WO2019080208A1 - 信号传输装置及显示装置 - Google Patents
信号传输装置及显示装置Info
- Publication number
- WO2019080208A1 WO2019080208A1 PCT/CN2017/111206 CN2017111206W WO2019080208A1 WO 2019080208 A1 WO2019080208 A1 WO 2019080208A1 CN 2017111206 W CN2017111206 W CN 2017111206W WO 2019080208 A1 WO2019080208 A1 WO 2019080208A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive pattern
- insulating layer
- disposed
- electrically connected
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
Definitions
- Embodiments of the present application relate to a signal transmission device. Specifically, embodiments of the present application relate to a signal transmission device composed of a plurality of printed circuit boards, and a display device having the signal transmission device. Background technique
- a liquid crystal touch device having a touch function includes a system, a liquid crystal display panel, a touch panel, and a light source.
- signals of the liquid crystal display panel, the touch panel, and the light source are respectively transmitted via different flexible printed circuit boards.
- the flexible printed circuit board is transmitting signals to the system, it must be electrically connected to the system via three ports, respectively. This configuration makes it necessary for the system to leave enough space to set the port, which limits the size of the device.
- an existing invention attempts to solder a plurality of flexible printed circuit boards to the same flexible printed circuit board by means of soldering, electrically connecting and integrating the signals. It is then transmitted to the system via the same connection. In this way, the system only needs to leave a space for one port to improve the above problem.
- the welding process is a step that is more prone to cause a change in the manufacturing process.
- the current environmental factors affect the effect of mechanical welding, and the effect of manual welding is more difficult to grasp. Therefore, if it is found that the above effects can be achieved by means other than welding, the above technique should be further improved.
- a technical problem to be solved by embodiments of the present invention is to provide a signal transmission device to improve the size of the device and the problem that the cause of the welding process is prone to cause a change.
- a further technical problem to be solved by embodiments of the present invention is to provide a display device to improve the size of the device and the problem that the cause of the soldering process is prone to cause a change.
- the present application provides a signal transmission device, including: an insulating substrate; a connecting portion disposed on the insulating substrate and electrically connected to the system; the first conductive pattern disposed on the insulating substrate , electrically connecting with the display module and the connecting portion; the second conductive pattern is disposed on the first conductive pattern, and is displayed The module and the first conductive pattern are electrically connected; the third conductive pattern is disposed on the second conductive pattern and electrically connected to the display module and the second conductive pattern; the insulating layer is disposed on the first conductive pattern, the second conductive pattern, and Between the third conductive patterns, and for insulating and bonding the first conductive pattern, the second conductive pattern and the third conductive pattern; the interlayer conduction structure is disposed in the insulating layer, electrically connecting the first conductive pattern, the first The second conductive pattern and the third conductive pattern are electrically connected to the system through the first conductive pattern.
- the interlayer conduction structure includes a via hole that forms a vertical direction in the insulating layer.
- a plating layer having conductivity is disposed on the hole wall of the through hole.
- the material of the plating layer is metal
- the material of the plating layer is a conductive plastic.
- the insulating layer and the first conductive pattern and the second conductive pattern are bonded by curing the prepolymer solution before the insulating layer is cured to form an insulating layer.
- the insulating layer and the second conductive pattern and the third conductive pattern are adhered by curing the prepolymer solution before the insulating layer is cured to form an insulating layer.
- the material of the insulating layer is Polyimide (PI).
- the present application also provides a display device, including: a display module; a system; wherein, the display module and the system are electrically connected by a signal transmission device, the signal transmission device includes: an insulating substrate; a connection portion, a setting On the insulating substrate, electrically connected to the system; the first conductive pattern is disposed on the insulating substrate and electrically connected to the display module and the connecting portion; the second conductive pattern is disposed on the first conductive pattern, and is displayed The module and the first conductive pattern are electrically connected; the third conductive pattern is disposed on the second conductive pattern and electrically connected to the display module and the second conductive pattern; the insulating layer is disposed on the first conductive pattern, the second conductive pattern, and Between the third conductive patterns, and for insulating and adhering the first conductive pattern, the second conductive pattern and the third conductive pattern; the interlayer conduction structure is disposed in the insulating layer to make the second conductive pattern and the third conductive The pattern
- the interlayer conduction structure includes a through hole formed in a vertical direction in the insulating layer, and a plating layer having conductivity is disposed on the hole wall of the through hole.
- the material of the plating layer is selected from the group consisting of metal and conductive plastic.
- the insulating layer and the first conductive pattern, the second conductive pattern, and the third conductive pattern are insulated
- the prepolymer solution before curing of the layer is cured to form an insulating layer to be bonded.
- the material of the insulating layer is Polyimide (PI).
- the present application further provides a display device, including: a display module; a system; wherein, the display module and the system are electrically connected by a signal transmission device, the signal transmission device includes: an insulating substrate; a connecting portion disposed on the insulating substrate And electrically connected to the system; the first conductive pattern is disposed on the insulating substrate and electrically connected to the display module and the connecting portion; the second conductive pattern is disposed on the first conductive pattern, and the display module and the first The conductive pattern is electrically connected; the third conductive pattern is disposed on the first conductive pattern and electrically connected to the display module and the second conductive pattern; and the insulating layer is disposed on the first conductive pattern, the second conductive pattern and the third conductive pattern And for insulating, and the first conductive pattern, the second conductive pattern, and the third conductive pattern are adhered by curing the prepolymer solution before curing the insulating layer to form the insulating layer; the interlayer conduction structure a vertical via hole
- connection method of soldering several circuit boards by using other methods, thereby avoiding the causes of the soldering process, making the process less prone to error, thereby improving the yield of the product.
- connection strength between the plurality of boards can be further improved compared to soldering.
- FIG. 1 is a schematic structural view of an exemplary liquid crystal touch device.
- FIG. 2 is a schematic side view showing the structure of an exemplary liquid crystal touch device.
- FIG 3 is a schematic side view showing the structure of a display device in an embodiment of the present application.
- FIG. 4 is a schematic side view showing the structure of a display device in an embodiment of the present application.
- FIG. 5 is a schematic side view showing the structure of a display device in an embodiment of the present application.
- FIG. 6 is a flow chart showing a method of manufacturing a signal transmission device in an embodiment of the present application.
