WO2019012766A1 - Lunettes attachées à une étiquette rfid et article fixé à une étiquette rfid - Google Patents

Lunettes attachées à une étiquette rfid et article fixé à une étiquette rfid Download PDF

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Publication number
WO2019012766A1
WO2019012766A1 PCT/JP2018/015362 JP2018015362W WO2019012766A1 WO 2019012766 A1 WO2019012766 A1 WO 2019012766A1 JP 2018015362 W JP2018015362 W JP 2018015362W WO 2019012766 A1 WO2019012766 A1 WO 2019012766A1
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WO
WIPO (PCT)
Prior art keywords
rfid tag
dipole
rfic
dipole element
output terminal
Prior art date
Application number
PCT/JP2018/015362
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English (en)
Japanese (ja)
Inventor
越智　達也
加藤　登
哲平 三浦
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2018545522A priority Critical patent/JP6531873B1/ja
Publication of WO2019012766A1 publication Critical patent/WO2019012766A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength

Definitions

  • the present invention relates to an item to which an RFID tag is attached in order to perform management of a predetermined item, and more particularly to an RFID tag-attached article in which the RFID tag can be used even for an article which is not suitable for applying the RFID tag.
  • Patent Document 1 discloses an RFID tag-equipped eyeglass that enables a wearer to be managed as a customer using an RFID tag. Further, Patent Document 2 shows an RFID tag-equipped eyeglass that enables management of information on eyeglasses purchased by a customer using an RFID tag.
  • the RFID tags are attached to the temples of the glasses.
  • the temple is an insulating resin
  • reading of the RFID tag is possible, but if the temple is metal, reading of the RFID tag becomes difficult.
  • the rim is metal, reading of the RFID tag may be difficult depending on the positional relationship of the reader / writer with respect to the glasses. Since the rim is electromagnetically two looped conductors, it acts as a planarly spread conductor plate in the UHF band. Therefore, when the reader / writer is directed to the front side of the rim, for example, the rim electromagnetically shields the RFID tag, which makes it difficult to communicate with the RFID tag.
  • the RFID tag is embedded in the recess of the lens.
  • the rim is a metal, it is difficult to be affected, but it is difficult to make the antenna of the RFID tag large, and a sufficient communication distance can not be obtained. Therefore, it is difficult to read the tag if the reader / writer is not in proximity, and the usage of the RFID tag is limited.
  • an object of the present invention is to provide an RFID-tagged article capable of communicating with an RFID tag, particularly an RFID-tagged eyeglass, even for an article on which an electromagnetically looped conductor is formed.
  • the RFID tag-equipped glasses of the present invention comprise: glasses having a spectacle lens, a metal rim for holding the spectacle lens, and an RFID tag having a planar dimension smaller than that of the spectacle lens,
  • the RFID tag is A substrate, An RFIC element mounted on the substrate and having a first input / output terminal and a second input / output terminal;
  • a first dipole element formed on the base material one end being a first connection end connected to the first input / output terminal, and the other end being a first open end, and one end being the second input / output terminal
  • Consists of The formation area of the dipole antenna has a longitudinal direction and a short direction in a plan view, and has a first end and a second end which are opposite ends in the longitudinal direction, and the short direction Having opposite sides, a first side and a second side
  • the first dipole element is a conductor pattern extending from the first connection end toward the
  • the rim acts as part of the antenna of the RFID tag, since the open end of the first dipole element and its vicinity will be arranged along the rim. That is, although the RFID tag is disposed in the loop conductor, the loop conductor is effectively used and the RFID tag can communicate with the reader / writer.
  • An article with an RFID tag according to the present invention is an article having an insulator portion and a metal portion surrounding all or part of the periphery of the insulator portion, and an RFID tag having a planar dimension smaller than that of the insulator portion
  • the RFID tag is A substrate, An RFIC element mounted on the substrate and having a first input / output terminal and a second input / output terminal; A first dipole element formed on the base material, one end being a first connection end connected to the first input / output terminal, and the other end being a first open end, and one end being the second input / output terminal A second connection end connected to the second end and a second open end, the other end being a second open end, Consists of The formation area of the dipole antenna has a longitudinal direction and a short direction in a plan view, and has a first end and a second end which are opposite ends in the longitudinal direction, and the short direction Having opposite sides, a first side and a second side,
  • the first dipole element is a conduct
  • the open end of the first dipole element and the vicinity thereof are disposed along the metal portion, so that the metal portion acts as a part of the antenna of the RFID tag. That is, although the RFID tag is disposed in the loop conductor, the loop conductor is effectively used and the RFID tag can communicate with the reader / writer.
  • the said 1st open end exists in the position near the said 1st side.
  • the degree of electric field coupling between the first open end and the metal portion is increased, and the current induced in the metal portion is increased, whereby the metal portion effectively functions as a radiator.
  • the RFIC element is preferably an element in which an RFIC chip and an impedance matching circuit for matching the impedances of the RFIC chip and the dipole antenna are integrated.
  • a part of the first dipole element is disposed between the RFIC element and the first side, and a part of the second dipole element is the RFIC element and the second side It is preferable that it is arrange
  • mold antenna is 2 times or more of the dimension of the said transversal direction.
