WO2018205772A1 - 一种有机电致发光显示面板、其制作方法及显示装置 - Google Patents

一种有机电致发光显示面板、其制作方法及显示装置 Download PDF

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WO2018205772A1
WO2018205772A1 PCT/CN2018/081604 CN2018081604W WO2018205772A1 WO 2018205772 A1 WO2018205772 A1 WO 2018205772A1 CN 2018081604 W CN2018081604 W CN 2018081604W WO 2018205772 A1 WO2018205772 A1 WO 2018205772A1
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Prior art keywords
high temperature
display device
temperature resistant
resistant film
organic electroluminescent
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French (fr)
Inventor
王浩田
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US16/300,413 priority Critical patent/US20210226178A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to an organic electroluminescence display panel, a method of fabricating the same, and a display device.
  • OLED devices are display lighting technologies that have been developed in recent years. Due to its high response, high contrast, flexibility and other advantages, it is considered to have broad application prospects. However, since OLED devices are easily damaged by moisture and oxygen corrosion, it is especially important for OLED devices to choose a better package.
  • Embodiments of the present invention provide a method of fabricating an organic electroluminescent display panel, comprising: forming an organic electroluminescent display device on a substrate; providing a package cover; and the organic electroluminescent display device At least a portion of a surface of the surface and/or the surface of the package cover forms a high temperature resistant film, the at least partial region corresponding to a pixel of an outermost edge of the organic electroluminescent display device; at the package cover or Forming a glazing paste on the base substrate, the glazing seal surrounding an area on the package cover or the base substrate corresponding to a pixel of an outermost edge of the organic electroluminescent display device; After encapsulating the cover plate and the organic electroluminescent display device, the region of the cover glass of the package cover is sintered by a laser.
  • the high temperature resistant film is formed on a surface of the package cover; the glass frame glue is formed on the package cover or the base substrate, the glass frame An area surrounding the pixel on the package cover or the base substrate corresponding to the outermost edge of the organic electroluminescent display device, comprising: on the package cover, and the high temperature resistant film
  • the glass frame glue is formed on the same side.
  • the high temperature resistant film is formed on a surface of the package cover; the glass frame glue is formed on the package cover or the base substrate, the glass frame An area surrounding the pixel on the package cover or the base substrate corresponding to the outermost edge of the organic electroluminescent display device, comprising: a surface facing away from the high temperature resistant film on the package cover
  • the glass frame glue is formed on the side.
  • the method further includes: removing the high temperature resistant film.
  • the high temperature resistant film is a transparent high temperature resistant film.
  • the high temperature resistant film is formed on a surface of the organic electroluminescence display device; the high temperature resistant film is formed on at least a portion of a surface of the surface of the organic electroluminescence display device.
  • the at least a portion of the region corresponding to the pixel of the outermost edge of the organic electroluminescent display device includes forming a transparent high temperature resistant film at a region corresponding to a pixel of an outermost edge of the organic electroluminescent display device.
  • forming a high temperature resistant film on at least a portion of a surface of the organic electroluminescent display device and/or a surface of the package cover comprises: The 1-3 layer pixel corresponding region of the outermost edge of the light-emitting display device forms a high temperature resistant film.
  • forming a high temperature resistant film on at least a portion of a surface of the organic electroluminescent display device and/or a surface of the package cover comprises: All of the pixel corresponding regions of the luminescent display device form a high temperature resistant film.
  • a high temperature resistant film is formed using polyethylene terephthalate or a polyimide material.
  • the thickness of the high temperature resistant film is
  • Embodiments of the present invention provide an organic electroluminescence display panel, wherein the display panel is fabricated by the fabrication method as described above.
  • Embodiments of the present invention provide a display device including the organic electroluminescence display panel as described above.
  • FIG. 1 is a flowchart of a method for fabricating an organic electroluminescence display panel according to an embodiment of the present invention
  • FIGS. 2a and 2b are top views of the organic electroluminescent display panel on the side of the package cover in the embodiment of the present invention.
  • 3a, 3b and 3c are schematic cross-sectional views of AA' in Fig. 2a when the high temperature resistant film is at different positions;
  • 4a, 4b and 4c are schematic cross-sectional views of BB' in Fig. 2b when the high temperature resistant film is at different positions;
  • 201 a substrate
  • 202 an organic electroluminescent display device
  • 203 a package cover
  • 204 a high temperature resistant film
  • 205 a glass frame glue.
