WO2018205281A1 - 一种金属外壳及其制备方法、电子设备 - Google Patents

一种金属外壳及其制备方法、电子设备 Download PDF

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Publication number
WO2018205281A1
WO2018205281A1 PCT/CN2017/084207 CN2017084207W WO2018205281A1 WO 2018205281 A1 WO2018205281 A1 WO 2018205281A1 CN 2017084207 W CN2017084207 W CN 2017084207W WO 2018205281 A1 WO2018205281 A1 WO 2018205281A1
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WO
WIPO (PCT)
Prior art keywords
metal
metal casing
layer
antenna
shielding layer
Prior art date
Application number
PCT/CN2017/084207
Other languages
English (en)
French (fr)
Inventor
毛维华
龚露露
黄礼忠
钱云贵
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2017/084207 priority Critical patent/WO2018205281A1/zh
Priority to CN201780018388.XA priority patent/CN108886880B/zh
Publication of WO2018205281A1 publication Critical patent/WO2018205281A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present application relates to the field of electronic device technologies, and in particular, to a metal casing, a method for preparing the same, and an electronic device.
  • the role of the antenna in the electronic device is to transmit the radio frequency signal generated by the circuit board and transmit the received radio frequency signal to the circuit board to realize wireless bidirectional transmission of the voice signal, the video signal, the data signal and the like.
  • metal casings are increasingly favored and sought after by consumers due to their excellent hand, texture, wear and impact resistance.
  • the present application provides a metal casing, a preparation method thereof, and an electronic device, which can improve the stability of an antenna signal.
  • a metal casing including a metal casing, further comprising a metal layer sprayed on an inner surface of the metal casing, the metal layer being a part of the antenna structure; the metal layer being closely attached to the inner surface of the metal casing, and
  • the material of the metal layer is a wear-resistant and oxidation-resistant material.
  • the application can improve the stability of the antenna signal; when the metal layer is located in the non-metallic antenna blocking region of the metal casing, since the material of the metal layer is wear-resistant and oxidation-resistant material, the stability of the antenna signal can also be improved.
  • the metal housing includes a feed point region; the metal layer includes an antenna bridge, and the antenna bridge is located at the feed point region and covers the feed point region.
  • the feeding point of the metal shell vibrates and rubs against the metal shrapnel, which will cause oxidation and wear of the feeding point on the metal shell to increase the contact resistance.
  • the electrical connection performance of the antenna loop is degraded, and the stability of the antenna signal is degraded. Therefore, the present application can improve the problem by providing antenna bridging in the feeding point region.
  • the metal layer further includes an antenna trace. Relatively adopting the routing on the PCB, or using FPC to achieve signal radiation, when the metal layer includes the antenna trace, so that the antenna trace is used for signal radiation, the space occupied by the corresponding PCB and FPC can be saved. Ultra-thin electronic devices offer the possibility.
  • the metal layer further includes an antenna trace. Relatively using the routing on the PCB, or using FPC to achieve signal radiation, when The metal layer includes the antenna traces, so that when the antenna traces are used for signal radiation, the space occupied by the corresponding PCB and FPC can be saved, which makes it possible to manufacture ultra-thin electronic equipment. Relatively using the CNC process to fabricate a structure for radiating signals inside the metal casing, the arrangement of the antenna wires can reduce the cost of manufacturing the structure by using the CNC process.
  • the material of the metal layer comprises phosphor bronze. Since phosphor bronze has higher corrosion resistance, oxidation resistance, wear resistance, and fatigue resistance, phosphor bronze can be used as the material of the metal layer in the present application.
  • an electronic device comprising the metal casing of the first aspect and any one of the implementations of the first aspect.
  • the metal casing has the same technical effects as the first aspect, and details are not described herein again.
  • a third aspect provides a method for preparing a metal casing, comprising: forming a shielding layer on an inner surface of the metal casing, the shielding layer exposing a partial region; spraying a wear-resistant oxidation-resistant metal material by a spraying process, exposing the shielding layer
  • the area of the inner surface of the metal casing forms a metal layer closely attached to the inner surface of the metal casing; the metal layer is a part of the antenna structure; and the shielding layer is removed.
  • the layer is in intimate contact with the metal casing exposed by the shielding layer to prevent the metal layer from falling off during use.
