WO2019002008A1

WO2019002008A1 - Electric assembly and method for controlling an electric assembly

Info

Publication number: WO2019002008A1
Application number: PCT/EP2018/066167
Authority: WO
Inventors: Rene Blank; Martin Franke; Peter Frühauf; Stefan Nerreter; Rüdiger Knofe; Bernd Müller; Jörg Strogies; Klaus Wilke
Original assignee: Siemens Aktiengesellschaft
Priority date: 2017-06-26
Filing date: 2018-06-19
Publication date: 2019-01-03
Also published as: DE102017210706A1

Abstract

The invention relates to an electric assembly (1) comprising a sensor device (10) and to a method for controlling an electric assembly (1). According to the invention, measurement data provided by a control device from the sensor device (10) and which characterises a thermo-mechanical property of the assembly (1) is received and processed to generate a control signal for at least one active influencing element (17) of the assembly (1). The at least one the active influencing element (17) acts on the thermo-mechanical property by actively influencing at least one component (2, 3, 4, 5, 6, 7, 9) of the assembly (1) in accordance with the control signal, such that a difference in dilation between the at least two components (2, 3, 4, ,5, 6, 7, 9) of the assembly (1) is minimised.

Description

description

Electrical assembly and method for controlling an electrical assembly

The invention relates to an electrical assembly with a sensor and a method for controlling an electrical assembly. Current innovative design concepts for electrical and electronic assemblies are characterized by an increasing degree of integration and miniaturization. A particularly problematic aspect is the controlled, targeted cooling and handling of damaging expansion differences due to different thermal effects

Expansion coefficients of various components or components.

As well as temperature gradients within the assemblies, these different expansion coefficients can lead to thermomechanical stresses which, depending on the design of joint connections between different components or functional materials, can cause cumulative damage to respective interfaces, joining materials and functional elements. A prominent example of this from the construction and connection technology of electronics is the known solder fatigue due to cyclic exchange loads.

Known approaches to address this problem, typically strive for a passive tuning (matching) of jewei ^¬ then loads and respective capacity of the affected building and structural elements. It is therefore attempted to combine respective joining partners and materials in such a way that expansion differences, that is to say faulty expansions, are optimally avoided in terms of design. In addition, soldering materials that are as fatigue-resistant as possible and / or large joint gaps are used that promote stress reduction. These measures, however, are reaching their limits today due to increasing Miniaturization necessities, increasing demands on an electrical and thermal performance and associated, resulting in an operating tempera ^¬ turgradienten. To nowadays often required electrical see and to achieve thermal performance is example ^¬, attempts ceramic materials and combine fiberglass composite mate ^¬ rials in a confined space, although these materials very different expansion behavior under thermal stress, so having a large expansion mismatch. Thus, new solutions are required, since the problems and challenges that occur can no longer be handled with satisfactory quality and cost efficiency by means of the known conventional measures.

For example, there is a commitment and an improvement of the previously used passive material-geometric

Optimizations clearly contrary to the development goals of miniaturization, cost efficiency and increased functionality. For example, the use of highly stress-resistant solder materials as well as a transition to higher-quality joining processes - for example, soldering instead of sintering - significantly increases the cost of a particular product. Object of the present invention is to provide an electrical

To create an assembly with an improved thermomechanical behavior.

This object is achieved by one of the subjects of the independent claims. Advantageous Substituted ^¬ staltungen and developments of the invention are indicated in the dependent patent claims and in the description and in the drawing. An electrical assembly according to the invention has a

Sensor and at least one controllable active influencing ^¬ sungselement and connected to this control unit. The control unit processes the sensor technology presented measurement data characterizing a thermal and / or mechanical ^¬ specific property of the module to a control signal for the at least one active influencing ^¬ element. The at least one active influencing element influences the thermal and / or mechanical property of the assembly as a function of the control signal by actively influencing at least one component of the assembly and thereby minimizes an expansion difference, ie a faulty expansion, between at least two components of the assembly. In other words, the electrical influences

Assembly their thermal and / or mechanical properties so even by means of a control or control circuit.

For the purposes of the present invention, the electrical or electronic assembly can be understood as a constructive and / or functional composite or as a structural and / or functional unit made of integrated and / or discrete, active and / or passive components or components. These components or components may be electrically connected to each other by an electrical line network. The at least one component that is actively impressive ^¬ enced, must fulfill not necessarily an electrical ^¬ cal or electronic signal- or data-processing or -weiterleitende function. The at least one

Component may therefore be an electrically insulating support or structural element or a cooling element of the assembly.

