WO2019019941A1 - 一种不积水的抛光头 - Google Patents

一种不积水的抛光头 Download PDF

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Publication number
WO2019019941A1
WO2019019941A1 PCT/CN2018/096003 CN2018096003W WO2019019941A1 WO 2019019941 A1 WO2019019941 A1 WO 2019019941A1 CN 2018096003 W CN2018096003 W CN 2018096003W WO 2019019941 A1 WO2019019941 A1 WO 2019019941A1
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WO
WIPO (PCT)
Prior art keywords
gland
cover
top cover
polishing head
polishing
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PCT/CN2018/096003
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English (en)
French (fr)
Inventor
赵德文
路新春
陈祥玉
Original Assignee
清华大学
天津华海清科机电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN201710606798.8A external-priority patent/CN107253134B/zh
Priority claimed from CN201720904612.2U external-priority patent/CN207139536U/zh
Application filed by 清华大学, 天津华海清科机电科技有限公司 filed Critical 清华大学
Publication of WO2019019941A1 publication Critical patent/WO2019019941A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools

Definitions

  • the invention relates to the technical field of chemical mechanical polishing equipment, and more particularly to a polishing head which does not accumulate water.
  • the cover of the polishing apparatus is sealed between the cover and the outer side of the clip assembly, and the cover body and the base body have a gap therebetween, and the polishing liquid enters the inside of the polishing apparatus from the gap between the cover body and the base body, during the polishing process.
  • the polishing liquid deposited in the polishing apparatus will overflow outward, thereby affecting the polishing effect of the substrate of the polishing apparatus.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a polishing head that does not accumulate water, which prevents the polishing liquid from entering the inside of the polishing head and affecting the polishing effect.
  • the polishing head includes a base body, a clip assembly, and a cover body, and further includes: a gland that is sealingly coupled to an upper portion of the clip assembly; the cover The cover includes a top cover and a shroud, the top cover is sealingly connected to an upper portion of the base body, the shroud is disposed on an outer side of the gland, and the gland is disposed with a gap between the gland and the wrap.
  • the gland moves downward relative to the panel, and the gland overlaps at least a portion of the panel.
  • the water-free polishing head has a gap between the cover body and the top of the base body by preventing the base body from being in close contact with the cover body, thereby preventing the polishing liquid from entering the inside of the polishing head, so that the clip assembly and the base body are Under the relative motion, the polishing liquid will not be extruded from the inside of the polishing head, and will not affect the polishing process and polishing effect.
  • the top cover is horizontally disposed, the shroud being vertically disposed, the shroud being disposed around the top cover and extending downward from an outer circumference of the top cover.
  • top cover and the surrounding panel are connected by a circular arc segment.
  • the top cover and the surrounding plate are connected by an inclined portion, and the inclined portion is inclined outward and downward in a radial direction of the top cover.
  • the top cover is disposed to be inclined downward in a direction from a center thereof toward the panel.
  • FIG. 1 is a schematic view of a polishing head in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic view showing another state of a polishing head according to an embodiment of the present invention.
  • Figure 3 is a schematic illustration of a polishing head in accordance with another embodiment of the present invention.
  • FIG. 4 is a schematic view showing another state of a polishing head according to an embodiment of the present invention.
  • Figure 5 is a schematic illustration of a polishing head in accordance with yet another embodiment of the present invention.
  • Figure 6 is a schematic illustration of another state of a polishing head in accordance with an embodiment of the present invention.
  • polishing head 100: polishing head
  • 20 cover body; 20a: receiving cavity; 21: top cover; 22: coaming; 23: arc portion; 24: inclined portion;
  • 30 base body; 30a: shaft hole; 31: central shaft portion; 32: outer ring portion; 321: first groove; 322: pressure ring;
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • a polishing head 100 that does not accumulate water according to an embodiment of the present invention will be described below with reference to Figs.
  • a polishing head 100 in accordance with an embodiment of the present invention may include a clip assembly 10, a cover 20, a base 30, and a gland 50.
  • the gland 50 is sealingly connected to the upper portion of the clip assembly 10.
  • the clip assembly 10 is movable up and down relative to the base 30, and the gland 50 is disposed on the clip assembly 10, whereby the gland 50 can move up and down relative to the base 30, such as In the example shown in FIGS. 1 to 6, the gland 50 is formed in an annular structure, and an annular gland 50 is provided on the clip assembly 10 and disposed adjacent to the outer periphery of the clip assembly 10.
