WO2019029605A1 - 具有自适应性的抛光头 - Google Patents

具有自适应性的抛光头 Download PDF

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Publication number
WO2019029605A1
WO2019029605A1 PCT/CN2018/099568 CN2018099568W WO2019029605A1 WO 2019029605 A1 WO2019029605 A1 WO 2019029605A1 CN 2018099568 W CN2018099568 W CN 2018099568W WO 2019029605 A1 WO2019029605 A1 WO 2019029605A1
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WO
WIPO (PCT)
Prior art keywords
annular flange
polishing head
clip assembly
outer peripheral
assembly
Prior art date
Application number
PCT/CN2018/099568
Other languages
English (en)
French (fr)
Inventor
赵德文
路新春
陈祥玉
Original Assignee
清华大学
天津华海清科机电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710687742.XA external-priority patent/CN107363717A/zh
Application filed by 清华大学, 天津华海清科机电科技有限公司 filed Critical 清华大学
Publication of WO2019029605A1 publication Critical patent/WO2019029605A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Definitions

  • the invention relates to the technical field of chemical mechanical polishing, in particular to a polishing head with adaptability.
  • the polishing head is an important part of the chemical mechanical polishing unit.
  • the polishing head of the related art is equivalent to a universal joint, and the pivot assembly can only absorb the up and down direction vibration between the clip assembly and the base, and is driven by the rotary drive mechanism.
  • the pivot assembly moves at a high speed relative to the base, so that the pivot assembly may have a certain deflection, which may cause circumferential swing, and there is a problem that the centering function is insufficient and the adaptability is poor.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent.
  • the present invention provides an adaptive polishing head that can effectively reduce the swing of the pivot assembly, resulting in improved stability and adaptability.
  • An adaptive polishing head includes: a pivot assembly including a shaft body and a disk body, the disk body being coupled to the shaft body and coaxial with the shaft body
  • the outer peripheral wall of the disc body is provided with an annular flange; a clip assembly, and the clip assembly is provided with a groove adapted to cooperate with the disc body, and the disc body fits in the groove
  • the outer peripheral surface of the annular flange is in line contact with the inner peripheral wall of the groove.
  • the outer peripheral surface of the annular flange is in line contact with the inner peripheral wall of the groove, so that on the one hand, the pivot assembly is prevented from being radially rotated when the polishing head is rotated.
  • the movement of the direction to ensure the centering function of the polishing head, and the annular flange can be adaptively oscillated in the groove, thereby improving the stability and adaptability of the polishing head, improving the parallelism of the substrate, and thereby improving the substrate. Polishing characteristics.
  • the adaptive polishing head according to an embodiment of the present invention may further have the following additional technical features:
  • the orthographic projection of the outer peripheral surface of the annular flange on the cross section of the disk body through the central axis is an outer contour a, the outer contour line a being curved.
  • an orthographic projection of the outer peripheral surface of the annular flange on a cross section of the disk body through the central axis is an outer contour line a, the outer contour line a including at least one arc a segment and at least one straight segment.
  • the orthographic projection of the outer peripheral surface of the annular flange on a cross section of the disk body through the central axis is an outer contour line a, the outer contour line a comprising a plurality of straight lines .
  • a vibration absorbing ring is disposed above the annular flange and below the annular flange, and a through hole is formed on a side of the annular flange that cooperates with the vibration absorbing ring.
  • an inner cavity is defined between the disc body and the shaft body, and the inner cavity is provided with a plurality of ribs respectively, and the ribs and the outer peripheral wall of the shaft body respectively The inner peripheral walls of the inner chamber are connected.
  • the ribs extend in a radial direction of the inner cavity, and a plurality of ribs are spaced apart along a circumference of the inner cavity.
  • the adaptive polishing head further comprises: a buffering member disposed on the clip assembly and located between the base body and the clip assembly.
  • the buffering member is a buffer column, and the buffering column is plural, and the plurality of buffering columns are spaced apart along a circumferential direction of the clip assembly.
  • FIG. 1 is a schematic structural view of a pivot assembly having an adaptive polishing head in accordance with an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a pivot assembly with an adaptive polishing head in accordance with one embodiment of the present invention
  • Figure 3 is an enlarged view of A in Figure 2;
  • FIG. 4 is a structural schematic view of an annular flange portion of a pivot assembly having an adaptive polishing head in accordance with another embodiment of the present invention.
  • FIG. 5 is an enlarged view of a through hole of a disk body having an adaptive polishing head according to an embodiment of the present invention
  • FIG. 6 is a schematic view showing the structure of an adaptive polishing head according to an embodiment of the present invention.
  • Figure 7 is an enlarged view of a portion B of Figure 6;
  • Figure 8 is a schematic view showing the structure of a chemical mechanical polishing apparatus according to an embodiment of the present invention.
