子像素222中、射出的蓝色光射入像素的蓝色子像素223中。
其中，制作微棱镜层230的方式有很多种，本实施例以其中的两种为例进行说明。
1)在第一种制作方式中，微棱镜层230由各个微棱镜231排列形成。此时，可以制作和像素大小相近的微棱镜231，按照各个微棱镜231和像素之间的位置关系进行排列，形成微棱镜层230。
2)在第二种制作方式中，由于制作与像素大小相近的微棱镜231以及排列微棱镜231的难度较大，因此，微棱镜层230由预设材料的基板蚀刻形成。此时，可以按照微棱镜231和像素之间的位置关系进行蚀刻，形成微棱镜层230。其中，预设材料可以是光学玻璃、石英玻璃、碱金属卤化物晶体、塑料等等，本实施例不作限定。
综上所述，本公开实施例提供的摄像头感光组件，通过微棱镜将入射光线分解成m种色光后射出，且射出的m种色光中n种色光分别射入微棱镜对应的像素中对应颜色的子像素中，这样，可以通过微棱镜分解出n种色光，而不是通过RGB滤光片吸收部分色光之后得到n种色光，可以提高色光射入像素的透过率，从而减少成像所需的曝光时间，进而可以提高对低光照条件下的拍摄效果，也可以提高对运动物体的拍摄效果。
第一像素和第二像素共用第n个子像素，由于共用的子像素的面积较大，所以，可以增加子像素的感光面积，从而增加子像素的光线透过率， 减少成像所需的曝光时间。
微透镜层位于像素阵列层和微棱镜层之间，这样，微透镜层可以将微棱镜层射出的n种色光中的每一种色光单独会聚后分别射入所述微棱镜对应的像素中对应颜色的子像素中，可以保证每一种色光全部射入对应颜色的子像素中，从而增加子像素的光线透过率，减少成像所需的曝光时间。
微棱镜层是由预设材料的基板蚀刻形成的，这样，无需制作出与像素大小相近的微棱镜并排列，可以降低微棱镜层的实现难度。
图7是根据一示例性实施例示出的一种搭载有摄像头感光组件的装置700的框图。例如，装置700可以是移动电话、计算机、数字广播终端、消息收发设备、游戏控制台、平板设备、医疗设备、健身设备、个人数字助理等。
参照图7，装置700可以包括以下一个或多个组件：处理组件702、存储器704、电源组件706、多媒体组件708、音频组件710、输入/输出(I/O)接口712、传感器组件714、以及通信组件716。
处理组件702通常控制装置700的整体操作，诸如与显示、电话呼叫、数据通信、相机操作和记录操作相关联的操作。处理组件702可以包括一个或多个处理器718来执行指令，以完成上述的方法的全部或部分步骤。此外，处理组件702可以包括一个或多个模块，便于处理组件702和其他组件之间的交互。例如，处理组件702可以包括多媒体模块，以方便多媒体组件708和处理组件702之间的交互。
存储器704被配置为存储各种类型的数据以支持在装置700的操作。这些数据的示例包括配置为在装置700上操作的任何应用程序或方法的指令、联系人数据、电话簿数据、消息、图片、视频等。存储器704可以由任何类型的易失性或非易失性存储设备或者它们的组合实现，如静态随机存取存储器(SRAM)、电可擦除可编程只读存储器(EEPROM)、可擦除可 编程只读存储器(EPROM)、可编程只读存储器(PROM)、只读存储器(ROM)、磁存储器、快闪存储器、磁盘或光盘。
电源组件706为装置700的各种组件提供电力。电源组件706可以包括电源管理系统，一个或多个电源，及其他与为装置700生成、管理和分配电力相关联的组件。
多媒体组件708包括在所述装置700和用户之间的提供一个输出接口的屏幕。在一些实施例中，屏幕可以包括液晶显示器(LCD)和触摸面板(TP)。如果屏幕包括触摸面板，屏幕可以被实现为触摸屏，以接收来自用户的输入信号。触摸面板包括一个或多个触摸传感器以感测触摸、滑动和触摸面板上的手势。所述触摸传感器可以不仅感测触摸或滑动动作的边界，而且还检测与所述触摸或滑动操作相关的持续时间和压力。在一些实施例中，多媒体组件708包括一个前置摄像头和/或后置摄像头。当装置700处于操作模式，如拍摄模式或视频模式时，前置摄像头和/或后置摄像头可以接收外部的多媒体数据。每个前置摄像头和后置摄像头可以是一个固定的光学透镜系统或具有焦距和光学变焦能力。
音频组件710被配置为输出和/或输入音频信号。例如，音频组件710包括一个麦克风(MIC)，当装置700处于操作模式，如呼叫模式、记录模式和语音识别模式时，麦克风被配置为接收外部音频信号。所接收的音频信号可以被进一步存储在存储器704或经由通信组件716发送。在一些实施例中，音频组件710还包括一个扬声器，配置为输出音频信号。
