WO2018210141A1

WO2018210141A1 - Sensor assembly, cover plate assembly, display assembly, and electronic device

Info

Publication number: WO2018210141A1
Application number: PCT/CN2018/085659
Authority: WO
Inventors: 周意保
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-05-17
Filing date: 2018-05-04
Publication date: 2018-11-22
Also published as: CN107135290A

Abstract

Disclosed, in embodiments of the present application, is a sensor assembly, comprising a light emitter, a light receiver, and a light shielding structure. The light emitter is used for emitting light to the outside; the light receiver is used for receiving reflected light formed by reflecting the light; the light shielding structure comprises a body and an extension portion extending from the top of the body; the extension portion partially covers the light receiver. The present application also provides a cover plate assembly, a display assembly, and an electronic device.

Description

Sensor assembly, cover assembly, display assembly, and electronic device

[0001] This application claims priority to Chinese Patent Application, filed on May 17, 2017, to the Chinese Patent Office, Application No. CN201710348423.6, entitled "A Sensor Assembly, Cover Assembly, Display Assembly, and Terminal" The entire contents of which are incorporated herein by reference.

Technical field

[0001] The present application relates to the field of electronic device technologies, and in particular, to a sensor component, a cover assembly, a display assembly, and an electronic device.

Background technique

[0003] With the rapid development of electronic device technology, electronic devices have become more and more popular, and have become an indispensable device in people's lives. People can learn, entertain, etc. through electronic devices.

[0004] Currently, the non-display area of the touch panel of the electronic device is transparent, in order to make the electronic device more beautiful.

It is generally possible to spray ink under the non-display area of the touch panel to form a multilayer ink to cover the structure inside the electronic device.

[0005] In the prior art, the proximity sensor of an electronic device is usually implemented by using an infrared emitter and an infrared receiver. The infrared emitter emits infrared light, which is reflected by the barrier to form reflected light. After receiving the reflected light, the infrared receiver determines whether the electronic device is close to or away from the obstacle according to the intensity of the reflected light.

SUMMARY OF THE INVENTION

[0007] Embodiments of the present application provide a sensor assembly, a cover assembly, a display assembly, and an electronic device, which can improve proximity sensor sensitivity.

[0008] In a first aspect, an embodiment of the present application provides a sensor assembly, including a light emitter, a light receiver, and a light shielding structure, wherein the light emitter is configured to emit light to the outside, and the light receiver is configured to receive the light. The reflected light formed by the reflection, the light shielding structure includes a body and an extension extending from a top end of the body, the extension partially covering the light receiver.

[0009] In a second aspect, the embodiment of the present application further provides a cover assembly, including a sensor assembly, a cover plate, and an adhesion layer disposed on a side of the cover plate, wherein the sensor component is disposed on the cover plate to be attached One of the layers On the side, the sensor component is the above sensor component.

[0010] In a third aspect, the embodiment of the present application further provides a display assembly, including a liquid crystal panel and a cover assembly, the cover assembly covers a portion of the liquid crystal panel, and the cover assembly is the cover assembly. .

[0011] In a fourth aspect, an embodiment of the present application further provides an electronic device, including a housing and a sensor assembly, the sensor assembly is mounted inside the housing, and the sensor component is the sensor component.

[0012] In a fifth aspect, an embodiment of the present application further provides an electronic device, including a housing and a cover assembly, the cover assembly is mounted on the housing, and the cover assembly is the cover assembly.

Brief description of the drawing

DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. Obviously, the drawings in the following description are only some of the present application. For the embodiments, those skilled in the art can obtain other drawings according to the drawings without any creative work.

[0014] FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

FIG. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

3 is a schematic structural view of a cover plate according to an embodiment of the present application.

[0017] FIG. 4 is a schematic structural diagram of a sensor assembly according to an embodiment of the present application.

[0018] FIG. 5 is another schematic structural diagram of a sensor assembly according to an embodiment of the present application.

[0019] FIG. 6 is still another schematic structural diagram of a sensor assembly according to an embodiment of the present application.

7 is a schematic structural view of a cover assembly according to an embodiment of the present application.

[0021] FIG. 8 is another schematic structural diagram of a cover assembly according to an embodiment of the present application.