  • 60 cover body, 61: cover seal ring, 62: mounting cavity;
  • 70 retaining ring
  • 71 upper shock ring
  • 72 lower shock ring
  • polishing disc polishing disc
  • polishing pad polishing pad
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or in one piece; it may be a mechanical connection, or it may be an electrical connection or a communication with each other; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship between two elements. Unless otherwise expressly defined. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • an adaptive polishing head 100 in accordance with an embodiment of the present invention can include a pivot assembly 10 and a clip assembly 20.
  • the pivot assembly 10 includes a shaft body 11 and a disk body 12, and the disk body 12 is coupled to the shaft body 11 and disposed coaxially with the shaft body 11.
  • the outer peripheral wall of the disk body 12 is provided with an annular flange 15, and the clip assembly 20
  • a recess 21 adapted to engage with the disk body 12 is provided, and the disk body 12 fits within the recess 21 and the outer peripheral surface of the annular flange 15 is in contact with the inner peripheral wall of the recess 21.
  • the pivot assembly 10 is secured to the clip assembly 20, and the substrate 300 to be polished can be secured to the clip assembly 20, the pivot assembly 10 including the shaft 11 and the tray 12, the disc
  • the body 12 is disposed at a lower portion of the shaft body 11 and coaxially disposed with the shaft body 11, and the disk body 12 and the shaft body 11 are integrally formed.
  • annular flange 15 is formed on the outer peripheral wall of the disk body 12.
  • the annular flange 15 may be formed to extend outward in the radial direction from the outer peripheral wall of the disk body 12, and the annular flange 15 extends along the circumferential direction of the disk body 12, and the clip
  • the groove 20 is formed on the assembly 20, the disk body 12 is fitted in the groove 21 and the annular flange 15 is adapted to be in contact with the groove 21.
  • the upper portion of the groove 21 is formed in a stepped shape, and the groove 21 is formed.
  • a stepped portion is formed on the inner peripheral wall, and the annular flange 15 is adapted to cooperate with the stepped portion.
  • the outer peripheral surface of the annular flange 15 is in line contact with the inner peripheral wall of the recess 21, in other words, when the disc body 12 is fitted in the recess 21, the outer peripheral wall of the annular flange 15 is in line contact contact with the clip assembly 20 to prevent pivoting.
  • the shaft assembly 10 is swayed, that is, the annular flange 15 is adapted to fit within the recess 21 and the annular flange 15 can be restrained by the inner peripheral wall of the recess 21, thereby limiting the disc 12 and preventing pivoting.
  • the shaft assembly 10 is shaken.
  • the annular flange 15 is located within the recess 21 through which the disk 12 can be positioned to define the horizontal orientation of the disk 15 (e.g., left and right as shown in Figure 6).
  • the translation occurs, and at the same time, since the annular flange 15 is in line contact with the inner peripheral wall of the groove 21, so that the disk body 12 can swing in the up and down direction, the annular flange 15 can swing in the groove 21, for example, the disk body 12 and The groove 21 is coaxially disposed.
  • the disk body 12 When the disk body 12 is required to perform an adaptive swing when the polishing head 100 is in operation, the disk body 12 can be inclined with respect to the central axis of the groove 21 due to the linear contact fit of the annular flange 15 with the groove 21. That is, the disk body 12 can be oscillated in the up and down direction for adaptive change, thereby not only ensuring the centering action of the polishing head 100, but also improving the adaptability and flexibility of the polishing head 100.
  • the outer peripheral surface of the annular flange 15 is in line contact with the inner peripheral wall of the groove 21, so that the pivot assembly 10 is prevented from occurring when the polishing head 100 is rotated.
  • the movement in the radial direction to ensure the centering function of the polishing head 100 also reduces the friction between the disk body 12 and the clip assembly 20, and the outer peripheral surface of the annular flange 15 is in line contact with the inner peripheral wall of the groove 21.
  • the stability and adaptability of the polishing head 100 are improved, the parallelism of the substrate 300 is improved, the planarization quality of the substrate 300 is improved, and the polishing characteristics of the substrate 300 are improved.
  • the shape of the inner wall surface of the groove 21 and the outer circumferential surface of the annular flange 15 may be such that the inner wall surface of the groove 21 and the outer circumferential surface of the annular flange 15 are in line contact.
  • the outer peripheral surface of the annular flange 15 is shown as an outer contour line a in the cross section of the over-center axis of the disk body 12, at the center of the abaxial body 11 of the polishing head 100.
  • the inner peripheral wall of the groove 21 cooperating with the annular flange 15 is a straight line extending in the vertical direction, and the outer peripheral surface structure of the annular flange 15 can be improved so that the outer peripheral surface of the annular flange 15 is The inner wall of the groove 21 is in contact with the upper surface line, so that not only the centering function of the disk body 12 but also the adaptability and flexibility of the disk body 12 can be ensured. It also facilitates the manufacture of the components of the polishing head 100 to facilitate assembly of the tray 12 and the clip assembly 20.
  • the shape of the outer peripheral surface of the annular flange 15 can be made to be in line contact with the inner wall surface of the groove 21.