  • the RFIC element communicates in the UHF band via the dipole antenna.
  • the RFIC element can adapt to the RFID system which utilizes a UHF band.
  • an RFID-tagged article capable of communicating with an RFID tag can be obtained even for an article in which a loop conductor is electromagnetically formed.
  • glasses with RFID tags are obtained.
  • FIG. 1 is a partial front view of the RFID tag equipped eyeglasses 410 according to the first embodiment.
  • FIG. 2A is a plan view of the RFID tag 301.
  • FIG. 2B is a front view showing the relationship between the RFID tag 301 and the spectacle lens 411 and the rim 412.
  • FIG. 3A is a diagram particularly showing the relationship between the current flowing through the RFID tag 301 and the current flowing through the rim 412.
  • FIG. 3B is an equivalent circuit diagram of the antenna portion of the RFID tag-equipped glasses.
  • FIG. 4 is a perspective view of the RFIC element 100.
  • FIG. FIG. 5 is a longitudinal sectional view of the RFIC element shown in FIG. FIG.
  • FIG. 6A is a plan view of the upper insulating layer of the multilayer substrate 120 as viewed from directly above.
  • FIG. 6B is a plan view of the middle insulating layer of the multilayer substrate 120.
  • FIG. 6C is a plan view of the lower insulating layer of the multilayer substrate 120.
  • FIG. 7A is a cross-sectional view of the insulating layer shown in FIG. 6A along the line B1-B1.
  • FIG. 7B is a cross-sectional view of the insulating layer shown in FIG. 6B along the line B2-B2.
  • FIG. 7C is a cross-sectional view of the insulating layer shown in FIG. 6C along the line B3-B3.
  • FIG. 8 is a diagram showing an equivalent circuit of the RFIC element 100.
  • FIG. 9 is a diagram showing the direction of the magnetic field generated in the inductors L1 to L4 of the RFIC element 100.
  • FIG. 10 is a diagram showing the distribution of rigid regions and flexible regions in the RFIC element 100.
  • FIG. 11 is a view showing a state in which the RFID tag in which the RFIC element 100 is attached to the lands LA1 and LA2 is bent.
  • FIG. 12 is a diagram showing an example of current flowing in the equivalent circuit of the RFID tag of FIG.
  • FIG. 13 is a diagram showing frequency characteristics of reflection loss when the circuit connected to the RFIC chip in the RFID tag of FIG. 11 is viewed from the RFIC chip.
  • FIG. 14 is a plan view of the RFID tag 302A according to the second embodiment.
  • FIG. 15 is a plan view of another RFID tag 302B according to the second embodiment.
  • FIG. 16 is a plan view of another RFID tag 302C according to the second embodiment.
  • FIG. 17 is a plan view of another RFID tag 302D according to the second embodiment.
  • FIG. 18 is a plan view of another RFID tag 302E according to the second embodiment.
  • FIG. 19 is a plan view showing an internal structure of the RFID tag-attached name tag 421.
  • FIG. 20 is a view showing the main configuration of a portable electronic device 422 with an RFID tag.
  • FIG. 21 is a plan view of the clipboard 423 with an RFID tag.
  • FIG. 22 is a perspective view of a car 424 with an RFID tag.
  • FIG. 1 is a partial front view of the RFID tag equipped eyeglasses 410 according to the first embodiment.
  • the RFID tag-attached eyeglasses 410 includes an eyeglass lens 411 and an eyeglass lens 411 and a metal rim (hereinafter simply referred to as “rim”) 412 for holding the eyeglass lens 411, and an RFID tag 301 whose planar dimension is smaller than the eyeglass lens 411. And.
  • the rim 412 is a looped conductor.
  • the spectacle lens 411 is, for example, a powerless resin lens fitted in advance for display of a spectacle frame.
  • FIG. 2A is a plan view of the RFID tag 301.
  • the RFID tag 301 includes a rectangular plate-shaped base 1, a first dipole element 10 and a second dipole element 20 formed on the base 1, and an RFIC element 100 mounted on the base 1.
  • the base material 1 has a longitudinal direction (X-axis direction in FIG. 2A) and a lateral direction (Y-axis direction in FIG. 2A) in plan view, and the mutually opposing end portions in the longitudinal direction It has one end E1 and a second end E2, and has a first side S1 and a second side S2 which are mutually opposite sides in the transverse direction.
  • the first side and the second side correspond to each other.
  • Lands LA1 and LA2 for mounting the RFIC element 100 are formed at the center of the substrate 1.
  • the first input / output terminal and the second input / output terminal of the RFIC element 100 are connected to the lands LA1 and LA2, respectively.
  • a first dipole element 10 and a second dipole element 20 are formed on the substrate 1.
  • the first dipole element 10 and the second dipole element 20 constitute one dipole antenna.
  • this dipole antenna basically uses quarter-wave resonance, it is not limited thereto as described later.
  • the first dipole element 10 is composed of the main conductor pattern portion 11 and the tip portion 12.
  • the second dipole element 20 is composed of the main conductor pattern 21 and the tip 22.
  • the main conductor pattern portion 11 of the first dipole element 10 includes a side conductor pattern 11S.