[0022] FIG. 9 is still another schematic structural view of a cover assembly according to an embodiment of the present application.

FIG. 10 is still another schematic structural view of a cover assembly according to an embodiment of the present application.

[0024] FIG. 11 is a schematic view showing the photosensitive member of a cover assembly according to an embodiment of the present application.

[0025] t m^

[0026] The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all An embodiment. All other embodiments obtained by a person skilled in the art based on the embodiments of the present application without creative efforts are within the scope of the present application.

[0027] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "previous" ", "after", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "shun", "reverse needle" Orientation or positional relationship of the indications is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply that the device or component referred to has a specific orientation, Azimuth construction and operation are therefore not to be construed as limiting the application. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality" means two or more, unless specifically defined otherwise.

[0028] In the description of the present application, it should be noted that the terms "installation", "connected", and "connected" should be understood broadly, unless otherwise explicitly defined and limited. For example, it may be a fixed connection, or It is detachable, or connected integrally; it can be mechanically connected, it can be electrically connected or can communicate with each other; it can be connected directly or indirectly through an intermediate medium, it can be the internal connection of two components or two components Interaction relationship. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

[0029] In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include the first sum, unless otherwise specifically defined and defined. The second feature is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely indicates that the first feature level is less than the second feature

[0030] The following disclosure provides many different embodiments or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the application. In addition, this application can be weighted in different examples. The reference numerals and/or reference numerals are used for simplicity and clarity and do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

[0031] In actual use, a part of the infrared ray emitted by the infrared emitter directly enters the infrared receiver through the reflection inside the electronic device, that is, the infrared ray received by the infrared receiver is composed of two parts, and part of it is The reflective object forms a reflected light after reflection, and a part is infrared light reflected inside the electronic device, which causes the infrared receiver to receive infrared rays larger than the actual value, and may even make the receiver full scale; therefore, the sensitivity of the infrared receiver is very high. Low, will result in inaccurate test results.

[0032] Embodiments of the present application provide a sensor assembly, a cover assembly, a display assembly, and an electronic device, which will be separately described in detail below.

[0033] Embodiments of the present application provide a sensor assembly including a light emitter, a light receiver, and a light shielding structure.

[0034] The light emitter is configured to emit light to the outside, the light receiver is configured to receive the reflected light formed by the light being reflected, the light shielding structure comprises a body and an extension extending from a top end of the body, the extension The portion partially covers the light receiver.

[0035] In an embodiment, the extension portion is located on a side close to the light emitter and extends in a horizontal direction toward the light receiver.

[0036] In an embodiment, the extension portion is located on a side away from the light emitter and extends in a horizontal direction toward the light emitter.

[0037] In an embodiment, the extension portion is located on a side close to the light emitter and extends obliquely upward toward the light receiver.

[0038] In an embodiment, the light shielding structure includes a first receiving space and a second receiving space, wherein the first receiving space and the second receiving space are respectively configured to receive the light emitter and the light receiver.

[0039] In an embodiment, the light shielding structure is a black silicone sleeve.

[0040] In an embodiment, the light emitter is spaced apart from the light receiver, and a center distance between the light emitter and the light receiver is 2 mm to 6 mm.

[0041] In an embodiment, further comprising a circuit board, wherein the light emitter and the light receiver are disposed in the circuit On the board.

[0042] In an embodiment, an ambient light sensor is further included, and the ambient light sensor is spaced apart from the light emitter and the light receiver.

[0043] Embodiments of the present application further provide a cover assembly, including a sensor assembly, a cover plate, and an adhesion layer disposed on one side of the cover plate, wherein the sensor assembly is disposed on the cover plate having an adhesion layer The sensor assembly is the sensor assembly of any one of claims 1 to 9.

[0044] In an embodiment, the light shielding structure is spaced apart from the cover plate.

[0045] In an embodiment, the adhesion layer includes a first adhesion layer and a second adhesion layer;

[0046] the first adhesion layer is disposed on a side of the cover plate adjacent to the sensor assembly;

[0047] the second adhesion layer is disposed on a side of the first adhesion layer adjacent to the sensor component;

[0048] the second adhesion layer is provided with a first light-transmitting region for the light emitter to emit light, and a second light-transmitting region for receiving light by the light receiver, the first adhesion layer The layer covers the first light transmissive area and the second light transmissive area of the second adhesive layer such that the light transmissive area is hidden from view from the outer shape of the cover.

