WO2019039484A1 - Emballage avec étiquette rfid - Google Patents

Emballage avec étiquette rfid Download PDF

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Publication number
WO2019039484A1
WO2019039484A1 PCT/JP2018/030893 JP2018030893W WO2019039484A1 WO 2019039484 A1 WO2019039484 A1 WO 2019039484A1 JP 2018030893 W JP2018030893 W JP 2018030893W WO 2019039484 A1 WO2019039484 A1 WO 2019039484A1
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WO
WIPO (PCT)
Prior art keywords
package body
rfid tag
antenna conductor
package
conductor layer
Prior art date
Application number
PCT/JP2018/030893
Other languages
English (en)
Japanese (ja)
Inventor
亮平 大森
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019525921A priority Critical patent/JP6785966B2/ja
Publication of WO2019039484A1 publication Critical patent/WO2019039484A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention relates to an RFID tagged package.
  • Patent Document 1 discloses a wireless IC device (RFID (Radio-Frequency Identification) tag) attached so as to stand on the outer surface of an article.
  • the article is an article at least the outer surface of which is metal, and the RFID tag is configured to perform wireless communication via the metal portion.
  • RFID Radio-Frequency Identification
  • the RFID tag described in Patent Document 1 is attached to a product so as to stand upright, there is a possibility that the design of the product may be impaired. If the article is, for example, a package for a high-end retail article, the outer surface of which is at least partially covered by a metal layer, the RFID tag can greatly impair the high aesthetics that give it a high-class feel.
  • this invention makes it a subject to provide the package with a RFID tag provided with the RFID tag so that the designability might not be impaired.
  • Package with RFID tag A package body made of a non-conductive material, A metal layer partially provided on the outer surface of the package body; An RFIC chip provided with the first and second input / output terminals and disposed in the package body; A first antenna conductor layer disposed at a portion of the package body, one end of which is connected to the first input / output terminal of the RFIC chip and the other end of which is an open end, and the metal layer is not provided; A second terminal connected to the second input / output terminal of the RFIC chip at one end and directly connected to the metal layer at the other end or via a capacitor and disposed in the package body An RFID tagged package is provided, comprising: an antenna conductor layer.
  • Package with RFID tag A package body made of a conductive material and provided with through holes; A sealing member attached to the package body to close the through hole; An RFIC chip provided with the first and second input / output terminals and disposed in the package body; A first antenna conductor layer disposed on the seal member such that one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and is located within the opening of the through hole; A second one connected to the second input / output terminal of the RFIC chip at one end, and the other end connected directly to the package body or connected via a capacitor; An RFID tagged package is provided, comprising: an antenna conductor layer.
  • a package with an RFID tag can be provided in which the RFID tag is provided so as not to impair the design.
  • a perspective view of a package with an RFID tag according to Embodiment 1 of the present invention A perspective view of the package body with the RFID tag removed Perspective view of RFID tag Equivalent circuit diagram of RFID tag
  • An exploded perspective view of the RFIC module A perspective view of a package with an RFID tag according to Embodiment 2 of the present invention The perspective view of the package main body of the state which removed the RFID tag based on this Embodiment 2
  • a perspective view of a package with an RFID tag according to Embodiment 3 of the present invention A perspective view of the package body with the RFID tag removed
  • the perspective view of the package with a RFID tag concerning Embodiment 4 of the present invention The perspective view of the package with an RFID tag concerning Embodiment 5 of the present invention
  • the RFID tag-equipped package comprises a package body made of a nonconductive material, a metal layer partially provided on the outer surface of the package body, and first and second input / output terminals.
  • a portion of the package body having one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, and the metal layer not provided And one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer or via a capacitor.
  • a second antenna conductor layer disposed on the package body.
  • the RFID tag-attached package has a sheet substrate attached to the package body, and the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are provided on the sheet substrate. It may be provided.
  • the sheet base material may be attached to the package body such that the package body has a through hole and the first antenna conductor layer is located in the opening of the through hole.
  • the package body may comprise a transparent window
  • the first antenna conductor layer, the second antenna conductor layer, and the sheet substrate may be made of a transparent material and disposed in the transparent window.
  • the first and second antenna conductor layers may be made of the same material as the metal layer and provided on the outer surface of the package body.