The active influence of the component can mean, for example, that a thermal, mechanical and / or electrical property of the component or a corresponding one

Parameter value influenced, that is modified. Likewise, the active influence, for example, include or mean a position, position, shape and / or size change of the component. For this purpose, the active influencing element can be designed, for example, as a microsystem (MEMS, microelectromechanical system). The active element can Beeinflussungsele ^¬ arranged on or at the at least one component being ^¬ embedded in or integrated with this or with this, for example via an electrical line or a mechanical and / or thermal connection element verbun ^¬ the or be coupled. In order to bring about the active influencing, the active influencing ^element can be connected, for example, to a power supply of the electrical assembly and can be supplied with energy via this. The same can also apply to the control unit.

The control unit may, for example, a microchip, a

Microcontroller or the like or have such. The control unit can be arranged as a component of the electrical ^¬ rule module in or on this. However, it is also possible to arrange the control unit spatially spaced from the other interconnected components of the assembly. While an arrangement of the control device together with the other components of the electrical assembly in a conventional composite may be advantageous in terms of miniaturization, independence and simplified contactability, a spatially separated arrangement of the controller, for example, be advantageous if this multiple electrical components or respectively at least one controls active influencing ^element unterschiedli ^¬ cher electrical components, that is supplied with control signals. For this purpose, the controller and the rest

Components of the electrical module or the electrical components, for example, arranged on a larger board and / or integrated into a larger electrical or electronic system. An expansion difference, ie an expansion difference between at least two components or sub-areas of the assembly means in the context of the present invention, a different thermal expansion, so for example a different length, size and / or shape change, the at least two components or sub-areas, which by different Temperatures and / or different thermal expansion coefficients of at least two

Components or subregions is caused respectively is caused. Such differences in expansion can lead to damage to the involved components, a Fügema terials or a connection between these and / or other components or portions of the electrical assembly. In concrete terms, this can for example result in mechanical stresses within the electrical assembly, which can lead to breakage or tearing of components and / or connections or joining materials. For the purposes of the present invention, such differences in expansion are therefore also referred to as faulty expansions.

Damage caused by incorrect expansion may occur, in particular, in the case of cyclically loaded, ie thermal, mechanical and / or electrical changeover switches, components, connections or assemblies. The present invention can therefore be used particularly advantageously in such fields of application in order to avoid damage, to prevent premature aging of the components, connections and / or assemblies and thus for a prolonged service life and / or increased thermal, mechanical and / or electrical load capacity to care. Through the use of the at least one active influencing element and its control to avoid or

Minimization of expansion differences is advantageously reduced by the present invention, a load susceptible ^¬ cher components and thus allows the use kostengüns tigerer components and / or materials. In addition, additional design freedom, optimization scope and flexibility for a design, a structure and / or a geometry of the electrical assembly can be created or exploited. Overall, the vorlie ing invention thus advantageously a further Miniaturisie ^¬ tion, a more cost-effective production and / or an increase in power density allow.

While in a design or a structure of conventional electrical components usually an external Effect, so for example, an ambient temperature at a respective location of the electrical assembly, is considered as a significant influence size, it is a basic idea of the present invention, occurring within the electrical assembly internal conditions to consider If ^¬ units and interactions. The present invention is therefore based on the finding that in the course of the progressive miniaturization and increase in the performance of electrical components in an operation of the module within these by the components themselves hervorge ^¬ called conditions, in particular temperatures and temperature gradients, essential for a functionality and resilience of the assembly. Since conventional methods, such as an arrangement of a power semiconductor element in the greatest possible spatial distance from a temperature-sensitive component, such as a surface-mounted device (SMD, "Surface-mounted device"), due to the increasing Miniatu ^¬ tion and increased packaging or functional density does not provide sufficient protection for the sensitive ones

Components can ensure more, is the present inventive use of the at least one active influencing ^¬ lussungselementes and its control using the own electrical assembly sensor technology particularly effective and advantageous.