[0049] In an embodiment, the transmittance of the first adhesion layer is greater than the transmittance of the second adhesion layer.

[0050] In an embodiment, the first adhesion layer is a white ink layer, and the second adhesion layer is a black ink layer.

[0051] In an embodiment, the first light transmitting region and the second light transmitting region are both through holes.

[0052] In an embodiment, the cover plate includes a display area and a non-display area, and the non-display area is disposed around the display area.

[0053] In an embodiment, the ink is sprayed under the non-display area of the cover.

[0054] Embodiments of the present application further provide a display assembly including a liquid crystal panel and a cover assembly, the cover assembly covering a portion of the liquid crystal panel, wherein the cover assembly is according to any one of claims 10 to 14. The cover assembly described.

[0055] Embodiments of the present application further provide an electronic device including a housing and a sensor assembly, the sensor assembly being mounted inside the housing, and the sensor assembly being the sensor assembly described above.

[0056] Embodiments of the present application further provide an electronic device including a housing and a cover assembly, the cover assembly is mounted on the housing, and the cover assembly is the cover assembly. 1 to 11, the electronic device 1000 in the embodiment of the present application includes: a cover 10, a proximity sensor 20, an ambient light sensor 30, a printed circuit board 40, a fingerprint recognition module 50, and a sound source for the receiver. Pupil 60.

[0058] wherein the proximity sensor 20 and the ambient light sensor 30 are both located under the cover 10, and the proximity sensor 20 and the ambient light sensor 30 are both disposed on the printed circuit board 40 of the electronic device and electrically connected to the printed circuit board. . The proximity sensor 20 may include a light emitter 22 for emitting light to the outside, and a light receiver 21 for receiving reflected light formed by the light being reflected; The emitter 22 may be an infrared emitter or the like, such as an IR LED (infrared light emitting diode) or the like; the light receiver 21 may be an infrared receiver or the like.

[0059] The electronic device 1000 can determine whether the electronic device 1000 and the external object are in a close state or a distant state according to the intensity value of the light received by the light emitter 22 and the light receiver 21, thereby controlling the electronic device 1 000.

[0060] The light emitter 22 and the ambient light sensor 30 of the proximity sensor 20 may be integrated in the same module, as shown in FIG. 9, for example, the receiving end of the module can receive the invisible light emitted by the light emitter 22 ( Such as infrared signals, it can also sense the visible light of the external environment. Of course, in other embodiments, the ambient light sensor 30 can also be integrated in the same module as the light receiver 21.

[0061] In some embodiments, the light emitter 22 and the ambient light sensor 30 can also be disposed separately. The light emitter 22 and the ambient light sensor 30 are two independent devices, and the light emitter 22 and the ambient light sensor 30. Can be connected to each other, such as side by side settings.

The cover assembly 100 of the embodiment of the present application can be applied to an electronic device 1000, such as an electronic device such as a mobile phone or a tablet computer. It will be appreciated that the electronic device 1000 includes, but is not limited to, an example of the present embodiment.

[0063] In a practical application, the proximity sensor 20 can pass the monitoring light emitter 22 after the electronic device 1000 is in a conversation.

(such as IR LED) The emitted infrared light determines whether the electronic device 1000 is close to the face. When it is judged that the electronic device 1000 is close to the face, the backlight of the screen can be turned off, thereby saving power and preventing malfunction. Further, the electronic device 1000 can perform simple gesture recognition or the like using the plurality of proximity sensors 20, and then perform corresponding operations and the like based on the recognition result.

[0064] wherein the cover 10 can be a touch panel, a display panel, a touch display panel, or have other functions. Electronic device panels and more. Specifically, as shown in FIG. 3, the cover 10 may include: a transparent substrate 11, a first adhesion layer group 17, and a second adhesion layer 18. It can be understood that the transparent substrate 11 is the design surface of the cover plate assembly 100 facing the user. The user can perform a gesture operation on the surface of the transparent substrate 11, such as clicking or sliding to control the electronic device 1000 to implement the corresponding function.