  • the orthographic projection of the outer peripheral surface of the annular flange 15 on the cross section of the disk body 12 over the central axis is the outer contour line a, and the outer contour line a may be arc. That is, the outer peripheral surface of the annular flange 15 is formed into a curved surface, whereby not only the line contact of the outer peripheral surface of the annular flange 15 with the inner wall surface of the groove 21 but also the outer circumference of the annular flange 15 can be made smoother and more beautiful. It also facilitates the manufacture of the annular flange 15 and simplifies the manufacturing process.
  • the orthographic projection of the outer peripheral surface of the annular flange 15 on the cross section of the disk body 12 over the central axis is the outer contour line a
  • the outer contour line a may include at least one curved segment and at least one The straight section, that is, the outer peripheral surface of the annular flange 15 includes a combination of a curved surface and a sloped surface.
  • the outer contour line a may include two axial segments and one arc segment, wherein the arcuate segment portion of the outer circumferential surface of the annular flange 15 may be adapted to be in line contact with the outer peripheral wall of the groove 21.
  • the orthographic projection of the outer peripheral surface of the annular flange 15 on the cross section of the disk body 12 over the central axis is the outer contour line a, and the outer contour line a may include a plurality of straight lines.
  • the outer circumferential surface of the annular flange 15 may be formed in a substantially tapered shape, wherein the tapered tip end may face the outer circumferential surface of the groove 21 to achieve a line contact fit with the outer circumferential surface of the groove 21, Further, the space between the outer peripheral surface of the annular flange 15 and the upper and lower sides of the fitting portion of the groove 21 is relatively large, and the swing of the annular flange 15 can also be favored to further improve the adaptability.
  • a vibration absorbing ring is provided above the annular flange 15 and below the annular flange 15, respectively.
  • the vibration of the pivot assembly 10 and the clip assembly 20 in the up and down direction can be absorbed by the vibration absorbing ring to further improve the overall stability of the polishing head 100.
  • an upper absorbing ring 71 is disposed above the annular flange 15, and a lower absorbing ring 72 is disposed below the annular flange 15, and the lower absorbing ring 72 is disposed at the annular flange 15 and Between the clip assemblies 20.
  • the vibration absorbing ring and the inner peripheral wall of the groove 21 may be spaced apart by a certain distance, thereby facilitating the upward and downward swing of the annular flange 15 in the groove 21.
  • the adaptive polishing head 100 can also include a pressure ring 80 that is secured to the annular flange 15 of the disk body 12 to effect attachment of the disk body 12 to the clip assembly 20.
  • a pressure ring 80 that is secured to the annular flange 15 of the disk body 12 to effect attachment of the disk body 12 to the clip assembly 20.
  • the pressure ring 80 is formed in an annular shape and the pressure ring 80 is disposed above the upper vibration absorbing ring 71, and at least a portion thereof covers the upper vibration absorbing ring 71 and the other portion is fixedly coupled to the clip assembly 20.
  • the pressure ring 80 can be secured to the clip assembly 20 by threaded fasteners 51 to effect attachment of the disc body 12 to the clip assembly 20.
  • a cavity 13 may be defined between the disk body 12 and the shaft body 11.
  • the inner cavity 13 is provided with a plurality of ribs 14 respectively, and the ribs 14 and the outer peripheral wall and the inner cavity of the shaft body 11, respectively.
  • the inner peripheral walls of 13 are connected.
  • the disk body 12 is disposed at a lower portion of the shaft body 11, and the shaft body 11 is disposed coaxially with the disk body 12, and the inner wall surface of the disk body 12 and the outer wall surface of the shaft body 11 are defined.
  • Out of the inner cavity 13 a plurality of ribs 14 are connected between the shaft body 11 and the disk body 12 and located in the inner cavity 13, so that the structural strength of the pivot assembly 10 can be enhanced.
  • each rib 14 may extend radially along the inner cavity 13 and a plurality of ribs 14 may be spaced apart along the circumference of the inner cavity 13. Thereby the strength of the pivot assembly 10 can be further increased. As shown in FIG. 1, a plurality of ribs 14 are disposed in the inner cavity 13, and two ends of each rib 14 are respectively connected to the shaft body 11 and the disk body 12, and extend in the radial direction of the inner cavity 13, a plurality of The ribs 14 are evenly spaced apart along the circumferential direction of the inner cavity 13.
  • the polishing head 100 may further include a base body 30 having a shaft hole 31, the pivot assembly 10 being disposed between the base body 30 and the clip assembly 20 and the shaft body 11 being fitted to the shaft hole 31.
  • the shaft body 11 is confined in the shaft hole 31, and the disc body 12 is restrained in the recess 21 of the clip assembly 20, by the cooperation of the shaft body 11 with the base body 30 and the cooperation of the disc body 12 and the clip assembly 20, thereby The effective centering of the pivot assembly 10 is achieved, improving the adaptability of the pivot assembly 10.
  • the pivot assembly 10 can effectively reduce the circumferential swing of the pivot assembly 10 while absorbing the upper and lower directions of the clip assembly 20, effectively improving the parallelism between the substrate 300 and the polishing pad 210, and ensuring the global flatness of the substrate 300. effect.
