CN106686215B

CN106686215B - Sensor assembly and mobile terminal

Info

Publication number: CN106686215B
Application number: CN201611111621.2A
Authority: CN
Inventors: 张海平; 周意保
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2016-12-06
Filing date: 2016-12-06
Publication date: 2022-03-25
Anticipated expiration: 2036-12-06
Also published as: CN106686215A

Abstract

The invention provides a sensor assembly and a mobile terminal. The sensor component comprises at least one light emitter and at least one light receiver, wherein each light receiver at least corresponds to one light receiver; each optical transmitter is provided with an emergent surface for emitting optical signals, and the optical signals are reflected by barriers to form reflection signals; each light receiver is provided with a light incident surface for receiving corresponding reflection signals, and the included angle between the light emergent surface and the light incident surface at one side of the emergent light signals is less than 180 degrees. In the mobile terminal provided by the invention, the included angle of less than 180 degrees is formed between the light emitting surface of the light emitter and the light incident surface of the light receiver, so that the quantity of light signals received by the light receiver can be increased, and the detection sensitivity can be improved.

Description

Sensor assembly and mobile terminal

Technical Field

The present invention relates to the field of communications, and in particular, to a sensor module and a mobile terminal.

Background

With the rapid development of terminal technology, intelligent terminals are more and more popular and become essential devices in people's life. People can learn, entertain and the like through the intelligent terminal.

In the prior art, a mobile terminal is provided with a proximity sensor. The proximity sensor is arranged below the glass cover plate. The proximity sensor is used to determine whether the mobile terminal is in a close state or a distant state from an external object. The proximity sensor includes an infrared emitter and an infrared receiver. The infrared emitter emits infrared rays outwards, the infrared rays form reflected light after being reflected by an external object, the infrared receiver receives the reflected light, and then whether the mobile terminal is in a close state or a far state with the external object is judged according to the intensity of the received reflected light.

In practical application, the glass cover plate is provided with an ink layer. When the infrared emitter emits infrared rays outwards, part of the infrared rays enter the ink layer to be diffracted, so that optical signals received by the optical receiver are less, and the sensitivity of the proximity sensor is low.

Disclosure of Invention

The embodiment of the invention provides a sensor assembly and a mobile terminal, which can improve the detection sensitivity of the sensor assembly.

The embodiment of the invention provides a sensor component, which comprises at least one light emitter and at least one light receiver, wherein each light receiver at least corresponds to one light receiver;

each optical transmitter is provided with an emergent surface for emitting optical signals, and the optical signals are reflected by barriers to form reflection signals;

each light receiver is provided with a light incident surface for receiving corresponding reflection signals, and the included angle between the light emergent surface and the light incident surface at one side of the emergent light signals is less than 180 degrees.

The embodiment of the invention provides a mobile terminal, which comprises a cover plate, a shell, a display panel and a sensor assembly, wherein the cover plate is arranged on the shell; the sensor assembly is arranged in the shell, the display panel is arranged on the shell, and the cover plate covers the display panel; the sensor assembly is any one of the sensor assemblies described above.

As can be seen from the above, in the mobile terminal provided in this embodiment, since an included angle smaller than 180 degrees is formed between the light emitting surface of the light emitter and the light incident surface of the light receiver, the amount of the light signal received by the light receiver can be increased, which is beneficial to improving the detection sensitivity.

Drawings

Fig. 1 is a schematic structural diagram of a mobile terminal in a preferred embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a cover plate assembly according to a preferred embodiment of the present invention.

Fig. 3 is a schematic view of a mounting structure of the first light emitter in a preferred embodiment of the invention.

Fig. 4 is a schematic view of another mounting structure of the first light emitter in a preferred embodiment of the invention.

Fig. 5 is a schematic view of an installation structure of the first optical receiver in a preferred embodiment of the present invention.

Fig. 6 is a schematic view of another mounting structure of the first optical receiver in a preferred embodiment of the invention.

Fig. 7 is another structural diagram of the cover plate assembly in a preferred embodiment of the invention.

Fig. 8 is a schematic view of another structure of a cover plate assembly in a preferred embodiment of the invention.

Fig. 9 is a first structural schematic diagram of a sensor assembly in a preferred embodiment of the invention.

