WO2019051932A1 - 一种像素排列结构及其制备方法 - Google Patents

一种像素排列结构及其制备方法 Download PDF

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WO2019051932A1
WO2019051932A1 PCT/CN2017/107180 CN2017107180W WO2019051932A1 WO 2019051932 A1 WO2019051932 A1 WO 2019051932A1 CN 2017107180 W CN2017107180 W CN 2017107180W WO 2019051932 A1 WO2019051932 A1 WO 2019051932A1
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pixel
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徐超
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/84—Parallel electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a pixel arrangement structure and a method of fabricating the same.
  • OLED displays are widely recognized as the focus of next-generation display technologies due to their high brightness, fast response, low power consumption, and flexibility. Compared with thin film transistor liquid crystal displays, OLED displays have the biggest advantage of being ultra-thin, transparent and flexible.
  • OLED displays are still prepared by evaporation technology, and high-precision metal masks are required when preparing pixels using evaporation technology (Fine Metal) Mask, FMM).
  • FMM evaporation technology
  • the inventor of the present application found that the opening size of the FMM is very difficult to achieve, and even if the opening size of the FMM is very small, it is easy to cause small hole clogging during the evaporation process. This makes it difficult to prepare ultra-high resolution OLED displays by evaporation.
  • the technical problem to be solved by the present invention is to provide a pixel arrangement structure and a preparation method thereof for the above-mentioned defects of the prior art, which can effectively improve the color gamut of the OLED display panel when the pixel arrangement structure is applied to the OLED display panel. Get an ultra-high resolution OLED display panel.
  • one technical solution adopted by the present invention is to provide a pixel arrangement structure including a plurality of pixels arranged in a matrix of a plurality of rows and a plurality of columns, each of the pixels including a red sub-pixel. a green sub-pixel, a blue sub-pixel, and a yellow sub-pixel, wherein the red sub-pixel, the yellow sub-pixel, and the green sub-pixel are arranged side by side or in parallel on one side of the blue sub-pixel, The area of the blue sub-pixel is greater than or equal to the area of the red sub-pixel, the green sub-pixel, and the yellow sub-pixel.
  • another technical solution adopted by the present invention is to provide a pixel arrangement structure including a plurality of pixels arranged in a matrix of a plurality of rows and a plurality of columns, each of the pixels including a red sub-pixel a pixel, a green sub-pixel, a blue sub-pixel, and a yellow sub-pixel, wherein the red sub-pixel, the yellow sub-pixel, and the green sub-pixel are disposed side by side or in parallel on one side of the blue sub-pixel.
  • another technical solution adopted by the present invention is to provide a method for preparing a pixel arrangement structure, comprising the steps of: providing a substrate; forming a red sub-pixel on the substrate; forming a green color on the substrate a sub-pixel, wherein the green sub-pixel overlaps with the red sub-pixel partial region, the overlapping region forms a yellow sub-pixel; and a blue sub-pixel is formed on the substrate.
  • the invention has the beneficial effects that the pixel arrangement structure provided by the present invention comprises a plurality of pixels arranged in a matrix in a plurality of rows and columns, each pixel including a red sub-pixel, a green sub-pixel, and a blue.
  • the sub-pixel and the yellow sub-pixel, wherein the red sub-pixel, the yellow sub-pixel, and the green sub-pixel are arranged side by side or in parallel on one side of the blue sub-pixel.
  • the invention applies to the OLED by adding each pixel from a red sub-pixel, a green sub-pixel, and a blue sub-pixel three-color sub-pixel to a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a yellow sub-pixel four-color sub-pixel.
  • the color gamut of the OLED display panel can be effectively improved, so that the OLED display panel has better resolution.
  • FIG. 1 is a schematic structural view of an embodiment of a pixel arrangement of a pixel arrangement structure of the present invention
  • FIG. 2 is a schematic structural view of another embodiment of a pixel arrangement of a pixel arrangement structure of the present invention.
  • FIG. 3 is a schematic structural view of still another embodiment of a pixel arrangement of a pixel arrangement structure of the present invention.
  • FIG. 4 is a schematic flow chart of an embodiment of a method for fabricating a pixel arrangement structure of the present invention.