- installation should be understood broadly, unless otherwise explicitly defined and limited. For example, it may be a fixed connection, or It is a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium.
- chimeric and “embedded” should be understood broadly, for example, may be partially embedded, may be fully embedded, may be detachable, or the like. The specific meaning of the above terms in the present application can be understood by a person of ordinary skill in the art.
- the signals of the liquid crystal display panel, the touch panel, and the light source in the display module 10 are transmitted via the flexible printed circuit boards 102, 104, and 106, respectively.
- the aforementioned flexible printed circuit board must be electrically connected via three ports respectively when transmitting signals to the system. This configuration makes the system have enough space to set the port, which limits the size of the device.
- the prior invention has attempted to solder the flexible printed circuit boards 104 and 106 to the flexible printed circuit board 102 by soldering, and electrically connected and integrated the signals. After the flexible printed circuit board 102, it is transmitted to the system via the connection terminal 1020. In this way, the system only needs to leave a space for one port to improve the above problem.
- a non-composite signal transmission device is provided.
- the first flexible printed circuit board 110 and the second flexible printed circuit board 120 are included.
- the first flexible printed circuit board 110 can be electrically connected to the display module 100 and the system (not shown), and the first flexible printed circuit board 110 is provided with a plurality of port portions 202.
- the port portion 202 is electrically connected to the circuit of the first flexible printed circuit board 110, so that other components can be electrically connected to the first flexible printed circuit board 102 through the port portion 202.
- the circuit board 120 is electrically connected to the display module 100 and is provided with a port connector 201.
- the port connector 201 is electrically connected to the circuit of the second flexible printed circuit board 120 such that other components can be electrically connected to the first flexible printed circuit board 110 through the port portion 202.
- the port connector 201 described above matches the port portion 202, and can be fixed or detached as needed.
- the port connector 201 can be inserted, mated, or connected to the port portion 202 by any known means such as a spring, a cassette, or the like, and in a state in which the port is electrically connected, the second port 201 is provided.
- the flexible printed circuit board 120 is electrically connected to the first flexible printed circuit board 110 having the port portion 202.
- the port portion 202 may be single or plural and may be disposed on either side of the first flexible printed circuit board 110.
- port portion 202 can be disposed on an upper surface, a lower surface, a peripheral edge, or other configurable location of first flexible printed circuit board 110.
- the above arrangement must at least ensure that the port portion 202 can be electrically connected to the circuit of the first flexible printed circuit board 110 for the signal to be input to or output from the first flexible printed circuit board 110 through the port portion 202.
- the port connectors 201 may be single or plural and may be disposed on either side of the second flexible printed circuit board 120.
- the port portion 202 can be disposed on an upper surface, a lower surface, a peripheral edge, or other configurable position of the second flexible printed circuit board 120.
- the above arrangement must at least ensure that the port connector 210 can be electrically connected to the circuit of the second flexible printed circuit board 120 for the signal to be input to or output from the first flexible printed circuit board 110 through the port connector 201.
- the first flexible printed circuit board 110 can be electrically connected to the second flexible printed circuit board 120 by connecting the port connector 201 and the port portion 202.
- the first flexible printed circuit board 110 and the second flexible printed circuit board 120 can be differently arranged according to the positions of the port connector 201 and the port portion 202.
- the first flexible printed circuit board 110 may be in the same plane as the second flexible printed circuit board 120 and adjacent to each other; or the first flexible printed circuit board 110 may be different from the second flexible printed circuit board 120.
- the first flexible printed circuit board 110 may partially overlap the second flexible printed circuit board 120.
- the actual configuration is not limited thereto, but at least the effect of electrically connecting the first flexible printed circuit board 110 and the second flexible printed circuit board 120 is required.
- the first flexible printed circuit board 110 may be directly connected to the display module 100 or may not be directly connected to the display module 100. In the case of directly connecting the display module 100, the first flexible printed circuit board 110 can receive signals directly from the display module 100; without directly connecting the display module 100, The first flexible printed circuit board 110 can be electrically connected to the display module 10 through the second flexible printed circuit board 120, the port connector 201, and the port portion 202 to receive signals from the display module 100.
- the first flexible printed circuit board 110 can further be provided with a connecting portion 500 for electrically connecting the system. And transmitted to the system through the connection portion 500.
- the second flexible printed circuit board 120 can be electrically connected to the light source or the touch panel of the display module 100 (not shown), and transmits the light source signal provided by the light source and/or transmits the touch signal provided by the touch panel. .
- the second flexible printed circuit board 120 may be disposed on a different side of the display module 100 than the first flexible printed circuit board 110, or may be disposed on the same side of the display module 100 as the first flexible printed circuit board 110.
- the first flexible printed circuit board 110 and the second flexible printed circuit board 120 are further fixed in relative positions by alignment marks.
- the first flexible printed circuit board 110 and the second flexible printed circuit board 120 after being aligned by the alignment marks, may be known in the art. Ways to strengthen the link between the two to fix the relative position between the two.
- the signal transmission device of the present application may further include a third flexible printed circuit board 130.
- the third flexible printed circuit board 130 can have the same function as the second flexible printed circuit board 120. That is, the third flexible printed circuit board 130 can be electrically connected to the light source or the touch panel of the display module 100 (not shown), and the light source signal provided by the light source and/or the touch signal provided by the touch panel can be transmitted. .
- the third flexible printed circuit board 130 may be disposed on the different side of the display module 100 from the first flexible printed circuit board 110, or may be disposed on the same side of the display module 100 as the first flexible printed circuit board 110.
- the third flexible printed circuit board 130 may also be disposed on a different side of the display module 100 than the second flexible printed circuit board 120, or may be disposed on the same side of the display module 100 as the second flexible printed circuit board 120.
- the third flexible printed circuit board 130 may transmit different signals from the second flexible printed circuit board 120, respectively.
- a light source for electrically connecting the third flexible printed circuit board 130 to the display module 100, a light source signal, and a touch panel for electrically connecting the second flexible printed circuit board 120 to the display module 100 may be disposed. Transfer touch signals.
- an improved liquid crystal display device can be further provided by disposing the above-described signal transmission device in a liquid crystal display device for transmitting signals.
- a composite signal transmission device is provided.