  • OLED devices are usually available in a variety of packages.
  • One of the methods is: the substrate and the package cover are sintered by a frit, thereby blocking the action of water vapor and oxygen.
  • a frit thereby blocking the action of water vapor and oxygen.
  • An embodiment of the present invention provides an organic electroluminescence display panel, a manufacturing method thereof, and a display device, which are suitable for the problem of the display of the display device.
  • Embodiments of the present invention provide a method for fabricating an organic electroluminescent display panel, including:
  • the region where the glass frame seal of the package cover plate is located is sintered by using a laser.
  • the corresponding area forms a high temperature resistant film, which can carry the heat generated during the laser sintering process, and protects the underlying pixel points from the heat generated by the laser to burn the pixel points.
  • the glass frame glue is disposed around the package cover plate, and in the process of laser sintering the glass frame glue, the pixels that are easily burned by the heat of the laser are displayed.
  • the pixel of the outermost edge of the device therefore, forms a high temperature resistant film through a region corresponding to the pixel of the outermost edge of the display device, and protects the pixel of the outermost edge of the display device by the heat of the laser carried by the high temperature resistant film.
  • the glazing paste may be formed on the package cover or on the base substrate as long as the package cover and the base substrate can be bonded.
  • the high temperature resistant film may be formed on the outer surface of the organic electroluminescence display device or on the surface of the package cover, and the implementation of the high temperature film in accordance with the drawings will be described in detail below.
  • FIGS. 3a, 3b and 3c are cross sections of the AA' in FIG. 2a when the anti-high temperature film is at different positions.
  • 4a, 4b and 4c are schematic cross-sectional views of BB' in Fig. 2b when the high temperature resistant film is at different positions.
  • Implementation manner 1 the high temperature resistant film is formed on the surface of the package cover;
  • a glazing is formed on the package cover, and the glazing surrounding the area of the package cover corresponding to the pixel of the outermost edge of the organic electroluminescent display device may include:
  • a glazing adhesive 205 is formed on the same side of the high temperature resistant film 204, and the glazing adhesive 205 surrounds the package cover 203 and the organic electroluminescent display device.
  • 202 corresponds to the area of the outermost edge of the pixel, or,
  • a glazing adhesive 205 is formed on a side of the package cover 203 facing away from the high temperature resistant film 204, and the glazing adhesive 205 surrounds the package cover 203 and the organic electroluminescent display device 202.
  • the high temperature resistant film 204 may be formed by coating a high temperature resistant material on the package cover 203, or may be formed by directly attaching a film having high temperature resistance to the package cover 203. The manner in which the film 204 is formed is defined.
  • the high temperature resistant film 204 and the glass sealant 205 are formed on the same side of the package cover plate 203, the region where the glass sealant 205 of the package cover plate 203 is located is sintered by laser in the above step S105.
  • the high temperature resistant film 204 protects the pixels during the laser sintering process, and therefore, the high temperature resistant film 204 is formed in the box.
  • the high temperature resistant film 204 in the structure shown in Fig. 3a or Fig. 4a is made of a transparent material.
  • a glazing paste 205 is formed on a side facing away from the high temperature resistant film 204;
  • step S105 after the laser is used to sinter the region of the cover glass 205 of the package cover 203, the method further includes:
  • the high temperature resistant film 204 is removed.
  • the high temperature resistant film 204 and the bead 205 are formed on different sides of the package cover 203, that is, the high temperature resistant film 204 is formed on the package cover 203 and the organic electroluminescent display device 202.
  • the high temperature resistant film 204 can be removed.
  • the high temperature resistant film 204 may be removed by peeling after laser sintering; if the high temperature resistant film 204 is resistant to high temperatures The film layer of the performance is directly attached to the package cover 203, and the high temperature resistant film 204 can be directly removed after laser sintering. Therefore, in the structure shown in FIG. 3b or FIG. 4b, the high temperature resistant film 204 is transparent or opaque, and does not affect the light transmittance of the display device.