  • the side conductor pattern 11 S is disposed between the RFIC element 100 and the tip 12.
  • a side conductor pattern 21 S which is a part of the main conductor pattern portion 21 of the second dipole element 20 is disposed between the RFIC element 100 and the tip 22.
  • One end of the first dipole element 10 is a first connection end CE1 connected to the land LA1 (connected to the first input / output terminal of the RFIC element).
  • the other end of the first dipole element 10 is a first open end OE1.
  • One end of the second dipole element 20 is a second connection end CE2 connected to the land LA2 (connected to the second input / output terminal of the RFIC element).
  • the other end of the second dipole element 20 is a second open end OE2.
  • the first dipole element 10 is a conductor pattern extending from the first connection end CE1 in the direction of the first end E1 and meandering in the direction of the first side portion S1 in a meandering manner.
  • the second dipole element 20 is a conductor pattern extending from the second connection end CE2 in the direction of the second end E2 and meandering in the direction of the second side S2.
  • the side conductor patterns 11S and 21S are disposed between the RFIC element 100 and the tip portions 12 and 22, the area of the base material 1 is effectively used as a space for forming a dipole element. It can be used to miniaturize the RFID tag. Also, if the size is the same, high gain can be achieved.
  • the first open end OE1 is located closer to the first side S1 in the formation area of the first dipole element 10.
  • the second open end OE2 is located closer to the second side S2 in the formation area of the second dipole element 20.
  • the first open end OE1 is folded back from the first end E1 of the substrate 1 in the direction of the second end E2.
  • the second open end OE2 is folded back from the second end E2 of the substrate 1 toward the first end E1.
  • the line width of the tip portion 12 of the first dipole element 10 is twice or more than the line width of the main conductor pattern portion 11.
  • the line width of the tip 22 of the second dipole element 20 is twice or more than the line width of the main conductor pattern 21.
  • the tip 12 further extends in the direction of the second end E2 from the formation region of the side conductor pattern 11S.
  • the tip 22 further extends in the direction of the first end E1 from the formation region of the side conductor pattern 21S.
  • the tip 12 of the first dipole element 10 and the tip 22 of the second dipole element 20 are conductor patterns for adding capacitance at and near the open end of the dipole element. This addition of capacitance shortens the dipole element.
  • the portion along the first side S1 and the tip portion 12 form a capacitive coupling portion CC.
  • the RFID tag 301 has a dimension of 24 mm in the longitudinal direction and a dimension of 8 mm in the latitudinal direction, and the dimensional ratio of the latitudinal direction to the longitudinal direction is 1: 3. That is, the dimension in the longitudinal direction is twice or more the dimension in the transverse direction (see FIG. 2 (B)).
  • FIG. 2B is a front view showing the relationship between the RFID tag 301 and the spectacle lens 411 and the rim 412.
  • FIG. 3A is a diagram particularly showing the relationship between the current flowing through the RFID tag 301 and the current flowing through the rim 412.
  • FIG. 3A the number of times the meandering pattern of the first dipole element 10 and the second dipole element 20 is folded is represented in a simplified manner.
  • FIG. 3B is an equivalent circuit diagram of the antenna portion of the RFID tag-equipped glasses.
  • the front in FIG. 2 (B) and the plane in FIG. 2 (A) are planes viewed in the same direction.
  • the RFID tag 301 is configured such that the first side S 1 (first open end) is along the rim 412 and the second side.
  • the eyeglass lens 411 is attached such that the portion S2 (second open end) is positioned closer to the center of the rim 412 (center of the spectacle lens 311) than the first side portion S1 (first open end).
  • the capacitive coupling portion CC (the open end OE1 of the first dipole element 10 and its vicinity) is arranged along the rim 412.
  • the capacitive coupling portion CC and the rim 412 are in close proximity to each other, as shown by the circuit symbol of the capacitor in FIG. 2B and FIG. 3A, the capacitance between the capacitive coupling portion CC and the rim 412 Will occur.
  • the capacitive coupling portion CC and the rim 412 are capacitively coupled via this capacitance. Thereby, current is induced as shown in FIG. In FIG. 3A, for example, when a current flows from the first connection end CE1 toward the first open end OE1, a rightward current flows in the capacitive coupling portion CC, and a rightward current flows in the rim 412.
  • the rim 412 can be represented as a ground GND shown by a loop conductor in FIG. 3 (B).
  • the second dipole element 20 can be represented as a monopole antenna.
  • FIG. 4 is a perspective view of the RFIC element 100.
  • the RFIC element 100 is, for example, an RFIC element corresponding to a communication frequency of 900 MHz band, that is, UHF band.
  • the RFIC element 100 has a multilayer substrate 120 whose main surface is rectangular.
  • the multilayer substrate 120 is flexible.
  • the multilayer substrate 120 has, for example, a laminated structure in which a flexible resin insulating layer such as polyimide or liquid crystal polymer is laminated.
  • the dielectric constant of each insulating layer composed of these materials is smaller than the dielectric constant of the ceramic base layer represented by LTCC.
  • the length direction of the multilayer substrate 120 is taken as the X axis, the width direction of the multilayer substrate 120 as the Y axis, and the thickness direction of the multilayer substrate 120 as the Z axis.