  • the cover body 20 includes a top cover 21 and a surrounding plate 22.
  • the top cover 21 is sealingly connected with the upper portion of the base body.
  • the cover plate 22 is disposed on the outer side of the cover 50.
  • the cover 50 is disposed with a gap between the cover plate 22 and the cover 50 is opposite.
  • the plate 22 moves up and down, and the gland 50 overlaps at least a portion of the shroud 22.
  • the upper end of the enclosure 22 is connected to the top cover 21, and the top cover 21 is located above the gland 50.
  • the enclosure 22 is disposed outside the gland 50 and spaced apart from the outer side of the gland 50, so that When the base 30 moves up and down relative to the clip assembly 10, the gland 50 can move up and down relative to the enclosure 22, and during the relative movement of the gland 50 and the enclosure 22, the gland 50 and at least a portion of the enclosure 22 overlap.
  • a closed chamber can be formed between the cover body 20, the base body, the gland 50 and the clip assembly 10, thereby preventing polishing liquid from entering the cover body 20, the base body, the gland 50, and the chamber inside the clip assembly 10 to cause polishing. The deposition of the polishing liquid inside the head 100.
  • the gland 50 is sealingly connected to the upper portion of the clip assembly 10
  • the top cover 21 is sealingly connected to the upper portion of the base body 20
  • the shroud 22 is covered by the gland 50.
  • the outside side thereby preventing the polishing liquid from entering the cover 20, the substrate, the gland 50, and the chamber inside the clip assembly 10, causes deposition of the polishing liquid inside the polishing head.
  • the shroud 22 can move up and down relative to the gland 50.
  • the shroud 22 and the gland 50 at least partially overlap, so that when the base body 30 and the clip assembly 10 are relatively moved,
  • the polishing liquid is prevented from entering the inside of the polishing head 100, so that the polishing effect and the polishing process of the polishing head 100 can be prevented from being affected to ensure the stability of the polishing head 100 and a good polishing effect.
  • the top cover 21 is sealingly connected with the base body 30, and the gland 50 is sealingly connected with the clip assembly 10, which can improve the sealing effect between the top cover 21 and the base body and the gland 50 and the clip assembly 10, further preventing the polishing liquid from being topped.
  • the mounting gap between the cover 21 and the base 30 and the mounting gap between the gland 50 and the clip assembly and the gland 50 enter the interior of the polishing head 100.
  • the polishing head 100 may further include a diaphragm 40.
  • the cover 20 is mounted on the clip assembly 10 and movable relative to the clip assembly 10 (as shown in FIGS. 1 and 2, the cover 20 moves up and down relative to the clip assembly 10), and the diaphragm 40 is respectively associated with
  • the clip assembly 10 is sealingly coupled to the base 30 and the diaphragm 40 has a cushioning effect in the relative movement of the clip assembly 10 and the base 30.
  • a rotary drive mechanism (not shown) is fixed to the upper end of the polishing head 100 and drives the polishing head to rotate, and a substrate (not shown) is pressed against the polishing pad on the polishing disk (not shown) ( Not shown) between the clip assembly.
  • the polishing disc rotates under the driving mechanism, and the polishing head 100 moves forward and backward along a predetermined track while self-propagating, and an appropriate amount of polishing liquid is supplied between the substrate and the polishing pad, so that under the combined action of chemical and mechanical, the substrate is realized. Polishing effect.
  • the polishing head 100 has strict requirements on the supply amount of the polishing liquid and the supply period of the polishing liquid.
  • the polishing liquid cannot be deposited inside the polishing head 100, thereby effectively avoiding
  • the relative movement of the base body 30 and the clip assembly 10 causes a phenomenon of the deposited polishing liquid, so that when the substrate is polished, only a proper amount of the polishing liquid is sprinkled on the substrate, and the period of supplying the polishing liquid also conforms to the polishing process, thereby not Will affect the polishing effect on the substrate.
  • the base body 30 is mated with the inner top wall surface of the cover body 20 to prevent the polishing liquid from entering the inside of the polishing head 100 from the top of the cover body 20, and may prevent the polishing liquid deposited on the inside of the polishing head 100 from being squeezed when the base body 30 moves up and down. Out, which in turn affects the polishing effect.