Fig. 10 is a schematic view of an installation structure of the second optical receiver in a preferred embodiment of the present invention.

Fig. 11 is a schematic view of another mounting structure of the second optical receiver in a preferred embodiment of the invention.

Fig. 12 is a second structural schematic diagram of a sensor assembly in a preferred embodiment of the invention.

FIG. 13 is a third schematic diagram of a sensor assembly in accordance with a preferred embodiment of the present invention.

Fig. 14 is a schematic diagram of a fourth structure of a sensor assembly in a preferred embodiment of the invention.

Fig. 15 is a schematic diagram of a fifth construction of a sensor assembly in accordance with a preferred embodiment of the present invention.

Fig. 16 is a diagram illustrating a sixth structure of a sensor assembly according to a preferred embodiment of the present invention.

Fig. 17 is a schematic view of a mounting structure of a second optical emitter in a preferred embodiment of the invention.

Fig. 18 is a schematic view of another mounting structure of the second optical emitter in a preferred embodiment of the invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 1, fig. 1 is a structural diagram of a mobile terminal 1 in a preferred embodiment of the present invention, where the mobile terminal 1 may be an electronic device such as a mobile phone and an IPAD. The mobile terminal 1 includes a housing 10, a face plate 20, and a cover plate assembly 30.

The housing 10 serves to form an outer contour of the mobile terminal 1 and to mount other components therein.

The panel 20 may be a display panel, a touch display panel, or the like. The panel 20 is mounted on the housing 10.

Referring to fig. 2, the cover assembly 30 includes a sensor assembly 31 and a cover 32, the sensor assembly 31 is disposed in the housing 10, the panel 20 is disposed on the housing 10 and connected to the housing 10, and the cover 32 covers the panel 20 to protect the panel 20. The cover 32 has a non-display area 30a and a display area opposite 30 b. The non-display area 30a is substantially white or other light color, and is capable of transmitting part of invisible light and visible light. The display area 30b is transparent so that the mobile terminal 1 can present the picture on the panel 20 to the user through the display area 30 b.

In some embodiments, the mobile terminal 1 further includes a receiver assembly, and correspondingly, the cover plate 32 has a corresponding receiver hole 300.

In some embodiments, the mobile terminal 1 further comprises a fingerprint module 40 for inputting the fingerprint information of the user by the user.

The sensor assembly 31 includes a first light emitter 311, a first light receiver 312, an ambient light sensor 313, a circuit board 314, a first support pad 315, and a second support pad 316. The first light emitter 311, the first light receiver 312, the ambient light sensor 313, the circuit board 314, the first support pad 315, and the second support pad 316 are disposed on the circuit board 314, and the first light emitter 311, the first light receiver 312, and the ambient light sensor 313 are electrically connected to the circuit board 314. The circuit board 314 may also be another carrier board for carrying the light emitter, the light receiver, and the ambient light sensor 313. For example, the carrier plate may be a package substrate or a circuit board.

The first light emitter 311 has an exit surface for emitting invisible light with a wavelength greater than 850nm as a first light, such as infrared light. The first light is reflected by the barrier 70 to form a first reflected light. The first light receiver 312 has a light incident surface for receiving the reflected light. The ambient light sensor 313 is used to detect ambient brightness.

The first optical transmitter 311, the first optical receiver 312 and the ambient light sensor 313 are disposed on the circuit board 314 along a straight line, and the sequence is not limited as long as the distance between the first optical transmitter 311 and the first optical receiver 312 is maintained at a predetermined value.

The first light emitter 311 is disposed on the circuit board 314 through the first supporting pad 315, the first supporting pad 315 is disposed on the circuit board 314, and the first light emitter is disposed on the first supporting pad 315. The first light receiver 312 is disposed on the circuit board 314 through the second support pad 316, the second support pad 316 is disposed on the circuit board 314, and the first light receiver 312 is disposed on the second support pad 316. Therefore, an included angle between the light emitting surface of the first light emitter 311 and the light incident surface of the first light receiver 312 on one side of the emitted light signal is P, and the included angle P is smaller than 180 degrees. In practical applications, the included angle P ranges from 110 degrees to 145 degrees.