It can for one, several or all of the directly or indirectly by means of the active influencing element of modifiable thermal and / or mechanical properties of the component and / or the assembly a respective target value

and / or a respective threshold value. If such a threshold is exceeded - for example, by heating a component beyond a predetermined threshold temperature - this can be done by means of

Sensors are detected. A reaching or exceeding such a threshold value may serve as a signal or Auslö ^¬ ser for the control unit, which then drives the at least one active influencing element according to to bring each current value or measured value of a corresponding measured variable below the exceeded threshold value. Preferably, the active Beeinf ^¬ lussungselement controls can be adapted accordingly, for example, until the predetermined target value is reached for the current value of the respective measured variable. As a result, advantageously a high-frequency exceeding of the threshold value can be avoided.

For the purposes of the present invention, a change or influencing of the thermal and / or mechanical properties of a component or partial area of the electrical assembly simultaneously also means a change or influencing of the thermal and / or mechanical properties of the electrical assembly as a whole. The thermal and / or mechanical properties are collectively referred to as thermomechanical properties. Through the use of the term "thermomechanical", reference may be made to the respective thermal and / or mechanical variables,

Properties, components or conditions.

In an advantageous embodiment of the present invention, the at least one active influencing element has a heating element. By controlling or controlling this

Heating element, the at least one component heated, so be heated. Through the heating element, the Wenig ^¬ least one component can thus in its temperature and thus at least an indirect influence in its expansion. Thus, for example, the temperature of the at least one component can be adjusted to a temperature of another, in particular of an adjacent, component of the assembly by means of the heating element. Likewise, it is possible, for example, for at least one component to be heated to a controlled extent by means of the heating element, that is to bring it to a specific temperature determined, for example, by the control unit, so that the actual thermal expansion, that is, for example, a length Change, the at least one component is matched to a thermal expansion of at least one further, in particular adjacent, component of the assembly. This can be necessary and advantageous, for example, to avoid incorrect expansion if the at least one component and the further component have different thermal expansion coefficients. The heating or temperature required for this purpose can be determined by the control unit, for example by balancing the temperatures of the at least one determined by means of the sensor system

Component and the other component with a characteristic field or a respective material properties of the components of the assembly descriptive or containing database are determined. To avoid or minimize thermal stress and aging of the at least one component or of the assembly, the zusätzli ^¬ che heating the at least one component independently may, for example, a signal-processing function or functions at first appear counter-intuitive. However, the positive effect of avoiding or minimizing a faulty expansion that can be achieved by heating outweighs, so that overall a positive effect results, for example in the form of avoiding damage, reduced or slowed aging and / or an extended life of the electrical assembly.

In a further advantageous embodiment of the present invention, the at least one active influencing element has an actuator, in particular a piezoelectric element and / or a bimetallic element. Thereby re insbesonde ^¬ can thus be influenced a mechanical property of at least one Bauele ^¬ mentes. For the purposes of the present invention, a change in state, that is to say a change in particular of a thermal and / or mechanical state of a component or the assembly, is to be understood as a change, that is to say influencing a corresponding thermal and / or mechanical property. By controlling the Actuator can thus, for example, a position, location and / or shape of at least one of the elements influenced or to be modified, which means an embedding ^¬ flussung a mechanical property of the at least one component. As a result, the at least one

Component be brought, for example, in direct mechanical, in particular heat-conducting, contact with another component of the assembly or such contact is interrupted or canceled.

This advantageously allows active control or

Adjustment of a heat flow or cooling path within the electrical assembly. By means of the actuator, therefore, a respective current preferred direction for a heat flow within the assembly can be set. This in turn allowed ^¬ light an adjustment of a temperature gradient or temperature distribution within the electrical assembly, which may be utilized to avoid or minimize the expansion difference. Likewise, by means of the actuator, the at least one component or another component mechanically coupled thereto can be brought into contact with a cooling element or such contact can be interrupted or a corresponding contact surface can be increased or reduced. It is possible, for example by means of a pulse width modulation, and / or by adjusting a size of a contact surface between two components not only perform a binary tax, but a value, for example, a heat flow rate of a specific heat flow or cooling path within the electrical

Assembly in several stages or steplessly adapt or adjust.

Likewise, due to temperature differences or temperature gradients and / or different coefficients of thermal expansion, for example, a mechanical deformation, for example bending of at least one component within the electrical assembly, may be caused. This bending or deformation can be done by means of the Actuator be counteracted. The actuator can thus exert a mechanical stress, a mechanical pressure or a mechanical tension on the at least one component in order to avoid or compensate for the deformation or the bending. The use of the actuator thus advantageously enables a particularly precise and flexible active influencing of the thermo-mechanical properties or of the thermomechanical behavior of the electrical assembly.