  • the center of the clip assembly 10 has an upwardly extending central shaft 11 fixed in a shaft hole 30a on the base 30, and having an axis that cooperates with the central shaft 11 at the center of the base 30
  • the hole 30a, the central shaft 11 can extend into the shaft hole 30a, thereby achieving a mating connection of the base body 30 and the clip assembly 10.
  • the base body 30 includes a central shaft portion 31 and an outer ring portion 32.
  • the shaft hole 30a penetrates the central shaft portion 31 in the up and down direction, a through hole is formed in the cover body 20, and an outer diameter and a through hole of the central shaft portion 31 are provided. The diameters of the holes are equal, and the upper end of the central shaft portion 31 of the base body 30 can pass through the through hole of the cover body 20 to achieve a close fitting connection between the base body 30 and the cover body 20.
  • the outer ring portion 32 of the base body 30 is disposed around the central shaft portion 31, and the diaphragm 40 has a buffering effect on the outer ring portion 32.
  • the upper surface of the outer ring portion 32 is closely connected with the inner wall surface of the cover body 20, so that the outer ring portion 32 and the cover body.
  • the base body 30 and the outer ring portion 32 can be connected by bolts, so that the connection between the base body 30 and the cover body 20 is more tight and reliable, and the base body 30 and the cover body 20 are connected to form a tight joint. overall.
  • the cover body 20 and the outer ring portion 32 are connected by bolts, and the two are closely matched, so that the receiving cavity 20a is formed.
  • a closed cavity effectively prevents the polishing liquid from entering the accommodating cavity 20a to cause deposition of the polishing liquid, and avoids the polishing effect due to the extrusion of the polishing liquid by the relative movement of the substrate 30 and the splicing assembly 10, thereby ensuring the smooth execution of the polishing process.
  • the relative movement of the clip assembly 10 and the base body 30 is achieved by providing a through hole on the base body 30 to control the vacuum of the chamber by an external air source, wherein the base body 30 is fixed and fixed when the external air source is directed
  • the clip assembly 10 moves away from the base 30 (as shown in FIG. 2), and when the external air source draws air from the chamber to form a negative pressure in the chamber, the clip assembly 10 moves in a direction close to the base 30 until it returns to its original position (as shown in Figure 1).
  • a first groove 321 is formed on the lower surface of the outer ring portion 32.
  • the first groove 321 penetrates the outer peripheral surface of the base body 30, that is, the first groove 321 extends circumferentially along the lower surface of the outer ring portion 32.
  • the first annular groove is provided with a pressure ring 322 at the outer peripheral edge of the lower surface of the outer ring portion 32, and one end of the diaphragm 40 is pressed into the first groove 321 through the pressure ring 322, so that one end and the outer ring of the diaphragm 40 The portion 32 is tightly coupled to ensure the cushioning effect of the diaphragm 40 on the base 30.
  • the upper surface of the clip assembly 10 is provided with a second recess 12, and further a gland 50 is provided on the clip assembly 10, and the gland 50 is partially located in the cover 20 through the gland 50.
  • the other end of the diaphragm 40 is pressed into the second recess 12, and the second recess 12 is formed as a second annular groove along the circumferential direction of the clip assembly 10, and the other end of the diaphragm 40 is pressed into the second ring.
  • the connection between the clip assembly 10 and the diaphragm 40 is ensured in the groove, ensuring the cushioning action of the base body 30 and the cover body 20 in the diaphragm 40, and the diaphragm 40 does not disengage from the clip assembly 10.
  • the cover 20 moves up and down, at least a portion of the cover 50 overlaps with each other, thereby preventing the cover 20 from being detached from the cover 50, and ensuring that the inside of the polishing head 100 is a closed cavity.
  • a first sealing ring 60 is disposed between the gland 50 and the clip assembly 10, and the first sealing ring 60 is used to seal a gap between the lower surface of the gland 50 and the clip assembly 10, The polishing liquid is prevented from entering the inside of the polishing head 100 by the gap between the gland 50 and the clip assembly 10, ensuring the seal between the gland 50 and the clip assembly 10.
  • the inside of the gland 50 is provided with a fourth annular groove, and the fourth annular groove of the gland 50 is mounted on the annular boss of the upper portion of the clip assembly 10.
  • the gland 50 is disposed at the upper portion of the base 30, and the middle of the cover 20 is circular.