  • FIG. 5 is a longitudinal sectional view of the RFIC element shown in FIG.
  • FIG. 6A is a plan view of the upper insulating layer of the multilayer substrate 120 as viewed from directly above.
  • FIG. 6B is a plan view of the middle insulating layer of the multilayer substrate 120.
  • FIG. 6C is a plan view of the lower insulating layer of the multilayer substrate 120.
  • FIG. 7A is a cross-sectional view of the insulating layer shown in FIG. 6A along the line B1-B1.
  • FIG. 7B is a cross-sectional view of the insulating layer shown in FIG. 6B along the line B2-B2.
  • FIG. 7C is a cross-sectional view of the insulating layer shown in FIG. 6C along the line B3-B3.
  • an RFIC chip 160 and an impedance matching circuit 180 are incorporated in the multilayer substrate 120.
  • a first terminal electrode 140 a and a second terminal electrode 140 b are formed on one main surface of the multilayer substrate 120.
  • the matching circuit 180 impedance-matches the RFIC chip 160 with the first dipole element 10 and the second dipole element 20, and determines the resonant frequency characteristic of the antenna.
  • the RFIC chip 160 has a structure in which various elements are incorporated in a hard semiconductor substrate made of a semiconductor such as silicon. Both main surfaces of the RFIC chip 160 are square. Further, as shown in FIG. 6C, on the other main surface of the RFIC chip 160, a first input / output terminal 160a and a second input / output terminal 160b are formed. Inside the multilayer substrate 120, the RFIC chip 160 is X with each side of the square extending along the X-axis or Y-axis direction and one main surface and the other main surface parallel to the XY plane. Centrally located on each of the axis, Y axis, and Z axis.
  • the matching circuit 180 is configured of the coil conductor 200 and the interlayer connection conductors 240 a and 240 b.
  • the coil conductor 200 is configured by the coil patterns 200a to 200c shown in FIG. 6B or 6C.
  • a part of the coil pattern 200a is configured by the first coil portion CIL1.
  • a part of the coil pattern 200b is configured by the second coil portion CIL2.
  • a part of the coil pattern 200c is configured by the third coil portion CIL3 and the fourth coil portion CIL4.
  • the first coil portion CIL1, the third coil portion CIL3, and the interlayer connection conductor 240a are arranged in the Z-axis direction.
  • the second coil portion CIL2, the fourth coil portion CIL4, and the interlayer connection conductor 240b are also arranged in the Z-axis direction.
  • the RFIC chip 160 is disposed between the first coil portion CIL1 and the second coil portion CIL2 when the multilayer substrate 120 is viewed in the Z-axis direction.
  • the RFIC chip 160 is disposed between the third coil portion CIL3 and the fourth coil portion CIL4 when the multilayer substrate 120 is viewed in the Y-axis direction.
  • Each of the first terminal electrode 140a and the second terminal electrode 140b is formed in a strip shape using a flexible copper foil as a material.
  • the sizes of the main surfaces of each of the first terminal electrode 140a and the second terminal electrode 140b match each other.
  • the short sides of the first terminal electrode 140a and the second terminal electrode 140b extend in the X-axis direction.
  • the long sides of the first terminal electrode 140a and the second terminal electrode 140b extend in the Y-axis direction.
  • the RFIC chip 160 is sandwiched between a part of the matching circuit 180 and another part of the matching circuit 180 when the multilayer substrate 120 is viewed from the Y-axis direction. Further, the RFIC chip 160 overlaps the matching circuit 180 when the multilayer substrate 120 is viewed from the X-axis direction.
  • the matching circuit 180 partially overlaps each of the first terminal electrode 140 a and the second terminal electrode 140 b when the multilayer substrate 120 is viewed in plan.
  • the multilayer substrate 120 is configured by three sheet-like insulating layers 120a to 120c stacked as shown in FIGS. 6A to 6C.
  • the insulating layer 120 a is located on the upper side
  • the insulating layer 120 b is located on the middle side
  • the insulating layer 120 c is located on the lower side.
  • a first terminal electrode 140a and a second terminal electrode 140b are formed on one main surface of the insulating layer 120a.
  • a rectangular through hole HL1 reaching the other main surface is formed at the central position of one of the main surfaces of the insulating layer 120b.
  • the through hole HL1 is formed to a size including the RFIC chip 160.
  • a coil pattern 200c is formed around the through hole HL1 on one of the main surfaces of the insulating layer 120b.
  • the coil pattern 200c is configured using a flexible copper foil as a material.
  • One end of the coil pattern 200c is disposed at a position overlapping the first terminal electrode 140a in plan view, and is connected to the first terminal electrode 140a by the interlayer connection conductor 220a extending in the Z-axis direction.
  • the other end of the coil pattern 200c is disposed at a position overlapping the second terminal electrode 140b in plan view, and is connected to the second terminal electrode 140b by the interlayer connection conductor 220b extending in the Z-axis direction.
  • the interlayer connection conductors 220a and 220b are made of a hard metal bulk mainly composed of Sn.
  • Coil patterns 200a and 200b are formed on one main surface of the insulating layer 120c.
  • the coil patterns 200a and 200b are configured using a flexible copper foil as a material.