In a further advantageous embodiment of the present invention, the sensor has several, at different

Components of the assembly arranged sensors. These plurality of sensors are adapted to a respective thermal and / or mechanical state, that a respective thermal and / or various ^¬ to detect the components which mechanical property. Thus, a temperature gradient or a temperature field and / or a mechanical stress field or a profile or gradient of a mechanical stress or stress within the electrical assembly can thus advantageously be detected or determined by means of the sensor system. This allows a particularly accurate evaluation of a respective current thermo-mechanical state of the electrical assembly as well as a particularly flexible and particularly precise influencing of the respective thermo-mechanical state, ie the respective thermo-mechanical property or properties of the electrical assembly.

Particularly preferred as a plurality of spaced at various components of the module active influencing ^¬ elements may be provided. In interaction of the several

Sensors and the plurality of active influencing elements, an optimal influence on the electrical assembly or its thermo-mechanical properties can be achieved. An optimum here, for example, a minimization of one or more expansion differences within the electrical assembly, minimizing a thermomechanical stress, minimizing aging or aging phenomena of the electrical assembly, maximizing a thermomechanical and / or electrical damage-free achievable load capacity of the electrical assembly, maximizing the life of the electrical assembly or the like more or to be.

Another aspect of the present invention in addition to the electrical assembly according to the invention is a method for controlling an electrical assembly, in particular an electrical assembly according to the invention. In the inventive method Messda ^¬ th received by means of a control device provided by a sensor of the assembly, which characterize a thermal and / or mechanical property of the assembly. These measurement data are processed by means of the control unit to a control signal for at least one active influencing element of the module. By means of the at least one active Beeinflus ^¬ sungselementes is then influenced by active manipulation Wenig ^¬ least a component of the module in response to the control signal, the thermal and / or mechanical property of the assembly and thereby a difference in expansion, so a faulty extension between at least two components of the assembly minimized.

In an advantageous development of the inventive method, a thermal and / or mechanical Verhal ^¬ th of the module is mathematically modeled, and generates the control signal as a function of the modeled behavior. Thus, a model description of components and / or functional units of the module is made or provided. For modeling of the thermomechanical behavior of the rule assembly ^¬ a given model can be used, for example, where the measurement data detected by the sensors are supplied as input or state variables. For example, for modeling a modeling device, which may be part of the control unit, are used.

The modeling device can-like the control device-have, for example, a processor device and a memory device connected to it. To model the behavior, a purely mathematical model can be used. Additionally or alternatively, determined behaviors of the assembly under predetermined and / or known thermomechanical and / or electrical conditions can be used or taken into consideration, for example, by means of experimental methods, ie concrete measurements. A knowledge or prediction of a past, current and / or future behavior or state of the electrical assembly associated with the given model or modeling advantageously enables a particularly accurate, reliable, effective and efficient control of the electrical assembly, ie a correspondingly advantageous minimization of the expansion difference - Approximately the expansion differences within the electrical ^¬ rule module.

Now the future as a ^¬ ges behavior of the assembly can for instance be predicted or estimated by means of modeling. This in turn allows a preventive control of the at least one active control element, in order to avoid, for example, anticipated thermomechanical Belastungsspit ^¬ zen or intercept their effects. For example, a thermomechanical inertia that can delay an influence or an effect of the control signal, that is to say the activation of the active influencing element, can be considered or compensated.

The modeling of the thermomechanical behavior can also effectively and efficiently control even ermögli ^¬ chen, for example, when not every single component of the assembly is monitored by an individual sensor. This is the case because, by means of the model, a The number of measured data, for example, on a thermo-mechanical state, can also be concluded from those components or partial areas of the module that are not detected or monitored by the sensor system. Overall, this integration or combination of the local sensor system in or on the module makes it possible to the modeling of the thermo-mechanical behavior of the assembly and the actively controlled influencing ^¬ tion of the module by means of the active influencing element in dependence on the modeled behavior and the measurement data of the sensor, an electrical assembly with improved thermo-mechanical behavior, improved

Achieve performance or resilience and / or extended life.