  • forming the high temperature resistant film 204 may include:
  • a transparent high temperature resistant film 204 is formed at a region corresponding to the pixel of the outermost edge of the organic electroluminescent display device 202.
  • the high temperature resistant film 204 is made of a transparent material, and the high temperature resistant film 204 is formed in the box or outside the box without affecting the display effect of the display device.
  • Embodiment 2 a high temperature resistant film 204 is formed on the organic electroluminescent display device 202, as shown in FIG. 3c or 4c;
  • Forming the high temperature resistant film 204 at a region corresponding to the pixel of the outermost edge of the organic electroluminescent display device 202 includes:
  • a transparent high temperature resistant film 204 is formed at a region corresponding to the pixel of the outermost edge of the organic electroluminescent display device 202.
  • a high temperature resistant film 204 is formed over the organic electroluminescent display device 202 on the substrate substrate 201. Because the laser is used to sinter the region where the glazing material 205 of the package cover 203 is located, in the step S105, after the package cover 203 and the organic electroluminescent display device 202 are paired, the high temperature resistant film 204 is The pixels are protected during the laser sintering process, and therefore, the high temperature resistant film 204 is formed in the case. In order not to affect the display effect of the display device, the high temperature resistant film 204 in the structure shown in Fig. 3c or Fig. 4c is made of a transparent material.
  • the high temperature resistant film 204 is formed on a pixel corresponding region with the outermost edge of the organic electroluminescent display device 202, and the bead filler 205 is formed on the package cover.
  • the area of the glass frit 205 corresponding to the pixel of the outermost edge of the organic electroluminescent display device 202 may have a gap of a certain width, and some metal traces may be disposed in the gap, that is, the device at the gap position Generally not burned by the heat of the laser. If the high temperature resistant film 204 is further provided in the region corresponding to the gap, the display effect of the display device is not affected.
  • the region corresponding to the gap may be provided with the high temperature resistant film 204 or the high temperature resistant film 204 may not be provided.
  • the high temperature resistant film 204 is generally disposed in close proximity to the bezel 205, i.e., the high temperature resistant film 204 is also formed in the region corresponding to the gap.
  • step S103 forming a high temperature resistant film 204 with a pixel corresponding region of the outermost edge of the organic electroluminescent display device 202 includes:
  • a high temperature resistant film 204 is formed at a region corresponding to 1-3 layers of the outermost edge of the organic electroluminescent display device 202; or
  • a high temperature resistant film 204 is formed in correspondence with all of the pixels of the organic electroluminescent display device 202, as shown in Fig. 2b.
  • the high temperature resistant film 204 corresponds to a region of at least one pixel of the outermost edge of the organic electroluminescent display device 202, that is, the high temperature resistant film 204.
  • the width is approximately 1 mm.
  • the high temperature resistant film 204 may be disposed to correspond to a region of 1-3 layers of pixels of the outermost edge of the organic electroluminescent display device 202, that is, the width of the high temperature resistant film 204 is about 1-3 mm; or, 2b, the high temperature resistant film 204 may also be disposed to correspond to a region where all the pixels of the organic electroluminescent display device 202 are located.
  • the high temperature resistant film 204 is disposed to correspond to a region of the outermost edge of the organic electroluminescent display device 202, which is a layer of 1-3 pixels, or corresponds to a region where all pixels of the organic electroluminescent display device 202 are located. It is a preferred embodiment of the embodiment of the present invention.
  • the high temperature resistant film 204 may also correspond to a region of other layer pixels of the outermost edge of the organic electroluminescent display device 202, where the number of layers corresponding to the high temperature film 204 is not limited.
  • step S103 forming a high temperature resistant film with a pixel corresponding region of the outermost edge of the organic electroluminescence display device includes:
  • a high temperature resistant film is formed on a region corresponding to a pixel of the outermost edge of the organic electroluminescence display device using polyethylene terephthalate (PET) or polyimide material (Polyimide, PI).
  • PET polyethylene terephthalate
  • PI polyimide material
  • a solution of PET or PI may be applied to a pixel corresponding region of the outermost edge of the organic electroluminescence display device, and dried to form a high temperature resistant film; or a high temperature resistant film made of PET or PI may be directly attached. A pixel corresponding region attached to the outermost edge of the organic electroluminescence display device.