- the configuration relationship between the second flexible printed circuit board 120 and the third flexible printed circuit board 130 is optimized, and the structure of the port connector 201 and the port portion 202 is not used to electrically connect the above three, but directly
- the first flexible printed circuit board 110, the second flexible printed circuit board 120, and the third flexible printed circuit board 130 are integrated into a multi-layered composite signal transmission device 700.
- the flexible printed circuit boards equivalent to the first flexible printed circuit board 110, the second flexible printed circuit board 120, and the third flexible printed circuit board 130 are respectively the first flexible printed circuit.
- the board 111, the second flexible printed circuit board 121, and the third flexible printed circuit board 131 are shown separated from the foregoing embodiment.
- the hybrid signal transmission device 700 has a multilayer structure in which the first flexible printed circuit board 111, the second flexible printed circuit board 121, and the third flexible printed circuit board 131 are stacked, and the insulating layer 300 is provided between the three.
- the insulating layer 300 is provided with a plurality of through holes 310, and the conductive pillars 320 are respectively disposed in the plurality of through holes 310, so that the first flexible printed circuit board 11 and the second flexible printed circuit board 121 are separated.
- the third flexible printed circuit boards 131 are electrically connectable.
- the first flexible printed circuit board 110 can be replaced with a hard circuit board.
- the insulating layer 30 0 may be further disposed under the first flexible printed circuit board 111.
- the material of the insulating layer 300 may be, for example, polyimide (Polyimide, PI), polyethylene terephthalate (PET), polyethylene naphthalate (Polyethylene). Naphthalate' PEN) or other insulating materials commonly used in the art.
- the conductive pillars 320 may be conductive pastes, anisotropic conductive films or other conductive materials commonly used in the art.
- the second flexible printed circuit board 121 can be electrically connected to the light source of the display module 100, and the third flexible printed circuit board 131 can be electrically connected to the touch panel of the display module 100.
- the second flexible printed circuit board 121 and the third flexible printed circuit board 131 are electrically connected to the first flexible printed circuit board 111 through the conductive pillars 320 disposed in the through holes 310, and further passed through the connecting portion 500 and the system. Electrical connection.
- the second flexible printed circuit board 121 may be disposed on the same plane as the third flexible printed circuit board 131 on the first flexible printed circuit board 111, and the above method and the first flexible printed circuit board 111 are respectively employed. Electrical connection.
- a thin composite signal transmission device is provided.
- the arrangement relationship between the first flexible printed circuit board 110, the second flexible printed circuit board 120, and the third flexible printed circuit board 130 is optimized.
- the integrated application on the first flexible printed circuit board 110, the second flexible printed circuit board 120, and the third flexible printed circuit board 130 is similar to the multilayer structure in the previous embodiment.
- the composite flexible printed circuit board forms a thin composite signal transmission device 800, and the structure is as shown in FIG. In FIG. 5, the thin composite signal transmission device 800 includes a first conductive pattern 112 equivalent to the circuit of the first flexible printed circuit board 110, and a second flexible printed circuit board.
- the first conductive pattern 112 may be disposed on any insulating substrate (not shown), and the conductive substrate 500 is disposed on the insulating substrate to be electrically connected to the above structure.
- An insulating layer 400 is disposed between the bottom of the thin composite signal transmission device 800 and the first conductive pattern 112, the second conductive pattern 122, and the third conductive pattern 132, and an interlayer conductive structure 410 is disposed therein.
- the first conductive pattern 112, the second conductive pattern 122, and the third conductive pattern 132 are electrically connected through the interlayer conductive structure 410.
- the formation of the interlayer conduction structure 410 includes forming at least one via hole in the insulating layer 400, and the hole wall of the via hole is formed into a conductive plating layer through a chemical and electroplating process.
- the material of the coating can be a metal or a conductive plastic, or other material that is also electrically conductive.
- the plating layer electrically connects the conductive patterns of the upper layer and the lower layer of the interlayer conduction structure to electrically connect each other.
- the thin composite signal transmission device 800 is different from the composite signal transmission device 700 of the previous embodiment in that the first conductive pattern 112, the second conductive pattern 122, and the third conductive pattern 132 are imprinted by copper foil.
- the thickness is much smaller than the first flexible printed circuit board 111, the second flexible printed circuit board 121, and the third flexible printed circuit board 131. Therefore, the overall thickness of the thin composite signal transmission device 800 can be made smaller than that of the composite signal transmission device 700.
- the insulating layer 400 of the thin composite signal transmission device 800 can be made of a single material, the formation thereof is divided into two parts, which are respectively an insulating layer which is originally solid and a liquid insulating layer before curing.
- the material of the insulating layer 400 may be polyimide (Polyimide, PI).
- the insulating layer 400 is disposed between the first conductive pattern 112, the second conductive pattern 122, and the third conductive pattern 132.
- a prepolymer solution of the uncured liquid polyimide is applied between the insulating layer 400 and the above three conductive patterns, that is, the material before the insulating layer 400 is cured, and the organic solvent in the solution is removed by a heating step.
- the signal transmission apparatus of this embodiment can be manufactured by the flow of FIG. 6, wherein steps S11 to S17 are briefly described in the above-described steps, which are merely examples. The steps can be modified as needed.
- the present application further includes providing a liquid crystal display device by providing the signal transmission device described above in a liquid crystal display device for transmitting a signal, and the liquid crystal display device may have the above signal transmission device.
- the signal transmission device described above may be disposed in other electronic devices, and is not limited to the display device.