  • the package body is a rectangular parallelepiped box having a front surface, a back surface, a right side surface, a left side surface, a top surface, and a bottom surface, any one of the front surface, the back surface, the right side surface, and the left side surface.
  • the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are arranged in the opposing direction of the top surface and the bottom surface.
  • An RFID tag-attached package is made of a conductive material and includes a package body provided with a through hole, a seal member attached to the package body so as to close the through hole, and The RFIC chip disposed in the package body, one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and the opening of the through hole is provided.
  • a second antenna conductor layer connected via a capacitor and disposed in the package body.
  • FIG. 1 is a perspective view showing a package with an RFID (Radio-Frequency IDentification) tag according to Embodiment 1 of the present invention.
  • the XYZ coordinate system is for the purpose of facilitating the understanding of the invention, and does not limit the invention.
  • the RFID tag-equipped package 10 includes a package body 12 which is a rectangular parallelepiped box body, and a sheet-like RFID tag 30 attached to the package body 12. Have.
  • FIG. 2 shows the package body 12 with the RFID tag 30 removed.
  • the package body 12 has a front surface 12a which is directed to the front of the display shelf when displayed on a display shelf of a store, a back surface 12b opposite to the front surface 12a, and a right side surface 12c between the front surface 12a and the back surface 12b.
  • a left side 12d, a bottom 12e opposite to the display shelf, and a top 12f opposite to the bottom 12e are provided.
  • the package body 12 is made of a non-conductive material, such as a paper material or a resin material.
  • the package body 12 is made of a paper material.
  • the transparent window 14 made of a transparent (or translucent) sheet, for example, a resin sheet, is provided so that the articles contained in the RFID tag-attached package 10 can be viewed.
  • the transparent window 14 is provided on the front surface 12 a of the package body 12.
  • a metal layer 16 is partially provided on the outer surface of the package body 12.
  • the metal layer 16 is provided on the package body 12 in order to create a sense of quality of the articles contained in the RFID tag-attached package 10.
  • the package body 12 has a metallic luster due to the metal layer 16.
  • the metal layer 16 prints, for example, an ink containing metal particles such as aluminum or silver on the package body 12 (sheet-like member before being formed on the package body 12) It is formed by doing.
  • the metal layer 16 is formed on the entire surface of the back surface 12b, the left side surface 12d, the bottom surface 12e, and the top surface 12f.
  • the metal layer 16 is formed over the entire surface except for the transparent window 14.
  • the metal layer 16 is formed on the right side surface 12c except for a portion (exposed portion) 12g. That is, most of the outer surface of the package body 12 is covered by the metal layer 16.
  • An RFID tag 30 is attached to the exposed portion 12 g of the right side surface 12 c of the package body 12 where the metal layer 16 is not provided. The RFID tag 30 will be described.
  • FIG. 3 is a perspective view of the RFID tag 30. 4 is an equivalent circuit diagram of the RFID tag 30. As shown in FIG. 3
  • the RFID tag 30 includes a sheet base 32, first and second antenna conductor layers 34 and 36 provided on the sheet base 32, and an RFIC (Radio-Frequency Integrated Circuit) module. And 40.
  • RFIC Radio-Frequency Integrated Circuit
  • the sheet base 32 is a rectangular sheet made of a nonconductive material such as a paper material or a resin material, and includes the first antenna conductor layer 34 and the second antenna conductor layer. And a main surface 32a on which the RFIC module 40 is provided, and a back surface 32b opposite to the main surface 32a.
  • the sheet base 32 is attached to the package body 12 via the main surface 32 a.
  • the back surface 32 b of the sheet base 32 is exposed to the outside and constitutes a part of the outer surface of the RFID tag-attached package 10.
  • a barcode or a component table of a product may be printed on the back surface 32b.
  • the exposed portion 12g affects the design of the RFID tag-attached package 10
  • the sheet substrate 32 has a size capable of completely covering the exposed portion 12g of the package body 12 as shown in FIG. It is preferable to have.
  • the first and second antenna conductor layers 34 and 36 are pattern layers made of a conductor material such as aluminum, silver, copper, etc., and are pattern printed, for example, on the major surface 32 a of the sheet substrate 32.
  • the first antenna conductor layer 34 is disposed on one end side of the sheet base 32 in the longitudinal direction (Y-axis direction).
