WO2019020331A1 - Procédé de fabrication d'un module électronique à liaison frittée et module électronique à liaison frittée - Google Patents

Procédé de fabrication d'un module électronique à liaison frittée et module électronique à liaison frittée Download PDF

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Publication number
WO2019020331A1
WO2019020331A1 PCT/EP2018/068036 EP2018068036W WO2019020331A1 WO 2019020331 A1 WO2019020331 A1 WO 2019020331A1 EP 2018068036 W EP2018068036 W EP 2018068036W WO 2019020331 A1 WO2019020331 A1 WO 2019020331A1
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WO
WIPO (PCT)
Prior art keywords
circuit carrier
component
structural component
screw
contact pressure
Prior art date
Application number
PCT/EP2018/068036
Other languages
German (de)
English (en)
Inventor
Nora JESKE
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2019020331A1 publication Critical patent/WO2019020331A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for producing an electronic assembly, in which a circuit carrier is equipped with an electronic component and this component is firmly connected to the circuit carrier (for example, by gluing, soldering or bonding).
  • a circuit carrier is equipped with an electronic component and this component is firmly connected to the circuit carrier (for example, by gluing, soldering or bonding).
  • another Bau ⁇ component is fixed to the circuit carrier in a specific positioning and the component subsequently connected by sintering via a sintered layer fixed to the circuit carrier.
  • the invention relates to an electronic assembly having a circuit carrier. On this circuit board, an electronic component is attached. In addition, a further component is attached to the circuit carrier via a sintered layer.
  • the electronic module is a power module, wherein an electronic component is mounted on the upper side of a circuit ⁇ carrier. With the underside of the circuit carrier is connected via a sintered connection with a structural component in the form of a cooling plate. The sintering takes place in that the cooling plate and the printed circuit board are pressed together, for example under increased pressure and elevated temperature. In this way, a silver paste located therebetween can be compressed and form a sintered layer connecting the two components.
  • the use of silver sintering materials as the contact material is common due to the high thermal conductivity of Sil ⁇ calc.
  • Sintered joints are therefore often produced using adapted special tools, which make it possible to insert the components to be sintered in a sintering press.
  • Her ⁇ position such sintered tools is only worthwhile for large quantities, which are not always found in electronics assembly.
  • semiconductor devices are used as elekt ⁇ tronic components increasing. These chips are connected directly without Ge ⁇ housing with the circuit carrier, which in particular a derivative of heat loss simplified. However, this can only be done reliably if the thermal connection between the semiconductor component and the circuit carrier and between the circuit carrier and the heat sink have a high quality.
  • the semiconductor device can be connected, for example by a sintered connection with the scarf ⁇ tion carrier.
  • the object is therefore to specify a method for producing an electronic assembly with sintered connection, which is simple to carry out and with which it is possible to produce high-quality sintered connections. Moreover, it is an object of the invention to provide an electronic assembly with a sintered connection, which can be easily manufactured and has a high quality.
  • a holding device is attached to the circuit carrier and the structural component, with the circuit carrier and the structural component are kept in the positioning, wherein the holding device locally to at least two separate and
  • the Garvor ⁇ directional invention can advantageously very compact and simple design, as these attacks at two points of the structural component and so overall a symmetrical force transmission in the
  • the holding device can be made compact, it can be pre-assembled during the driving Ver ⁇ for generating the electronic assembly and thus provided with a bias voltage Sinterver- bond are carried out during the manufacturing process at a favorable time for the production.
  • ⁇ sondere it is not necessary to use a sintering press ei ⁇ ner consuming adapted to be sintered components on ⁇ takeover.
  • the sintered compound can be produced, for example, in an oven, whereby both a batch oven and a reflow oven come into question. This allows the cost-effective production of electronic assemblies, especially for small planned quantities or custom-made.
  • the electronic component is firmly connected by generating a solder connection with the circuit carrier, wherein the generating of the solder joint is performed simultaneously with the sintering.
  • This makes it possible advantageous ⁇ way of a manufacturing step in producing the electronic module saved.
  • the sintered connection with the compact holding device can be subjected to further manufacturing steps, for example, can be equipped with components.
  • the soldering as well as the sintering can then be carried out, for example, in a reflow oven, the holding device, during this This time ensures the necessary contact pressure to form the sintered connection.
  • solder material and the material of the sintered layer are matched to one another in this embodiment of the method according to the invention that overlap the required process ⁇ window for soldering and sintering.