  • the electrical connection between the metal layer and the metal portion of the metal casing covered thereby can be regarded as one body, and the metal
  • the material of the layer is wear-resistant and oxidation-resistant material, so that the anti-wear and anti-oxidation properties of the region where the metal layer is located can be improved, and the metal layer is not disposed, and the metal portion of the corresponding region is oxidized and worn to cause the antenna signal to be stable.
  • the application can improve the stability of the antenna signal; when the metal layer is located in the non-metallic antenna partition region of the metal casing, since the material of the metal layer is a wear-resistant and oxidation-resistant material, the antenna signal can also be improved. stability.
  • the metal housing includes a feed point region; the metal layer includes an antenna bridge, and the antenna bridge is located at the feed point region and covers the feed point region. Relatively, the antenna bridge is not formed in the feeding point area. Since the feeding point of the metal casing vibrates and rubs against the metal dome during long-term use, the feeding point of the metal casing is oxidized and worn, and the contact resistance is increased. As a result, the antenna loop electrical connection performance is degraded, and the stability of the antenna signal is degraded. Therefore, the present application forms an antenna bridge in the feed point region, which can improve the problem.
  • the metal layer further includes an antenna trace. Relatively adopting the implementation of routing on the PCB, or using FPC to achieve signal radiation, when the metal layer includes the antenna trace 202, the antenna trace 202 is used for signal radiation, which can save the space occupied by the corresponding PCB and FPC. It is possible to make ultra-thin electronic devices.
  • the metal layer includes antenna traces. Relatively adopting the routing on the PCB, or using FPC to achieve signal radiation, when the metal layer includes the antenna trace, so that the antenna trace is used for signal radiation, the corresponding PCB and FPC can be saved. The space occupied makes it possible to make ultra-thin electronic devices. Relatively using the CNC process to fabricate a structure for radiating signals inside the metal casing, the arrangement of the antenna wires can reduce the cost of manufacturing the structure by using the CNC process.
  • the metal material is sprayed by using a spraying process, and the inner surface of the metal shell exposed on the shielding layer is a region, forming a metal layer closely attached to the inner surface of the metal casing, comprising: melting and spraying the phosphor bronze material onto the inner surface of the metal casing, and forming a tight adhesion to the metal casing in a region of the inner surface of the metal casing exposed by the shielding layer a metal layer on the surface. Since phosphor bronze has higher corrosion resistance, oxidation resistance, wear resistance, and fatigue resistance, phosphor bronze can be used as the material of the metal layer.
  • the forming a shielding layer on the inner surface of the metal casing comprises: The shielding film covering the inner surface of the metal casing is formed by a spraying process; the shielding film of the metal layer region to be formed is removed by a laser engraving process to form a shielding layer.
  • the masking layer can be formed by a simple process.
  • the forming a shielding layer on the inner surface of the metal casing comprises: The masking film covering the inner surface of the metal shell is formed by a laminating process; the masking film of the metal layer region to be formed is removed by a laser engraving process to form a shielding layer.
  • the masking layer can be formed by a simple process.
  • the inner surface of the metal casing is anodized;
  • the method further comprises: removing the oxide layer on the inner surface of the metal shell exposed by the shielding layer by using a laser engraving process, after removing the shielding film of the metal layer region by using a laser engraving process to form a shielding layer and forming a metal layer by a spraying process. . This ensures that the metal layer is electrically connected to the metal portion of the metal casing it covers.
  • the removing the shielding layer comprises: removing the shielding layer by using an ultrasonic water washing process. Ultrasonic water washing removes the masking layer without affecting the metal casing.
  • the removing the shielding layer comprises: tearing off the shielding layer.
  • the mask layer is removed without affecting the metal casing and the process is simple.
  • the material of the shielding layer comprises at least one of a paint and an ink. Since the paint and the ink do not react with the metal material, and the cost is low and easy to remove, the material of the masking film may be selected from at least one of paint and ink.
  • FIG. 1 is a schematic view 1 of a metal casing provided by the present application.
  • FIG. 2 is a schematic view 2 of a metal casing provided by the present application.
  • Figure 3 is a schematic view 1 of a metal casing provided by the present application.
  • Figure 4 is a schematic view 2 of a metal casing provided by the present application.
  • Figure 5 is a schematic view 3 of a metal casing provided by the present application.
  • FIG. 6 is a schematic flow chart 1 for preparing a metal casing provided by the present application.
