WO2019071752A1 - 彩膜基板及其制作方法以及oled显示器件 - Google Patents

彩膜基板及其制作方法以及oled显示器件 Download PDF

Info

Publication number
WO2019071752A1
WO2019071752A1 PCT/CN2017/112998 CN2017112998W WO2019071752A1 WO 2019071752 A1 WO2019071752 A1 WO 2019071752A1 CN 2017112998 W CN2017112998 W CN 2017112998W WO 2019071752 A1 WO2019071752 A1 WO 2019071752A1
Authority
WO
WIPO (PCT)
Prior art keywords
black matrix
color
groove
layer
substrate
Prior art date
Application number
PCT/CN2017/112998
Other languages
English (en)
French (fr)
Inventor
李文杰
刘亚伟
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US15/579,195 priority Critical patent/US20190386253A1/en
Publication of WO2019071752A1 publication Critical patent/WO2019071752A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a color film substrate, a method for fabricating the same, and an OLED display device.
  • OLED Organic Light Emitting Diode
  • OLED has self-luminous, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, near 180° viewing angle, wide temperature range, flexible display and Many advantages such as large-area full-color display are recognized by the industry as the next generation of flat panel display emerging application technology.
  • the design of the color film substrate needs to refer to a color film substrate structure in a liquid crystal display (LCD).
  • the color filter substrate 100 of the conventional OLED display device generally includes a package cover 101, a black matrix (BM) 102 disposed on the package cover 101, and a space filled with the black matrix 102.
  • BM black matrix
  • the color resist layer 103 includes a red color resist R, a green color resist G, and a blue color resist B.
  • the support pillars 105 are used to abut the OLED substrate 200 to maintain the spacing between the color filter substrate 100 and the OLED substrate 200. Since the support pillar 105 is located above the flat layer 104, the spacing between the color filter substrate 100 and the OLED substrate 200 is large, there is a risk of displaying color mixture, and the material of the support pillar 105 is generally an organic photoresist, which is yellowish. It has a certain light transmission, which increases the risk of displaying color mixture.
  • IJP Inkjet Printing
  • a groove (Bank) B is usually formed on the substrate A to be printed for holding the printing ink and restricting the printing ink, and after drying and baking, printing
  • the ink shrinks in the groove B to form a film.
  • the contact angle between the groove B and the printing ink has a great influence on the flatness of the film formation and the uniformity of the film thickness, such as If the contact angle is too large, the ink will be thicker in the middle and thinner on both sides as shown in Fig. 2. If the contact angle is small, the ink will be thin and thick on both sides as shown in Fig. 3.
  • the object of the present invention is to provide a color filter substrate, which can improve the flatness and film thickness uniformity of the color color resist layer, reduce the risk of display color mixing, and simplify the process, and the color film substrate can be improved by applying to the OLED display device. Display quality.
  • Another object of the present invention is to provide a method for fabricating a color filter substrate.
  • the color resist layer in the color filter substrate produced by the method has better flatness, uniform film thickness, less risk of color mixing, and process It's simpler.
  • Another object of the present invention is to provide an OLED display device, wherein the color color resist layer in the color filter substrate has better flatness, uniform film thickness, less risk of display color mixing, and improved display quality.
  • the present invention firstly provides a color filter substrate, comprising: a carrier substrate; a first black matrix disposed on the carrier substrate; a bank layer disposed on the first black matrix, a black matrix covering a second black matrix of the bank layer and a color color resist layer;
  • the first black matrix has a plurality of first grooves arranged in an array
  • the bank layer has a plurality of second grooves arranged in an array, and a second groove corresponds to a first groove Upper
  • the color resist layer is filled in a space defined by the carrier substrate, the first recess and the second recess;
  • the surface of the carrier substrate has hydrophilicity, the surface of the first groove has hydrophilicity, and the surface of the second groove has hydrophobicity; the contact angle of the first groove is smaller than the second groove Contact angle.
  • the color filter substrate further includes a protective layer covering the color resist layer, the second black matrix and the first black matrix.
  • the materials of the first black matrix and the second black matrix are both black organic resin or black inorganic thin film, and the material of the bank layer is an organic resin containing fluorine element.
  • the black inorganic film is a metal oxide or a metal sulfide.
  • the first black matrix has a thickness of 100 nm to 5000 nm
  • the bank layer has a thickness of 1 um to 10 um
  • the second black matrix has a thickness of 100 nm to 2000 nm.
  • the film thickness of the color resist layer is the same as the thickness of the first black matrix.
  • the color color resist layer is formed by dispersing a dye of three colors of red, green and blue in an organic monomer or dispersing a quantum dot material of three colors of red, green and blue in an organic solvent. The color resistance of the quantum dot ink after drying and baking.
  • the invention also provides a method for manufacturing a color film substrate, comprising the following steps:
  • Step S1 providing a carrier substrate and performing a hydrophilic treatment on the surface of the carrier substrate;
  • Step S2 forming a first black matrix having a hydrophilic surface on the carrier substrate
  • the first black matrix has a plurality of first grooves arranged in an array
  • Step S3 forming a surface dam layer on the first black matrix
  • the dam layer has a plurality of second grooves arranged in an array; a second groove correspondingly located above a first groove; a contact angle of the first groove is smaller than a contact angle of the second groove;
  • Step S4 printing a color color resist layer in a space defined by the carrier substrate, the first groove and the second groove by using an inkjet printing process;
  • Step S5 forming a second black matrix covering the bank layer on the first black matrix.
  • the method for fabricating the color filter substrate further includes a step S6 of forming a protective layer on the color resist layer, the second black matrix, and the first black matrix.
  • the present invention also provides an OLED display device comprising the above color film substrate and an OLED substrate disposed opposite to the color film substrate.
  • the color film substrate provided by the present invention is provided with a first black matrix and a second black matrix to perform light shielding together, which can reduce the risk of displaying color mixture; and the first groove and the dam layer of the first black matrix are disposed.
  • the second groove co-assembles and limits the printing ink required for the color resist layer, and the surface of the first groove has hydrophilicity, and the surface of the second groove has hydrophobicity, which can improve color color resistance.
  • the flatness of the layer and the uniformity of the film thickness, the application of the color filter substrate to the OLED display device can improve the display quality; and the installation of the dam layer and the second black matrix instead of the support column in the prior art can simplify the process.
