WO2019013813A1 - Détection de décharge électrostatique - Google Patents

Détection de décharge électrostatique Download PDF

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Publication number
WO2019013813A1
WO2019013813A1 PCT/US2017/042095 US2017042095W WO2019013813A1 WO 2019013813 A1 WO2019013813 A1 WO 2019013813A1 US 2017042095 W US2017042095 W US 2017042095W WO 2019013813 A1 WO2019013813 A1 WO 2019013813A1
Authority
WO
WIPO (PCT)
Prior art keywords
esd
detection device
port
circuit board
visual indication
Prior art date
Application number
PCT/US2017/042095
Other languages
English (en)
Inventor
Jeffrey Ryan MORGAN
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2017/042095 priority Critical patent/WO2019013813A1/fr
Publication of WO2019013813A1 publication Critical patent/WO2019013813A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08—Measuring electromagnetic field characteristics
    • G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
    • G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
    • G01R29/0842—Measurements related to lightning, e.g. measuring electric disturbances, warning systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/12—Measuring electrostatic fields or voltage-potential

Definitions

  • Electrostatic discharge is the sudden flow of electricity between two electrically charged objects caused by contact, by an electrical short, or by dielectric breakdown.
  • the ESD can occur when differently-charged objects are brought close together or when the dielectric between them breaks down, which may create a visible spark.
  • Figure 1 illustrates a diagram of a system including an ESD defection device and an I/O port according to an example
  • Figure 2 illustrates a diagram of an ESD detection device according to an example
  • Figure 3 illustrates a diagram of a method for electrostatic discharge detection according to an example.
  • System and/or component failures in computing devices can occur in response to ESD.
  • ESD events and resulting failures can occur at a chipset, central processing unit (CPU), or keyboard controller (KBC), among other components.
  • Determining a cause of the failures can include determining with which component the ESD is associated.
  • Some approaches to failure cause determination can include removing failed components and sending the failed components and/or a main circuit board to suppliers for failure analysis through x-ray and chemical processes (e.g., chemical integrated circuit layer removal). These approaches can be used to determine entry points of over voltage or over current to distinguish between ESD and electrical overstress (EOS) failures. Other approaches can include the use of temporary color changes detected by hardware on a particular integrated circuit surface, detection of EOS events, or the use of LCD displays to display ESD events.
  • EOS electrical overstress
  • Examples of the present disclosure can provide a visual indicator at an electronic system board level for detection of an ESD event that entered through an input/output (I/O) port. For instance, using an ESD detection device, it can be determined with which particular power and/or data lines an ESD event is associated.
  • the visual indicator can be seen via visual inspection without the use of additional hardware.
  • the visual indicator can be a permanent color change, for instance.
  • permanent can include lasting or intended to last without essential change or remain unchanged approximately indefinitely.
  • “approximately” can include a value within a particular margin, range, and/or threshold.
  • failures of computing device components can be categorized, and circuit boards can be sorted based on failures. Sorted and categorized failures can be used for identification of areas to increase or add ESD event protection.
  • FIG. 1 illustrates a diagram of a system 100 including an ESD detection device 120 and an I/O port 104 of a computing device according to an example.
  • ESD detection device 20 can include an electrochromic polymer circuit board component of the computing device to provide a visual indication of an ESD event.
  • An electrochromic polymer circuit board component can include a device that can control optical properties including otpical transmission, absorption, reflectance, and/or emittance in a continual but reversible manner in response to an application of voltage. For instance, in response to an ESD event above a particular threshold received at an I/O port coupled in-line with the electrochromic polymer circuit board component, a visual indication may be provided via the electrochromic polymer circuit board component.
  • the visual indication can include a color change, which can be permanent in some examples.
  • System 100 can include a plurality of different power and/or data lines 106 associated with the I/O port 104 and a plurality of different ESD detection devices 120.
  • Each of the plurality of different ESD detection devices 120 is associated with one of the plurality of different power and/or data lines 06.
  • ESD device 120-1 can be associated with power or data line 106-1
  • ESD device 120-2 can be associated with power or data line 106-2
  • ESD device 120-3 can be associated with power or data line 106-3
  • ESD device 120-4 can be associated with power or data line 106-5, etc.
  • Each of the plurality of ESD detection devices 120 can be located on a circuit board (e.g., motherboard) near a connection to the I/O port 104.
  • an ESD event 102 can be received at a first location, such as a first power or data line 106-1 of I/O port 104 and can travel to ESD detection device 120-1 , where the ESD event is detected, in some examples, power or data lines 106 can include pins of an I/O port 104.
  • I/O port 104 can include an external port on a computing device, such as a display port, a high-definition multimedia interface ⁇ HD ! port, an audio jack port, a universal serial bus (USB) port, or an Ethernet port, among others.
  • the example illustrated in Figure 1 can be a USB 3.0 connector port, for instance. Because each ESD detection device 120 is in line with a particular power or data line 106 of the I/O port, a determination can be made with respect to a location of the I/O port at which the ESD event was received.
