WO2018227492A1 - 用于电子设备的按键装置及电子设备 - Google Patents

用于电子设备的按键装置及电子设备 Download PDF

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Publication number
WO2018227492A1
WO2018227492A1 PCT/CN2017/088498 CN2017088498W WO2018227492A1 WO 2018227492 A1 WO2018227492 A1 WO 2018227492A1 CN 2017088498 W CN2017088498 W CN 2017088498W WO 2018227492 A1 WO2018227492 A1 WO 2018227492A1
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WO
WIPO (PCT)
Prior art keywords
plate
panel
support plate
capacitor
fpc
Prior art date
Application number
PCT/CN2017/088498
Other languages
English (en)
French (fr)
Inventor
陈土江
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2017/088498 priority Critical patent/WO2018227492A1/zh
Priority to CN201790000097.3U priority patent/CN209375608U/zh
Publication of WO2018227492A1 publication Critical patent/WO2018227492A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/965—Switches controlled by moving an element forming part of the switch
    • H03K17/975—Switches controlled by moving an element forming part of the switch using a capacitive movable element

Definitions

  • the embodiments of the present application relate to pressure detection technologies, and in particular, to a button device and an electronic device for an electronic device.
  • the pressure sensing function also known as the pressure sensing function, provides a differentiated user experience by providing users with multi-dimensional input that meets diverse user needs.
  • the detection of the pressing operation of the electronic device can be mostly realized by a conventional mechanical button.
  • mechanical buttons typically require holes in the electronics to place the mechanical buttons.
  • this may cause problems such as poor dustproof and waterproof performance of the electronic device, thereby limiting the service life of the electronic device.
  • the embodiment of the present application provides a button device and an electronic device for an electronic device to replace the traditional mechanical button, thereby improving the service life of the electronic device.
  • An embodiment of the present application provides a button device for an electronic device, where the button device includes a parallel plate capacitor, and a plate of the parallel plate capacitor can be deformed when the operation region of the button device is pressed to change The plate spacing of the parallel plate capacitors;
  • the plate of the parallel plate capacitor is provided with electrical connection leads for connecting to the signal detecting device of the electronic device;
  • the button device includes: a panel for setting the operation area and a first plate, the panel is a metal panel, and a deformable dielectric layer is disposed between the panel and the first plate to form the parallel Board capacitor, or;
  • the button device includes: a panel for setting the operation area, a first plate and a second plate; the first plate is disposed at a position close to the panel, and the second plate is disposed away from the Panel a position between the first plate and the second plate is provided with a deformable dielectric layer to form the parallel plate capacitor.
  • the embodiment of the present application further provides an electronic device, including an electronic device body, where the electronic device body is provided with a button device for an electronic device as described above, and the electronic device body is further provided with a signal detecting device and processing Device
  • the signal detecting device is configured to receive a plate voltage signal corresponding to an operation area of the parallel plate capacitor output by the button device, and determine a voltage change value caused by a capacitance change of the parallel plate capacitor corresponding to the operation area;
  • the processor is configured to determine a pressing condition of the operating area according to the voltage difference value output by the signal detecting device.
  • the button device comprises a parallel plate capacitor, and the plate of the parallel plate capacitor can be deformed when the operation region of the button device is pressed to change the parallel plate a plate pitch of the capacitor, and an electrode of the parallel plate capacitor is provided with an electrical connection lead for connecting to the signal detecting device of the electronic device;
  • the button device may include: a panel and a first plate for setting the operating area, The panel is a metal panel, and a deformable dielectric layer is disposed between the panel and the first pole to form the parallel plate capacitor; or the button device comprises: a panel for setting the operation area, a first plate and a second a plate, the first plate is disposed at a position close to the panel, the second plate is disposed at a position away from the panel; and a deformable dielectric layer is disposed between the first plate and the second plate
  • the parallel plate capacitor is formed.
  • the button device can detect the pressure change of the pressing operation in the operating area of the button device by detecting the capacitance change of the parallel plate capacitor, instead of the traditional mechanical button, the processing of the electronic device can be avoided, and the sealing is not required. Rings and other structural parts, effectively avoiding waterproof and dustproof failure caused by opening, sealing ring aging and structural parts wear, effectively ensuring the waterproof and dustproof effect of electronic equipment, and high reliability, thereby improving the service life of electronic equipment .
  • FIG. 1A is a schematic diagram of application of a button device according to various embodiments of the present application.
  • FIG. 1 is a schematic structural diagram 1 of a button device for an electronic device according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram 2 of a button device for an electronic device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram 3 of a button device for an electronic device according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram 4 of a button device for an electronic device according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram 5 of a button device for an electronic device according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural diagram 6 of a button device for an electronic device according to an embodiment of the present disclosure
  • FIG. 7 is a schematic structural diagram 7 of a button device for an electronic device according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram 8 of a button device for an electronic device according to an embodiment of the present application.
  • FIG. 8A is a schematic structural diagram of a gasket according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram 1 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic structural diagram 2 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram 3 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural diagram 3 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 13 is a schematic structural diagram 5 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 14 is a schematic structural diagram 6 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 15 is a schematic structural diagram 7 of an electronic device according to an embodiment of the present application.
  • Vcom reference signal
  • Vdrv drive signal
  • Rf1, Rf2, R1, R2 resistance
  • the button device provided in the following embodiments of the present application can be applied to any electronic device having a pressure sensing function, such as a smart phone, a notebook computer, a wearable device, and a household electrical appliance, and uses a capacitance change to perform pressure detection to realize a pressure sensing function, thereby Replace the traditional mechanical buttons to detect the pressing operation.
  • a pressure sensing function such as a smart phone, a notebook computer, a wearable device, and a household electrical appliance
  • FIG. 1A is a schematic diagram of application of a button device according to various embodiments of the present application.
  • the button device can be located, for example, on a side frame of the electronic device to replace a conventional mechanical button, such as a volume button or a power button.
  • buttons device can also be located at other locations of the electronic device, and FIG. 1A is only one type. The selected examples are not limited in this application.
  • the key device for an electronic device provided by the embodiment of the present application is described below in conjunction with a plurality of examples.
  • FIG. 1 is a schematic structural diagram 1 of a button device for an electronic device according to an embodiment of the present application.
  • the key device 10 includes a parallel plate capacitor 11, and the plates of the parallel plate capacitor 11 can be deformed when the operation area of the key device 10 is pressed to change the plate pitch of the parallel plate capacitor 11.
  • the electrode plates of the parallel plate capacitor 11 are provided with electrical connection leads 12 for connection to the signal detecting means of the electronic device.
  • the operation area of the button device 10 can be disposed on the panel of the button device 10, and the operation area can cover the entire area of the panel or cover a partial area of the panel.
  • the user can operate the button device 10 within the operating area, which can be referred to as a user operating area.
  • At least one pressing zone may be provided in the operating zone, each pressing zone being operable to receive an input pressing operation.
  • FIG. 1 illustrates two pressing regions, such as a pressing region 1 and a pressing region 2 .
  • the pressing region of the button device 10 can also be provided with a pressing region or more pressing regions, and no longer Narration.
  • the force of the operation area is transmitted to the plates of the parallel plate capacitor 11, so that the plates of the parallel plate capacitor 11 are deformed.
  • the pressing region 1 of the operation area As an example, when the pressing region 1 is pressed, the pressure applied to the pressing region 1 is transmitted to the plate of the parallel plate capacitor 11 corresponding to the pressing region 1, so that the electrode plate is deformed.
  • one plate of the parallel plate capacitor 11 can be deformed while the other plate is fixed, i.e., no deformation occurs, thereby causing variations in the plate spacing.
  • both plates of the parallel plate capacitor 11 are deformed, wherein one plate is deformed more than the other plate, and the plate spacing can be varied.
  • the plates of the parallel plate capacitors 11 may be electrically conductive members within the electronic device, such as two plate-like structures or approximately plate-like structures adjacent to each other within the electronic device, which are both parallel to each other, both of which are capable of conducting electrons.
  • Flexible Printed Circuit FPC
  • metal support board or the conductive member such as a metal panel can transmit electrons. Therefore, the plate of the parallel plate capacitor 11 can be an FPC, a metal support plate, a metal panel, or the like, or can be a combination of the above various types.
  • the dielectric layer between the two plates of the parallel plate capacitor 11 may be a deformable dielectric layer.
  • the deformable dielectric layer may be a gaseous medium layer such as an air dielectric layer or the like, or may be another solid medium layer such as a glue layer, or a partial region may be a gaseous medium layer, and a partial region is a solid medium layer. This is a limitation.
  • the pressing operation of the operation area causes the plate of the parallel plate capacitor 11 corresponding to the operation area to be deformed, so that the plate spacing of the parallel plate capacitor 11 is changed, so that the The capacitance value of the parallel plate capacitor 11 corresponding to the operation area changes.
  • the pressing area 1 of the operation area as an example, when the pressing area 1 is pressed, the pressing operation of the pressing area 1 causes the plate of the parallel plate capacitor 11 corresponding to the pressing area 1 to be deformed, so that the plate of the parallel plate capacitor 11 is deformed.
  • the pitch changes to change the capacitance value of the parallel plate capacitor 11 corresponding to the pressing region 1.
  • the electrical connection leads 12 on the plates of the parallel plate capacitors 11 may be located at the positions of the corresponding operating regions on the plates of the parallel plate capacitors 11, for example, on the plates of the parallel plate capacitors 11 corresponding to each of the pressing regions in the operating region. Location.
  • the plate voltage signal of the parallel plate capacitor 11 can be transmitted to the signal detecting means, so that the signal detecting means can be based on the parallel plate capacitor
  • the plate voltage signal corresponding to the operation area of the operation area determines the voltage change value caused by the capacitance change of the parallel plate capacitor 11 corresponding to the operation area, and then the processor determines the button device 10 according to the voltage change value output by the signal detection device. The pressing condition of the operating area.
  • the processor may determine a corresponding pressing force on the operating area according to the voltage change value, and then if the pressing force is greater than or equal to a preset threshold, determining that a pressing operation at the operating area of the button device 10 is generated, and then Corresponding processing is executed in accordance with the pressing operation.
  • the button device for an electronic device includes a parallel plate capacitor, and the plate of the parallel plate capacitor can be deformed when the operation region of the button device is pressed to change the plate spacing of the parallel plate capacitor, and the parallel plate
  • An electrical connection lead is provided on the electrode plate of the capacitor for connection to a signal detecting device of the electronic device.
  • the button device can detect the pressure change of the pressing operation in the operating area of the button device by detecting the capacitance change of the parallel plate capacitor, instead of the traditional mechanical button
  • the key can avoid the opening of the electronic equipment, without the need to set the sealing ring and other structural parts, effectively avoiding the waterproofing and dustproof failure caused by the opening, the sealing ring aging and the structural parts, etc., and effectively ensuring the waterproof of the electronic equipment.
  • the dustproof effect and high reliability increase the service life of the electronic device.
  • each plate in the button device can multiplex the conductive members in the electronic device, thereby reducing the manufacturing process and cost of the electronic device; and the button device replaces the mechanical button, so that the appearance of the electronic device has no mechanical button There is no need to add additional components, making the appearance of the electronic device more compact.