  • the method for fabricating a color film substrate provided by the invention can produce the color film substrate, so that the color color resist layer in the color film substrate has better flatness, uniform film thickness, less risk of display color mixing, and simple process.
  • the OLED display device provided by the invention comprises the above color film substrate, so the color color resist layer in the color film substrate has better flatness, uniform film thickness, less risk of display color mixing, and the display quality of the OLED display device is improved.
  • FIG. 1 is a schematic cross-sectional structural view of a conventional OLED display device
  • FIG. 2 is a schematic view showing a state of film thickness in a case where a contact angle is large when a film is formed by printing;
  • FIG. 3 is a schematic view showing a state of film thickness in a case where a contact angle is small when a film is formed by printing;
  • FIG. 4 is a schematic cross-sectional structural view of a color filter substrate of the present invention.
  • FIG. 5 is a flow chart of a method of fabricating a color filter substrate of the present invention.
  • FIG. 10 are schematic diagrams showing steps S1, S2, S3, S4, and S5 of the method for fabricating a color filter substrate of the present invention
  • FIG. 11 is a schematic cross-sectional view showing an OLED display device of the present invention.
  • the present invention firstly provides a color filter substrate, comprising: a carrier substrate 11, a first black matrix 12 disposed on the carrier substrate 11, and a bank layer 13 disposed on the first black matrix 12. a second black matrix 14 covering the bank layer 13 , a color color resist layer 15 , and a cover of the color color resist layer 15 , the second black matrix 14 and the first black matrix 12 on the first black matrix 12 .
  • the first black matrix 12 has a plurality of first grooves 121 arranged in an array, and the bank layer 13 has a plurality of second grooves 131 arranged in an array, and a second groove 131 is correspondingly located.
  • the color resist layer 15 is filled in a space defined by the carrier substrate 11, the first recess 121 and the second recess 131.
  • the surface of the carrier substrate 11 has hydrophilicity
  • the surface of the first groove 121 has hydrophilicity
  • the surface of the second groove 131 has hydrophobicity
  • the contact angle of the first groove 121 is smaller than the contact angle of the second groove 131 to enhance the hydrophilicity of the first groove 121
  • the contact angle of the second groove 131 is larger to enhance the second groove.
  • the hydrophobicity of 131 is formed by a printing method, especially an inkjet printing method, the first groove 121 of the first black matrix 12 and the second groove 131 of the bank layer 13 are co-assembled and restricted in production.
  • the printing ink required for the color resist layer 15 is distributed due to the hydrophilicity of the surface of the substrate 11, the hydrophilicity of the surface of the first groove 121, and the hydrophobicity of the surface of the second groove 131.
  • the coloring resist layer 15 formed by drying and baking of the printing ink has better flatness and film thickness uniformity, and the color film substrate is applied to the OLED display device to improve display quality.
  • the first black matrix 12 and the second black matrix 14 are shielded together, and the shading effect is more Ok, it can reduce the risk of displaying color mixture.
  • the dam layer 13 and the second black matrix 14 are used to replace the support columns in the prior art, which can simplify the process; after the color film substrate of the present invention is combined with the OLED substrate, the spacing between the color film substrate and the OLED substrate It is reduced, and the risk of displaying color mixture is further reduced.
  • the carrier substrate 11 is a glass substrate or a flexible substrate substrate, and the surface of the carrier substrate 11 is hydrophilically treated to obtain hydrophilicity.
  • the thickness of the first black matrix 12 is preferably 100 nm to 5000 nm, which can be defined according to actual needs.
  • the material of the first black matrix 12 is a black organic resin or a black inorganic film; further, the black inorganic film may be a metal oxide or a metal sulfide, such as copper oxide, iron oxide, manganese dioxide, and tetraoxide Iron, molybdenum sulfide, copper sulfide, etc.
  • the first black matrix 12 also functions to accommodate the color resist layer 15 due to the arrangement of the first recess 121.
  • the thickness of the bank layer 13 is preferably 1 um to 10 um, which can be defined according to actual needs.
  • the material of the bank layer 13 is an organic resin containing a fluorine (F) element.
  • the thickness of the second black matrix 14 is preferably from 100 nm to 2000 nm, which can be defined according to actual needs.
  • the material of the second black matrix 14 is also a black organic resin or a black inorganic film; further, the black inorganic film may be a metal oxide or a metal sulfide such as copper oxide, iron oxide, manganese dioxide, and tetraoxide. Triiron, molybdenum sulfide, copper sulfide, etc.
  • the color resist layer 15 includes a red color resist R, a green color set G, and a blue color resist B.
  • the film thickness of the color resist layer 15 is preferably the same as the thickness of the first black matrix 12.
  • the color resist layer 15 may be an organic color resist formed by dispersing dyes of three colors of red, green, and blue in an organic monomer, or may be dispersed in a quantum dot material of three colors of red, green, and blue.
  • the color resistance of the quantum dot ink formed in the organic solvent after drying and baking is preferred, the latter.
  • the protective layer 17 may be a single layer or a triple layer film, preferably a single layer film.
  • the single layer film is a dense inorganic film such as silicon oxide, silicon nitride or aluminum oxide, and has a thickness of 500 nm to 2000 nm.
  • the three-layer film is an organic film such as an organic polymer resin film or a SiOC film sandwiched between two inorganic film layers as a buffer layer and having a thickness of 1 um to 20 um.
  • the function of the protective layer 17 is to avoid the influence of the precipitation gas generated by the color film substrate during the process on the OLED in the OLED substrate of the color film substrate pair, and the organic filler in the color film substrate and the OLED display device package. To improve the life of OLED display devices.
  • the present invention also provides a method for fabricating the above color film substrate, comprising the following steps:
  • Step S1 as shown in FIG. 6, the carrier substrate 11 is provided and the surface of the carrier substrate 11 is provided. Do a hydrophilic treatment.
  • the carrier substrate 11 is a glass substrate or a flexible substrate.
  • the surface of the carrier substrate 11 may be subjected to a hydrophilic treatment by irradiating the surface of the carrier substrate 11 with ultraviolet light (UV) or plasma (Plasma) for a certain period of time, or by using a solvent against the surface of the carrier substrate 11.
  • UV ultraviolet light
  • Pasma plasma
  • the modification is performed so that the surface of the carrier substrate 11 is hydrophilic.
  • Step S2 as shown in FIG. 7, a first black matrix 12 having a hydrophilic surface is formed on the carrier substrate 11.
  • the first black matrix 12 has a plurality of first grooves 121 arranged in an array.
  • the thickness of the first black matrix 12 is preferably 100 nm to 5000 nm, which can be defined according to actual needs.