  • process parameters can be found in the overlapping area of these process windows, which are suitable both for the formation of the solder connection and for the formation of the sintered connection.
  • a silver sintering mate ⁇ rial can be selected as sintered material.
  • Pressure sintering sintered silver sintering materials are typically sintered at 200-250 ° C within 1-3 minutes, depending on the manufacturer.
  • Matching solder mate- rials for example, are the lead-free solder alloys based on tin-silver-copper. Peak temperatures during soldering are around 245 ° C, whereby the time above 200 ° C is around 100s. Thus, both remelting of the solder and sintering of the silver sintered material in one and the same production step is possible.
  • the holding device consists of at least two brackets, which of the
  • the mounting of the brackets is particularly easy. This can be done for example by a placement and thus automated.
  • the contact pressure can be generated by the elasticity of the staple material ⁇ the.
  • the clamps can be removed again after the sintering treatment and thus used several times.
  • the holding device consists of at least two screw ⁇ connections, wherein the contact pressure is generated by tightening the screw. This can be beneficial Tightening torque can be calculated for a given contact pressure, which is a conventional method for screw and therefore will not be explained here.
  • the screw connection is guided through a hole which runs through the structural component and / or through the circuit carrier.
  • the hole advantageously allows easy placement of the screw connection at exactly the point of the structural component where the Anpress ⁇ pressure to be generated.
  • the hole also prevents the screw connection from shifting during tightening.
  • the hole may but need not be formed in both connection partners.
  • the hole can also be a threaded hole into which the screw is screwed.
  • the circuit carrier has a substrate plate for receiving the component and a bottom plate for receiving the component.
  • the substrate plate can beispielswei ⁇ se have the interconnect for generating the electronic circuit.
  • the bottom plate may be metallic, for example, to promote heat dissipation.
  • the bottom plate stabilizes the circuit carrier, which makes it possible to distribute the contact pressure generated by the holding device better on the entire surface of the sintered connection, since the force is applied at spaced locations of the structural component.
  • the structural component may consist of a heat sink or an electrical load connection or a Halbleiterbau ⁇ stone. If a heat sink is connected to the circuit carrier as a structural component, the heat dissipation into the heat sink is advantageously improved by the high-quality sintered connection. When an electric load terminal mounted, this benefits preferably of a Besse ⁇ ren electrical transmission. The lower contact resistance between the load terminal and the circuit carrier advantageously results in less power loss is ent ⁇ .
  • the sintered connection can be used for improved heat dissipation due to its higher quality. As with the load connection improved Sinterverbin ⁇ -making also leads to reduced contact resistance in the sintered connection, if it is to be used for the electrical contacting of. It is also advantageous if the sintered layer is applied to the circuit carrier or the component before Fi ⁇ xieren circuit substrate and component. This simplifies the subsequent assembly, because the sintered layer then does not have to be handled as a separate component.
  • the sintered layer can be applied, for example, in a stencil printing method ⁇ on the building component or on the circuit carrier.
  • the sintered layer is dried in an oven before fixing the circuit carrier and component.
  • the sintered layer obtained advantageously be ⁇ already a greater mechanical stability. Therefore, the contact pressure exerted by the holding device may have a higher amount. This promotes the formation of the sintered bond through the sintered layer in the subsequent sintering process.
  • the above object is also achieved by the above-mentioned electronic assembly according to the invention that the circuit carrier and the component are enclosed by a holding device, wherein the holding device locally at least two separate and spaced locations of the component a contact pressure between the component and the circuit board generated.
  • the holding device advantageously enables the carrying out the method already described above for Erzeu ⁇ gene of this electronic module, wherein the creation of the contact pressure between the structural component and the circuit carrier is advantageously possible reliably by the holding device and with simple means.
  • the holding device advantageously enables the carrying out the method already described above for Erzeu ⁇ gene of this electronic module, wherein the creation of the contact pressure between the structural component and the circuit carrier is advantageously possible reliably by the holding device and with simple means.
  • Clamping device be performed by at least two brackets or at least two screw. These are simply formed components that can remain on the electronic assembly even after the assembly process. Thereby, the Demontageauf- associated wall is saved, which is considering whether this advantage ge ⁇ geninate the possibility of multiple use of the
  • FIG. 1 shows an embodiment of the electronic assembly according to the invention from the side, partially cut ⁇ way , prepared according to an embodiment of the method according to the invention
  • FIGS. 2 to 4 are sections of embodiments of the assembly according to the invention according to Figure 1 as a side view, in which alternative Garvor ⁇ directions are used,
  • FIG. 7 shows an embodiment of the invention
  • FIG. 1 shows an electronic module which is mounted on a circuit carrier.