  • the through hole is installed in the upper part of the base body 30, and the second sealing ring 70 is disposed on the upper part of the cover body 20 and the base body 30, and a gap exists between the inner wall surface of the cover body 20 and the outer wall surface of the pressure cover 50 to ensure the cover body 20 and
  • the base body 30 is adaptively moved in the up and down direction with respect to the gland 50 on the clip assembly 10.
  • a second sealing ring 70 is disposed between the upper surface of the outer ring portion 32 and the inner top wall surface of the cover body 20, and the top wall surface and the outer ring portion 32 of the cover body 20 are sealed by the second sealing ring 70.
  • the gap between the surfaces ensures the tightness between the cover 20 and the outer ring portion 32, preventing the polishing liquid from entering the accommodating cavity 20a from the gap between the cover 20 and the outer ring portion 32, effectively avoiding the polishing process.
  • the polishing effect is poor due to the extrusion of the polishing liquid.
  • the outer peripheral surface of the central shaft portion 31 closely matches the inner peripheral wall of the through hole. It can be understood that the outer diameter of the central shaft 11 is equal to the diameter of the through hole, so that the central shaft 11 and the through hole are closely matched. The sealing between the central shaft 11 and the cover 20 is ensured.
  • a third groove 13 is provided on the lower surface of the clip assembly 10, and the third groove 13 extends circumferentially along the outer circumference of the lower surface of the clip assembly 10 to form a third annular groove. That is, the third annular groove penetrates the outer peripheral surface of the clip assembly 10, and the retaining ring 14 is disposed in the third recess 13 to prevent the polishing head 100 from being ejected during operation, and has a fixing effect on the polishing head 100.
  • the cover 20 includes a top cover 21 and a shroud 22.
  • the base 30 is closely coupled to the top cover 21 at the diaphragm 40, and the lower wall surface of the top cover 21 and the base 30
  • the shroud 22 is annularly disposed around the top cover 21 and extends downward from the outer periphery of the top cover 21, and the top cover 21 and the shroud 22 cooperate to close the receiving cavity 20a to form a closed cavity.
  • the polishing liquid is prevented from entering into the accommodating chamber 20a.
  • the top cover 21 is horizontally disposed, and the surface of the top cover 21 is arranged in a horizontal plane for convenient molding.
  • the top cover 21 and the enclosure 22 are connected by a circular arc portion 23, so that the transition between the top cover 21 and the enclosure 22 is natural and beautiful in appearance.
  • FIG. 2 is a schematic view of the extreme position of the example shown in FIG. 1, that is, the pressure ring 322 provided on the base 30 has a maximum gap with the top of the clip assembly 10, and at this time, the vertical direction of the cover 20 22 and the gland 50 have a position overlapping each other.
  • the splashed polishing liquid can slide down along the top of the cover body 20 and drip on the polishing disc (not shown), thereby effectively preventing the polishing liquid.
  • the inside of the polishing head 100 is entered to prevent the polishing liquid from being squeezed out when the base body 30 and the clip assembly 10 are relatively moved to affect the polishing effect.
  • the top cover 21 and the shroud 22 are connected by the inclined portion 24, so that the polishing liquid falling on the cover 20 can pass along the top cover 21.
  • the inclined portion 24 slides down, which facilitates the sliding of the polishing liquid onto the polishing disk.
  • FIG. 4 is a schematic view of the extreme position of the example shown in FIG. 3, that is, the pressure ring 322 provided on the base 30 has a maximum gap with the top of the clip assembly 10, and at this time, the vertical direction of the cover 20 of the cover 20 is 22
  • the pressing cover 50 has a overlapping position, and the splashed polishing liquid can slide down along the top of the cover body 20 and drip on the polishing disk, so that the polishing liquid can be effectively prevented from entering the inside of the polishing head 100, and the polishing liquid is prevented from being extruded and affected. Polishing effect.
  • the top cover 21 is gradually disposed obliquely downward from a center thereof toward a shingle 22, and a surface of the top cover 21 is formed as a tapered surface, and the top cover 21 is The shroud 22 is directly transitioned so that the splashed polishing liquid can be slid down along the tapered surface when splashed on the top cover 21, preventing the polishing liquid from accumulating on the top cover 21 and finally dripping on the polishing disc.
  • FIG. 6 is a schematic view of the extreme position of the example shown in FIG. 5, that is, the pressure ring 322 provided on the base 30 has a maximum gap with the top of the clip assembly 10, and at this time, the flap in the vertical direction of the cover 20 22 and the gland 50 have a coincident position, the splashed polishing liquid can slide down along the tapered surface of the cover body 20, and drip on the polishing disc, which can effectively prevent the polishing liquid from entering the inside of the polishing head 100, preventing the polishing liquid from being polished.
