Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0607—Solder feeding devices
  • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
  • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
  • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
  • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3457—Solder materials or compositions; Methods of application thereof
  • H05K3/3485—Applying solder paste, slurry or powder
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Definitions

• the present application relates to a solder paste addition device, in particular to a worktable and a solder paste nozzle for an automatic solder paste addition device capable of automatically removing residual solder paste.
• solder paste printers In the surface mount technology of printed circuit boards, solder paste printers (also called stencil printers) are used to print solder paste onto electronic products (such as circuit boards).
• a solder paste printer generally comprises a screen plate (or stencil), a solder paste addition device, a scraping blade or scraper, and other mechanisms.
• the circuit board is automatically fed into the solder paste printer.
• the circuit board has a pattern of solder pads or some other conductive surfaces on which solder paste can be deposited, and the circuit board has one or more small holes or marks, called datum points, which are used as reference points to align the circuit board with the screen plate in the solder paste printer before printing solder paste on the circuit board.
• solder paste is dispensed by moving a scraping blade or scraper across the screen plate to force the solder paste to pass through the holes in the screen plate and fall onto the circuit board. After the printing operation, the circuit board is then delivered to another workstation in the processing line of printed circuit boards.
• the automatic solder paste addition device on the solder paste printing machine is used for automatically adding tanked or canned solder paste to the screen plate of the solder paste printer so as to supplement the solder paste consumed in the printing process.
• the solder paste tank and the solder paste nozzle inserted into the solder paste tank from the opening of the solder paste tank usually form a solder paste tank assembly, and the solder paste is dispensed (or extruded) from the solder paste tank through relative displacement of the solder paste tank and the solder paste nozzle.
• the automatic solder paste addition device is used, the solder paste tank assembly is first mounted on the automatic solder paste addition device, so that the opening of the solder paste tank faces downward.
• solder paste tank assembly is moved to a certain position above the screen plate (this action is simply referred to as "positioning"), and then the solder paste is dispensed to the screen plate from the solder paste tank nozzle by means of actions such as extrusion or extraction (this action is simply referred to as “solder addition”).
• positioning this action is simply referred to as "positioning”
• solder paste is dispensed to the screen plate from the solder paste tank nozzle by means of actions such as extrusion or extraction
• the solder paste may be diffused into the surrounding environment, and after removing the solder paste residue, the solder paste is easily further dripped due to gravity or the like.
• the purpose of the present application is to provide a solder paste addition device capable of automatically removing residual solder paste, which can effectively and automatically remove the residual solder paste from a solder paste nozzle of the solder paste addition device.
• the present application provides a solder paste nozzle comprising: an upper nozzle portion, a lower nozzle portion, and a film disposed between the upper nozzle portion and the lower nozzle portion; a solder paste nozzle through-hole penetrating through the upper nozzle portion, the lower nozzle portion and the film, wherein the solder paste nozzle through-hole forms a lower nozzle through-hole in the lower nozzle portion; and a deformation space disposed between an upper surface of the film and the upper nozzle portion and/or between a lower surface of the film and the lower nozzle portion, wherein the lower nozzle portion is provided with at least one nozzle duct to enable a gas flow to be blown upwardly to the film through the at least one nozzle duct to upwardly deform the film, thereby forming a gas flow passage between the film and the lower nozzle portion to enable a gas flow to enter the lower nozzle through-hole via the gas flow passage to blow residual solder paste out of the lower nozzle through-hole
• the at least one nozzle duct has a nozzle duct outlet, the nozzle duct outlet is disposed on a top surface of the lower nozzle portion, and the film covers the nozzle duct outlet.
• the deformation space is disposed at the bottom of the upper nozzle portion, and the deformation space at least partially covers the nozzle duct outlet.
• the deformation space is disposed at the top of the lower nozzle portion, and the deformation space is in communication with the at least one nozzle duct.