  • the circuit carrier consists of a substrate plate 11 and a bottom plate 12, which are firmly connected.
  • Are on the substrate plate 11 is a contact layer of the centering by struc ⁇ contact pads 13 for electric contacts and contact ⁇ surfaces 14 for receiving of electronic components 15 are provided.
  • the electronic components 15 can be electrically contacted, for example, by bonding wires 16 or contact structures 17 with the contact pads 13.
  • the contact structures 17 are electrically contacted with the contact pads 13 by soldering connections (not shown in greater detail).
  • the bottom plate 12 of the scarf ⁇ tion carrier with a structural component in the form of adekör ⁇ pers 19 thermally conductively connected.
  • Screw 20 used.
  • the screw 20 each consist of a screw 21 which is inserted through a hole 22, wherein the hole 22 through the heat sink 19, the sintered layer 18 and the bottom plate 12 leads.
  • a nut 23 is provided, which exerts a contact pressure defined by the tightening torque on the dressing of base plate 12, sintered layer 18 and heat sink 19. This contact pressure is uniformly distributed over washers 24 around the edge of the hole 22.
  • the screw connections are attached to diagonally ge ⁇ genübericide corners 20 to generate by a symmetrical introduction of the contact pressure uniform Druckvertei ⁇ development in the sintered layer eighteenth
  • This effect is improved when the bottom plate 12 is made relatively stiff, for example, is made of a metal be ⁇ .
  • the heat sink is also metallic, for example made of aluminum.
  • more than two screw connections can also be used. be used, for example, at each of the four corners of the bottom plate. As a result, a higher contact pressure can advantageously be generated and / or a contact pressure can be distributed more uniformly over the surface of the sintered layer 18.
  • FIG. 2 shows an alternative embodiment of the assembly according to FIG. The difference is that the sintered layer 18 has a smaller area than the cooling body 19 and the bottom plate 12 so that the screw 21 be bridged, a gap which is defined by the thickness of the sintered layer ⁇ 18th Since the sintered layer 18 has a smaller area in this way, by means of the
  • the bottom plate 12 can be reduced in size such that the hole 22 (gesti ⁇ chelt shown) is located according to Figure 1 outside the bottom plate.
  • the screw 21 of the screw 20 is then guided only in the hole 22 of the heat sink 19, wherein the Un ⁇ terlegular 24 is used on one side of the screw 21 to a force in the bottom plate 12.
  • the hole is designed as a threaded hole according to Figure 3, in which the screw 21 can be screwed directly. Therefore, no nut is necessary to secure the screw 20 according to FIG.
  • a clip 25 is provided as a holding device. This is pushed from the side of the dressing, consisting of bottom plate 12, sintered layer 18 and heat sink 19 ⁇ . On the side of the heat sink 19, the clamp has a cheek 26 which engages under the heat sink 19. On the side of the bottom plate 12 is a Biegefe ⁇ formed of 27 to the bracket, which is supported on top of the bottom plate 12 and is determined by the deformation of the contact pressure for the sinter layer eighteenth In Figure 5, the circuit substrate consists only of the substrate plate 11. Of course, as set ⁇ not Darge alternative, a bottom plate 12, as shown in Figure 1, can be provided. On the substrate plate 11 is a device 15 with contact structures 17 on the
  • Contact pads 13 provided. Other components are not shown, but may also be present, for example, a component which is contacted with bonding wires (see Figure 1).
  • the semiconducting ⁇ terbaustein 28 may for example be a power electronic switching element, and by means of the bracket 25 ge ⁇ hold (as shown in Figure 4 explained).
  • a second bracket is behind the illustrated bracket 25 and therefore can not be seen in Figure 5.
  • the load terminal 29 is fixed by means of two screw connections 20 to the contact pad 13, one of the fferverbin ⁇ applications 20 of the front of the load port 29 and the other
  • FIG. 6 shows how a structural component in the form of the heat sink 19 can be provided with the sintered layer 18.
  • a template 30 is placed, in which with a metering device 31, the sintered layer 18 is generated.
  • the sintered layer is dried in a reflow oven 32a.