  • the high temperature resistant film is made of PET or PI material. It is a preferred embodiment of the embodiment of the present invention, and other high temperature resistant materials may be used, and the material which does not resist the high temperature film is limited herein.
  • step S103 forming a high temperature resistant film with a pixel corresponding region of the outermost edge of the organic electroluminescence display device includes:
  • the thickness of the high temperature resistant film is at least For example Set the thickness of the high temperature resistant film to It is a preferred embodiment of the embodiment of the present invention. In a specific implementation, the thickness of the high temperature resistant film may be set to other sizes, and the thickness of the high temperature film is not limited herein.
  • an embodiment of the present invention further provides an organic electroluminescence display panel, which is fabricated by the above manufacturing method. Since the principle of solving the problem of the organic electroluminescent display panel is similar to the above manufacturing method, the implementation of the organic electroluminescent display panel can be referred to the implementation of the above manufacturing method, and the repeated description is omitted.
  • an embodiment of the present invention further provides a display device, including the above organic electroluminescent display panel, which can be applied to a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigation device. Any product or part that has a display function. Since the principle of solving the problem of the display device is similar to that of the above-mentioned organic electroluminescent display panel, the implementation of the display device can be referred to the implementation of the above-mentioned organic electroluminescent display panel, and the repeated description is omitted.
  • the surface of the organic electroluminescent display device and/or the surface of the package cover plate are the most
  • the pixel corresponding region of the outer edge forms a high temperature resistant film, and the high temperature resistant film can withstand the heat generated during the laser sintering process, and protect the underlying pixel point from the heat generated by the laser to burn the pixel.