  • FIG. 1 is a schematic structural diagram of an embodiment of a pixel arrangement of a pixel arrangement structure 100 of the present invention.
  • the pixel arrangement structure 100 provided by the embodiment includes a plurality of pixels 10 arranged in a matrix of a plurality of rows and a plurality of columns, each of the pixels 10 including a red sub-pixel 11, a green sub-pixel 12, a blue sub-pixel 13 and a yellow sub-pixel 14.
  • the red sub-pixel 11 , the yellow sub-pixel 14 , and the green sub-pixel 12 are arranged side by side or in parallel on one side of the blue sub-pixel 13 .
  • the red sub-pixel 11 is made of a material that emits red light
  • the green sub-pixel 12 is made of a material that emits green light
  • the blue sub-pixel 13 is made of a material that emits blue light
  • the yellow sub-pixel 14 is a red sub-pixel 11 A composite layer with the green sub-pixel 12, that is, a composite layer of a material that emits red light and a material that emits green light.
  • the area of the blue sub-pixel 13 is larger than the area of the red sub-pixel 11, the green sub-pixel 12, and the yellow sub-pixel 14. Further, the area of the blue sub-pixel 13 is equal to the sum of the areas of the red sub-pixel 11, the green sub-pixel 12, and the yellow sub-pixel 14.
  • the luminous efficiency of the luminescent material of the blue sub-pixel 13 is lower than that of the luminescent materials of the red sub-pixel 11, the green sub-pixel 12, and the yellow sub-pixel 14, the area of the blue sub-pixel 13 is larger than the red sub-pixel. 11. The area of the green sub-pixel 12 and the yellow sub-pixel 14 such that the luminance of the light between the sub-pixels is balanced.
  • the area ratio between the red sub-pixel 11, the yellow sub-pixel 14 and the green sub-pixel 12 is 1:1:1.
  • the blue sub-pixels 13 are arranged in the horizontal direction, and the red sub-pixels 11, the yellow sub-pixels 14, and the green sub-pixels 12 are arranged side by side on one side of the long side of the blue sub-pixel 13, wherein the horizontally arranged blue
  • the length of the sub-pixel 13 is equal to the width and sum of the red sub-pixel 11, the yellow sub-pixel 14, and the green sub-pixel 12 which are juxtaposed.
  • the blue sub-pixels 13 are arranged in a horizontal direction, and the red sub-pixels 11 , the yellow sub-pixels 14 , and the green sub-pixels 12 are disposed in parallel on one side of the long side of the blue sub-pixel 13 .
  • the lengths of the blue sub-pixels 13 arranged in the lateral direction are equal to the lengths of the red sub-pixels 11, the yellow sub-pixels 14, and the green sub-pixels 12 arranged in parallel, and the widths of the blue sub-pixels 13 arranged in the lateral direction and the red color arranged in parallel
  • the widths and equalities of the sub-pixel 11, the yellow sub-pixel 14, and the green sub-pixel 12 are equal.
  • the blue sub-pixels 13 are vertically arranged, and the red sub-pixels 11, the yellow sub-pixels 14, and the green sub-pixels 12 are disposed in parallel on one side of the long side of the blue sub-pixel 13, wherein The length of the blue sub-pixels 13 arranged in the longitudinal direction is equal to the width and the width of the red sub-pixel 11, the yellow sub-pixel 14, and the green sub-pixel 12 which are disposed in parallel.
  • the arrangement of the blue sub-pixels 13, the red sub-pixels 11, the yellow sub-pixels 14, and the green sub-pixels 12 can be adjusted according to requirements, which is not limited herein.
  • the red sub-pixel 11, the green sub-pixel 12, the blue sub-pixel 13, and the yellow sub-pixel 14 each have a thickness ranging from 10 to 100 nm. Further, the red sub-pixel 11, the green sub-pixel 12, the blue sub-pixel 13, and the yellow sub-pixel The thickness of the pixel 14 ranges from 10 to 80 nm, such as 30 nm, 50 nm or 70 nm.
  • the pixel arrangement structure 100 includes a plurality of pixels arranged in a matrix of a plurality of rows and a plurality of columns, each pixel including a red sub-pixel 11, a green sub-pixel 12, a blue sub-pixel 13 and a yellow
  • each pixel is added to a red sub-pixel, a green sub-pixel, and a blue sub-pixel three-color sub-pixel to a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a yellow sub-pixel four-color sub-pixel, and is applied to
  • the color gamut of the OLED display panel can be effectively improved, so that the OLED display panel has better resolution.
