WO2019064576A1 - Dispositif de manipulation de substrat, dispositif d'exposition, procédé de production d'écran plat, procédé de production de dispositif, procédé de manipulation de substrat et procédé d'exposition - Google Patents

Dispositif de manipulation de substrat, dispositif d'exposition, procédé de production d'écran plat, procédé de production de dispositif, procédé de manipulation de substrat et procédé d'exposition Download PDF

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Publication number
WO2019064576A1
WO2019064576A1 PCT/JP2017/035709 JP2017035709W WO2019064576A1 WO 2019064576 A1 WO2019064576 A1 WO 2019064576A1 JP 2017035709 W JP2017035709 W JP 2017035709W WO 2019064576 A1 WO2019064576 A1 WO 2019064576A1
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WIPO (PCT)
Prior art keywords
substrate
holding
unit
holder
hand
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PCT/JP2017/035709
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English (en)
Japanese (ja)
Inventor
青木保夫
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株式会社ニコン
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2017/035709 priority Critical patent/WO2019064576A1/fr
Priority to CN201780095240.6A priority patent/CN111149059B/zh
Priority to TW107132863A priority patent/TWI722320B/zh
Publication of WO2019064576A1 publication Critical patent/WO2019064576A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate transfer apparatus, an exposure apparatus, a method of manufacturing a flat panel display, a device manufacturing method, a substrate transfer method, and an exposure method.
  • a pattern formed on a mask (or reticle) is transferred onto a substrate (substrate made of glass or plastic, semiconductor wafer etc.) using an energy beam.
  • An exposure apparatus for transferring is used.
  • the substrate transfer apparatus for transferring the substrate to the holding surface of the holding device capable of holding the substrate
  • the first holding unit having the substrate holding surface for holding the substrate above the holding device
  • a second holding unit for holding a part of the substrate held by the first holding unit at a position between the holding surface and the substrate holding surface in the vertical direction; and the first holding unit holds the second holding unit.
  • a substrate transfer apparatus for transferring the substrate to the holding surface of the holding device capable of holding the substrate, the first holding unit having the substrate holding surface for holding the substrate above the holding device
  • a second holding unit for holding a part of the substrate held by the first holding unit at a position between the holding surface and the substrate holding surface in the vertical direction; and the first holding unit holds the second holding unit.
  • an exposure apparatus comprising: the substrate transfer apparatus described above; and an optical system which irradiates an energy beam to the substrate transferred to the holding apparatus to expose the substrate.
  • a method of manufacturing a flat panel display comprising: exposing a substrate using the exposure apparatus described above; and developing the exposed substrate.
  • a device manufacturing method comprising: exposing a substrate using the exposure apparatus described above; and developing the exposed substrate.
  • the substrate carrying method for carrying the substrate to the holding surface of the holding device capable of holding the substrate the substrate is held by the first holding portion and the second holding portion above the holding device. Holding and holding the first holding portion at a position between the holding surface and the substrate holding surface in the vertical direction so that the first holding portion is retracted from above the holding device Moving the holding device and the second holding unit relative to the first holding unit in a state where the second holding unit holding a part of the substrate holds the part of the substrate; A substrate transport method is provided.
  • an exposure method comprising: transporting the substrate to the holding device by the above substrate transporting method; and irradiating the substrate with an energy beam to expose the substrate. Is provided.
  • a method of manufacturing a flat panel display comprising: exposing the substrate using the above-described exposure method; and developing the exposed substrate.
  • a device manufacturing method comprising: exposing the substrate using the above-described exposure method; and developing the exposed substrate.
  • FIG. 1 is a view schematically showing the arrangement of an exposure apparatus according to the first embodiment.
  • FIG. 2 is a plan view of a stage apparatus and a substrate transfer apparatus which the exposure apparatus (partially omitted) of FIG. 1 has.
  • Fig.3 (a) is a top view of the stage apparatus which concerns on 1st Embodiment
  • FIG.3 (b) is a side view
  • FIG.3 (c) is AA sectional drawing of Fig.3 (a). is there.
  • FIGS. 4A to 4C are side views (part 1) of an exposure apparatus for describing a substrate exchange operation in the first embodiment.
  • 5 (a) to 5 (c) are side views (part 2) of an exposure apparatus for describing the substrate exchanging operation in the first embodiment.
  • FIGS. 6 (a) to 6 (c) are side views (part 3) of an exposure apparatus for describing the substrate exchanging operation in the first embodiment.
  • FIGS. 7A to 7C are side views (part 4) of the exposure apparatus for describing the substrate exchanging operation in the first embodiment.
  • FIGS. 8 (a) to 8 (c) are side views (part 5) of an exposure apparatus for describing the substrate exchanging operation in the first embodiment.
  • FIG. 9A to FIG. 9C are side views of an exposure apparatus for describing a substrate exchange operation in the first modification of the first embodiment.
  • FIG. 10 (a) is a perspective view of a substrate loading hand according to a second modification of the first embodiment
  • FIG. 10 (b) is a side view.
  • FIG. 11A and 11B are side views of an exposure apparatus for describing a substrate exchange operation in the third modification of the first embodiment.
  • 12 (a) is a top view of a substrate loading hand according to a fourth modification of the first embodiment
  • FIG. 12 (b) is a sectional view taken along the line AA of FIG. 12 (a).
  • FIG. 13A and FIG. 13B are views for explaining the substrate loading operation using the substrate loading hand according to the fourth modification of the first embodiment.
  • FIG. 14A and FIG. 14B are cross-sectional views schematically showing a substrate loading hand according to a fifth modification of the first embodiment.
  • FIG. 15A and FIG. 15B are respectively a top view and a side view of the exposure apparatus according to the second embodiment.
  • FIG. 16B are perspective views of the substrate loading hand according to the second embodiment.
  • 17 (a) and 17 (b) are a top view and a side view (part 1) of an exposure apparatus for describing a substrate exchange operation in the second embodiment, respectively.
  • 18 (a) and 18 (b) are respectively a top view and a side view (part 2) of an exposure apparatus for describing a substrate exchange operation in the second embodiment.
  • FIG. 19A and FIG. 19B are respectively a top view and a side view (part 3) of an exposure apparatus for describing a substrate exchange operation in the second embodiment.
  • FIG. 20A and FIG. 20B are respectively a top view and a side view (part 4) of an exposure apparatus for describing a substrate exchange operation in the second embodiment.
  • FIGS. 21 (a) and 21 (b) are respectively a top view and a side view (# 5) of an exposure apparatus for describing a substrate exchange operation in the second embodiment.
  • FIGS. 22 (a) and 22 (b) are a top view and a side view (part 6) of an exposure apparatus for describing a substrate exchange operation in the second embodiment, respectively.
  • FIGS. 23 (a) and 23 (b) are respectively a top view and a side view (# 7) of an exposure apparatus for describing a substrate exchange operation in the second embodiment.
  • FIGS. 24 (a) and 24 (b) are a top view and a side view (part 8) of an exposure apparatus for describing a substrate exchange operation in the second embodiment, respectively.
  • FIGS. 25 (a) and 25 (b) are views for explaining the advantages of the substrate loading hand according to the second embodiment.
  • FIGS. 26 (a) and 26 (b) are respectively a top view and a side view of an exposure apparatus for describing a substrate exchange operation in the first modified example of the second embodiment.
  • FIGS. 27 (a) and 27 (b) are a top view and a side view (part 1) of an exposure apparatus for describing a substrate exchange operation in the second modified example of the second embodiment, respectively.
  • FIGS. 28 (a) and 28 (b) are a top view and a side view (part 2) of an exposure apparatus for describing a substrate exchange operation in the second modified example of the second embodiment, respectively.
  • FIGS. 30 (a) and 30 (b) are a top view and a side view (part 4) of an exposure apparatus for describing a substrate exchange operation in the second modified example of the second embodiment, respectively.
  • 31 (a) and 31 (b) is a side view of a substrate transfer apparatus for describing transfer of a substrate from a beam unit to a substrate loading hand in a third modification of the second embodiment.
  • 32A and 32B respectively show a top view and a side view of an exposure apparatus for describing transfer of a substrate from a beam unit to a substrate loading hand in the fourth modification of the second embodiment (parts 1).
  • 33 (a) and 33 (b) are respectively a top view and a side view of an exposure apparatus for describing transfer of a substrate from a beam unit to a substrate loading hand in the fourth modification of the second embodiment 2).
  • 34 (a) and 34 (b) are respectively a top view and a side view of an exposure apparatus for describing transfer of a substrate from the external transfer device to the substrate loading hand in the fifth modification of the second embodiment That is 1).
  • FIG. 35 (a) and 35 (b) are respectively a top view and a side view of an exposure apparatus for describing transfer of a substrate from the external transfer device to the substrate loading hand in the fifth modification of the second embodiment That is 2).
  • FIG. 36 is a perspective view showing a substrate loading hand according to a sixth modification of the second embodiment.
  • FIG. 37A and FIG. 37B are diagrams for explaining a configuration example of a substrate loading hand.
  • FIG. 38 is a diagram for describing a configuration example of a substrate transfer unit.
  • FIG. 39 is a diagram for describing a configuration example of a surface plate.
  • FIGS. 40 (a) and 40 (b) are respectively a top view and a side view showing the configuration of the stage apparatus in the first and second embodiments and their modifications.
  • FIGS. 41 (a) is a top view showing another example of the stage device
  • FIGS. 41 (b) and 41 (c) are cross-sectional views taken along the line AA of FIG. 41 (a).
  • FIG. 42 (a) is a top view showing another example of the stage device
  • FIG. 42 (b) is a cross-sectional view taken along the line AA of FIG. 42 (a).
  • FIGS. 43 (a) to 43 (c) are side views for describing the placement of the substrate on the stage apparatus shown in FIGS. 42 (a) and 42 (b).
  • FIG. 1 schematically shows the arrangement of an exposure apparatus 10A according to the first embodiment.
  • FIG. 2 is a plan view of a stage device 20A and a substrate transfer device 100A which the exposure apparatus 10A (partially omitted) of FIG. 1 has.
  • 3 (a) is a plan view of the stage device 20A
  • FIG. 3 (b) is a side view of the stage device 20A
  • FIG. 3 (c) is a sectional view taken along the line AA of FIG. 3 (a). is there.
  • the exposure apparatus 10A is, for example, a projection of a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used for a liquid crystal display (flat panel display) or the like is an exposure object
  • the exposure apparatus is a so-called scanner.
  • the exposure apparatus 10A includes an illumination system 12, a mask stage 14 holding a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a surface (a surface facing the + Z side in FIG. ), A stage apparatus 20A for holding a substrate P coated with a resist (sensitive agent), a substrate transfer apparatus 100A, and a control system of these.
  • an illumination system 12 a mask stage 14 holding a mask M on which a pattern such as a circuit pattern is formed
  • a projection optical system 16 and a surface (a surface facing the + Z side in FIG. )
  • a stage apparatus 20A for holding a substrate P coated with a resist (sensitive agent), a substrate transfer apparatus 100A, and a control system of these.
  • the X axis, Y axis and Z axis orthogonal to each other are set with respect to the exposure apparatus 10A, and the mask M and the substrate P with respect to the projection optical system 16 at the time of exposure
  • the rotational (inclination) directions about the X axis, Y axis, and Z axis will be described as ⁇ x, ⁇ y, and ⁇ z directions, respectively.
  • positions in the X axis, Y axis, and Z axis directions will be described as X position, Y position, and Z position, respectively.
  • the illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, US Pat. No. 5,729,331, and illuminates the mask M with illumination light for illumination (illumination light) IL.
  • illumination light IL for example, light including at least one wavelength of i-line (wavelength 365 nm), g-line (wavelength 436 nm) and h-line (wavelength 405 nm) is used.
  • the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited.
  • ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm) It may be light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).
  • the mask stage 14 holds a light transmission type mask M.
  • the mask stage 14 is driven at a predetermined stroke at least in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including, for example, a linear motor. Further, the mask stage 14 is driven by a fine movement drive system that moves the X position and the Y position with a stroke in order to adjust the relative position to at least one of the illumination system 12, the stage device 20 A, and the projection optical system 16.
  • Position information of the mask stage 14 is obtained by, for example, a mask stage position measurement system (not shown) including a linear encoder system and an interferometer system.