  • the electronic device can be provided with a mechanical button, and only a mark on the appearance of the button device is required.
  • the button device can be disposed on the side frame of the electronic device to implement a side trigger operation to ensure the screen ratio of the electronic device.
  • the side borders are usually narrow. If mechanical buttons are arranged on the side borders, the display performance of the curved screen or ultra-thin screen of such electronic devices is undoubtedly limited. . Therefore, for such an electronic device, the button device according to the present application is used, and the traditional mechanical button is replaced, and the display performance of the curved screen or the ultra-thin screen can be effectively ensured while ensuring the proportion of the screen of the electronic device, and It can also ensure the surface of the screen and the demand for ultra-thin.
  • the panel on the button device may be used as one plate of the parallel plate capacitor, and the other plate may be disposed on the inner side of the panel toward the electronic device.
  • the panel is an operation panel provided with an operation area, and therefore, when the operation area on the panel is pressed, the panel itself is deformed to change the plate spacing of the parallel plate capacitor; in another mode, the panel may face the electron Two plates are disposed on the inner side of the device to form a parallel plate capacitor. When the operation area on the panel is pressed, the pressing operation is transmitted to the plate adjacent to the panel, so that the plate is deformed to make the plate of the parallel plate capacitor The spacing changes.
  • FIG. 2 is a schematic structural diagram 2 of a button device for an electronic device according to an embodiment of the present application.
  • the embodiment uses a panel on a button device as one plate of a parallel plate capacitor.
  • the button device 10 may include: a panel 111 and a first plate 112 for setting the operation area, the panel 111 is a metal panel, and a deformable dielectric layer is disposed between the panel 111 and the first plate 112. To form a parallel plate capacitor 11.
  • the panel 111 and the first plate 112 can serve as two plates, respectively, and the dielectric layer between the panel 111 and the first plate 112 is combined to form a parallel plate capacitor 11.
  • the operation area may be disposed on the panel 111.
  • the force of the operation area may cause the panel 111 to be deformed, thereby causing the plate spacing of the parallel plate capacitor 11. A change has occurred.
  • the plate spacing of the parallel plate capacitor 11 changes, and the dielectric layer between the face plate 111 and the first plate 112 is also deformed.
  • the panel 111 If the panel 111 is used as a plate, the panel 111 needs to be grounded.
  • the existing panel in the electronic device is used as one of the parallel plate capacitors, and the parallel plate capacitor can further simplify the internal structure of the button device, facilitate the installation of the button device, and the like. Improve the integration inside the button device and improve the integration of electronic devices to meet the needs of thin and light electronic devices.
  • the dielectric layer between the two plates of the parallel plate capacitor may be a deformable dielectric layer.
  • the deformable dielectric layer may be a gaseous medium layer such as an air dielectric layer or the like, or may be other solid medium layers such as a glue layer, or a partial region may be a gaseous medium layer, and a partial region may be a solid medium layer.
  • FIG. 3 is a schematic structural diagram 3 of a button device for an electronic device according to an embodiment of the present application. Figure 3 further provides an implementation of the dielectric layer between the plates of the parallel plate capacitors based on the embodiment of Figure 2.
  • the portion of the dielectric layer shown in FIG. 2 corresponding to the operation area may be provided with a glue layer, which may include various types of adhesive materials, such as double-sided tape.
  • the portion other than the glue layer may not be filled, that is, it may be an air dielectric layer.
  • the portion of the dielectric layer corresponding to the operation region is provided with a glue layer, the force on the operation region can be transmitted to the first electrode plate 112 through the glue layer, so that the first electrode plate 112 is deformed.
  • the glue layer disposed in the portion of the dielectric layer corresponding to the operation area may be such that the glue layer is used as the medium of the parallel plate capacitor 11.
  • the dielectric layer is located between the panel 111 and the first plate 112.
  • the glue layer disposed in the dielectric layer enables the panel 111 to be connected to the first plate 112 through the glue layer, thereby avoiding the panel 111 and the first plate. 112 moves in other directions than the direction of the plate spacing, avoiding the button device 10
  • the looseness of each device ensures the service life of the button device 10.
  • the above embodiment adopts the panel on the button device as one plate of the parallel plate capacitor, and the other plate of the parallel plate capacitor may be located inside the panel, and the material thereof may be a flexible plate such as FPC or a rigid metal support plate. .
  • the first plate 112 shown in FIG. 3 is an FPC
  • the first plate 112 is provided with at least one support plate on a side facing away from the panel 111.
  • the first plate 112 is an FPC
  • the FPC is relatively flexible and the rigidity is poor, the support to the panel 111 is poor. Therefore, in order to ensure the secure mounting of the devices in the button device 10, the first plate 112 can be provided. At least one support plate is fixed to a side facing away from the panel 111.
  • FIG. 4 is a schematic structural diagram 4 of a button device for an electronic device according to an embodiment of the present application.
  • FIG. 4 shows an embodiment in which the first plate 112 is fixed with a first support plate 114 and a second support plate 115 on a side facing away from the panel 111.
  • the first support plate 114 and the second support plate 115 may be metal support plates or non-metal support plates such as plastic support plates.
  • the first support plate 114 can be attached to the FPC, that is, in direct contact.
  • a gap may be formed between the first support plate 114 and the second support plate 115, and a portion corresponding to the operation region may not be filled in the gap, that is, an air dielectric layer, and a portion other than the air dielectric layer may be provided with a glue.
  • the layer is such that the first support plate 114 and the second support plate 115 are bonded by a glue layer.
  • a central portion of the gap may be provided with a glue layer, and both ends of the central portion of the gap may also be respectively provided with a glue layer, so that the portion outside the glue layer in the gap is an air medium.
  • Floor a glue layer
  • FIG. 4 is only an optional example.
  • the glue layer may be disposed only in the central portion, such that the portion other than the central portion is an air dielectric layer.
  • the present application provides The button device does not limit this.
  • the area occupied by the glue layer may be larger than the area occupied by the central portion of the glue layer in the gap shown in FIG. 4 to ensure the first support plate 114 and the second support plate.
  • the glue layer is only disposed in the central portion, which can effectively avoid the crosstalk problem between the parallel plate capacitors corresponding to different pressing regions in the operation region, so that the detection of the pressing operation in the operating region can be better and more accurate, and the button can be effectively guaranteed.
  • the performance of the device improves the user experience.
  • the specific structure of the panel 111 may be enclosed outside the outermost support plate, and at least one spacer 117 is disposed between the panel 111 and the outermost support plate.
  • the outermost support plate may be, for example, a second support plate 115 as shown in FIG. 4, and the at least one spacer 117 may be disposed between the panel 111 and the second support plate 115.
  • FIG. 4 is exemplified by a spacer 117.
  • the gasket 117 may be referred to as a pre-pressure gasket.
  • the spacer 117 can pre-press the panel 111, the first plate 112 and the support plates in the button device 10, so that the panel 111 is completely bonded to the first plate 112, the first plate 112 and the support plates to ensure complete bonding. The mounting reliability in the key device 10 is obtained.
  • FIG. 5 is a schematic structural diagram 5 of a key device for an electronic device according to an embodiment of the present disclosure. Different from the embodiment shown in FIG. 2-4, the embodiment may separately provide two panels on the inner side of the electronic device. The plates are formed to form parallel plate capacitors.
  • the button device 10 may include a panel 111 that sets the operation area, a first plate 112, and a second plate 118. The first plate 112 is disposed at a position close to the panel 111, and the second plate 118 is disposed at a position away from the panel 111. A deformable dielectric layer is disposed between the first plate 112 and the second plate 118 to form a parallel plate capacitor 11.
  • the panel 111, the first plate 112, and the second plate 118 in FIG. 5 may be sequentially disposed in a top-down order, wherein the panel 111 is located at the outermost side, and the first plate 112 is disposed adjacent to the panel 111.
  • the second plate 118 is remote from the panel 111.
  • the first plate 112 and the second plate 118 can be respectively formed as two plates combined with the dielectric layer between the first plate 112 and the second plate 118 to form a dielectric layer.
  • Parallel plate capacitor 11 11.
  • the operating area may be located on the panel 111.
  • the force of the operating area may be transmitted to the first plate 112 through the panel 111 such that the first plate 112
  • the deformation is caused such that the distance between the first plate 112 and the second plate 117, that is, the plate spacing of the parallel plate capacitor 11, changes.
  • the corresponding embodiment of FIG. 5 is not limited to the material of the panel, and the panel 111 may be a metal panel or a non-metal panel such as a plastic panel.
  • two plates other than the panel in the electronic device can be used as the parallel plate capacitor, and the material of the panel is not limited, so that the button device has wider applicability.
  • the two plates of the parallel plate capacitor may be two flexible plates such as an FPC or two rigid metal support plates.
  • One plate of the parallel plate capacitor may be a flexible plate and the other plate is a rigid metal support plate.
  • the first plate 112 and the second plate 118 may both be FPCs.
  • FIG. 6 is a schematic structural diagram 6 of a button device for an electronic device according to an embodiment of the present disclosure.
  • FIG. 6 illustrates an example in which both plates are FPCs.
  • the first plate 112 may be a first FPC
  • the second plate 118 may be a second FPC
  • a deformable dielectric layer is disposed between the first FPC and the second FPC to form a parallel Plate capacitor 11.
  • the dielectric layer between the two plates of the parallel plate capacitor may be a gaseous medium layer such as an air dielectric layer, or may be other solid medium layers such as a glue layer, or a partial region may be a gaseous medium layer, a partial region. It is a solid dielectric layer.
  • An embodiment of a dielectric layer between the plates of a parallel plate capacitor is provided in FIG. In the embodiment corresponding to FIG. 6, the portion of the dielectric layer corresponding to the operation region may not be filled, that is, may be an air dielectric layer, and a portion other than the air dielectric layer is provided with a glue layer.
  • the air dielectric layer can be employed as the dielectric layer of the parallel plate capacitor 11 in the button device shown in FIG.
  • the dielectric layer is located between the first plate 112 and the second plate 118.
  • the glue layer is disposed in the dielectric layer, the first plate 112 can be connected to the second plate 118 through the glue layer, thereby avoiding The first plate 112 and the second plate 118 are moved in other directions than the distance between the plates, thereby avoiding the looseness of the devices in the button device 10 and ensuring the service life of the button device 10.
  • a central portion of the dielectric layer between the first plate 112 and the second plate 118 may be provided with a glue layer, and a glue layer may be respectively disposed at both ends of the central portion outside the central portion.
  • the portion of the dielectric layer outside the glue layer is an air dielectric layer.
  • FIG. 6 is only an optional example.
  • a glue layer may be disposed only in the central portion, so that portions other than the central portion are air dielectric layers.
  • the provided button device does not limit this.
  • the area occupied by the glue layer may be larger than the central portion of the dielectric layer shown in FIG. The area is to ensure the bonding strength between the first plate 112 and the second plate 118.
  • the crosstalk problem between the parallel plate capacitors corresponding to different pressing regions in the operation region can be effectively avoided, which can make The detection of the pressing operation on the operation area is better and more accurate, effectively ensuring the performance of the button device and improving the user experience.
  • a first support plate 114 is fixed to one side of the first FPC facing the panel 111
  • a second support plate 115 is fixed on a side of the second FPC facing away from the panel 111 .