As shown in fig. 3, the first supporting pad 315 is substantially in the shape of a block with a flat bottom surface, and the top of the first supporting pad is inclined, so that a first mounting surface 315a is formed at the top of the inclined shape, after the first supporting pad 315 is mounted on the circuit board 314, the first mounting surface 315a of the first supporting pad 315 faces one side of the first optical receiver 312, and an included angle between the first mounting surface 315a and the circuit board 314 is P. The first light emitter 311 is bonded to the first mounting surface 315a by an adhesive on a surface opposite to the light exit surface.

Alternatively, as shown in fig. 4, a first mounting groove 315b is formed at the top end of the first supporting pad 315, the first mounting groove 315 has a first mounting surface 315a facing one side of the first optical receiver 312, the first optical transmitter 311 is fixedly mounted in the first mounting groove 315b, and a surface of the first optical transmitter 311 opposite to the light emitting surface is attached to and bonded to the first mounting surface 315 a.

As shown in fig. 5, the second support pad 316 is substantially in the shape of a block with a flat bottom surface, and the top of the second support pad 316 is inclined, so that a second mounting surface 316a is formed at the top of the inclined shape, after the second support pad 316 is mounted on the circuit board 314, the second mounting surface 316a of the second support pad 316 faces the side of the first light emitter 311, and the second mounting surface 316a forms an included angle P with the circuit board 314. The first light receiver 312 is adhered to the second mounting surface 316a by an adhesive on a surface thereof opposite to the light emitting surface.

Alternatively, as shown in fig. 6, a second mounting groove 316b is formed at the top end of the second supporting pad 316, the second mounting groove 316 has a second mounting surface 316a facing the first light emitter 311, the first light receiver 312 is fixedly mounted in the second mounting groove 316b, and a surface of the first light receiver 312 opposite to the light emitting surface is attached to and bonded to the second mounting surface 316 a.

In other embodiments, as shown in fig. 7, in the embodiment, the first supporting pad 315 may be omitted, the first light emitter 311 is directly mounted on the circuit board 314, the light emitting surface thereof is substantially parallel to the circuit board 314, and only the second supporting pad 316 is used to incline the light incident surface of the first light receiver 312 toward one side of the first light emitter 311 and form the included angle P.

In other embodiments, as shown in fig. 8, in the embodiment, the second supporting pad 316 can be omitted, the first light receiver 312 is directly mounted on the circuit board 314, the light incident surface thereof is substantially parallel to the circuit board 314, and only the first supporting pad 315 is used to incline the light emergent surface of the first light emitter 311 toward one side of the first light receiver 312 and form an included angle P.

Referring to fig. 2, the cover 32 includes a cover body 321, a first adhesion layer 322, and a second adhesion layer 323. The non-display area 30a of the cover 32 is overlaid on the non-display portion of the panel 20, and the display area 30b of the cover 32 is overlaid on the display portion of the panel 20. The first adhesion layer 322 is disposed on a surface of the cover plate body 321 facing the sensor assembly 31 and located in the non-display area 30a, and the second adhesion layer 323 is disposed on the first adhesion layer 322.

The cover plate body 321 is made of a transparent material, for example, the cover plate body 321 is a glass cover plate. The cover body 321 may also be a glass cover made of a material such as sapphire. The first adhesive layer 322 completely covers the second adhesive layer 323. The first adhesion layer 322 and the second adhesion layer 323 are disposed to hide the internal structure of the mobile terminal 1 and the second adhesion layer 323. That is, when a user views the outer side of the cover plate body 321, only the first adhesive layer 322 can be seen, but the second adhesive layer 323 cannot be seen, that is, the outer side surface of the cover plate 32 is displayed as the first adhesive layer 322, and the second adhesive layer 323 is hidden.

The transmittance of the first adhesive layer 322 is greater than that of the second adhesive layer 323.

For example, the transmittance of the first adhesive layer 322 may be 80% or more, and the transmittance of the second adhesive layer 323 may be 10% or less. In practice, the first adhesive layer 322 may be referred to as a transmissive layer for transmitting most of the signal. The second adhesion layer 323 may be referred to as a shielding layer for shielding most of the signal.

In practical applications, the second adhesion layer 323 is used to hide the internal structure of the mobile terminal 1, so that the internal structure of the mobile terminal 1 cannot be seen from the outside of the cover plate body 321, thereby achieving the overall aesthetic effect of the mobile terminal 1.