  • FIG. 7 is a schematic flow chart 2 of preparing a metal casing provided by the present application.
  • FIG. 8 is a schematic view showing a masking film formed on a metal casing according to the present application.
  • 9a is a schematic view 1 of forming a shielding layer on a metal casing provided by the present application.
  • 9b is a schematic view 2 of forming a shielding layer on a metal casing provided by the present application.
  • Figure 9c is a schematic view 3 of forming a shielding layer on a metal casing provided by the present application.
  • Figure 10a is a schematic view showing the formation of an antenna bridge on the basis of Figure 9a;
  • Figure 10b is a schematic diagram of forming an antenna bridge and an antenna trace on the basis of Figure 9b;
  • Figure 10c is a schematic view showing the formation of antenna traces on the basis of Figure 9c;
  • Figure 11 is a schematic view 3 of a process for preparing a metal casing provided by the present application.
  • FIG. 12 is a schematic flow chart 4 of preparing a metal casing provided by the present application.
  • FIG. 13 is a schematic diagram 5 of a process for preparing a metal casing provided by the present application.
  • 10-metal housing 101-metal part; 102-plastic strip; 103-feed point area; 104-antenna trace area; 201-antenna bridge; 202-antenna trace; 30-shielding film; .
  • the present application provides a metal casing, including a metal casing, and further includes a metal layer sprayed on an inner surface of the metal casing, the metal layer being a part of the antenna structure; the metal layer is closely attached to the inner surface of the metal casing, and the metal
  • the material of the layer is a wear resistant and oxidation resistant material.
  • the thickness of the metal layer can be controlled within a range of 0.05 to 0.2 mm, for example, to about 0.1 mm.
  • the metal casing is not all metal, but needs to be formed on the all-metal shell body by a related process.
  • the metal antenna is cut off to allow the metal housing to also participate in signal radiation as part of the antenna structure.
  • the metal casing in the present application refers to a metal shell which is obtained by processing a metal profile to obtain a shell body having a certain shape and a certain internal structure, and performing a series of processes on the shell body, including a non-metallic antenna partition region. body.
  • the metal casing 10 includes a metal portion 101, and a plastic strip 102 is disposed at a partition between the metal portions. Only the metal portion 101 and the plastic strip 102 are illustrated in FIG. 1, and the specific structure inside the metal casing 10 is not illustrated.
  • the metal casing 10 may include only the back cover, and may also include a back cover and a side plate.
  • the back cover and the side panels may be an integrated structure.
  • the metal layer may be disposed on the back plate, or on the side plate, or at the same time on the back plate and the side plate.
  • the inner surface of the metal casing 10 is relative to the design surface of the metal casing 10, and the appearance surface is a surface that can be seen and touched when the metal casing is applied to an electronic device.
  • the antenna structure transmits the radio frequency signal generated by the circuit board in the electronic device, and will receive
  • the function of transmitting the radio frequency signal to the circuit board does not limit the antenna structure as long as the metal layer sprayed on the inner surface of the metal casing can be used as a part of the antenna structure, so that the antenna structure can perform the above functions.
  • the metal layer can be closely attached to the inner surface of the metal casing by controlling the spraying process when the metal layer is formed.
  • the present application provides a metal casing.
  • the metal layer closely attached to the metal casing 10 is located at the metal portion of the metal casing 10, the metal layer and the metal portion of the metal casing 10 covered thereby are electrically connected.
  • the material of the metal layer is wear-resistant and oxidation-resistant material, so that the wear resistance and oxidation resistance of the region where the metal layer is located can be improved, and the metal layer is relatively not disposed, and the metal portion of the corresponding region is oxidized and worn.
  • the application can improve the stability of the antenna signal; when the metal layer is located in the non-metallic antenna partition region of the metal casing 10, since the material of the metal layer is wear-resistant and oxidation-resistant material, Therefore, the stability of the antenna signal can also be improved.
  • the metal casing 10 includes a feeding point region 103.
  • the metal layer includes an antenna bridge 201, and the antenna bridge 201 is located at the feeding point region 103 and covers the feeding point region. 103.
  • the two together constitute a feeding point.
  • the connecting component on the circuit board may be a metal spring piece (for example, a gold-plated spring piece), and the direct connection between the spring piece and the feeding point enables conduction between the connecting component and the feeding point.