  • the first antenna conductor layer 34 has one end (land portion) 34 a connected to the RFIC module 40 and the other end 34 b being an open end, which will be described in detail later.
  • the portion of the first antenna conductor layer 34 between the land portion 34 a and the open end 34 b is formed in a meander shape. By forming in a meander shape in this manner, the details will be described later, but the first antenna conductor layer 34 is necessary for the RFID tag 30 to function as an exciter for good wireless communication at a predetermined communication frequency. Electric length.
  • the first antenna conductor layer 34 is disposed on the exposed portion 12 g when the sheet base 32 is attached to the package body 12.
  • One antenna conductor layer 34 is provided on the sheet substrate 32. Thereby, the electrical connection between the metal layer 16 and the first antenna conductor layer 34 is avoided.
  • the first antenna conductor layer 34 is disposed on the sheet substrate 32 such that the open end 34 b of the first antenna conductor layer 34 is located approximately at the center of the exposed portion 12 g. This is to avoid capacitive coupling between the metal layer 16 and the open end 34b.
  • the second antenna conductor layer 36 is independent of the first antenna conductor layer 34 at a distance, and the longitudinal direction of the sheet base 32 (Y It is arranged on the other end side of the axial direction).
  • the second antenna conductor layer 36 has one end (land portion) 36 a connected to the RFIC module 40 and the other end (contact pad portion) 36 b connected to the metal layer 16, which will be described in detail later.
  • the portion of the second antenna conductor layer 36 between the land portion 36a and the contact pad portion 36b is formed in a meander shape.
  • the second antenna conductor layer 36 has an inductance L5.
  • the second antenna conductor layer 36 is exposed to the exposed portion 12g except the contact pad portion 36b.
  • a second antenna conductor layer 36 is provided on the sheet substrate 32 so as to be disposed. That is, the contact pad portion 36 b overlaps the metal layer 16 and thereby electrically connects to the metal layer 16.
  • the sheet base 32 is attached (adhered) to the package body 12 via the insulating adhesive (not shown).
  • contact pad portion 36b and metal layer 16 are connected (capacitively coupled) via capacitance C2.
  • the RFIC module 40 is a wireless communication device that performs wireless communication at a communication frequency of, for example, 900 MHz band, that is, UHF band, and is provided on the main surface 32 a of the sheet base 32. . Further, the RFIC module 40 is connected to the first antenna conductor layer 34 and the second antenna conductor layer 36 in order to perform wireless communication. The RFIC module 40 will be described with reference to FIG.
  • FIG. 5 is an exploded perspective view of the RFIC module 40. As shown in FIG.
  • the RFIC module 40 is configured of a multilayer substrate consisting of three layers. Specifically, the RFIC module 40 is configured by laminating flexible insulating sheets 42A, 42B, and 42C made of resin materials such as polyimide and liquid crystal polymer. 5 shows the RFIC module 40 shown in FIG. 3 in a state of being turned over and disassembled.
  • the RFIC module 40 has an RFIC chip 44, a plurality of inductance elements 46A, 46B, 46C, and 46D, and external connection terminals 48, 50.
  • the inductance elements 46A to 46D and the external connection terminals 48 and 50 are formed on the insulating sheets 42A to 42C, and are formed of conductor patterns made of a conductor material such as copper.
  • the RFIC chip 44 is mounted at the central portion in the longitudinal direction (X-axis direction) on the insulating sheet 42C.
  • the RFIC chip 44 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon.
  • the RFIC chip 44 further includes a first input / output terminal 44a and a second input / output terminal 44b.
  • the RFIC chip 44 has an internal capacitance (capacitance: self-capacitance of the RFIC chip itself) C1.
  • the inductance element (first inductance element) 46A is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42C on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46A includes an inductance L1. A land 46Aa connected to the first input / output terminal 44a of the RFIC chip 44 is provided at one end (the end outside the coil) of the inductance element 46A. A land 46Ab is also provided at the other end (end on the coil center side).
  • the inductance element (second inductance element) 46B is provided on the other side of the insulating sheet 42C in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46B includes an inductance L2. A land 46Ba connected to the second input / output terminal 44b of the RFIC chip 44 is provided at one end (end outside the coil) of the inductance element 46B. A land 46Bb is also provided at the other end (end on the coil center side).