  • the projection optical system 16 is disposed below the mask stage 14.
  • the projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms, for example, an erecting image. It has multiple optical systems that are both telecentric.
  • the projection optical system 16 may not be a multi-lens type. It may be configured by one projection optical system as used in a semiconductor exposure apparatus.
  • the exposure apparatus 10A when the mask M located in a predetermined illumination area by the illumination light IL from the illumination system 12 is illuminated, a projection image (a partial pattern image) of the pattern of the mask M in the illumination area Is formed in the exposure area by the projection optical system 16. Then, the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area in the scanning direction, whereby scanning exposure is performed on the substrate P.
  • the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.
  • the stage device 20A includes a platen 22, a substrate table 24, a support device 26, and a substrate holder 28A.
  • the surface plate 22 is formed of a rectangular plate-like member in plan view (as viewed from the + Z side) arranged such that the upper surface (+ Z surface) is parallel to the XY plane, and the floor is provided via a vibration isolation device (not shown) It is installed on F.
  • the support device 26 is mounted on the surface plate 22 in a non-contact manner, and supports the substrate table 24 from the lower side in a non-contact manner.
  • the substrate holder 28A is disposed on the substrate table 24, and the substrate table 24 and the substrate holder 28A are integrally driven by a stage driving system (not shown) provided in the stage device 20A.
  • the stage drive system includes, for example, a linear motor, and a coarse movement system capable of driving the substrate table 24 in a predetermined stroke in the X-axis and Y-axis directions (along the upper surface of the platen 22); And a micromotion system for minutely driving the substrate table 24 in six degrees of freedom (X axis, Y axis, Z axis, .theta.x, .theta.y, and .theta.z).
  • the stage device 20A includes, for example, an optical interferometer system, an encoder system, and the like, and includes a stage measurement system for obtaining positional information in the direction of the six degrees of freedom of the substrate table 24.
  • substrate P is mounted in the upper surface TS (surface by the side of + Z) of the substrate holder 28A rectangular shape in planar view.
  • the aspect ratio of the upper surface TS is substantially the same as that of the substrate P.
  • the lengths of the long side and the short side of the upper surface TS are set somewhat shorter than the lengths of the long side and the short side of the substrate P, respectively.
  • the upper surface TS of the substrate holder 28A is finished flat over the entire surface. Further, on the upper surface of the substrate holder 28A, a plurality of minute holes (not shown) for blowing air and a plurality of small holes (not shown) for vacuum suction are formed. Note that the minute holes for blowing air and the small holes for vacuum suction may use a common hole in combination.
  • the substrate holder 28A sucks the air between the upper surface and the substrate P through the plurality of holes using the vacuum suction force supplied from a vacuum device (not shown), and adsorbs the substrate P on the upper surface TS. It is possible to make it (flatten).
  • the substrate holder 28A is a so-called pin chuck type holder, and a plurality of pins (a pin whose diameter is very small, for example, about 1 mm in diameter) are arranged at substantially equal intervals.
  • the substrate holder 28A can reduce the possibility of holding and supporting dust and foreign matter on the back surface of the substrate P, and can reduce the possibility of deformation of the substrate P due to the holding of the foreign matter.
  • the substrate P is held (supported) on the top surfaces of the plurality of pins.
  • the XY plane formed by the upper surfaces of the plurality of pins is taken as the upper surface of the substrate holder 28A.
  • the substrate holder 28A supplies (charges) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface TS and the substrate P via the holes.
  • pressurized gas for example, air
  • a pressurized gas supply device not shown
  • the back surface of the substrate P adsorbed to the substrate holder 28A can be separated from the top surface TS (the substrate P is floated).
  • a time difference occurs in the timing of supplying pressurized gas, or a hole for performing vacuum suction and a hole for supplying pressurized gas. Control the ground state of the substrate P by changing the location appropriately or changing the air pressure appropriately by suction and air supply (for example, an air pool between the back surface of the substrate P and the upper surface of the substrate holder 28A So that it does not occur).
  • the substrate holder 28A may perform surface correction of the substrate in a state where the substrate is floated and supported without attracting the substrate to the upper surface TS.
  • the substrate holder 28A supplies (charges) the pressurized gas (for example, air) supplied from the pressurized gas supply device (not shown) to the back surface of the substrate P through the holes, thereby the substrate A gas is interposed between the lower surface of P and the upper surface of the substrate holder 28A (ie, a gas film is formed).
  • the pressurized gas for example, air
  • the substrate holder 28A sucks the gas between the substrate holder 28A and the substrate P through the hole for vacuum suction using a vacuum suction device, and a force (preload in the direction of gravity downward with respect to the substrate P
  • the above-mentioned gas film is given rigidity in the direction of gravity by acting.
  • the substrate holder 28A floats the substrate P in the Z-axis direction through a minute clearance and holds (supports) the substrate P in a non-contact manner by the balance between the pressure and flow rate of the pressurized gas and the vacuum suction force.
  • a force for controlling the flatness may be applied to P.
  • Each hole may be formed by processing the substrate holder 28A, or air may be supplied or suctioned by forming the substrate holder 28A with a porous material.
  • the upper surface TS is not the surface on which the hole portion is formed, but a virtual surface located above the clearance from the surface, that is, the lower surface of the substrate corrected in plane. Is the upper surface TS.
  • two notches 28b are formed apart in the Y-axis direction at the end on the + X side of the top surface TS of the substrate holder 28A.
  • the notches 28b are respectively opened on the upper surface TS of the substrate holder 28A and the side surface on the + X side.
  • the substrate transfer apparatus 100A includes a port unit 150A, a substrate transfer unit 160A, and a transfer device 180A.
  • the port unit 150A and the substrate transfer unit 160A are installed on the + X side with respect to the stage device 20A.
  • delivery of the substrate P between an external apparatus (not shown) such as a coater / developer and the like and the exposure apparatus is performed by the substrate transfer apparatus 100A.
  • the substrate transfer unit 160A transfers the exposed substrate P (P1) from the substrate holder 28A to the port unit 150A and transfers the substrate P (P2) to be newly exposed from the port unit 150A to the substrate holder 28A. is there.
  • the substrate P2 may be a non-exposed (not exposed once) substrate, or may be a substrate on which the second and subsequent exposures are performed.
  • delivery of the substrate P between the above-described external apparatus and the exposure apparatus 10A is performed by using a chamber (not shown) that accommodates the illumination system 12, the mask stage 14, the projection optical system 16, the stage apparatus 20A, the substrate transfer apparatus 100A and the like
  • the external transfer device 300 has a fork-like robot hand, and can transfer the loaded substrate P from the external device to the port 150A in the exposure apparatus 10A.
  • the substrate transfer unit 160A transfers the substrate P from the port unit 150A to the substrate holder 28A.
  • the external transfer device 300 can transfer the exposed substrate P transferred to the port 150A by the substrate transfer device 100A from inside the chamber to the external device.
  • the port section 150A has a beam unit 152 composed of a plurality of (for example, eight in the first embodiment) beams 153 arranged at predetermined intervals in the Y-axis direction. .
  • a beam unit 152 supplies pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the back surface of the substrate P and the upper surface of the beam unit 152 through the holes (charging , The rear surface of the substrate P can be separated from the upper surface of the beam unit 152 (the substrate P can be floated).
  • the spacing between the plurality of beams 153 in the Y-axis direction can support the substrate P from below by the beam unit 152, and when the robot hand of the external transfer device 300 is arranged at the same height as the beam unit 152,
  • the plurality of finger portions 310 included in each of the plurality of beams 153 are set to be able to be disposed (inserted and removed) between the plurality of beams 153.
  • each beam 153 is slightly longer than the length in the longitudinal direction of the substrate P, and the length in the width direction (Y-axis direction) is the length in the width direction of the substrate P For example, it is set to about 1/50 or about 10 to 50 times the thickness of the substrate P, for example.
  • a plurality of (for example, two) bar-like legs 154 each of a plurality of beams 153 are located inward of both ends in the X-axis direction. Is supported from below. Lower ends of the plurality of legs 154 supporting the beams 153 are respectively connected to the base portion 157 via joint portions 155a, and upper ends are connected to the beams 153 via joint portions 155b.
  • the position of the beam unit 152 in the X-axis direction and the Z-axis direction can be integrally changed by the link mechanism configured by the beam 153, the legs 154, the joint parts 155a and 155b, and the base part 157. It has become.
  • the link mechanism is such that the upper surface TS of the substrate holder 28A, the upper surface of the offset beam 185a described later, and the upper surface of the beam unit 152 are substantially in the same plane when the beam unit 152 stops at the substrate delivery position with the substrate holder 28A. It is configured to be included.
  • the substrate transfer unit 160A includes a fork-like hand 161A (hereinafter referred to as a substrate loading hand 161A) similar to the above-described external transfer device 300 (see FIGS. 1 and 2).
  • the substrate loading hand 161A has a plurality of (for example, seven in the first embodiment) finger portions 162A, and the plurality of finger portions 162A hold the substrate P (hereinafter referred to as a substrate holding surface). Form).
  • the plurality of finger portions 162A are connected to each other near the end on the + X side by the connecting member 163A.
  • the end portions on the -X side (the substrate holder 28A (see FIG. 2 and the like) side) of the plurality of finger portions 162A are free ends, and the adjacent finger portions 162A are on the substrate holder 28A side. is open.
  • the substrate holding surface formed by the plurality of finger portions 162A is inclined with respect to the holding surface on which the substrate holder 28A holds the substrate (hereinafter referred to as a holder substrate holding surface). That is, the substrate loading hand 161A has a substrate holding surface which holds the substrate P (P2) by inclining with respect to the holder substrate holding surface of the substrate holder 28A. Therefore, the substrate loading hand 161A holds the + X side end of the substrate P2 at a position (+ Z side) higher than the ⁇ X side end of the substrate P2.
  • the Z position of the substrate loading hand 161A is such that the ⁇ X side end of the substrate loading hand 161A is closer to the substrate holder 28A than the + X side end.
  • the thickness of the finger 162A is thinner toward the tip.
  • the finger portion 162A is tapered at its tip end and has a tapered shape. Since the plurality of fingers 162A have a tapered shape, the -X side end of the substrate P2 can be brought closer to the upper surface TS of the substrate holder 28A as compared with a uniform thickness of the fingers 162A. . Further, since the area of the substrate loading hand 161A in which the Z position approaches the substrate holder 28A can be reduced, the risk of contact between the substrate loading hand 161A and the substrate holder 28A can be reduced.
  • the finger portions 162A of the substrate loading hand 161A do not overlap with the beam 153 of the beam unit 152 in plan view in the Y-axis direction, similarly to the robot hand (see FIG. 2) of the external transfer device 300 described above. It is arranged. Further, a plurality of support pads 164A for supporting the back surface of the substrate P is attached to each finger portion 162A, and the substrate holding surface of the substrate loading hand 161A is formed by the support pads 164A. The entire surface of the back surface of the substrate P may not be supported by the support pad 164A. The substrate holding surface is formed by a surface virtually connecting the support surface of the support pad 164A.
  • the connecting member 163A is a hollow member having a rectangular shape in a plan view and a small thickness, and extends in the Y-axis direction in which the plurality of beams 153 are arranged. Both ends of the connecting member 163A in the Y-axis direction are connected to a pair of X-axis driving devices 164 for moving the substrate loading hand 161A in the X-axis direction. Note that the pair of X-axis drive devices 164 may be driven independently, or may be mechanically connected by gears or belts and simultaneously driven by one drive motor.
  • the connecting member 163A may be configured to be moved only by the X-axis drive device 164 on one side without being limited to a pair in the Y-axis direction.
  • the pair of X-axis drive devices 164 can be moved up and down by a Z-axis drive device (not shown).
  • the substrate loading hand 161A can move between a position (+ Z side) higher than the upper surface of the beam unit 152 and a position ( ⁇ Z side) lower than the beam unit 152.
  • the substrate transfer unit 160A includes one or more (for example, two in the first embodiment) substrate unloading hands 170A.
  • two substrate carry-out hands 170A are spaced apart in the Y-axis direction.
  • Each substrate unloading hand 170A includes a holding pad 171A.