  • the material of the first black matrix 12 is a black organic resin or a black inorganic film; further, the black inorganic film may be a metal oxide or a metal sulfide, such as copper oxide, iron oxide, manganese dioxide, and tetraoxide Iron, molybdenum sulfide, copper sulfide, etc.
  • the step S2 may be a slit coating, a screen printing, a spin coating, an inkjet printing, or a flow.
  • the organic film forming process such as film formation forms a film, and the first black matrix 12 is formed by a process such as exposure and development.
  • the step S2 may be performed by a process such as sputtering, thermal evaporation, chemical vapor deposition (CVD) or physical vapor deposition (PVD).
  • the first black matrix 12 forms a first black matrix 12, for example by sputtering a layer of copper sulfide.
  • Step S3 as shown in FIG. 8, a dam layer 13 having a hydrophobic surface is formed on the first black matrix 12.
  • the dam layer 13 has a plurality of second grooves 131 arranged in an array; a second groove 131 is correspondingly located above a first groove 121; the contact angle of the first groove 121 is smaller than the second groove The contact angle of the groove 131.
  • the thickness of the bank layer 13 is preferably 1 um to 10 um, which can be defined according to actual needs.
  • the material of the bank layer 13 is an organic resin containing a fluorine element.
  • the film may be formed by an organic film forming process such as slit coating, screen printing, spin coating, inkjet printing or casting film formation, and then the bank layer 13 is formed by exposure, development, and the like.
  • Step S4 as shown in FIG. 9, the color resist layer 15 is printed in the space defined by the carrier substrate 11, the first recess 121 and the second recess 131 by an inkjet printing process.
  • the color resist layer 15 includes a red color resist R, a green color set G, and a blue color resist B.
  • the film thickness of the color resist layer 15 is preferably the same as the thickness of the first black matrix 12.
  • step S4 the quantum dot materials formed by dispersing the red, green and blue quantum dot materials in an organic solvent are firstly used, and then the quantum dot ink is used as a raw material to perform inkjet printing, and then dried.
  • a color resist layer 15 is formed after baking.
  • the surface of the substrate 11 has hydrophilicity.
  • the surface of the first groove 121 has hydrophilicity
  • the surface of the second groove 131 has hydrophobicity
  • the distribution of the printing ink is relatively uniform, so that the flatness of the color color resist layer 15 formed by the printing ink after drying and baking is flat. And the film thickness uniformity is good.
  • Step S5 as shown in FIG. 10, a second black matrix 14 covering the bank layer 13 is formed on the first black matrix 12.
  • the thickness of the second black matrix 14 is preferably 100 nm to 2000 nm, which can be defined according to actual needs.
  • the material of the second black matrix 14 is also a black organic resin or a black inorganic film; further, the black inorganic film may be a metal oxide or a metal sulfide such as copper oxide, iron oxide, manganese dioxide, and tetraoxide. Triiron, molybdenum sulfide, copper sulfide, etc.
  • the step S5 may form a film by an organic film forming process such as slit coating, screen printing, spin coating, inkjet printing or casting film formation, and then The second black matrix 14 is formed by a process such as exposure, development, or the like.
  • the step S5 may be performed by a process such as sputtering, thermal evaporation, chemical vapor deposition or physical vapor deposition to obtain the second black matrix 14, for example, by sputtering.
  • a layer of copper sulfide is shot to form the second black matrix 14.
  • step S6 referring to FIG. 4, a protective layer 17 is formed on the color resist layer 15, the second black matrix 14, and the first black matrix 12, and the protective layer 17 has a full surface coverage.
  • the protective layer 17 may be a single layer or a triple layer film, preferably a single layer film.
  • the single layer film is a dense inorganic film such as silicon oxide, silicon nitride or aluminum oxide, and has a thickness of 500 nm to 2000 nm.
  • the three-layer film is an organic film such as an organic polymer resin film or a SiOC film sandwiched between two inorganic film layers as a buffer layer and having a thickness of 1 um to 20 um.
  • the step S6 may be performed by chemical vapor deposition, plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD) or sputtering to form a protective layer.
  • PECVD plasma enhanced chemical vapor deposition
  • ALD atomic layer deposition
  • sputtering to form a protective layer.
  • the protective layer 17 is formed, for example, by plasma-enhanced chemical vapor deposition of a layer of silicon oxide.
  • the step S6 may be performed by chemical vapor deposition, plasma enhanced chemical vapor deposition, atomic layer deposition or sputtering to form an inorganic thin film therein, and inkjet is used.
  • a process such as printing or plasma enhanced chemical vapor deposition is used to fabricate an organic film therein.
  • the color film substrate obtained by the above method has better flatness and film thickness uniformity of the color color resist layer 15, and the color film substrate is applied to the OLED display device to improve display quality;
  • the black matrix 12 and the second black matrix 14 together shield light, and the light blocking effect is better, and the risk of displaying color mixture can be reduced;
  • the bank layer 13 and the second black matrix 14 are used to replace the support columns in the prior art, which can be simplified. Process.
  • the present invention further provides an OLED display device comprising the color filter substrate 1 as shown in FIG. 4 and the OLED substrate 2 disposed opposite to the color filter substrate 1 .
  • the structure of the color filter substrate 1 will not be repeatedly described here.
  • the OLED substrate 2 is the same as the prior art, and includes a substrate 21, a pixel defining layer 22, an OLED D, and a passivation layer 26, wherein the OLED D further includes an anode 23, an organic functional layer 24, and a cathode 25 which are sequentially stacked. No expansion is described here.
  • the color resist layer 15 in the color filter substrate 1 has better flatness, uniform film thickness, less risk of display color mixing, and improved display quality of the OLED display device.
  • the color film substrate of the present invention is provided with a first black matrix and a second black matrix for shielding together, which can reduce the risk of displaying color mixture; and the first groove of the first black matrix and the second layer of the bank layer
  • the grooves collectively contain and limit the printing ink required for the color resist layer, and the surface of the first groove has hydrophilicity, and the surface of the second groove has hydrophobicity, which can improve the color color resist layer.
  • the flatness and film thickness uniformity, the color film substrate applied to the OLED display device can improve the display quality; the dam layer and the second black matrix are provided instead of the support column in the prior art, which can simplify the process.
  • the color film substrate can be produced, so that the color color resist layer in the color filter substrate has better flatness, uniform film thickness, less risk of color mixing, and simple process.
  • the OLED display device of the invention comprises the above color film substrate, so the color color resist layer in the color film substrate has better flatness, uniform film thickness, less risk of display color mixing, and improved display quality of the OLED display device.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Filters (AREA)