  • a structure for radiating signals is required to be fabricated inside the metal casing 10, wherein a numerical control machining (CNC) may be employed.
  • CNC numerical control machining
  • the antenna bridge 201 is not disposed relatively in the feed point region 103. Since the feed point region 103 on the metal casing 10 vibrates frictionally with the metal dome during long-term use, the feed point region 103 on the metal casing 10 is oxidized and worn. The contact resistance is increased, resulting in a decrease in the electrical connection performance of the antenna loop and a decrease in the stability of the antenna signal. Therefore, the present application provides the antenna bridge 201 in the feed point region 103, which can improve the problem.
  • the metal layer may further include an antenna trace 202 (as shown in FIG. 4) on the basis that the metal layer includes the antenna bridge 201.
  • the antenna trace 202 is disposed on the non-metallic antenna cut-off area of the metal casing 10, that is, the plastic strip 102.
  • the antenna traces 202 are electrically connected directly to the connection components on the circuit board to form an antenna loop.
  • the connecting component on the circuit board can be a metal spring piece (for example, a gold-plated spring piece), and the elastic piece is directly in contact with the antenna wire 202 to realize the conduction between the connecting component and the antenna wire, so that the antenna wire can be used for signal radiation.
  • the metal casing 10 is used for signal radiation, and some antenna loops are used for signal radiation.
  • the antenna traces 202 are used for signal radiation.
  • the metal layer includes antenna traces 202.
  • the antenna trace 202 is used for signal radiation, which can save the space occupied by the corresponding PCB and FPC. It is possible to make ultra-thin electronic devices. Relatively using the CNC process to fabricate a structure for radiating signals inside the metal casing 10, the arrangement of the antenna traces 202 can reduce the cost of fabricating the structure by the CNC process.
  • phosphor bronze Since phosphor bronze has higher corrosion resistance, oxidation resistance, wear resistance, and fatigue resistance, phosphor bronze can be used as the material of the metal layer in the present application.
  • the application provides an electronic device including the metal housing described above.
  • the electronic device can be a cell phone, a tablet, a digital camera, or a netbook.
  • the circuit board in the electronic device needs to be provided with a connecting component, and the connecting component can be a gold-plated shrapnel or the like, and is used for direct contact with the antenna bridge 201 and the antenna trace 202.
  • the application also provides a method for preparing a metal casing, as shown in FIG. 6, comprising:
  • a shielding layer is formed on the inner surface of the metal casing 10, and the shielding layer exposes a partial region.
  • the metal casing 10 is not all metal, but needs to pass the related process on the all-metal shell body.
  • a non-metallic antenna cut-off region is formed such that the metal housing 10 also participates in signal radiation as part of the antenna structure.
  • the metal casing 10 in the present application refers to a metal shell obtained by processing a metal material to obtain a shell body having a certain shape and a certain internal structure, and performing a series of processes on the shell body to obtain a non-metallic antenna partition region. Body 10.
  • the metal casing 10 can be formed at least by the following processes: First, a shell body having a certain shape and a certain internal structure obtained by processing a metal profile, and the material of the shell body can be, for example, an aluminum alloy, a magnesium alloy, or a stainless steel. Metal materials such as titanium alloys and copper alloys; aluminum alloys can be used as the material of the shell body because of their low specific gravity, high specific yield strength, and excellent decorative appearance after anodization. Thereafter, the shell body is processed to obtain a hollow structure, and the hollow structure may include an antenna cut-off slot, a headphone jack, a Universal Serial Bus (USB) hole, and a speaker hole.
  • USB Universal Serial Bus
  • the nano-injection process can be used to inject the hollow structure; wherein, for the antenna partition groove, the plastic can fill the antenna cut-off groove to form a plastic strip 102 for partitioning as shown in FIG. As a whole; for the function hole of the camera hole, earphone hole, USB hole, speaker hole (not shown in Figure 1), etc., the plastic can be filled first with the camera hole, the earphone hole, the USB hole, the speaker hole, etc., and then used The milling process removes part of the plastic to form a camera hole with a plastic inner surface, a headphone hole, a USB hole, a speaker hole, and the like. On the basis of this, at least the surface of the obtained metal casing 10 may be subjected to surface treatment such as sand blasting, anodizing, or the like.
  • surface treatment such as sand blasting, anodizing, or the like.