  • the holding pad 171A can hold the lower surface of the substrate P by suction by the vacuum suction force supplied from a vacuum device (not shown).
  • the substrate unloading hand 170A is configured, for example, as an articulated robot or a parallel link robot, and can change the X position, the Y position, and the Z position of the holding pad 171A.
  • the transfer device 180A is a device that cooperates with the substrate transfer unit 160A at the time of substrate replacement. In other words, in the exposure apparatus 10A, the loading and unloading of the substrate P with respect to the substrate holder 28A is performed using the substrate transfer unit 160A and the transfer device 180A. The transfer device 180A is also used for positioning the substrate P when the substrate P is placed on the substrate holder 28A. The transfer device 180A will be described in detail with reference to FIGS. 3 (a) to 3 (c).
  • the transfer device 180A includes a pair of substrate loading bearer devices 182A, a pair of substrate unloading bearer devices 183A, and an offset beam unit 185.
  • the substrate loading bearer apparatus 182A includes a holding pad 184a, an X actuator 186x, and a Z actuator 186z as shown in FIG. 3 (b).
  • the holding pad 184a is formed of a plate-like member having a rectangular shape in a plan view, and can hold the lower surface of the substrate P by suction by a vacuum suction force supplied from a vacuum device (not shown). Further, as shown in FIG. 3B, the holding pad 184a can be driven in the Z-axis direction by the Z actuator 186z. The holding pad 184 a and the Z actuator 186 z can be integrally driven in the X axis direction by the X actuator 186 x attached to the substrate table 24.
  • the substrate carry-out bearer device 183A includes a holding pad 184b, an X actuator 186x, and a Z actuator 186z.
  • the holding pad 184b of one (+ Y side) of the substrate carry-out bearer apparatus 183A is formed on the substrate holder 28A, for example, one (+ Y side) of two notches 28b. A part is inserted into the notch 28b. Further, a part of the holding pad 184b of the other (-Y side) board unloading bearer device 183A is inserted into the other (-Y side) notch 28b.
  • the holding pad 184 b is formed of a plate-like member having a rectangular shape in a plan view, and can hold the lower surface of the substrate P by suction by a vacuum suction force supplied from a vacuum device (not shown).
  • the holding pad 184b can be driven in the Z-axis direction by the Z actuator 186z.
  • the holding pad 184 b and the Z actuator 186 z can be integrally driven in the X axis direction by the X actuator 186 x attached to the substrate table 24.
  • the Z actuator 186z includes a support that supports the holding pad 184b, and the support is disposed outside the substrate holder 28A.
  • the holding pad 184b is driven in the notch 28b by the Z actuator 186z so that the holding pad 184b can move between a position where it can be held in contact with the lower surface of the substrate P and held and a position where it is separated from the lower surface of the substrate P. ing.
  • the holding pad 184b is movable by the Z actuator 186z between a position where a part is accommodated in the notch 28b and a position higher than the upper surface of the substrate holder 28A.
  • the holding pad 184b is movable in the X-axis direction by being driven integrally with the Z actuator 186z by the X actuator 186x.
  • the offset beam portion 185 has a plurality of (for example, eight in the first embodiment) offset beams 185a arranged at predetermined intervals in the Y-axis direction.
  • the offset beam 185a is supported by a support member 185b attached to the substrate table 24, and is arranged such that the upper surface thereof and the upper surface TS of the substrate holder 28A are included in substantially the same plane.
  • a plurality of minute holes (not shown) for blowing air are formed on the upper surface of the offset beam 185a.
  • the offset beam 185a supplies pressurized gas (air) supplied from a pressurized gas supply device (not shown) between the upper surface of the offset beam 185a and the back surface of the substrate P through the holes (charge supply). Do. As a result, it is possible to separate the back surface of the substrate P from the top surface of the offset beam 185a (float the substrate P).
  • each bearer device 182A, 183A is attached to the substrate table 24 in the present embodiment, but is not limited thereto.
  • an XY stage device for driving the substrate holder 28A or the substrate table 24 in the XY plane It may be attached to (not shown).
  • the position and the number of the bearer devices 182A and 183A are not limited to this, and may be attached to the side surface on the + Y side and the -Y side of the substrate table 24, for example.
  • the mask loader (not shown) loads the mask M onto the mask stage 14 under the control of the main controller (not shown).
  • the substrate transfer apparatus 100A carries the substrate P onto the substrate holder 28A.
  • alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, step-and-scan exposure is sequentially performed on a plurality of shot areas set on the substrate P An operation is performed. Since this exposure operation is similar to that of the step-and-scan method conventionally performed, the X direction is taken as the scan direction. A detailed description of the step-and-scan exposure operation is omitted.
  • the substrate P (P1) for which the exposure processing has been completed is carried out of the substrate holder 28A by the substrate transfer apparatus 100A, and another substrate P (P2) to be exposed next is carried in the substrate holder 28A.
  • the substrates P on the substrate holder 28A are exchanged, and a series of exposure operations on the plurality of substrates P are performed.
  • Substrate exchange operation the exchange operation of the substrate P on the substrate holder 28A in the exposure apparatus 10A will be described with reference to FIG. 4 to FIG.
  • the following substrate exchange operation is controlled by a main controller (not shown).
  • the X-axis drive device 164 and the like are appropriately omitted to facilitate understanding of the operation of the substrate transfer unit 160A.
  • the exposed substrate P1 is placed on the substrate holder 28A of the stage device 20A in advance, and the substrate P2 different from the substrate P1 is removed while carrying out the exposed substrate P1.
  • a loading operation for placing on the substrate holder 28A will be described.
  • the operating directions of the components are schematically indicated by white arrows for easy understanding.
  • the state of sucking or supplying (charging) the gas is schematically shown by a group of black arrows.
  • the upper surface of the substrate loading hand 161A of the substrate loading hand 161A is a beam unit until the substrate P2 is transferred to the port 150A by the external transfer device 300. It is moved to be located below 152. At this time, the leg 154 of the port portion 150A is rotationally driven in the ⁇ y direction. Thus, the substrate loading hand 161A is disposed below the beam unit 152 so that the robot hand of the external transfer apparatus 300 can be disposed between the beam unit 152 and the substrate loading hand 161A in the Z direction.
  • this position of the port portion 150A is a substrate delivery position with the external transfer device 300.
  • the robot hand of the external transfer device 300 holding the substrate P 2 is moved in the ⁇ X direction so that the substrate P 2 is positioned above the beam unit 152 (+ Z side). At this time, the robot hand of the external transfer device 300 and the finger of the fork-like robot hand of the external transfer device 300 are positioned in the gaps between the beam units 152 adjacent to each other in the Y-axis direction in plan view. The Y position with the beam unit 152 is positioned.
  • the robot hand of the external transfer device 300 is driven to descend, and the fingers of the robot hand pass through the gaps of the plurality of beams of the beam unit 152 to perform external transfer.
  • the apparatus 300 delivers the substrate P 2 onto the beam unit 152.
  • the Z position of the robot hand of the external transfer device 300 is controlled so as not to contact the substrate transfer unit 160A waiting below the beam unit 152.
  • the robot hand of the external transfer device 300 is driven out in the + X direction to withdraw from the inside of the exposure apparatus 10A.
  • the substrate transfer unit 160A moves upward (moves in the + Z direction), and the holding pad 171A of the substrate unloading hand 170A suctions and holds the lower surface of the substrate P2 on the beam unit 152. Thereafter, as shown in FIG. 5A, pressurized gas is supplied to each of the plurality of beams 153 of the beam unit 152 of the port portion 150A, and the pressurized gas is supplied from the upper surface of each of the plurality of beams 153. The air is supplied (jetted) toward the lower surface of the substrate P2.
  • the substrate P2 floats up relative to the beam unit 152 via a minute gap (for example, several tens of micrometers to several hundreds of micrometers) while the substrate P2 is adsorbed and supported by the substrate transfer unit 160A. Further, the beam unit 152 is moved in the ⁇ X direction and the ⁇ Z direction by rotationally driving the leg 154 of the port portion 150A in the ⁇ y direction.
  • the holding pad 171A of the substrate carry-out hand 170A holding the lower surface of the substrate P2 by suction is appropriately minutely driven in the X-axis, Y-axis, and ⁇ z directions (three degrees of freedom in the horizontal plane), whereby the substrate P2 for the substrate carry-in hand 161A is Position adjustment (alignment) is performed. Since the substrate P2 is supported by the beam unit 152 in a noncontact manner, position adjustment (movement of a small amount) in the direction of three degrees of freedom in the horizontal plane of the substrate P2 can be performed in a low friction state. In addition, position adjustment (alignment) of the board
  • the substrate transport unit 160A is driven to rise in the + Z direction to the position shown in FIG. 5 (b).
  • the substrate P2 on the beam unit 152 is delivered to the substrate loading hand 161A.
  • the substrate P2 on the beam unit 152 is scooped from below by the substrate loading hand 161A.
  • the beam unit 152 is further driven in the ⁇ X direction as the leg 154 is further rotationally driven in the ⁇ y direction, and the substrate delivery position with respect to the substrate holder 28A for unloading the substrate P1 from the substrate holder 28A (FIG. Move to the position shown in c)).
  • the stage device 20A places the exposed substrate P1.
  • the substrate table 24 is moved in the + X direction so that the placed substrate holder 28A is disposed at a predetermined substrate exchange position (substrate delivery position with respect to the port 150A).
  • the substrate replacement position of the substrate holder 28A is the position on the ⁇ X side with respect to the port 150A.
  • the substrate holder 28A is illustrated at the same position in FIGS. 4A to 5B for easy understanding, during normal operation of the exposure apparatus 10A, the external transfer of the substrate P2 is performed.
  • the exposure operation for the substrate P1 is performed in parallel with the delivery operation from the device 300 to the substrate loading hand 161A, and at this time, the substrate holder 28A is appropriately moved in the X direction and the Y direction.
  • the holding pad 184b of each of the pair of substrate carry-out bearer devices 183A is driven to ascend.
  • the holding pad 184b is a back surface of a portion of the substrate P1 held by vacuum suction on the upper surface of the substrate holder 28A (a portion disposed on the notch 28b (see FIG. 3A and FIG. 3C)). Hold by suction from
  • the substrate loading hand 161A supporting the substrate P2 is moved in the ⁇ X direction.
  • the substrate loading hand 161A is moved to the upper side of the substrate holder 28A positioned at the substrate exchange position.
  • the Z position of the top surface of the beam unit 152 and the Z position of the top surface of the substrate holder 28A are set to substantially the same height. In order to set these to substantially the same height, the height may be adjusted by driving the substrate holder 28A in the Z-axis direction.
  • pressurized gas is ejected from the upper surface of the offset beam 185a.
  • pressurized gas is supplied (sprayed) from the upper surface of the substrate holder 28A to the lower surface of the substrate P1.
  • the substrate P1 floats from the upper surface TS of the substrate holder 28A, and the friction between the lower surface of the substrate P1 and the upper surface TS of the substrate holder 28A is in a low friction state.
  • the holding pad 184b of the substrate carry-out bearer device 183A is slightly raised and driven in the + Z direction so as to follow the floating operation of the substrate P1, and a part of the substrate P1 is held by suction. Then, it is moved in the + X direction (port 150A side) with a predetermined stroke.
  • the amount of movement of the holding pad 184b (ie, the substrate P1) is set to, for example, about 50 mm to 100 mm.
  • the end on the + X side of the substrate P1 is supported by the offset beam 185a in a noncontact manner, and the position of the substrate P1 is offset from the substrate holder 28A in the X direction by a predetermined amount in the + X direction.
  • the holding pads 184a of the pair of substrate loading bearer devices 182A are moved in the + X direction with a predetermined stroke.
  • the substrate loading hand 161A supporting the substrate P2 is disposed at a predetermined position above the substrate holder 28A.
  • the substrate P2 is positioned almost right above the substrate holder 28A positioned at the substrate exchange position.
  • the substrate loading hand 161A and the substrate holder 28A are positioned such that the Y position of the substrate P1 and the Y position of the substrate P2 substantially coincide with each other.
  • the substrate P1 and the substrate P2 are disposed at different positions.
  • the X positions of the substrates P1 and P2 are relatively different from each other by the offset of the substrate P1 from the substrate holder 28A to the + X side, and the end of the substrate P2 on the -X side Are disposed (projected) closer to the ⁇ X side than the end on the ⁇ X side of the substrate P1.