• the upper nozzle portion has a head, and the head is able to be inserted into a solder paste tank containing solder paste and moved relative to the solder paste tank so as to enable the solder paste to flow out of the solder paste nozzle through-hole.
• the film is made of a rubber material or another elastic material.
• the present application provides a worktable of a solder paste addition device, the worktable comprising: at least one worktable duct, each of the at least one worktable ducts comprising a worktable duct inlet and a worktable duct outlet, the worktable duct inlet being used to be in communication with a gas source to deliver a gas flow from a gas source to the worktable duct outlet, and the worktable duct outlet being used to provide a gas flow blown over the worktable.
• the worktable further comprises an opening for accommodating a lower end of a solder paste nozzle, and the worktable duct is used to provide a gas flow for a nozzle duct of the solder paste nozzle accommodated in the worktable.
• the worktable comprises an upper surface and a lower surface, and the worktable duct outlet is disposed on the upper surface.
• the worktable duct comprises a first passage portion and a second passage portion, the first passage portion being connected to a gas source, and one end of the second passage portion being connected to the first passage portion and the other end thereof being connected to the worktable duct outlet, wherein the second passage portion is arranged to be formed by extending upwardly from the first passage portion.
• the present application provides a solder paste addition device, comprising: a solder paste nozzle, comprising: an upper nozzle portion, a lower nozzle portion, and a film disposed between the upper nozzle portion and the lower nozzle portion; a solder paste nozzle through-hole penetrating through the upper nozzle portion, the lower nozzle portion and the film, wherein the solder paste nozzle through-hole forms a lower nozzle through-hole in the lower nozzle portion; and a deformation space, the deformation space being disposed between an upper surface of the film and the upper nozzle portion and/or between a lower surface of the film and the lower nozzle portion, wherein the lower nozzle portion is provided with at least one nozzle duct to enable a gas flow to be blown upwardly to the film through the at least one nozzle duct to upwardly deform the film, thereby forming a gas flow passage between the film and the lower nozzle portion to enable a gas flow to enter the lower nozzle through-hole via the
• the at least one nozzle duct has a nozzle duct inlet located at a bottom surface of the lower nozzle portion, the at least one workspace duct has a worktable duct outlet located at an upper surface of the worktable, and the nozzle duct inlet is aligned with the worktable duct outlet.
• the at least one nozzle duct has a nozzle duct outlet, the nozzle duct outlet is disposed on a top surface of the lower nozzle portion, and the film covers the nozzle duct outlet.
• the deformation space is disposed at the bottom of the upper nozzle portion, and the deformation space at least partially covers the nozzle duct outlet.
• the deformation space is disposed at the top of the lower nozzle portion, and the deformation space is in communication with the at least one nozzle duct.
• solder paste nozzle and the worktable of the automatic solder paste addition device cooperate with each other, and the residual solder paste can be removed from the through-hole of the lower nozzle portion after the end of the solder addition process.
• the solder paste may be dispersed into small droplets or powder during the removal of the residual solder paste using a high-pressure gas, the surrounding environment is contaminated; however, in the present application, the action of blowing the solder paste with gas is limited in the space of the through-hole of the lower portion of the solder paste nozzle, so as to prevent the droplets or powder into which the solder paste is dispersed by the gas flow from diffusing into the surrounding environment.
• Fig. 1 shows a perspective view of a solder paste addition device of the present application
• Fig. 2A shows a sectional view of a solder paste nozzle according to an embodiment of the present application
• Fig. 2B shows an exploded view of the solder paste nozzle shown in Fig. 2A;
• Fig. 3 is a perspective view of an upper nozzle portion of the solder paste nozzle shown in Figs. 2 A and 2B;
• Fig. 4A is a perspective view of a lower nozzle portion of the solder paste nozzle shown in Figs. 2 A and 2B;
• Fig. 4B is a partial sectional view of the lower nozzle portion shown in Fig. 4A;
• Fig. 5 is a perspective view of a film of the solder paste nozzle shown in Figs. 2A and
• Fig. 6A shows a perspective view of a worktable of the solder paste addition device of the present application
• Fig. 6B is a partial sectional view of the worktable of the solder paste addition device shown in Fig. 6A;
• Fig. 7 shows a sectional view of the solder paste nozzle shown in Figs. 2A and 2B assembled in a solder paste tank and assembled on the worktable;
• Fig. 8A shows a sectional view of a solder paste nozzle according to another embodiment of the present application.