  • the first plate 112 is the first FPC
  • the FPC is relatively flexible and the rigidity is poor, the support to the panel 111 is poor. Therefore, in order to ensure the firm installation of the devices in the button device 10, the first FPC can be used.
  • the first support plate 114 is fixed to one side of the panel 111.
  • the second plate 118 is the second FPC
  • the FPC is relatively flexible and has poor rigidity
  • the support for the panel 111 and the first plate 112 is also poor, and therefore, the components of the button device 10 are secured.
  • the second support plate 115 can also be fixed on the side of the second FPC facing away from the panel 111.
  • the first support plate 114 and the second support plate 115 are mainly used for supporting in FIG. 6 . Therefore, the first support plate 114 and the second support plate 115 in FIG. 6 may be metal support plates, or may be non- The metal support plate, such as a plastic support plate, may also be one of the support plates being a metal support plate and the other support plate being a non-metal support plate.
  • the portion corresponding to the operation area may be provided with a glue layer, or the first support plate 114 and the panel 111 may be attached to each other. direct contact.
  • This Fig. 6 shows an implementation scenario in which a glue layer is provided between the first support plate 114 and the panel 111 corresponding to the portion of the operation area.
  • the specific structure of the panel 111 may be disposed outside the second support plate 115, and at least one spacer 117 is disposed between the panel 111 and the second support plate 115.
  • Figure 6 is exemplified by a spacer 117.
  • the spacer 117 may be referred to as a pre-pressure pad.
  • the spacer 117 can pre-press the panel 111, the first plate 112, the second plate 118, the first support plate 114 and the second support plate 115 in the button device 10 such that the panel 111 and the first support plate 114, The first plate 112 and the second plate 118, the second plate 118 and the second support plate 115 are completely bonded to each other, thereby ensuring the installation in the button device 10. Rely on sex.
  • One of the first plate 112 and the second plate 118 in FIG. 5 may be an FPC, and the other is a support plate.
  • the support plate is a metal support plate, and a deformable dielectric layer is disposed between the FPC and the support plate.
  • a parallel plate capacitor 11 is formed. If the support plate is a metal support plate, the other support plates in the button device 10 may be metal support plates or support plates of other materials.
  • FIG. 7 is a schematic structural diagram 7 of an electronic device key device according to an embodiment of the present application.
  • Figure 7 illustrates one of the first plate 112 and the second plate 118 which may be an FPC and the other an alternative embodiment of the first support plate.
  • the FPC is disposed adjacent to the panel 111
  • the first support plate 114 is disposed away from the panel 111.
  • the first plate 112 is an FPC
  • the second plate 118 is a first support plate 114.
  • a deformable dielectric layer is disposed between the FPC and the first support plate 114 to form a parallel plate capacitor 11.
  • the first support plate 114 can be grounded.
  • a portion of the dielectric layer corresponding to the operation area may not be filled, that is, an air dielectric layer, and a portion other than the air dielectric layer is provided with a glue layer; or
  • a portion of the dielectric layer corresponding to the operation region may be provided with a glue layer, and a portion other than the glue layer is an air dielectric layer without being filled.
  • the dielectric layer of the parallel plate capacitor 11 formed by the FPC and the first support plate 114 may be an air dielectric layer.
  • a glue layer disposed in a portion of the dielectric layer corresponding to the operation region may be such that the dielectric layer of the parallel plate capacitor 11 formed by the FPC and the first support plate 114 is a glue layer.
  • the glue layer disposed in the dielectric layer between the FPC and the first support plate 114 may also cause the FPC and the first support plate 114 to be bonded by the glue layer.
  • the glue layer may be provided only in the central portion such that portions other than the central portion are air dielectric layers. If a glue layer is provided only in the central portion of the dielectric layer, the area occupied by the glue layer may be larger than the preset area to ensure the adhesive strength between the FPC and the first support plate 114.
  • the glue layer is only disposed in the central portion of the dielectric layer, the crosstalk problem between the parallel plate capacitors corresponding to different pressing regions in the operation area can be effectively avoided, and the detection of the pressing operation on the operation area can be better and more accurate, and the key device can be effectively ensured. Performance to improve the user experience.
  • FIG. 7 is only an example, and a central portion of the dielectric layer may be provided with a glue layer, and both ends of the central portion of the dielectric layer may also be respectively provided with a glue layer, so that the gap is provided.
  • the portion outside the glue layer is an air dielectric layer, however, the key device provided by the present application does not limit this.
  • the FPC disposed close to the panel and the first support plate 114 disposed away from the panel may be used as the two plates to form the parallel plate capacitor 11.
  • the first support plate 114 is away from the panel 111 as one of the plates, and the parallel plate capacitor can be formed on the basis of ensuring the support of the panel 111 and the FPC, so that the internal structure of the button device is simplified and the button is convenient.
  • the installation of the device, etc. can also improve the integration inside the button device and improve the integration of the electronic device to meet the light and thin requirements of the electronic device.
  • the second support plate 115 may be fixed on the side of the FPC facing the panel 111.
  • a portion corresponding to the operation area may be provided with a glue layer between the second support plate 115 and the panel 111 in FIG. 7; or, the second support plate 115 is attached to the panel 111.
  • the second support plate 115 may be in direct contact with the panel 111, that is, it may be bonded, or may be bonded by a glue layer.
  • the specific structure of the panel 111 may be disposed outside the first support plate 114, and at least one spacer 117 is disposed between the panel 111 and the first support plate 114.
  • FIG. 7 is exemplified by a spacer 117.
  • the spacer 117 may be referred to as a pre-pressure pad.
  • the spacer 117 can pre-press the panel 111, the second support plate 115, the FPC and the first support plate 114 in the button device 10 such that the panel 111 and the second support plate 115, the FPC and the first support plate 114 are completely bonded. The installation reliability in the key device 10 is ensured.
  • FIG. 8 is a schematic structural diagram 8 of an electronic device key device according to an embodiment of the present disclosure.
  • FIG. 8 illustrates another one of the first plate 112 and the second plate 118 which may be an FPC and the other of which is an alternative embodiment of the first support plate.
  • the difference between Fig. 7 and Fig. 8 is that the position of the FPC as the plate is different from that of the panel.
  • the first support plate 114 is disposed near the panel 111, and the FPC is away from the surface.
  • the board 111 is set.
  • the second plate 118 is an FPC
  • the first plate 112 is a first support plate 114
  • a deformable dielectric layer is disposed between the FPC and the first support plate 114 to form a parallel plate capacitor 11.
  • the first support plate 114 can be grounded.
  • a portion of the dielectric layer corresponding to the operation area may be an air dielectric layer without filling, and a portion other than the air dielectric layer is provided with a glue layer; or
  • a portion of the dielectric layer corresponding to the operation region may be provided with a glue layer, and a portion other than the glue layer is an air dielectric layer without being filled.
  • the dielectric layer of the parallel plate capacitor 11 formed by the FPC and the first support plate 114 may be an air dielectric layer.
  • the dielectric layer of the parallel plate capacitor 11 formed by the FPC and the first support plate 114 may be a glue layer.
  • the button device 10 can also cause the FPC and the first support plate 114 to be bonded by the glue layer.
  • the glue layer may be disposed only in the central portion such that portions other than the central portion are air dielectric layers. If a glue layer is provided only in the central portion of the dielectric layer, the area occupied by the glue layer may be larger than the preset area to ensure the adhesive strength between the FPC and the first support plate 114.
  • FIG. 8 is only an example.
  • a central portion of the dielectric layer may be provided with a glue layer, and both ends of the central portion of the dielectric layer may also be respectively provided with a glue layer, so that the gap is The portion outside the glue layer is an air dielectric layer, however, the key device provided by the present application does not limit this.
  • the FPC disposed away from the panel 111 and the first support plate 114 disposed adjacent to the panel 111 may be used as the two plates to form the parallel plate capacitor 11.
  • the second support plate 115 may be fixed on a side of the FPC facing away from the panel 111.
  • the first in FIG. Between a support plate 114 and the panel 111, a portion corresponding to the operation area may be provided with a glue layer; or, the first support plate 114 may be attached to the panel 111.
  • the specific structure of the panel 111 may be disposed outside the second support plate 115, and at least one spacer 117 is disposed between the panel 111 and the second support plate 115.
  • An example of a spacer 117 is shown in FIG.
  • the spacer 117 may be referred to as a preload pad.
  • the spacer 117 can pre-press the panel 111, the first support plate 114, the FPC and the second support plate 115 in the button device 10 such that the panel 111 and the first support plate 114, the FPC and the second support plate 115 are completely bonded. The installation reliability in the key device 10 is ensured.
  • FIG. 8A is a schematic structural diagram of a gasket provided by an embodiment of the present application.
  • the spacer 117 as shown in any of the above may be a wedge-shaped structure, which may also be referred to as a wedge, the thickness of the wedge-shaped structure being a gradient-changing spacer.
  • FIG. 9 is a schematic structural diagram 1 of an electronic device according to an embodiment of the present disclosure.
  • the electronic device may include: an electronic device body 90.
  • the electronic device body 90 is provided with a button device 10 for an electronic device according to any one of the above-mentioned FIG. 1 to FIG.
  • a signal detecting device 901 and a processor 902 are also provided.
  • the signal detecting device 901 is configured to receive a plate voltage signal corresponding to the operating region of the parallel plate capacitor output by the button device 10, and determine a voltage change value caused by a change in capacitance of the parallel plate capacitor corresponding to the operating region.
  • the processor 902 is configured to determine a pressing condition of the operating area of the electronic device button device 10 according to the voltage change value output by the signal detecting device.
  • the signal detecting device 901 is connected to the output terminal of the parallel plate capacitor of the button device 10 to receive the plate voltage signal corresponding to each pressing region of the parallel plate capacitor outputted by the electronic device button device 10.
  • the output end of the parallel plate capacitor may be a corresponding operating area on the plate of the parallel plate capacitor Electrical connection leads at the location.
  • the signal detecting device 901 can determine a voltage change value caused by a capacitance change of the parallel plate capacitor corresponding to the operation area according to the plate voltage signal corresponding to the operation area, and transmit the voltage change value to the processor 902.
  • the pressing force of the operating area is determined by the processor 902 according to the voltage change value. If the pressing force is greater than or equal to the preset threshold, determining that the operating area generates a pressing operation.
  • the operating area may be provided with at least one pressing area
  • the plate voltage signal corresponding to the operating area may be a plate voltage signal corresponding to a pressing area in the operating area
  • the operating area corresponds to the
  • the change in capacitance of the parallel plate capacitor may be a change in capacitance of the parallel plate capacitor corresponding to the certain pressing region of the operating area
  • the pressing condition of the operating region may be a pressing condition of the certain pressing region in the operating region.
  • the electronic device provided by the embodiment of the present application may include: the button device for an electronic device according to any one of the above, wherein the pressure detection of the pressing operation in the operating area on the button device can be performed by detecting the capacitance change of the parallel plate capacitor, It replaces the traditional mechanical buttons, can avoid the opening of the electronic equipment, etc., without the need to set seals and other structural parts, effectively avoiding the waterproofing and dustproof failure caused by the opening, the sealing ring aging and the structural parts wear, which effectively guarantees The waterproof and dustproof effect of the electronic device and the high reliability increase the service life of the electronic device.
