WO2019019325A1 - Module de haut-parleur et appareil électronique - Google Patents

Module de haut-parleur et appareil électronique Download PDF

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Publication number
WO2019019325A1
WO2019019325A1 PCT/CN2017/102762 CN2017102762W WO2019019325A1 WO 2019019325 A1 WO2019019325 A1 WO 2019019325A1 CN 2017102762 W CN2017102762 W CN 2017102762W WO 2019019325 A1 WO2019019325 A1 WO 2019019325A1
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WO
WIPO (PCT)
Prior art keywords
cavity
resonant
resonant cavity
speaker module
module according
Prior art date
Application number
PCT/CN2017/102762
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English (en)
Chinese (zh)
Inventor
高远
李振军
陈钢
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2019019325A1 publication Critical patent/WO2019019325A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of electroacoustic conversion technology, and more particularly to a speaker module and an electronic device.
  • a closed resonant cavity is usually provided on the module housing.
  • the resonant cavity is in communication with the front acoustic cavity.
  • the resonant cavity has a significant improvement over the speaker module FR.
  • the existing resonant cavity is a single cavity. Limited by the singularity of the natural frequency, the resonant cavity has a limited frequency width and cannot effectively absorb noise in a wider frequency band.
  • a speaker module includes a module housing and a sounding device, and a receiving cavity and a plurality of resonant cavities are disposed in the module housing, the sound generating device is disposed in the receiving cavity, and the sounding device will accommodate the sounding device
  • the cavity is divided into a front acoustic cavity and a rear acoustic cavity, and the front acoustic cavity communicates with the external space through the sound outlet; a plurality of the resonant cavity are isolated from each other, and each of the resonant cavity passes through a respective communication channel and the module housing
  • the front cavity is connected.
  • the plurality of resonant cavities include a first resonant cavity and a second resonant cavity, the first resonant cavity and the second resonant cavity being disposed adjacent to each other, in the first resonant cavity and the front acoustic cavity A first communication passage is disposed therebetween, and a second communication passage is disposed between the second resonant cavity and the front acoustic cavity.
  • first resonant cavity and the second resonant cavity are disposed adjacent to the front acoustic cavity, and the first resonant cavity and the second resonant cavity are located at a side of the front acoustic cavity.
  • the module housing includes an upper case, a middle case, a back cover and a lower cover
  • the middle case includes a sidewall and a receiving cavity hollowed out region surrounded by the sidewall and a plurality of resonant cavity hollow regions
  • the upper casing is closed at an upper end of the receiving cavity hollow region and the plurality of resonant cavity hollow regions
  • the back cover is closed at a lower end of the vacant space of the accommodating cavity
  • the lower cover is closed at a lower end of the plurality of cavity cavities for enclosing to form the accommodating cavity and the plurality of the resonant cavity
  • the communication passage for communicating each of the resonant cavity and the accommodating cavity is provided on the side wall.
  • At least one of the upper casing, the rear cover and the lower cover are coupled to the middle casing by ultrasonic welding.
  • the middle casing is integrally injection molded.
  • the resonant cavity is a separately arranged closed cavity.
  • the resonant cavity is a small cavity separated by a large cavity through a separator.
  • the front acoustic cavity is located at a side of the rear acoustic cavity.
  • an electronic device includes the speaker module provided by the present invention.
  • the resonant cavity of the speaker module is a single cavity. Limited by the singularity of the natural frequency, the resonant cavity has a limited frequency width and cannot effectively absorb noise in a wider frequency band. In addition, the transmission loss of a single cavity in the set frequency band is small. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • a plurality of resonant cavities are disposed in the module housing.
  • the plurality of resonant cavities are isolated from each other, and each of the resonant cavities communicates with the front acoustic cavity of the module housing through respective communication passages.
  • a plurality of resonant cavities arranged in parallel are capable of generating a resonant peak at a plurality of resonant frequencies.