  • an elastic member 40 may be disposed between the base body 30 and the clip assembly 20, and the sealing cavity 41 is defined between the elastic member 40, the base body 30 and the clip assembly 20.
  • the lower portion of the base 30 is coupled to the clip assembly 20 by an elastic member 40, one end of which is secured to the clip assembly 20, the resilient member 40, the base member 30, the clip assembly 20 and the pivot assembly 10
  • a sealed chamber 41 is defined between the upper and lower movements of the clip assembly 20 by controlling the pressure within the sealed chamber 41.
  • the upper end of the elastic member 40 may be fixed to the base 30 by a pressing plate 42, and the lower end of the elastic member 40 is fixed to the clip assembly 20 by a gland 43.
  • the base body 30 may be provided with a venting hole 32, which communicates with the air source and the sealing cavity 41, and controls the opening and closing of the venting hole 32 to control the internal pressure of the sealed cavity 41, thereby realizing the clip assembly. 20 is taken on the substrate 300.
  • the upper part of the body has a vent hole 32.
  • the vent hole 32 penetrates the base body 30 in the up and down direction.
  • the vent hole 32 can be connected to the ventilating source through a pipeline, and the ventilating source passes through the vent hole 32 to the sealed cavity. The gas is introduced into the 41 to control the pressure in the sealed chamber 41.
  • the adaptive polishing head 100 can also include a cushioning member 50 that is disposed on the clip assembly 20 and between the base body 30 and the clip assembly 20. Thereby, the lower end of the base body 30 is in contact with the cushioning member 50, so that the hard contact of the base body 30 with the clip assembly 20 can be effectively avoided, the cushioning effect of the base body 30 and the clip assembly 20 is ensured, and the damage of the clip assembly 20 and the base body 30 is reduced. .
  • the buffer member 50 may be a buffer column, and the buffer column may be a plurality of.
  • the lower end of the base body 30 can be in contact with a plurality of buffer columns, thereby enhancing the buffering effect between the base body 30 and the clip assembly 20, and further improving the adaptability of the polishing head 100.
  • the cushioning effect can be further improved by providing a plurality of buffer columns.
  • a plurality of buffer columns can be spaced apart along the circumference of the clip assembly 20. Thereby, the buffering effect between the base body 30 and the clip assembly 20 is made more uniform, so that the structure of the polishing head 100 is more stable.
  • the buffer column can be made of engineering plastic, and the engineering plastic has good elasticity, and can effectively avoid the hard contact of the base body 30 and the clip assembly 20.
  • an upper vibration absorbing ring 71 and a pressure ring 80 are disposed above the disk body 12.
  • the upper vibration absorbing ring 71 can be fixed to the clip assembly 20 through the pressure ring 80, and the buffer column is disposed.
  • Above the pressure ring 80 and can be fixed by screws, wherein the screw can be connected to the clip assembly 20 through the pressure ring 80 and the upper vibration absorbing ring 71, whereby the pressure ring 80 and the upper vibration absorption can be realized by one screw.
  • the ring 71 and the buffer column are fixed, and the structure is simple and the assembly is convenient.
  • the adaptive polishing head 100 can further include a cover 60 that is secured to the clip assembly 20 and that is provided with a cover seal 61 with the clip assembly 20.
  • the cover 60 is fixed above the clip assembly 20, and together with the clip assembly 20 defines a mounting cavity 62, the upper end portion of the cover 60 is open, and the base 30 and the pivot assembly 10 are at least partially mounted.
  • a cover seal 61 is provided between the cover 60 and the clip assembly 20, and the cover seal 61 is thereby prevented from entering the polishing head 100.
  • the adaptive polishing head 100 may further include a retaining ring 70 mounted at a lower end of the clip assembly 20, the substrate 300 being located below the clip assembly 20 and located in the retaining ring 70 inside.
  • the substrate 300 can be restrained by the retaining ring 70 to prevent the substrate 300 from being deflected or flying out.
  • the lower portion of the clip assembly 20 has a mounting groove in which the retaining ring 70 is mounted and the lower end surface of the retaining ring 70 extends beyond the lower end surface of the clip assembly 20, the substrate 300. It is adsorbed on the clip assembly 20 and is located on the retaining ring 70.
  • FIG. 8 is a view having the above embodiment.
  • the chemical polishing apparatus 1000 of the adaptive polishing head 100, the chemical mechanical polishing apparatus 1000 according to an embodiment of the present invention may include a polishing disk 200 and a polishing head 100.
  • the polishing pad 200 is provided with a polishing pad 210.
  • the polishing head 100 is an adaptive polishing head 100 of the above embodiment.
  • the polishing head 100 is disposed above the polishing pad 200, and the substrate 300 is mounted on the polishing head 100. Between the polishing pads 210.
  • the substrate 300 can be pressed between the polishing pad 210 and the clip assembly 20, the polishing disk 200 rotates, and the polishing head 100 is self-transmitted and the polishing head 100 moves back and forth, and an appropriate amount is supplied between the substrate 300 and the polishing pad 210.