  • the present invention further provides a method for preparing a pixel arrangement structure according to an embodiment, which includes the following steps:
  • step S101 a substrate is provided.
  • the substrate may be a glass substrate or a flexible substrate.
  • Step S102 forming a red sub-pixel on the substrate.
  • the red sub-pixel is made of a material that emits red light.
  • the red sub-pixel is formed by vapor deposition.
  • Step S103 forming a green sub-pixel on the substrate, wherein the green sub-pixel and the red sub-pixel partial region coincide, and the overlapping region forms a yellow sub-pixel;
  • the green sub-pixel is made of a material that emits green light, and a composite layer of a material that emits red light and a material that emits green light.
  • the green sub-pixel is formed by vapor deposition.
  • step S104 blue sub-pixels are formed on the substrate.
  • the blue sub-pixel is made of a material that emits blue light.
  • the green sub-pixel is formed by vapor deposition.
  • the area of the blue sub-pixel is larger than the area of the red sub-pixel, the green sub-pixel, and the yellow sub-pixel. Further, the area of the blue sub-pixel is equal to the area of the red sub-pixel, the green sub-pixel, and the yellow sub-pixel. with.
  • the illuminating efficiency of the luminescent material of the blue sub-pixel is lower than the illuminating efficiency of the luminescent material of the red sub-pixel, the green sub-pixel, and the yellow sub-pixel
  • the area of the blue sub-pixel is larger than the red sub-pixel, the green sub-pixel, The area of the yellow sub-pixels, so that the brightness of the light between the sub-pixels is balanced.
  • the area ratio between the red sub-pixel, the yellow sub-pixel, and the green sub-pixel is 1:1:1.
  • the blue sub-pixels are arranged in a horizontal direction, and the red sub-pixel, the yellow sub-pixel, and the green sub-pixel are juxtaposed on one side of a long side of the blue sub-pixel, wherein the horizontal arrangement
  • the length of the blue sub-pixel is equal to the width and the width of the red sub-pixel, the yellow sub-pixel, and the green sub-pixel disposed side by side.
  • the blue sub-pixels are arranged in a lateral direction, and the red sub-pixels, the yellow sub-pixels, and the green sub-pixels are disposed in parallel on one side of the long side of the blue sub-pixel, wherein the blue sub-pixels are arranged in a lateral direction.
  • the length is equal to the length of the red sub-pixel, the yellow sub-pixel, and the green sub-pixel set in parallel, and the width of the horizontally arranged blue sub-pixels is equal to the width of the red sub-pixel, the yellow sub-pixel, and the green sub-pixel set in parallel.
  • the blue sub-pixels are arranged in a vertical direction, and the red sub-pixels, the yellow sub-pixels, and the green sub-pixels are disposed in parallel on one side of the long side of the blue sub-pixel, wherein the blue sub-pixels are vertically arranged
  • the length and the width of the red sub-pixel, the yellow sub-pixel, and the green sub-pixel set in parallel are equal.
  • the arrangement of the blue sub-pixel, the red sub-pixel, the yellow sub-pixel, and the green sub-pixel may be adjusted according to requirements, which is not limited herein.
  • the red sub-pixel, the green sub-pixel, the blue sub-pixel, and the yellow sub-pixel have a thickness ranging from 10 to 100 nm. Further, the red sub-pixel, the green sub-pixel, the blue sub-pixel, and the yellow sub-pixel have a thickness ranging from 10 to 10 80 nm, such as 30 nm, 50 nm or 70 nm, and the like.
  • step S103 is performed in step S102, that is, a green sub-pixel is first formed on the substrate by evaporation, and then a red sub-pixel is formed on the substrate by evaporation, wherein the red sub-pixel and the green sub-pixel The pixel partial regions coincide, and the overlapping regions form yellow sub-pixels.
  • the step S104 is performed in the step S102 and the step S103, that is, the blue sub-pixel is formed on the substrate by vapor deposition, and then the green sub-pixel or the red sub-pixel is formed on the substrate by evaporation.