Abstract

一种彩膜基板及其制作方法以及OLED显示器件。该彩膜基板设置第一黑色矩阵(12)与第二黑色矩阵(14)共同进行遮光，能够减小显示混色的风险；设置第一黑色矩阵(12)的第一凹槽(121)与堤坝层(13)的第二凹槽(131)共同盛装并限制制作彩色色阻层(15)所需的打印墨水，且第一凹槽(121)的表面具有亲水性，第二凹槽(131)的表面具有疏水性，能够改善彩色色阻层(15)的平整度及膜厚均匀性，将该彩膜基板应用于OLED显示器件能够提升显示质量；设置堤坝层(13)与第二黑色矩阵(14)来替代现有技术中的支撑柱，能够简化制程。

Description

彩膜基板及其制作方法以及OLED显示器件 技术领域
本发明涉及显示技术领域，尤其涉及一种彩膜基板及其制作方法以及OLED显示器件。
背景技术
有机发光二极管显示器件(Organic Light Emitting Diode，OLED)具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽、可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是下一代的平面显示器新兴应用技术。
OLED显示器件实现全彩显示的方式有以下几种：
一、采用红绿蓝三种颜色的有机发光层直接发光；
二、采用白色有机发光层加彩膜(Colour Filter，CF)；
三、采用蓝色有机发光层加光色转换层。
目前，对于采用白色有机发光层加彩膜实现全彩显示的OLED显示器件，其彩膜基板的设计需要参照液晶显示器(Liquid Crystal Display，LCD)中的彩膜基板结构。如图1所示，现有OLED显示器件的彩膜基板100一般包括封装盖板101、设在所述封装盖板101上的黑色矩阵(Black Matrix，BM)102、填充所述黑色矩阵102空隙的彩色色阻层103、覆盖所述黑色矩阵102与彩色色阻层103的平坦层(Over Coat)104及设在所述平坦层104上的支撑柱(Photo spacer，PS)105，其中所述彩色色阻层103包括红色色阻R、绿色色阻G与蓝色色阻B，所述支撑柱105用于抵接OLED基板200以保持彩膜基板100与OLED基板200之间的间距。由于支撑柱105位于平坦层104之上，会造成彩膜基板100与OLED基板200之间的间距较大，存在显示混色的风险，并且支撑柱105的材料一般为有机光阻，呈现淡黄色，有一定的光透过性，增加了显示混色的风险。
喷墨打印(Inkjet Printing，IJP)是一种高效的成膜技术，不需要掩膜板或者曝光显影工艺，材料利用率较高。采用喷墨打印技术制备彩色色阻层也是一种具有创新性的想法。请参阅图2与图3，采用打印方式成膜时，通常会在待打印的基板A上制作出凹槽(Bank)B用于盛装打印墨水并限制住打印墨水，经干燥烘烤后，打印墨水在凹槽B里收缩形成薄膜。凹槽B与打印墨水的接触角对于成膜的平整度及膜厚均匀性有很大的影响，如 果接触角偏大，会如图2所示那样造成墨水中间厚、两侧薄，而如果接触角偏小，会如图3所示那样造成墨水中间薄、两侧厚。
如何降低OLED显示器件中彩膜基板的显示混色的风险以及如何改善通过打印方式制备的彩色色阻层的平整度与膜厚均匀性是需要解决的技术问题。
发明内容
本发明的目的在于提供一种彩膜基板，能够改善彩色色阻层的平整度及膜厚均匀性，减小显示混色的风险，并简化制程，将该彩膜基板应用于OLED显示器件能够提升显示质量。
本发明的另一目的在于提供一种彩膜基板的制作方法，通过该方法制作的彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，且制程较简单。
本发明的目的还在于提供一种OLED显示器件，其彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，显示质量得以提升。
为实现上述目的，本发明首先提供一种彩膜基板，包括：载体基板、设在所述载体基板上的第一黑色矩阵、设在所述第一黑色矩阵上的堤坝层、于所述第一黑色矩阵上覆盖所述堤坝层的第二黑色矩阵以及彩色色阻层；
所述第一黑色矩阵具有呈阵列式排布的多个第一凹槽，所述堤坝层具有呈阵列式排布的多个第二凹槽，一第二凹槽对应位于一第一凹槽上方；所述彩色色阻层填充于由所述载体基板、第一凹槽与第二凹槽限定的空间内；
所述载体基板的表面具有亲水性，所述第一凹槽的表面具有亲水性，所述第二凹槽的表面具有疏水性；所述第一凹槽的接触角小于第二凹槽的接触角。
所述彩膜基板还包括覆盖所述彩色色阻层、第二黑色矩阵与第一黑色矩阵的保护层。
所述第一黑色矩阵与第二黑色矩阵的材料均为黑色有机树脂或黑色无机薄膜，所述堤坝层的材料为含有氟元素的有机树脂。
所述黑色无机薄膜为金属氧化物或金属硫化物。
所述第一黑色矩阵的厚度为100nm～5000nm，所述堤坝层的厚度为1um～10um，所述第二黑色矩阵的厚度为100nm～2000nm。
所述彩色色阻层的膜厚与第一黑色矩阵的厚度相同。
所述彩色色阻层为将红、绿、蓝三种颜色的染料分散在有机单体中形成的有机色阻或将红、绿、蓝三种颜色的量子点材料分散在有机溶剂中形成的量子点墨水经干燥烘烤后形成的色阻。
本发明也提供一种彩膜基板的制作方法，包括如下步骤：
步骤S1、提供载体基板并对所述载体基板的表面做亲水处理；
步骤S2、在所述载体基板上制作出表面亲水的第一黑色矩阵；
所述第一黑色矩阵具有呈阵列式排布的多个第一凹槽；
步骤S3、在所述第一黑色矩阵上制作出表面疏水的堤坝层；
所述堤坝层具有呈阵列式排布的多个第二凹槽；一第二凹槽对应位于一第一凹槽上方；所述第一凹槽的接触角小于第二凹槽的接触角；
步骤S4、采用喷墨打印工艺在所述载体基板、第一凹槽与第二凹槽限定的空间内打印出彩色色阻层；
步骤S5、于所述第一黑色矩阵上制作出覆盖所述堤坝层的第二黑色矩阵。
所述彩膜基板的制作方法还包括步骤S6，在所述彩色色阻层、第二黑色矩阵与第一黑色矩阵上制作出保护层。