- the display device may be an LCD display device, an OLED display device, a QLED display device, or the like. Curved display device or other display device.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本申请涉及一种信号传输装置及显示装置,所述信号传输装置,包括:绝缘性基板;连接部,设置于绝缘性基板上,与系统电性连接;第一导电图样,设置在绝缘性基材上,与显示模块及连接部电性连接;第二导电图样,设置在第一导电图样上,与显示模块及第一导电图样电性连接;第三导电图样,设置在第二导电图样上,与显示模块及第二导电图样电性连接;绝缘层,设置于第一导电图样、第二导电图样及第三导电图样之间,且用于绝缘并贴合第一导电图样、第二导电图样及第三导电图样;层间导通结构,设置于绝缘层中,使第二导电图样及第三导电图样通过第一导电图样电性连接至系统。
Description
信号传输装置及显示装置 技术领域
[0001] 本申请各实施方式涉及信号传输装置。 具体而言, 本申请各实施方式涉及若干 个印刷电路板组成的信号传输装置, 及具有所述信号传输装置的显示装置。 背景技术
[0002] 一般而言, 具有触控功能的液晶触控装置 (以下称液晶触控装置)包括系统、 液 晶显示面板、 触控面板及光源。 典型的液晶触控装置的结构中, 液晶显示面板 、 触控面板及光源的信号是分别经由不同的软性印刷电路板传输。 然而, 而所 述软性印刷电路板在传输信号至系统吋, 必须分别经由三个端口电性连接系统 , 此配置使得系统必须留置足够的空间设置端口, 造成装置的大小受到限制。
[0003] 此外, 范例中, 已有发明创造试图利用焊接的方式, 将若干个的软性印刷电路 板与焊接至同一个软性印刷电路板上, 以电性连接并将信号汇整后, 再经由同 一连接端传输至系统。 藉此, 系统只须留置一个端口的空间, 改善上述问题。
[0004] 然而, 焊接过程是属于制程中较容易产生变因的步骤, 制造当下的环境因素会 影响到机械焊接的效果, 而人工焊接的效果更加难以掌握。 因此, 若能找到利 用焊接以外的方式达到上述功效, 应可更加改进上述技术。
技术问题
[0005] 本发明实施例要解决的技术问题是, 提供一种信号传输装置, 以改善装置大小 受到限制和焊接过程中容易产生变因的问题。
[0006] 本发明实施例进一步要解决的技术问题是, 提供一种显示装置, 以改善装置大 小受到限制和焊接过程中容易产生变因的问题。
问题的解决方案
技术解决方案
[0007] 有鉴于此, 本申请提供一种信号传输装置, 包括: 绝缘性基板; 连接部, 设置 于绝缘性基板上, 与系统电性连接; 第一导电图样, 设置在绝缘性基材上, 与 显示模块及连接部电性连接; 第二导电图样, 设置在第一导电图样上, 与显示
模块及第一导电图样电性连接; 第三导电图样, 设置在第二导电图样上, 与显 示模块及第二导电图样电性连接; 绝缘层, 设置于第一导电图样、 第二导电图 样及第三导电图样之间, 且用于绝缘并贴合第一导电图样、 第二导电图样及第 三导电图样; 层间导通结构, 设置于绝缘层中, 电性连接第一导电图样、 第二 导电图样及第三导电图样, 使第二导电图样及第三导电图样通过第一导电图样 电性连接至系统。
[0008] 可选地, 层间导通结构包括在绝缘层形成垂直方向的通孔。
[0009] 可选地, 通孔的孔壁上设置具有导电性的镀层。
[0010] 可选地, 镀层的材料是金属
[0011] 可选地, 镀层的材料是导电塑料。
[0012] 可选地, 绝缘层与第一导电图样及第二导电图样是通过使绝缘层固化前的前聚 体溶液固化形成绝缘层而贴合。
[0013] 可选地, 绝缘层与第二导电图样及第三导电图样是通过使绝缘层固化前的前聚 体溶液固化形成绝缘层而贴合。
[0014] 可选地, 绝缘层的材料是聚酰亚胺 (Polyimide, PI)。
[0015] 另一方面, 本申请亦提供一种显示装置, 包括: 显示模块; 系统; 其中, 显示 模块及系统通过信号传输装置电性连接, 信号传输装置包括: 绝缘性基板; 连 接部, 设置于绝缘性基板上, 与系统电性连接; 第一导电图样, 设置在绝缘性 基材上, 与显示模块及连接部电性连接; 第二导电图样, 设置在第一导电图样 上, 与显示模块及第一导电图样电性连接; 第三导电图样, 设置在第二导电图 样上, 与显示模块及第二导电图样电性连接; 绝缘层, 设置于第一导电图样、 第二导电图样及第三导电图样之间, 且用于绝缘并贴合第一导电图样、 第二导 电图样及第三导电图样; 层间导通结构, 设置于绝缘层中, 使第二导电图样及 第三导电图样通过第一导电图样电性连接至系统。
[0016] 可选地, 层间导通结构包括在绝缘层形成垂直方向的通孔, 且通孔的孔壁上设 置具有导电性的镀层。
[0017] 可选地, 镀层的材料是选自金属及导电塑料。
[0018] 可选地, 绝缘层与第一导电图样、 第二导电图样及第三导电图样是通过使绝缘
层固化前的前聚体溶液固化形成绝缘层而贴合。
[0019] 可选地, 绝缘层的材料是聚酰亚胺 (Polyimide, PI)。
[0020] 本申请更提供一种显示装置, 包括: 显示模块; 系统; 其中, 显示模块及系统 通过信号传输装置电性连接, 信号传输装置包括: 绝缘性基板; 连接部, 设置 于绝缘性基板上, 与系统电性连接; 第一导电图样, 设置在绝缘性基材上, 与 显示模块及连接部电性连接; 第二导电图样, 设置在第一导电图样上, 与显示 模块及第一导电图样电性连接; 第三导电图样, 设置在第一导电图样上, 与显 示模块及第二导电图样电性连接; 绝缘层, 设置于第一导电图样、 第二导电图 样及第三导电图样之间, 且用于绝缘, 与第一导电图样、 第二导电图样及第三 导电图样是通过使绝缘层固化前的前聚体溶液固化形成所述绝缘层而贴合; 层 间导通结构, 包括在绝缘层形成的垂直方向的通孔, 设置于所述绝缘层中, 使 第二导电图样及第三导电图样通过第一导电图样电性连接至系统。
发明的有益效果
有益效果
[0021] 本申请通过改用其他方式以取代焊接若干个电路板的连接方式, 可避免前述焊 接过程中的变因, 使制程中不易出错, 进而提升产品的良率。 此外, 使用本申 请的信号传输装置, 相较于焊接可更提升所述若干个电路板间的连接强度。 对附图的简要说明
附图说明
[0022] 通过参照附图详细说明示例性实施方式, 以上及其它特征和优点对本领域技术 人员将变得更明显, 其中:
[0023] 图 1是范例的液晶触控装置的结构示意图。
[0024] 图 2是范例的液晶触控装置的结构侧视示意图。
[0025] 图 3是本申请的一实施例中显示装置的结构侧视示意图。