  • ESD detection device 120 can have a resistance below a particular threshold.
  • the resistance can be approximately zero, with an upper threshold resistance of 10-50 milliohms.
  • the upper threshold can be determined, for example, based on a resistance that can reduce signal integrity issues.
  • ESD detection device 120 in some examples, can have a resistance of approximately 1 milliohm.
  • “approximately” can include a value within a particular margin, range, and/or threshold,
  • ESD detection device 120 can be a first component coupled in-line with a power or data line. By being first in line, ESD detection device 120 can be the first component to come in contact with an ESD event, making a determination as to where the ESD event entered more accurate. For instance, if an ESD event 102 is received at power or data line 106-9 of I/O port 104, ESD detection device 120-7 can be the first component coupled in-line with power or data line 106-3.
  • FIG. 2 illustrates a diagram of an ESD detection device 220 according to an example.
  • the left illustration of ESD detection device 220 (labeled 220-1) illustrates ESD detection device 220 during normal operation (e.g., prior to receipt of an ESD event), while the right illustration of ESD detection device 220 (labeled 220-2) illustrates ESD detection device 220 following defection of an ESD event.
  • a visual indication of the ESD detection is present on a portion of ESD detection device 220-2.
  • a portion of ESD detection device 220-1 can be a first color 226, while upon detection of an ESD event, ESD detection device 220-2 can change to a second, different color 228.
  • the color change can be permanent. Color changes may include, for instance, a color change from black to red, though other color changes may occur.
  • a permanent color change can allow for removal of an associated circuit board 222 for analysis at a later time.
  • the visual indication can be a result of an electric pulse of a voltage outside a particular threshold applied to the ESD detection device 220 or a portion of the ESD defection device 220.
  • the visual indication can be present above 1000 volts or below -1000 volts; however these thresholds are not so limited.
  • the ESD detection device 220 or a portion of the ESD defection device 220 can be an electrochromic polymer circuit board component, and the electrochromic polymer can change color when the electric pulse is applied.
  • ESD detection device 220 can be removed, in some examples, either by itself or as part of a circuit board for inspection of the ESD detection device 220. For instance, if a failure occurs at a particular component, an associated ESD detection device 220 can be removed (or the circuit board 222 with which it is associated) for inspection for a color change. Through inspection of the ESD detection 220, it can be determined which power and/or data line was exposed to an ESD event based on the visual indicator.
  • ESD detection device 220 can be coupled to a circuit board 222 of a computing device via a solder to a copper connection 224.
  • ESD detection device 220 can be a surface-mount component, can have two terminals, and can have a package below a particular threshold.
  • An example package includes a 0402 package, but examples are not so limited. For instance, sizes can vary based on a size of circuit board 222.
  • FIG. 3 illustrates a diagram of a method 330 for ESD detection according to an example.
  • method 330 can include detecting, using a two- terminal ESD detection device, an ESD event having a voltage outside of a particular threshold at a power or data line of an associated I/O port.
  • an ESD event may be received at a particular component via an I/O port, such as a USB port, and the component may fail.
  • the ESD detection device can detect the ESD event if the ESD event has a voltage above a particular threshold of 1000 volts, for example, or below of a particular threshold of -1000 volts, for instance.
  • method 330 can include displaying via the two-terminal ESD detection device a permanent visual indication of the ESD event in response to the detection.
  • displaying the permanent visual indication comprises an eiectrochromic polymer circuit board component of the ESD detection device permanently changing color.
  • an electric pulse of the ESD detection device can cause the eiectrochromic material of an eiectrochromic polymer circuit board component to change color. For instance, the color may change from black to red. The color change can be permanent, such that the circuit board associated with the ESD detection device can be removed and analyzed at a later time without the color disappearing.
  • method 330 can include detecting a plurality of ESD events at a plurality of ESD detection devices.
  • an I/O port may have a plurality of associated data and/or power lines.
  • Each of the plurality of ESD detection devices may be associated with a particular data and/or power line. If an ESD event is received at a plurality of data and/or power lines, the plurality of ESD detection devices can detect each ESD event. If a data and/or power line of the plurality of data and/or power lines does not receive an ESD event, it can be distinguished from those that did based on a lack of a visual indicator.
  • failed components can be removed, and associated circuit boards can be analyzed. Based on those ESD detection devices associated with the circuit boards that have visual indicators (e.g., have changed color), it can be determined which failures may have been caused by ESD events and where those ESD events were received.
  • failures of computing device components can be categorized, and circuit boards can be sorted based on failures. Sorted and categorized failures can be used for identification of areas to increase or add ESD event protection. For instance, if it is determined that ESD events are occurring at a same power or data line consistently, additional ESD event protection can be implemented at that location. Similarly, relationships between particular failures, particular components, and/or particular locations of ESD events may be determined using the determined ESD event locations. ESD event protection can be increased as such locations, for instance.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

