WO2019002008A1 - Module électrique et procédé de commande d'un module électrique - Google Patents

Module électrique et procédé de commande d'un module électrique Download PDF

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Publication number
WO2019002008A1
WO2019002008A1 PCT/EP2018/066167 EP2018066167W WO2019002008A1 WO 2019002008 A1 WO2019002008 A1 WO 2019002008A1 EP 2018066167 W EP2018066167 W EP 2018066167W WO 2019002008 A1 WO2019002008 A1 WO 2019002008A1
Authority
WO
WIPO (PCT)
Prior art keywords
assembly
active
mechanical
thermal
electrical
Prior art date
Application number
PCT/EP2018/066167
Other languages
German (de)
English (en)
Inventor
Rene Blank
Martin Franke
Peter Frühauf
Stefan Nerreter
Rüdiger Knofe
Bernd Müller
Jörg Strogies
Klaus Wilke
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2019002008A1 publication Critical patent/WO2019002008A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Definitions

  • the invention relates to an electrical assembly with a sensor and a method for controlling an electrical assembly.
  • Current innovative design concepts for electrical and electronic assemblies are characterized by an increasing degree of integration and miniaturization.
  • a particularly problematic aspect is the controlled, targeted cooling and handling of damaging expansion differences due to different thermal effects
  • thermomechanical stresses which, depending on the design of joint connections between different components or functional materials, can cause cumulative damage to respective interfaces, joining materials and functional elements.
  • solder fatigue due to cyclic exchange loads.
  • Object of the present invention is to provide an electrical
  • the control unit processes the sensor technology presented measurement data characterizing a thermal and / or mechanical ⁇ specific property of the module to a control signal for the at least one active influencing ⁇ element.
  • the at least one active influencing element influences the thermal and / or mechanical property of the assembly as a function of the control signal by actively influencing at least one component of the assembly and thereby minimizes an expansion difference, ie a faulty expansion, between at least two components of the assembly.
  • the electrical or electronic assembly can be understood as a constructive and / or functional composite or as a structural and / or functional unit made of integrated and / or discrete, active and / or passive components or components. These components or components may be electrically connected to each other by an electrical line network.
  • the at least one component that is actively impressive ⁇ enced, must fulfill not necessarily an electrical ⁇ cal or electronic signal- or data-processing or -wager malariade function.
  • Component may therefore be an electrically insulating support or structural element or a cooling element of the assembly.
  • the active influence of the component can mean, for example, that a thermal, mechanical and / or electrical property of the component or a corresponding one
  • the active influence for example, include or mean a position, position, shape and / or size change of the component.
  • the active influencing element can be designed, for example, as a microsystem (MEMS, microelectromechanical system).
  • the active element can Beeinpoundungsele ⁇ arranged on or at the at least one component being ⁇ embedded in or integrated with this or with this, for example via an electrical line or a mechanical and / or thermal connection element verbun ⁇ the or be coupled.
  • the active influencing element can be connected, for example, to a power supply of the electrical assembly and can be supplied with energy via this. The same can also apply to the control unit.
  • the control unit may, for example, a microchip, a
  • the control unit can be arranged as a component of the electrical ⁇ rule module in or on this. However, it is also possible to arrange the control unit spatially spaced from the other interconnected components of the assembly. While an arrangement of the control device together with the other components of the electrical assembly in a conventional composite may be advantageous in terms of miniaturization, independence and simplified contactability, a spatially separated arrangement of the controller, for example, be advantageous if this multiple electrical components or respectively at least one controls active influencing element administrat Kunststoffli ⁇ cher electrical components, that is supplied with control signals. For this purpose, the controller and the rest
  • An expansion difference ie an expansion difference between at least two components or sub-areas of the assembly means in the context of the present invention, a different thermal expansion, so for example a different length, size and / or shape change, the at least two components or sub-areas, which by different Temperatures and / or different thermal expansion coefficients of at least two
  • Damage caused by incorrect expansion may occur, in particular, in the case of cyclically loaded, ie thermal, mechanical and / or electrical changeover switches, components, connections or assemblies.