  • the polishing liquid is used to complete the chemical mechanical polishing of the substrate 300.
  • the polishing head 100 rotates at a high speed under the driving mechanism to drive the substrate 300 on the clip assembly 20 to rotate.
  • the chemical mechanical polishing device 1000 of the related art has the external factors and internal factors of the polishing head 100. Under the influence, the polishing head 100 may exhibit different degrees of vibration, that is, affect the parallelism between the substrate 300 on the clip assembly 20 and the polishing pad 210, and the chemical mechanical polishing apparatus 1000 of the embodiment of the present invention is provided by the above embodiment.
  • the polishing head 100, the substrate 300 on the clip assembly 20 and the polishing pad 210 can maintain a certain degree of parallelism, thereby ensuring good polishing characteristics of the chemical mechanical polishing apparatus 1000.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

一种具有自适应性的抛光头(100)，包括：枢轴组件(10)、基体(30)及夹片组件(20)，枢轴组件(10)由轴体(11)及盘体(12)组成，基体(30)上设置有适于与轴体(11)配合的轴孔(31)，夹片组件(20)上设置有适于与盘体(12)配合的凹槽(21)；盘体(12)的外周壁设有环形凸缘(15)，环形凸缘(15)的外周面与凹槽(21)的内周壁线接触。

Description

具有自适应性的抛光头 技术领域
本发明涉及化学机械抛光技术领域，尤其涉及一种具有自适应性的抛光头。
背景技术
抛光头是化学机械抛光单元的重要组成部分，相关技术的抛光头相当于一个万向节，枢轴组件只能吸收夹片组件与基座之间的上下方向振动，在旋转驱动机构的带动下，枢轴组件相对于基座做高速旋转运动，使得枢轴组件在会出现一定偏转，会产生周向的摆动，存在定心功能不足、自适应性差的问题。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种具有自适应性的抛光头，能够有效降低枢轴组件的摆动，使得稳定性和自适应性提高
根据本发明实施例的具有自适应性的抛光头，包括：枢轴组件，所述枢轴组件包括轴体和盘体，所述盘体与所述轴体相连且与所述轴体同轴设置，所述盘体的外周壁设有环形凸缘；夹片组件，所述夹片组件上设有适于与所述盘体配合的凹槽，所述盘体配合在所述凹槽内且所述环形凸缘的外周面与所述凹槽的内周壁线接触。
由此，根据本发明实施例的具有自适应性的抛光头，环形凸缘的外周面与凹槽的内周壁线接触，这样，在抛光头旋转时，一方面可防止枢轴组件发生径向方向的移动，以保证抛光头的定心功能，而且环形凸缘可在凹槽内进行适应性摆动，从而可提高抛光头稳定性和自适应性，提高基片的平行度，进而改善基片的抛光特性。
另外，根据本发明实施例的具有自适应性的抛光头还可以具有如下附加的技术特征：
根据本发明的一些实施例，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线线a为弧形。
根据本发明的一些实施例，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线线a包括至少一条弧形段和至少一条直线段。
根据本发明的一些实施例，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线线a包括多条直线。
根据本发明的一些实施例，所述环形凸缘的上方和所述环形凸缘的下方分别设有吸振环，所述环形凸缘与所述吸振环配合的一侧上设有通孔。
根据本发明的一些实施例，所述盘体与所述轴体之间限定出内腔，所述内腔内设有若干 肋板，所述肋板分别与所述轴体的外周壁和所述内腔的内周壁相连。
可选地，所述肋板沿所述内腔的径向延伸，且若干肋板沿所述内腔的周向间隔开设置。