本发明还提供一种OLED显示器件，包括上述彩膜基板及与所述彩膜基板相对设置的OLED基板。
本发明的有益效果：本发明提供的彩膜基板，设置第一黑色矩阵与第二黑色矩阵共同进行遮光，能够减小显示混色的风险；设置第一黑色矩阵的第一凹槽与堤坝层的第二凹槽共同盛装并限制制作彩色色阻层所需的打印墨水，且所述第一凹槽的表面具有亲水性，所述第二凹槽的表面具有疏水性，能够改善彩色色阻层的平整度及膜厚均匀性，将该彩膜基板应用于OLED显示器件能够提升显示质量；设置堤坝层与第二黑色矩阵来替代现有技术中的支撑柱，能够简化制程。本发明提供的彩膜基板的制作方法，能够制作出上述彩膜基板，使得彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，且制程较简单。本发明提供的OLED显示器件，包括上述彩膜基板，所以彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，OLED显示器件的显示质量得以提升。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的OLED显示器件的剖面结构示意图；
图2为采用打印方式成膜时在接触角偏大情况下的膜厚状态的示意图；
图3为采用打印方式成膜时在接触角偏小情况下的膜厚状态的示意图；
图4为本发明的彩膜基板的剖面结构示意图；
图5为本发明的彩膜基板的制作方法的流程图；
图6至图10分别为本发明的彩膜基板的制作方法的步骤S1、步骤S2、步骤S3、步骤S4、步骤S5的示意图；
图11为本发明的OLED显示器件的剖面结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图4，本发明首先提供一种彩膜基板，包括：载体基板11、设在所述载体基板11上的第一黑色矩阵12、设在所述第一黑色矩阵12上的堤坝层13、于所述第一黑色矩阵12上覆盖所述堤坝层13的第二黑色矩阵14、彩色色阻层15以及覆盖所述彩色色阻层15、第二黑色矩阵14与第一黑色矩阵12的保护层17。
所述第一黑色矩阵12具有呈阵列式排布的多个第一凹槽121，所述堤坝层13具有呈阵列式排布的多个第二凹槽131，一第二凹槽131对应位于一第一凹槽121上方；所述彩色色阻层15填充于由所述载体基板11、第一凹槽121与第二凹槽131限定的空间内。
所述载体基板11的表面具有亲水性，所述第一凹槽121的表面具有亲水性，所述第二凹槽131的表面具有疏水性，且所述第一凹槽121的接触角小于第二凹槽131的接触角，所述第一凹槽121的接触角较小以增强第一凹槽121的亲水性，第二凹槽131的接触角较大以增强第二凹槽131的疏水性。当采用打印方式，尤其是喷墨打印方式来制作所述彩色色阻层15时，所述第一黑色矩阵12的第一凹槽121与堤坝层13的第二凹槽131共同盛装并限制制作彩色色阻层15所需的打印墨水，由于所述基板11的表面具有亲水性、第一凹槽121的表面具有亲水性、第二凹槽131的表面具有疏水性，打印墨水的分布会比较均匀，从而打印墨水经干燥烘烤后形成的彩色色阻层15的平整度及膜厚均匀性较好，将该彩膜基板应用于OLED显示器件能够提升显示质量。
所述第一黑色矩阵12与第二黑色矩阵14共同进行遮光，遮光效果更 好，能够减小显示混色的风险。
所述堤坝层13与第二黑色矩阵14用来替代现有技术中的支撑柱，能够简化制程；将本发明的彩膜基板与OLED基板对组后，彩膜基板与OLED基板之间的间距得以减小，也进一步了减小了显示混色的风险。
具体地：
所述载体基板11为玻璃基板或柔性衬底基板，该载体基板11的表面经亲水性处理获得亲水性。
所述第一黑色矩阵12的厚度优选为100nm～5000nm，可根据实际需求进行限定。所述第一黑色矩阵12的材料为黑色有机树脂或黑色无机薄膜；进一步地，所述黑色无机薄膜可为金属氧化物或金属硫化物，比如氧化铜、氧化铁、二氧化锰、四氧化三铁、硫化钼、硫化铜等。该第一黑色矩阵12除了能够遮光外，由于其第一凹槽121的设置，也起到了容纳彩色色阻层15的作用。
所述堤坝层13的厚度优选为1um～10um，可根据实际需求进行限定。所述堤坝层13的材料为含有氟(F)元素的有机树脂。
所述第二黑色矩阵14的厚度优选为100nm～2000nm，可根据实际需求进行限定。所述第二黑色矩阵14的材料亦为黑色有机树脂或黑色无机薄膜；进一步地，所述黑色无机薄膜可为金属氧化物或金属硫化物，比如氧化铜、氧化铁、二氧化锰、四氧化三铁、硫化钼、硫化铜等。
所述彩色色阻层15包括红色色阻R、绿色色组G与蓝色色阻B。所述彩色色阻层15的膜厚优选与第一黑色矩阵12的厚度相同。所述彩色色阻层15可以是将红、绿、蓝三种颜色的染料分散在有机单体中形成的有机色阻，也可以是将红、绿、蓝三种颜色的量子点材料分散在有机溶剂中形成的量子点墨水经干燥烘烤后形成的色阻，优选后者。
所述保护层17可以为单层或三层的薄膜，优选为单层薄膜。所述单层薄膜为致密的氧化硅、氮化硅或者氧化铝等无机物薄膜，厚度为500nm～2000nm。所述三层薄膜为两层无机物薄膜之间夹一层作为缓冲层且厚度为1um～20um的有机物薄膜，如有机聚合物树脂薄膜或SiOC薄膜。该保护层17的作用是避免彩膜基板在制程过程中产生的析出气体对与彩膜基板对组的OLED基板中OLED的影响，还可以隔绝彩膜基板与OLED显示器件封装中的有机填充材，提高OLED显示器件的寿命。
请参阅图5，本发明也提供一种上述彩膜基板的制作方法，包括如下步骤：
步骤S1、如图6所示，提供载体基板11并对所述载体基板11的表面 做亲水处理。
具体地：
所述载体基板11为玻璃基板或柔性衬底基板。
对所述载体基板11的表面做亲水处理的方式可以是对所述载体基板11的表面照射一定时间的紫外光(UV)或等离子体(Plasma)，也可以采用溶剂对载体基板11的表面进行改性，使得载体基板11的表面具有亲水性。
步骤S2、如图7所示，在所述载体基板11上制作出表面亲水的第一黑色矩阵12。所述第一黑色矩阵12具有呈阵列式排布的多个第一凹槽121。