  • the pixels are then formed into red sub-pixels or green sub-pixels on the substrate by evaporation, wherein the red sub-pixels overlap the green sub-pixel partial regions, and the overlapping regions form yellow sub-pixels.
  • the method for fabricating a pixel arrangement structure includes the steps of: providing a substrate; forming a red sub-pixel on the substrate; forming a green sub-pixel on the substrate, wherein the green sub-pixel A pixel coincides with the red sub-pixel partial region, the overlapping region forms a yellow sub-pixel; and a blue sub-pixel is formed on the substrate.
  • a yellow sub-pixel is obtained, that is, the red light emitted by the red sub-pixel and the green light emitted by the green sub-pixel are combined to form a yellow light, so that the red sub-pixel and the green sub-pixel are prepared.
  • the yellow sub-pixels are formed at the same time, which simplifies the preparation process.
  • each pixel is increased from a red sub-pixel, a green sub-pixel, and a blue sub-pixel three-color sub-pixel to a red sub-pixel, a green sub-pixel,
  • the blue sub-pixel and the yellow sub-pixel four-color sub-pixel can effectively improve the color gamut of the OLED display panel when applied to the OLED display panel, thereby making the OLED display panel have better resolution.

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Abstract

一种像素排列结构（100）及其制备方法，像素排列结构（100）包括多行和多列呈矩阵排列的多个像素（10），每一像素（10）包括红色子像素（11）、绿色子像素（12）、蓝色子像素（13）和黄色子像素（14），其中，红色子像素（11）、黄色子像素（14）以及绿色子像素（12）并列或并行设置于蓝色子像素（13）的一侧。像素排列结构（100）应用至OLED显示面板时提高OLED显示面板的色域，从而获得超高分辨率的OLED显示面板。

Description

一种像素排列结构及其制备方法
【技术领域】
本发明涉及显示技术领域，特别是涉及一种像素排列结构及其制备方法。
【背景技术】
有机发光二极管（OLED）显示器具有亮度高、响应快、能耗低、可弯曲等优点，被广泛认可为下一代显示技术的焦点。OLED显示器与薄膜晶体管液晶显示器相比，最大的优势就是超薄、透明、柔性可折叠。
目前，仍然是采用蒸镀技术制备OLED显示器，使用蒸镀技术制备像素时需使用高精度金属掩模板（Fine Metal Mask，FMM）。
本申请的发明人在长期的研发过程中，发现FMM的开孔尺寸很难做到非常小，即使将FMM的开孔尺寸做到非常小时，很容易导致蒸镀过程中出现小孔堵塞的现象，使得蒸镀法很难制备出超高分辨率的OLED显示器。