  • the lower surface of the substrate P2 on the substrate loading hand 161A may be suction-held by the substrate carry-out hand 170A, or may be held by suction holding or frictional force by the finger portion 162A.
  • the notch 28b may not be formed in the substrate holder 28A.
  • the substrate P can be offset from the upper surface TS of the substrate holder 28A to the + X side by moving the substrate P in the + X-axis direction while holding the holding pad 184b, the notch 28b is placed on the substrate holder 28A. It does not have to be formed. In this case, planar correction on the substrate holder 28A can be performed even at the end of the substrate P.
  • the substrate loading hand 161A is driven in the ⁇ Z direction to a position not in contact with the substrate holder 28A.
  • the substrate loading hand 161A brings the ⁇ X side end of the substrate P2 (a part of the substrate P2) into contact with the holding pad 184a of the substrate loading bearer device 182A.
  • the holding pad 184a sucks and holds a part of the substrate P2 on the substrate loading hand 161A from below.
  • the holding pad 184a holds a part of the substrate P2 by suction at a position between the upper surface of the substrate holder 28A and the substrate holding surface of the substrate loading hand 161A at a position in the Z-axis direction.
  • the substrate loading bearer apparatus 182A holds a narrow area of the ⁇ X side end of the substrate P2. More specifically, the area is such that the entire substrate P2 can not be supported by the substrate loading bearer device 182A alone.
  • the X-direction dimension of the finger portion of the substrate loading hand 161A is described as being shorter than the X-direction dimension of the substrate P2, the dimension may be similar or the X dimension of the finger portion of the substrate loading hand 161A. It may be longer. In that case, the holding pad 184a may hold an area between the finger and the finger of the substrate loading hand 161A.
  • the substrate carry-out hand 170A releasing the suction gripping of the substrate P2 is driven, and a portion of the substrate P1 offset to the + X side from the substrate holder 28A. Hold the lower surface by suction. Further, the beam unit 152 ejects pressurized gas.
  • pressurized gas may be supplied (jetted) from the finger portion 162A of the substrate loading hand 161A to the lower surface of the substrate P2 to reduce the contact friction.
  • the substrate transport unit 160A is driven in the unloading direction (+ X direction), and the substrate unloading hand 170A holding the substrate P1 is driven in the + X direction.
  • the substrate P1 is moved from the substrate holder 28A to the port 150A (beam unit 152).
  • pressurized gas is jetted from the upper surface of each of the beams 153 of the beam unit 152, the substrate P1 is in a non-contact state (floating state) with respect to the substrate holder 28A and the port portion 150A. It is carried out from 28A.
  • the holding pad 184b of each of the pair of substrate carry-out bearer devices 183A is -Z so that a part is accommodated in the notch 28b of the substrate holder 28A (see FIGS. 3A and 3C). It is driven in the direction and the -X direction.
  • the substrate loading hand 161A is moved in the + X direction, whereby the substrate P2 partially held by the holding pad 184a.
  • the substrate loading hand 161A is moved relative to the X direction.
  • the substrate loading hand 161A is moved to the + X side with respect to the substrate holder 28A in the X direction, so that the substrate loading hand 161A is in the upper space (+ Z side) of the substrate holder 28A. Space) and the lower side of the substrate P2 (the space on the -Z side).
  • the substrate loading hand 161A is moved to the + X side with respect to the substrate holder 28A, so that it is retracted from the space between the substrate P2 partially held by the holding pad 184a and the substrate holder 28A.
  • the substrate loading hand 161A moves to the + X side with respect to the substrate holder 28A
  • the substrate loading hand 161A moves above the substrate holder 28A, that is, at a position where the Z position is higher than the upper surface of the substrate holder 28A.
  • the substrate loading hand 161A is retracted from the space between the substrate P2 and the substrate holder 28A, whereby the substrate P2 is delivered from the substrate loading hand 161A to the substrate holder 28A. That is, the substrate P2 is carried from the substrate loading hand 161A to the substrate holder 28A.
  • the region between the substrate loading hand 161A and the holding pad 184a is held by the substrate holder 28A.
  • the holding pad 184a adsorbs and holds a part of the substrate P2, thereby limiting the relative position of the substrate P2 to the substrate holder 28A in a fixed or predetermined minute movable range in the X and Y directions. ing.
  • the predetermined movable range is set by the drive range of the holding pad 184a with respect to the substrate holder 28A (or the substrate table 24). If the holding pad 184a has a function of setting the relative position (relative movable range) of the substrate P2 to the substrate holder 28A with respect to at least one of the X direction and the Y direction, the substrate table 24 (or It does not have to be installed in the substrate holder 28A). For example, it may be installed in a structure such as a column (not shown) of the exposure apparatus 10A and may be suspended from above the substrate holder 28A. In this case, the holding pad 184a may hold the upper surface of the substrate P2.
  • the substrate loading hand 161A moves relative to the substrate holder 28A in the + X direction, that is, in the direction along the substrate holding surface of the substrate holder 28A, in the direction parallel to the substrate holding surface of the substrate holder 28A.
  • the substrate P2 is retracted from below P2
  • a part of the substrate P2 is sequentially placed on the substrate holder 28A from the -X side.
  • the area of the substrate P2 held by the substrate loading hand 161A decreases, and the area of the substrate P2 supported by the holder substrate holding surface of the substrate holder 28A increases.
  • the period until the tip of the substrate loading hand 161A on the -X side is moved to the + X side from the substrate holder 28A that is, all the substrate loading hand 161A is from the space between the substrate holder 28A and the substrate P2.
  • the substrate loading hand 161A, the substrate holder 28A and the holding pad 184a simultaneously support (or hold) different portions of the substrate P2 respectively.
  • the substrate loading hand 161A the substrate holder 28A and the holding pad 184a (an optional part of the substrate P2 is the substrate loading hand 161A, the substrate holder 28A and (Supported by any of the holding pads 184a).
  • the support (or holding) of the substrate P2 by the substrate loading hand 161A and the substrate holder 28A is not limited to being in a contact state, but is a support (or holding) in a non-contact state via a gas (air gap) It is also good.
  • the Z-axis direction of the supported portion of the substrate P2 by the substrate loading hand 161A during the period until the tip of the substrate loading hand 161A on the ⁇ X side is moved to the + X side from the substrate holder 28A ( The position (Z position) with respect to the direction perpendicular to the holder substrate holding surface of the substrate holder 28A is higher than the Z position of the portion of the substrate P2 held by the holding pad 184a.
  • the substrate loading hand 161A is retracted from the space between the substrate P2 and the substrate holder 28A in the + X direction as described above, the position in the Z-axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A ( Z position) decreases gradually.
  • the portion in which the substrate P2 is held by the holding pad 184a is a circle with respect to the ⁇ y direction as the substrate loading hand 161A is retracted. It comes to land on the substrate holder 28A so as to exercise, but also in this case, the Z position of the supported portion of the substrate P2 by the substrate loading hand 161A gradually decreases. Further, the position (X position) of the supported portion of the substrate P2 supported by the substrate holder 28A in the X axis direction is gradually moved in the + X direction.
  • a position measurement device (not shown)
  • the holding pad 184a of each of the pair of substrate loading bearer devices 182A is driven in at least one of the X axis direction and the Y axis direction.
  • the position in the X-axis direction, the position in the Y-axis direction, and the angle in the ⁇ z direction of the substrate P2 with respect to the substrate holder 28A are adjusted.
  • a position measurement device may be disposed, for example, on at least one of the stage device 20A (for example, the substrate holder 28A and the substrate table 24) or a structure such as a column (not shown) provided in the exposure device 10A.
  • the substrate P2 transferred from the substrate loading hand 161A to the substrate holder 28A is placed on the substrate holder 28A except for the portion suctioned and held by the holding pad 184a.
  • the holding pad 184a may be driven in the Z-axis direction to assist the operation of delivering the substrate P2 to the substrate holder 28A.
  • the supply (spray) of pressurized gas from the substrate holder 28A is an air resistance, so that the substrate P2 can be prevented from directly colliding with the substrate holder 28A, and breakage of the substrate P2 can be prevented.
  • the pressurized gas is not supplied (jetted) from the substrate holder 28A, the air between the upper surface of the substrate holder 28A and the substrate P2 becomes air resistance, and the above-described effect is obtained.
  • the substrate P2 lands on the upper surface TS of the substrate holder 28A and comes into contact with the upper surface TS.
  • the position in the X-axis direction, the position in the Y-axis direction, and the angle in the ⁇ z direction of the substrate P2 with respect to the substrate holder 28A are not changed.
  • the beam unit 152 stops the ejection of the pressurized gas to the substrate P1.
  • the substrate unloading hand 170A releases the gripping of the substrate P1.
  • the substrate transport unit 160A is driven to ascend.
  • the beam unit 152 on which the substrate P1 is mounted is moved to the substrate delivery position with respect to the external transfer device 300.
  • the holding pad 184a moves in the -X direction so as to release the suction gripping of the substrate P2 and withdraw from the lower side of the substrate P2. Do. Thus, the portion of the substrate P2 held by the holding pad 184a is placed on the upper surface of the substrate holder 28A.
  • the robot hand of the external transfer device 300 is driven in the ⁇ X direction at a Z position lower than the beam unit 152, and is disposed below the beam unit 152.
  • the stage device 20A moves to a predetermined exposure start position while holding the substrate P2 by suction by the substrate holder 28A.
  • the description of the operation of the stage device 20A at the time of the exposure operation to the substrate P2 is omitted.
  • the robot hand of the external transfer device 300 is moved upward, and scoops the substrate P1 on the beam unit 152 from below.
  • the robot hand of the external transfer device 300 holding the exposed substrate P1 is moved in the + X direction and exits the exposure device 10A.
  • the beam unit 152 is moved in the ⁇ X direction to avoid contact with the substrate loading hand 161A, and the substrate loading hand 161A is moved in the + X direction.
  • the robot hand of the external transfer device 300 holds the substrate P3 on which the exposure is to be performed next to the substrate P2. Then, it is moved toward the port unit 150A.
  • the upper surface of the substrate loading hand 161A is lower than the lower surface of the beam unit 152 until the new substrate P3 is transported to the port 150A by the external transfer device 300.
  • the substrate transfer unit 160A is lowered (moved in the -Z direction) so as to be positioned.
  • the substrate P2 is held by the substrate loading hand 161A and the holding pad 184a from the state held only by the substrate loading hand 161A. Then, the substrate P2 is held by the substrate loading hand 161A, the substrate loading bearer device 182A, and the substrate holder 28A as the substrate loading hand 161A moves relative to the substrate holder 28A. Then, as shown in FIG. 7C, when the substrate loading hand 161A is moved to a position where the position of the substrate loading hand 161A in the X-axis direction does not overlap with the substrate holder 28A, the substrate P2 is moved with the substrate loading bearer device 182A. It is held by the substrate holder 28A and finally supported only by the substrate holder 28A. The substrate P2 is carried into the substrate holder 28A while being held by any one of the substrate loading hand 161A, the substrate holder 28A and the holding pad 184a.
  • the operation of unloading the substrate P1 from the substrate holder 28A and the operation of loading the substrate P2 into the substrate holder 28A can be performed at least partially in parallel, and the substrate exchange for the substrate holder 28A Time can be shortened.
  • the substrate carry-in hand 161A moves above the substrate holder 28A (the space on the + Z side), so there is nothing to interfere on the moving path, and the substrate is carried in quickly.
  • the hand 161A can be driven.
  • the operation of loading the substrate P2 into the substrate holder 28A can be performed quickly, so that the substrate exchange time can be shortened.
  • the substrate P2 can be carried into the substrate holder 28A while carrying out the substrate P1 from the substrate holder 28A by the operation of moving the substrate loading hand 161A to the + X side above the substrate holder 28A. That is, since a common drive system is used at the time of substrate loading and at the time of substrate unloading, it is not necessary to provide separate drive systems at the time of substrate loading and at the time of substrate unloading, and the number of driving systems can be reduced.