It should be explicitly noted here that the actively influenced component can be influenced independently of a possible electrical and / or signal and / or data processing functionality of this component. Thus, it is also possible for example to actively influence those components which are not actively and directly involved in electrical activity and / or signal or data processing within the electrical assembly. This clearly distinguishes the present invention from previous approaches of a mere load management, which, for example, a clock frequency of a computing or processing unit (CPU, Central Processing Unit) in

Depending on a temperature of this arithmetic or processor device vary or regulate.

In a further advantageous embodiment of the method according to the invention, the model or the modeled behavior of the module takes into account a respective influence of the sensor system and the at least one active influencing element on the thermal and / or mechanical behavior of the module. As a result, a real thermo-mechanical state and a real thermo-mechanical behavior of the electrical assembly can be modeled with particular accuracy, ie be imaged and / or predicted. Particularly advantageous ^¬ way can this modeling, development process, for example, in an unloading or a manufacturing method for the electrical assembly, are used to an optimum arrangement or positioning of the sensor system and / or the at least one active control element to determ ^¬ men, for example, a performance or belast ^¬ bility to maximize the electrical assembly.

In a further advantageous embodiment of the inventive method are detected spatially and temporally resolved at least one tempera ^¬ turgradient within the assembly and / or a shape ^¬ and / or dimensional change of at least one component of the assembly as the measurement data. For this purpose, the sensors can have a plurality of individual sensors in order to detect or determine a spatial and temporal course of the detected measured variables. This can advantageously enable a particularly accurate and effective influencing of the thermo-mechanical properties of the assembly, ie a particularly effective and efficient control of the electrical assembly.

The detection of a temperature gradient is particularly advantageous, since temperature gradients form a significant influencing factor or a significant cause of expansion differences within assemblies. Detecting the shape and / or dimensional change can for example be particularly advantageous if the respective temperature of its Forum and / or dimension changing device can not or can not be accurately detected and / or beispielswei ^¬ se varied within the device and / or then when the thermal expansion coefficient of the respective Bauele ^¬ mentes is not known. The detection of the change in shape and / or dimension may be possible, for example, by means of a sensor arranged on respective outer sides of the component. For a precise temperature measurement, however, for example, an arrangement of a temperature sensor in a central region of the respective component necessary which, for example, due to a Packagings

and / or a high functional density is not always feasible. Likewise, it may be difficult to determine an effective coefficient of thermal expansion of the device at varying within the jewei ^{¬ age} device temperature and / or in a structure of the device of a plurality of different materials. These difficulties can be avoided by detecting the changes in shape and / or dimension.

In a further advantageous embodiment of the inventive method a respective temperature ^¬ turänderung the at least one component and a second component of the assembly is detected by the sensor. By actively influencing at least one of these two components, their thermal expansions are adapted to each other. In other words, for example, at a Tempe ^¬ raturänderung two components through the active Beeinflus ^¬ solution the condition

set or ensured for the two components, where oii the coefficient of thermal expansion of the first component, ₂ the thermal expansion coefficient of the second component, ΔΘι the temperature change of the first component and ΔΘ ₂ the temperature change of the second

Indicates component. The relative changes in length of the two components should therefore be the same. The thermal expansion caused by the respective temperature change can be positive for heating and negative for cooling. A negative thermal expansion here means example ^¬, a contraction or contractive Längenände ^¬ tion. By separately detecting the respective temperature changes of the two components, a particularly accurate adaptation, ie approximation of the thermal expansions of the two components can be achieved. By adapting or equalizing the thermal expansions, therefore, the expansion difference between the two components is minimized, in particular ideally to zero. In a further advantageous embodiment of the inventive mechanical contact between at least two Bauele ^¬ elements of the assembly by means of the active influencing ^¬ elements in response to the control signal, a heat-conducting sealing, established or interrupted. The actively influenced at least one component can be one of the at least two components, between which the contact is made or interrupted. However, it is also possible that, as a result of the active influencing of the at least one component, approximately a second component is indirectly influenced and brought into contact with a third component or such a contact between the second and the third

Component is interrupted. A mechanical contact in this sense exists when the at least two Bauelemen ^¬ te, in particular directly, touch.

Since the expansion difference minimized by means of the present invention is particularly relevant for the operation of the electrical assembly, especially at high temperatures, temperature changes, temperature gradients and / or power densities, the present invention can be particularly advantageous for power electronic assemblies, electric drives, inverters and the like and be used profitably.