• Fig. 8B shows an exploded view of the solder paste nozzle shown in Fig. 8A;
• Fig. 8C is a partially enlarged schematic view of the solder paste nozzle shown in Fig. 8A;
• Fig. 9 is a perspective view of an upper nozzle portion of the solder paste nozzle shown in Figs. 8 A and 8B;
• Fig. 10A is a perspective view of a lower nozzle portion of the solder paste nozzle shown in Figs. 8 A and 8B;
• Fig. 10B is a partial sectional view of the lower nozzle portion shown in Fig. 10A.
• Fig. 11 shows a sectional view of the solder paste nozzle shown in Figs. 8 A and 8B assembled in a solder paste tank and assembled on the worktable.
• Fig. 1 shows a perspective and exploded view of a solder paste addition device 100 of the present application.
• the solder paste addition device 100 comprises a driving device 160, a support plate assembly 130, a push rod 110, a pressing plate 109 and a worktable 600.
• the support plate assembly 130 is used to support the solder paste addition device 100 on a solder paste printer.
• the pressing plate 109 is disposed at a lower part of the push rod 110, and the push rod 110 can be driven by the driving device 160 to move up and down, thereby driving the pressing plate 109 to move up and down accordingly.
• the driving device 160 is fixed to the support plate assembly 130, and the worktable 600 is also fixed to the support plate assembly 130.
• the worktable 600 is used to carry a solder paste tank 107 and a solder paste nozzle 200 accommodated in the solder paste tank 107, wherein a lower end of the solder paste nozzle 200 is supported by the worktable 600 and an upper end of the solder paste nozzle 200 is inserted into the inverted solder paste tank 107.
• the bottom of the inverted solder paste tank 107 is pressed by the downward movement of the pressing plate 109, causing the solder paste tank 107 to move downward relative to the solder paste nozzle 200, so that the solder paste contained in the solder paste tank 107 flows out from the nozzle opening (not shown in Fig. 1) at the lower end of the solder paste nozzle 200.
• solder paste addition device of the present application can automatically remove the residual solder paste by setting the solder paste nozzle and the worktable.
• Fig. 2A shows a sectional view of a solder paste nozzle 200 according to an embodiment of the present application
• Fig. 2B shows an exploded view of the solder paste nozzle 200 shown in Fig. 2A
• the powder paste nozzle 200 comprises an upper nozzle portion 210, a film 220 and a lower nozzle portion 230, wherein the film 220 is disposed between the upper nozzle portion 210 and the lower nozzle portion 230, and the three are connected together via fasteners 240, such as bolts.
• the solder paste nozzle 200 has a through-hole 280 penetrating through the upper nozzle portion 210, the film 220 and the lower nozzle portion 230, so that the solder paste in the solder paste tank 107 can enter the solder paste nozzle via the upper end 281 of the solder paste nozzle through-hole 280, and can be discharged via the lower end 282 of the solder paste nozzle through-hole 280, so as to achieve the aim of dispensing the solder paste.
• Fig. 3 is a perspective view of the upper nozzle portion 210 of the solder paste nozzle
• the upper portion 210 of the solder paste nozzle has a head 212, a tail 214, and an upper through-hole 216, the upper through-hole 216 penetrating through the head 212 and the tail 214 and extending through the entire upper nozzle portion 210.