  • an inductance element (third inductance element) 46C is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42B on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42B. It is configured. Further, the inductance element 46C is opposed to the inductance element 46A in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46C includes an inductance L3. A land 46Ca is provided at one end (end on the coil center side) of the inductance element 46C. The land 46Ca is connected to the land 46Ab of the inductance element 46A on the insulating sheet 42C through the interlayer connecting conductor 52 such as a through hole conductor penetrating the insulating sheet 42B.
  • an inductance element (fourth inductance element) 46D is provided on the other side of the insulating sheet 42B in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42B. It is configured. Further, the inductance element 46D is opposed to the inductance element 46B in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46D includes an inductance L4. A land 46Da is provided at one end (end on the coil center side) of the inductance element 46D. The land 46Da is connected to the land 46Bb of the inductance element 46B on the insulating sheet 42C via the interlayer connection conductor 54 such as a through hole conductor penetrating the insulating sheet 42B.
  • the inductance elements 46C and 46D on the insulating sheet 42B are integrated as one conductor pattern. That is, the respective other ends (ends outside the coil) are connected to each other. Further, through holes 42Ba in which the RFIC chips 44 mounted on the insulating sheet 42C are accommodated are formed in the insulating sheet 42B.
  • the external connection terminals 48 and 50 are formed of a conductor pattern provided on the insulating sheet 42A. Further, the external connection terminals 48 and 50 are opposed in the longitudinal direction (X-axis direction) of the insulating sheet 42A.
  • One external connection terminal 48 is connected to the land 46Ca of the inductance element 46C on the insulating sheet 42B via an interlayer connecting conductor 56 such as a through hole conductor penetrating the insulating sheet 42A.
  • the other external connection terminal 50 is connected to the land 46 Da of the inductance element 46 D on the insulating sheet 42 B via an interlayer connecting conductor 58 such as a through hole conductor penetrating the insulating sheet 42 A.
  • One external connection terminal 48 is connected to the land portion 36 a of the second antenna conductor layer 36 via, for example, a solder.
  • the other external connection terminal 50 is connected to the land 34 a of the first antenna conductor layer 34 via, for example, a solder.
  • the RFIC chip 44 is composed of a semiconductor substrate. Further, the RFIC chip 44 exists between the inductance elements 46A and 46B and between the inductance elements 46C and 46D. The RFIC chip 44 functions as a shield, thereby suppressing magnetic field coupling and capacitive coupling between the spiral coil inductance elements 46A and 46B provided on the insulating sheet 42C. Similarly, magnetic field coupling and capacitive coupling between the spiral coiled inductance elements 46C and 46D provided on the insulating sheet 42B are suppressed. As a result, narrowing of the pass band of the communication signal is suppressed.
  • the capacitance C1 (internal capacitance of the RFIC chip 44) and the inductances L1 to L4 (inductances of four inductance elements) allow the RFIC chip 44 and the first and second antenna conductor layers 34 and 36 to A matching circuit for matching between the two is configured.
  • the RFID tag 30 exchanges radio waves with an external wireless communication device (for example, a reader / writer device) via the metal layer 16 of the package body 12.
  • an external wireless communication device for example, a reader / writer device
  • the first antenna conductor layer 34 substantially functions as an exciter for exciting the second antenna conductor layer 36 (for radiating radio waves from the metal layer 16 through the second antenna conductor layer 36).
  • the first antenna conductor layer 34 is formed in a meander shape and has an electrical length for functioning as an exciter.
  • the RFIC chip 44 of the RFIC module 40 is driven by the electromotive force.
  • the driven RFIC chip 44 transmits the data stored in the storage unit via the second antenna conductor layer 36 or the metal layer 16.
  • the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are arranged in the opposing direction (Y-axis direction) of the top surface 12 f and the bottom surface 12 e of (package body 12). Moreover, these are arrange
  • radio waves are substantially emitted from the metal layer 16 on the front surface 12a, the back surface 12b, the right side surface 12c, and the left side surface 12d. That is, radiation of radio waves from the top surface 12f and the bottom surface 12e is suppressed.
  • the RFID tag 30 of the RFID tag-attached package 10 placed on the display shelf with the bottom surface 12e in contact with the display shelf can be read not only from the front but also from the rear of the display shelf.