  • the button device replaces the traditional mechanical button, the manufacturing process and cost are reduced, and the appearance of the electronic device can be made simpler, and the screen ratio of the electronic device is improved.
  • the signal detecting device 901 in the above-mentioned electronic device can detect the parallel plate capacitor in the key device 10 by using various alternative embodiments to determine the voltage change value caused by the capacitance change of the parallel plate capacitor corresponding to the operating region.
  • the parallel plate capacitor can be detected by mutual capacitance detection.
  • the parallel plate capacitor can be detected by self-capacitance.
  • the two electrode plates of the parallel plate capacitor in the key device 10 as shown above may be provided with electrical connection leads at positions corresponding to the operation regions.
  • the two plate plates of the parallel plate capacitor may be provided with electrical connection leads at positions corresponding to each of the pressing regions provided in the operation region.
  • the signal detecting device 901 can receive the output plates of the lead wires on the two plates corresponding to the operation area.
  • the voltage signal determines a voltage change value caused by a change in capacitance of the parallel plate capacitor corresponding to the operation area.
  • the plate voltage signal can be transmitted to the signal detecting device 901 by electrical connection leads disposed at positions corresponding to the operation regions on each of the plates of the parallel plate capacitor.
  • FIG. 10 is a schematic structural diagram 2 of an electronic device according to an embodiment of the present application.
  • the parallel plate capacitor can be detected in a mutual capacitance manner.
  • the signal detecting device 901 may include: an amplifier 9011 and an impedance circuit 9012; the non-inverting input of the amplifier 9011 is connected to the preset reference signal Vcom; and one of the plates of the parallel plate capacitor The leads are electrically connected to the drive signal Vdrv and the other lead on the plate is electrically coupled to the inverting input of amplifier 9011.
  • the inverting input of amplifier 9011 is also coupled to the output of amplifier 9011 via impedance circuit 9012.
  • the lead wires on one of the plates of the parallel plate capacitor may be directly connected to the driving signal Vdrv, or may be connected to the driving signal Vdrv through a predetermined resistor.
  • the driving signal Vdrv may be a square wave signal, a sine wave signal, a triangular wave signal, or other similar wave signals.
  • the parallel plate capacitor can use one plate as a driving electrode, thereby electrically connecting the leads on one plate to the driving signal Vdrv and the other plate as a signal electrode, thereby electrically connecting the leads on the other plate.
  • Vdrv driving signal
  • the other plate thereby electrically connecting the leads on the other plate.
  • the voltage of the leads of the one plate can be made Vdrv.
  • One plate and the other plate of the parallel plate capacitor form a capacitor C1 shown in FIG. 10 at a corresponding position in the operation region.
  • the variation of the distance between the two plates of the parallel plate capacitor causes the change of the capacitance C1 to change such that the current at the corresponding position of the operation region on the other plate changes, so that the current through the impedance circuit changes, which in turn causes
  • the voltage output from the output of the amplifier 9011 changes.
  • the amount of voltage change outputted by the signal detecting means 901 may be a voltage change value caused by a change in the capacitance C1 formed at a corresponding position in the operation area.
  • the signal detecting device 901 detects the voltage change value caused by the capacitance change of the parallel plate capacitor by means of mutual capacitance detection, so that the detection of the capacitance change of the parallel plate capacitor can be further detected. Add accuracy.
  • the impedance circuit 9012 in the signal detecting device 901 in the above embodiment may include at least one resistor (or equivalent resistor) and/or at least one capacitor (or equivalent capacitor) connected by a predetermined circuit connection.
  • the preset circuit connection manner may be parallel connection, series connection, or series-parallel combination.
  • FIG. 11 is a schematic structural diagram 3 of an electronic device according to an embodiment of the present application.
  • Figure 11 further provides an implementable embodiment of the impedance circuit based on the above-described Figure 10.
  • the impedance circuit 9012 in the signal detecting device 901 may include a resistor Rf1 and a capacitor Cf1 connected in parallel.
  • the impedance circuit 901 is implemented by paralleling resistors and capacitors to make the voltage value at the output of the amplifier 9011 more accurate.
  • FIG. 12 is a schematic structural diagram 4 of an electronic device according to an embodiment of the present disclosure.
  • the parallel plate capacitor can be detected in a self-contained manner.
  • the signal detecting means 901 comprises: an amplifier 9011; the non-inverting input of the amplifier 9011 is electrically connected to a lead on one of the plates; the lead of the other plate is grounded; the non-inverting input of the amplifier 9011 The terminal is also connected to the drive signal Vdrv.
  • the inverting input of amplifier 9011 is coupled to the output of amplifier 9011.
  • the lead wires on one of the plates of the parallel plate capacitor may be directly connected to the driving signal Vdrv, or may be connected to the driving signal Vdrv through a predetermined resistor.
  • the driving signal Vdrv may be a square wave signal, a sine wave signal, a triangular wave signal, or other similar wave signals.
  • the parallel plate capacitor can use one plate as a driving electrode, thereby electrically connecting the lead on one plate to the driving signal Vdrv, and the other plate as a ground plate, thereby grounding the lead on the other plate.
  • the non-inverting input of amplifier 9011 is coupled to drive signal Vdrv such that the initial input signal to the non-inverting input of amplifier 9011 is drive signal Vdrv.
  • the variation of the distance between the two plates of the parallel plate capacitor causes the change of the capacitance C1 to change the current at the corresponding position of the operation area through the one plate, so that the corresponding position of the operation area on the one plate.
  • the voltage changes, and the voltage input to the non-inverting input of amplifier 9011 changes, which in turn causes the voltage output at the output of amplifier 9011 to change.
  • the amount of voltage change output by the signal detecting device 901 can be The voltage change caused by the change of the capacitance C1 formed at the corresponding position of the operation area.
  • the signal detecting device 901 can detect the voltage change value caused by the capacitance change of the parallel plate capacitor by means of self-capacitance detection.
  • the voltage change value caused by the capacitance change of the parallel plate capacitor directly detected by the amplifier 9011 is usually small.
  • the voltage change value may be first performed. Zoom in.
  • FIG. 13 is a schematic structural diagram 5 of an electronic device according to an embodiment of the present application.
  • FIG. 13 shows an alternative embodiment of amplifying a signal output from the signal detecting means 901.
  • the electronic device body 90 is further provided with:
  • the signal amplifying circuit 903 is configured to amplify the signal output from the signal detecting device 901 and input it to the processor 902.
  • the signal output from the signal detecting device 901 is amplified by the signal amplifying circuit 903 and input to the processor 902, so that the processor 902 can make the determination of the pressing condition of the operating region based on the signal output from the signal detecting device 901 more accurate.
  • the parallel plate capacitor corresponding to the position of the adjacent pressing region may have a certain interference, thereby affecting the detection accuracy of the pressing operation.
  • the signal amplifying circuit 903 may be differentially amplified.
  • the circuit is configured to differentially amplify a voltage change value caused by a change in capacitance of the parallel plate capacitor corresponding to the adjacent pressing region, and then input the result to the processor 902.
  • FIG. 14 is a schematic structural diagram 6 of an electronic device according to an embodiment of the present disclosure.
  • FIG. 14 shows an implementation scenario in which a mutual capacitance detection mode is adopted for a plurality of pressing regions.
  • the signal detecting device 901 includes two amplifiers 9011, two impedance circuits, and a differential amplifying circuit 904; the non-inverting input terminals of each of the amplifiers 9011 are connected to a preset reference signal Vcom.
  • Lead wires corresponding to each of the pressing regions in the operating region of one of the parallel plate capacitors are electrically connected to the driving signal Vdrv.
  • the lead wire corresponding to one pressing area of the other plate of the parallel plate capacitor can be electrically connected to the inverting input end of one amplifier 9011, and the lead wire corresponding to the other pressing area of the other plate of the parallel plate capacitor can be electrically connected. To the inverting input of another amplifier 9011.
  • the inverting input of each amplifier 9011 is coupled to the output of each amplifier 9011 via an impedance circuit.
  • the impedance circuit connected to the inverting input terminal of the amplifier 9011 may include: a parallel resistor Rf1 and a capacitor Cf1, and the impedance circuit connected to the inverting input terminal of the other amplifier 9011 may include: a parallel resistor Rf2 and a capacitor Cf2.
  • the differential amplifying circuit 904 can differentially amplify the voltage change value caused by the capacitance change of the parallel plate capacitor corresponding to the adjacent pressing region in the operation region, and then input the signal to the processor 902, thereby effectively improving the recognition sensitivity of the pressing condition and improving the adjacentness.
  • the anti-interference ability of the pressing area can differentially amplify the voltage change value caused by the capacitance change of the parallel plate capacitor corresponding to the adjacent pressing region in the operation region, and then input the signal to the processor 902, thereby effectively improving the recognition sensitivity of the pressing condition and improving the adjacentness.
  • the anti-interference ability of the pressing area can differentially amplify the voltage change value caused by the capacitance change of the parallel plate capacitor corresponding to the adjacent pressing region in the operation region, and then input the signal to the processor 902, thereby effectively improving the recognition sensitivity of the pressing condition and improving the adjacentness.
  • the anti-interference ability of the pressing area can differentially amplify the voltage change value caused by the capacitance change of the parallel
  • FIG. 15 is a schematic structural diagram 7 of an electronic device according to an embodiment of the present application.
  • FIG. 15 shows an implementation scenario in which a self-capacity detection method is adopted for a plurality of pressing regions.
  • the signal detecting means 901 includes two amplifiers 9011 and a differential amplifying circuit 904; the non-inverting input terminals of each of the amplifiers 9011 are connected to the driving signal Vdrv.
  • a corresponding one of the pressing regions of the operating region of one of the parallel plate capacitors is electrically connected to the non-inverting input of an amplifier 9011.
  • a lead corresponding to another pressing region on one of the plates of the parallel plate capacitor is electrically connected to the non-inverting input of the other amplifier 9011.
  • the lead corresponding to the one pressing region on one of the plates of the parallel plate capacitor is also connected to the driving signal Vdrv.
  • the lead corresponding to the one pressing area on the one of the plates can be connected to Vdrv through the resistor R1.
  • the lead corresponding to the other pressing region in the operating region of one of the plates of the parallel plate capacitor is also connected to the driving signal Vdrv.
  • the lead corresponding to the other pressing area on the other plate can be connected to Vdrv through the resistor R2.
  • the leads corresponding to each pressing area on the other plate are grounded.
  • each amplifier 9011 is coupled to the output of each of the amplifiers 9011.
  • the differential amplification circuit 904 can change the capacitance of the parallel plate capacitor corresponding to the adjacent pressing region.
  • the induced voltage change value is differentially amplified and input to the processor 902, thereby effectively improving the recognition sensitivity of the pressing condition and improving the anti-interference ability of the adjacent pressing region.
  • the foregoing program may be stored in a computer readable storage medium, and the program is executed when executed.
  • the foregoing steps include the steps of the foregoing method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.