  • the process is continuous, which is why the individual production steps can be seen in one figure.
  • the heatsink 19 lie on a conveyor belt 33a and are guided by this through the individual production ⁇ stations including the reflow oven 32a.
  • the method according to FIG. 7 also runs continuously.
  • the heat sink 19 is also guided by a conveyor belt 33b through the individual stations.
  • the heat sink 19 is a heat sink provided with a sintered layer, the sintering layer, unlike in FIG. 6, not being shown for the sake of clarity.
  • the heat sink 19 is brought into contact with a substrate plate 11, wherein the
  • Screw 20 are attached and create a contact pressure between the heat sink 19 and the substrate plate 11.
  • the substrate plate 11 is equipped with electronic components 15. The contacting of these components should take place via soldered connections, not shown in more detail.
  • the entire assembly is passed through a reflow oven, wherein the sintered connection see between the heat sink 19 and the substrate plate 11 simultane- ously ⁇ tig with the solder joints of the electronic components 15, not shown.
  • the screw 20 After passing ⁇ run the reflow furnace 32b, the screw 20 removed in a manner not shown.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé permettant de fabriquer un module électronique ainsi qu'un module électronique pouvant être obtenu au moyen d'un tel procédé. Selon ledit procédé, un support de circuit (11, 12) est équipé de composants (15) et est relié auxdits composants par l'intermédiaire de liaisons par brasage. En outre, un composant structural, comme par ex. un dispositif de refroidissement (19), est relié au support de circuit (11, 12) par une liaison frittée (18). Selon l'invention, un dispositif de retenue, en particulier une liaison vissée (20) qui est exerce une pression d'appui pour la liaison frittée (18) en au moins deux points, est appliqué(e) sur le support de circuit (11, 12) et le composant structural (19). Ledit dispositif de retenue est réalisé de ce fait de manière très simple et compacte, tout en transférant néanmoins de manière fiable une pression d'appui sur la liaison frittée (18). La liaison frittée peut par conséquent être réalisée de manière aisée, sans requérir d'outils spécifiques. Ladite liaison frittée (18) s'effectue de préférence simultanément avec les liaisons par brasage des composants électroniques.
PCT/EP2018/068036 2017-07-27 2018-07-04 Procédé de fabrication d'un module électronique à liaison frittée et module électronique à liaison frittée WO2019020331A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017212902.6 2017-07-27
DE102017212902.6A DE102017212902A1 (de) 2017-07-27 2017-07-27 Verfahren zum Erzeugen einer elektronischen Baugruppe mit Sinterverbindung und elektronische Baugruppe mit Sinterverbindung

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049104A2 (fr) * 2000-12-13 2002-06-20 Daimlerchrysler Ag Module de puissance presentant une impedance thermique transitoire amelioree
EP2390912A1 (fr) * 2010-05-25 2011-11-30 Sunonwealth Electric Machine Industry Co., Ltd. Procédé d'assemblage de module de refroidissement
DE102014013036A1 (de) 2014-09-02 2016-03-03 Daimler Ag Leistungsmodul für ein Kraftfahrzeug
DE102015107724A1 (de) * 2015-04-02 2016-10-06 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen einer Substratanordnung, Substratanordnung, Verfahren zum Verbinden eines Elektronikbauteils mit einer Substratanordnung und Elektronikbauteil

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Publication number Priority date Publication date Assignee Title
EP2226838A1 (fr) * 2009-03-04 2010-09-08 ABB Research Ltd. Appareil de fixation pour frittage basse température et basse pression
DE102014206606A1 (de) * 2014-04-04 2015-10-08 Siemens Aktiengesellschaft Verfahren zum Montieren eines elektrischen Bauelements auf einem Substrat

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049104A2 (fr) * 2000-12-13 2002-06-20 Daimlerchrysler Ag Module de puissance presentant une impedance thermique transitoire amelioree
EP2390912A1 (fr) * 2010-05-25 2011-11-30 Sunonwealth Electric Machine Industry Co., Ltd. Procédé d'assemblage de module de refroidissement
DE102014013036A1 (de) 2014-09-02 2016-03-03 Daimler Ag Leistungsmodul für ein Kraftfahrzeug
DE102015107724A1 (de) * 2015-04-02 2016-10-06 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen einer Substratanordnung, Substratanordnung, Verfahren zum Verbinden eines Elektronikbauteils mit einer Substratanordnung und Elektronikbauteil

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