  • the display shelf above the RFID tag-equipped package 10 and the display shelf below can function as a shield to interfere with wireless communication.
  • the RFID tag-attached package 10 can be provided in which the RFID tag 30 is provided so as not to impair the design.
  • the RFID tag-equipped package 10 provided with the RFID tag 30 can be provided without substantially changing the external shape of the package body 12.
  • the first antenna conductor layer 34 is disposed on the exposed portion 12 g of the package body 12 in which the metal layer 16 is not provided.
  • the second embodiment is different.
  • the other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
  • FIG. 6 is a perspective view of a package with an RFID tag according to the second embodiment.
  • FIG. 7 is a perspective view of the package body with the RFID tag removed.
  • the appearance of the RFID tag equipped package 110 according to the second embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG.
  • the package body 112 is different from the package body 12 of the first embodiment described above.
  • the package body 112 is provided with a through hole 112h.
  • the through hole 112 h is a portion of the package body 112 where the metal layer 116 is not provided.
  • the first antenna conductor layer 34 is provided such that the first antenna conductor layer 34 is located in the opening of the through hole 112h formed in the right side surface 112c.
  • the sheet base 32 is attached to the package body 12. That is, when viewed in the direction (X-axis direction) orthogonal to the right side surface 112c, the first antenna conductor layer 34 is surrounded by the opening edge of the through hole 112h at a distance.
  • the RFIC module 40 and a part of the second antenna conductor layer 36 are also located in the opening of the through hole 112h.
  • the sheet base 32 has a size capable of closing the through hole 112 h (that is, it functions as a seal member).
  • the RFID tag-attached package 110 can be provided in which the RFID tag 30 is provided so as not to impair the design.
  • the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are provided on the sheet base 32, and the sheet base 32 is attached to the package body 12.
  • the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are disposed in the package body 12.
  • the third embodiment is different.
  • the other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
  • FIG. 8 is a perspective view of a package with an RFID tag according to the third embodiment.
  • FIG. 9 is a perspective view of the package body with the RFID tag removed.
  • the appearance of the RFID tag equipped package 210 according to the third embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG.
  • the package main body 212 is different from the package main body 12 of the first embodiment described above.
  • the first antenna conductor layer 234 and the second antenna conductor layer 236 of the RFID tag 230 are not provided on the sheet base 232 but are provided on the package body 212.
  • the first antenna conductor layer 234 and the second antenna conductor layer 236 are made of the same material as the metal layer 216. That is, the metal layer 216, the first antenna conductor layer 234, and the second antenna conductor layer 236 are formed on the outer surface of the package body 212 in the same process (for example, a printing process). Therefore, the shape of the exposed portion 212g is more complicated than the exposed portion 12g of the first embodiment described above.
  • the metal layer 216 and the second antenna conductor layer 236 are directly connected. Being made of the same material, the electrical resistance between the metal layer 216 and the second antenna conductor layer 236 is substantially zero.
  • the RFIC module 40 is also provided in the package body 212.
  • the sheet substrate 232 serves to protect the first antenna conductor layer 234, the second antenna conductor layer 236, and the RFIC module 40.
  • the RFIC module 40 may be provided on the sheet substrate 232.
  • the RFIC module 40 is connected to the first and second antenna conductor layers 34 and 36 by attaching the sheet base 232 to the package body 212.
  • the RFID tag-attached package 210 can be provided in which the RFID tag 230 is provided so as not to impair the design.
  • Embodiment 4 differs from the above-described first embodiment in that the RFID tag is substantially transparent.
  • FIG. 10 is a perspective view of a package with an RFID tag according to the fourth embodiment.
  • transparent windows 314A, 314B, and 314C are provided on the front surface 312a, the right side surface 312c, and the left side surface 312d of the package body 312, respectively.
  • the RFID tag 330 is attached to the right side surface 312 c of the package body 312.
  • the sheet base 332, the first antenna conductor layer 334, and the second antenna conductor layer 336 are made of a transparent material.
  • the first antenna conductor layer 334 and the second antenna conductor layer 336 are made of, for example, indium tin oxide (ITO).
  • the sheet base material 332 is attached to the right side surface 312 c of the package body 312 such that the first antenna conductor layer 334 is disposed in the transparent window 314 B. That is, the first antenna conductor layer 334 is disposed in the transparent window 314 B which is a portion of the package body 312 where the metal layer 316 is not provided.