【发明内容】
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种像素排列结构及其制备方法，能够使得该像素排列结构应用至OLED显示面板时有效提高OLED显示面板的色域，从而获得超高分辨率的OLED显示面板。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种像素排列结构，所述像素排列结构包括多行和多列呈矩阵排列的多个像素，每一所述像素包括红色子像素、绿色子像素、蓝色子像素和黄色子像素，其中，所述红色子像素、所述黄色子像素以及所述绿色子像素并列或并行设置于所述蓝色子像素的一侧，所述蓝色子像素的面积大于或等于所述红色子像素、所述绿色子像素、所述黄色子像素的面积。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种像素排列结构，所述像素排列结构包括多行和多列呈矩阵排列的多个像素，每一所述像素包括红色子像素、绿色子像素、蓝色子像素和黄色子像素，其中，所述红色子像素、所述黄色子像素以及所述绿色子像素并列或并行设置于所述蓝色子像素的一侧。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种像素排列结构的制备方法，包括如下步骤：提供基板；在所述基板上形成红色子像素；在所述基板上形成绿色子像素，其中所述绿色子像素与所述红色子像素部分区域重合，重合区域形成黄色子像素；在所述基板上形成蓝色子像素。
本发明的有益效果是：区别于现有技术的情况，本发明提供的像素排列结构包括多行和多列呈矩阵排列的多个像素，每一像素包括红色子像素、绿色子像素、蓝色子像素和黄色子像素，其中，红色子像素、黄色子像素以及绿色子像素并列或并行设置于蓝色子像素的一侧。本发明通过将每一像素由红色子像素、绿色子像素、蓝色子像素三色子像素增加到红色子像素、绿色子像素、蓝色子像素、黄色子像素四色子像素，应用至OLED显示面板时能够有效提高OLED显示面板的色域，从而使得OLED显示面板具有较佳的分辨率。
【附图说明】
图1是本发明像素排列结构的像素排列一实施方式的结构示意图；
图2是本发明像素排列结构的像素排列另一实施方式的结构示意图；
图3是本发明像素排列结构的像素排列又一实施方式的结构示意图；
图4是本发明像素排列结构的制备方法一实施方式的的流程示意图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细说明。
参阅图1，图1为本发明像素排列结构100的像素排列一实施方式的结构示意图。本实施方式提供的像素排列结构100包括多行和多列呈矩阵排列的多个像素10，每一像素10包括红色子像素11、绿色子像素12、蓝色子像素13和黄色子像素14，其中，红色子像素11、黄色子像素14以及绿色子像素12并列或并行设置于蓝色子像素13的一侧。
其中，红色子像素11为发射红光的材料制成，绿色子像素12为发射绿光的材料制成，蓝色子像素13为发射蓝光的材料制成，黄色子像素14为红色子像素11与绿色子像素12的复合层，即发射红光的材料与发射绿光的材料的复合层。
本实施方式中，蓝色子像素13的面积大于红色子像素11、绿色子像素12、黄色子像素14的面积。进一步的，蓝色子像素13的面积等于红色子像素11、绿色子像素12、黄色子像素14的面积之和。
可以理解，因蓝色子像素13的发光材料的发光效率低于红色子像素11、绿色子像素12、黄色子像素14的发光材料的发光效率，所以蓝色子像素13的面积大于红色子像素11、绿色子像素12、黄色子像素14的面积，从而使得各子像素之间的发光亮度达到平衡。
本实施方式中，红色子像素11、黄色子像素14以及绿色子像素12之间的面积比为1:1:1。
在本实施方式中，蓝色子像素13呈横向排列，红色子像素11、黄色子像素14、绿色子像素12并列设置于蓝色子像素13长边的一侧，其中，横向排列的蓝色子像素13的长度与并列设置的红色子像素11、黄色子像素14、绿色子像素12的宽度和相等。
在一实施方式中，请参阅图2，蓝色子像素13呈横向排列，红色子像素11、黄色子像素14、绿色子像素12并行设置于蓝色子像素13长边的一侧，其中，呈横向排列的蓝色子像素13的长度与并行设置的红色子像素11、黄色子像素14、绿色子像素12的长度相等，且呈横向排列的蓝色子像素13的宽度与并行设置的红色子像素11、黄色子像素14、绿色子像素12的宽度和相等。