[0065] The cover 10 may be a clear glass cover. In some embodiments, the cover 10 can be a cover glass made of a material such as sapphire.

Further, the transparent substrate 11 includes a display area 14 and a non-display area 15; generally, an intermediate area of the transparent substrate 11 serves as a display area 14, and a non-display area 15 is disposed around the display area 14. For example, the non-display area 15 is disposed on the top side or the bottom side of the display area 14. Referring to FIG. 2, the top non-display area 15 of the transparent substrate 11 is further provided with a front camera aperture 16. In some embodiments, the front camera aperture 16 may be omitted or removed. Referring to the electronic device 1000 shown in FIG. .

Since the cover 10 is made of a light transmissive material, the user can view the content displayed on the screen of the electronic device 100 through the display area 14.

[0068] In order to make the electronic device 1000 more aesthetically pleasing, ink may be sprayed under the non-display area 15. The ink not only satisfies the user's demand for the electronic device 1000 of different colors, but also covers the structure inside the electronic device 1000 to beautify the effect of the electronic device 1000.

[0069] Further, a first adhesion layer group 17 is disposed under the non-display area 15 and a second adhesion layer 18 is disposed under the first adhesion layer group 17. It can be understood that the number of the first adhesion layer 170 included in the first adhesion layer group 17 can be set according to actual needs, such as 1 layer, 2 layers, 3 layers, and the like. As shown in FIG. 7, the present embodiment describes the cover 10 of the present application by taking the first adhesion layer group 17 including a first adhesion layer 170 as an example. Of course, as shown in FIG. 8, in other embodiments, the first adhesion layer group 17 may include three layers of the first adhesion layer 170.

[0070] The first adhesion layer 17 and the second adhesion layer 18 may be formed by a spray coating process such as electrostatic spraying, powder coating process, or the like. The first adhesive layer 17 may be a flat or complete first adhesive layer, that is, the surface of the first adhesive layer 17 is uniformly sprayed with light-transmitting ink, so that the first adhesive layer 17 - the entire surface of the layer has a light-transmitting ink.

[0071] The transmittance of the first adhesion layer 17 is greater than the transmittance of the second adhesion layer 18.

[0072] For example, the transmittance of the first adhesion layer 17 may be 80% or more, and the transmittance of the second adhesion layer 18 It can be 10% or less. In practical applications, the first adhesion layer 17 may be referred to as a transmission layer for transmitting most of the light, and the second adhesion layer 18 may be referred to as an occlusion layer for shielding most of the light.

[0073] The second adhesion layer 18 can block the external ambient light or the light inside the electronic device 1000, and achieve the effect of covering the structure inside the electronic device 1000, so that the appearance of the electronic device 1000 is more beautiful. The ink color of the second adhesive layer 18 may be black, gray or the like, as long as the transmittance of the second adhesive layer 18 is greater than that of the first adhesive layer 17, and the specific situation may be set according to actual needs.

[0074] The first adhesive layer group 17 can serve as a protection for the second adhesive layer 18, prevent the second adhesive layer 18 from being damaged, and can also satisfy the user's demand for the electronic device 1000 of different colors. For example, the ink color of the first adhesive layer 17 may be white, blue or the like, as long as the transmittance of the first adhesive layer 17 is smaller than that of the second adhesive layer 18. The specific situation may be set according to actual needs.

[0075] In order to meet the requirements of the proximity sensor 20 and the ambient light sensor 30 for transmitting and receiving light, the second adhesive layer 18 needs to be provided with two light-transmissive regions, that is, a second adhesive layer 18 is provided for the proximity sensor to emit. A first light transmissive region 181 of light, and a second light transmissive region 182 for receiving light from the proximity sensor 20. The second adhesive layer includes a first light-transmitting region 181, a second light-transmitting region 182, and a light-shielding region 184. The first light-transmitting region 181 and the second light-transmitting region 182 are used for projecting light, and the light-shielding region 184 is for blocking light. The first light transmitting region 181 and the second light transmitting region 182 are defined by the light shielding region 184. The first adhesion layer 170 covers the first light-transmissive region 181 and the second light-transmissive region 182 such that the first light-transmissive region 181 and the second light-transmissive region 182 are hidden from view by the electronic device.