具体地，所述第一黑色矩阵12的厚度优选为100nm～5000nm，可根据实际需求进行限定。所述第一黑色矩阵12的材料为黑色有机树脂或黑色无机薄膜；进一步地，所述黑色无机薄膜可为金属氧化物或金属硫化物，比如氧化铜、氧化铁、二氧化锰、四氧化三铁、硫化钼、硫化铜等。
若所述第一黑色矩阵12的材料为黑色有机树脂，则该步骤S2可以采用狭缝涂布(Slit Coating)、丝网印刷(Screen Printing)、旋涂(Spin Coating)、喷墨打印或流延成膜等有机物成膜工艺形成薄膜，再经曝光、显影等制程形成第一黑色矩阵12。
若所述第一黑色矩阵12的材料为黑色无机薄膜，则该步骤S2可以采用溅射(Sputter)、热蒸镀、化学汽相沉积(CVD)或物理汽相沉积(PVD)等工艺制得第一黑色矩阵12，例如通过溅射一层硫化铜来形成第一黑色矩阵12。
步骤S3、如图8所示，在所述第一黑色矩阵12上制作出表面疏水的堤坝层13。所述堤坝层13具有呈阵列式排布的多个第二凹槽131；一第二凹槽131对应位于一第一凹槽121上方；所述第一凹槽121的接触角小于第二凹槽131的接触角。
具体地，所述堤坝层13的厚度优选为1um～10um，可根据实际需求进行限定。所述堤坝层13的材料为含有氟元素的有机树脂。
该步骤S3可以采用狭缝涂布、丝网印刷、旋涂、喷墨打印或流延成膜等有机物成膜工艺形成薄膜，再经曝光、显影等制程形成堤坝层13。
步骤S4、如图9所示，采用喷墨打印工艺在所述载体基板11、第一凹槽121与第二凹槽131限定的空间内打印出彩色色阻层15。
具体地，所述彩色色阻层15包括红色色阻R、绿色色组G与蓝色色阻B。所述彩色色阻层15的膜厚优选与第一黑色矩阵12的厚度相同。
该步骤S4先将红、绿、蓝三种颜色的量子点材料分散在有机溶剂中形成的量子点墨水，然后以所述量子点墨水为原料实施喷墨打印，再经干燥 烘烤后形成彩色色阻层15。
在喷墨打印过程中，由于所述第一黑色矩阵12的第一凹槽121与堤坝层13的第二凹槽131共同盛装并限制所述打印墨水，所述基板11的表面具有亲水性、第一凹槽121的表面具有亲水性、第二凹槽131的表面具有疏水性，打印墨水的分布会比较均匀，从而打印墨水经干燥烘烤后形成的彩色色阻层15的平整度及膜厚均匀性较好。
步骤S5、如图10所示，于所述第一黑色矩阵12上制作出覆盖所述堤坝层13的第二黑色矩阵14。
具体地，所述第二黑色矩阵14的厚度优选为100nm～2000nm，可根据实际需求进行限定。所述第二黑色矩阵14的材料亦为黑色有机树脂或黑色无机薄膜；进一步地，所述黑色无机薄膜可为金属氧化物或金属硫化物，比如氧化铜、氧化铁、二氧化锰、四氧化三铁、硫化钼、硫化铜等。
若所述第二黑色矩阵14的材料为黑色有机树脂，则该步骤S5可以采用狭缝涂布、丝网印刷、旋涂、喷墨打印或流延成膜等有机物成膜工艺形成薄膜，再经曝光、显影等制程形成第二黑色矩阵14。
若所述第二黑色矩阵14的材料为黑色无机薄膜，则该步骤S5可以采用溅射、热蒸镀、化学汽相沉积或物理汽相沉积等工艺制得第二黑色矩阵14，例如通过溅射一层硫化铜来形成第二黑色矩阵14。
以及步骤S6、请参阅图4，在所述彩色色阻层15、第二黑色矩阵14与第一黑色矩阵12上制作出保护层17，该保护层17具有整面覆盖性。
具体地，所述保护层17可以为单层或三层的薄膜，优选为单层薄膜。所述单层薄膜为致密的氧化硅、氮化硅或者氧化铝等无机物薄膜，厚度为500nm～2000nm。所述三层薄膜为两层无机物薄膜之间夹一层作为缓冲层且厚度为1um～20um的有机物薄膜，如有机聚合物树脂薄膜或SiOC薄膜。
若所述保护层17为单层的无机物薄膜，则该步骤S6可以采用化学汽相沉积、等离子体增强化学汽相沉积(PECVD)、原子层沉积(ALD)或溅射工艺制作出保护层17，例如通过等离子体增强化学汽相沉积一层氧化硅来形成保护层17。
若所述保护层17为三层的薄膜，则该步骤S6可以采用化学汽相沉积、等离子体增强化学汽相沉积、原子层沉积或溅射工艺来制作其中的无机物薄膜，而采用喷墨打印或等离子体增强化学汽相沉积等工艺来制作其中的有机物薄膜。
由上述方法制得的彩膜基板，其彩色色阻层15的平整度及膜厚均匀性较好，将该彩膜基板应用于OLED显示器件能够提升显示质量；所述第一 黑色矩阵12与第二黑色矩阵14共同进行遮光，遮光效果更好，能够减小显示混色的风险；所述堤坝层13与第二黑色矩阵14用来替代现有技术中的支撑柱，能够简化制程。
请参阅图11，本发明还提供一种OLED显示器件，包括上述如图4所示的彩膜基板1及与所述彩膜基板1相对设置的OLED基板2。此处不再对所述彩膜基板1的结构进行重复描述。所述OLED基板2与现有技术无异，包括基板21、像素定义层22、OLED D以及钝化层26，其中所述OLED D又包括依次层叠的阳极23、有机功能层24及阴极25，此处不做展开叙述。
本发明的OLED显示器件中，彩膜基板1内的彩色色阻层15的平整度较好、膜厚较均匀，显示混色风险较小，OLED显示器件的显示质量得以提升。
综上所述，本发明的彩膜基板，设置第一黑色矩阵与第二黑色矩阵共同进行遮光，能够减小显示混色的风险；设置第一黑色矩阵的第一凹槽与堤坝层的第二凹槽共同盛装并限制制作彩色色阻层所需的打印墨水，且所述第一凹槽的表面具有亲水性，所述第二凹槽的表面具有疏水性，能够改善彩色色阻层的平整度及膜厚均匀性，将该彩膜基板应用于OLED显示器件能够提升显示质量；设置堤坝层与第二黑色矩阵来替代现有技术中的支撑柱，能够简化制程。本发明的彩膜基板的制作方法，能够制作出上述彩膜基板，使得彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，且制程较简单。本发明的OLED显示器件，包括上述彩膜基板，所以彩膜基板中的彩色色阻层的平整度较好、膜厚较均匀，显示混色风险较小，OLED显示器件的显示质量得以提升。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明的权利要求的保护范围。