  • the substrate transfer apparatus 100A for transferring the substrate P2 to the substrate holder 28A the substrate loading hand 161A for holding the substrate P2 above the substrate holder 28A and the substrate
  • the substrate loading bearer apparatus 182A holding a part of the substrate P2 held by the loading hand 161A, and the substrate holder 28A, the substrate loading bearer apparatus 182A, and the substrate such that the substrate loading hand 161A is retracted from above the substrate holder 28A.
  • the substrate holder 28A, the substrate loading hand 161A, and the substrate loading bearer device 182A move relative to each other by the X-axis driving device 164. Hold the substrate P2.
  • the substrate P2 is sequentially mounted on the substrate holder 28A from the end on the -X side (the side opposite to the port 150A), so that the substrate holder 28A and the substrate P2 are not easily damaged, and dust is generated due to contact Decreases.
  • air stagnation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to be wrinkled.
  • the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed.
  • the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement is stopped halfway) in accordance with the retracting condition (speed and position) of the substrate loading hand 161A. Therefore, in order to reduce friction from the substrate loading hand 161A to the substrate P2, the pressurized gas may not be jetted.
  • the mechanism for driving the substrate loading bearer device 182A up and down can be omitted.
  • the substrate P2 is provided above the holder substrate holding surface, and part of the substrate P2 and the holder substrate holding A substrate loading hand 161A for holding the substrate P2 in a state in which the distance to the surface is shorter than the distance between the other portion of the substrate P2 and the holder substrate holding surface, and the other portion of the substrate P2 held by the substrate loading hand 161A
  • the substrate holder 28A, the substrate loading bearer device 182A, and the substrate loading hand 161A are relative to the direction along the holder substrate holding surface such that the substrate loading bearer device 182A and the substrate loading hand 161A are retracted from above the substrate holder 28A.
  • the substrate P2 can be placed on the substrate holder 28A sequentially from the end on the -X side (the opposite side to the port 150A), so the substrate holder 28A and the substrate P2 are not easily damaged, and contact is made Dust generation due to In addition, air stagnation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to be wrinkled. Further, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement is stopped halfway) in accordance with the retracting condition (speed and position) of the substrate loading hand 161A. Therefore, in order to reduce friction from the substrate loading hand 161A to the substrate P2, the pressurized gas may not be jetted. Further, the mechanism for moving the substrate loading bearer device 182A up and down can be omitted.
  • the substrate holding device holds the substrate P2 above the substrate holder 28A.
  • a substrate loading hand 161A having a surface, and a substrate loading bearer device 182A for holding a part of the substrate P2 held by the substrate loading hand 161A at a position between the holder substrate holding surface and the substrate holding surface in the vertical direction;
  • the substrate loading bearer device 182A holds a part of the substrate P2 so that the substrate loading hand 161A is retracted from above the substrate holder 28A
  • the substrate holder 28A, the substrate loading bearer device 182A and the substrate loading hand 161A are And an X-axis drive device 164 for relative movement.
  • the substrate P2 can be placed on the substrate holder 28A sequentially from the end on the -X side (the opposite side to the port 150A), so the substrate holder 28A and the substrate P2 are not easily damaged, and contact is made Dust generation due to In addition, air stagnation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to be wrinkled. Further, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement is stopped halfway) in accordance with the retracting condition (speed and position) of the substrate loading hand 161A. Therefore, in order to reduce friction from the substrate loading hand 161A to the substrate P2, the pressurized gas may not be jetted. Further, the mechanism for moving the substrate loading bearer device 182A up and down can be omitted.
  • the substrate transfer apparatus 100A for transferring the substrate P2 to the holder substrate holding surface of the substrate holder 28A, the substrate loading hand 161A for holding the substrate P2 above the substrate holder 28A, and the substrate loading The substrate loading bearer apparatus 182A holding a part of the substrate P2 held by the hand 161A, and the substrate loading 28A and the substrate loading bearer apparatus 182A and the substrate loading so that the substrate loading hand 161A is retracted from above the substrate holder 28A.
  • the X axis driving device 164 relatively moves the hand 161A in a predetermined direction along the holder substrate holding surface.
  • the substrate P2 is set so that the vertical position of the region held by the hand 161A approaches the substrate holder 28A.
  • the substrate P2 can be placed on the substrate holder 28A sequentially from the end on the -X side (the opposite side to the port 150A), so the substrate holder 28A and the substrate P2 are not easily damaged, and contact is made Dust generation due to In addition, air stagnation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to be wrinkled. Further, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed.
  • the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement is stopped halfway) in accordance with the retracting condition (speed and position) of the substrate loading hand 161A. Therefore, in order to reduce friction from the substrate loading hand 161A to the substrate P2, the pressurized gas may not be jetted. Further, the mechanism for moving the substrate loading bearer device 182A up and down can be omitted.
  • the substrate holding surface of the substrate loading hand 161A is provided to be inclined with respect to the holder substrate holding surface.
  • the substrate loading hand 161A retracts from between the substrate P2 and the substrate holder 28A, the substrate loading hand 161A moves away from the lower surface of the inclined substrate P2 (different from the tangential direction of the lower surface of the substrate P2). Since it retracts, contact wear can be reduced.
  • the X-axis drive device 164 is one of the substrate holder 28A, the substrate carry-in bearer device 182A, and the substrate carry-in hand 161A in the direction along the holding surface where the substrate holder 28A holds the substrate P2. Move relative to the other.
  • the substrate loading hand 161A retracts in a direction away from the lower surface of the inclined substrate P2 (a direction different from the tangential direction of the lower surface of the substrate P2), so that contact wear can be reduced.
  • the X-axis drive device 164 moves the substrate loading hand 161A in a direction parallel to the holder substrate holding surface of the substrate holder 28A.
  • the substrate loading hand 161A retracts in a direction away from the lower surface of the inclined substrate P2 (horizontal direction different from the tangential direction of the lower surface of the substrate P2), so that contact wear can be reduced.
  • the first modification is an example in which the configuration of the substrate transfer apparatus is changed. Specifically, in the substrate transfer apparatus 100B of the exposure apparatus 10B according to the first modification, the upper surface of the substrate loading hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A, and the upper surface of the substrate loading hand 161A is a substrate A drive system is provided which switches between the holder 28A and the holder substrate holding surface.
  • the state of FIG. 9A shows a state in which the stage device 20A is disposed at the substrate delivery position with the port portion 150A after the state of FIG. 5A in the first embodiment.
  • the substrate P2 is placed on the substrate loading hand 161A.
  • the upper surface of the substrate loading hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A.
  • the substrate loading hand 161A supporting the substrate P2 from the lower side holds the upper surface of the substrate loading hand 161A substantially parallel to the holder substrate holding surface of the substrate holder 28A, -X. Driven in the direction.
  • the operations of the stage device 20A, the substrate loading bearer device 182A, the substrate unloading bearer device 183A, and the offset beam 185a are the same as the operations described with reference to FIG.
  • the substrate loading hand 161A supporting the substrate P2 from below is disposed at a predetermined position above the substrate holder 28A.
  • the substrate loading hand 161A is driven to rise, it is driven to tilt its tip downward. That is, the substrate loading hand 161A is driven such that the upper surface of the substrate loading hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A. Thereby, the tip of the substrate P2 contacts the holding pad 184a of the substrate loading bearer device 182A. The holding pad 184a suction-holds the vicinity of the end on the -X side of the substrate P2.
  • the substrate loading hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A at the Z position where there is no risk that the tip contacts the upper surface of the substrate holder 28A even if the front end is driven to tilt downward. You may make it move to-X direction, maintaining it.
  • the substrate P2 when the substrate P2 is transferred between the port 150A and the substrate loading hand 161A, the substrate P2 is placed from one side with the substrate mounting surface of the port 150A parallel to the upper surface of the substrate loading hand 161A. Since it can be delivered to the other, the possibility of breakage of the substrate P2 at the time of substrate delivery can be reduced.
  • the distance between the port 150A and the substrate holder 28A and the substrate loading hand 161A in the Z direction can be increased.
  • the risk of the port portion 150A and / or the substrate holder 28A and the substrate loading hand 161A coming into contact is reduced.
  • the substrate loading hand 161A may be moved relative to the substrate holder 28A in the + X direction while gradually changing the inclination angle between the upper surface of the substrate loading hand 161A and the holder substrate holding surface of the substrate holder 28A. .
  • the substrate holding surface of the substrate loading hand 161A may be inclined with respect to the holder substrate holding surface of the substrate holder 28A by inclining the substrate loading hand 161A.
  • FIG. 10A is a perspective view of a substrate loading hand 161C according to a second modification
  • FIG. 10B is a side view of a substrate loading hand 161C according to the second modification.
  • the finger portion 162C is thicker at the + X side end and thinner as it approaches the ⁇ X side end. It has a triangular shape in cross section.
  • the shape of the finger portion of the substrate loading hand may be a triangular XZ cross-section, which becomes thinner toward the + X side end and closer to the ⁇ X side end.
  • the rigidity of the finger portion of the substrate loading hand is improved, and the substrate loading hand 161C is shaken when moving the substrate loading hand 161C, and the substrate loading hand 161C and the substrate holder 28A are in contact due to the fluctuation.
  • the drive mechanism for inclining the substrate loading hand 161A as in the first modification with respect to the substrate holder 28A can be omitted.
  • the tip of the substrate P2 is brought into contact with the holding pad 184a of the substrate loading bearer device 182A by being moved downward.
  • the front end of the substrate P2 is brought into contact with the holding pad 184a of the substrate loading bearer device 182A using the substrate unloading hand 170A.
  • FIGS. 11 (a) and 11 (b) corresponds to the state of FIG. 6 (a) of the first embodiment
  • FIG. 11 (b) corresponds to the state of FIG. 6 (b) of the first embodiment.
  • the substrate transfer unit 160D includes a substrate loading hand 161C according to the second variation and a substrate output hand 170A. And.
  • the substrate delivery position of the substrate loading hand 161C with the stage device 20A is on the + X side of the substrate delivery position of the substrate loading hand 161A in FIG. 6A. It is in position.
  • the substrate unloading hand 170A holding the lower surface of the substrate P2 by suction is driven so as to extend the arm, as shown in FIG. 11 (b).
  • the substrate P2 slides down along the substrate loading hand 161C, and the tip of the substrate P2 contacts the holding pad 184a of the substrate loading bearer device 182A.
  • the support pad 164D attached to the upper surface of the finger portion 162C of the substrate loading hand 161C is preferably in the shape of a bar extending in the extending direction of the finger portion 162C in order to smooth the movement of the substrate. Further, when the substrate P2 is slid, the pressurized gas may be ejected from the support pad 164D.
  • the substrate transport unit 160D may include a plurality of substrate unloading hands 170A.
  • the exposed substrate P1 on the substrate holder 28A is held by the remaining substrate carry-out hand 170A while the tip of the substrate P2 is in contact with the holding pad 184a by a part of the plurality of substrate carry-out hands 170A. Good.
  • the substrate carry-in hand 161C is moved in the + X direction to carry out the substrate carry-in operation and the substrate carry-out operation. And can be done in parallel.
  • the substrate P2 is lowered by the substrate carry-out hand 170A instead of moving the entire substrate transfer unit 160D, so positioning can be performed more easily and accurately than when the entire substrate transfer unit 160D is moved. it can.
  • the stroke in the X axis direction of the substrate transfer unit 160D can be shortened.
  • the tip of the substrate P2 can be shortened even if the movement distance of the substrate loading hand 161C in the X-axis direction is shorter than the horizontal movement component of the substrate P2 due to the gradient of the substrate loading hand 161C It can be made to approach holding pad 184a of substrate loading bearer apparatus 182A.
  • the substrate loading hand 161C according to the second modification is used, but the substrate loading hand 161A according to the first embodiment may be used.
  • FIG. 12 (a) is a top view of a substrate loading hand 161E according to a fourth modification
  • FIG. 12 (b) is a sectional view taken along the line AA in FIG. 12 (a).
  • finger portions 162E1 at both ends in the Y-axis direction among the plurality of finger portions 162E include the belt portion 166.
  • the belt portion 166 includes a belt 166a and a pair of pulleys 166b.
  • the belt 166a is disposed substantially parallel to the upper surface of the finger portion 162E1 so that the upper surface thereof forms substantially the same surface as the upper surface of the support pad 164E disposed on the finger portion 162E1 so as to contact the back surface of the substrate P2.