• the head 212 of the upper nozzle portion 210 is generally in the shape of a cylinder having a diameter that matches the inner diameter of the solder paste tank 107 (as shown in Fig. 7), so that the solder paste contained in the solder paste tank 107 can flow out through the through-hole 280 of the solder paste nozzle when the solder paste tank 107 moves downward relative to the solder paste nozzle 200.
• a deformation space 219 is provided at the bottom of the tail 214 of the upper nozzle portion 210 for accommodating the deformation of the film 220 (described in detail below).
• the deformation space 219 is formed by expanding the diameter of a lower section of the upper through-hole 216.
• the deformation space 219 also constitutes part of the bottom surface of the upper nozzle portion 210 so that in the assembled nozzle 200, the deformation space 219 is disposed adjacent to the film 220.
• Mounting holes 218 are further provided in the tail 214 of the upper nozzle portion 210 for receiving the fasteners, so as to connect the upper nozzle portion 210, the film 220 and the lower nozzle portion 230 together.
• Figs. 4A and 4B are respectively a perspective view and a partial sectional view of the lower nozzle portion of the solder paste nozzle shown in Figs. 2A and 2B.
• the lower nozzle portion 230 has a head 232, a tail 234 and a lower through-hole 236, the lower through-hole 236 penetrating through the head 232 and the tail 234.
• the head 232 is provided with two nozzle ducts 233.1 and 233.2, and the nozzle ducts 233.1 and 233.2 have nozzle duct outlets 239.1 and 239.2 located on the top surface of the lower nozzle portion 230, so that the gas flow can be blown upwardly to the film 220 through the nozzle ducts 233.1 and 233.2 respectively, so as to upwardly deform the film 220.
• the two nozzle ducts 233.1 and 233.2 are symmetrically disposed relative to the lower through-hole 236 so that the film 220 is subjected to balanced gas flow biasing forces.
• the nozzle ducts 233.1 and 233.2 are passages in the lower nozzle portion 230, which may be disposed vertically or obliquely.
• bent nozzle ducts 233.1 and 233.2 may also be provided, but the sections of the nozzle ducts 233.1 and 233.2 near the nozzle duct outlets 239.1 and 239.2 need to extend upwardly to provide an upward gas flow.
• two nozzle ducts are shown in Figs. 4A and 4B, more than two, or just one nozzle duct may also be provided in the present application.
• the outer diameter of the tail 234 of the lower nozzle portion 230 is set to be smaller than that of the head 232, so that the lower nozzle portion 230 can be clamped in the worktable 600 (as shown in Fig. 7) by the head 232 to limit the downward movement of the solder paste nozzle 200 relative to the worktable 600.
• the downward movement of the solder paste nozzle relative to the worktable 600 can also be limited by means of fixed connection.
• the nozzle ducts 233.1 and 233.2 extend through the head 232 so that nozzle duct inlets 237.1 and 237.2 of the nozzle ducts 233.1 and 233.2 are located on the bottom surface of the head 232.
• the head 232 of the lower nozzle portion 230 is further provided with mounting holes 238 for connecting the upper nozzle portion 210, the film 220 and the lower nozzle portion 230 together by the fasteners.
• Fig. 5 is the perspective view of a film of the solder paste nozzle shown in Figs. 2A and 2B.
• the film 220 has a film through-hole 226.
• the upper through-hole 216 of the upper nozzle portion 210, the film through-hole 226, and the lower through-hole 236 of the lower nozzle portion 230 together constitute the solder paste nozzle through-hole 280.
• the film 220 is made of an elastic material (e.g. rubber), so that the film 220 can be deformed by force.
• the film 220 is further provided with mounting holes 228 for connecting the upper nozzle portion 210, the film 220 and the lower nozzle portion 230 together by fasteners.
• the film 220 is arranged to be able to cover the outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 in the lower nozzle portion 230, and the deformation space 219 of the upper nozzle portion 210 is sized to be able to at least partially cover the outlets 239.1 and 239.2 of the nozzle ducts 233.