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Abstract

一种有机电致发光显示面板、其制作方法及显示装置，该制作方法包括：在衬底基板上形成有机电致发光显示器件；提供一封装盖板；在该有机电致发光显示器件的表面和/或该封装盖板的表面的至少部分区域形成抗高温膜，该至少部分区域与该有机电致发光显示器件的最外侧边缘的像素对应；在该封装盖板或该衬底基板上形成玻璃框胶，该玻璃框胶围绕该封装盖板或该衬底基板上与该有机电致发光显示器件的最外侧边缘的像素对应的区域；将该封装盖板与该有机电致发光显示器件对盒后，用激光对该封装盖板的玻璃框胶所在的区域进行烧结。

Description

一种有机电致发光显示面板、其制作方法及显示装置 技术领域
本公开涉及一种有机电致发光显示面板、其制作方法及显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)器件是近年来逐渐发展起来的显示照明技术。由于其具有高响应、高对比度、可柔性化等优点，被认为拥有广泛的应用前景。但是，由于OLED器件容易被水汽和氧气腐蚀而导致损坏，选择较好的封装方式对OLED器件来说尤为重要。
发明内容
本发明的实施例提供了一种有机电致发光显示面板的制作方法，包括：在衬底基板上形成有机电致发光显示器件；提供一封装盖板；在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜，所述至少部分区域与所述有机电致发光显示器件的最外侧边缘的像素对应；在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域；将所述封装盖板与所述有机电致发光显示器件对盒后，用激光对所述封装盖板的玻璃框胶所在的区域进行烧结。
根据本发明的一种实施方式，例如，所述抗高温膜形成于所述封装盖板的表面；所述在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域，包括：在所述封装盖板上，与所述抗高温膜的同侧形成所述玻璃框胶。
根据本发明的一种实施方式，例如，所述抗高温膜形成于所述封装盖板的表面；所述在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域，包括：在所述封装盖板上背离所述抗高温膜的一 侧形成所述玻璃框胶。
根据本发明的一种实施方式，例如，所述用激光对所述封装盖板的玻璃框胶所在的区域进行烧结之后，还包括：去除所述抗高温膜。
根据本发明的一种实施方式，例如，所述抗高温膜为透明的抗高温膜。
根据本发明的一种实施方式，例如，所述抗高温膜形成于所述有机电致发光显示器件的表面；所述在所述有机电致发光显示器件的表面的至少部分区域形成抗高温膜，所述至少部分区域与所述有机电致发光显示器件的最外侧边缘的像素对应，包括：在与所述有机电致发光显示器件的最外侧边缘的像素对应区域形成透明的抗高温膜。
根据本发明的一种实施方式，例如，所述在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜包括：在与所述有机电致发光显示器件的最外侧边缘的1-3层像素对应区域形成抗高温膜。
根据本发明的一种实施方式，例如，所述在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜包括：在与所述有机电致发光显示器件的所有像素对应区域形成抗高温膜。
根据本发明的一种实施方式，例如，采用聚对苯二甲酸乙二醇酯或聚酰亚胺材料形成抗高温膜。
根据本发明的一种实施方式，例如，所述抗高温膜的厚度为
Figure PCTCN2018081604-appb-000001
本发明的实施例提供了一种有机电致发光显示面板，其中，所述显示面板由如上所述的制作方法制作而成。
本发明的实施例提供了一种显示装置，包括如上所述的有机电致发光显示面板。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例提供的有机电致发光显示面板的制作方法的流程图；
图2a和图2b为本发明实施例中有机电致发光显示面板在封装盖板一侧的俯视图；
图3a、3b和3c为抗高温膜位于不同位置时图2a中AA＇处的截面示意图；
图4a、4b和4c为抗高温膜位于不同位置时图2b中BB＇处的截面示意图；
其中，201、衬底基板；202、有机电致发光显示器件；203、封装盖板；204、抗高温膜；205、玻璃框胶。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
OLED器件通常有多种封装方式。其中一种方式为：基板与封装盖板之间通过玻璃框胶(Frit)熔结，从而起到阻隔水汽和氧气的作用。但是，在制造过程中，需要使用激光对玻璃框胶进行烧结，由于烧结过程中较高的激光能量产生较高的温度，极易烧伤像素区边缘位置的像素点，造成显示器件在点亮状态下角发黑，影响显示器件的显示效果。
因此，如何防止激光烧结玻璃框胶的工艺过程中像素点被烧伤是急需解决的技术问题。
针对激光烧结玻璃框胶的工艺过程中容易烧伤像素点，影响显示器件的显示效果的问题，本发明实施例提供了一种有机电致发光显示面板、其制作方法及显示装置。
下面结合附图，对本发明实施例提供的有机电致发光显示面板、其制作方法及显示装置的具体实施方式进行详细地说明。附图中各膜层的厚度和形状不反映真实比例，目的只是示意说明本发明内容。