  • the belt 166a is made of a material having a large non-slip coefficient of friction, and is selected from, for example, urethane-coated stainless steel, silicon, rubber, or flexible PVC (polyvinyl chloride).
  • FIG. 13A and FIG. 13B are diagrams showing the loading operation of the substrate P2 into the substrate holder 28A using the substrate loading hand 161E.
  • the substrate loading hand 161E is held in a state where the holding pad 184a holds the tip of the substrate P2.
  • the substrate holder 28A is relatively moved in the + X direction.
  • the belt 166a is made of a material having a large coefficient of friction, as shown in FIG. 13B, the belt 166a in contact with the substrate P2 has a pair of pulleys together with the relative movement of the substrate P2 to the substrate loading hand 161E. It moves circularly by 166b.
  • the belt 166a descends obliquely on the substrate loading hand 161E while keeping the position of the substrate P2 in the Y-axis direction restrained. Therefore, the substrate P2 is carried into the substrate holder 28A in a state of being restrained by the belt 166a until immediately before the entire substrate P2 leaves the substrate carrying hand 161E.
  • the substrate loading hand is moved (retracted) in the + X direction, with the holding pad 184a of the substrate loading bearer apparatus 182A holding the substrate P2 at the -X side end. (For example, FIG.6 (c) etc.).
  • the movement of the Y-axis direction is not restricted until the portion other than the ⁇ X side end of the substrate P2 is supported by the substrate holder 28A.
  • the substrate loading hand 161E is moved in the + X direction with the holding pad 184a holding the ⁇ X side edge of the substrate P2, the + X side edge is transferred by the substrate loading hand 161E.
  • the substrate P2 is placed on the substrate holder 28A while holding and restraining the movement in the Y-axis direction. Therefore, according to the fourth modification, the substrate P2 can be restrained until immediately before the entire substrate P2 leaves the substrate loading hand 161E, so that the mounting displacement of the substrate P2 can be prevented.
  • the belt unit 166 may control the feed by a motor or the like.
  • the belt 166a may be fed out in synchronization with the timing at which the substrate loading hand 161E is moved backward.
  • the belt 166a may not be an endless belt.
  • the belts 166a of the finger portions 162E1 at both ends are moved independently, relative position adjustment (alignment) of the substrate P2 with respect to the substrate holder 28A can be performed on the substrate loading hand 161E.
  • the fifth modification is to change the configuration of the finger of the substrate loading hand.
  • FIG. 14A and FIG. 14B are cross sectional views schematically showing a substrate loading hand 161F according to the fifth modification.
  • the finger portion 162F of the substrate loading hand 161F has a first finger portion 162F1 and a second finger portion 162F2.
  • the first finger portion 162F1 is hollow, and a wire rope 169A for moving the second finger portion 162F2 is disposed therein.
  • the second finger portion 162F2 is coupled to the first finger portion 162F1 rotatably around the Y axis via a pin 169B and the like.
  • a wire rope 169A is connected to the second finger portion 162F2.
  • the second finger portion 162F2 rotates around the Y axis with the pin 169B as a fulcrum. Thereby, only a partial region of the substrate P2 held by the second finger portion 162F2 can be inclined with respect to the holder substrate holding surface of the substrate holder 28A.
  • the other configuration is the same as that of the first embodiment, so the description will be omitted.
  • the substrate loading hand 161F may not have a drive mechanism by the wire rope 169A, and the second finger portion 162F2 may always be inclined with respect to the first finger portion 162F1.
  • the drive mechanism for tilting the substrate loading hand 161A as in the first modification can be omitted.
  • the tip of the second finger portion 162F2 can be thinned.
  • the configuration of the exposure apparatus 10G according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of a part of the substrate transfer apparatus are different, so only the differences will be described below.
  • symbol as the said 1st Embodiment is attached
  • FIG. 15A and FIG. 15B are respectively a top view and a side view of an exposure apparatus 10G according to the second embodiment.
  • 16 (a) and 16 (b) are perspective views of a substrate loading hand 161G according to the second embodiment.
  • the substrate holder 28A is provided with the notch 28b that accommodates the holding pad 184b of the substrate carry-out bearer device 183A (see FIGS. 3A and 3C).
  • the substrate holder 28G according to the second embodiment is provided with a notch 28a for receiving the holding pad 184a of the substrate carry-in bearer apparatus 182G in addition to the notch 28b.
  • each of the plurality of beams 153 provided in the beam unit 152 has a plurality of (for example, two) bar-like legs 154 extending in the Z-axis direction, rather than both ends in the X-axis direction. It is supported from below at the inner position. A plurality of legs 154 supporting the respective beams 153 are connected by a base plate 156 near their lower end portions.
  • the beam unit 152 is integrally moved in the X axis direction with a predetermined stroke by moving the base plate 156 in the X axis direction with a predetermined stroke by the X actuator (not shown). ing.
  • the base plate 156 is moved in the Z-axis direction by the Z actuator 158, so that the beam unit 152 can be integrally moved up and down in the Z-axis direction.
  • the base plate 156 is not shown in FIG. 15A and the following top views.
  • the substrate loading hand 161G has a plurality of (for example, eight in this embodiment) finger portions 162G.
  • the plurality of finger portions 162G are connected to each other near the end on the -X side by a connecting member 163G.
  • the connecting member 163G is configured to be capable of floatingly supporting the substrate P by supplying (supplying) a gas to the back surface of the substrate P held by the substrate loading hand 161G.
  • the ends on the + X side of the plurality of finger portions 162G are free ends, and the adjacent finger portions 162G are open to the port portion 150G side.
  • the finger portions 162G are arranged such that the positions in the Y-axis direction do not overlap with the plurality of beams of the beam unit 152 in a plan view.
  • the finger portions 162G1 at both ends in the Y-axis direction have a thickness on the -X side (substrate holder 28G side) in side view It is thin and has a triangular shape in which the + X side (port portion 150G side) is thick.
  • the thickness of the inner finger portion 162G2 on the port portion side is thinner than that of the finger portions 162G1 on both ends.
  • arms 168 of the substrate loading hand 161G are attached to the finger portions 162G1 at both ends of FIGS. 16 (a) and 16 (b). As shown in FIG. 15A, both ends of the arm 168 are connected to the X-axis drive device 164.
  • the substrate loading hand 161G has a pair of substrate pick hands 167G provided on the finger portions 162G1 at both ends in the Y-axis direction.
  • the substrate pick hand 167G can be moved in a predetermined stroke in the X-axis direction and the Z-axis direction by a drive device (not shown).
  • the substrate pick hand 167G can suction and hold the lower surface of the substrate P by the vacuum suction force supplied from a vacuum device (not shown).
  • the substrate loading bearer device 182G is different from the substrate loading bearer device 182A of the first embodiment in that the X actuator 186x is omitted.
  • the holding pad 184a of the substrate loading bearer device 182G is moved within the notch 28a by the Z actuator 186z to contact the lower surface of the substrate P, and the lower surface of the substrate P. It is movable between a position away from
  • the holding pad 184a can be moved by the Z actuator 186z between a position where a part is accommodated in the notch 28a and a position higher than the upper surface of the substrate holder 28G.
  • the external transfer device 300 is moved in the -Z direction to place the substrate P2 on the beam unit 152. . Thereafter, the external transfer device 300 is moved in the + X direction and exits the exposure device.
  • the substrate loading hand 161G is driven in the + X direction, and enters under the beam unit 152 from the -X side (substrate holder 28G side).
  • the stage device 20G which has completed the exposure process moves to the substrate delivery position with the substrate transfer unit 160G.
  • the beam unit 152 is driven downward (driven in the ⁇ Z direction) by the Z actuator 158 while holding the substrate P2. At this time, a part of the substrate P2 on the beam unit 152 is in contact with the substrate pick hand 167G of the substrate loading hand 161G.
  • the substrate pick hand 167G suctions and holds the lower surface of the substrate P2.
  • the substrate P1 on the substrate holder 28G is offset in the + X direction by the substrate carry-out bearer device 183A.
  • the substrate holder 28G and the offset beam 185a supply (charge) a gas to the back surface of the substrate P1 so that the substrate P is moved in a floating state.
  • Pressurized gas is ejected from each beam 153 of the beam unit 152. Also, the beam unit 152 continues to descend gradually.
  • the substrate loading hand 161G is gradually moved in the ⁇ X direction while holding the substrate P2 on the beam unit 152 by suction with the substrate pick hand 167G.
  • the substrate P2 moves in the -X direction along with the movement of the substrate loading hand 161G in the -X direction.
  • the substrate loading hand 161G is moved in the -X direction to the X position where the crotch of the finger 162G and the beam unit 152 do not overlap in plan view. Ru.
  • the beam unit 152 is moved down to the lower side of the substrate loading hand 161G, and completely transfers the new substrate P2 to the substrate loading hand 161G. At this time, on the substrate loading hand 161G, the relative position of the substrate P2 to the substrate loading hand 161G may be adjusted by the pair of substrate pick hands 167G.
  • the substrate loading hand 161G is moved in the ⁇ X direction while holding the substrate P2, and arranged at a predetermined position above the substrate holder 28G.
  • the holding pad 184a of the substrate loading bearer device 182G is driven to rise by the Z actuator 186z.
  • the substrate loading hand 161G pushes the substrate P2 obliquely downward by the substrate pick hand 167G.
  • the end on the ⁇ X side of the substrate P2 contacts the holding pad 184a.
  • the holding pad 184a contacts the substrate P2 on the substrate loading hand 161G waiting from above the substrate holder 28G from below, and holds the vicinity of the end portion on the ⁇ X side of the substrate P2 by suction.
  • the substrate pick hand 167G may adjust the position of the substrate P2 with respect to the substrate holder 28G.
  • the substrate carry-out hand 170A is moved, and the lower surface of the portion of the substrate P1 offset to the + X side from the substrate holder 28G is held by suction.
  • the beam unit 152 is moved in the ⁇ X direction and the ⁇ Z direction, and stops at the substrate delivery position with the substrate holder 28G. Further, pressurized gas is ejected from each beam 153 of the beam unit 152. Thus, the beam unit 152 serves as a guide for supporting the substrate P1 carried out of the substrate holder 28G.
  • the gripping of the substrate P2 by the substrate pick hand 167G of the substrate loading hand 161G is released, and as shown in FIGS. 22 (a) and 22 (b), the holding pad 184a of the substrate loading bearer device 182G is the substrate P2.
  • the substrate transfer unit 160G is driven in the unloading direction (+ X side) in a state where the ⁇ X side end portion is suctioned and held.
  • the substrate unloading hand 170A holding the substrate P1 is also driven in the + X direction.
  • the substrate P1 moves from above the substrate holder 28G to the port 150G (beam unit 152).
  • the substrate P1 since pressurized gas is ejected from the upper surface of the beam unit 152, the substrate P1 is not in contact with the substrate holder 28G and the port 150G (except for the portion held by the substrate carry-out hand 170A). ) And is transported.
  • the substrate unloading hand 170A releases the grip of the substrate P1 and is moved in the ⁇ X direction together with the substrate loading hand 161G.
  • the port 150G is moved in the + X direction while holding the substrate P2 on the beam unit 152.
  • the substrate loading bearer device 182G adjusts the position of the substrate P2 with respect to the substrate holder 28G
  • the substrate loading bearer device 182G is moved in the ⁇ Z direction by the Z actuator 186z, and a part thereof is accommodated in the notch 28a.
  • the substrate P2 is adsorbed to the holder substrate holding surface of the substrate holder 28G.
  • substrate P2 described here can be abbreviate
  • the external transfer device 300 transfers a new substrate P3 to the port 150A.
  • the port portion 150G side is open between the adjacent finger portions 162G of the substrate loading hand 161G.
  • the substrate loading hand 161G directly enters the lower side of the beam unit 152 from the substrate holder 28G side and is driven to the upper side of the beam unit 152 to scoop the substrate P2 on the beam unit 152, thereby the substrate holder It can move to the 28G side. Therefore, even in a state where the substrate P2 is mounted on the beam unit 152, the substrate loading hand 161G can enter below the substrate P2 with a short moving distance in the X-axis direction.