Claims (10)

  1. 一种彩膜基板，包括：载体基板、设在所述载体基板上的第一黑色矩阵、设在所述第一黑色矩阵上的堤坝层、于所述第一黑色矩阵上覆盖所述堤坝层的第二黑色矩阵以及彩色色阻层；
    所述第一黑色矩阵具有呈阵列式排布的多个第一凹槽，所述堤坝层具有呈阵列式排布的多个第二凹槽，一第二凹槽对应位于一第一凹槽上方；所述彩色色阻层填充于由所述载体基板、第一凹槽与第二凹槽限定的空间内；
    所述载体基板的表面具有亲水性，所述第一凹槽的表面具有亲水性，所述第二凹槽的表面具有疏水性；所述第一凹槽的接触角小于第二凹槽的接触角。
  2. 如权利要求1所述的彩膜基板，还包括覆盖所述彩色色阻层、第二黑色矩阵与第一黑色矩阵的保护层。
  3. 如权利要求1所述的彩膜基板，其中，所述第一黑色矩阵与第二黑色矩阵的材料均为黑色有机树脂或黑色无机薄膜，所述堤坝层的材料为含有氟元素的有机树脂。
  4. 如权利要求3所述的彩膜基板，其中，所述黑色无机薄膜为金属氧化物或金属硫化物。
  5. 如权利要求1所述的彩膜基板，其中，所述第一黑色矩阵的厚度为100nm～5000nm，所述堤坝层的厚度为1um～10um，所述第二黑色矩阵的厚度为100nm～2000nm。
  6. 如权利要求1所述的彩膜基板，其中，所述彩色色阻层的膜厚与第一黑色矩阵的厚度相同。
  7. 如权利要求1所述的彩膜基板，其中，所述彩色色阻层为将红、绿、蓝三种颜色的染料分散在有机单体中形成的有机色阻或将红、绿、蓝三种颜色的量子点材料分散在有机溶剂中形成的量子点墨水经干燥烘烤后形成的色阻。
  8. 一种彩膜基板的制作方法，包括如下步骤：
    步骤S1、提供载体基板并对所述载体基板的表面做亲水处理；
    步骤S2、在所述载体基板上制作出表面亲水的第一黑色矩阵；
    所述第一黑色矩阵具有呈阵列式排布的多个第一凹槽；
    步骤S3、在所述第一黑色矩阵上制作出表面疏水的堤坝层；
    所述堤坝层具有呈阵列式排布的多个第二凹槽；一第二凹槽对应位于一第一凹槽上方；所述第一凹槽的接触角小于第二凹槽的接触角；
    步骤S4、采用喷墨打印工艺在所述载体基板、第一凹槽与第二凹槽限定的空间内打印出彩色色阻层；
    步骤S5、于所述第一黑色矩阵上制作出覆盖所述堤坝层的第二黑色矩阵。
  9. 如权利要求8所述的彩膜基板的制作方法，还包括步骤S6，在所述彩色色阻层、第二黑色矩阵与第一黑色矩阵上制作出保护层。
  10. 一种OLED显示器件，包括如权利要求1所述的彩膜基板及与所述彩膜基板相对设置的OLED基板。
PCT/CN2017/112998 2017-10-12 2017-11-27 彩膜基板及其制作方法以及oled显示器件 WO2019071752A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/579,195 US20190386253A1 (en) 2017-10-12 2017-11-27 Color filter substrate and method of producing the same and oled display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710948814.1 2017-10-12
CN201710948814.1A CN107731873B (zh) 2017-10-12 2017-10-12 彩膜基板及其制作方法以及oled显示器件

Publications (1)

Publication Number Publication Date
WO2019071752A1 true WO2019071752A1 (zh) 2019-04-18

Family

ID=61211030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/112998 WO2019071752A1 (zh) 2017-10-12 2017-11-27 彩膜基板及其制作方法以及oled显示器件

Country Status (3)