在又一实施方式中，请参阅图3，蓝色子像素13呈纵向排列，红色子像素11、黄色子像素14、绿色子像素12并行设置于蓝色子像素13长边的一侧，其中，呈纵向排列的蓝色子像素13的长度与并行设置的红色子像素11、黄色子像素14、绿色子像素12的宽度和相等。
在其它实施方式中，蓝色子像素13、红色子像素11、黄色子像素14和绿色子像素12的排列方式可根据需求进行调整，在此不作限定。
红色子像素11、绿色子像素12、蓝色子像素13、黄色子像素14的厚度范围均为10-100nm，进一步的，红色子像素11、绿色子像素12、蓝色子像素13、黄色子像素14的厚度范围为10-80nm，例如30nm、50nm或70nm等。
区别于现有技术，本实施方式提供的像素排列结构100包括多行和多列呈矩阵排列的多个像素，每一像素包括红色子像素11、绿色子像素12、蓝色子像素13和黄色子像素14，其中，红色子像素11、黄色子像素14以及绿色子像素12并列或并行设置于蓝色子像素13的一侧。本实施方式通过将每一像素由红色子像素、绿色子像素和蓝色子像素三色子像素增加到红色子像素、绿色子像素、蓝色子像素和黄色子像素四色子像素，应用至OLED显示面板时能够有效提高OLED显示面板的色域，从而使得OLED显示面板具有较佳的分辨率。
请参阅图4，本发明还提供一实施方式的像素排列结构的制备方法，包括如下步骤：
步骤S101，提供基板。
在一实施方式中，基板可为玻璃基板或柔性基板。
步骤S102，在基板上形成红色子像素。
其中，红色子像素为发射红光的材料制成。
本实施方式中，红色子像素是通过蒸镀的方式形成。
步骤S103，在基板上形成绿色子像素，其中绿色子像素与红色子像素部分区域重合，重合区域形成黄色子像素；
其中，绿色子像素为发射绿光的材料制成，发射红光的材料与发射绿光的材料的复合层。
本实施方式中，绿色子像素是通过蒸镀的方式形成。
步骤S104，在基板上形成蓝色子像素。
其中，蓝色子像素为发射蓝光的材料制成。
本实施方式中，绿色子像素是通过蒸镀的方式形成。
本实施方式中，蓝色子像素的面积大于红色子像素、绿色子像素、黄色子像素的面积，进一步的，蓝色子像素的面积等于红色子像素、绿色子像素、黄色子像素的面积之和。
可以理解，因蓝色子像素的发光材料的发光效率低于红色子像素、绿色子像素、黄色子像素的发光材料的发光效率，所以蓝色子像素的面积大于红色子像素、绿色子像素、黄色子像素的面积，从而各子像素之间的发光亮度达到平衡。
本实施方式中，红色子像素、黄色子像素以及绿色子像素之间的面积比为1:1:1。
在本实施方式中，所述蓝色子像素呈横向排列，所述红色子像素、所述黄色子像素以及所述绿色子像素并列设置于蓝色子像素长边的一侧，其中，横向排列的所述蓝色子像素的长度与并列设置的所述红色子像素、所述黄色子像素、所述绿色子像素的宽度和相等。
在另一实施方式中，蓝色子像素呈横向排列，红色子像素、黄色子像素、绿色子像素并行设置于蓝色子像素长边的一侧，其中，呈横向排列的蓝色子像素的长度与并行设置的红色子像素、黄色子像素、绿色子像素的长度相等，且呈横向排列的蓝色子像素的宽度与并行设置的红色子像素、黄色子像素、绿色子像素的宽度和相等。
在又一实施方式中，蓝色子像素呈纵向排列，红色子像素、黄色子像素、绿色子像素并行设置于蓝色子像素长边的一侧，其中，呈纵向排列的蓝色子像素的长度与并行设置的红色子像素、黄色子像素、绿色子像素的宽度和相等。
在其它实施方式中，蓝色子像素、红色子像素、黄色子像素和绿色子像素的排列方式可根据需求进行调整，在此不作限定。
红色子像素、绿色子像素、蓝色子像素、黄色子像素的厚度范围均为10-100nm，进一步的，红色子像素、绿色子像素、蓝色子像素、黄色子像素的厚度范围为10-80nm，例如30nm、50nm或70nm等。
在一实施方式中，步骤S103先于步骤S102执行，即先通过蒸镀的方式在基板上形成绿色子像素，接着通过蒸镀的方式在基板上形成红色子像素，其中红色子像素与绿色子像素部分区域重合，重合区域形成黄色子像素。
在另一实施方式中，步骤S104先于步骤S102、步骤S103执行，即先通过蒸镀的方式在基板上形成蓝色子像素，接着通过蒸镀的方式在基板上形成绿色子像素或红色子像素，接着通过蒸镀的方式在基板上形成红色子像素或绿色子像素，其中红色子像素与绿色子像素部分区域重合，重合区域形成黄色子像素。