The first adhesion layer 322 may be a white ink layer, and the second adhesion layer 323 may be a black ink layer. Of course, the white ink layer and the black ink layer are only examples, and the first adhesion layer 322 and the second adhesion layer 323 can be designed to be other colors according to different aesthetic requirements as long as the transmittance of the first adhesion layer 322 is greater than that of the second adhesion layer 323. The white ink layer, the black ink layer or the ink layers with other colors can be manufactured through a spraying or printing process.

The first adhesive layer 322 is a multi-layer, and the second adhesive layer 323 is a single layer or a multi-layer. For example, the first attachment layer 322 includes three sub-layers 3221, the three sub-layers 3221 overlapping one another.

Alternatively, the first adhesive layer 322 may be a single layer, and the second adhesive layer 323 may be a single layer.

With reference to fig. 2, the second adhesion layer 323 may include a first region 323A and a second region 323B. The first region 323A can be understood as a portion where the second adhesion layer 323 and the first adhesion layer 322 overlap each other, and the second region 323B can be understood as a portion where the second adhesion layer 323 and the first adhesion layer 321 do not overlap. The transmittance of the first region 323A is greater than that of the second region 323B, so that a signal may sequentially transmit through the first region 323A, the first adhesion layer 322, and the cover body 321, and sequentially transmit through the cover body 321, the first adhesion layer 322, and the first region 323A after being reflected by the external barrier 70.

Wherein the first adhesive layer 32 covers the first area 323A of the second adhesive layer 323 such that the first area 323A is not visible from outside the mobile terminal 1.

In some embodiments, when the second adhesive layer 323 is a black ink layer, the black ink of the first region 323A may be treated to make the transmittance of the region greater than that of the second region 323B.

In some embodiments, the first region 323A may be a through hole defined by a boundary of the second region 323B, where the transmittance of the region is 100%, and the first adhesion layer 322 covers the through hole. In some embodiments, a material transparent to a signal may be filled in the through hole of the first region 323A.

In some embodiments, the first region 323A includes a first sub-region 3231A and a second sub-region 3232A.

For example, in fig. 2, the first sub-region 3231A is opposite to the first light emitter 311 and the ambient light sensor 313, and the second sub-region 3232A is opposite to the first light receiver 312. The first sub-region 3231A and the second sub-region 3232A are through holes defined by the boundary of the second region 323B.

During operation, the first optical transmitter 311 emits a first optical signal, the first optical signal sequentially passes through the first region 323a of the second adhesion layer 323, the first adhesion layer 322 and the cover plate body 321, and is reflected by the obstacle 70 after being incident into the external environment to form a first reflection signal, the first reflection signal sequentially passes through the cover plate body 321, the first adhesion layer 322 and the first region 323a, and is received by the first optical receiver 312 and converted into a corresponding electrical signal, and the circuit board 314 determines whether the mobile terminal 1 is close to the obstacle 70 or far from the obstacle 70 according to the electrical signal. The mobile terminal 1 is determined to be close to the obstacle 70 if the electrical signal is greater than a threshold value, which may be derived from preliminary experiments, and the mobile terminal is determined to be far from the obstacle 70 if the electrical signal is less than the threshold value.

Referring to fig. 9, in other embodiments of the sensor assembly 31, the sensor assembly 31 includes a first light emitter 311, a first light receiver 312, an ambient light sensor 313, a circuit board 314, a first support pad 315, a second support pad 316, a second light receiver 317, and a third support pad 318. The first light emitter 311, the first light receiver 312, the ambient light sensor 313, the first support pad 315, the second support pad 316, the second light receiver 317, and the third support pad 318 are disposed on the circuit board 314. The first optical transmitter 311, the first optical receiver 312, the ambient light sensor 313, and the second optical receiver 317 are electrically connected to the circuit board 314. Wherein the distance between the first optical receiver 312 and the first optical transmitter 311 is smaller than the distance between the second optical receiver 317 and the first optical transmitter 311.

The ambient light sensor 313, the first light emitter 311, the second light receiver 317, and the first light receiver 312 are sequentially arranged along a straight line. Of course, the position of the ambient light sensor 313 may be adaptively changed.