Country Link
US (1) US20190386253A1 (zh)
CN (1) CN107731873B (zh)
WO (1) WO2019071752A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108922917B (zh) * 2018-09-04 2022-12-09 京东方科技集团股份有限公司 彩膜基板及oled显示面板、显示装置
CN109300395B (zh) * 2018-10-12 2020-11-20 京东方科技集团股份有限公司 彩膜基板及其制备方法和包含它的量子点显示装置
KR20200097379A (ko) 2019-02-07 2020-08-19 삼성디스플레이 주식회사 표시패널 및 그 제조방법
CN110211997A (zh) * 2019-05-30 2019-09-06 深圳市华星光电半导体显示技术有限公司 一种cf盖板、其制备方法及其显示面板
CN110335893B (zh) * 2019-07-22 2022-11-11 京东方科技集团股份有限公司 显示面板、封装盖板及其制造方法
CN110718644B (zh) 2019-09-24 2021-02-02 深圳市华星光电半导体显示技术有限公司 一种彩膜基板及其制备方法、oled显示装置
CN111063708A (zh) * 2019-11-15 2020-04-24 深圳市华星光电半导体显示技术有限公司 彩膜基板及其制备方法
TWI719775B (zh) * 2019-12-25 2021-02-21 錼創顯示科技股份有限公司 顯示裝置
CN111081685B (zh) * 2019-12-25 2021-09-14 錼创显示科技股份有限公司 显示装置
CN111326562B (zh) * 2020-03-05 2023-01-24 深圳市华星光电半导体显示技术有限公司 量子点显示面板及其制备方法
CN111443517A (zh) * 2020-03-26 2020-07-24 武汉华星光电半导体显示技术有限公司 显示器件及其制作方法
US11393881B2 (en) 2020-03-26 2022-07-19 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device and manufacturing method thereof
KR20210129309A (ko) 2020-04-17 2021-10-28 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN111584563B (zh) * 2020-05-08 2023-05-09 武汉华星光电半导体显示技术有限公司 一种oled显示面板及显示装置
CN111584568B (zh) * 2020-05-12 2023-10-31 Tcl华星光电技术有限公司 显示装置及其制备方法
CN111584581B (zh) * 2020-05-15 2022-11-01 武汉华星光电半导体显示技术有限公司 一种彩膜基板及其制备方法、显示装置
CN111769141A (zh) * 2020-06-23 2020-10-13 武汉华星光电半导体显示技术有限公司 彩色滤光片、彩色滤光片的制备方法及显示面板
KR20220018129A (ko) * 2020-08-05 2022-02-15 삼성디스플레이 주식회사 색변환 패널 및 이를 포함하는 표시 장치
WO2022082341A1 (en) * 2020-10-19 2022-04-28 Boe Technology Group Co., Ltd. Counter substrate, display panel, and display apparatus
CN113253510B (zh) * 2021-05-19 2022-11-04 惠科股份有限公司 一种彩膜基板及其制作方法
CN113078180B (zh) * 2021-06-07 2021-09-03 苏州华星光电技术有限公司 显示面板与显示装置
CN113394242B (zh) * 2021-06-15 2022-07-22 武汉天马微电子有限公司 显示面板及显示装置
CN117940982A (zh) * 2022-08-26 2024-04-26 京东方科技集团股份有限公司 彩膜基板、显示面板及显示装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030033612A (ko) * 2001-10-24 2003-05-01 엘지전자 주식회사 액정 표시장치의 칼라필터 및 그 제조방법
US20040263764A1 (en) * 2003-06-24 2004-12-30 Kim Jeong Hyun Liquid crystal display panel and method of fabricating the same
CN101410734A (zh) * 2006-04-03 2009-04-15 大日本印刷株式会社 滤色片的制造方法和滤色片
JP2011128208A (ja) * 2009-12-15 2011-06-30 Toppan Printing Co Ltd カラーフィルタ基板及びその製造方法
CN102629016A (zh) * 2011-05-19 2012-08-08 京东方科技集团股份有限公司 彩膜结构及其制造方法、和应用该彩膜结构的液晶显示器
CN102945855A (zh) * 2012-11-13 2013-02-27 京东方科技集团股份有限公司 发光显示背板、显示装置和像素界定层的制备方法
CN104091893A (zh) * 2014-06-26 2014-10-08 京东方科技集团股份有限公司 一种彩膜基板及其制备方法、显示面板
CN104090419A (zh) * 2014-07-11 2014-10-08 京东方科技集团股份有限公司 一种彩色滤光片及其制备方法、显示装置
CN104834124A (zh) * 2015-04-07 2015-08-12 武汉华星光电技术有限公司 彩色滤光基板和液晶面板
CN104932136A (zh) * 2015-07-01 2015-09-23 合肥鑫晟光电科技有限公司 彩膜基板及其制作方法、显示面板和显示装置
CN106816557A (zh) * 2017-03-02 2017-06-09 广州新视界光电科技有限公司 一种显示基板、显示基板的制作方法以及显示面板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101213476B1 (ko) * 2005-08-23 2012-12-18 삼성에스디아이 주식회사 연료전지용 막전극 접합체
TWI349117B (en) * 2007-01-03 2011-09-21 Au Optronics Corp Color filter and manufacturing method thereof
TWI350389B (en) * 2007-03-30 2011-10-11 Au Optronics Corp Color filter and liquid crystal display panel using the same
CN104241329A (zh) * 2014-08-22 2014-12-24 京东方科技集团股份有限公司 具有像素界定层的显示面板及像素界定层的制造方法
CN105826358B (zh) * 2016-05-24 2019-02-05 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示面板、显示装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030033612A (ko) * 2001-10-24 2003-05-01 엘지전자 주식회사 액정 표시장치의 칼라필터 및 그 제조방법
US20040263764A1 (en) * 2003-06-24 2004-12-30 Kim Jeong Hyun Liquid crystal display panel and method of fabricating the same
CN101410734A (zh) * 2006-04-03 2009-04-15 大日本印刷株式会社 滤色片的制造方法和滤色片
JP2011128208A (ja) * 2009-12-15 2011-06-30 Toppan Printing Co Ltd カラーフィルタ基板及びその製造方法
CN102629016A (zh) * 2011-05-19 2012-08-08 京东方科技集团股份有限公司 彩膜结构及其制造方法、和应用该彩膜结构的液晶显示器
CN102945855A (zh) * 2012-11-13 2013-02-27 京东方科技集团股份有限公司 发光显示背板、显示装置和像素界定层的制备方法
CN104091893A (zh) * 2014-06-26 2014-10-08 京东方科技集团股份有限公司 一种彩膜基板及其制备方法、显示面板
CN104090419A (zh) * 2014-07-11 2014-10-08 京东方科技集团股份有限公司 一种彩色滤光片及其制备方法、显示装置
CN104834124A (zh) * 2015-04-07 2015-08-12 武汉华星光电技术有限公司 彩色滤光基板和液晶面板
CN104932136A (zh) * 2015-07-01 2015-09-23 合肥鑫晟光电科技有限公司 彩膜基板及其制作方法、显示面板和显示装置
CN106816557A (zh) * 2017-03-02 2017-06-09 广州新视界光电科技有限公司 一种显示基板、显示基板的制作方法以及显示面板

Also Published As

Publication number Publication date
CN107731873B (zh) 2020-01-31
US20190386253A1 (en) 2019-12-19
CN107731873A (zh) 2018-02-23

Similar Documents

Publication Publication Date Title
WO2019071752A1 (zh) 彩膜基板及其制作方法以及oled显示器件
US11832495B2 (en) Display apparatus and manufacturing method therefor
KR100837475B1 (ko) 증착장치 및 유기발광소자의 제조방법
US11005083B2 (en) High-resolution Micro-OLED display module and manufacturing method thereof
US9722005B2 (en) Light-emitting device, array substrate, display device and manufacturing method of light-emitting device
US10811476B2 (en) Pixel definition layer, manufacturing method thereof, display substrate and display device
US20170170245A1 (en) Organic light emitting diode display and method for manufacturing the same
CN108963100A (zh) 彩膜基板及其制作方法、显示面板
CN106098742A (zh) 有机发光显示装置及制造方法
JP2021520024A (ja) 有機発光ダイオード表示装置及びその製造方法
US20210408126A1 (en) Color filter cover plate, preparation method thereof, and display panel
US10991884B2 (en) Mask plate, OLED display substrate, display device and manufacturing method thereof
WO2021174615A1 (zh) 量子点显示面板及其制备方法
US10868276B2 (en) Display panel, display device, and fabrication method thereof
WO2020001061A1 (zh) 显示基板及制造方法、显示装置
WO2019205425A1 (zh) Woled显示面板及其制作方法
WO2020224010A1 (zh) Oled 显示面板及其制备方法
CN111063708A (zh) 彩膜基板及其制备方法
US11374072B2 (en) Display panel with quantom dot and manufacturing method thereof
US10503064B2 (en) Method for manufacturing color filter substrate
US10707274B2 (en) Display panel and manufacturing method thereof
CN109935623B (zh) 显示装置
US11257889B2 (en) OLED display panel having light shielding layer for shielding light emitted at edges of pixel-emitting region, manufacturing method thereof, and OLED display device
US11895902B2 (en) Display device with device board and manufacturing method thereof
US10763458B2 (en) Manufacturing method of color filter substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17928478

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17928478

Country of ref document: EP

Kind code of ref document: A1