[0026] 图 4是本申请的一实施例中显示装置的结构侧视示意图。
[0027] 图 5是本申请的一实施例中显示装置的结构侧视示意图。
[0028] 图 6是本申请的一实施例中的信号传输装置的制造方法流程图。
本发明的实施方式
[0029] 以下将参照附图更全面地说明示例性实施方式; 然而, 它们可以不同形式体现 并不应理解成受限于文中所述实施方式。 相反, 提供这些实施方式以使得本公 幵彻底而完整, 并将完整地将本申请的范围传达给本领域技术人员。
[0030] 在本申请的描述中, 需要理解的是, 术语"上"、 "下"、 "左"、 "右"、 "内"、 "外 "等指示的方位或位置关系为基于附图所示的方位或位置关系, 仅是为了便于描 述本申请和简化描述, 而不是暗示所指的装置或组件必须具有特定的方位, 因 此不能理解为对本申请的限制。
[0031] 在本申请的描述中, 需要说明的是, 除非另有明确的规定和限定, 术语"安装" 、 "相连"、 "连接 "应做广义理解, 例如, 可以是固定连接, 也可以是可拆卸连接 , 或一体地连接; 可以是机械连接, 也可以是电性连接; 可以是直接相连, 也 可以通过中间媒介间接相连。 术语"嵌合"、 "嵌入 "应做广义理解, 例如, 可以 是部分嵌入、 可以是完全嵌入, 可以是可拆卸的嵌入等。 对于本领域的普通技 术人员而言, 可以具体情况理解上述术语在本申请中的具体含义。
[0032] 如图 1所示的范例中, 显示模块 10中的液晶显示面板、 触控面板及光源的信号 是分别经由软性印刷电路板 102、 104、 106传输。 然而, 前述软性印刷电路板在 传输信号至系统吋, 必须分别经由三个端口电性连接, 此配置使得系统必须留 置足够的空间设置端口, 造成装置的大小受到限制。
[0033] 如图 2所示的范例, 已有发明创造试图利用焊接的方式, 将软性印刷电路板 104 及 106与焊接至软性印刷电路板 102上, 以电性连接并将信号汇整至软性印刷电 路板 102后, 再经由连接端 1020传输至系统。 藉此, 系统只须留置一个端口的空 间, 改善上述问题。
[0034] 在本申请的实施例中, 提供一种非复合式信号传输装置, 如图 3所示, 包括第 一软性印刷电路板 110及第二软性印刷电路板 120。 第一软性印刷电路板 110可电 性连接显示模块 100及系统 (未于图中表示), 且第一软性印刷电路板 110上设置有 若干个端口部 202。 端口部 202与第一软性印刷电路板 110的电路电性连接, 使其 他组件可通过端口部 202与第一软性印刷电路板 102电性连接。 第二软性印刷电
路板 120电性连接显示模块 100, 且设置有端口连接件 201。 端口连接件 201与第 二软性印刷电路板 120的电路电性连接, 使其他组件可通过端口部 202与第一软 性印刷电路板 110电性连接。 上述的端口连接件 201匹配端口部 202, 两者间可依 需求固定或拆卸。 端口连接件 201可插入、 嵌合、 或利用弹片、 卡榫等任何已知 存在的方式与端口部 202连接, 且在连接吋处于电性连接的状态, 使设置有端口 连接件 201的第二软性印刷电路板 120与具有端口部 202的第一软性印刷电路板 110电性连接。
[0035] 在上述实施例中, 端口部 202可为单个或多个, 且可设置在第一软性印刷电路 板 110的任一侧。 举例而言, 端口部 202可设置在第一软性印刷电路板 110的上表 面、 下表面、 四周边缘或其他可设置的位置。 惟上述设置至少须确保端口部 202可与第一软性印刷电路板 110的电路电性连接, 以供信号通过端口部 202输入 至或输出第一软性印刷电路板 110。
[0036] 另一方面, 端口连接件 201可为单个或多个, 且可设置在第二软性印刷电路板 1 20的任一侧。 举例而言, 端口部 202可设置在第二软性印刷电路板 120的上表面 、 下表面、 四周边缘或其他可设置的位置。 惟上述设置至少须确保端口连接件 2 01可与第二软性印刷电路板 120的电路电性连接, 以供信号通过端口连接件 201 输入至或输出第一软性印刷电路板 110。
[0037] 通过连接端口连接件 201及端口部 202, 第一软性印刷电路板 110可与第二软性 印刷电路板 120电性连接。 根据端口连接件 201及端口部 202设置的位置, 第一软 性印刷电路板 110及第二软性印刷电路板 120可对应进行不同设置。 举例而言, 第一软性印刷电路板 110可与第二软性印刷电路板 120位于同一平面并相互邻接 ; 或者第一软性印刷电路板 110可与第二软性印刷电路板 120位于不同平面; 或 者第一软性印刷电路板 110可与第二软性印刷电路板 120部分重叠。 然而, 实际 配置方式并不限于此, 惟至少需达到使第一软性印刷电路板 110与第二软性印刷 电路板 120电性连接的效果。
[0038] 在本申请的实施例中, 第一软性印刷电路板 110可直接连接显示模块 100, 或者 不直接连接显示模块 100。 在直接连接显示模块 100的情况下, 第一软性印刷电 路板 110可直接由显示模块 100接收信号; 在不直接连接显示模块 100的情况下,
第一软性印刷电路板 110可通过第二软性印刷电路板 120、 端口连接件 201及端口 部 202电性连接显示模块 10, 以从显示模块 100接收信号。 第一软性印刷电路板 110更可设置连接部 500, 用以电性连接系统。 并通过连接部 500传输至系统。
[0039] 第二软性印刷电路板 120可电性连接显示模块 100的光源或触控面板 (未于图中 表示), 传输光源提供的光源信号及 /或传输触控面板提供的触控信号。 第二软性 印刷电路板 120可与第一软性印刷电路板 110设置在显示模块 100的不同侧, 或者 可与第一软性印刷电路板 110设置在显示模块 100的同一侧。
[0040] 可选地, 所述第一软性印刷电路板 110及所述第二软性印刷电路板 120进一步通 过对准标记固定相对位置。 可选地, 除端口连接件 201及端口部 202外, 第一软 性印刷电路板 110及所述第二软性印刷电路板 120在通过对准标记对准后, 可通 过本领域习知的方式加强两者间的连结, 以固定两者间的相对位置。
[0041] 此外, 本申请的信号传输装置可进一步包括第三软性印刷电路板 130。 第三软 性印刷电路板 130可与第二软性印刷电路板 120具有相同功能。 亦即, 第三软性 印刷电路板 130可电性连接显示模块 100的光源或触控面板 (未于图中表示), 传输 光源提供的光源信号及 /或传输触控面板提供的触控信号。 同样地, 第三软性印 刷电路板 130可与第一软性印刷电路板 110设置在显示模块 100的不同侧, 或者可 与第一软性印刷电路板 110设置在显示模块 100的同一侧。 第三软性印刷电路板 130亦可与第二软性印刷电路板 120设置在显示模块 100的不同侧, 或者可与第二 软性印刷电路板 120设置在显示模块 100的同一侧。