The first light emitter 311 has an exit surface for emitting invisible light with a wavelength greater than 850nm as a first light, such as infrared light. The first light is reflected by the obstacle 70 to form a first reflected light and a second reflected light. The first light receiver 312 has a light incident surface for receiving the first reflected light. The ambient light sensor 313 is used to detect ambient brightness. The second light receiver 317 has a light incident surface for receiving the second reflected light.

The first light emitter 311 is disposed on the circuit board 314 through the first supporting pad 315, the first supporting pad 315 is disposed on the circuit board 314, and the first light emitter is disposed on the first supporting pad 315. The first light receiver 312 is disposed on the circuit board 314 through the second support pad 316, the second support pad 316 is disposed on the circuit board 314, and the first light receiver 312 is disposed on the second support pad 316. Therefore, an included angle between the light emitting surface of the first light emitter 311 and the light incident surface of the first light receiver 312 on one side of the emitted light signal is P, and the included angle P is smaller than 180 degrees. In practical applications, the included angle P ranges from 110 degrees to 145 degrees. The structure of the first supporting pad 315 is the same as that of the first supporting pad 315 in the above embodiments, and therefore, the description thereof is omitted. The structure of the second support pad 316 is the same as that of the second support pad 316 in the above embodiments, and therefore, the description thereof is omitted.

The second optical receiver 317 is disposed on the circuit board 314 through the third supporting pad 318, the third supporting pad 318 is disposed on the circuit board 314, and the second optical receiver 317 is disposed on the third supporting pad 318, so that an included angle between the light emitting surface of the first optical transmitter 311 and the light incident surface of the second optical receiver 317 at one side of the emergent light signal is also P, and the included angle P is smaller than 180 degrees. In practical applications, the included angle P ranges from 110 degrees to 145 degrees.

As shown in fig. 10, the third support pad 318 is substantially block-shaped with a flat bottom surface, and the top of the third support pad 318 is inclined, so that a third mounting surface 318a is formed at the top of the inclined shape, after the third support pad 318 is mounted on the circuit board 314, the third mounting surface 318a of the third support pad 318 faces to a side of the first light emitter 311, and an included angle P is formed between the third mounting surface 318a and the circuit board 314. The second light receiver 317 is adhered to the third mounting surface 318a by an adhesive on a surface thereof opposite to the light incident surface.

Alternatively, as shown in fig. 11, a third mounting groove 318b is formed at the top end of the third supporting pad 318, the third mounting groove 318b has a third mounting surface 318a facing the first light emitter 311, the second light receiver 317 is fixedly mounted in the third mounting groove 318b, and a surface of the second light receiver 317 opposite to the light emitting surface is attached to and bonded to the third mounting surface 318 b.

As shown in fig. 12, the difference from fig. 9 lies in that the third supporting pad 318 is omitted, and the second light receiver 317 is directly disposed on the circuit board 314, so that the light incident surface of the second light receiver 317 is parallel to the circuit board 314.

Alternatively, as shown in fig. 13, the sensor assembly 31 of fig. 9 is different in that the third support pad 318 and the second support pad 316 are omitted, and the first light receiver 312 and the second light receiver 317 are disposed directly on the circuit board 314, so that the light incident surfaces of the first light receiver 312 and the second light receiver 317 are parallel to the circuit board 314.

Or as shown in fig. 14, which is different from the sensor assembly 31 of fig. 9 in that, in the sensor assembly 31 of fig. 12, the first support pad 315 is omitted. The first light emitter 311 is directly disposed on the circuit board 314 such that the light emitting surface of the first light emitter 311 is parallel to the circuit board 314. In the present embodiment, the arrangement order is changed by arranging the ambient light sensor 313, the first light receiver 311, the second light emitter 317, and the first light receiver 312 in this order along a straight line.

Or as shown in fig. 15, which is different from the sensor assembly 31 of fig. 9 in that, in the sensor assembly 31 shown in fig. 15, the first support pad 315 is omitted. The first light emitter 311 is directly disposed on the circuit board 314 such that the light emitting surface of the first light emitter 311 is parallel to the circuit board 314.