  • the transmission loss in the set frequency band is superimposed, so that the effect of the speaker module in absorbing noise in the set frequency band is enhanced.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of a module case in which a lower cover and a rear cover are not provided, according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a speaker module in accordance with one embodiment of the present invention.
  • FIG. 4 is a comparison diagram of transmission loss of a speaker module and a speaker module of a single resonant cavity, in accordance with one embodiment of the present invention.
  • first resonant cavity 12: second resonant cavity; 13: middle case; 14: upper case; 15: back cover; 17: lower cover; 18: front acoustic cavity; 19: rear acoustic cavity; 20: spacer; : first communication channel; 22: second communication channel; 23: speaker unit; 24: magnetic conductive plate.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present invention.
  • Figure 2 is based on A schematic structural view of a module housing without a lower cover and a rear cover according to an embodiment of the present invention.
  • 3 is a cross-sectional view of a speaker module in accordance with one embodiment of the present invention.
  • the speaker module includes a module housing and a sounding device.
  • a receiving cavity and a plurality of resonant cavities are disposed in the module housing.
  • the sounding device is disposed within the housing cavity.
  • the sounding device separates the receiving chamber into a front sound chamber 18 and a rear sound chamber 19.
  • the front acoustic cavity 18 communicates with the external space through the sound outlet.
  • the plurality of resonant cavities are isolated from each other, and each of the resonant cavities communicates with the front acoustic cavity 18 of the module housing through respective communication passages.
  • the sounding device may be a moving iron speaker unit or a moving coil speaker unit. These two monomers are common knowledge in the art and will not be described in detail herein.
  • the resonant cavity is a closed cavity.
  • a plurality of resonant cavities are arranged in parallel. Parallel arrangement means that there is no communication between the plurality of resonant cavities, and each resonant cavity is in communication with the front acoustic cavity.
  • the resonant cavity may be a separately arranged closed cavity.
  • the plurality of closed cavities are independent of each other and are not in communication.
  • a plurality of closed cavities are disposed in parallel with respect to the front acoustic cavity 18.
  • the resonant cavity is separated from the small cavity by a large cavity through the partition 20.
  • the plurality of small cavities are independent of each other and are not in communication.
  • a plurality of small cavities are disposed in parallel with respect to the front acoustic cavity 18. This way, the fabrication of the resonant cavity is simplified, and the modular housing is compact.
  • the shape of the resonant cavity may be, but not limited to, a rectangular parallelepiped, a sphere, a cone, or the like, or may be a cavity having an irregular structure designed by a person skilled in the art according to the shape of the reserved space of the device to be mounted.
  • a plurality of resonant cavities are disposed in the module housing.
  • the plurality of resonant cavities are isolated from each other, and each of the resonant cavities communicates with the front acoustic cavity of the module housing through respective communication passages.
  • a plurality of resonant cavities arranged in parallel are capable of generating a resonant peak at a plurality of resonant frequencies.
  • the transmission loss in the set frequency band is superimposed, so that the effect of the speaker module in absorbing noise in the set frequency band is enhanced.
  • the module housing includes an upper case 14, a middle case 13, and a rear Cover 15 and lower cover 17.
  • the middle casing 13 is a hollow structure.
  • the middle casing 13 includes a side wall and a receiving cavity hollowed out area surrounded by the side wall and a plurality of resonant cavity hollowed out areas.
  • the upper casing 14 covers the upper end of the accommodating cavity hollowing area and the plurality of resonant cavity hollowing areas
  • the rear cover 15 covers the lower end of the vacant space of the accommodating cavity
  • the lower cover 17 covers the lower end of the plurality of resonant cavity hollow areas to surround Forming a receiving cavity and a plurality of resonant cavities.
  • the communication passage for communicating each of the resonant cavity and the accommodating cavity is provided on the side wall.
  • the speaker unit separates the receiving chamber into a front sound chamber 18 and a rear sound chamber 19.
  • the communication passage is in communication with the front acoustic chamber 18.