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Abstract

一种用于电子设备的按键装置（10）及电子设备，该按键装置（10）包括平行板电容器（11），电容器（11）的极板（112，118）能够在操作区被按压时产生变形；电容器（11）的极板上设有引线；按键装置（10）包括形成电容器（11）的面板（111）和第一极板（112），或者；按键装置（10）包括面板（111）、形成电容器（11）的第一极板（112）和第二极板（118）。该按键装置（10）可提高电子设备的使用寿命。

Description

用于电子设备的按键装置及电子设备 技术领域
本申请实施例涉及压力检测技术，尤其涉及一种用于电子设备的按键装置及电子设备。
背景技术
压力感应功能，也称压感功能，由于其可为用户提供多维度的输入，满足了多样化的用户需求，提供了差异化的用户体验。
目前对电子设备的按压操作的检测，大多可通过传统的机械按键实现。然而机械按键通常需在电子设备上开孔，以放置该机械按键。然而，这会使得电子设备的防尘防水性能较差等问题，从而使得电子设备的使用寿命受到限制。
如何通过压感功能取代传统的机械按键，实现对按压操作的检测，以提高电子设备的使用寿命显得格外重要。
发明内容
本申请实施例提供一种用于电子设备的按键装置及电子设备，以替代传统的机械按键，进而提高电子设备的使用寿命。
本申请实施例提供一种用于电子设备的按键装置，所述按键装置包括平行板电容器，所述平行板电容器的极板能够在所述按键装置的操作区被按压时产生变形，以改变所述平行板电容器的极板间距；
所述平行板电容器的极板上设置有电连接引线，以连接至所述电子设备的信号检测装置；
所述按键装置包括：设置所述操作区的面板和第一极板，所述面板为金属面板，所述面板和所述第一极板之间设置有可形变的介质层以形成所述平行板电容器，或者；
所述按键装置包括：设置所述操作区的面板、第一极板和第二极板；所述第一极板设置在靠近所述面板的位置，所述第二极板设置在远离所述面板 的位置；所述第一极板和所述第二极板之间设置有可形变的介质层以形成所述平行板电容器。
本申请实施例还提供一种电子设备，包括电子设备本体，所述电子设备本体上设置有如上所述的用于电子设备的按键装置，所述电子设备本体上还设置有信号检测装置和处理器；
所述信号检测装置，用于接收所述按键装置输出的平行板电容器中操作区对应的极板电压信号，确定所述操作区对应的所述平行板电容器的电容变化引起的电压变化值；
所述处理器，用于根据所述信号检测装置输出的所述电压差值，确定所述操作区的按压情况。
本申请实施例提供的用于电子设备的按键装置及电子设备，其中，该按键装置包括平行板电容器，平行板电容器的极板能够在按键装置的操作区被按压时产生变形，以改变平行板电容器的极板间距，且平行板电容器的极板上设有电连接引线，以连接至该电子设备的信号检测装置；该按键装置可包括：设置该操作区的面板和第一极板，该面板为金属面板，该面板和该第一极板之间设置有可形变的介质层以形成该平行板电容器；或者；该按键装置包括：设置该操作区的面板、第一极板和第二极板，该第一极板设置在靠近该面板的位置，该第二极板设置在远离该面板的位置；该第一极板和该第二极板之间设置有可形变的介质层以形成该平行板电容器。该按键装置可通过检测平行板电容器的电容变化，实现对该按键装置上操作区内的按压操作的压力检测，替代了传统的机械按键，可避免对电子设备进行开孔等处理，无需设置密封圈及其它结构件，有效避免开孔、密封圈老化及结构件磨损等引起的防水防尘失效，有效保证电子设备的防水防尘效果，且可靠性较高，从而提高了电子设备的使用寿命。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1A为本申请各实施例提供的按键装置的应用示意图；
图1为本申请实施例提供的一种用于电子设备的按键装置的结构示意图一；
图2为本申请实施例提供的一种用于电子设备的按键装置的结构示意图二；
图3为本申请实施例提供的一种用于电子设备的按键装置的结构示意图三；
图4为本申请实施例提供的一种用于电子设备的按键装置的结构示意图四；
图5为本申请实施例提供的一种用于电子设备的按键装置的结构示意图五；
图6为本申请实施例提供的一种用于电子设备的按键装置的结构示意图六；
图7为本申请实施例提供的一种用于电子设备的按键装置的结构示意图七；
图8为本申请实施例提供的一种用于电子设备的按键装置的结构示意图八；
图8A为本申请实施例提供的一种垫片的结构示意图；
图9为本申请实施例提供的一种电子设备的结构示意图一；
图10为本申请实施例提供的一种电子设备的结构示意图二；
图11为本申请实施例提供的一种电子设备的结构示意图三；
图12为本申请实施例提供的一种电子设备的结构示意图三；
图13为本申请实施例提供的一种电子设备的结构示意图五；
图14为本申请实施例提供的一种电子设备的结构示意图六；
图15为本申请实施例提供的一种电子设备的结构示意图七。
附图标记说明：
10：按键装置；
11：平行板电容器；
111：面板；
112：第一极板；
114：第一支撑板；
115：第二支撑板；
117：垫片；
118：第二极板；
90：电子设备本体；
901：信号检测装置；
9011：放大器；
9012：阻抗电路；
902：处理器；
Vcom：参考信号；
Vdrv：驱动信号；
Rf1、Rf2、R1、R2：电阻；
Cf1、Cf2：电容；
903：信号放大电路；
904：差分放大电路。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请下述各实施例提供的按键装置可应用于智能手机、笔记本电脑、可穿戴设备、家电设备等任一具有压感功能的电子设备中，利用电容变化进行压力检测实现压感功能，从而替换传统的机械按键，对按压操作进行检测。
图1A为本申请各实施例提供的按键装置的应用示意图。以智能手机为例，该按键装置例如可位于电子设备侧边的边框上，以替代传统的机械按键，如音量按键或者电源按键等。
当然，该按键装置还可位于在电子设备的其它位置，图1A仅为一种可 选的示例，本申请不对此进行限制。
需要说明的是，为了方便说明，放大或者缩小了压力感应结构中不同结构的尺寸，所以图中所示大小和比例并不一定代表实际尺寸，也不反映尺寸的比例关系。
如下结合多个实例对本申请实施例提供的用于电子设备的按键装置进行说明。
图1为本申请实施例提供的一种用于电子设备的按键装置的结构示意图一。如图1所示，按键装置10包括平行板电容器11，平行板电容器11的极板能够在按键装置10的操作区被按压时产生变形，以改变平行板电容器11的极板间距。
平行板电容器11的极板上设置有电连接引线12，以连接至该电子设备的信号检测装置。
按键装置10的操作区可设置于按键装置10的面板上，该操作区可覆盖该面板的整个区域，也可覆盖该面板的部分区域。用户可在该操作区内对按键装置10进行操作，该操作区可称为用户操作区。该操作区内可设置有至少一个按压区域，每个按压区域可用于接收输入的按压操作。图1以两个按压区域，如按压区域1和按压区域2为例进行说明，当然，该按键装置10的操作区内也可设有一个按压区域，或者更多的按压区域，在此不再赘述。
具体地，当按键装置10的操作区被按压时，该操作区的受力会传递至平行板电容器11的极板，使得平行板电容器11的极板发生变形。以操作区的按压区域1为例，当按压区域1被按压时，按压区域1所受到的压力会传递至按压区域1对应的平行板电容器11的极板，使得极板发生变形。
在一种应用中，平行板电容器11的一个极板可发生变形，而另一个极板固定不变，即未发生变形，从而使得极板间距发生变化。在另一种应用中，平行板电容器11的两个极板均会产生变形，其中一个极板的变形大于另一个极板的变形，也可使得极板间距发生变化。
平行板电容器11的极板可以为电子设备内的导电件，如该电子设备内相邻，且相互平行的两个板状结构或近似板状结构，该两个结构均可传导电子。在电子设备中，柔性电路板(Flexible Printed Circuit，FPC)、金属支撑板、 或者金属面板等导电件均可传电子，因此，平行板电容器11的极板可以为FPC、金属支撑板、金属面板等，或者还可以是上述各种类型的组合形式。
平行板电容器11的两个极板之间的介质层可以为可形变的介质层。该可形变的介质层可以为气态介质层如空气介质层等，也可以为其它固态介质层如胶合层等，或者，还可以部分区域为气态介质层，部分区域为固态介质层，本申请不对此进行限制。
当按键装置10的操作区被按压时，该操作区的按压操作便会使得该操作区对应的平行板电容器11的极板产生变形，使得平行板电容器11的极板间距发生变化，可使得该操作区对应的平行板电容器11的电容值发生变化。以操作区的按压区域1为例，当按压区域1被按压时，按压区域1的按压操作便会使得按压区域1对应的平行板电容器11的极板产生变形，使得平行板电容器11的极板间距发生变化，可使得按压区域1对应的平行板电容器11的电容值发生变化。
平行板电容器11的极板上的电连接引线12可位于平行板电容器11的极板上对应操作区的位置处，例如可位于平行板电容器11的极板上对应操作区内每个按压区域的位置处。
当平行板电容器11的极板上的电连接引线12连接至该电子设备的信号检测装置，可将平行板电容器11的极板电压信号传递至信号检测装置，使得信号检测装置可根据平行板电容器11中操作区对应的极板电压信号，确定该操作区对应的平行板电容器11的电容变化引起的电压变化值，继而由处理器根据该信号检测装置输出的该电压变化值，确定按键装置10的该操作区的按压情况。
例如，该处理器可根据该电压变化值，确定该操作区上对应的按压力度，继而若该按压力度大于或等于预设阈值，则可确定按键装置10的操作区处的按压操作产生，继而根据该按压操作执行对应处理。
本实施方式提供的用于电子设备的按键装置包括平行板电容器，平行板电容器的极板能够在该按键装置的操作区被按压时产生变形，以改变平行板电容器的极板间距，且平行板电容器的极板上设有电连接引线，以连接至该电子设备的信号检测装置。该按键装置可通过检测平行板电容器的电容变化，实现对该按键装置上操作区内的按压操作的压力检测，替代了传统的机械按 键，可避免对电子设备进行开孔等处理，无需设置密封圈及其其它结构件，有效避免开孔、密封圈老化及结构件磨损等引起的防水防尘失效，有效保证了电子设备的防水防尘效果，并且可靠性较高，从而提高了电子设备的使用寿命。
同时，该按键装置中各极板可复用电子设备内的导电件，减小了电子设备的制造工艺和成本；并且该按键装置对机械按键进行替换，可使得电子设备的外观上无机械按键且无需增加额外的部件，使得电子设备的外观更简洁。例如，在外观上该电子设备可无需设置机械按键，只需在外观上该按键装置所在区域处做个标记即可。
另外，该按键装置可设置于电子设备的侧边边框上，实现侧边触发操作，保证电子设备的屏占比。然而对于曲面屏、超薄屏等电子设备，其侧边的边框通常较窄，如在其侧边边框设置机械按键，无疑对该类电子设备的曲面屏或者超薄屏的显示性能必然受到限制。因而，对于该类电子设备，采用本申请所涉及的按键装置，替换传统的机械按键，可在保证电子设备屏占比的情况下，还可有效保证曲面屏或者超薄屏的显示性能，并且，还可保证屏幕的曲面化需求及超薄化需求。