  • the second antenna conductor layer 336 and the sheet base 332 are partially disposed in the transparent window 314B.
  • the RFID tag 330 is transparent, the transparency of the transparent window 314B hardly changes even if it is disposed in the transparent window 314B. Also, even if a part of the RFID tag 330 overlaps the metal layer 316 in order to connect the contact pad portion 336 b of the second antenna conductor layer 336 with the metal layer 316, it is transparent. You can see the part. Therefore, in the case of the fourth embodiment, even if the RFID tag 330 is provided, the design of the package body 312 is hardly changed.
  • the RFID tag-attached package 310 can be provided in which the RFID tag 330 is provided so as not to impair the design.
  • the package body 12 is made of a paper material, that is, a non-conductive material.
  • the package body is made of a conductor material.
  • the RFID tag is substantially the same as that of the first embodiment.
  • FIG. 11 is a perspective view of a package with an RFID tag according to the fifth embodiment of the present invention.
  • the RFID tag-attached package is shown with the RFID tag removed.
  • the package body 412 of the RFID tag-attached package 410 is a bag made of a sheet-like conductive material.
  • the package body 412 is produced by making an aluminum sheet cylindrical and sealing its both ends.
  • a through hole 412 h is formed in the package body 412. Further, a sheet-like seal member 418 made of a nonconductive material (for example, a resin material) is attached to the package body 412 in order to close the through hole 412 h.
  • a nonconductive material for example, a resin material
  • the RFID tag 30 is attached to the package body 412 such that the first antenna conductor layer 34 is located in the opening of the through hole 412 h, that is, disposed on the seal member 418. Thereby, the electrical connection between the first antenna conductor layer 34 and the package body 412 is avoided.
  • the sheet base 32 of the RFID tag 30 has a size capable of closing the through hole 412 h of the package body 412 and is made of a resin material, the sheet base 32 blocks the through hole 412 h. It may function as a seal member. Thereby, the seal member 418 can be omitted.
  • the through hole 412 h may be closed by a transparent seal member 418 to form a transparent window of the package body 412.
  • the sheet base 32, the first antenna conductor layer 34, and the second antenna conductor layer 36 are made of a transparent material.
  • the RFID tag-attached package 410 can be provided in which the RFID tag 30 is provided so as not to impair the design.
  • the package body 12 in the RFID tag-attached package 10 is a rectangular parallelepiped box, but the embodiment of the present invention is not limited thereto.
  • the shape of the package body may be cylindrical, for example.
  • the package body made of non-conductive material may also be a bag as in the fifth embodiment described above.
  • the package body may be a bag made of paper or resin material, the outer surface of which may be partially provided with a metal coating.
  • the first antenna conductor layer 34 and the second antenna conductor layer 36 have meandering portions, but the embodiment of the present invention is not limited to this. Not limited to.
  • the shapes of the first antenna conductor layer and the second antenna conductor layer correspond to the specifications of the RFID tag (communication frequency, communicable distance, etc.), and the electrical characteristics (inductance, electric length, etc.) necessary for the specifications Are modified in various ways to provide
  • the RFID tag 30 is attached to the outer surface of the package body 12, but the embodiment of the present invention is not limited to this.
  • an RFID tag may be provided on the inner surface of the package body 12.
  • the RFID tag is attached to its inner surface before the package body is formed (prior to assembly).
  • the second antenna conductor layer disposed on the inner surface side of the package body capacitively couples with the metal layer provided on the outer surface through the package body. In this case, the RFID tag is less likely to come off the package body during handling of the RFID tag-equipped package.
  • an RFID tag-attached package broadly includes a package body made of a non-conductive material, a metal layer partially provided on the outer surface of the package body, And a second input / output terminal, the RFIC chip disposed in the package body, one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, the metal layer provided A first antenna conductor layer disposed in the portion of the package body which is not connected, and one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer And a second antenna conductor layer connected via a capacitor and disposed on the package body.