  • the first coil end T1 and the second coil end T2 are both formed in a rectangular shape when the insulating layer 120c is viewed in plan.
  • One end of the coil pattern 200a is connected to one end of the coil pattern 200c by an interlayer connection conductor 240a extending in the Z-axis direction.
  • One end of the coil pattern 200b is connected to the other end of the coil pattern 200c by an interlayer connection conductor 240b extending in the Z-axis direction.
  • the interlayer connection conductors 240a and 240b are made of a hard metal bulk mainly composed of Sn.
  • a section of the coil pattern 200a overlaps a section of the coil pattern 200c, and a section of the coil pattern 200b is also another section of the coil pattern 200c.
  • the section on the coil pattern 200a side is referred to as “first coil portion CIL1”
  • the section on the coil pattern 200c side is referred to as "third coil portion CIL3”.
  • the section on the coil pattern 200b side is referred to as "second coil section CIL2”
  • the section on the coil pattern 200c side is referred to as "fourth coil section CIL4".
  • first position P1 the position of one end of the coil pattern 200a or the one end of the coil pattern 200c is referred to as "first position P1"
  • second position P2 the position of the one end of the coil pattern 200b or the other end of the coil pattern 200c is "second position P2" It is said.
  • Rectangular dummy conductors 260a and 260b are formed on one main surface of the insulating layer 120c.
  • the dummy conductors 260a and 260b are made of a flexible copper foil.
  • the dummy conductors 260a and 260b are arranged to overlap two of the four corner portions of the rectangular through hole HL1.
  • the RFIC chip 160 is mounted on the insulating layer 120c such that the four corner portions of the other main surface face the first coil end T1, the second coil end T2, and the dummy conductors 260a and 260b.
  • the first input / output terminal 160a is disposed on the other main surface of the RFIC chip 160 so as to overlap with the first coil end T1 in plan view.
  • the second input / output terminal 160b is disposed on the other main surface of the RFIC chip 160 so as to overlap the second coil end T2 in a plan view.
  • the RFIC chip 160 is connected to the first coil end T1 by the first input / output terminal 160a, and is connected to the second coil end T2 by the second input / output terminal 160b.
  • the thickness of the insulating layers 120a to 120c is 10 ⁇ m to 100 ⁇ m. Therefore, the RFIC chip 160 and the matching circuit 180 built in the multilayer substrate 120 can be seen through from the outside. Therefore, the connection state (presence or absence of disconnection) of the RFIC chip 160 and the matching circuit 180 can be easily confirmed.
  • FIG. 8 is a diagram showing an equivalent circuit of the RFIC element 100 configured as described above.
  • an inductor L1 corresponds to the first coil portion CIL1.
  • the inductor L2 corresponds to the second coil portion CIL2.
  • the inductor L3 corresponds to the third coil portion CIL3.
  • the inductor L4 corresponds to the fourth coil portion CIL4.
  • the characteristics of impedance matching by matching circuit 180 are defined by the values of inductors L1 to L4.
  • One end of the inductor L1 is connected to a first input / output terminal 160a provided in the RFIC chip 160.
  • One end of the inductor L2 is connected to a second input / output terminal 160b provided on the RFIC chip 160.
  • the other end of the inductor L1 is connected to one end of the inductor L3.
  • the other end of the inductor L2 is connected to one end of the inductor L4.
  • the other end of the inductor L3 is connected to the other end of the inductor L4.
  • the first terminal electrode 140a is connected to the connection point of the inductors L1 and L3.
  • the second terminal electrode 140 b is connected to the connection point of the inductors L 2 and L 4.
  • the first coil portion CIL1, the second coil portion CIL2, the third coil portion CIL3, and the fourth coil portion CIL4 are wound such that the magnetic fields are in phase and in series with each other. It is connected. Therefore, the magnetic field is generated at a certain point so as to turn in the direction indicated by the arrow in FIG. On the other hand, the magnetic field is generated at another time point so as to turn in the opposite direction to the direction shown by the arrow in FIG.
  • the first coil portion CIL1 and the third coil portion CIL3 have substantially the same loop shape and the same first winding axis.
  • the second coil portion CIL2 and the fourth coil portion CIL4 have substantially the same loop shape and the same second winding axis.
  • the first winding axis and the second winding axis are disposed at positions sandwiching the RFIC chip 160.
  • first coil portion CIL1 and the third coil portion CIL3 are magnetically and capacitively coupled.
  • second coil portion CIL2 and the fourth coil portion CIL4 are magnetically and capacitively coupled.
  • the RFIC chip 160 has the first input / output terminal 160 a and the second input / output terminal 160 b and is built in the multilayer substrate 120.
  • the matching circuit 180 is incorporated in the multilayer substrate 120 including the coil patterns 200a to 200c.
  • the first terminal electrode 140 a and the second terminal electrode 140 b are provided on one main surface of the multilayer substrate 120.
  • first coil portion CIL1 is present in a section from the first coil end T1 to the first position P1, and has a first winding axis in a direction intersecting with one main surface of the multilayer substrate 120.
  • the second coil portion CIL2 is present in a section from the second coil end T2 to the second position P2, and has a second winding axis in a direction intersecting with one main surface of the multilayer substrate 120.