[0076] The light emitter 22 is located below the first light-transmitting region 181, and is configured to emit light to the outside through the first light-transmitting region; the light receiver 21 is located in the second light-transmitting Below the region 182, the light emitted by the light emitter 22 is received through the second light transmitting region 182. The ambient light sensor 30 can be located below the first light transmissive region 181.

[0077] As an embodiment of the present application, the first light-transmitting region 181 and the second light-transmitting region 182 on the second adhesive layer 18 are all hollowed out to form a through hole, that is, the first light-transmitting region 181. And the second light transmitting region 182 are both through holes. Thus, the light emitted by the proximity sensor is transmitted to the outside through one of the through holes, and the other sensor is used to receive the light from the proximity sensor.

[0078] The shape of the first light transmitting region 181 and the second light transmitting region 182 may be set according to actual needs. For example, it can be formed as a circle, a rectangle, a rounded rectangle, or the like. The first light transmitting region 181 and the second light transmitting region 182 The size can also be set according to actual needs, for example, it can be a circular aperture, and the aperture can be between l. lmm-1.3 mm, or between 2 mm and 3 mm. In this embodiment, in order to improve the ability of the light receiver 21 to receive light, and to increase the sensitivity of the sensor, the pupil area of the second light-transmitting region 182 may be larger than the pupil area of the first light-transmitting region 181.

[0079] In the embodiment of the present application, since the hole is not formed on the second adhesion layer 18 and is not punctured on the first adhesion layer 170, the panel layout design and the manufacturing process can be simplified, which can be simplified compared with the prior art. The manufacturing process of the intelligent electronic device greatly enhances the appearance and expression of the electronic device 1000.

[0080] Furthermore, since the pupil is not punctured only on the second adhesive layer 18, the pupil is not punctured on the first adhesive layer 170, so that there is no pupil limitation of the appearance of the electronic device 1000, and thus the size of the pupil on the second adhesive layer 18. The shape and shape are not limited, and can be set according to the actual light-emitting requirements of the sensor device (generally, the larger the hole is, the better), the flexibility of the pupil and the performance of the proximity sensor 20 and the ambient light sensor 30 are improved.

[0081] Considering that if the distance between the light emitter 22 and the light receiver 21 is relatively close, since the first adhesion layer 17 is blocked, the light transmittance is low, and the light is diffracted in the first adhesion layer 170. , and the diffraction value is relatively large. Therefore, the optical receiver 21 will directly reach the full scale, that is, the current proximity value of the optical receiver 21 directly jumps to the maximum value or the upper limit value of the approximate value range, and the electronic device 1000 may appear. Misoperation (such as mistakenly thinking that the electronic device 1000 is close to the obstruction to perform the screen-out operation). In addition, the proximity value of the optical receiver 21 does not change, and the light change will not be sensed, and the electronic device 1000 cannot be monitored whether it is close to the obstruction, which reduces the sensing accuracy and performance of the proximity sensor 20.

In order to prevent the proximity sensor 20 from directly convulsing the light by the full scale, thereby improving the sensing accuracy and performance of the proximity sensor 20, the present embodiment may provide a light shielding structure 183 including the body 1 831 and the top of the body. An extended extension portion 1832 partially covers the light receiver 21 such that light diffracted within the first adhesion layer 170 cannot enter the light receiver 21. Its implementation is as follows:

[0083] As shown in FIG. 4, the light shielding structure 183 includes a first receiving space and a second receiving space. The first receiving space and the second receiving space are respectively configured to receive the light emitter 22 and the light receiver 21, and the light blocking structure 183 The extension portion 1832 is located on the side close to the light emitter 22 and extends in the horizontal direction toward the light receiver 21.

As shown in FIG. 5, in another embodiment, the extension portion 1832 is located on a side away from the light emitter 22 and extends horizontally toward the light emitter 22.

[0085] As shown in FIG. 6, in another embodiment, the extension portion 1832 is located on a side close to the light emitter 22, and The light receiver 21 extends obliquely upward.

[0086] wherein, the light shielding structure may be a black silicone sleeve. The light emitter 22 is spaced apart from the light receiver 21, and the center distance between the light emitter 22 and the light receiver 21 is 2 mm to 6 mm. The center distance is the distance between the geometric center of the light emitter 22 and the geometric center of the light receiver 21.