• the film 220 can cover the nozzle ducts 233.1 and 233.2 to prevent the solder paste flowing through the nozzle 200 from entering the nozzle ducts 233.1 and 233.2, and when the gas flow is delivered from the nozzle ducts
• the gas flow from the outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 can upwardly deform the film 220 to form a gas flow passage between the film 220 and the lower nozzle portion 230, so that the gas flow can enter the lower nozzle through-hole 236 through the gas flow passage, so as to blow the residual solder paste out of the lower nozzle through-hole 236.
• Figs. 6A and 6B respectively show a perspective view and a partial sectional view of the worktable of the solder paste addition device of the present application.
• the worktable 600 is provided with an opening 603 and worktable ducts 610.1 (see Fig. 7) and 610.2, the opening 603 is used to accommodate the tail 234 of the lower nozzle portion 230, and the ducts 610.1 and 610.2 are used to direct the gas from the gas source (not shown) toward the nozzle ducts 233.1 and 233.2 of the lower nozzle portion 230 to cut (or remove) the residual solder paste in the lower nozzle portion 230 by means of the gas flow.
• the worktable 600 has an upper surface 641 and a lower surface 642, and the opening 603 extends through the upper surface 641 and the lower surface 642.
• the two worktable ducts 610.1 and 610.2 comprise worktable duct inlets 608.1, 608.2 and worktable duct outlets 609.1, 609.2.
• the worktable duct outlets 609.1 and 609.2 are disposed on the upper surface 641 of the worktable 600 for providing the gas flow to the nozzle ducts 233.1 and 233.2.
• the worktable duct outlets 609.1 and 609.2 are aligned with the nozzle duct inlets
• the duct inlets 608.1 and 608.2 are respectively disposed on an outer wall of the worktable 600 to facilitate communication with the external gas source.
• the number of the worktable ducts is two.
• the number of the worktable ducts may be another number as long as it matches the number of the nozzle ducts.
• the opening 303 of the worktable 600 is recessed inward from one side of the worktable to form a U-shaped groove
• the opening 303 may also be a through-hole penetrating through the worktable 600.
• the worktable duct 610.2 is taken as an example to introduce the specific structure of the worktable duct, and the other worktable duct 610.1 is similar in structure to the worktable duct 610.1, which will not be described again here.
• the worktable duct 610.2 comprises a first duct portion 625.2 and a second duct portion 626.2, the first duct portion 625.2 being connected to the gas source through the worktable duct inlet 608.2, and the second duct portion 626.2 being connected to the corresponding nozzle duct inlet 237.2 through the worktable duct outlet 609.2.
• the first duct portion 625.2 generally extends in a transverse direction
• the second duct portion and the first duct portion extend may also be set as other forms as long as the gas flow can be delivered to the outlets 609.1 and 609.2 of the worktable ducts.
• the duct inlets 608.1 and 608.2 are disposed on an outer side wall 643 of the worktable. In other embodiments, the duct inlets 608.1 and 608.2 may also be disposed at other parts of the worktable, so long as they are able to be connected to the gas source.
• Fig. 7 shows a sectional view of the solder paste nozzle 200 shown in Fig. 2A assembled in the solder paste tank and assembled on the worktable 600 shown in Figs. 6A and 6B. The process of the solder paste nozzle and the worktable of the present application cooperating with each other to remove the residual solder paste from the solder paste nozzle will be explained below in conjunction with Fig. 7.
• the upper end of the assembled solder paste nozzle 200 is inserted into the solder paste tank 107, and the lower end of the solder paste nozzle 200 is assembled in the worktable 600, so that the solder paste nozzle 200 and the solder paste tank 107 are carried by the worktable 600.