  • the present invention can therefore be used particularly advantageously in such fields of application in order to avoid damage, to prevent premature aging of the components, connections and / or assemblies and thus for a prolonged service life and / or increased thermal, mechanical and / or electrical load capacity to care.
  • the vorlie ing invention thus advantageously a further Miniaturisie ⁇ tion, a more cost-effective production and / or an increase in power density allow.
  • Components can ensure more, is the present inventive use of the at least one active influencing ⁇ lussungsijns and its control using the own electrical assembly sensor technology particularly effective and advantageous.
  • a reaching or exceeding such a threshold value may serve as a signal or Auslö ⁇ ser for the control unit, which then drives the at least one active influencing element according to to bring each current value or measured value of a corresponding measured variable below the exceeded threshold value.
  • the active Beeinf ⁇ lussungselement controls can be adapted accordingly, for example, until the predetermined target value is reached for the current value of the respective measured variable.
  • thermomechanical properties For the purposes of the present invention, a change or influencing of the thermal and / or mechanical properties of a component or partial area of the electrical assembly simultaneously also means a change or influencing of the thermal and / or mechanical properties of the electrical assembly as a whole.
  • the thermal and / or mechanical properties are collectively referred to as thermomechanical properties.
  • the at least one active influencing element has a heating element.
  • Heating element the at least one component heated, so be heated.
  • the Wenig ⁇ least one component can thus in its temperature and thus at least an indirect influence in its expansion.
  • the temperature of the at least one component can be adjusted to a temperature of another, in particular of an adjacent, component of the assembly by means of the heating element.
  • at least one component it is possible, for example, for at least one component to be heated to a controlled extent by means of the heating element, that is to bring it to a specific temperature determined, for example, by the control unit, so that the actual thermal expansion, that is, for example, a length Change, the at least one component is matched to a thermal expansion of at least one further, in particular adjacent, component of the assembly.
  • the heating or temperature required for this purpose can be determined by the control unit, for example by balancing the temperatures of the at least one determined by means of the sensor system
  • the zusommeli ⁇ che heating the at least one component independently may, for example, a signal-processing function or functions at first appear counter-intuitive.
  • the positive effect of avoiding or minimizing a faulty expansion that can be achieved by heating outweighs, so that overall a positive effect results, for example in the form of avoiding damage, reduced or slowed aging and / or an extended life of the electrical assembly.
  • the at least one active influencing element has an actuator, in particular a piezoelectric element and / or a bimetallic element.
  • an actuator in particular a piezoelectric element and / or a bimetallic element.
  • re insbesonde ⁇ can thus be influenced a mechanical property of at least one Bauele ⁇ mentes.
  • a change in state that is to say a change in particular of a thermal and / or mechanical state of a component or the assembly, is to be understood as a change, that is to say influencing a corresponding thermal and / or mechanical property.
  • the Actuator can thus, for example, a position, location and / or shape of at least one of the elements influenced or to be modified, which means an embedding ⁇ pound ung a mechanical property of the at least one component.
  • Component be brought, for example, in direct mechanical, in particular heat-conducting, contact with another component of the assembly or such contact is interrupted or canceled.
  • Adjustment of a heat flow or cooling path within the electrical assembly By means of the actuator, therefore, a respective current preferred direction for a heat flow within the assembly can be set. This in turn allowed ⁇ light an adjustment of a temperature gradient or temperature distribution within the electrical assembly, which may be utilized to avoid or minimize the expansion difference.
  • the at least one component or another component mechanically coupled thereto can be brought into contact with a cooling element or such contact can be interrupted or a corresponding contact surface can be increased or reduced.
  • a mechanical deformation for example bending of at least one component within the electrical assembly
  • This bending or deformation can be done by means of the Actuator be counteracted.
  • the actuator can thus exert a mechanical stress, a mechanical pressure or a mechanical tension on the at least one component in order to avoid or compensate for the deformation or the bending.