  • the substrate loading hand 161G can receive the substrate P2 on the beam unit 152 without moving to the position on the + X side of the port 150G. Further, the substrate loading hand 161G can deliver the exposed substrate P1 onto the beam unit 152 without having to move to the position on the + X side of the port portion 150G. That is, a series of operations of loading the substrate P2 and unloading the substrate P1 can be performed without changing the positional relationship in the X direction between the external transfer device 300, the port 150G, the substrate loading hand 161G, and the substrate holder 28G.
  • the footprint of the exposure apparatus that is, the installation area of the exposure apparatus 10G can be reduced. it can.
  • the substrate P carried out to the port 150G (beam unit 152) is carried in again without the external transfer device 300. It can be delivered to the hand 161G and carried into the substrate holder 28G.
  • the plurality of finger portions 162G of the substrate loading hand 161G are mutually connected by the connecting member 163G in the vicinity of the end portion on the ⁇ X side (the substrate holder 28G side).
  • the substrate loading hand 161G according to the second embodiment can install the substrate P2 on the substrate holder 28G without distortion as compared with the substrate loading hand 161A.
  • the space between the finger portions 162A is open on the ⁇ X side. Therefore, the edge on the -X side of the substrate P2 immediately before being installed on the substrate holder 28A is a minute amount because there is a region supported by the finger portion 162A and a region not supported as shown in FIG. However, there are cases where it is difficult to place the substrate P2 on the substrate holder 28A without distortion.
  • the substrate loading hand 161G according to the second embodiment does not open between the adjacent finger portions 162G on the -X side and is continuous.
  • the substrate loading hand 161G can set the substrate P2 on the substrate holder 28G without distortion as compared with the substrate loading hand 161A.
  • the substrate loading hand 161G is moved to the substrate P2 and the substrate holder by moving the substrate transfer unit 160G (substrate loading hand 161G) and the stage device 20G (substrate holder 28G) in opposite directions. Evacuate from 28G. Thereby, the carrying-in time to the board
  • the thickness of the port portion side of the inner finger portions 162G2 other than the finger portions 162G1 at both ends is thinner than the finger portions 162G1 at both ends (See, for example, FIG. 16 (b)). Thereby, the weight of the substrate loading hand 161G can be reduced.
  • the substrate loading hand 161G can support the central portion of the substrate P2, and the substrate The carry-in hand 161G can be made smaller. Furthermore, since the arms 168 of the substrate loading hand 161G are attached to the finger portions 162G1 at both ends, since the center of gravity of the entire substrate loading hand 161G is supported, bending of the substrate loading hand 161G can be suppressed.
  • the Z position (pass line) for delivering the substrate between the external transfer device 300 and the beam unit 152 of the port 150G is set to a position higher than the upper surface of the substrate holder 28G.
  • the height of the pass line can be freely set (no restriction).
  • FIGS. 26 (a) and 26 (b) are diagrams for explaining the substrate exchange operation in the first modified example.
  • the external transfer device 300 places the substrate P2 on the beam unit 152 stopped at a position lower than the upper surface TS of the substrate holder 28G.
  • the substrate loading hand 161G is vertically moved.
  • the substrate P2 can be delivered to the substrate loading hand 161G even when there is no drive device to move to the position.
  • the substrate carried out to the port 150G (beam unit 152) is again read even without the external transfer device 300. It can be delivered to the substrate loading hand 161G and loaded into the substrate holder 28G.
  • the second modification is an example in which the configuration of the substrate transfer apparatus is changed.
  • the substrate transfer unit 160I includes a drive system that rotationally moves the substrate loading hand 161I around the Y axis. That is, the substrate loading hand 161I can tilt the substrate holding surface around the Y axis by the drive system.
  • the stroke of the substrate pick hand 167I provided in the substrate loading hand 161I is longer than the substrate pick hand 167G of the second embodiment.
  • the distance from the ⁇ X side end of the substrate loading hand 161I to the base of the finger portion 162I, that is, the width of the connecting member 163I in the X axis direction is , And is longer than the connecting member 163G of the second embodiment.
  • FIGS. 27A and 27B correspond to the states of FIGS. 17A and 17B in the second embodiment, respectively.
  • the external transfer device 300 is moved in the -Z direction to place a new substrate P2 on the beam unit 152. Then, it is moved in the + X direction and exits the exposure apparatus 10I.
  • the substrate loading hand 161I is moved in the + X direction, and enters under the beam unit 152 from the ⁇ X side (substrate holder 28G side). Then, the crotch portion of the finger portion 162I of the substrate loading hand 161I is stopped at a position not overlapping with the ⁇ X side end portion of the beam unit 152 in plan view.
  • the stage device 20G that has finished the exposure process moves to the substrate delivery position with the port 150G.
  • the substrate loading hand 161I is rotationally driven around the Y axis such that the substrate holding surface of the substrate loading hand 161I is substantially parallel to the substrate P2 on the beam unit 152.
  • the beam unit 152 is moved downward (moved in the ⁇ Z direction) while holding the substrate P2, and stops at a position where a part of the substrate P2 on the beam unit 152 contacts the substrate pick hand 167I of the substrate loading hand 161I.
  • the substrate pick hand 167I sucks and holds the back surface of the substrate P2.
  • the substrate P1 on the substrate holder 28G is offset in the + X direction by the substrate carry-out bearer device 183A.
  • the substrate pick hand 167I of the substrate loading hand 161I is moved in the ⁇ X direction while holding the substrate P2 on the beam unit 152.
  • the substrate P2 is moved onto the substrate loading hand 161I while being held by the substrate loading hand 161I and the beam unit 152.
  • pressurized gas is ejected from the beam unit 152 and the substrate carry-out hand 161I. Since the substrate pick hand 167I holds the substrate P2 by suction, the substrate P2 does not fall from the beam unit 152 or the substrate carry-out hand 161I.
  • the substrate loading hand 161I moves in the + Z direction with respect to the beam unit 152 to load the substrate P2 from the beam unit 152 onto the substrate loading hand 161I. There is less load on the substrate P2 than placement. Therefore, the risk of breakage of the substrate P2 can be reduced when the substrate P2 is transferred between the substrate loading hand 161I and the beam unit 152.
  • the beam unit 152 is driven down to the lower side of the substrate loading hand 161I, and delivers the substrate P2 completely to the substrate loading hand 161I.
  • the substrate loading hand 161I is rotationally driven around the Y axis, and the substrate holding surface of the substrate loading hand 161I is inclined relative to the holder substrate holding surface of the substrate holder 28G. It will be in the state of FIG. 27 (b).
  • the beam unit 152 is formed.
  • Substrate P2 is transferred to the substrate loading hand 161I.
  • the substrate P2 can be reliably delivered to the substrate loading hand 161I without bending.
  • the width of the connecting member 163I in the X-axis direction is wide.
  • the length of the finger portion 162I of the substrate loading hand 161I can be shortened, and the rigidity of the entire substrate loading hand 161I can be increased.
  • the port 150J includes legs 154a and 154b whose upper ends are connected to the beam 153 of the beam unit 152.
  • the port portion 150J includes Z actuators 158a and 158b which can extend and contract in the Z-axis direction independently of the legs 154a and 154b.
  • the Z actuators 158a and 158b can change the tilt of the upper surface of the beam unit 152 by changing the amount of expansion and contraction of the legs 154a and 154b.
  • the beam unit 152 disposed between the finger portions 162I1 at both ends and the inner finger portion 162I2 is illustrated.
  • FIG. 31 (a) shows a state in which the substrate P2 is installed on the beam unit 152 by the external transfer device 300.
  • the extension amounts of the legs 154a and 154b are changed by the Z actuators 158a and 158b, and the upper surface of the beam unit 152 is substantially the same as the substrate holding surface of the substrate loading hand 161I.
  • the beam unit 152 is tilted to form.
  • the substrate P2 held by the beam unit 152 is gripped by the substrate pick hand 167I with the lowering of the beam unit 152, and delivered to the substrate loading hand 161I while shifting the substrate position by the movement of the substrate pick hand 167I.
  • the substrate P2 may be moved from the beam unit 152 to the substrate loading hand 161I by tilting the beam unit 152.
  • the fourth modified example is an example in which the configuration of the finger portion of the substrate loading hand is changed.
  • the substrate loading hand 161K according to the fourth modification has finger portions 162K of substantially the same length as the substrate dimension in the X-axis direction.
  • the shape of the substrate loading hand 161K is shaped like a rhombus with sharpened both ends in a side view, and the arm 168 is located at a thick central portion. Is attached.
  • the substrate loading hand 161K is disposed at a position where the crotch of the finger 162K does not overlap with the ⁇ X side end of the beam unit 152 in plan view.
  • the beam unit 152 is moved in the -Z direction as shown in FIGS. 33 (a) and 33 (b). Since the length of the finger portion 162K of the substrate loading hand 161K is substantially the same as the length of the substrate P2, the substrate P2 is placed on the substrate loading hand 161K by the movement of the beam unit 152 in the ⁇ Z axial direction. Thereafter, the substrate P2 is slid to the slope side by the substrate pick hand 167K. As a result, a part of the substrate P2 is inclined with respect to the holder substrate holding surface of the substrate holder 28G. The subsequent operations will not be described in detail, being substantially the same as in the second embodiment.
  • the substrate P2 placed on the beam unit 152 is In the case of receiving by the substrate loading hand 161K, the substrate P2 can be scooped only by passing the substrate loading hand 161K from the bottom to the top of the beam unit 152. Therefore, there is an effect that the operation is simple and damage to the substrate P2 and dust generation hardly occur.
  • the fifth modified example is an example in which a substrate is directly delivered from the external transfer device 300 to the substrate loading hand 161K.
  • the forks of the external transfer device 300 are arranged such that the position in the Y-axis direction of the substrate loading hand 161K and the finger portion 162K do not overlap in plan view.
  • the beam 153 of the beam unit 152 is disposed so as not to overlap with the fork of the external transfer device 300 in plan view.
  • the finger portion 162K of the substrate loading hand 161K and the beam 153 of the beam unit 152 are disposed at overlapping positions in plan view.
  • the substrate loading hand 161K is driven in the + X direction so as to be disposed at a substrate delivery position with the external transfer device 300.
  • the external transfer device 300 is moved in the ⁇ X direction until reaching the substrate delivery position with the substrate loading hand 161K while holding the substrate P2.
  • the stage device 20G which has completed the exposure process moves to the substrate delivery position with the beam unit 152.
  • the substrate P1 on the substrate holder 28G is offset in the + X direction by the substrate carry-out bearer device 183A.
  • the lower surface of the substrate P2 contacts the substrate pick hand 167K.
  • the substrate pick hand 167K sucks and holds the lower surface of the substrate P2.
  • the substrate pick hand 167K holding the lower surface of the substrate P2 by suction is driven in the ⁇ X direction.
  • the substrate P2 on the external transfer device 300 is moved to the substrate loading hand 161K.
  • the external transfer device 300 is driven to descend as it is and completely transfers the substrate P2 onto the substrate loading hand 161K, the external transfer device 300 is driven in the + X direction to withdraw from the inside of the exposure device 10L.
  • the beam unit 152 is moved in the ⁇ Z direction and the ⁇ X direction, and travels to the substrate delivery position with the stage device 20G.
  • the substrate loading hand 161K can directly receive the substrate P2 from the external transfer device 300 without passing through the port portion 150G.
  • the substrate loading hand 161K since only one delivery of the delivery from the transfer apparatus 300 to the substrate loading hand 161K is sufficient and the number of times of delivery of the substrate P2 is reduced, shortening of the time taken for loading the substrate P2 and prevention of damage and dusting of the substrate P2 Can.
  • the substrate P1 is transferred from the beam unit 152 to the external transfer apparatus 300 as in the second embodiment for the recovery (unloading) of the substrate P1.
  • the beam 153 of the beam unit 152 and the finger portion 162K of the substrate loading hand 161K do not overlap so that the beam unit 152 and the finger portion of the robot hand of the external transfer device 300 do not overlap in plan view.
  • positions so that it may overlap in planar view it is not restricted to this.
  • the beam 153 of the beam unit 152 and the finger portion 162K of the substrate loading hand 161K may not overlap in plan view.