  • the head 100 is squeezed during work to affect the polishing effect.
  • the cover body 20, the gland 50, the second sealing ring 70 and the first sealing ring 60 together constitute a protective device of the polishing head 100, which can effectively prevent the polishing liquid from entering the interior of the polishing head 100, and simultaneously satisfy the polishing head 100.
  • a protective device of the polishing head 100 which can effectively prevent the polishing liquid from entering the interior of the polishing head 100, and simultaneously satisfy the polishing head 100.

Abstract

一种不积水的抛光头(100)，抛光头(100)包括基体(30)、夹片组件(10)及盖体(20)，还包括：压盖(50)，压盖(50)密封连接在夹片组件(10)上部；盖体(20)包括顶盖(21)及围板(22)，顶盖(21)与基体(30)的上部密封连接，围板(22)罩设在压盖(50)的外侧，压盖(50)与围板(22)设置一间隙，压盖(50)相对围板(22)上下移动，压盖(50)与围板(22)至少一部分重合。

Description

一种不积水的抛光头 技术领域
本发明涉及一种化学机械抛光设备技术领域，更具体地，涉及一种不积水的抛光头。
背景技术
相关技术中的抛光设备的盖体与夹片组件外侧之间密封，盖体与基体之间具有间隙，抛光液会从盖体与基体之间的间隙进入抛光设备的内部，在抛光过程中，沉积在抛光设备内抛光液会向外溢出，进而影响抛光设备的基片的抛光效果。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明提出一种不积水的抛光头，所述抛光头可避免抛光液进入抛光头内部进而影响抛光效果。
根据本发明实施例的不积水的抛光头，所述抛光头包括基体、夹片组件及盖体，还包括：压盖，所述压盖密封连接在所述夹片组件上部；所述盖体包括顶盖及围板，所述顶盖与所述基体的上部密封连接，所述围板罩设在所述压盖的外侧，所述压盖与所述围板设置一间隙，所述压盖相对所述围板上下移动，所述压盖与所述围板至少一部分重合。
根据本发明实施例的不积水的抛光头，通过将基体与盖体紧密接触，使得盖体与基体的顶部之间无间隙，防止抛光液进入抛光头内部，这样在夹片组件与基体的相对运动下不会由抛光头内部挤出抛光液，不会影响抛光工艺和抛光效果。
根据本发明的一个实施例，所述顶盖水平设置，所述围板竖直设置，所述围板围绕所述顶盖设置且由所述顶盖的外周向下延伸。
可选地，所述顶盖与所述围板通过圆弧段相连。
根据本发明的一个可选的示例，所述顶盖与所述围板之间通过倾斜部相连，所述倾斜部沿所述顶盖的径向方向向外、向下倾斜。
根据本发明的又一个实施例，所述顶盖沿从其中心处向所述围板处的方向倾斜向下设置。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本发明实施例的抛光头的示意图；
图2是根据本发明实施例的抛光头另一个状态的示意图；
图3是根据本发明另一个实施例的抛光头的示意图；
图4是根据本发明实施例的抛光头另一个状态的示意图；
图5是根据本发明又一个实施例的抛光头的示意图；
图6是根据本发明实施例的抛光头另一个状态的示意图。
附图标记：
100：抛光头；
10：夹片组件；11：中枢轴；12：第二凹槽；13：第三凹槽；14：保持环；
20：盖体；20a：容纳腔；21：顶盖；22：围板；23：圆弧部；24：倾斜部；
30：基体；30a：轴孔；31：中轴部；32：外环部；321：第一凹槽；322：压环；
40：膜片；
50：压盖；
60：第一密封圈；