In operation, the circuit board 314 controls the first light emitter 311 to emit a light signal, the light signal is reflected by the obstacle 70 to form a first reflected light and a second reflected light, the first light receiver receives the first reflected light to generate a first electrical signal, and the second light receiver receives the second reflected light to generate a second electrical signal. The circuit board judges the approaching or separating state of the mobile terminal 1 corresponding to the obstacle 70 according to the first electric signal and the second electric signal, and controls the display panel of the mobile terminal to be off when the circuit board is in the approaching state, and controls the display panel to be on when the circuit board is in the separating state.

In other embodiments, as shown in fig. 16, the sensor assembly 31 includes a first light emitter 311, a first light receiver 312, an ambient light sensor 313, a circuit board 314, a first support pad 315, a second support pad 316, a second light emitter 319, and a fourth support pad 320. The first light emitter 311, the first light receiver 312, the ambient light sensor 313, the first support pad 315, the second support pad 316, the second light emitter 319, and the fourth support pad 320 are disposed on the circuit board 314, and the first light emitter 311, the first light receiver 312, the ambient light sensor 313, and the second light emitter 319 are electrically connected to the circuit board 314.

The first light emitter 311 has an exit surface for emitting invisible light with a wavelength greater than 850nm as a first light, such as infrared light. The first light is reflected by the barrier 70 to form a first reflected light. The first light receiver 312 has a light incident surface for receiving the reflected light. The ambient light sensor 313 is used to detect ambient brightness. The second light emitter has an exit surface for emitting invisible light with a wavelength greater than 850nm as second light, such as infrared light. The second light ray is reflected by the barrier to form a third reflected light ray.

The ambient light sensor 313, the first optical transmitter 311, the second optical transmitter 319, and the first optical receiver 312 are sequentially arranged along a straight line. The position of the ambient light sensor 313 may be adaptively changed. The distance between the first optical transmitter 311 and the first optical receiver 312 is greater than the distance between the second optical transmitter 319 and the first optical receiver 312.

As shown in fig. 17, the fourth support pad 320 is substantially a block with a flat bottom surface, and the top of the block is inclined, so that a fourth mounting surface 320a is formed at the inclined top, after the fourth support pad 320 is mounted on the circuit board 314, the fourth mounting surface 320a of the fourth support pad 320 faces the first light receiver 312, and the fourth mounting surface 320a forms an angle P with the circuit board 314. The surface of the second light emitter 319 opposite to the light incident surface is bonded to the fourth mounting surface 320a by using an adhesive.

Alternatively, as shown in fig. 18, a fourth mounting groove 320b is formed at the top end of the fourth supporting pad 320, the fourth mounting groove 320b has a fourth mounting surface 320a facing the first optical receiver 312, the second optical transmitter 319 is fixedly mounted in the fourth mounting groove 320b, and a surface of the second optical transmitter 319 opposite to the light emitting surface is attached to and bonded to the fourth mounting surface 320 b.

It is to be understood that in the sensor assembly 31 shown in fig. 16, one or both of the first support pad 315, the second support pad 316, and the fourth support pad 320 may be omitted such that the light emitter or the light receiver mounted on the support pad is directly mounted on the circuit board 314.

In operation, the circuit board 314 controls the first optical transmitter 311 to transmit a first optical signal, and the first optical signal is reflected by a barrier to form a first reflection signal; controlling the second optical transmitter 319 to emit a second optical signal, wherein the second optical signal is reflected by a barrier to form a third reflected signal; the first optical receiver 319 receives the first reflected signal and the second reflected signal and generates a corresponding electrical signal, and the circuit board 314 determines whether the mobile terminal is close to or far from the obstacle according to the electrical signal.

In summary, in the mobile terminal provided by the present invention, since an included angle of less than 180 degrees is formed between the light emitting surface of the light emitter and the light incident surface of the light receiver, the amount of the light signal received by the light receiver can be increased, which is beneficial to improving the detection sensitivity.