  • the invention is applicable to packages that need to have an RFID tag attached.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

L'invention concerne un emballage (10) avec une étiquette RFID qui comprend : un corps principal d'emballage (12) qui est formé à partir d'un matériau non conducteur ; une couche métallique (16) qui est partiellement disposée sur la surface externe du corps principal d'emballage (12) ; une puce RFIC qui est pourvue de première et de seconde bornes d'entrée/sortie et est disposée sur le corps principal d'emballage (12) ; une première couche conductrice d'antenne (34) qui a une extrémité connectée à la première borne d'entrée/sortie de la puce RFIC, tandis que l'autre extrémité agit comme une extrémité ouverte, et qui est disposée dans une partie (12g) du corps principal d'emballage (12), où il n'y a pas la couche métallique (16) ; et une seconde couche conductrice d'antenne (36) qui a une extrémité connectée à la seconde borne d'entrée/sortie de la puce RFIC, tout en ayant l'autre extrémité connectée à la couche métallique (16) directement ou par l'intermédiaire d'un condensateur, et qui est agencée sur le corps principal d'emballage (12).
PCT/JP2018/030893 2017-08-24 2018-08-22 Emballage avec étiquette rfid WO2019039484A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019525921A JP6785966B2 (ja) 2017-08-24 2018-08-22 Ｒｆｉｄタグ付きパッケージ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017161519 2017-08-24
JP2017-161519 2017-08-24

Publications (1)

Publication Number Publication Date
WO2019039484A1 true WO2019039484A1 (fr) 2019-02-28

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Country Link
JP (1) JP6785966B2 (fr)
WO (1) WO2019039484A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022075263A1 (fr) * 2020-10-05 2022-04-14 株式会社村田製作所 Récipient comprenant un module rfid
JPWO2022113851A1 (fr) * 2020-11-30 2022-06-02
DE212021000250U1 (de) 2020-11-09 2022-08-23 Murata Manufacturing Co., Ltd. Behälter, der ein RFID-Modul umfasst
JP7476722B2 (ja) 2020-08-24 2024-05-01 大日本印刷株式会社 Ｒｆタグ付き包装体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009031893A (ja) * 2007-07-25 2009-02-12 Hitachi Ltd Ｒｆｉｄタグ実装パッケージおよびその製造方法
JP2013258779A (ja) * 2011-02-28 2013-12-26 Murata Mfg Co Ltd 無線通信デバイス
JP2016226047A (ja) * 2014-01-23 2016-12-28 株式会社村田製作所 無線通信タグ付き物品および無線通信タグ
JP2017095147A (ja) * 2015-11-25 2017-06-01 セコム株式会社 封印具

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Publication number Priority date Publication date Assignee Title
JP6439344B2 (ja) * 2014-09-22 2018-12-19 大日本印刷株式会社 Ｉｃタグラベル

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Publication number Priority date Publication date Assignee Title
JP2009031893A (ja) * 2007-07-25 2009-02-12 Hitachi Ltd Ｒｆｉｄタグ実装パッケージおよびその製造方法
JP2013258779A (ja) * 2011-02-28 2013-12-26 Murata Mfg Co Ltd 無線通信デバイス
JP2016226047A (ja) * 2014-01-23 2016-12-28 株式会社村田製作所 無線通信タグ付き物品および無線通信タグ
JP2017095147A (ja) * 2015-11-25 2017-06-01 セコム株式会社 封印具

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7476722B2 (ja) 2020-08-24 2024-05-01 大日本印刷株式会社 Ｒｆタグ付き包装体
WO2022075263A1 (fr) * 2020-10-05 2022-04-14 株式会社村田製作所 Récipient comprenant un module rfid
DE212021000250U1 (de) 2020-11-09 2022-08-23 Murata Manufacturing Co., Ltd. Behälter, der ein RFID-Modul umfasst
US11797815B2 (en) 2020-11-09 2023-10-24 Murata Manufacturing Co., Ltd. Container including RFID module
JPWO2022113851A1 (fr) * 2020-11-30 2022-06-02
WO2022113851A1 (fr) * 2020-11-30 2022-06-02 株式会社村田製作所 Récipient pourvu d'un module rfid et procédé de fabrication de récipient pourvu du module rfid
JP7243931B2 (ja) 2020-11-30 2023-03-22 株式会社村田製作所 Ｒｆｉｄモジュールを備えた容器及びｒｆｉｄモジュールを備えた容器の製造方法

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JPWO2019039484A1 (ja) 2019-11-07

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