  • the use of the actuator thus advantageously enables a particularly precise and flexible active influencing of the thermo-mechanical properties or of the thermomechanical behavior of the electrical assembly.
  • the senor has several, at different
  • Components of the assembly arranged sensors. These plurality of sensors are adapted to a respective thermal and / or mechanical state, that a respective thermal and / or various ⁇ to detect the components which mechanical property.
  • a temperature gradient or a temperature field and / or a mechanical stress field or a profile or gradient of a mechanical stress or stress within the electrical assembly can thus advantageously be detected or determined by means of the sensor system. This allows a particularly accurate evaluation of a respective current thermo-mechanical state of the electrical assembly as well as a particularly flexible and particularly precise influencing of the respective thermo-mechanical state, ie the respective thermo-mechanical property or properties of the electrical assembly.
  • an optimal influence on the electrical assembly or its thermo-mechanical properties can be achieved.
  • An optimum here for example, a minimization of one or more expansion differences within the electrical assembly, minimizing a thermomechanical stress, minimizing aging or aging phenomena of the electrical assembly, maximizing a thermomechanical and / or electrical damage-free achievable load capacity of the electrical assembly, maximizing the life of the electrical assembly or the like more or to be.
  • Another aspect of the present invention in addition to the electrical assembly according to the invention is a method for controlling an electrical assembly, in particular an electrical assembly according to the invention.
  • These measurement data are processed by means of the control unit to a control signal for at least one active influencing element of the module.
  • the at least one active Beeinflus ⁇ sungs is then influenced by active manipulation Wenig ⁇ least a component of the module in response to the control signal, the thermal and / or mechanical property of the assembly and thereby a difference in expansion, so a faulty extension between at least two components of the assembly minimized.
  • a thermal and / or mechanical Verhal ⁇ th of the module is mathematically modeled, and generates the control signal as a function of the modeled behavior.
  • a model description of components and / or functional units of the module is made or provided.
  • a given model can be used, for example, where the measurement data detected by the sensors are supplied as input or state variables.
  • a modeling device which may be part of the control unit, are used.
  • the modeling device can-like the control device-have, for example, a processor device and a memory device connected to it.
  • a purely mathematical model can be used.
  • determined behaviors of the assembly under predetermined and / or known thermomechanical and / or electrical conditions can be used or taken into consideration, for example, by means of experimental methods, ie concrete measurements.
  • a knowledge or prediction of a past, current and / or future behavior or state of the electrical assembly associated with the given model or modeling advantageously enables a particularly accurate, reliable, effective and efficient control of the electrical assembly, ie a correspondingly advantageous minimization of the expansion difference - Approximately the expansion differences within the electrical ⁇ rule module.
  • thermomechanical inertia that can delay an influence or an effect of the control signal, that is to say the activation of the active influencing element, can be considered or compensated.
  • thermomechanical behavior can also effectively and efficiently control even ermögli ⁇ chen, for example, when not every single component of the assembly is monitored by an individual sensor. This is the case because, by means of the model, a The number of measured data, for example, on a thermo-mechanical state, can also be concluded from those components or partial areas of the module that are not detected or monitored by the sensor system.
  • this integration or combination of the local sensor system in or on the module makes it possible to the modeling of the thermo-mechanical behavior of the assembly and the actively controlled influencing ⁇ tion of the module by means of the active influencing element in dependence on the modeled behavior and the measurement data of the sensor, an electrical assembly with improved thermo-mechanical behavior, improved
  • the actively influenced component can be influenced independently of a possible electrical and / or signal and / or data processing functionality of this component.
  • the model or the modeled behavior of the module takes into account a respective influence of the sensor system and the at least one active influencing element on the thermal and / or mechanical behavior of the module.
  • a real thermo-mechanical state and a real thermo-mechanical behavior of the electrical assembly can be modeled with particular accuracy, ie be imaged and / or predicted.