For example, when the light emitting surface of the light emitter is inclined toward one side of the light receiver, that is, when the supporting pad is arranged below the light emitter, the effective emittance of the optical signal can be increased, which is beneficial to improving the intensity of the reflected signal received by the light receiver; when the light incident surface of the light receiver is inclined towards one side of the light emitter, namely the supporting pad is arranged below the light receiver, the receiving amount of the reflected signals can be increased, and the intensity of the reflected signals received by the light receiver can be improved; thereby, the detection sensitivity of the sensor assembly can be improved.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A sensor assembly, wherein the sensor assembly is arranged on one side of a cover plate, the cover plate comprises a first sub-area and a second sub-area, and the size of the first sub-area is larger than that of the second sub-area; the sensor assembly includes:

the first optical transmitter is arranged corresponding to the first sub-area and provided with an emergent surface used for emitting optical signals, and the optical signals penetrate through the first sub-area and are reflected by an obstacle to form reflection signals; and

first light receiver, with the second subregion corresponds the setting, first light receiver has the income plain noodles that is used for receiving corresponding reflection signal, reflection signal passes the second subregion extremely go into the plain noodles and quilt first light receiver receives, go out the plain noodles with the contained angle of going into the plain noodles is 110 degrees to 145 degrees at the contained angle of one side of emergent light signal.

2. The sensor assembly of claim 1, further comprising a carrier plate, wherein the first light emitter and the first light receiver are both mounted on the carrier plate.

3. The sensor assembly of claim 2, wherein the carrier plate is a circuit board, and the first optical emitter and the first optical receiver are both electrically connected to the circuit board.

4. The sensor assembly of claim 2, further comprising a first support pad mounted to the carrier plate;

the first light emitter is arranged on the first supporting pad, so that the light emitting surface of the first light emitter faces one side of the first light receiver, and the included angle between the light emitting surface of the first light emitter and the bearing plate on the light emitting side is smaller than 180 degrees.

5. The sensor assembly of claim 4, wherein the first supporting pad has a first mounting surface, an included angle between the first mounting surface and the carrier plate is less than 180 degrees, and a surface of the first light receiver opposite to the light emitting surface is attached to the first mounting surface.

6. The sensor assembly of any of claims 2-5, further comprising a second support pad mounted to the carrier plate;

the first light receiver is arranged on the second supporting pad, so that the light incident surface of the first light receiver faces one side of the light emitter, and the included angle between the light incident surface of the first light receiver and the light incident side of the bearing plate is smaller than 180 degrees.

7. The sensor assembly of claim 6, wherein the second support pad has a second mounting surface, the second mounting surface is at an angle of less than 180 degrees with respect to the carrier plate, and a surface of the first light receiver opposite the light incident surface is attached to the second mounting surface.

8. The sensor assembly of any one of claims 1-5, further comprising a second optical receiver for receiving the reflected signal.

9. The sensor assembly of any one of claims 1-5, further comprising a second light emitter, wherein the first light receiver is further configured to receive a reflected signal formed by a light signal emitted by the second light emitter reflecting off of an obstacle.

10. A mobile terminal is characterized by comprising a cover plate, a shell, a display panel and a sensor assembly; the display panel is arranged on the shell, the cover plate covers the display panel, the cover plate comprises a first sub-area and a second sub-area, and the size of the first sub-area is larger than that of the second sub-area; the sensor assembly is arranged in the shell and arranged on one side of the cover plate; the sensor assembly of any one of claims 1-9.

11. The mobile terminal of claim 10, wherein the cover comprises a cover body, a first adhesive layer, and a second adhesive layer, wherein the transmittance of the first adhesive layer is greater than the transmittance of the second adhesive layer; the first adhesion layer is arranged on one surface of the cover plate body facing the sensor assembly, and the second adhesion layer is arranged on the first adhesion layer; the second adhesion layer is provided with a first area and a second area, the transmissivity of the first area is greater than that of the second area, and the first adhesion layer covers the first area of the second adhesion layer, so that the outer side surface of the cover plate is displayed as the first adhesion layer, and the second adhesion layer is hidden; the first region comprises the first sub-region and the second sub-region; wherein the content of the first and second substances,

the light signal emitted by the first light emitter of the sensor assembly passes through the first sub-area of the first adhesion layer, and the reflected signal formed by the light signal reflected by the barrier passes through the second sub-area of the first adhesion layer and is received by the first light receiver.

12. The mobile terminal of claim 11, wherein the first area defines a through-hole for a boundary of the second area.

13. The mobile terminal of claim 11, wherein the first adhesion layer and the second adhesion layer are ink layers.

14. The mobile terminal of claim 11, wherein the first adhesion layer is a white ink layer, and the second adhesion layer is a black ink layer.