  • the third coil portion CIL3 is arranged to overlap the first coil portion CIL1 in plan view.
  • the fourth coil portion CIL4 is arranged to overlap the second coil portion CIL2 in plan view.
  • the first coil portion CIL1, the third coil portion CIL3, the second coil portion CIL2, and the fourth coil portion CIL4 are disposed at positions sandwiching the RFIC chip 160.
  • the matching circuit 180 and the RFIC chip 160 are incorporated in the multilayer substrate 120.
  • the RFIC chip 160 is formed of a semiconductor substrate. Therefore, the RFIC chip 160 functions as a ground or a shield for the first coil portion CIL1, the second coil portion CIL2, the third coil portion CIL3, and the fourth coil portion CIL4. As a result, the first coil portion CIL1 and the second coil portion CIL2 as well as the third coil portion CIL3 and the fourth coil portion CIL4 become difficult to couple to each other magnetically or capacitively. Thus, narrowing of the pass band of the communication signal is suppressed.
  • FIG. 10 is a diagram showing the distribution of rigid regions and flexible regions in the RFIC element 100.
  • FIG. 11 is a view showing a state in which the RFID tag in which the RFIC element 100 is attached to the lands LA1 and LA2 is bent.
  • the multilayer substrate 120, the coil patterns 200a to 200c, the first terminal electrode 140a, and the second terminal electrode 140b are made of flexible members.
  • interlayer connection conductors 220a, 220b, 240a, 240b, and the RFIC chip 160 are made of hard members.
  • the first terminal electrode 140a and the second terminal electrode 140b are relatively large in size, their flexibility is low.
  • the flexibility of the first terminal electrode 140a and the second terminal electrode 140b is even lower. Become.
  • a rigid region and a flexible region are formed in the RFIC element 100. More specifically, the area in which the first terminal electrode 140a, the second terminal electrode 140b, and the RFIC chip 160 are disposed is a rigid area, and the other area is a flexible area. In particular, since the first terminal electrode 140a and the second terminal electrode 140b are provided at a distance from the RFIC chip 160, the first terminal electrode 140a and the RFIC chip 160, and the second terminal electrode 140b and the RFIC chip 160. The area is a flexible area.
  • the RFIC element 100 bends as shown in FIG. 11, for example.
  • FIG. 12 is a diagram showing an example of current flowing in the equivalent circuit of the RFID tag of FIG.
  • FIG. 13 is a diagram showing frequency characteristics of reflection loss when the circuit connected to the RFIC chip in the RFID tag of FIG. 11 is viewed from the RFIC chip.
  • a parasitic capacitance (floating capacitance) Cp that the RFIC chip 160 has is present between the first input / output terminal 160a and the second input / output terminal 160b. Therefore, in the RFIC element 100, two resonances occur.
  • the first resonance is a resonance that occurs in the current path configured by the first dipole element 10, the second dipole element 20, and the inductors L3 and L4.
  • the second resonance is a resonance that occurs in a current path (current loop) formed of the inductors L1 to L4 and the parasitic capacitance Cp. These two resonances are coupled by the inductors L3 to L4 shared by the respective current paths.
  • Two currents I1 and I2 respectively corresponding to the two resonances flow as indicated by broken arrows in FIG.
  • both the first resonance frequency and the second resonance frequency are affected by the inductors L3 to L4.
  • a difference of several tens of MHz is generated between the first resonance frequency f1 and the second resonance frequency f2.
  • the rim 412 is a loop conductor
  • the rim 412 acts as a part of the antenna of the RFID tag 301. That is, although the RFID tag is disposed in the loop conductor, the loop conductor is effectively used and the RFID tag can communicate with the reader / writer.
  • the loop conductor acts as part of the RFID tag's antenna, that is, it does not radiate only by the dipole antenna of the RFID tag, the dipole antenna is sized for quarter-wave resonance. It does not have to be.
  • the first dipole element relatively close to the rim interacts with the rim as shown in FIGS. 3A and 3B, it does not have a length equivalent to a quarter wavelength. It is also good.
  • the RFID tag according to the present embodiment is attached to the spectacle lens just as in the case of a conventional spectacle seal attached to a resin lens which has been fitted in advance for display of the spectacle frame, that is,
  • the RFID tag-equipped glasses can be configured without significantly impairing the design.
  • the RFID tag-equipped glasses can be used for inventory control, store control, distribution control, and the like.
  • the rim shows the example which constitutes a loop conductor of a closed loop
  • the rim is an open loop loop conductor like a so-called half rim type eyeglass frame and an under rim type eyeglass frame Even if it is applicable similarly.
  • the impedance matching circuit is provided in the RFIC element 100 to match the impedances of the RFIC chip 160 and the first dipole element 10 and the second dipole element 20 and to determine the resonance frequency characteristics of the antenna. Therefore, the following effects can be achieved.
  • the area of the substrate can be effectively used as a space for forming a dipole element, and the RFID tag can be miniaturized. Also, if the size is the same, high gain can be achieved.