本发明实施例提供了一种有机电致发光显示面板的制作方法，包括：
S101、在衬底基板上形成有机电致发光显示器件；
S102、提供一封装盖板；
S103、在所述有机电致发光显示器件表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜，所述至少部分区域与所述有机电致发光显示器件的最外侧边缘的像素对应；
S104、在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域；
S105、将所述封装盖板与所述有机电致发光显示器件对盒后，采用激光对所述封装盖板的所述玻璃框胶所在的区域进行烧结。
在本发明实施例提供的上述有机电致发光显示面板的制作方法中，在有机电致发光显示器件之上和/或封装盖板的表面，与有机电致发光显示器件的最外侧边缘的像素对应区域形成抗高温膜，该抗高温膜可以承载激光烧结过程中产生的热量，对下方的像素点起到保护作用，防止激光产生的热量烧伤像素点。
例如，采用封装盖板对有机电致发光显示器件进行封装时，一般玻璃框胶设置于封装盖板的四周，在激光烧结玻璃框胶的工艺过程中，容易被激光的热量烧伤的像素为显示器件的最外侧边缘的像素，因此，通过与显示器件的最外侧边缘的像素对应区域形成抗高温膜，通过抗高温膜承载激光的热量，对显示器件的最外侧边缘的像素起到保护作用。上述玻璃框胶可以形成于封装盖板上，也可以形成于衬底基板上，只要能够将封装盖板和衬底基板粘合即可。该抗高温膜可以形成于有机电致发光显示器件的外表面，也可以形成于封装盖板的表面，以下结合附图对抗高温膜的实现方式分别进行详细说明。
图2a和图2b为本发明实施例中有机电致发光显示面板在封装盖板一侧的俯视图，图3a、图3b和图3c是抗高温膜位于不同位置时图2a中AA＇处的截面示意图，图4a、4b和4c为抗高温膜位于不同位置时图2b中BB＇处的截面示意图。
实现方式一：抗高温膜形成于封装盖板的表面；
上述步骤S103中，在封装盖板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板上与有机电致发光显示器件的最外侧边缘的像素对应的区域，可以包括：
如图3a或图4a所示，在封装盖板203上，与抗高温膜204的同侧形成玻璃框胶205，所述玻璃框胶205围绕所述封装盖板203与有机电致发光显示器件202最外侧边缘的像素对应的区域，或，
如图3b或图4b所示，在封装盖板203上背离抗高温膜204的一侧形成玻璃框胶205，所述玻璃框胶205围绕所述封装盖板203与有机电致发光显示器件202的最外侧边缘的像素对应的区域。
例如，上述抗高温膜204可以是抗高温材料涂覆于封装盖板203上形成的，也可以是具有抗高温性能的膜层直接贴附于封装盖板203上形成的，此处不对抗高温膜204的形成方式进行限定。
参照图3a或图4a，抗高温膜204与玻璃框胶205形成于封装盖板203的同侧时，由于上述步骤S105中，采用激光对封装盖板203的玻璃框胶205所在的区域进行烧结，是在封装盖板203与有机电致发光显示器件202对盒后进行的，而抗高温膜204是在激光烧结过程中对像素起保护作用，因此，抗高温膜204会形成于盒内，为了不影响显示器件的显示效果，图3a或图4a所示的结构中的抗高温膜204采用透明材料制作。
参照图3b或图4b，玻璃框胶205形成于背离抗高温膜204的一侧；
上述步骤S105中，采用激光对封装盖板203的玻璃框胶205所在的区域进行烧结之后，还可以包括：
去除抗高温膜204。
图3b或图4b所示的结构中，抗高温膜204与玻璃框胶205形成于封装盖板203的不同侧，即抗高温膜204位于封装盖板203与有机电致发光显示器件202形成的盒外侧，在步骤S105中对玻璃框胶205所在的区域进行烧结之后，可以去除抗高温膜204。例如，若该抗高温膜204为抗高温材料涂覆于封装盖板203上形成的，则在激光烧结之后可以通过剥离的方式将抗高温膜204去除；若该抗高温膜204为具有抗高温性能的膜层直接贴附于封装盖板203上形成的，则在激光烧结之后可以直接将抗高温膜204揭去。因此，在图3b或图4b所示的结构中，该抗高温膜204为透明的或不透明的，都不会影响该显示器件的光透过率。
进一步地，在实现方式一中，上述步骤S103中，形成抗高温膜204可以包括：
在与有机电致发光显示器件202的最外侧边缘的像素对应区域形成透明的抗高温膜204。
采用透明材料制作抗高温膜204，将抗高温膜204形成于盒内或盒外都不会影响显示器件的显示效果。
实现方式二：抗高温膜204形成于有机电致发光显示器件202之上，如图3c或图4c所示；
在与有机电致发光显示器件202的最外侧边缘的像素对应区域形成抗高温膜204，包括：
在与有机电致发光显示器件202的最外侧边缘的像素对应区域形成透明的抗高温膜204。
参照图3c或图4c，抗高温膜204形成于位于衬底基板201上的有机电致发光显示器件202之上。由于上述步骤S105中，采用激光对封装盖板203的玻璃框胶205所在的区域进行烧结，是在封装盖板203与有机电致发光显示器件202对盒后进行的，而抗高温膜204是在激光烧结过程中对像素起保护作用，因此，抗高温膜204会形成于盒内。为了不影响显示器件的显示效果，图3c或图4c所示的结构中的抗高温膜204采用透明材料制作。