As shown in FIG. 11, the proximity sensing process is such that the light emitter 22 generates infrared rays, and the infrared rays are transmitted to the outside through the first light transmitting region 181 and the first adhesive layer 170, and the covering object 70 is encountered. After being reflected to the transparent substrate 11 and then reflected by the transparent substrate 11 to the covering 70, after being reflected by the covering 70 and the cover 10, the infrared rays are received by the first adhesive layer 170 and the second transparent region 182. The device 21 receives. A portion of the infrared rays are also diffracted inside the electronic device after being emitted by the light emitter 22, for example, continuously reflected inside the electronic device via the second adhesive layer 18 and the transparent substrate 11, and reflected to the extension of the light shielding structure 183, due to the extension portion. The presence of this portion makes it impossible for the portion of the infrared ray to enter the light receiver 21.

[0088] In order to improve the sensing accuracy and performance of the proximity sensor 20, the present embodiment can also extend the distance between the light emitter 22 and the light receiver 21. Preferably, the distance between the light emitter 22 and the light receiver 21 may be between 2 mm and 6 mm. Correspondingly, the distance between the first transparent region 181 and the second transparent region 182 may be between 2 mm and 6 mm, and the distance between the first transparent region 181 and the second transparent region 182 may be The center distance is the distance between the center of the first light transmitting region 181 and the center of the second light transmitting region 182.

As shown in FIG. 9, in the cap assembly 100, if the light emitter 22 and the ambient light sensor 30 are integrated in one device, the distance between the neon emitter 22 and the photoreceiver 21 is an integrated device. The distance from the light receiver 21. In the present embodiment, the extending portion of the light shielding structure 183 is located on the side close to the light emitter 22 and extends in the horizontal direction toward the light receiver 21.

As shown in FIG. 10, in another embodiment of the cover assembly 100, the extension may be located on a side away from the light emitter 22 and extend horizontally toward the light emitter 22. Further, the shape of the extension portion may be designed according to actual needs. For example, the cross-sectional view of the extension portion may be a straight line or a wave shape or the like.

[0091] As shown in FIG. 4, for ease of assembly, the sensor assembly may be separately fabricated, including the light emitter 22 and the light receiver 21, and then assembled with the cover plate. The sensor assembly can include a circuit board with the light emitter 22 and the light receiver 21 disposed on the circuit board. [0092] Embodiments of the present application further provide a display assembly including a liquid crystal panel and a cover assembly, the cover assembly covering a portion of the liquid crystal panel, and the cover assembly is the cover assembly.

[0093] Embodiments of the present application also provide an electronic device including a housing and a sensor assembly, the sensor assembly being mounted inside the housing, and the sensor assembly being the sensor assembly described above.

[0094] Embodiments of the present application also provide an electronic device including a housing and a cover assembly, the cover assembly being mounted on the housing, and the cover assembly being the cover assembly described above.

[0095] In summary, the embodiments of the present application provide a sensor assembly, a cover assembly, a display assembly, and an electronic device, the sensor assembly including a light emitter, a light receiver, and a light shielding structure, and the light emitter is used to the outside The light receiver is configured to receive the reflected light formed by the light being reflected. The light shielding structure comprises a body and an extension extending from a top end of the body, the extension portion partially covering the light receiver. This solution makes the measured data more accurate by covering the extension above the light receiver so that the extension can absorb the diffracted light inside part of the electronic device. Therefore, the solution can improve the sensitivity of the proximity sensor, effectively avoiding the judgment error or the judgment failure.

[0096] Although the present application has been shown and described with respect to the embodiments of the embodiments of the invention, This application includes all such modifications and variations, and is only limited by the scope of the appended claims. With particular regard to the various functions performed by the above-described components, the terms used to describe such components are intended to correspond to any component that performs the specified function of the component (eg, which is functionally equivalent) (unless otherwise indicated) Even if it is structurally not identical to the public structure for performing the functions in the exemplary implementation of the present specification shown herein. Moreover, although specific features of the specification have been disclosed with respect to only one of several implementations, such features may be combined with one or more other implementations as may be desirable and advantageous for a given or particular application. A combination of other features. Moreover, to the extent that the terms "comprising", "having", "comprising" or "comprising" are used in the particular embodiments or claims, such terms are intended to be encompassed in a manner similar to the term "comprising."