70：第二密封圈。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“上”、“下”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、 “相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
下面参考图1-图6描述根据本发明实施例的不积水的抛光头100。
如图1所示，根据本发明实施例的抛光头100可以包括夹片组件10、盖体20、基体30和压盖50。
其中，压盖50密封连接在夹片组件10上部，夹片组件10相对基体30可上下移动，压盖50设在夹片组件10上，由此压盖50相对基体30可上下移动，在如图1-图6所示的示例中，压盖50形成为环状结构，环状的压盖50设在夹片组件10上且邻近夹片组件10的外周设置。
盖体20包括顶盖21及围板22，顶盖21与基体的上部密封连接，围板22罩设在压盖50的外侧，压盖50与围板22设置一间隙，压盖50相对围板22上下移动，压盖50与围板22至少一部分重合。
具体地，围板22的上端与顶盖21相连，顶盖21位于压盖50的上方，围板22设在压盖50的外侧且与压盖50的外侧面间隔开一定间隙，这样，在基体30相对夹片组件10上下移动时，压盖50可相对围板22上下移动，在压盖50与围板22进行相对移动的过程中，压盖50与围板22至少一部分重合，由此使得盖体20、基体、压盖50和夹片组件10之间可形成封闭的腔室，从而可防止抛光液进入盖体20、基体、压盖50和夹片组件10内部的腔室内导致抛光头100内部抛光液的沉积。
由此，根据本发明实施例的不积水的抛光头100，压盖50密封连接在夹片组件10上部，顶盖21与基体20的上部密封连接，围板22罩设在压盖50的外侧，从而可防止抛光液进入盖体20、基体、压盖50和夹片组件10内部的腔室内导致抛光头内部抛光液的沉积。而且围板22相对压盖50可上下移动，在压盖50与压盖50相对移动时，围板22与压盖50至少一部分重合，这样，在基体30与夹片组件10相对移动时也可防止抛光液进入抛光头100内部，从而可避免影响抛光头100的抛光效果和抛光工艺，以保证抛光头100使用的稳定性和良好的抛光效果。同时顶盖21与基体30密封连接，压盖50与夹片组件10密封连接，可提高顶盖21与基体以及压盖50与夹片组件10之间的密封效果，进一步地防止抛光液从顶盖21与基体30之间的安装间隙以及压盖50与夹片组件与压盖50之间的安装间隙进入抛光头100内部。
如图1-图6所示，根据本发明实施例的抛光头100还可以包括膜片40。其中，盖体 20安装在夹片组件10上，且相对于夹片组件10可以移动(如图1和图2所示，盖体20相对于夹片组件10上下移动)，膜片40分别与夹片组件10和基体30密封相连，且膜片40在夹片组件10与基体30的相对运动中具有缓冲作用。
需要进一步说明的是，旋转驱动机构(未示出)与抛光头100的上端固定，并带动抛光头旋转，基片(未示出)压合在抛光盘(未示出)上的抛光垫(未示出)与夹片组件之间。抛光盘在驱动机构带动下旋转，抛光头100自传的同时沿预定轨道前后移动，基片与抛光垫之间供应适量的抛光液，这样，在化学、机械的综合作用下，实现对基片的抛光效果。
抛光头100在抛光过程中，对于抛光液的供应量和抛光液的供应时段均具有严格要求，将基体30与盖体20密封相连时，抛光液无法沉积在抛光头100内部，有效地避免了基体30与夹片组件10相对运动造成沉积的抛光液的现象，这样在对基片进行抛光时，只有适量供应的抛光液洒在基片上，且供应抛光液的时段也符合抛光工艺，从而不会影响对基片的抛光效果。
可选地，基体30与盖体20的内顶壁面配合连接，防止抛光液从盖体20的顶部进入抛光头100内部，避免基体30上下移动时可能将沉积在抛光头100内部的抛光液挤出，进而影响抛光效果。
根据本发明的一个实施例，夹片组件10的中心具有向上延伸的中枢轴11，中枢轴11固定在基体30上的轴孔30a内，在基体30的中心具有与中枢轴11相配合的轴孔30a，中枢轴11可以伸入轴孔30a内，从而实现基体30和夹片组件10的配合连接。
可选地，基体30包括中轴部31和外环部32，轴孔30a在上下方向上贯通中轴部31，在盖体20上设有通孔，且中轴部31的外径与通孔的直径相等，基体30的中轴部31的上端可穿过盖体20的通孔，实现基体30与盖体20的紧密配合连接。