The properties and refinements of the electrical assembly according to the invention and the corresponding advantages given heretofore and hereinafter are mutatis mutandis applicable to the method according to the invention and / or components or devices used or usable for carrying out the method according to the invention and vice versa. Thus, the invention also includes such developments of the electrical assembly according to the invention and of the method according to the invention which have configurations which are not explicitly described here in the respective combination. Further features, details and advantages of the present invention will become apparent from the following description of preferred embodiments and from the drawing. The single figure shows a schematic and geschnit ^¬ tene side view of an electrical assembly with a sensor and several controllable active influencing elements for actively influencing a thermal and / or mechanical property of the assembly.

The exemplary embodiments explained below are preferred embodiments of the invention. In the exemplary embodiments, the described components of the embodiments in each case represent individual features of the invention that are to be considered independently of one another, which also develop the invention independently of one another and thus also individually or in a different combination than the one shown as part of the invention. Furthermore, the described embodiments can also be supplemented by further features of the invention already described.

The single FIGURE shows a schematic and sectional side view of an electrical or electronic see assembly 1 in an exemplary construction. In the present case, the electrical assembly 1 has a base element 2, which may be, for example, a cooling element or heat sink. In the vertical direction of the electrical assembly 1 on or above the base element 2 is a

Ceramic member 3 is arranged, which may be, for example, be a ceramic substrate for a direct bonded copper structure structural ^¬ (DBC, English "Direct Bonded Copper", also DCB, "Direct Bonded Copper"). The ceramic element 3 can be used as the main heating path for dissipating heat from overlying parts of the electrical assembly 1 towards the

Base element 2 serve. It is particularly advantageous that the ceramic element 3 can have a high thermal conductivity and at the same time as an electrical insulator, such as can serve over the example metallic base element 2.

Above the ceramic member 3, a power semiconductor element 4 is arranged in the present case, which is bordered laterally by elekt ^¬ driven insulating support members. 5 The

Support elements 5 can serve as supporting surfaces for an arranged above the power semiconductor element 4 Hauptverdrah ^¬ tung carrier 6 of the electric module. 1 By the mechanically stable support elements 5 can be avoided that the power semiconductor element 4 is damaged for example in a joining of the electrical assembly by mechanical pressure. The main wiring carrier 6 serves in particular as a carrier or substrate for an electrical line network 7, which in the present case and also further

Subareas of the electrical assembly 1 interspersed. It should be noted here that not all individual parts or Teilbe ^¬ rich of the pipeline network, including all seven PLEASE CONTACT ^¬ stanchions and the like explicitly identified. On the main wiring substrate 6, however, are as components of the

Line network 7 two contacts 8 for a above the main wiring substrate 6 arranged surface-mounted device (SMD, "surface-mounted device") 9 is arranged and labeled ^¬ .

Furthermore, the electrical assembly 1 has a sensor with a plurality of spatially distributed in or on different components of the electrical assembly 1 arranged sensors 10. The sensors 10 may be the same or different types, for example temperature sensors, pressure sensors or sensors for detecting mechanical stresses,

Movements, shape or extent changes. By means of

Sensors 10, for example, a temperature field and / or mechanical variables such as bends or contractions within the electrical assembly 1 can be detected spatially and temporally resolved. Corresponding measured values or measured data acquired by the sensors 10 are transmitted to a control unit, not shown here. The control unit can, for example, wise be designed as a microchip or microcontroller and / or be part of the power semiconductor element 4. For example, parts of the pipeline network 7 of the electrical module 1 can be used to transmit the measured data. Appropriate contacts or connections of the individual sensors 10 are here for reasons of clarity is not explicitly Darge is ^¬. Likewise, for example, a wireless transmission of the measured data to the control unit may be possible. Against the background of increasing miniaturization and an increasing functional and power density within devices such as the electrical assembly 1, it can be observed that thermal expansion and / or different coefficients of thermal expansion of the components of the electrical assembly 1 can lead to erroneous expansion and mechanical stress Damage and / or premature aging of the electrical assembly 1 can lead. To counter this problem, the electrical

Assembly in the present case on several active influencing elements 17, which are spatially distributed in or on different components of the electrical assembly 1 are arranged. Thus, the measurement data detected by the sensors 10 characterize a thermal and / or mechanical, thermomechanical so short, the electrical property compo ^¬ pe 1 and of the respective component in or on which a respective one of the sensors 10 is arranged. By contrast, a thermomechanical property of the electrical assembly 1 or of the respective component can be influenced by means of the active influencing elements 17. For this purpose, the control unit can generate respective control signals for the active influencing elements 17 as a function of the measurement data provided by the sensors 10 and transmit them to them. Also here are appropriate

Connections are not shown for the sake of clarity, where also a wireless transmission of the respective

Control signals may be possible.