Des modes de réalisation exemplaires de la présente invention concernent un dispositif de détection de décharge électrostatique (ESD). Un exemple de dispositif de détection d'ESD peut comprendre un composant de carte de circuit imprimé à polymère électrochrome pour fournir une indication visuelle en réponse à un événement d'ESD au-dessus d'un seuil particulier reçu au niveau d'un port d'entrée/sortie (E/S) couplé en ligne avec le composant de carte de circuit imprimé à polymère électrochrome.
PCT/US2017/042095 2017-07-14 2017-07-14 Détection de décharge électrostatique WO2019013813A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2017/042095 WO2019013813A1 (fr) 2017-07-14 2017-07-14 Détection de décharge électrostatique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2017/042095 WO2019013813A1 (fr) 2017-07-14 2017-07-14 Détection de décharge électrostatique

Publications (1)

Publication Number Publication Date
WO2019013813A1 true WO2019013813A1 (fr) 2019-01-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/042095 WO2019013813A1 (fr) 2017-07-14 2017-07-14 Détection de décharge électrostatique

Country Status (1)

Country Link
WO (1) WO2019013813A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5673028A (en) * 1993-01-07 1997-09-30 Levy; Henry A. Electronic component failure indicator
US5849046A (en) * 1991-01-31 1998-12-15 Eveready Battery Company, Inc. Electrochromic thin film state-of-charge detector for on-the-cell application
US20150355253A1 (en) * 2012-03-28 2015-12-10 Globalfoundries Inc. Visually detecting electrostatic discharge events
US20160025818A1 (en) * 2014-07-25 2016-01-28 The Gillette Company Battery state of charge indicator with an indicator circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5849046A (en) * 1991-01-31 1998-12-15 Eveready Battery Company, Inc. Electrochromic thin film state-of-charge detector for on-the-cell application
US5673028A (en) * 1993-01-07 1997-09-30 Levy; Henry A. Electronic component failure indicator
US20150355253A1 (en) * 2012-03-28 2015-12-10 Globalfoundries Inc. Visually detecting electrostatic discharge events
US20160025818A1 (en) * 2014-07-25 2016-01-28 The Gillette Company Battery state of charge indicator with an indicator circuit

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