应该说明的是，参照图3a-图3c以及图4a-图4c，抗高温膜204形成于与有机电致发光显示器件202的最外侧边缘的像素对应区域，玻璃框胶205形成于封装盖板203的四周，而玻璃框胶205与有机电致发光显示器件202的最外侧边缘的像素对应的区域可能存在一定宽度的间隙，该间隙内可能会设置一些金属走线，即间隙位置处的器件一般不会被激光的热量烧伤。如果在该间隙对应的区域进一步设置抗高温膜204，显示器件的显示效果也不会受到影响。所以，该间隙对应的区域可以设置抗高温膜204，也可以不设置抗高温膜204。例如，为了简化制作工艺并且防止激光的热量从该间隙中进入而危害显示器件，一般将抗高温膜204设置为紧邻玻璃框胶205，即在该间隙对应的区域也形成抗高温膜204。
例如，本发明实施例提供的上述制作方法中，上述步骤S103中，与有机电致发光显示器件202的最外侧边缘的像素对应区域形成抗高温膜204，包括：
如图2a所示，在与有机电致发光显示器件202的最外侧边缘的1-3层像 素对应区域形成抗高温膜204；或，
与有机电致发光显示器件202的所有像素对应区域形成抗高温膜204，如图2b所示。
参照图2a，为了保证抗高温膜204能够保护显示器件不被烧伤，该抗高温膜204与有机电致发光显示器件202的最外侧边缘的至少一层像素的区域对应，即该抗高温膜204的宽度约为1mm。例如，可以将抗高温膜204设置为与有机电致发光显示器件202的最外侧边缘的1-3层像素的区域对应，即该抗高温膜204的宽度约为1-3mm；或者，参照图2b，也可以将该抗高温膜204设置为与有机电致发光显示器件202的所有像素所在的区域对应。本发明实施例中该抗高温膜204设置为与有机电致发光显示器件202的最外侧边缘1-3层像素的区域对应，或与有机电致发光显示器件202的所有像素所在的区域对应，是本发明实施例的优选实施方式。例如，抗高温膜204也可以与有机电致发光显示器件202的最外侧边缘其他层数像素的区域对应，此处不对抗高温膜204对应像素的层数进行限定。
例如，本发明实施例提供的上述制作方法中，上述步骤S103中，与有机电致发光显示器件的最外侧边缘的像素对应区域形成抗高温膜，包括：
采用聚对苯二甲酸乙二醇酯(Polyethylene terephthalate，PET)或聚酰亚胺材料(Polyimide，PI)，在与有机电致发光显示器件的最外侧边缘的像素对应区域形成抗高温膜。
例如，可以将PET或PI的溶液涂覆于有机电致发光显示器件的最外侧边缘的像素对应区域，加热烘干后形成抗高温薄膜；也可以将PET或PI制成的抗高温膜直接贴附于有机电致发光显示器件的最外侧边缘的像素对应区域。抗高温膜采用PET或PI材料制作是本发明实施例的优选实施方式，也可以采用其他抗高温材料，此处不对抗高温膜的材料进行限定。
例如，本发明实施例提供的上述制作方法中，上述步骤S103中，与有机电致发光显示器件的最外侧边缘的像素对应区域形成抗高温膜，包括：
与有机电致发光显示器件的最外侧边缘的像素对应区域形成厚度为
Figure PCTCN2018081604-appb-000002
的抗高温膜。
为了保证抗高温膜能够承受激光烧结时的热量，该抗高温膜的厚度至少为
Figure PCTCN2018081604-appb-000003
例如为
Figure PCTCN2018081604-appb-000004
将抗高温膜的厚度设置为
Figure PCTCN2018081604-appb-000005
是本发 明实施例的优选实施方式，在具体实施时，也可以设置抗高温膜的厚度为其他尺寸，此处不对抗高温膜的厚度进行限定。
基于同一发明构思，本发明实施例还提供了一种有机电致发光显示面板，该显示面板由上述制作方法制作而成。由于该有机电致发光显示面板解决问题的原理与上述制作方法相似，因此该有机电致发光显示面板的实施可以参见上述制作方法的实施，重复之处不再赘述。
基于同一发明构思，本发明实施例还提供了一种显示装置，包括上述有机电致发光显示面板，该显示装置可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与上述有机电致发光显示面板相似，因此该显示装置的实施可以参见上述有机电致发光显示面板的实施，重复之处不再赘述。
本发明实施例提供的上述有机电致发光显示面板、其制作方法及显示装置中，通过在有机电致发光显示器件之上和/或封装盖板的表面，与有机电致发光显示器件的最外侧边缘的像素对应区域形成抗高温膜，该抗高温膜可以承受激光烧结过程中产生的热量，对下方的像素点起到保护作用，防止激光产生的热量烧伤像素点。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2017年5月12日递交的中国专利申请第201710333397.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (12)

  1. 一种有机电致发光显示面板的制作方法，包括：
    在衬底基板上形成有机电致发光显示器件；
    提供一封装盖板；
    在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜，所述至少部分区域与所述有机电致发光显示器件的最外侧边缘的像素对应；
    在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域；
    将所述封装盖板与所述有机电致发光显示器件对盒后，用激光对所述封装盖板的玻璃框胶所在的区域进行烧结。
  2. 如权利要求1所述的制作方法，其中，所述抗高温膜形成于所述封装盖板的表面；