[0042] 可选地, 第三软性印刷电路板 130可与第二软性印刷电路板 120分别传输不同信 号。 举例而言, 可设置使第三软性印刷电路板 130电性连接显示模块 100的光源 , 传输光源信号, 并设置使第二软性印刷电路板 120电性连接显示模块 100的触 控面板, 传输触控信号。
[0043] 在本申请的另一实施例中, 更可藉由将上述说明的信号传输装置设置在液晶显 示装置内用以传输信号, 进而提供一种改良的液晶显示装置。
[0044] 除上述实施例以外, 还可依据实际状况及需求, 针对其中若干个组件进行优化 , 更加增强本申请的优点, 下文将以不同实施例进行示例说明。
[0045] 在一实施例中, 提供一种复合式信号传输装置。 针对上述第一软性印刷电路板
110、 第二软性印刷电路板 120及第三软性印刷电路板 130之间的配置关系进行优 化, 不使用端口连接件 201及端口部 202的结构电性连接以上三者, 而是直接将 第一软性印刷电路板 110、 第二软性印刷电路板 120及第三软性印刷电路板 130上 整合成多层结构的复合式信号传输装置 700。 如图 4所示, 将与第一软性印刷电 路板 110、 第二软性印刷电路板 120及第三软性印刷电路板 130等效的软性印刷电 路板分别以第一软性印刷电路板 111、 第二软性印刷电路板 121及第三软性印刷 电路板 131表示, 以与前述实施例区隔。 复合式信号传输装置 700是将第一软性 印刷电路板 111、 第二软性印刷电路板 121及第三软性印刷电路板 131重叠, 并 在三者间设置绝缘层 300的多层结构。 其中, 绝缘层 300设置若干个通孔 310, 并 分别设置导电柱 320于上述若干个通孔 310中, 使被分隔的第一软性印刷电路板 1 11、 第二软性印刷电路板 121及第三软性印刷电路板 131间可电性连接。 可选地 , 第一软性印刷电路板 110可改用硬式电路板。 此外, 亦可进一步设置绝缘层 30 0于第一软性印刷电路板 111下。
[0046] 绝缘层 300的材料可为例如: 聚酰亚胺 (Polyimide, PI)、 聚乙烯对苯二甲酸乙二 醇酯 (Polyethylene Terephthalate, PET)、 聚萘二甲酸乙二醇酉旨 (Polyethylene naphthalate' PEN)或其他本领域所常用的绝缘材料。 导电柱 320可为导电胶、 异方 性导电膜或其他本领域所常用的导电材料。
[0047] 举例而言, 第二软性印刷电路板 121可电性连接显示模块 100的光源, 第三软性 印刷电路板 131可电性连接显示模块 100的触控面板。 第二软性印刷电路板 121及 第三软性印刷电路板 131通过设置于通孔 310中的导电柱 320进而与第一软性印刷 电路板 111电性连接, 再进一步通过连接部 500与系统电性连接。 然而, 上述仅 为示例, 实际实施的配置可依照需求进行调整。 例如, 第二软性印刷电路板 121 可与第三软性印刷电路板 131同样设置在第一软性印刷电路板 111上的同一平面 , 且分别采用上述方法与第一软性印刷电路板 111电性连接。
[0048] 在本申请的示例性实施例中, 提供一种薄型复合式信号传输装置。 同样地, 针 对上述第一软性印刷电路板 110、 第二软性印刷电路板 120及第三软性印刷电路 板 130之间的配置关系进行优化。 将第一软性印刷电路板 110、 第二软性印刷电 路板 120及第三软性印刷电路板 130上整合应用类似于上一实施例中的多层结构
的复合软性印刷电路板, 形成薄型复合式信号传输装置 800, 结构如图 5所示。 在图 5中, 薄型复合式信号传输装置 800包含与第一软性印刷电路板 110的电路等 效的第一导电图形 112、 与第二软性印刷电路板
120的电路等效的第二导电图形 122及与第三软性印刷电路板 130的电路等效的第 三导电图形 132。 其中, 第一导电图形 112可设置于任意绝缘性基板 (未于图中标 示)上, 且绝缘性基板上设置有导电部 500, 与上述结构电性连接。
[0049] 在薄型复合式信号传输装置 800的底部及上述第一导电图样 112、 第二导电图样 122及第三导电图样 132之间设置绝缘层 400, 并在其中设置层间导通结构 410, 使第一导电图样 112、 第二导电图样 122及第三导电图样 132之间通过层间导通结 构 410电性连接。 层间导通结构 410的形成, 包括在绝缘层 400中形成至少一个通 孔, 且所述通孔的孔壁是经由化学及电镀工艺形成具有导电性的镀层。 镀层的 材料可为金属或导电塑料, 或其他同样具有导电性的材料。 所述镀层电性连接 层间导通结构上层及下层的导电图样, 使其彼此电性连接。
[0050] 薄型复合式信号传输装置 800与前一实施例的复合式信号传输装置 700不同的地 方是, 第一导电图样 112、 第二导电图样 122及第三导电图样 132是由铜箔压印而 成, 其厚度远小于前述的第一软性印刷电路板 111、 第二软性印刷电路板 121及 第三软性印刷电路板 131。 因此, 薄型复合式信号传输装置 800的整体厚度可小 于复合式信号传输装置 700。
[0051] 此外, 薄型复合式信号传输装置 800的绝缘层 400虽可为单一材料制成, 但其形 成分为两个部分, 分别为原先即为固态的绝缘层, 及固化前的液态绝缘层, 其 中, 绝缘层 400的材料可为聚酰亚胺 (Polyimide, PI)。 绝缘层 400是设置在第一导 电图样 112、 第二导电图样 122及第三导电图样 132之间。 在绝缘层 400与上述三 种导电图样之间涂布未固化的液态聚酰亚胺的前聚体溶液, 亦即绝缘层 400固化 前的材料, 并经由加热步骤去除溶液中的有机溶剂即可使其固化形成绝缘层 400 。 藉上述方式设置的绝缘层 400除了具有绝缘效果外, 更能作为辅助贴合第一导 电图样 112、 第二导电图样 122及第三导电图样 132的黏着材料, 使薄型复合式信 号传输装置 800的结构更加稳固。 总括而言, 本实施例的信号传输装置可通过如 图 6的流程制造, 其中步骤 S11到 S17是将上述说明的步骤简要地叙述, 仅为示例
的步骤, 可依需求作适当的修改。
[0052] 同样地, 本申请更包括藉由将上述说明的信号传输装置设置在液晶显示装置内 用以传输信号, 进而提供一种液晶显示装置, 而所述液晶显示装置可具有上述 信号传输装置的各实施例所具有的益处及效果。 在不影响电路板的讯号传输效 果的同吋, 改变电路板的设置方式, 通过减少与系统相连的端口, 并免除焊接 步骤这种变因较大的制程, 更能减少出错机率, 提高产品良率。
[0053] 其中, 上述说明的信号传输装置还可以设置在其他电子装置中, 不限于显示装 置, 在应用于显示装置吋, 显示装置的种类可以是 LCD显示装置、 OLED显示装 置、 QLED显示装置、 曲面显示装置或其他显示装置。