  • the beam unit 152 may be shifted by one finger portion 162K in the Y-axis direction. Thereby, the substrate carried out from the substrate holder 28G to the port portion 150G can be again scooped by the substrate carrying hand.
  • the external transfer device 300 When transferring the substrate, the external transfer device 300 is shifted in the Y-axis direction, not the beam unit 152 is shifted in the Y-axis direction so that the beam 153 does not overlap with the finger portion 162K in plan view.
  • the substrate loading hand 161K may be shifted in the Y-axis direction.
  • the sixth modification is the one in which the configuration of the substrate loading hand is changed.
  • FIG. 36 is a perspective view showing a substrate loading hand 161L according to the sixth modification.
  • the substrate loading hand 161L has a plate portion 263 having a triangular XZ cross section, and an arm portion 265 supporting the plate portion 263.
  • the upper surface of the plate portion 263 is inclined with respect to the XY plane.
  • the substrate loading hand may not have a finger. That is, the substrate loading hand may not have a fork shape.
  • the upper surface of the plate portion 263 of the substrate loading hand 161L may be curved.
  • the section coefficient of the substrate can be increased. That is, the same effect can be obtained as the thickness of the substrate becomes several to several hundreds times larger than the actual thickness with respect to the deflection of the substrate.
  • the substrate P even if the substrate P is placed on the substrate carry-in hand 161L in a state where the -X end protrudes, it bends (drops) at the -X end of the substrate P. Can be suppressed.
  • the substrate P since generation of bending (drooping) of the substrate P is suppressed, the substrate P can be brought into contact from the central portion in the Y-axis direction of the side on the ⁇ X side when the substrate P is brought into contact with the substrate holder. This makes it possible to make wrinkles less likely to occur at the -X end of the substrate P.
  • the substrate transport units 160A to 160L may be provided with a cover 199.
  • the cover 199 By providing the cover 199, adhesion of dust to the substrate P can be prevented, and the temperature of the substrate P can be made constant.
  • the stage device 20A according to the first embodiment may be used instead of the stage device 20G. Further, the stage device 20G may be applied to the first embodiment and its modification.
  • FIG. 39 shows the vicinity of the + X side end portion of the surface plate 30 called the upper column, which supports the projection optical system 16 and the mask stage 14 etc. And (c) partially chamfering (30a) so as not to interfere with the substrate loading hand.
  • FIG. 39 shows the case in which the substrate loading hand is the substrate loading hand 161G according to the second embodiment. Thereby, the height of the entire exposure apparatus can be reduced.
  • the stage devices 20A and 20G are the substrate position measuring devices as the substrate position measuring device described above.
  • the CCD cameras 31x and 31y image processing edge detection for detecting an edge are provided.
  • the CCD cameras 31x are arranged so that two sides on the -X side of the substrate P before being placed on the substrate holders 28A and 28G can be observed.
  • the CCD camera 31y is arranged such that one of the sides on the ⁇ Y side (or the + Y side) of the substrate P can be observed from below. Thereby, the X position, the Y position, and the ⁇ z position of the substrate P relative to the stage devices 20A and 20G can be known.
  • the edge of the substrate P may not be detected by the CCD cameras 31x and 31y.
  • a known edge sensor including a light source and a light receiving unit may be used.
  • the light source is disposed at the same position as the CCD cameras 31x and 31y, and the light receiving unit is disposed so as to face the light source with the substrate P interposed therebetween.
  • the cross section orthogonal to the optical axis of the measurement light emitted from the light source is linear, and the light receiving unit detects the end of the substrate P by receiving the measurement light.
  • the X position, Y position, and ⁇ z position of the substrate P with respect to the stage devices 20A and 20G are detected You may do it.
  • stage device 20M shown in FIGS. 41 (a) to 41 (c) may be used.
  • the substrate loading bearer device 182M is provided in two places at the -X side end of the substrate holder 28M. As shown in FIG. 41 (b), the substrate loading bearer device 182M has a part on the notch 28a formed at the end of the substrate holder 28M on the -X side.
  • the height is set to be substantially the same height as the upper surface of the substrate holder 28M. Therefore, even after the substrate P2 is placed, the holding pad 184a does not have to move in the ⁇ X direction and be retracted from the substrate holder 28M.
  • the substrate carry-in bearer device 182M can be inclined so that the back surface of the substrate P2 carried in obliquely can be suctioned and fixed with certainty. Further, the substrate loading bearer device 182M can move in the horizontal direction (X-axis direction or the X-axis and Y-axis directions) so that relative position adjustment (alignment) of the substrate P2 with respect to the substrate holder 28M can be performed.
  • the holding pad 184a can be inclined, the back surface of the substrate P2 can be reliably suctioned and fixed.
  • stage device 20N shown in FIGS. 42 (a) and 42 (b) may be used.
  • the stage device 20N does not have the substrate loading bearer device which moves independently and which is described in the first and second embodiments.
  • the substrate is carried in at one or more locations near the -X side end face of the substrate holder so that a part of the upper surface of the substrate holder 28N also serves as a holding pad 184a that suctions and holds the leading end of the carried-in substrate.
  • An adsorption area (bearer area) 187 is provided for adsorbing and holding the tip of the head.
  • the relative position adjustment (alignment) of the loaded substrate P with respect to the substrate holder 28N can not be performed by the substrate loading bearer device.
  • the position adjustment of the substrate P may be performed on the substrate carry-in hand using the pair of substrate carry-out hands before suctioning the substrate at step S2. If it is desired to perform relative position adjustment (alignment) of the substrate P with respect to the substrate holder 28N after placing the substrate P on the substrate holder 28N, the substrate carry-out bearer device 183A may be used.
  • the substrate loading hand 161A is retracted from between the substrate P and the substrate holder 28N.
  • the substrate holder 28N absorbs the air to suck the substrate P2 onto the holder substrate holding surface, thereby stably carrying in the substrate P2.
  • the support pad on the finger of the substrate loading hand may be omitted.
  • the same magnification system is used as the projection optical system 16.
  • the present invention is not limited to this.
  • the application of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, and for example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, for semiconductor manufacturing
  • the present invention can be widely applied to an exposure apparatus for producing an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip, etc.
  • an exposure apparatus for producing an exposure apparatus a thin film magnetic head, a micromachine, a DNA chip, etc.
  • micro devices such as semiconductor devices but also masks or reticles used in light exposure devices, EUV exposure devices, X-ray exposure devices, electron beam exposure devices, etc., glass substrates or silicon wafers etc.
  • the substrate to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank.
  • the thickness of the substrate is not particularly limited, and includes, for example, a film (a sheet-like member having flexibility). Note that the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target.
  • the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll.
  • ⁇ Device manufacturing method a method of manufacturing a microdevice using the exposure apparatuses 10A to 10L according to the above-described embodiments in the lithography process will be described.
  • liquid crystal display elements as microdevices can be obtained by forming predetermined patterns (circuit patterns, electrode patterns, etc.) on a substrate.
  • ⁇ Pattern formation process First, a so-called photolithographic process of forming a pattern image on a photosensitive substrate (such as a glass substrate coated with a resist) is performed using the exposure apparatus according to each of the above-described embodiments.
  • a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to steps such as a developing step, an etching step and a resist removing step to form a predetermined pattern on the substrate.
  • steps such as a developing step, an etching step and a resist removing step to form a predetermined pattern on the substrate.
  • a set of three stripes corresponding to R (Red), G (Green), and B (Blue) are arranged in a large number in a matrix, or a set of three stripe filters of R, G, B Form color filters arranged in the direction of a plurality of horizontal scanning lines.
  • a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like.
  • a liquid crystal is injected between a substrate having a predetermined pattern obtained in the pattern formation step and a color filter obtained in the color filter formation step to manufacture a liquid crystal panel (liquid crystal cell).
  • ⁇ Module assembly process> Thereafter, components such as an electric circuit for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) and a backlight are attached to complete the liquid crystal display element.
  • the exposure of the substrate is performed with high throughput and high accuracy using the exposure apparatus according to each of the above-described embodiments.
  • the productivity of the liquid crystal display element can be improved.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Afin de raccourcir le temps nécessaire au remplacement d'un substrat, l'invention concerne un dispositif de manipulation de substrat (100A) transportant un substrat (P2) vers la surface de support (TS) d'un dispositif de support qui peut porter le substrat (P2), qui comprend : une première partie de support (161A) qui a une surface de support de substrat qui porte le substrat (P2) au-dessus du dispositif de support ; une seconde partie de support (184A) qui porte une partie du substrat (P2) maintenue par la première partie de support (161A) dans une position entre la surface de support (TS) et la surface de support de substrat par rapport à la direction verticale ; et une unité d'entraînement (164) qui déplace le dispositif de support, la seconde partie de support (184A) et la première partie de support (161A) l'une par rapport à l'autre dans un état dans lequel la seconde partie de support (184A) porte une partie du substrat (P2), afin que la première partie de support (161A) soit rétractée depuis le dessus du dispositif de support.
PCT/JP2017/035709 2017-09-29 2017-09-29 Dispositif de manipulation de substrat, dispositif d'exposition, procédé de production d'écran plat, procédé de production de dispositif, procédé de manipulation de substrat et procédé d'exposition WO2019064576A1 (fr)

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PCT/JP2017/035709 WO2019064576A1 (fr) 2017-09-29 2017-09-29 Dispositif de manipulation de substrat, dispositif d'exposition, procédé de production d'écran plat, procédé de production de dispositif, procédé de manipulation de substrat et procédé d'exposition
CN201780095240.6A CN111149059B (zh) 2017-09-29 2017-09-29 基板搬运、曝光装置、方法、平板显示器及元件制造方法
TW107132863A TWI722320B (zh) 2017-09-29 2018-09-18 基板搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、基板搬運方法以及曝光方法

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06148752A (ja) * 1992-09-16 1994-05-27 Ono Sokki Co Ltd 密着体と密着装置及び露光装置
JP2010123888A (ja) * 2008-11-21 2010-06-03 Nikon Corp 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2011014784A (ja) * 2009-07-03 2011-01-20 Nikon Corp 基板保持部材、基板搬送装置、基板搬送方法、ステージ装置、露光装置及びデバイス製造方法
JP2012238758A (ja) * 2011-05-12 2012-12-06 Sharp Corp 基板載置装置および基板載置方法
WO2013031222A1 (fr) * 2011-08-30 2013-03-07 株式会社ニコン Dispositif de transport d'objets, dispositif de traitement d'objets, dispositif d'exposition, procédé de fabrication d'un écran plat, procédé de fabrication d'un dispositif, procédé de transport d'objets ainsi que procédé d'échange d'objets
JP2016053732A (ja) * 2011-05-13 2016-04-14 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2016157133A (ja) * 2010-02-17 2016-09-01 株式会社ニコン 搬送装置、搬送方法、露光装置、及びデバイス製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497972B2 (ja) * 2004-03-23 2010-07-07 株式会社オーク製作所 描画装置の基板の搬送機構
JP4903027B2 (ja) * 2006-01-06 2012-03-21 東京エレクトロン株式会社 基板搬送装置および基板支持体
JP5741834B2 (ja) * 2011-05-13 2015-07-01 株式会社ニコン 物体の搬出方法、物体の交換方法、物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TWI735438B (zh) * 2015-03-30 2021-08-11 日商尼康股份有限公司 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06148752A (ja) * 1992-09-16 1994-05-27 Ono Sokki Co Ltd 密着体と密着装置及び露光装置
JP2010123888A (ja) * 2008-11-21 2010-06-03 Nikon Corp 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2011014784A (ja) * 2009-07-03 2011-01-20 Nikon Corp 基板保持部材、基板搬送装置、基板搬送方法、ステージ装置、露光装置及びデバイス製造方法
JP2016157133A (ja) * 2010-02-17 2016-09-01 株式会社ニコン 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2012238758A (ja) * 2011-05-12 2012-12-06 Sharp Corp 基板載置装置および基板載置方法
JP2016053732A (ja) * 2011-05-13 2016-04-14 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2013031222A1 (fr) * 2011-08-30 2013-03-07 株式会社ニコン Dispositif de transport d'objets, dispositif de traitement d'objets, dispositif d'exposition, procédé de fabrication d'un écran plat, procédé de fabrication d'un dispositif, procédé de transport d'objets ainsi que procédé d'échange d'objets

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