[0097] A sensor assembly, a cover assembly, a display assembly, and an electronic device provided by the embodiments of the present application are described in detail above. The principles and implementations of the present application are described herein by using specific examples. The description of the above embodiments is only for helping to understand the method and the core idea of the present application. Similarly, for those skilled in the art, according to the present application. Thought, in the specific implementation and scope of application There is a change in the above, and the contents of this specification should not be construed as limiting the present application.

Claims

Claim

[Claim 1] A sensor assembly, comprising: a light emitter, a light receiver, and a light blocking structure; the light emitter is configured to emit light to the outside, and the light receiver is configured to receive the light beam after being reflected Reflecting light, the light shielding structure includes a body and an extension extending from a top end of the body, the extension partially covering the light receiver.

[Claim 2] The sensor assembly according to claim 1, wherein the extension portion is located on a side close to the light emitter and extends in a horizontal direction toward the light receiver.

[Claim 3] The sensor assembly according to claim 1, wherein the extension portion is located on a side away from the light emitter and extends in a horizontal direction toward the light emitter.

[Claim 4] The sensor assembly according to claim 1, wherein the extension portion is located on a side close to the light emitter and extends obliquely upward toward the light receiver.

The sensor assembly of claim 1 , wherein the light shielding structure comprises a first receiving space and a second receiving space, wherein the first receiving space and the second receiving space are respectively for receiving the light Transmitter and light receiver.

[Claim 6] The sensor assembly according to claim 1, wherein the light shielding structure is a black silicone sleeve

[Claim 7] The sensor assembly according to claim 1, wherein the light emitter is spaced apart from the light receiver, and a center distance between the light emitter and the light receiver is 2 mm to 6 mm

[Claim 8] The sensor assembly according to any one of claims 1 to 7, further comprising a circuit board, the light emitter and the light receiver being disposed on the circuit board.

The sensor assembly according to any one of claims 1 to 8, further comprising an ambient light sensor, the ambient light sensor being spaced apart from the light emitter and the light receiver.

[Claim 10] A cover plate assembly, comprising: a sensor assembly, a cover plate, and an adhesion layer disposed on one side of the cover plate, wherein the sensor assembly is disposed on a side of the cover plate having an adhesion layer, The sensor assembly is the sensor assembly of any one of claims 1 to 9.

[Claim 11] The cap assembly according to claim 10, wherein the light shielding structure is spaced apart from the cap plate. The cover plate assembly according to claim 10, wherein the adhesion layer comprises a first adhesion layer and a second adhesion layer;

The first adhesive layer is disposed on a side of the cover plate adjacent to the sensor component; the second adhesive layer is disposed on a side of the first adhesive layer adjacent to the sensor component, the second attachment The layer is provided with a first light-transmissive area for emitting light by the light emitter, and a second light-transmissive area for receiving light by the light receiver, the first adhesion layer covering the second adhesion layer The first light transmissive area and the second light transmissive area are such that the light transmissive area is hidden from view from the outer shape of the cover.

The cover plate assembly according to claim 12, wherein a transmittance of the first adhesion layer is greater than a transmittance of the second adhesion layer.

The cover assembly of claim 12, wherein the first adhesive layer is a white ink layer and the second adhesive layer is a black ink layer.

The cover assembly of claim 12, wherein the first light transmitting region and the second light transmitting region are both through holes.

The cap assembly according to claim 10, wherein the cap plate includes a display area and a non-display area, and the non-display area is disposed around the display area.

The cover assembly of claim 16, wherein the ink is sprayed under the non-display area of the cover.

A display assembly, comprising a liquid crystal panel and a cover assembly, the cover assembly covering a portion of the liquid crystal panel, the cover assembly being the cover assembly of any one of claims 10 to 14.

An electronic device, comprising a housing and a sensor assembly, the sensor assembly being mounted inside the housing, the sensor assembly being the sensor assembly of any of claims 1-9.

An electronic device, comprising a housing and a cover assembly, the cover assembly being mounted on the housing, the cover assembly being the cover assembly of any of claims 10-17.