[0054] 以上所述的内容仅是依照本申请优选地实施例详细说明, 而非限制本申请的权 利范围。 本申请相关领域具有通常知识者皆应理解, 在不违背本申请的技术原 理及精神下, 可对上述实施例作出修改与变化。 因此本申请的权利范围应如权 利要求书内容所述。
Claims
权利要求书
一种信号传输装置, 其特征在于, 包括:
绝缘性基板;
连接部, 设置于所述绝缘性基板上, 与系统电性连接;
第一导电图样, 设置在所述绝缘性基材上, 与显示模块及所述连接 部电性连接;
第二导电图样, 设置在所述第一导电图样上, 与所述显示模块及所 述第一导电图样电性连接;
第三导电图样, 设置在所述第二导电图样上, 与所述显示模块及所 述第二导电图样电性连接;
绝缘层, 设置于所述第一导电图样、 所述第二导电图样及所述第三 导电图样之间, 且用于绝缘并贴合所述第一导电图样、 所述第二导电 图样及所述第三导电图样;
层间导通结构, 设置于所述绝缘层中, 使所述第二导电图样及所述 第三导电图样通过所述第一导电图样电性连接至所述系统。
如权利要求 1所述的信号传输装置, 其特征在于, 所述层间导通结构 包括在所述绝缘层形成垂直方向的通孔。
如权利要求 2所述的信号传输装置, 其特征在于, 所述通孔的孔壁上 设置具有导电性的镀层。
如权利要求 3所述的信号传输装置, 其特征在于, 所述镀层的材料是 金属。
如权利要求 3所述的信号传输装置, 其特征在于, 所述镀层的材料是 导电塑料。
如权利要求 1所述的信号传输装置, 其特征在于, 所述绝缘层与所述 第一导电图样及所述第二导电图样是通过使所述绝缘层固化前的前聚 体溶液固化形成所述绝缘层而贴合。
如权利要求 1所述的信号传输装置, 其特征在于, 所述绝缘层与所述 第二导电图样及所述第三导电图样是通过使所述绝缘层固化前的前聚
体溶液固化形成所述绝缘层而贴合。
[权利要求 8] 如权利要求 1所述的信号传输装置, 其特征在于, 所述绝缘层的材料 是聚酰亚胺。
[权利要求 9] 一种显示装置, 其特征在于, 包括:
显示模块;
系统;
其中, 所述显示模块及所述系统通过信号传输装置电性连接, 所 述信号传输装置包括:
绝缘性基板;
连接部, 设置于所述绝缘性基板上, 与所述系统电性连接; 第一导电图样, 设置在所述绝缘性基材上, 与所述显示模块及所述 连接部电性连接;
第二导电图样, 设置在所述第二导电图样上, 与所述显示模块及所 述第一导电图样电性连接;
第三导电图样, 设置在所述第一导电图样上, 与所述显示模块及所 述第二导电图样电性连接;
绝缘层, 设置于所述第一导电图样、 所述第二导电图样及所述第三 导电图样之间, 且用于绝缘并贴合所述第一导电图样、 所述第二导电 图样及所述第三导电图样;
层间导通结构, 设置于所述绝缘层中, 电性连接所述第一导电图样 、 所述第二导电图样及所述第三导电图样, 使所述第二导电图样及所 述第三导电图样通过所述第一导电图样电性连接至所述系统。
[权利要求 10] 如权利要求 9所述的显示装置, 其特征在于, 所述层间导通结构包括 在所述绝缘层形成垂直方向的通孔。
[权利要求 11] 如权利要求 10所述的显示装置, 其特征在于, 所述通孔的孔壁上设置 具有导电性的镀层。
[权利要求 12] 如权利要求 11所述的显示装置, 其特征在于, 所述镀层的材料是金属
如权利要求 11所述的显示装置, 其特征在于, 所述镀层的材料是选自 导电塑料。
如权利要求 9所述的显示装置, 其特征在于, 所述绝缘层与所述第一 导电图样及所述第二导电图样是通过使所述绝缘层固化前的前聚体溶 液固化形成所述绝缘层而贴合。
如权利要求 9所述的显示装置, 其特征在于, 所述绝缘层与所述第二 导电图样及所述第三导电图样是通过使所述绝缘层固化前的前聚体溶 液固化形成所述绝缘层而贴合。
如权利要求 9所述的显示装置, 其特征在于, 所述绝缘层的材料是聚 酰亚胺。
一种显示装置, 其特征在于, 包括:
显示模块;
系统;
其中, 所述显示模块及所述系统通过信号传输装置电性连接, 所 述信号传输装置包括:
绝缘性基板;
连接部, 设置于所述绝缘性基板上, 与所述系统电性连接; 第一导电图样, 设置在所述绝缘性基材上, 与所述显示模块及所述 连接部电性连接;
第二导电图样, 设置在所述第一导电图样上, 与所述显示模块及所 述第一导电图样电性连接;
第三导电图样, 设置在所述第一导电图样上, 与所述显示模块及所 述第二导电图样电性连接;
绝缘层, 设置于所述第一导电图样、 所述第二导电图样及所述第三 导电图样之间, 且用于绝缘, 与所述第一导电图样、 所述第二导电图 样及所述第三导电图样是通过使所述绝缘层固化前的前聚体溶液固化 形成所述绝缘层而贴合;
层间导通结构, 包括在所述绝缘层形成的垂直方向的通孔, 设置于
所述绝缘层中, 使所述第二导电图样及所述第三导电图样通过所述第 一导电图样电性连接至所述系统。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711022849.9A CN107765920B (zh) | 2017-10-26 | 2017-10-26 | 信号传输装置及显示装置 |
| CN201711022849.9 | 2017-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019080208A1 true WO2019080208A1 (zh) | 2019-05-02 |
Family
ID=61270813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/111206 Ceased WO2019080208A1 (zh) | 2017-10-26 | 2017-11-15 | 信号传输装置及显示装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107765920B (zh) |
| WO (1) | WO2019080208A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102921721B1 (ko) * | 2019-11-27 | 2026-02-04 | 삼성디스플레이 주식회사 | 표시 장치 |
| TWI738570B (zh) * | 2020-11-19 | 2021-09-01 | 英業達股份有限公司 | 訊號傳輸模組及折疊式電子裝置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101098053A (zh) * | 2007-06-20 | 2008-01-02 | 友达光电股份有限公司 | 电子装置、其包含的电路信号连接端模块及制造方法 |