  • Particularly advantageous ⁇ way can this modeling, development process, for example, in an unloading or a manufacturing method for the electrical assembly, are used to an optimum arrangement or positioning of the sensor system and / or the at least one active control element to determ ⁇ men, for example, a performance or belast ⁇ bility to maximize the electrical assembly.
  • the sensors can have a plurality of individual sensors in order to detect or determine a spatial and temporal course of the detected measured variables. This can advantageously enable a particularly accurate and effective influencing of the thermo-mechanical properties of the assembly, ie a particularly effective and efficient control of the electrical assembly.
  • the detection of a temperature gradient is particularly advantageous, since temperature gradients form a significant influencing factor or a significant cause of expansion differences within assemblies. Detecting the shape and / or dimensional change can for example be particularly advantageous if the respective temperature of its Forum and / or dimension changing device can not or can not be accurately detected and / or beispielswei ⁇ se varied within the device and / or then when the thermal expansion coefficient of the respective Bauele ⁇ mentes is not known.
  • the detection of the change in shape and / or dimension may be possible, for example, by means of a sensor arranged on respective outer sides of the component. For a precise temperature measurement, however, for example, an arrangement of a temperature sensor in a central region of the respective component necessary which, for example, due to a Packagings
  • a respective temperature ⁇ tur is detected by the sensor.
  • the relative changes in length of the two components should therefore be the same.
  • the thermal expansion caused by the respective temperature change can be positive for heating and negative for cooling.
  • a negative thermal expansion here means example ⁇ , a contraction or contractiveConnectn Masse ⁇ tion.
  • the actively influenced at least one component can be one of the at least two components, between which the contact is made or interrupted.
  • approximately a second component is indirectly influenced and brought into contact with a third component or such a contact between the second and the third
  • Component is interrupted.
  • a mechanical contact in this sense exists when the at least two Bauelemen ⁇ te, in particular directly, touch.
  • the present invention can be particularly advantageous for power electronic assemblies, electric drives, inverters and the like and be used profitably.
  • the properties and refinements of the electrical assembly according to the invention and the corresponding advantages given heretofore and hereinafter are mutatis mutandis applicable to the method according to the invention and / or components or devices used or usable for carrying out the method according to the invention and vice versa.
  • the invention also includes such developments of the electrical assembly according to the invention and of the method according to the invention which have configurations which are not explicitly described here in the respective combination. Further features, details and advantages of the present invention will become apparent from the following description of preferred embodiments and from the drawing.
  • the single figure shows a schematic and marnit ⁇ tene side view of an electrical assembly with a sensor and several controllable active influencing elements for actively influencing a thermal and / or mechanical property of the assembly.
  • the single FIGURE shows a schematic and sectional side view of an electrical or electronic see assembly 1 in an exemplary construction.
  • the electrical assembly 1 has a base element 2, which may be, for example, a cooling element or heat sink.
  • a base element 2 In the vertical direction of the electrical assembly 1 on or above the base element 2 is a
  • Ceramic member 3 is arranged, which may be, for example, be a ceramic substrate for a direct bonded copper structure structural ⁇ (DBC, English “Direct Bonded Copper”, also DCB, “Direct Bonded Copper”).
  • the ceramic element 3 can be used as the main heating path for dissipating heat from overlying parts of the electrical assembly 1 towards the
  • Base element 2 serve. It is particularly advantageous that the ceramic element 3 can have a high thermal conductivity and at the same time as an electrical insulator, such as can serve over the example metallic base element 2.
  • a power semiconductor element 4 is arranged in the present case, which is bordered laterally by elekt ⁇ driven insulating support members. 5
  • Support elements 5 can serve as supporting surfaces for an arranged above the power semiconductor element 4 Hauptverdrah ⁇ tung carrier 6 of the electric module. 1 By the mechanically stable support elements 5 can be avoided that the power semiconductor element 4 is damaged for example in a joining of the electrical assembly by mechanical pressure.