• a seal cap of a tank opening 171 (as shown in Fig. 7) of the solder paste tank 107 is first removed, and then the upper nozzle portion 210 of the solder paste nozzle is inserted into the solder paste tank 107 from the tank opening 171 of the solder paste tank 107.
• the vicinity of the tank opening 171 of the solder paste tank 107 is not filled with the solder paste, thus leaving a mounting space for the solder paste nozzle 200.
• solder paste tank 107 When the solder paste tank 107 is pressed downward, the solder paste tank 107 is squeezed and thus moves downward relative to the solder paste nozzle 200. Since the outer diameter of the head 212 of the upper portion 210 of the solder paste nozzle matches the inner diameter of the solder paste tank 107, the solder paste in the solder paste tank 107 above the head 210 of the solder paste nozzle 200 is squeezed into and discharged from the through-hole 280 of the solder paste nozzle.
• the downward flowing of the solder paste forces the film 220 to downwardly abut against the top surface of the lower nozzle portion 106. Since the film 220 is arranged to be able to cover the nozzle duct outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 on the lower nozzle portion 230, the solder paste cannot enter between the film 220 and the upper surface of the lower nozzle portion 230 when flowing through the film 220, so that the solder paste cannot enter the nozzle ducts 233.1 and 233.2.
• the external gas source is activated, so that the gas flow flows through the worktable ducts 610.1 and 610.2 and the nozzle ducts 233.1 and 233.2 and is blown to the film 220. Since the deformation space 219 of the upper nozzle portion 210 is sized to be able to at least partially cover the nozzle duct outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2, the gas flow delivered from the nozzle duct outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 can upwardly deform the film 220.
• the film 220 is upwardly deformed so that a gas flow passage is formed between the film 220 and the top surface of the lower nozzle portion 230, and the gas flow can enter the lower nozzle through-hole 236 through the gas flow passage, thereby blowing the residual solder paste out of the lower nozzle through-hole 236.
• the gas source may be in direct communication with the nozzle ducts to supply gas to the nozzle ducts.
• the ducts on the worktable and feeding the gas source into the nozzle ducts via the worktable ducts, it may be not necessary to reconnect the gas source when replacing the solder paste nozzle. Due to the relatively high frequency of replacement of the solder paste nozzle, the process can be simplified and the operation is more convenient for the operator by means of the arrangement of the worktable ducts.
• the gas source may be compressed gas so as to increase the gas flow rate, thereby being beneficial to achieving a greater gas flow pressure.
• Fig. 8A shows a sectional view of a solder paste nozzle according to another embodiment of the present application
• Fig. 8B shows an exploded view of the solder paste nozzle shown in Fig. 8A
• Fig. 8C is a partially enlarged schematic view of a portion C of Fig. 8A.
• the solder paste nozzle 800 shown in Fig. 8A is similar to the solder paste nozzle 200 in Fig. 2 A, and also comprises an upper nozzle portion 810, a film 820 and a lower nozzle portion 830, wherein the film 820 is disposed between the upper nozzle portion 810 and the lower nozzle portion 830, and the solder paste enters the solder paste nozzle from the upper end 881 of the solder paste nozzle through-hole 880 and is then discharged from the lower end 882 of the solder paste nozzle through-hole 880.
• the deformation space 819 is disposed in the lower nozzle portion 830 (see Fig. 8C)
• the deformation space 219 is disposed in the upper nozzle portion 210.
• Fig. 9 is a perspective view of the upper nozzle portion of the solder paste nozzle shown in Fig. 8 A.
• the upper nozzle portion 810 similar in structure to the upper portion 210 of the nozzle 200, has a head 812 and a tail 814, and is provided with an upper through-hole 816 and mounting holes 818, but has no deformation space on the bottom surface of the upper nozzle portion 810.
• Figs. 10A and 10B are respectively a perspective view and a sectional view of the lower nozzle portion of the solder paste nozzle shown in Fig. 8A. As shown in Figs.