  • the lands LA1 and LA2 on which the RFIC element 100 is mounted overlap the first coil portion CIL1, the second coil portion CIL2, the third coil portion CIL3 and the fourth coil portion CIL4 of the RFIC element 100 in plan view,
  • the sections CIL1 to CIL4 are electromagnetically shielded by the lands LA1 and LA2, which make the sections CIL1 to CIL4 unlikely to be affected by the electromagnetic properties of the article to which the RFID tag is attached. That is, even when the RFID tag 301 is attached to an article having a high relative dielectric constant or relative permeability, the change in the electromagnetic characteristics of the RFID tag is small between the attached state and the single state before attachment.
  • FIG. 14 is a plan view of the RFID tag 302A according to the second embodiment.
  • the RFID tag 302 ⁇ / b> A includes a rectangular plate-shaped base 1, a first dipole element 10 and a second dipole element 20 formed on the base 1, and an RFIC element 100 mounted on the base 1.
  • the shape, size, and position of the tip 12 are different from those of the RFID tag 301 shown in FIG. 2A. Moreover, it differs in the point which is not equipped with side part conductor pattern 11S, 21S.
  • the line width of the tip portions 12 and 22 is three or more times thicker than the line width of the main conductor pattern portions 11 and 21. Moreover, it is longer than the dimension of the formation area of the longitudinal direction of the main conductor pattern parts 11 and 21.
  • the tip portion 12 of the first dipole element 10 constitutes a capacitive coupling portion CC.
  • the other configuration is the same as that shown in the first embodiment.
  • the capacitive coupling with the rim (see the rim 412 in FIG. 3A) closely following the capacitive coupling portion CC is large.
  • FIG. 15 is a plan view of another RFID tag 302B according to the present embodiment.
  • the first dipole element 10 has the first open end OE1 close to the first end E1 of the substrate 1.
  • the second dipole element 20 is positioned such that the second open end OE2 is close to the second end E2 of the substrate 1.
  • the other configuration is the same as that shown in the first embodiment.
  • FIG. 16 is a plan view of another RFID tag 302C according to the present embodiment.
  • the side conductor pattern 10S which is a part of the first dipole element 10 is disposed between the RFIC element 100 and the first side S1.
  • the side conductor pattern 20S which is a portion, is disposed between the RFIC element 100 and the second side S2.
  • the other configuration is the same as that of the RFID tag 302B shown in FIG.
  • FIG. 17 is a plan view of another RFID tag 302D according to the present embodiment.
  • the first open end OE1 of the first dipole element 10 is not located closer to the first end E1, but closer to the center than the first end E1 or the second end E2. is there.
  • the second open end OE2 of the second dipole element 20 is not closer to the second end E2, but is closer to the center than the first end E1 or the second end E2.
  • the side conductor pattern 10S of the first dipole element 10 is formed to a position extending in the direction of the second end E2 from the middle point between the land LA1 and the land LA2.
  • the side conductor pattern 20S of the second dipole element 20 is formed to a position extending in the direction of the first end E1 more than the middle point between the land LA1 and the land LA2.
  • the other configuration is the same as that of the RFID tag 302C shown in FIG.
  • FIG. 18 is a plan view of another RFID tag 302E according to this embodiment.
  • the first open end OE1 of the first dipole element 10 protrudes from the main portion of the side conductor pattern 10S.
  • the second open end OE2 of the second dipole element 20 protrudes from the main part of the side conductor pattern 20S.
  • the other configuration is the same as that of the RFID tag 302D shown in FIG.
  • the first dipole element 10 or the second dipole element 20 capacitively couples with the rim, and the rim contributes to radiation. Therefore, communication becomes possible also from the radio wave arrival direction electromagnetically shielded by the rim, and the communicable distance is also improved.
  • FIG. 19 is a plan view showing an internal structure of the RFID tag-attached name tag 421.
  • the RFID tag-attached name tag 421 includes a base 91, a coil antenna 92, an RFIC element 93 for the HF band, and an RFID tag 301 for the UHF band.
  • the coil antenna 92 for the HF band RFID is formed on the base 91.
  • the RFIC element 93 in the HF band is mounted on the base 91 and connected to the coil antenna 92.
  • the UHF band RFID tag 301 is provided on the base 91 along the inner periphery of the coil antenna 92.
  • the coil antenna 92 acts as a loop conductor in the UHF band. That is, this coil antenna 92 corresponds to the "metal part" in the present invention.
  • FIG. 20 is a view showing the main configuration of a portable electronic device 422 with an RFID tag.
  • the RFID tag-attached portable electronic device 422 includes a circuit board 95 on which the RFID tag 301 is provided, and a frame-shaped metal portion 94.
  • the RFID tag 301 is disposed close to and along the metal portion 94.
  • the metal part 94 acts as a part of the antenna of the RFID tag 301.
  • FIG. 21 is a plan view of the clipboard 423 with an RFID tag.
  • the RFID tag-attached clipboard 423 has a metal frame formed around the base portion 96, and the RFID tag 301 is provided at a position along and in close proximity to the metal frame. Since the metal frame constitutes a looped conductor, this structure capacitively couples the looped conductor to the dipole element of the RFID tag 301. That is, the metal frame acts as part of the antenna of the RFID tag 301.
  • a metal clip portion 97 may be used as a loop conductor.