    所述在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域，包括：
    在所述封装盖板上，与所述抗高温膜的同侧形成所述玻璃框胶。
  3. 如权利要求1所述的制作方法，其中，所述抗高温膜形成于所述封装盖板的表面；
    所述在所述封装盖板或所述衬底基板上形成玻璃框胶，所述玻璃框胶围绕所述封装盖板或所述衬底基板上与所述有机电致发光显示器件的最外侧边缘的像素对应的区域，包括：
    在所述封装盖板上背离所述抗高温膜的一侧形成所述玻璃框胶。
  4. 如权利要求3所述的制作方法，其中，所述用激光对所述封装盖板的玻璃框胶所在的区域进行烧结之后，还包括：
    去除所述抗高温膜。
  5. 如权利要求2或3所述的制作方法，其中，所述抗高温膜为透明的抗高温膜。
  6. 如权利要求1所述的制作方法，其中，所述抗高温膜形成于所述有机电致发光显示器件的表面；
    所述在所述有机电致发光显示器件的表面的至少部分区域形成抗高温膜，所述至少部分区域与所述有机电致发光显示器件的最外侧边缘的像素对应，包括：
    在与所述有机电致发光显示器件的最外侧边缘的像素对应区域形成透明的抗高温膜。
  7. 如权利要求1-6任一项所述的制作方法，其中，所述在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜包括：
    在与所述有机电致发光显示器件的最外侧边缘的1-3层像素对应区域形成抗高温膜。
  8. 如权利要求1-6任一项所述的制作方法，其中，所述在所述有机电致发光显示器件的表面和/或所述封装盖板的表面的至少部分区域形成抗高温膜包括：
    在与所述有机电致发光显示器件的所有像素对应区域形成抗高温膜。
  9. 如权利要求1-6任一项所述的制作方法，其中，采用聚对苯二甲酸乙二醇酯或聚酰亚胺材料形成抗高温膜。
  10. 如权利要求1-6任一项所述的制作方法，其中，所述抗高温膜的厚度为
    Figure PCTCN2018081604-appb-100001
  11. 一种有机电致发光显示面板，其中，所述显示面板由权利要求1-10任一项所述的制作方法制作而成。
  12. 一种显示装置，其中，包括：如权利要求11所述的有机电致发光显示面板。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110053344A (zh) * 2019-04-22 2019-07-26 霸州市云谷电子科技有限公司 显示屏、显示屏的制备方法和显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935730B (zh) * 2017-05-12 2019-01-01 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN114141830B (zh) * 2021-11-22 2023-05-30 深圳市华星光电半导体显示技术有限公司 显示面板及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1414643A (zh) * 2001-10-24 2003-04-30 翰立光电股份有限公司 显示元件的封装结构及其封装方法
CN105098092A (zh) * 2015-06-17 2015-11-25 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
CN106935730A (zh) * 2017-05-12 2017-07-07 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7495390B2 (en) * 2000-12-23 2009-02-24 Lg Display Co., Ltd. Electro-luminescence device with improved thermal conductivity
JP3884351B2 (ja) * 2002-08-26 2007-02-21 株式会社 日立ディスプレイズ 画像表示装置およびその製造方法
CN104362259B (zh) * 2014-11-17 2017-02-22 京东方科技集团股份有限公司 发光二极管显示面板及其封装方法
KR102303244B1 (ko) * 2015-04-15 2021-09-17 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1414643A (zh) * 2001-10-24 2003-04-30 翰立光电股份有限公司 显示元件的封装结构及其封装方法
CN105098092A (zh) * 2015-06-17 2015-11-25 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
CN106935730A (zh) * 2017-05-12 2017-07-07 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110053344A (zh) * 2019-04-22 2019-07-26 霸州市云谷电子科技有限公司 显示屏、显示屏的制备方法和显示装置

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