• the lower nozzle portion 830 similar in structure to the lower portion 230 of the nozzle 200, is provided with a lower through-hole 836 and nozzle ducts 833.1 and 833.2.
• the lower nozzle portion 830 is further provided with a deformation space 819 at the top thereof, and the deformation space 819 is in communication with the nozzle ducts 833.1 and 833.2.
• the deformation space 819 is an elongated shallow groove formed by the top surface of the lower nozzle portion 830 recessing downward, and the deformation space 819 extends through the lower through-hole 836.
• the width of the deformation space 819 is set to be substantially the same as the diameter of the nozzle ducts 833.1 and 833.2, and the length thereof is set to be able to be covered by the film 820 (as shown in Fig. 8B).
• Fig. 11 shows a sectional view of the solder paste nozzle shown in Fig. 8 A assembled in the solder paste tank and assembled on the worktable.
• the solder paste nozzle 800 shown in Fig. 8A can also cooperate with the worktable 600 shown in Figs. 6A and 6B to remove the residual solder paste from the solder paste nozzle 800.
• the process of the solder paste nozzle 800 and the worktable 600 shown in Fig. 8A cooperating with each other to remove the residual solder paste from the solder paste nozzle will be explained below in conjunction with Fig. 11.
• the upper end of the assembled solder paste nozzle 800 is inserted into the solder paste tank 107, and the lower end of the solder paste nozzle 820 is assembled in the worktable 600, so that the solder paste nozzle 800 and the solder paste tank 107 are carried by the worktable 600.
• the solder paste tank 107 is pressed downward, the solder paste tank 107 is squeezed and thus moves downward relative to the solder paste nozzle 800, so that the solder paste in the solder paste tank 107 above the head 810 of the solder paste nozzle 800 is squeezed into and discharged from the through hole 880 of the solder paste nozzle.
• the external gas source is activated, so that the gas flow flows through the worktable ducts 610.1 and 610.2 and the nozzle ducts 833.1 and 833.2 and is blown to the film 820.
• the gas flow delivered from the outlets 839.1 and 839.2 of the nozzle ducts 833.1 and 833.2 can push up the film 820 entering the deformation space 819, causing the downwardly deformed film to undergo upward deformation and return to its original shape.
• the deformation space 819 forms a gas flow passage between the film 820 and the lower nozzle portion 830, and the gas flow can enter the lower nozzle through-hole 836 through the gas flow passage, thereby blowing the residual solder paste out of the lower nozzle through-hole 836.
• the solder paste nozzle and the worktable of the solder paste addition device cooperate with each other, and the residual solder paste can be removed from the through-hole of the lower nozzle portion after the end of the solder addition process.
• the present application can remove the residual solder paste in time from the lower portion of the solder paste nozzle, thereby preventing the residual solder paste in the lower portion of the solder paste nozzle from further flowing downward out of the solder paste nozzle. Due to the relatively large adhesiveness of the solder paste, there is often much solder paste remaining in the solder paste nozzle after the solder addition process is completed.
• solder paste By removing the solder paste remaining in the lower portion of the solder paste nozzle, rather than just removing the solder paste adhered to the nozzle opening, it is possible to better prevent the solder paste remaining in the solder paste nozzle from dropping to an undesired place during the movement of the solder paste addition device.
• the solder paste may be dispersed into small droplets or powder during the removal of the residual solder paste using a high-pressure gas, the surrounding environment is contaminated; however, in the present application, the action of blowing the solder paste with gas is limited in the space of the through-hole of the lower portion of the solder paste nozzle, so as to prevent the droplets or powder into which the solder paste is dispersed by the gas flow from diffusing into the surrounding environment.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Coating Apparatus (AREA)

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• 2018
  • 2018-07-20 TW TW107125124A patent/TWI748116B/zh active
  • 2018-08-06 WO PCT/US2018/045308 patent/WO2019032418A2/en active Application Filing

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