基体30的外环部32围绕中轴部31设置，膜片40对外环部32具有缓冲作用，外环部32的上表面与盖体20的内壁面紧密相连，使得外环部32与盖体20之间保持紧密配合连接，具体地，基体30与外环部32可以通过螺栓连接，使得基体30与盖体20之间连接更加紧密、可靠，保证基体30与盖体20连接形成一个紧密的整体。
此外，在中轴部31的上端穿过通孔后，中轴部31与通孔之间，盖体20与外环部32之间通过螺栓连接，二者为紧密配合，使得容纳腔20a形成一个封闭的腔体，有效地防止抛光液进入容纳腔20a内造成抛光液的沉积，避免由于基体30与剪片组件10相对运动挤出抛光液影响抛光效果，保证抛光工艺的顺利执行。
需要说明的是，通过在基体30上设置有通孔，通过外接气源控制腔室的真空度，实现夹片组件10与基体30的相对运动，其中基体30固定不动，当外接气源向腔室内充 气使得腔室内形成正压时，夹片组件10朝远离基体30的方向运动(如图2所示)，当外接气源从腔室内抽气使得腔室内形成负压时，夹片组件10向靠近基体30的方向运动直至恢复原位(如图1所示)。
进一步地，在外环部32的下表面设有第一凹槽321，第一凹槽321贯通基体30的外周面，即第一凹槽321沿着外环部32的下表面周向延伸形成第一环形槽，在外环部32下表面的外周边缘处设有压环322，通过压环322将膜片40的一端压入第一凹槽321内，使得膜片40的一端与外环部32紧密连接，以保证膜片40对基体30的缓冲作用。
根据本发明进一步的示例，夹片组件10的上表面设有第二凹槽12，此外在夹片组件10上还设有压盖50，压盖50部分位于盖体20内，通过压盖50将膜片40的另一端压紧在第二凹槽12内，第二凹槽12沿着夹片组件10的周向形成为第二环形槽，将膜片40的另一端压入第二环形槽内，使得夹片组件10与膜片40之间的连接可靠，确保基体30以及盖体20在膜片40的缓冲作用，且膜片40不会脱离夹片组件10。
可选地，盖体20发生上下移动时，与压盖50至少有一部分相互重合，既可以避免盖体20脱离压盖50，也可以保证抛光头100内部为封闭腔体。
根据本发明一个可选的示例，压盖50与夹片组件10之间设有第一密封圈60，第一密封圈60用于密封压盖50下表面与夹片组件10之间的缝隙，避免抛光液由压盖50与夹片组件10之间的间隙进入抛光头100的内部，确保压盖50与夹片组件10之间的密封性。
压盖50的内部设置有第四环形槽，压盖50的第四环形槽安装在夹片组件10上部的环形凸台上，压盖50设置在基体30的上部，盖体20中部的圆形通孔安装在基体30的上部，盖体20与基体30的上部设置有第二密封圈70，盖体20的内壁面与压盖50的外壁面之间存在一定间隙，以保证盖体20和基体30相对夹片组件10上的压盖50做沿上下方向的自适应性移动。
可选地，在外环部32的上表面与盖体20的内顶壁面之间设有第二密封圈70，通过第二密封圈70来密封盖体20内顶壁面与外环部32上表面之间的间隙，确保盖体20与外环部32之间的密封性，防止抛光液由盖体20与外环部32之间的缝隙进入容纳腔20a内，有效地避免在抛光过程中由于抛光液的被挤出导致抛光效果欠佳。
可选地，中轴部31的外周面与通孔的内周壁紧密配合，可以理解的是，中枢轴11的外径尺寸与通孔的直径相等，使得中枢轴11与通孔的刚好紧密配合，保证中枢轴11与盖体20之间的密封性。
根据本发明的又一个实施例，在夹片组件10的下表面设有第三凹槽13，第三凹槽 13沿着夹片组件10的下表面的外周周向延伸形成第三环形槽，即第三环形槽贯通夹片组件10的外周面，在第三凹槽13内设有保持环14，以防止抛光头100在运转过程中被甩出，对抛光头100具有固定作用。
如图1所示，根据本发明可选的实施例，盖体20包括顶盖21和围板22，基体30在膜片40与顶盖21紧密相连接，顶盖21的下壁面与基体30之间紧密接触，围板22围绕顶盖21成环形设置且从顶盖21的外周沿向下延伸，顶盖21和围板22共同作用将容纳腔20a封闭起来，形成一个密闭的腔体，避免抛光液由进入到容纳腔20a内。
如图1所示，根据本发明可选的示例，顶盖21水平设置，顶盖21的表面呈水平面布置，成型方便。
如图1所示，在本发明的一些具体示例中，顶盖21与围板22之间通过圆弧部23相连接，使得顶盖21与围板22之间的过渡自然，外形美观。