  • the main wiring carrier 6 serves in particular as a carrier or substrate for an electrical line network 7, which in the present case and also further
  • Line network 7 two contacts 8 for a above the main wiring substrate 6 arranged surface-mounted device (SMD, "surface-mounted device”) 9 is arranged and labeled ⁇ .
  • SMD surface-mounted device
  • the electrical assembly 1 has a sensor with a plurality of spatially distributed in or on different components of the electrical assembly 1 arranged sensors 10.
  • the sensors 10 may be the same or different types, for example temperature sensors, pressure sensors or sensors for detecting mechanical stresses,
  • Sensors 10 for example, a temperature field and / or mechanical variables such as bends or contractions within the electrical assembly 1 can be detected spatially and temporally resolved.
  • Corresponding measured values or measured data acquired by the sensors 10 are transmitted to a control unit, not shown here.
  • the control unit can, for example, wise be designed as a microchip or microcontroller and / or be part of the power semiconductor element 4.
  • parts of the pipeline network 7 of the electrical module 1 can be used to transmit the measured data.
  • Appropriate contacts or connections of the individual sensors 10 are here for reasons of clarity is not explicitly Darge is ⁇ .
  • a wireless transmission of the measured data to the control unit may be possible.
  • the measurement data detected by the sensors 10 characterize a thermal and / or mechanical, thermomechanical so short, the electrical property compo ⁇ pe 1 and of the respective component in or on which a respective one of the sensors 10 is arranged.
  • a thermomechanical property of the electrical assembly 1 or of the respective component can be influenced by means of the active influencing elements 17.
  • the control unit can generate respective control signals for the active influencing elements 17 as a function of the measurement data provided by the sensors 10 and transmit them to them. Also here are appropriate
  • Control signals may be possible.
  • a first sensor 11 and a first active influencing element 18 are integrated in the base element 2.
  • a first sensor 11 and a first active influencing element 18 are integrated in the base element 2.
  • a first sensor 11 and a first active influencing element 18 are integrated in the base element 2.
  • a first sensor 11 and a first active influencing element 18 are integrated in the base element 2.
  • the ceramic element 3 is a second
  • Temperature gradient can be determined, which can extend, for example, from the power semiconductor element 4 through the ceramic member 3 into the base member 2 in. Due to their different functions and consequent different material compositions that can
  • the second active influencing element 19 can be designed as a heating element and be used to heat the ceramic element 3, by a difference of the thermal expansion coefficients of the
  • the second active influencing element 19 increased temperature of the ceramic element 3 so then the otherwise possible incorrect expansion can be avoided or reduced so far that it does not damage the electrical assembly 1.
  • the temperatures or the temperature field can be detected or determined not only locally, but also in time.
  • an active temperature or temperature field management may be provided to achieve a minimization of effective mis-expansion by reducing local expansion differences.
  • the goal of the appropriate control or regulation can be achieved or fulfilled the condition
  • the main wiring substrate 6 and the SMD 9 may have different thermal expansion coefficients.
  • the SMD 9 can be sensitive to a heat influence or a temperature increase, for example. Is then by the fifth sensor 15 and the sixth sensor 16, a Temperaturdiffe ⁇ rence between the main wiring substrate 6 and the SMD 9 determines, a without further action from the alternative ⁇ ell resulting incorrect expansion can not be compensated for by heating the SMD 9 usefully as this could lead to thermal damage of the SMD 9. However, a balancing of the respective false expansion may still be desirable to avoid, for example, a Bebuldi ⁇ supply of an electrical connection of the SMD 9 to the mains 7 to the contacts. 8 In such a case, the fifth active influencing element 22 be formed for example as a mechanical actuator.
  • a mechanical force can then be exerted on the main wiring carrier 6 in order, for example, to compensate for unequal bending of the main wiring substrate 6 resulting from a temperature difference or temperature change compared with a bending or deformation of the SMD 9 or the contacts 8.
  • the main wiring substrate 6 can thus by means of the fifth active control element 22 running in the opposite direction are bent to a caused by the change in temperature or a temperature gradient bending to maintain a straight, neutral position and shape or the Verbie ⁇ gene at a corresponding position and / or shape change of the SMD 9 and / or the contacts 8 to match.
  • An active mechanical influence by means of the active influencing elements 17 thus provides one to the thermal