In the present case, for example, a first sensor 11 and a first active influencing element 18 are integrated in the base element 2. In the ceramic element 3 is a second

Sensor 12 and a second active influencing element 19 integrated. In the power semiconductor element 4 is integrated or arranged on this, a third sensor 13 and a third active influencing element 20 integrated in the Annual General Meeting ^¬ drahtungsträger 6, a fourth sensor 14, a fifth sensor 15, a fourth active influencing element 21, and a fifth active influencing element 22 On the SMD 9, a sixth sensor 16 and a sixth active influencing element 23 are arranged.

It can, for example, by means of the third sensor 13, a temperature increase of the power semiconductor element 4 and by evaluating the detected by the second sensor 12 and the first sensor 10 measurement data, a temperature field or a

Temperature gradient can be determined, which can extend, for example, from the power semiconductor element 4 through the ceramic member 3 into the base member 2 in. Due to their different functions and consequent different material compositions that can

Power semiconductor element 4, the ceramic element 3 and the base element 2 significantly different thermal

Have expansion coefficients. The temperature gradient between these components could thus lead to different thermal expansions or changes in length of these components without further measures.

In order to avoid or compensate for such erroneous expansions, for example, the second active influencing element 19 can be designed as a heating element and be used to heat the ceramic element 3, by a difference of the thermal expansion coefficients of the

Ceramic element 3 and the power semiconductor element 4th on the one hand and / or the ceramic element 3 and the Basisele ^¬ ment 2 on the other hand compensate. By the means of the second active influencing element 19 increased temperature of the ceramic element 3 so then the otherwise possible incorrect expansion can be avoided or reduced so far that it does not damage the electrical assembly 1.

In particular, the temperatures or the temperature field can be detected or determined not only locally, but also in time. Thus, an active temperature or temperature field management may be provided to achieve a minimization of effective mis-expansion by reducing local expansion differences. As the goal of the appropriate control or regulation can be achieved or fulfilled the condition

Oi _n · q _n (t) = _m · q _m (t) = ...

be given, where _η , _m , ... the thermal expansion ^¬ coefficients of the different components and q _n (t), q _m (t), ... indicate the respective time-dependent temperature or temperature change ^¬ .

In another example, the main wiring substrate 6 and the SMD 9 may have different thermal expansion coefficients. The SMD 9 can be sensitive to a heat influence or a temperature increase, for example. Is then by the fifth sensor 15 and the sixth sensor 16, a Temperaturdiffe ^¬ rence between the main wiring substrate 6 and the SMD 9 determines, a without further action from the alternative ^¬ ell resulting incorrect expansion can not be compensated for by heating the SMD 9 usefully as this could lead to thermal damage of the SMD 9. However, a balancing of the respective false expansion may still be desirable to avoid, for example, a Beschädi ^¬ supply of an electrical connection of the SMD 9 to the mains 7 to the contacts. 8 In such a case, the fifth active influencing element 22 be formed for example as a mechanical actuator.

By means of the fifth active influencing element 22, a mechanical force can then be exerted on the main wiring carrier 6 in order, for example, to compensate for unequal bending of the main wiring substrate 6 resulting from a temperature difference or temperature change compared with a bending or deformation of the SMD 9 or the contacts 8. The main wiring substrate 6 can thus by means of the fifth active control element 22 running in the opposite direction are bent to a caused by the change in temperature or a temperature gradient bending to maintain a straight, neutral position and shape or the Verbie ^¬ gene at a corresponding position and / or shape change of the SMD 9 and / or the contacts 8 to match. An active mechanical influence by means of the active influencing elements 17 thus provides one to the thermal

Influencing the alternative possibility to avoid missing expansions in the electrical assembly 1 or compensate.