I/O接口712为处理组件702和外围接口模块之间提供接口，上述外围接口模块可以是键盘、点击轮、按钮等。这些按钮可包括但不限于：主页按钮、音量按钮、启动按钮和锁定按钮。
传感器组件714包括一个或多个传感器，配置为为装置700提供各个方面的状态评估。例如，传感器组件714可以检测到装置700的打开/关闭 状态，组件的相对定位，例如所述组件为装置700的显示器和小键盘，传感器组件714还可以检测装置700或装置700一个组件的位置改变，用户与装置700接触的存在或不存在，装置700方位或加速/减速和装置700的温度变化。传感器组件714可以包括接近传感器，被配置用来在没有任何的物理接触时检测附近物体的存在。传感器组件714还可以包括光传感器，如CMOS或CCD图像传感器，配置为在成像应用中使用。在一些实施例中，该传感器组件714还可以包括加速度传感器、陀螺仪传感器、磁传感器、压力传感器或温度传感器。
通信组件716被配置为便于装置700和其他设备之间有线或无线方式的通信。装置700可以接入基于通信标准的无线网络，如WiFi、2G或3G，或它们的组合。在一个示例性实施例中，通信组件716经由广播信道接收来自外部广播管理系统的广播信号或广播相关信息。在一个示例性实施例中，所述通信组件716还包括近场通信(NFC)模块，以促进短程通信。例如，在NFC模块可基于射频识别(RFID)技术、红外数据协会(IrDA)技术、超宽带(UWB)技术、蓝牙(BT)技术和其他技术来实现。
在示例性实施例中，装置700可以被一个或多个应用专用集成电路(ASIC)、数字信号处理器(DSP)、数字信号处理设备(DSPD)、可编程逻辑器件(PLD)、现场可编程门阵列(FPGA)、控制器、微控制器、微处理器或其他电子元件实现，配置为执行上述方法。
在示例性实施例中，还提供了一种包括指令的非临时性计算机可读存储介质，例如包括指令的存储器704，上述指令可由装置700的处理器718执行以完成上述方法。例如，所述非临时性计算机可读存储介质可以是ROM、CD-ROM、磁带、软盘和光数据存储设备等。
本领域技术人员在考虑说明书及实践这里的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开实施例的任何变型、用途或者 适应性变化，这些变型、用途或者适应性变化遵循本公开实施例的一般性原理并包括本公开实施例未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开实施例的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开实施例并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开实施例的范围仅由所附的权利要求来限制。
工业实用性
本公开的实施例提供的技术方案可以包括以下有益效果：通过微棱镜将入射光线分解成m种色光后射出，且射出的m种色光中n种色光分别射入微棱镜对应的像素中对应颜色的子像素中，这样，可以通过微棱镜分解出n种色光，而不是通过RGB滤光片吸收部分色光之后得到n种色光，可以提高色光射入像素的透过率，从而减少成像所需的曝光时间，进而可以提高对低光照条件下的拍摄效果，也可以提高对运动物体的拍摄效果。
第一像素和第二像素共用第n个子像素，由于共用的子像素的面积较大，所以，可以增加子像素的感光面积，从而增加子像素的光线透过率，减少成像所需的曝光时间。
微透镜层位于像素阵列层和微棱镜层之间，这样，微棱透镜层可以将微棱镜层射出的n种色光中的每一种色光单独会聚后分别射入所述微棱镜对应的像素中对应颜色的子像素中，可以保证每一种色光全部射入对应颜色的子像素中，从而增加子像素的光线透过率，减少成像所需的曝光时间。
微棱镜层是由预设材料的基板蚀刻形成的，这样，无需制作出与像素大小相近的微棱镜并排列，可以降低微棱镜层的实现难度。

Claims (13)

  1. 一种摄像头感光组件，所述摄像头感光组件包括：硅基片层、贴附于所述硅基片层的一面的像素阵列层、与所述像素阵列层相对平行设置的微棱镜层；
    所述微棱镜层中的微棱镜配置为将入射光线分解成m种色光后射出，射出的所述m种色光中n种色光分别射入所述微棱镜对应的像素中对应颜色的子像素中，n≤m。