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module électrique (1) comprenant un système de détection (10), et un procédé de commande d'un module électrique (1). Des données de mesure qui sont fournies au moyen d'un appareil de commande par le système de détection (10) et qui décrivent une caractéristique thermomécanique du module (1) sont reçues et traitées pour produire un signal de commande d'au moins un élément exerçant une influence active (17) du module (1). Le ou les éléments exerçant une influence active (17) agissent sur la caractéristique thermomécanique par une influence active sur au moins un composant (2, 3, 4, 5, 6, 7, 9) du module (1) en fonction du signal de commande, de sorte qu'une différence de dilatation entre au moins deux composants (2, 3, 4, 5, 6, 7, 9) du module (1) est réduite au minimum.
PCT/EP2018/066167 2017-06-26 2018-06-19 Module électrique et procédé de commande d'un module électrique WO2019002008A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017210706.5A DE102017210706A1 (de) 2017-06-26 2017-06-26 Elektrische Baugruppe und Verfahren zur Steuerung einer elektrischen Baugruppe
DE102017210706.5 2017-06-26

Publications (1)

Publication Number Publication Date
WO2019002008A1 true WO2019002008A1 (fr) 2019-01-03

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Application Number Title Priority Date Filing Date
PCT/EP2018/066167 WO2019002008A1 (fr) 2017-06-26 2018-06-19 Module électrique et procédé de commande d'un module électrique

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DE (1) DE102017210706A1 (fr)
WO (1) WO2019002008A1 (fr)

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GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates
EP1811819A1 (fr) * 2006-01-19 2007-07-25 Siemens Aktiengesellschaft Circuit imprimé
WO2010128978A1 (fr) * 2009-05-05 2010-11-11 Wavecom S.A. Chauffage rapide de carte de circuits imprimés
CN103327671A (zh) * 2012-03-19 2013-09-25 黄如金 一种led灯具的pcb电路板
US8964394B2 (en) * 2012-07-10 2015-02-24 Moxa Inc. Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components
US20170181271A1 (en) * 2015-12-21 2017-06-22 Intel Corporation Warpage mitigation in printed circuit board assemblies

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JPH0621588A (ja) * 1992-07-03 1994-01-28 Hitachi Ltd 回路基板
US6359372B1 (en) * 2000-05-03 2002-03-19 Intel Corporation Circuit card assembly having controlled expansion properties
DE102005050515A1 (de) * 2005-10-21 2007-04-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flächensubstrat mit elektrisch leitender Struktur
JP5195918B2 (ja) * 2008-12-09 2013-05-15 富士通株式会社 解析装置、解析方法及び解析プログラム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates
EP1811819A1 (fr) * 2006-01-19 2007-07-25 Siemens Aktiengesellschaft Circuit imprimé
WO2010128978A1 (fr) * 2009-05-05 2010-11-11 Wavecom S.A. Chauffage rapide de carte de circuits imprimés
CN103327671A (zh) * 2012-03-19 2013-09-25 黄如金 一种led灯具的pcb电路板
US8964394B2 (en) * 2012-07-10 2015-02-24 Moxa Inc. Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components
US20170181271A1 (en) * 2015-12-21 2017-06-22 Intel Corporation Warpage mitigation in printed circuit board assemblies

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