区别于现有技术，本实施方式提供的像素排列结构的制备方法，包括如下步骤：提供基板；在所述基板上形成红色子像素；在所述基板上形成绿色子像素，其中所述绿色子像素与所述红色子像素部分区域重合，重合区域形成黄色子像素；在所述基板上形成蓝色子像素。通过将绿色子像素与红色子像素部分重合，从而得到黄色子像素，即红色子像素发射的红光与绿色子像素发射的绿光组合形成黄光，如此，将红色子像素和绿色子像素制备出来的同时形成了黄色子像素，简化了制备流程。另外，制备过程中，所使用的FMM的开孔尺寸无需改变的情况下，每一像素由红色子像素、绿色子像素、蓝色子像素三色子像素增加到红色子像素、绿色子像素、蓝色子像素、黄色子像素四色子像素，应用至OLED显示面板时能够有效提高OLED显示面板的色域，从而使得OLED显示面板具有较佳的分辨率。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种像素排列结构，其中，所述像素排列结构包括多行和多列呈矩阵排列的多个像素，每一所述像素包括红色子像素、绿色子像素、蓝色子像素和黄色子像素，其中，所述红色子像素、所述黄色子像素以及所述绿色子像素并列或并行设置于所述蓝色子像素的一侧，所述蓝色子像素的面积大于或等于所述红色子像素、所述绿色子像素、所述黄色子像素的面积。
  2. 根据权利要求1所述的像素排列结构，其中，所述蓝色子像素呈横向排列，所述红色子像素、所述黄色子像素以及所述绿色子像素并列设置于所述蓝色子像素长边的一侧，其中，横向排列的所述蓝色子像素的长度与并列设置的所述红色子像素、所述黄色子像素、所述绿色子像素的宽度和相等。
  3. 根据权利要求1所述的像素排列结构，其中，所述红色子像素、所述绿色子像素、所述蓝色子像素和所述黄色子像素的厚度范围均为10-100nm。
  4. 根据权利要求1所述的像素排列结构，其中，所述红色子像素、所述黄色子像素和所述绿色子像素之间的面积比为1:1:1。
  5. 一种像素排列结构，其中，所述像素排列结构包括多行和多列呈矩阵排列的多个像素，每一所述像素包括红色子像素、绿色子像素、蓝色子像素和黄色子像素，其中，所述红色子像素、所述黄色子像素以及所述绿色子像素并列或并行设置于所述蓝色子像素的一侧。
  6. 根据权利要求5所述的像素排列结构，其中，所述蓝色子像素的面积大于所述红色子像素、所述绿色子像素、所述黄色子像素的面积。
  7. 根据权利要求5所述的像素排列结构，其中，所述蓝色子像素的面积等于所述红色子像素、所述绿色子像素、所述黄色子像素的面积之和。
  8. 根据权利要求5所述的像素排列结构，其中，所述蓝色子像素呈横向排列，所述红色子像素、所述黄色子像素以及所述绿色子像素并列设置于所述蓝色子像素长边的一侧，其中，横向排列的所述蓝色子像素的长度与并列设置的所述红色子像素、所述黄色子像素、所述绿色子像素的宽度和相等。
  9. 根据权利要求5所述的像素排列结构，其中，所述红色子像素、所述绿色子像素、所述蓝色子像素和所述黄色子像素的厚度范围均为10-100nm。
  10. 根据权利要求5所述的像素排列结构，其中，所述红色子像素、所述黄色子像素和所述绿色子像素之间的面积比为1:1:1。
  11. 一种像素排列结构的制备方法，其中，包括如下步骤：
    提供基板；
    在所述基板上形成红色子像素；
    在所述基板上形成绿色子像素，其中所述绿色子像素与所述红色子像素部分区域重合，重合区域形成黄色子像素；
    在所述基板上形成蓝色子像素。
  12. 根据权利要求11所述的方法，其中，所述蓝色子像素的面积大于所述红色子像素、所述绿色子像素、所述黄色子像素的面积。
  13. 根据权利要求11所述的方法，其中，所述蓝色子像素呈横向排列，所述红色子像素、所述黄色子像素以及所述绿色子像素并列设置于所述蓝色子像素长边的一侧，其中，横向排列的所述蓝色子像素的长度与并列设置的所述红色子像素、所述黄色子像素、所述绿色子像素的宽度和相等。
  14. 根据权利要求11所述的方法，其中，所述红色子像素、所述绿色子像素、所述蓝色子像素、所述黄色子像素均是通过蒸镀的方式形成。
  15. 根据权利要求11所述的方法，其中，所述蓝色子像素的面积等于所述红色子像素、所述绿色子像素、所述黄色子像素的面积之和。
  16. 根据权利要求11所述的方法，其中，所述红色子像素、所述黄色子像素和所述绿色子像素之间的面积比为1:1:1。
  17. 根据权利要求11所述的方法，其中，所述红色子像素、所述绿色子像素、所述蓝色子像素和所述黄色子像素的厚度范围均为10-100nm。
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