  2. 根据权利要求1所述的摄像头感光组件，其中，每个微棱镜对应于一个像素，且所述像素包括n个子像素；
    所述微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述像素中对应颜色的子像素中。
  3. 根据权利要求2所述的摄像头感光组件，其中，所述微棱镜的底面与所述像素阵列层所在平面垂直，且所述像素中沿所述微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素。
  4. 根据权利要求1所述的摄像头感光组件，其中，每相邻的两个微棱镜对应于两个相邻的像素，其中，第一像素和第二像素均包括n个子像素，且所述第一像素和所述第二像素中的第n个子像素相邻；
    第一微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第一像素中对应颜色的子像素中，第二微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第二像素中对应颜色的子像素中。
  5. 根据权利要求4所述的摄像头感光组件，其中，所述第一微棱镜的底面和所述第二微棱镜的底面相对且平行，且所述第一微棱镜的底面与所述像素阵列层所在平面垂直，所述第二微棱镜的底面与所述像素阵列层所 在平面垂直；
    所述第一像素中沿所述第一微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素，所述第二像素中沿所述第二微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n个子像素。
  6. 根据权利要求1所述的摄像头感光组件，其中，每两个相邻的微棱镜对应于两个相邻的像素，第一像素和第二像素共包括2n-1个子像素，且所述第一像素和所述第二像素共用第n个子像素；
    第一微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第一像素中对应颜色的n-1个子像素和共用的所述第n个子像素中，第二微棱镜配置为将所述入射光线分解成所述m种色光后射出，射出的所述m种色光中n种色光分别射入所述第二像素中对应颜色的n-1个子像素和共用的所述第n个子像素中。
  7. 根据权利要求6所述的摄像头感光组件，其中，所述第一微棱镜的底面和所述第二微棱镜的底面相对且平行，且所述第一微棱镜的底面与所述像素阵列层所在平面垂直，所述第二微棱镜的底面与所述像素阵列层所在平面垂直；
    所述第一像素中沿所述第一微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n-1个子像素和共用的所述第n个子像素，所述第二像素中沿所述第二微棱镜的顶点指向所述底面的方向上依次设置有按照对应颜色的折射率由小到大的顺序排列的所述n-1个子像素和共用的所述第n个子像素。
  8. 根据权利要求1所述的摄像头感光组件，其中，所述摄像头感光组件还包括微透镜层，所述微透镜层位于所述像素阵列层和所述微棱镜层之间；
    所述微棱镜配置为将所述入射光线分解成所述m种色光后射出；
    所述微透镜层中的微透镜配置为将所述微棱镜射出的所述m种色光中的n种色光中，每一种色光单独会聚后分别射入所述微棱镜对应的像素中对应颜色的子像素中。
  9. 根据权利要求1所述的摄像头感光组件，其中，所述摄像头感光组件还包括微透镜层，所述微透镜层与所述微棱镜层相对平行，且所述微透镜层与所述像素阵列层不相邻；
    所述微透镜层中的微透镜配置为将入射光线会聚后射出；
    所述微棱镜配置为将所述微透镜射出的会聚的光线分解成所述m种色光后射出，射出的所述m种色光中n种色光射分别入所述微棱镜对应的像素中对应颜色的子像素中。
  10. 根据权利要求1至9任一项所述的摄像头感光组件，其中，所述微棱镜层由各个微棱镜排列形成。
  11. 根据权利要求1至9任一项所述的摄像头感光组件，其中，所述微棱镜层由预设材料的基板蚀刻形成。
  12. 一种摄像头，所述摄像头包括如权利要求1至11任一项所述的摄像头感光组件。
  13. 一种摄像终端，所述摄像终端包括如权利要求12所述的摄像头。
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