Overall, the described use of avoidance or minimization of erroneous expansions as acting on the components of the electrical assembly 1 stress factors by a thermo-mechanical influence on the electrical assembly 1 or individual components to minimize the

Missing expansion taking into account a respective

Temperature or temperature change or respective temperature differences and respective differences of the respective thermal expansion coefficients dynamically compensated electrical assemblies relationship ^¬ structures, which thus have over conventional electrical assemblies or structures an improved thermo-mechanical behavior. Reference sign list

1 electrical assembly

2 base element

3 ceramic element

4 power semiconductor element

5 support elements

6 main wiring carrier

7 line network

8 contacts

9 SMD / Surface Mounted Device

10 sensors

11 first sensor

12 second sensor

13 third sensor

14 fourth sensor

15 fifth sensor

16 sixth sensor

17 active influencing elements

18 first active influencing element

19 second active influencing element

20 third active influencing element

21 fourth active influencing element

22 fifth active influencing element

23 sixth active influencing element

Claims

claims

1. Electrical assembly (1), comprising a sensor (10), characterized in that

the assembly (1) at least one controllable active Beeinf ^¬ lussungselement (17) and having connected thereto Steuerge advises ^¬ which from the sensor (10) provided measurement data that a thermal and / or mechanical

Characterized characteristic of the module (1), processed to a control signal for the at least one active influencing ^¬ lussungselement (17), which in response to the control ^¬ signal by actively influencing at least one compo ^¬ element (2, 3, 4, 5, 6 , 7, 9) of the assembly (1) influences the thermal and / or mechanical property of the assembly (1) and thereby an expansion difference between at least two components (2, 3, 4, 5, 6, 7, 9)

Assembly (1) minimized.

2. Electrical assembly (1) according to claim 1, characterized marked by the fact that the at least one active Beeinflussungsele ^¬ element (17) comprises a heating element.

3. Electrical assembly (1) according to any one of the preceding claims, characterized in that the at least one active-influencing element (17) comprises an actuator, ^¬ re insbesonde a piezo element and / or a bimetal element.

4. Electrical assembly (1) according to any one of the preceding claims, characterized in that the sensor (10) comprises a plurality of, on different components (2, 3, 4, 5, 6, 7, 9) of the assembly (1) arranged sensors ( 10, 11, 12, 13, 14, 15, 16) having a respective thermal

and / or mechanical condition of the various components (2, 3, 4, 5, 6, 7, 9).

5. A method for controlling an electrical assembly (1), characterized in that - Measured by a control device of a sensor (10) of the module (1) provided measurement data, which characterize a ther ^¬ mixing and / or mechanical property of the module (1) and to a control signal for at least one active influencing element (17) of the construction ^¬ group (1) are processed, and

- by means of the at least one active control element (17) by actively influencing at least one Bauele ^¬ member (2, 3, 4, 5, 6, 7, 9) of the assembly (1) in dependence on the control signal, the thermal and / or mechanical influences ^¬ specific property of the assembly (1) and thereby a difference in expansion between at least two Bauele ^¬ elements (2, 3, 4, 5, 6, 7, 9) of the module (1) is minimized.

6. The method according to claim 5, characterized in that a thermal and / or mechanical behavior of the assembly (1) is mathematically modeled and the control signal in

Depending on the modeled behavior is generated.

7. The method according to claim 6, characterized in that the modeled behavior has a respective influence of

Sensor (10) and the at least one active influencing ^¬ sungselements (17) on the thermal and / or mechanical behavior of the assembly (1) taken into account.

8. The method according to any one of claims 5 to 7, characterized in that as the measurement data of at least a Tempe ^¬ raturgradient within the assembly (1) and / or a shape ^¬ and / or dimensional change at least one component (2, 3, 4, 5 , 6, 7, 9) of the module positioned spatially and temporally ^¬ triggers are detected.

9. The method according to any one of claims 5 to 8, characterized in that

- By means of the sensor (10) a respective change in temperature of the at least one component (2, 3, 4, 5, 6, 7, 9) and a second component (2, 3, 4, 5, 6, 7, 9) of the construction ^¬ group (1) is recorded and - By the active influence of at least one of these two components (2, 3, 4, 5, 6, 7, 9) whose thermal expansions are adapted to each other.

10. The method according to any one of claims 5 to 9, characterized in that by means of the active Beeinflussungsele ^¬ member (17) in response to the control signal a wärmelei ^¬ sealing, mechanical contact between at least two Bauele ^¬ elements (2, 3, 4, 5 , 6, 7, 9) of the assembly (1) is made or broken.