  • the RFID tag 301 is provided at a position along and in close proximity to the clip unit 97.
  • the loop conductor capacitively couples with the dipole element of the RFID tag 301. That is, the clip unit 97 acts as part of the antenna of the RFID tag 301.
  • FIG. 22 is a perspective view of a car 424 with an RFID tag.
  • an RFID tag 301 is attached to a windshield 98 thereof.
  • the RFID tag 301 is disposed at a position along and in close proximity to the frame of the windshield 98. Since the frame of the windshield 98 constitutes a looped conductor, this looped conductor acts as part of the antenna of the RFID tag 301.
  • the RFID tag may be configured such that the first side (or first open end) is along the metal portion provided at the edge portion of the insulator portion, and the second side (or second portion) By arranging (offset) the open end) closer to the center (part away from the metal part) of the insulator portion than the first side (or first open end), the design of the article is not significantly impaired. , An RFID tagged article capable of communicating with the RFID tag is obtained.
  • an RFID tag in a display device provided with a metal frame portion as an article with an RFID tag, can be arranged in proximity to the metal frame portion to constitute a display device with an RFID tag.
  • the dipole antenna has an electrical length corresponding to a quarter wavelength, and an electrical length from the first open end to the second open end corresponds to a half wavelength.
  • the electric length from the 1st open end to the 2nd open end may be less than 1/2 wavelength, and it is an asymmetrical dipole type antenna from which the electric length of the 1st dipole element and the 2nd dipole differ. May be
  • the dipole antenna is formed on almost the entire surface of the base material, but a part of the base material may be a formation region of the dipole antenna. Also, the outer shape of the substrate may not be similar to the formation area of the dipole antenna.
  • RFID tag 410 ... RFID tag glasses 411 ... glasses lens 412 ... metal rim 421 ... RFID tag name tag 422 ... RFID tag portable electronic device 423 ... RFID tag clipboard 424 ... RFID tag automobile car

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Eyeglasses (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne une paire de lunettes attachées à une étiquette RFID (410) comprenant : une paire de lunettes ayant des verres de lunettes (411) et un rebord métallique (412); et une étiquette RFID (301). L'étiquette RFID (301) comprend une antenne dipôle comprenant un premier élément dipôle et un second élément dipôle. L'étiquette RFID est collée à l'une des verres de lunettes (411) de sorte qu'une section latérale du premier élément dipôle soit disposée le long du rebord métallique (412).
PCT/JP2018/015362 2017-07-14 2018-04-12 Lunettes attachées à une étiquette rfid et article fixé à une étiquette rfid WO2019012766A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018545522A JP6531873B1 (ja) 2017-07-14 2018-04-12 Ｒｆｉｄタグ付きメガネおよびｒｆｉｄタグ付き物品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017137973 2017-07-14
JP2017-137973 2017-07-14

Publications (1)

Publication Number Publication Date
WO2019012766A1 true WO2019012766A1 (fr) 2019-01-17

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PCT/JP2018/015362 WO2019012766A1 (fr) 2017-07-14 2018-04-12 Lunettes attachées à une étiquette rfid et article fixé à une étiquette rfid

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JP (2) JP6531873B1 (fr)
WO (1) WO2019012766A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021152889A1 (fr) * 2020-01-29 2021-08-05

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136542A1 (fr) * 2022-01-17 2023-07-20 삼성전자 주식회사 Dispositif à porter sur soi comprenant une antenne à l'intérieur d'un élément transparent

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013168A1 (fr) * 2005-07-29 2007-02-01 Fujitsu Limited Étiquette rf et procédé de fabrication correspondant
WO2012023511A1 (fr) * 2010-08-16 2012-02-23 凸版印刷株式会社 Étiquette de circuit intégré (ci) sans contact et plaque signalétique
WO2012086619A1 (fr) * 2010-12-22 2012-06-28 シャープ株式会社 Appareil de communication sans fil du type lunettes
WO2013187509A1 (fr) * 2012-06-14 2013-12-19 ヤマハ株式会社 Antenne
WO2016072335A1 (fr) * 2014-11-07 2016-05-12 株式会社 村田製作所 Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013168A1 (fr) * 2005-07-29 2007-02-01 Fujitsu Limited Étiquette rf et procédé de fabrication correspondant
WO2012023511A1 (fr) * 2010-08-16 2012-02-23 凸版印刷株式会社 Étiquette de circuit intégré (ci) sans contact et plaque signalétique
WO2012086619A1 (fr) * 2010-12-22 2012-06-28 シャープ株式会社 Appareil de communication sans fil du type lunettes
WO2013187509A1 (fr) * 2012-06-14 2013-12-19 ヤマハ株式会社 Antenne
WO2016072335A1 (fr) * 2014-11-07 2016-05-12 株式会社 村田製作所 Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021152889A1 (fr) * 2020-01-29 2021-08-05
JP7036287B2 (ja) 2020-01-29 2022-03-15 株式会社村田製作所 Ｒｆｉｄタグ

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JP6531873B1 (ja) 2019-06-19
JP2019149168A (ja) 2019-09-05
JP6857676B2 (ja) 2021-04-14
JPWO2019012766A1 (ja) 2019-07-11

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