可选地，所述具有自适应性的抛光头还包括：缓冲件，所述缓冲件设在所述夹片组件上且位于所述基体和所述夹片组件之间。
可选地，所述缓冲件为缓冲柱，所述缓冲柱为多个，多个所述缓冲柱沿所述夹片组件的周向间隔开设置。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
图1是根据本发明实施例的具有适应性抛光头的枢轴组件的结构示意图；
图2是根据本发明一个实施例的具有适应性抛光头的枢轴组件的剖视意图；
图3是图2中A的放大图；
图4是根据本发明另一个实施例的具有适应性抛光头的枢轴组件的环形凸缘部分的结构示意图；
图5是根据本发明实施例的具有自适应抛光头的盘体的通孔处的放大图；
图6是根据本发明实施例的具有适应性抛光头的结构示意图；
图7是图6中B部的放大图；
图8是根据本发明实施例的化学机械抛光装置的结构示意图。
附图标记：
1000：化学机械抛光装置；
100：具有自适应性的抛光头；
10：枢轴组件；11：轴体；12：盘体；13：内腔；14：肋板；15：环形凸缘；16：通孔；
20：夹片组件，21：凹槽；
30：基体，31：轴孔，32：通气孔；
40：弹性件，41：密封腔，42：压板，43：压盖；
50：缓冲件，51：螺纹紧固件；
60：盖体，61：盖体密封圈，62：安装腔；
70：保持环，71：上吸振环，72：下吸振环；
80：压环；
200：抛光盘；210：抛光垫；
300：基片。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
下面参考附图描述根据本发明实施例的具有自适应性的抛光头100。
如图1-图7所示，根据本发明实施例的具有自适应性的抛光头100可以包括枢轴组件10和夹片组件20。
具体地，枢轴组件10包括轴体11和盘体12，盘体12与轴体11相连且与轴体11同轴设置，盘体12的外周壁设有环形凸缘15，夹片组件20上设有适于与盘体12配合的凹槽21，盘体12配合在凹槽21内且环形凸缘15的外周面与凹槽21的内周壁接触。
如图6和图8所示，枢轴组件10固定在夹片组件20上，待抛光的基片300可固定在夹片组件20上，枢轴组件10包括轴体11和盘体12，盘体12设在轴体11的下部且与轴体11同轴设置，盘体12与轴体11可一体成型。
盘体12的外周壁上设有环形凸缘15，环形凸缘15可由盘体12的外周壁沿径向方向向外延伸形成，且环形凸缘15沿盘体12的周向延伸，夹片组件20上凹槽21，盘体12配合在凹槽21内且环形凸缘15适于与凹槽21接触配合，如图6所示，凹槽21的上部形成为阶梯状，凹槽21的内周壁上形成有阶梯部，环形凸缘15适于与阶梯部配合。
其中，环形凸缘15的外周面与凹槽21内周壁线接触，换言之，盘体12配合在凹槽21内时，环形凸缘15的外周壁与夹片组件20线接触接触配合以防止枢轴组件10发生晃动， 即通过环形凸缘15适于配合在凹槽21内且通过凹槽21的内周壁可对环形凸缘15进行限位，进而可对盘体12进行限位，防止枢轴组件10发生晃动。
这样，在抛光头100的工作过程中，环形凸缘15位于凹槽21内，通过凹槽21可以对盘体12进行定位以限定盘体15水平方向(例如如图6所示的左右方向)发生平移，同时由于环形凸缘15与凹槽21的内周壁线接触，使得盘体12在上下方向可发生摆动时，环形凸缘15可在凹槽21内发生摆动，例如，盘体12与凹槽21同轴设置，在抛光头100工作时需要盘体12进行适应性摆动时，由于环形凸缘15与凹槽21线接触配合，盘体12可以相对凹槽21的中心轴线发生倾斜，即盘体12可以进行相对上下方向摆动以进行适应性变化，从而不仅可保证抛光头100定心的作用，也能够提高抛光头100的自适应性和灵活性。
由此，根据本发明实施例的具有自适应性的抛光头100，环形凸缘15的外周面与凹槽21的内周壁线接触，这样，在抛光头100旋转时，防止枢轴组件10发生径向方向的移动，以保证抛光头100的定心功能，也可降低盘体12与夹片组件20之间的摩擦，而且环形凸缘15的外周面与凹槽21的内周壁的线接触，提高抛光头100稳定性和自适应性，提高基片300的平行度，进而提高基片300的平坦化质量，改善基片300的抛光特性。
其中对于凹槽21的内壁面和环形凸缘15外周面的形状而言，只要能够实现凹槽21的内壁面和环形凸缘15的外周面线接触即可。
在如图1和图2所示的示例中，在盘体12的过中心轴线的横截面上，环形凸缘15的外周面显示为外轮廓线a，在抛光头100的过轴体11中心轴线的横截面上，凹槽21与环形凸缘15配合的内周壁为沿竖直方向延伸的直线，可通过对环形凸缘15的外周面结构进行改善以使得环形凸缘15的外周面与凹槽21的内壁面线接触配合，从而不仅能够实现盘体12的定心功能，也能够保证盘体12的自适应性和灵活性。也有利于抛光头100的部件的生产制造，方便盘体12和夹片组件20的装配。对于环形凸缘15的外周面的形状而言，只要能够实现与凹槽21的内壁面线接触即可。
在本发明的一些示例中，如图1和图2所示，环形凸缘15的外周面在盘体12过中心轴线的横截面上的正投影为外轮廓线a，外轮廓线a可以为弧形。即环形凸缘15的外周面形成为弧形面，由此，不仅能够实现环形凸缘15的外周面与凹槽21的内壁面的线接触，而且可使得环形凸缘15的外周更加光滑美观，也有利于环形凸缘15的生产制造，简化制造工艺。