| CN101763186A (zh) * | 2008-12-23 | 2010-06-30 | 胜华科技股份有限公司 | 触控面板 |
| CN102346587A (zh) * | 2010-08-03 | 2012-02-08 | 明兴光电股份有限公司 | 触控面板 |
| CN103838415A (zh) * | 2012-11-24 | 2014-06-04 | 宝宸(厦门)光学科技有限公司 | 柔性触控面板结构及其制造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2896794Y (zh) * | 2006-03-02 | 2007-05-02 | 威盛电子股份有限公司 | 具有差动信号传输结构的线路板 |
| CN102945846B (zh) * | 2012-09-28 | 2016-03-30 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| KR102006273B1 (ko) * | 2012-11-19 | 2019-08-02 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
| CN107068647B (zh) * | 2012-12-24 | 2021-02-09 | 日月光半导体制造股份有限公司 | 电子模块以及其制造方法 |
| CN103915443B (zh) * | 2013-04-02 | 2018-04-27 | 上海天马微电子有限公司 | 一种阵列基板及其制备方法、液晶显示装置 |
| TW201512914A (zh) * | 2013-09-17 | 2015-04-01 | Wintek Corp | 觸控面板與觸控顯示裝置 |
| CN104754868A (zh) * | 2013-12-30 | 2015-07-01 | 深南电路有限公司 | 电路板及其层间互连结构的实现方法和电路板的加工方法 |
-
2017
- 2017-10-26 CN CN201711022849.9A patent/CN107765920B/zh active Active
- 2017-11-15 WO PCT/CN2017/111206 patent/WO2019080208A1/zh not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101098053A (zh) * | 2007-06-20 | 2008-01-02 | 友达光电股份有限公司 | 电子装置、其包含的电路信号连接端模块及制造方法 |
| CN101763186A (zh) * | 2008-12-23 | 2010-06-30 | 胜华科技股份有限公司 | 触控面板 |
| CN102346587A (zh) * | 2010-08-03 | 2012-02-08 | 明兴光电股份有限公司 | 触控面板 |
| CN103838415A (zh) * | 2012-11-24 | 2014-06-04 | 宝宸(厦门)光学科技有限公司 | 柔性触控面板结构及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107765920A (zh) | 2018-03-06 |
| CN107765920B (zh) | 2020-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1671274B (zh) | 具有层间接合部位的柔性基板及其制造方法 | |
| CN102348340B (zh) | 制造多层柔性电路板的方法 | |
| US6525718B1 (en) | Flexible circuit board and liquid crystal display device incorporating the same | |
| CN106233825B (zh) | 印刷布线板 | |
| JP2004158545A (ja) | 多層基板及びその製造方法 | |
| CN102365005B (zh) | 电路板加工方法 | |
| WO2015014048A1 (zh) | 一种刚挠结合印制电路板及其制作方法 | |
| WO2019080208A1 (zh) | 信号传输装置及显示装置 | |
| US10709020B2 (en) | Component-embedded substrate and method for manufacturing component-embedded substrate | |
| WO2019080207A1 (zh) | 信号传输装置及显示装置的制造方法 | |
| WO2019080209A1 (zh) | 信号传输装置及显示装置 | |
| WO2019080210A1 (zh) | 信号传输装置及显示装置 | |
| CN105578749A (zh) | 电路板连接组件及移动终端 | |
| CN105578719A (zh) | 柔性电路板及终端 | |
| KR101154565B1 (ko) | 다층 연성회로기판 및 그 제조 방법 | |
| CN110580855A (zh) | 覆晶薄膜、覆晶薄膜基板及其制作方法、显示装置 | |
| TWI472273B (zh) | 電路板及其製作方法 | |
| CN104661428A (zh) | 一种双面柔性电路板及其制作方法 | |
| KR101050876B1 (ko) | 연성인쇄회로기판의 제조방법 및 그 연성인쇄회로기판 | |
| CN206490892U (zh) | 任意层互连高密度印刷电路板 | |
| JP2012247526A5 (zh) | ||
| CN105704908B (zh) | 移动终端、软硬结合板及其制造方法 | |
| US20070285905A1 (en) | Electronic device, display apparatus, flexible circuit board and fabrication method thereof | |
| KR20210054079A (ko) | 액정 폴리머 다층회로기판 및 제조방법 | |
| CN218735154U (zh) | 用于电路板的连接件和电路板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17929758 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 17929758 Country of ref document: EP Kind code of ref document: A1 |