图2是图1所示的示例的极限位置的示意图，即设置在基体30上的压环322与夹片组件10的顶部存在最大间隙，此时，盖体20的竖直方向上的围板22与压盖50具有一段相互重合的位置，在化学机械抛光过程中，飞溅的抛光液可沿盖体20的顶部下滑，滴落在抛光盘(未示出)上，这样可以有效避免抛光液进入抛光头100的内部，防止抛光液在基体30与夹片组件10相对运动时被挤出进而影响抛光效果。
如图3所示，在本发明的另一些具体示例中，顶盖21与围板22之间通过倾斜部24相连接，这样，落在盖体20上的抛光液可以沿着顶盖21通过倾斜部24下滑，有利于抛光液下滑滴落在抛光盘上。
图4是图3所示的示例的极限位置的示意图，即设置在基体30上的压环322与夹片组件10的顶部存在最大间隙，此时，盖体20的竖直方向的围板22与压盖50具有一段重合位置，飞溅的抛光液可沿盖体20的顶部下滑，滴落在抛光盘上，这样可以有效防止抛光液进入抛光头100的内部，防止抛光液被挤出进而影响抛光效果。
参照图5，根据本发明的可选的示例，顶盖21沿从其中心处向围板22处的方向逐渐向下倾斜地设置，顶盖21的表面形成为锥形面，顶盖21与围板22直接过渡衔接，这样飞溅的抛光液溅落在顶盖21上时，可以沿着锥形面向下滑落，防止抛光液积聚在顶盖21上，最终滴落在抛光盘上。
图6是图5所示的示例的极限位置的示意图，即设置在基体30上的压环322与夹片组件10的顶部存在最大间隙，此时，盖体20的竖直方向上的围板22与压盖50存在一段重合位置，飞溅的抛光液可沿盖体20的锥形面下滑，滴落在抛光盘上，这样可以有效防止抛光液进入抛光头100的内部，防止抛光液在抛光头100工作过程中被挤出进而影响抛光效果。
可选地，盖体20、压盖50、第二密封圈70及第一密封圈60共同构成一个抛光头100的防护装置，可以有效防止抛光液进入抛光头100的内部，同时满足抛光头100自适应性的要求。
根据本发明实施例的不积水的抛光头100的其他构成以及操作对于本领域普通技术人员而言都是已知的，这里不再详细描述。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (5)

  1. 一种不积水的抛光头，所述抛光头包括基体、夹片组件及盖体，其特征在于，还包括：
    压盖，所述压盖密封连接在所述夹片组件上部；
    所述盖体包括顶盖及围板，所述顶盖与所述基体的上部密封连接，所述围板罩设在所述压盖的外侧，所述压盖与所述围板设置一间隙，所述压盖相对所述围板上下移动，所述压盖与所述围板至少一部分重合。
  2. 根据权利要求1所述的不积水的抛光头，其特征在于，所述顶盖水平设置，所述围板竖直设置，所述围板围绕所述顶盖设置且由所述顶盖的外周向下延伸。
  3. 根据权利要求2所述的不积水的抛光头，其特征在于，所述顶盖与所述围板通过圆弧段相连。
  4. 根据权利要求2所述的不积水的抛光头，其特征在于，所述顶盖与所述围板之间通过倾斜部相连，所述倾斜部沿所述顶盖的径向方向向外、向下倾斜。
  5. 根据权利要求2所述的不积水的抛光头，其特征在于，所述顶盖沿从其中心处向所述围板处的方向倾斜向下设置。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008044064A (ja) * 2006-08-14 2008-02-28 Nikon Corp 研磨装置
KR100897226B1 (ko) * 2008-02-12 2009-05-14 황병렬 화학기계 연마장치의 내부 세척식 연마헤드
CN102172888A (zh) * 2011-02-16 2011-09-07 清华大学 一种抛光头
CN107253134A (zh) * 2017-07-24 2017-10-17 清华大学 一种不积水的抛光头

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008044064A (ja) * 2006-08-14 2008-02-28 Nikon Corp 研磨装置
KR100897226B1 (ko) * 2008-02-12 2009-05-14 황병렬 화학기계 연마장치의 내부 세척식 연마헤드
CN102172888A (zh) * 2011-02-16 2011-09-07 清华大学 一种抛光头
CN107253134A (zh) * 2017-07-24 2017-10-17 清华大学 一种不积水的抛光头

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