  • the upper case 14, the rear cover 15, and the lower cover 17 have a flat structure.
  • the back cover 15 is made of a metal material to reduce the thickness of the module case. Moreover, the metal material has good heat dissipation performance.
  • a magnetic conductive plate 24 is embedded in the rear cover 15.
  • the speaker unit 23 is fixed to the magnetic conductive plate 24, wherein the magnetic circuit system of the speaker unit 23 is close to the magnetic conductive plate 24.
  • the manufacture of the module housing becomes easy.
  • the upper case 14, the middle case 13, and the lower cover 17 are formed by injection molding of a TPU material.
  • the back cover 15 is made of a metal plate by press molding.
  • the middle case 13 is a hollow structure. In the case of integral injection molding, the mold does not need to use a slider, thereby reducing the difficulty of injection molding of the middle casing 13.
  • the mounting of the speaker unit 23 becomes easy.
  • the speaker unit 23 is mounted directly into the housing cavity hollow area.
  • the diaphragm of the speaker unit 23 is opposed to the upper case 14.
  • the space between the diaphragm and the upper casing 14 is at least a portion of the front acoustic chamber 18.
  • the magnetic circuit system of the speaker unit 23 is bonded and fixed to the magnetic conductive plate 24.
  • At least one of the upper casing 14, the rear cover 15, and the lower cover 17 is joined to the middle casing 13 by ultrasonic welding.
  • Ultrasonic welding has the characteristics of fast welding speed and firm connection.
  • the upper case 14, the middle case 13, and the lower cover 17 are TPU materials.
  • the upper case 14 is welded to the upper end of the middle case 13 by ultrasonic welding, and the lower cover 17 is welded to the lower end of the middle case 13.
  • the rear acoustic cavity 19 is located on the side of the front acoustic cavity 18. This can reduce the height of the module housing. It will be understood by those skilled in the art that the side portion refers to the side along the extended face of the front acoustic cavity.
  • a plurality of resonant cavities are arranged side by side.
  • the plurality of resonant cavities are in a long strip structure. In this way, the overall width and height of the plurality of resonant cavities are reduced, making the speaker module more compact.
  • the plurality of resonant cavities of the speaker module include a first resonant cavity 11 and a second resonant cavity 12.
  • the first resonant cavity 11 and the second resonant cavity 12 are disposed adjacent to each other.
  • the first resonant cavity 11 and the second resonant cavity 12 are separated from each other by a separator 20.
  • the adjacent arrangement means that the first resonant cavity 11 and the second resonant cavity 12 are juxtaposed and adjacent to each other.
  • the first resonant cavity 11 communicates with the front acoustic cavity 18 through the first communication passage 21.
  • the second resonant cavity 12 is in communication with the front acoustic cavity 18 through the second communication passage 22.
  • the two resonant cavities 11, 12 together form a resonant system.
  • FIG. 4 is a comparison diagram of transmission loss of a speaker module and a speaker module of a single resonant cavity, in accordance with one embodiment of the present invention.
  • the transmission loss can reflect the frequency range in which the speaker module can eliminate noise.
  • a single resonant cavity can only form one resonant peak.
  • the two resonant cavities form a resonance peak at two frequencies.
  • the transmission loss in the set frequency band will be superimposed, so that the speaker module absorbs the noise in the set frequency band. The effect is enhanced.
  • the number of resonance peaks corresponds to the number of resonance cavities, and the number of resonance cavities can be set according to the bandwidth range of the noise to absorb noise of a wider frequency band; or the transmission loss on the set frequency band is superimposed.
  • the first resonant cavity 11 and the second resonant cavity 12 are adjacent to the front acoustic cavity 18, and the first resonant cavity 11 and the second resonant cavity 12 are located on the side of the front acoustic cavity 18.
  • the module housing is more compact and the module housing as a whole has a flat structure. In this way, the volume of the speaker module is reduced, and the development trend of thinning and miniaturization of the electronic device is followed.
  • an electronic device can be, but is not limited to, a mobile phone, a tablet computer, a smart watch, a game machine, a notebook computer, a walkie-talkie, a headset, and the like.
  • the electronic device includes the speaker module provided by the present invention.
  • the electronic device has the characteristics of small noise and good sound effect.