在本发明的另一些示例中，环形凸缘15的外周面在盘体12过中心轴线的横截面上的正投影为外轮廓线a，外轮廓线a可以包括至少一条弧形段和至少一条直线段，也就是说，环形凸缘15的外周面包括曲面和斜面的结合。在如图4所示的示例中，外轮廓线a可以包括两条轴线段和一条弧线段，其中环形凸缘15外周面的弧形段部分可适于与凹槽21的外周壁线接触。
在本发明又一些示例中，环形凸缘15的外周面在盘体12过中心轴线的横截面上的正投影为外轮廓线a，外轮廓线a可以包括多条直线。在发明的一些具体示例中，环形凸缘15的外周面可以形成为大体锥形，其中锥形的尖端可朝向凹槽21的外周面，以实现与凹槽21的外周面的线接触配合，而且环形凸缘15的外周面与凹槽21的配合处的上下两侧的空间比较大，也可有利于环形凸缘15的摆动以进一步地提高自适应性。
在本发明的一些实施例中，环形凸缘15的上方和环形凸缘15的下方分别设有吸振环。通过吸振环从而可吸收枢轴组件10和夹片组件20沿上下方向的振动，以进一步地提高抛光头100的整体稳定性。在如图6和图7所示的示例中，环形凸缘15的上方设有上吸振环71，环形凸缘15的下方设有下吸振环72，下吸振环72设在环形凸缘15和夹片组件20之间。进一步地，如图7所示，吸振环与凹槽21的内周壁之间可间隔开一定距离，由此，从而有利于环形凸缘15在凹槽21内的上下摆动。
可选地，如图5所示，环形凸缘15与吸振环配合的一侧上设有通孔16。通孔16可以作为一个工艺孔设计，从而可以方便拆卸吸振环，保障枢轴组件10的后期维护的便捷性。如图6所示，具有自适应性的抛光头100还可以包括压环80，压环80固定在盘体12的环形凸缘15上，从而实现盘体12与夹片组件20的连接固定。在如图7所示的示例中，压环80形成为圆环状且压环80设在上吸振环71的上方，并至少一部分覆盖上吸振环71且另一部分与夹片组件20连接固定。可选地，压环80可通过螺纹紧固件51固定在夹片组件20上以实现盘体12与夹片组件20的连接固定。
在本发明的一些实施例中，盘体12与轴体11之间可限定出内腔13，内腔13内设有若干肋板14，肋板14分别与轴体11的外周壁和内腔13的内周壁相连。如图1、图2和图6所示，盘体12设在轴体11的下部，轴体11与盘体12同轴设置，盘体12的内壁面与轴体11的外壁面之间限定出内腔13，多个肋板14连接在轴体11和盘体12之间且位于内腔13内，从而可增强枢轴组件10的结构强度。
可选地，每个肋板14可沿内腔13的径向延伸，且若干肋板14沿内腔13的周向间隔开设置。从而可进一步地提高枢轴组件10的强度。如图1所示，内腔13内设有多个肋板14，每个肋板14的两端分别与轴体11和盘体12相连，且沿内腔13的径向方向延伸，多个肋板14沿内腔13的周向均匀间隔开设置。
在本发明的一些实施例中，抛光头100还可以包括：基体30，基体30具有轴孔31，枢轴组件10设在基体30和夹片组件20之间且轴体11配合在轴孔31内。由此，轴体11限制在轴孔31内，盘体12限制在夹片组件20的凹槽21内，通过轴体11与基体30的配合以及盘体12与夹片组件20的配合，从而实现了枢轴组件10的有效定心，提高枢轴组件10的自适应性。枢轴组件10在吸收夹片组件20上下方向振动的同时，能够有效降低枢轴组件10 的周向的摆动，有效提高基片300与抛光垫210的平行度，保证基片300的全局化平坦效果。
可选地，基体30与夹片组件20之间可设有弹性件40，弹性件40、基体30和夹片组件20之间限定出密封腔41。如图6所示，基体30的下部通过弹性件40与夹片组件20相连，弹性件40的一端固定在夹片组件20上，弹性件40、基体30、夹片组件20和枢轴组件10之间限定出密封腔41，通过控制密封腔41内的压力，从而可控制夹片组件20的上下移动。在如图6所示的示例中，弹性件40的上端可通过压板42固定在基体30上，弹性件40的下端通过压盖43固定在夹片组件20上。
进一步地，基体30可设有通气孔32，通气孔32连通气源和密封腔41，通过控制通气孔32的开合，以实现对密封腔41室的内部压力的控制，从而实现夹片组件20上基片300的拿取。如图6所示，机体的上部有通气孔32，通气孔32沿在上下方向上贯穿基体30，通气孔32可通过管路与通气源相连，通气源通过通气孔32以向密封腔41内通入气体，进而控制密封腔41内的压力。
在本发明的一些示例中，具有自适应性的抛光头100还可以包括缓冲件50，缓冲件50设在夹片组件20上且位于基体30和夹片组件20之间。由此，基体30的下端与缓冲件50接触，从而可有效避免基体30与夹片组件20的硬接触，保证基体30和夹片组件20的缓冲效果，减少夹片组件20和基体30的损坏。
进一步地，缓冲件50可以为缓冲柱，缓冲柱可以为多个。由此，基体30的下端可与多个缓冲柱接触配合，从而可增强了基体30和夹片组件20之间的缓冲效果，进一步地提高抛光头100的自适应性。而且通过设置多个缓冲柱也可进一步地提高缓冲效果，可选地，多个缓冲柱可沿夹片组件20的周向间隔开设置。由此，使得基体30与夹片组件20之间的缓冲效果更加均匀，使得抛光头100结构更加稳定。进一步地，缓冲柱可以由工程塑料制作而成，工程塑料具有很好的弹性，能够有效避免基体30和夹片组件20的硬接触。