上述涉及的平行板电容器可以具有多种可行的实施方式：一种方式下，可以采用按键装置上的面板作为平行板电容器的一个极板，在面板朝向电子设备的内侧再设置另一极板，其中，面板为设置有操作区的操作面板，因此，在面板上的操作区被按压时，面板自身变形从而使平行板电容器的极板间距产生变化；另一种方式下，可以在面板朝向电子设备的内侧设置两个极板以形成平行板电容器，在面板上的操作区被按压时，该按压操作会传递至邻近面板的极板，使该极板产生变形从而使平行板电容器的极板间距产生变化。
以下将采用不同实施例分别对上述的实施方式进行详细说明。
图2为本申请实施例提供的一种用于电子设备的按键装置的结构示意图二，该实施例采用按键装置上的面板作为平行板电容器的一个极板。
如图2所示，该按键装置10可包括：设置该操作区的面板111和第一极板112，面板111为金属面板，面板111和第一极板112之间设置有可形变的介质层以形成平行板电容器11。
也就是说，在图2对应的实例中，面板111和第一极板112可分别作为两个极板，结合面板111和第一极板112之间的介质层，形成平行板电容器11。
在该实施方式中，该操作区可设置于面板111上，当面板111上的操作区被按压时，该操作区的受力可使得面板111发生变形，从而使得平行板电容器11的极板间距发生变化。平行板电容器11的极板间距发生变化，面板111和第一极板112之间的介质层也随之发生形变。
若以面板111作为一个极板，面板111还需接地。
该实施方式提供的按键装置中，采用电子设备中已有的面板作为平行板电容器其中一个极板，形成平行板电容器可进一步使得按键装置内部结构更加简化，便于按键装置的安装等，同时还可提高按键装置内部的集成度，提高电子设备的集成度，以满足电子设备的轻薄化需求。
上述平行板电容器的两个极板之间的介质层可以为可形变的介质层。该可形变的介质层可以为气态介质层如空气介质层等，也可以为其它固态介质层如胶合层等，或者，还可以部分区域为气态介质层，部分区域为固态介质层。图3为本申请实施例提供的一种用于电子设备的按键装置的结构示意图三。图3在图2所示实施例的基础上，进一步提供了平行板电容器的极板之间的介质层的可实施方式。
如图3所示，上述图2所示的介质层中对应该操作区的部分可设置有胶合层，该胶合层可包括：各种类型的胶黏物质，例如：双面胶等。该胶合层之外的部分可以不进行填充，即可以为空气介质层。
在该实施方式下，由于介质层中对应该操作区的部分设置有胶合层，可使得操作区上的受力通过胶合层传递至第一极板112，使得第一极板112产生变形。
并且，该介质层中对应该操作区的部分设置的胶合层，可使得该按键装置10中采用胶合层作为平行板电容器11的介质。
其次，该介质层位于面板111和第一极板112之间，该介质层中设置的胶合层，可使得面板111通过胶合层与第一极板112连接，可避免面板111和第一极板112在极板间距方向外的其它方向进行移动，避免了按键装置10 内各器件的松动，保证了按键装置10的使用寿命。
上述实施例采用按键装置上的面板作为平行板电容器的一个极板，而平行板电容器的另一个极板，可位于面板内侧，其材质可以是柔性板如FPC，也可以是刚性的金属支撑板。
在另一极板，也就是图3所示的第一极板112为FPC的实施方式下，该第一极板112在背离面板111的一侧固设有至少一层支撑板。
当第一极板112为FPC，由于FPC柔性较高，而刚性较差，其对面板111的支撑较差，因此，为保证按键装置10内各器件的牢固安装，可在第一极板112背离面板111的一侧固设有至少一层支撑板。
图4为本申请实施例提供的一种用于电子设备的按键装置的结构示意图四。该图4示出了第一极板112在背离面板111的一侧固设有第一支撑板114和第二支撑板115的实施场景。其中，第一支撑板114与第二支撑板115可以为金属支撑板，也可以为非金属支撑板如塑料支撑板等。
其中，第一支撑板114可以与FPC贴合，即直接接触。第一支撑板114与第二支撑板115之间可以形成间隙，在该间隙中对应该操作区的部分可以不进行填充，即为空气介质层，该空气介质层之外的部分可以设置有胶合层，从而使第一支撑板114与第二支撑板115通过胶合层粘合。
在图4中，在该间隙内的中央部分可设置有胶合层，该间隙内该中央部分外的两端部也可分别设置一个胶合层，使得该间隙内该胶合层外的部分为空气介质层。
需要说明的是，图4仅为一种可选的实例，在该间隙内，也可仅在中央部分可设置胶合层，使得中央部分之外的部分均为空气介质层，然而，本申请提供的按键装置不对此进行限制。
若该间隙内，仅在中央部分设置有胶合层，在该胶合层所占区域可大于图4所示的间隙内中央部分胶合层所占区域，以保证第一支撑板114与第二支撑板115之间的粘合强度。
如在该间隙内，仅在中央部分设置胶合层，可有效避免操作区内不同按压区域对应的平行板电容器间的串扰问题，可使得对操作区内按压操作的检测更佳精确，有效保证按键装置的性能，提高用户体验。
进一步的，为了提高按键装置10内的安装可靠性，面板111的具体结构可以围设至最外层支撑板外部，并且在面板111与最外层支撑板之间设置有至少一个垫片117。最外层支撑板例如可以为图4所示的第二支撑板115，该至少一个垫片117可设置于面板111与第二支撑板115之间。图4以一个垫片117进行示例。
图4中，垫片117可以称为预压垫片。垫片117可对按键装置10内的面板111、第一极板112以及各支撑板进行预压，使得面板111与第一极板112，第一极板112以及各支撑板完全粘合，保证了按键装置10内的安装可靠性。
图5为本申请实施例提供的一种用于电子设备的按键装置的结构示意图五，区别于图2-4所示的实施方式，该实施例可以在面板朝向电子设备的内侧另外设置两个极板以形成平行板电容器。如图5所示，按键装置10可包括：设置该操作区的面板111、第一极板112和第二极板118。第一极板112设置在靠近面板111的位置，第二极板118设置在远离面板111的位置。第一极板112和第二极板118之间设置有可形变的介质层以形成平行板电容器11。
具体实现中，图5中面板111、第一极板112和第二极板118可按照自上而下的顺序依次设置，其中，面板111位于最外侧，第一极板112靠近面板111设置，第二极板118远离面板111。
也就是说，在图5对应的实例中，第一极板112和第二极板118可分别作为两个极板，结合第一极板112和第二极板118之间的介质层，形成平行板电容器11。
在该实施方式中，该操作区可位于面板111上，当面板111上的操作区被按压时，该操作区的受力可通过面板111传递至第一极板112，使得第一极板112产生变形，从而使得第一极板112和第二极板117之间的距离，也就是平行板电容器11的极板间距发生变化。
图5对应的实施方式，不限于面板的材质，面板111可以为金属面板，也可以为非金属面板如塑料面板等。
该实施方式提供的按键装置中，可利用电子设备中的面板之外的两个极板作为平行板电容器，而不限于面板的材质，使得该按键装置的适用性更广。
上述按键装置中，平行板电容器的两个极板可以为两个柔性板如FPC，也可以为两个刚性的金属支撑板。平行板电容器的一个极板可以为柔性板，而另一个极板为刚性的金属支撑板。
在一个实施方式中，第一极板112和第二极板118可均为FPC。图6为本申请实施例提供的一种用于电子设备的按键装置的结构示意图六。该图6便以两个极板均为FPC为例进行说明。
图6所示的按键装置中，第一极板112可以为第一FPC，第二极板118为可以第二FPC，第一FPC和第二FPC之间设置有可形变的介质层以形成平行板电容器11。
平行板电容器的11两个极板之间的介质层可以为气态介质层如空气介质层等，也可以为其它固态介质层如胶合层等，或者，还可以部分区域为气态介质层，部分区域为固态介质层。图6中提供一种平行板电容器的极板之间的介质层的可实施方式。在该图6对应的实施方式中，该介质层中对应该操作区的部分可以不进行填充，即可以为空气介质层，而空气介质层之外的部分设置有胶合层。
由于该介质层中对应该操作区的部分的空气介质层，可使得图6所示的该按键装置中可采用空气介质层作为平行板电容器11的介质层。
并且，该介质层位于第一极板112和第二极板118之间，当该介质层中设置的胶合层，可使得第一极板112通过胶合层与第二极板118连接，可避免第一极板112和第二极板118在极板间距方向外的其它方向进行移动，避免了按键装置10内各器件的松动，保证了按键装置10的使用寿命。
在图6中，在第一极板112和第二极板118之间的介质层的中央部分可设置有胶合层，该介质层内该中央部分外的两端部也可分别设置一个胶合层，使得该介质层内该胶合层外的部分为空气介质层。需要说明的是，图6仅为一种可选的实例，在该介质层内，也可仅在中央部分可设置胶合层，使得中央部分之外的部分均为空气介质层，然而，本申请提供的按键装置不对此进行限制。
若第一极板112和第二极板118之间的介质层内，仅在中央部分设置胶合层，在该胶合层所占区域可大于图6所示的介质层内中央部分胶合层所占 区域，以保证第一极板112和第二极板118之间的粘合强度。
在第一极板112和第二极板118之间的介质层内，如仅在中央部分设置胶合层，可有效避免操作区内不同按压区域对应的平行板电容器间的串扰问题，可使得对操作区上按压操作的检测更佳精确，有效保证按键装置的性能，提高用户体验。
图6中所示的实施例方式中，第一FPC朝向面板111的一侧固设有第一支撑板114，第二FPC背离面板111的一侧固设有第二支撑板115。
当第一极板112为第一FPC，由于FPC柔性较高，而刚性较差，其对面板111的支撑较差，因此，为保证按键装置10内各器件的牢固安装，可在第一FPC朝向面板111的一侧固设第一支撑板114。
当第二极板118为第二FPC，由于FPC柔性较高，而刚性较差，其对面板111、第一极板112等支撑也较差，因此，为保证按键装置10内各器件的牢固安装，还可在第二FPC背离面板111的一侧固设第二支撑板115。
由上可知，该图6中第一支撑板114与第二支撑板115主要用于支撑，因此，图6中第一支撑板114与第二支撑板115可以为金属支撑板，也可以为非金属支撑板如塑料支撑板等，还可以是其中一个支撑板为金属支撑板，而另一个支撑板为非金属支撑板。
在该实施方式中，为保证第一支撑板114与面板111的相对位置的固定，对应该操作区的部分可以设置有胶合层，或者，第一支撑板114与面板111也可以相贴合即直接接触。该图6示出了第一支撑板114与面板111之间，对应该操作区的部分设置胶合层的实施场景。
进一步的，为了提高按键装置10内的安装可靠性，面板111的具体结构可以围设至第二支撑板115外部，面板111与第二支撑板115之间设置有至少一个垫片117。图6以一个垫片117进行示例。
图6中，垫片117可以称为预压垫片。垫片117可对按键装置10内的面板111、第一极板112、第二极板118、第一支撑板114和第二支撑板115进行预压，使得面板111与第一支撑板114，第一极板112与第二极板118、第二极板118与第二支撑板115之间完全粘合，保证了按键装置10内的安装可 靠性。