Abstract

L'invention concerne un module de haut-parleur et un appareil électronique. Le module comprend un boîtier de module et un dispositif de production de son ; une cavité de réception et de multiples cavités résonantes sont disposées dans le boîtier de module ; le dispositif de production de son est disposé dans la cavité de réception ; la cavité de réception est séparée en une cavité acoustique avant (18) et une cavité acoustique arrière (19) par le dispositif de production de son ; la cavité acoustique avant (18) est en communication avec un espace externe au moyen d'une sortie sonore ; les multiples cavités résonantes sont isolées l'une de l'autre, et chaque cavité résonante est en communication avec la cavité acoustique avant (18) du boîtier de module au moyen de canaux de communication respectifs. Les multiples cavités résonantes connectées en parallèle peuvent améliorer l'effet de production sonore du module de haut-parleur.
PCT/CN2017/102762 2017-07-28 2017-09-21 Module de haut-parleur et appareil électronique WO2019019325A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710628026.4A CN107318073A (zh) 2017-07-28 2017-07-28 扬声器模组以及电子设备
CN201710628026.4 2017-07-28

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WO2019019325A1 true WO2019019325A1 (fr) 2019-01-31

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WO (1) WO2019019325A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11962969B2 (en) 2018-12-17 2024-04-16 Goertek Inc. Acoustic device and electronic apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207802357U (zh) * 2017-12-25 2018-08-31 歌尔科技有限公司 一种发声装置模组
CN207802339U (zh) * 2017-12-25 2018-08-31 歌尔科技有限公司 一种发声装置模组
CN108430017B (zh) * 2018-04-24 2020-10-09 歌尔股份有限公司 一种发声装置及电子设备
CN108462929B (zh) * 2018-05-17 2020-10-20 歌尔股份有限公司 扬声器模组以及电子设备
WO2020125619A1 (fr) * 2018-12-17 2020-06-25 歌尔股份有限公司 Dispositif acoustique et appareil électronique
CN109874067A (zh) * 2018-12-30 2019-06-11 瑞声科技(新加坡)有限公司 扬声器箱
CN110177324B (zh) * 2019-05-15 2021-01-08 维沃移动通信有限公司 扬声器及终端设备
CN209949410U (zh) * 2019-06-27 2020-01-14 歌尔科技有限公司 声学装置及电子设备

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US20110116670A1 (en) * 2008-08-01 2011-05-19 Canon Kabushiki Kaisha Speaker system with at least two codirectional channels
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CN104754441A (zh) * 2013-12-31 2015-07-01 深圳富泰宏精密工业有限公司 扬声器组件和应用该扬声器组件的电子装置
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CN204993827U (zh) * 2015-09-09 2016-01-20 歌尔声学股份有限公司 一种扬声器模组
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CN104238657B (zh) * 2013-06-24 2017-11-07 宏碁股份有限公司 可携式电子装置
CN203554669U (zh) * 2013-11-25 2014-04-16 施平曦 一种带独立共振腔的耳机前腔
CN203618111U (zh) * 2013-12-09 2014-05-28 施平曦 一种多层后腔的喇叭
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Publication number Priority date Publication date Assignee Title
US5373565A (en) * 1991-09-30 1994-12-13 Pioneer Electronic Corporation Spacer for coaxial loudspeakers
US20110116670A1 (en) * 2008-08-01 2011-05-19 Canon Kabushiki Kaisha Speaker system with at least two codirectional channels
CN104754441A (zh) * 2013-12-31 2015-07-01 深圳富泰宏精密工业有限公司 扬声器组件和应用该扬声器组件的电子装置
CN104754454A (zh) * 2015-03-25 2015-07-01 歌尔声学股份有限公司 扬声器模组
CN204616050U (zh) * 2015-04-29 2015-09-02 歌尔声学股份有限公司 扬声器模组
CN204993827U (zh) * 2015-09-09 2016-01-20 歌尔声学股份有限公司 一种扬声器模组
CN206100383U (zh) * 2016-09-06 2017-04-12 歌尔科技有限公司 一种入耳式耳机
CN207124749U (zh) * 2017-07-28 2018-03-20 歌尔股份有限公司 扬声器模组以及电子设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11962969B2 (en) 2018-12-17 2024-04-16 Goertek Inc. Acoustic device and electronic apparatus

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