在如图6和图7所示的示例中，盘体12的上方设有上吸振环71和压环80，通过压环80可将上吸振环71固定在夹片组件20上，缓冲柱设在压环80上方，并可通过螺钉进行固定，其中，螺钉可穿过压环80、上吸振环71与夹片组件20相连，由此，通过一个螺钉从而能够实现对压环80、上吸振环71和缓冲柱的固定，结构简单且装配方便。
在本发明的一些实施例中，具有自适应性的抛光头100还可以包括盖体60，盖体60固定在夹片组件20上且与夹片组件20设有盖体密封圈61。如图6所示，盖体60固定在夹片组件20的上方，且与夹片组件20共同限定出安装腔62，盖体60的上端部分敞开，基体30和枢轴组件10至少部分位于安装腔62内，盖体密封圈61设在盖体60和夹片组件20之间，通过盖体密封圈61从而可防止抛光液进入抛光头100内。
在本发明的一些实施例中，具有自适应性的抛光头100还可以包括保持环70，保持环 70安装在夹片组件20的下端，基片300位于夹片组件20的下方且位于保持环70内。通过保持环70从而可对基片300进行限位，以防止基片300偏离或飞出。在如图6和图8所示的示例中，夹片组件20的下部具有安装槽，保持环70安装在安装槽内且保持环70的下端面超出夹片组件20的下端面，基片300吸附在夹片组件20上且位于保持环70。
如图8所示，图8为具有上述实施例的
Figure PCTCN2018099568-appb-000001
自适应性抛光头100的化学抛光装置1000，根据本发明实施例的化学机械抛光装置1000可以包括抛光盘200和抛光头100。
具体地，抛光盘200上设有抛光垫210，抛光头100为上述实施例的具有自适应性的抛光头100，抛光头100设在抛光盘200的上方，基片300安装在抛光头100和抛光垫210之间。
其中，基片300可以压合在抛光垫210与夹片组件20之间，抛光盘200旋转，同时抛光头100自传及抛光头100的前后移动，基片300与抛光垫210之间供应适量的抛光液，以完成基片300的化学机械抛光。
在化学机械抛光过程中，抛光头100在驱动机构的带动下高速旋转，带动夹片组件20上的基片300旋转，相关技术的化学机械抛光装置1000，抛光头100在外界因素及内部因素的影响下，抛光头100会出现不同程度的振动，即而影响夹片组件20上的基片300与抛光垫210的平行度，而本发明实施例的化学机械抛光装置1000，通过设置上述实施例的抛光头100，夹片组件20上的基片300与抛光垫210能够保持一定的平行度，从而可保证化学机械抛光装置1000良好的抛光特性。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (9)

  1. 一种具有自适应性的抛光头，包括枢轴组件、基体及夹片组件，所述枢轴组件由轴体及盘体组成，所述基体上设置有适于与所述轴体配合的轴孔，所述夹片组件上设置有适于与所述盘体配合的凹槽；所述枢轴组件上的轴体与基体上的轴孔配合设置，枢轴组件上的盘体设置在夹片组件上的凹槽内；其特征在于，所述盘体的外周壁设有环形凸缘，所述环形凸缘的外周面与所述凹槽的内周壁线接触。
  2. 根据权利要求1所述的具有自适应性的抛光头，其特征在于，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线a为弧形。
  3. 根据权利要求所述的具有自适应性的抛光头，其特征在于，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线线a包括至少一条弧形段和至少一条直线段。
  4. 根据权利要求1所述的具有自适应性的抛光头，其特征在于，所述环形凸缘的外周面在所述盘体过所述中心轴线的横截面上的正投影为外轮廓线a，所述外轮廓线线a包括多条直线。
  5. 根据权利要求1所述的具有自适应性的抛光头，所述环形凸缘的上方和所述环形凸缘的下方分别设有吸振环，其特征在于，所述环形凸缘与所述吸振环配合的一侧上设有通孔。
  6. 根据权利要求1所述的具有自适应性的抛光头，所述盘体与所述轴体之间限定出内腔，其特征在于，所述内腔内设有若干肋板，所述肋板分别与所述轴体的外周壁和所述内腔的内周壁相连。
  7. 根据权利要求6所述的具有自适应性的抛光头，其特征在于，所述肋板沿所述内腔的径向延伸，且若干肋板沿所述内腔的周向间隔开设置。
  8. 根据权利要求1所述的具有自适应性的抛光头，其特征在于，还包括缓冲件，所述缓冲件设在所述夹片组件上且位于所述基体和所述夹片组件之间。
  9. 根据权利要求8所述的具有自适应性的抛光头，其特征在于，所述缓冲件为缓冲柱，所述缓冲柱为多个，多个所述缓冲柱沿所述夹片组件的周向间隔开设置。
PCT/CN2018/099568 2017-08-11 2018-08-09 具有自适应性的抛光头 WO2019029605A1 (zh)

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