上述图5中第一极板112和第二极板118中的一个可以为FPC，另一个为支撑板，该支撑板为金属支撑板，FPC和支撑板之间设置有可形变的介质层以形成平行板电容器11。若该支撑板为金属支撑板，该按键装置10中的其它支撑板可以为金属支撑板，也可以为其它材质的支撑板。
图7为本申请实施例提供的一种电子设备按键装置的结构示意图七。图7示出了第一极板112和第二极板118中的一个可以为FPC，另一个为第一支撑板的一种可选的实施场景。在图7中FPC靠近面板111设置，第一支撑板114远离面板111设置。
该实施方式中，第一极板112为FPC，而第二极板118为第一支撑板114，FPC和第一支撑板114之间设置有可形变的介质层以形成平行板电容器11。当第二极板118为第一支撑板114，则第一支撑板114可接地。
可选的，该介质层中对应该操作区的部分可以不进行填充，即为空气介质层，而该空气介质层之外的部分设置有胶合层；或者，
该介质层中对应该操作区的部分可以设置有胶合层，而该胶合层之外的部分不进行填充即为空气介质层。
具体地，若该介质层中对应该操作区的部分为空气介质层，可使得FPC和第一支撑板114形成的平行板电容器11的介质层为空气介质层。
该介质层中对应该操作区的部分设置的胶合层，可使得FPC和第一支撑板114形成的平行板电容器11的介质层为胶合层。
FPC和第一支撑板114之间的该介质层中设置的胶合层，还可使得FPC和第一支撑板114通过胶合层粘合。
在图7对应的实施方式中，可仅在中央部分可设置胶合层，使得中央部分之外的部分均为空气介质层。若仅在介质层的中央部分设置胶合层，在该胶合层所占区域可大于预设区域，以保证FPC和第一支撑板114之间的粘合强度。
若仅在介质层的中央部分设置胶合层，可有效避免操作区内不同按压区域对应的平行板电容器间的串扰问题，可使得对操作区上按压操作的检测更佳精确，有效保证按键装置的性能，提高用户体验。
需要说明的是，图7仅为一种实例，在该介质层内的中央部分可设置有胶合层，该介质层内该中央部分外的两端部也可分别设置一个胶合层，使得该间隙内该胶合层外的部分为空气介质层，然而，本申请提供的按键装置不对此进行限制。
在该图7所示的实施方式中，可将靠近面板设置的FPC和远离面板设置的第一支撑板114作为两个极板，形成平行板电容器11。
该实施方式提供的按键装置中，第一支撑板114远离面板111作为其中一个极板，形成平行板电容器可在保证对面板111及FPC支撑的基础上，使得按键装置内部结构更加简化，便于按键装置的安装等，同时还可提高按键装置内部的集成度，提高电子设备的集成度，以满足电子设备的轻薄化需求。
进一步地，由于FPC的刚性较差，为保证对面板111的支撑，可在FPC朝向面板111的一侧固设第二支撑板115。
进一步地，为保证第二支撑板115与面板111的相对固定，图7中的第二支撑板115与面板111之间，对应该操作区的部分可设置有胶合层；或者，第二支撑板115与面板111相贴合。
也就是说，第二支撑板115可以与面板111直接接触即贴合，也可通过胶合层粘合。
进一步的，为了提高按键装置10内的安装可靠性，面板111的具体结构可围设在第一支撑板114外部，面板111与第一支撑板114之间设置有至少一个垫片117。图7以一个垫片117进行示例。
图7中，垫片117可以称为预压垫片。垫片117可对按键装置10内的面板111、第二支撑板115、FPC及第一支撑板114进行预压，使得面板111与第二支撑板115，FPC与第一支撑板114完全粘合，保证了按键装置10内的安装可靠性。
图8为本申请实施例提供的一种电子设备按键装置的结构示意图八。图8示出了第一极板112和第二极板118中的一个可以为FPC，另一个为第一支撑板的另一种可选的实施场景。图7与图8的区别在于，作为极板的FPC相对面板的位置不同。图8中第一支撑板114靠近面板111设置，FPC远离面 板111设置。
在该实施方式中，第二极板118为FPC，而第一极板112为第一支撑板114，FPC和第一支撑板114之间设置有可形变的介质层以形成平行板电容器11。当第一极板112为第一支撑板114，则第一支撑板114可接地。
可选的，该介质层中对应该操作区的部分可以不进行填充即为空气介质层，而该空气介质层之外的部分设置有胶合层；或者，
该介质层中对应该操作区的部分可以设置有胶合层，而该胶合层之外的部分不进行填充即为空气介质层。
具体地，若该介质层中对应该操作区的部分为空气介质层，可使得FPC和第一支撑板114形成的平行板电容器11的介质层便为空气介质层。
若该介质层中对应该操作区的部分设置有胶合层，可使得FPC和第一支撑板114形成的平行板电容器11的介质层便为胶合层。
该介质层中设置的胶合层，因此，按键装置10还可使得FPC和第一支撑板114通过胶合层粘合。
需要说明的是，在图8中可仅在中央部分可设置胶合层，使得中央部分之外的部分均为空气介质层。若仅在介质层的中央部分设置胶合层，在该胶合层所占区域可大于预设区域，以保证FPC和第一支撑板114之间的粘合强度。
仅在介质层的中央部分设置胶合层，可有效避免操作区内不同按压区域对应的平行板电容器间的串扰问题，可使得对操作区上的按压操作的检测更佳精确，有效保证按键装置的性能，提高用户体验。
需要说明的是，图8仅为一种实例，在该介质层内的中央部分可设置有胶合层，该介质层内该中央部分外的两端部也可分别设置胶合层，使得该间隙内该胶合层外的部分为空气介质层，然而，本申请提供的按键装置不对此进行限制。
在该图8所示的实施方式中，可将远离面板111设置的FPC和靠近面板111设置的第一支撑板114作为两个极板，形成平行板电容器11。
进一步地，由于FPC的刚性较差，为保证对面板111、第一支撑板114及FPC的支撑，可在FPC背离面板111的一侧固设第二支撑板115。
进一步地，为保证第一支撑板114与面板111的相对固定，图8中的第 一支撑板114与面板111之间，对应该操作区的部分可设置有胶合层；或者，第一支撑板114与面板111相贴合。
进一步地，为提高按键装置10内的安装可靠性，面板111的具体结构可围设在第二支撑板115外部，面板111与第二支撑板115之间设置有至少一个垫片117。图8中以一个垫片117进行示例。
图8中，垫片117可以称为预压垫片。垫片117可对按键装置10内的面板111、第一支撑板114、FPC及第二支撑板115进行预压，使得面板111与第一支撑板114，FPC与第二支撑板115完全粘合，保证了按键装置10内的安装可靠性。
可选的，图8A为本申请实施例提供的一种垫片的结构示意图。如图8A所示，如上任一所示的垫片117可以为楔形结构，也可称为楔子，该楔形结构的厚度呈梯度变化的垫片。
采用楔形结构的垫片可使得垫片117有效地适应及吸收结构公差。
在上述实施例的基础上，本申请实施例还提供一种电子设备。图9为本申请实施例提供的一种电子设备的结构示意图一。如图9所示，该电子设备可包括：电子设备本体90，电子设备本体90上设置有如上述图1至图8中任一项所述的用于电子设备的按键装置10，电子设备本体90上还设置有信号检测装置901和处理器902。
信号检测装置901，用于接收按键装置10输出的平行板电容器的操作区对应的极板电压信号，确定该操作区对应的该平行板电容器的电容变化引起的电压变化值。
处理器902，用于根据该信号检测装置输出的该电压变化值，确定该电子设备按键装置10的该操作区的按压情况。
具体地，信号检测装置901与按键装置10的平行板电容器的输出端连接，以接收该电子设备按键装置10输出的平行板电容器的每个按压区域对应的极板电压信号。
该平行板电容器的输出端可以为该平行板电容器的极板上对应操作区的 位置处的电连接引线。
信号检测装置901可根据操作区对应的极板电压信号，确定该操作区对应的该平行板电容器的电容变化引起的电压变化值，将电压变化值传递至处理器902。
由处理器902根据电压变化值，确定该操作区的按压力度，若该按压力度大于或等于预设阈值，则确定该操作区产生按压操作。
需要说明的是该操作区内可设置有至少一个按压区域，则上述该操作区对应的极板电压信号可以为该操作区内某一按压区域对应的极板电压信号，该操作区对应的该平行板电容器的电容变化可以为该操作区该某一按压区域对应的该平行板电容器的电容变化，该操作区的按压情况可以为该操作区内该某一按压区域的按压情况。
本申请实施例提供的电子设备可包括：上述任一所述的用于电子设备的按键装置，可通过检测平行板电容器的电容变化，实现对按键装置上操作区内的按压操作进行压力检测，替代了传统的机械按键，可避免对电子设备进行开孔等处理，无需设置密封圈及其它结构件，有效避免开孔、密封圈老化及结构件磨损等引起的防水防尘失效，有效保证了电子设备的防水防尘效果，并且可靠性较高，从而提高了电子设备的使用寿命。
同时，由于该按键装置替代了传统的机械按键，减小了制造工艺和成本，并且还可使得电子设备的外观更简洁，提高了电子设备的屏占比。
上述涉及的电子设备中信号检测装置901可以通过采用多种可选的实施方式对按键装置10中平行板电容器进行检测，以确定操作区对应的该平行板电容器的电容变化引起的电压变化值。一种方式下，可采用互容检测方式对平行板电容器进行检测，在另一种方式下，可采用自容方式对平行板电容器进行检测。
无论针对互容检测，还是针对自容检测，如上所示的按键装置10中的平行板电容器的两个极板上，对应操作区的位置处均可设有电连接引线。例如，平行板电容器的两个极板上，对应该操作区内所设置的每个按压区域的位置处均可设有电连接引线。
信号检测装置901可接收操作区对应的两个该极板上的引线输出的极板 电压信号，确定该操作区对应的该平行板电容器的电容变化引起的电压变化值。
也就是说，该极板电压信号可以由设置在平行板电容器的每个极板上对应该操作区的位置处的电连接引线传输至信号检测装置901。
如下将采用不同实施例分别对上述平行板电容器的检测方式进行详细说明。
图10为本申请实施例提供的一种电子设备的结构示意图二。该实施例中可采用互容方式对平行板电容器进行检测。如图10所示，在该实施例中，信号检测装置901可包括：放大器9011和阻抗电路9012；放大器9011的同相输入端连接至预设参考信号Vcom；该平行板电容器的一个极板上的引线电连接至驱动信号Vdrv，另一个该极板上的引线电连接至放大器9011的反相输入端。
放大器9011的反相输入端还通过阻抗电路9012连接至放大器9011的输出端。
图10所示的实施方式中，该平行板电容器的一个极板上的引线电可直接连接至驱动信号Vdrv，也可通过一个预设电阻连接至驱动信号Vdrv。其中，该驱动信号Vdrv可以为方波信号，正弦波信号、三角波信号，也可以为其它类似的波信号。
该平行板电容器可将一个极板作为驱动电极，从而将该一个极板上的引线电连接至驱动信号Vdrv，将另一个极板作为信号电极，从而将另一个该极板上的引线电连接至放大器9011的反相输入端。
图10所示的实施方式中，当一个极板上的引线电连接至驱动信号Vdrv，可使得该一个极板的引线的电压为Vdrv。该平行板电容器的一个极板和另一个极板在该操作区对应位置处形成图10所示的电容C1。该平行板电容器的两个极板间距的变化，使得电容C1的产生变化，使得通过该另一个极板上该操作区对应位置处的电流发生变化，使得通过阻抗电路的电流发生变化，继而使得放大器9011的输出端所输出的电压发生变化。该信号检测装置901输出的电压变化量可以为操作区对应位置处所形成的电容C1的变化所引起的电压变化值。
该实施方式中，信号检测装置901采用互容检测的方式检测平行板电容器的电容变化引起的电压变化值，可使得对平行板电容器的电容变化的检测更 加准确。
上述实施例中信号检测装置901中的阻抗电路9012可包括：采用预设电路连接方式所连接的至少一个电阻(或等效电阻)和/或至少一个电容(或等效电容)。该预设电路连接方式可以为并联，也可以为串联，还可以是串并联结合。
图11为本申请实施例提供的一种电子设备的结构示意图三。图11在上述图10所示的基础上，进一步提供了阻抗电路的一种可实施方式。如图11所示，信号检测装置901中的阻抗电路9012可包括：并联的电阻Rf1和电容Cf1。
该阻抗电路901通过并联的电阻和电容实现，可使得放大器9011输出端的电压值更加精确。
图12为本申请实施例提供的一种电子设备的结构示意图四。该实施例中可采用自容方式对平行板电容器进行检测。如图12所示，在该实施例中，信号检测装置901包括：放大器9011；放大器9011的同相输入端与一个极板上的引线电连接；另一极板的引线接地；放大器9011的同相输入端还连接至驱动信号Vdrv。放大器9011的反向输入端与放大器9011的输出端连接。
图12的实施方式中，该平行板电容器的一个极板上的引线电可直接连接至驱动信号Vdrv，也可通过一个预设电阻连接至驱动信号Vdrv。其中，该驱动信号Vdrv可以为方波信号，正弦波信号、三角波信号，也可以为其它类似的波信号。
该平行板电容器可将一个极板作为驱动电极，从而将该一个极板上的引线电连接至驱动信号Vdrv，将另一个极板作为接地极板，从而将另一个该极板上的引线接地。
放大器9011的同相输入端连接至驱动信号Vdrv，可使得放大器9011的同相输入端的初始输入信号为驱动信号Vdrv。该平行板电容器的两个极板间距的变化，使得电容C1的产生变化，使得通过该一个极板上该操作区对应位置处的电流发生变化，使得该一个极板上该操作区对应位置处的电压发生变化，继而输入至放大器9011的同相输入端的电压发生变化，继而使得放大器9011的输出端所输出的电压发生变化。该信号检测装置901输出的电压变化量可以 为操作区对应位置处所形成的电容C1的变化所引起的电压变化。
该实施方式提供的电子设备中，信号检测装置901可采用自容检测的方式检测平行板电容器的电容变化引起的电压变化值。
无论是互容检测方式，还是自容检测方式，放大器9011所直接检测到的平行板电容器的电容变化引起的电压变化值通常较小，为方便进一步进行数据处理，可先将该电压变化值进行放大处理。
图13为本申请实施例提供的一种电子设备的结构示意图五。图13示出了一种对信号检测装置901输出的信号进行放大处理的可选实施方式。如图13所示，电子设备本体90内还设置有：
信号放大电路903，用于对信号检测装置901输出的信号进行放大后输入处理器902。
通过信号放大电路903对信号检测装置901输出的信号放大处理后输入至处理器902，可使得处理器902基于信号检测装置901输出的信号对操作区的按压情况的确定更加准确。
若按键装置10的操作区内设有多个按压区域，当其中一个按压区域被按压时，其相邻按压区域所在位置对应的平行板电容器会发生一定的干扰，从而影响按压操作的检测准确度。
为解决相邻按压区域所在位置对应的平行板电容器会发生的干扰，提高按压操作的检测准确度，若按键装置10的操作区内设有多个按压区域，其信号放大电路903可以为差分放大电路，用于对相邻按压区域对应的该平行板电容器的电容变化引起的电压变化值进行差分放大后输入至处理器902。
在如上实施例的基础上，本申请实施例还提供一种电子设备。图14为本申请实施例提供的一种电子设备的结构示意图六。图14示出了一种针对多个按压区域，采用互容检测方式的实施场景。如图14所示，信号检测装置901包括：两个放大器9011、两个阻抗电路及差分放大电路904；每个放大器9011的同相输入端均连接至预设参考信号Vcom。
该平行板电容器的一个极板上操作区内的每个按压区域对应的引线均电连接至驱动信号Vdrv。
该平行板电容器的另一个极板上一个按压区域对应的引线可电连接至一个放大器9011的反相输入端，而该平行板电容器的另一个极板上另一个按压区域对应的引线可电连接至另一个放大器9011的反相输入端。
该平行板电容器的另一个极板上该每个按压区域对应的引线均电连接至放大器9011的反相输入端。
每个放大器9011的反相输入端分别通过一个阻抗电路连接至每个放大器9011的输出端。其中，一个放大器9011的反相输入端连接的阻抗电路可包括：并联的电阻Rf1和电容Cf1，另一个放大器9011的反相输入端连接的阻抗电路可包括：并联的电阻Rf2和电容Cf2。
差分放大电路904可对操作区内相邻按压区域对应的该平行板电容器的电容变化引起的电压变化值进行差分放大后输入至处理器902，有效提高按压情况的识别灵敏度，还可提高相邻按压区域的抗干扰能力。
在如上实施例的基础上，本申请实施例还提供一种电子设备。图15为本申请实施例提供的一种电子设备的结构示意图七。图15示出了一种针对多个按压区域，采用自容检测方式的实施场景。如图15所示，信号检测装置901包括：两个放大器9011及差分放大电路904；每个放大器9011的同相输入端均连接至驱动信号Vdrv。
该平行板电容器的一个极板上操作区内的一个按压区域对应的引线电连接至一个放大器9011的同相输入端。该平行板电容器的一个极板上另一个按压区域对应的引线电连接至另一个放大器9011的同相输入端。
该平行板电容器的一个极板上该一个按压区域对应的引线还连接至驱动信号Vdrv。其中，该一个极板上该一个按压区域对应的引线可通过电阻R1连接至Vdrv。
该该平行板电容器的一个极板上操作区内的另一个按压区域对应的引线还连接至驱动信号Vdrv。其中，该另一个极板上该另一个按压区域对应的引线可通过电阻R2连接至Vdrv。
而另一个极板上每个按压区域对应的引线均接地。
每个放大器9011的反相输入端均连接至该每个放大器9011的输出端。
差分放大电路904可对相邻按压区域对应的该平行板电容器的电容变化 引起的电压变化值进行差分放大后输入至处理器902，有效提高按压情况的识别灵敏度，还可提高相邻按压区域的抗干扰能力。
本领域普通技术人员可以理解：实现上述方法实施例的全部或部分步骤可以通过程序指令相关的硬件来完成，前述的程序可以存储于一计算机可读取存储介质中，该程序在执行时，执行包括上述方法实施例的步骤；而前述的存储介质包括：ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (12)

  1. 一种用于电子设备的按键装置，其特征在于，
    所述按键装置包括平行板电容器，所述平行板电容器的极板能够在所述按键装置的操作区被按压时产生变形，以改变所述平行板电容器的极板间距，所述平行板电容器的极板上设置有电连接引线，以连接至所述电子设备的信号检测装置；
    所述按键装置包括：设置所述操作区的面板和第一极板，所述面板为金属面板，所述面板和所述第一极板之间设置有可形变的介质层以形成所述平行板电容器，或者；
    所述按键装置包括：设置所述操作区的面板、第一极板和第二极板；所述第一极板设置在靠近所述面板的位置，所述第二极板设置在远离所述面板的位置；所述第一极板和所述第二极板之间设置有可形变的介质层以形成所述平行板电容器。
  2. 根据权利要求1所述的装置，其特征在于，若所述按键装置包括：设置所述操作区的面板和所述第一极板，则所述介质层中对应所述操作区的部分设置有胶合层，所述胶合层之外的部分为空气介质层；或者，
    若所述按键装置包括：设置所述操作区的面板、所述第一极板和所述第二极板，则所述介质层中对应所述操作区的部分为空气介质层，所述空气介质层之外的部分设置有胶合层。
  3. 根据权利要求1所述的装置，其特征在于，若所述按键装置包括：设置所述操作区的面板和所述第一极板，则所述第一极板为FPC，所述第一极板在背离所述面板的一侧固设有第一支撑板和第二支撑板；
    所述第一支撑板与所述FPC贴合，所述第一支撑板与所述第二支撑板之间形成间隙，所述间隙中对应所述操作区的部分为空气介质层，所述空气介质层之外的部分设置有胶合层。
  4. 根据权利要求1所述的装置，其特征在于，若所述按键装置包括：设置所述操作区的面板、所述第一极板和所述第二极板，则所述第一极板为第一FPC，所述第二极板为第二FPC；所述第一FPC朝向所述面板的一侧固设有第一支撑板，所述第二FPC背离所述面板的一侧固设有第二支撑板。
  5. 根据权利要求4所述的装置，其特征在于，所述第一支撑板与所述面 板之间，对应所述操作区的部分设置有胶合层；
    或者，所述第一支撑板与所述面板相贴合。
  6. 根据权利要求1所述的装置，其特征在于，若所述按键装置包括：设置所述操作区的面板、所述第一极板和所述第二极板，所述第一极板和所述第二极板中的一个为FPC，另一个为支撑板，所述支撑板为金属支撑板。
  7. 根据权利要求6所述的装置，其特征在于，所述第一极板为FPC，所述第二极板为第一支撑板，所述FPC朝向所述面板的一侧固设有第二支撑板；
    所述第二支撑板与所述面板之间，对应所述操作区的部分设置有胶合层；
    或者，所述第二支撑板与所述面板相贴合。
  8. 根据权利要求7所述的装置，其特征在于，所述面板围设在所述第一支撑板外部，所述面板与所述第一支撑板之间设置有至少一个垫片。
  9. 根据权利要求6所述的装置，其特征在于，所述第一极板为第一支撑板，所述第二极板为FPC，所述FPC背离所述面板的一侧固设有第二支撑板；
    所述第一支撑板与所述面板之间，对应所述操作区的部分设置有胶合层；
    或者，所述第一支撑板与所述面板相贴合。
  10. 根据权利要求3、4或9所述的装置，其特征在于，所述面板围设在所述第二支撑板外部，所述面板与所述第二支撑板之间设置有至少一个垫片。
  11. 一种电子设备，其特征在于，包括电子设备本体，所述电子设备本体上设置有如权利要求1-10中任一项所述的用于电子设备的按键装置，所述电子设备本体上还设置有信号检测装置和处理器；
    所述信号检测装置，用于接收所述按键装置输出的平行板电容器中操作区对应的极板电压信号，确定所述操作区对应的所述平行板电容器的电容变化引起的电压变化值；
    所述处理器，用于根据所述信号检测装置输出的所述电压差值，确定所述操作区的按压情况。
  12. 根据权利要求11所述的设备，其特征在于，所述操作区内设有多个按压区域，所述信号放大电路为差分放大电路，用于对所述操作区内相邻按压区域对应的所述平行板电容器的电容变化引起的电压变化值进行差分放大后输入所述处理器。
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