  • the material of the shielding layer should not react with the metal material of the metal casing 10, and when removed, does not affect the metal casing 10 and the formed metal layer.
  • the principle of metal spraying is to heat the solid metal material to a molten state by using a heat source, atomizing the droplet by the flame flow or the applied thrust or pushing the molten pellet into the sprayed particle beam, and hitting the surface of the metal casing 10 at a certain speed. After cooling, it adheres to the surface of the metal casing 10 to form a metal layer.
  • the metal wire can be melted by a spray gun and atomized into particles, and sprayed onto the surface of the metal casing 10 to form a metal layer.
  • the metal layer is closely attached to the inner surface of the metal casing 10 by a control process during the spraying process.
  • the metal spraying has a small influence on the metal casing 10, does not affect the metallographic structure and mechanical properties of the metal, and can also make the formed metal layer have wear resistance, corrosion resistance, oxidation resistance, high temperature resistance, electrical conductivity and the like.
  • the present application provides a method for preparing a metal casing.
  • a shielding layer By forming a shielding layer in advance, the shielding layer is exposed to a region where a metal layer is to be formed, and other regions of the metal casing 10 are not formed in the process of forming a metal layer by a spraying process.
  • the effect is exerted, and by controlling the spraying process, the metal layer can be brought into close contact with the metal casing 10 exposed by the shielding layer to prevent the metal layer from falling off during use.
  • the electrical connection between the metal layer and the metal portion of the metal casing 10 covered thereby can be regarded as one.
  • the material of the metal layer is a wear-resistant and oxidation-resistant material, thereby improving the anti-wear and anti-oxidation properties of the region where the metal layer is located, and relatively no metal layer is provided, and the metal portion of the corresponding region is oxidized and worn to cause the antenna.
  • the problem of the stability of the signal is reduced.
  • the present application can improve the stability of the antenna signal; when the metal layer is located in the non-metallic antenna blocking region of the metal casing 10, since the material of the metal layer is wear-resistant and oxidation-resistant material, Improve the stability of the antenna signal.
  • Embodiment 1 provides a method for preparing a metal casing, as shown in FIG. 7, comprising:
  • a masking film 30 covering the inner surface of the metal casing 10 is formed by a spraying process.
  • the material of the mask film 30 may be selected from at least one of paint and ink.
  • the masking film 30 to be formed in the metal layer region is removed by a laser engraving process to form the shielding layer 301.
  • the metal layer may include the antenna bridge 201, and based on this, as shown in FIG. 9a, the shielding layer 301 needs to expose the feed point region 103.
  • the metal layer may further include an antenna trace 202. Based on this, as shown in FIG. 9b, the shielding layer 301 exposes the antenna trace area 104 in addition to the feed point area 103.
  • the metal layer may only include the antenna trace 202, and based on this, as shown in FIG. 9c, the shielding layer 301 The antenna routing area 104 is exposed.
  • the shielding film 30 to be formed in the metal layer region may be removed by using a carbon dioxide (CO 2 ) laser laser engraving machine to form the shielding layer 301.
  • CO 2 carbon dioxide
  • the antenna bridge 201 as shown in FIG. 10a can be formed by a spraying process, that is, in this case, the metal layer only includes the antenna.
  • Bridge 201, antenna bridge 201 is located in feed point region 103 and covers feed point region 103.
  • the two together constitute a feeding point.
  • the connecting component on the circuit board may be a metal spring piece (for example, a gold-plated spring piece), and the direct connection between the spring piece and the feeding point enables conduction between the connecting component and the feeding point.
  • a structure for radiating signals is required to be fabricated inside the metal casing 10, wherein a CNC process can be used to fabricate the inside of the metal casing 10. Structure for radiating signals.
  • the antenna bridge 201 is formed relatively in the feed point region 103. Since the feed point region 103 on the metal casing 10 vibrates frictionally with the metal dome during long-term use, the feed point region 103 on the metal shell 10 is oxidized and worn. As a result, the contact resistance is increased, resulting in a decrease in the electrical connection performance of the antenna loop and a decrease in the stability of the antenna signal. Therefore, the present application forms the antenna bridge 201 in the feed point region 103, which can improve the problem.
  • the antenna bridge 201 and the antenna wiring 202 as shown in FIG. 10b can be formed by a spraying process, that is, In this case, the metal layer includes an antenna bridge 201 and an antenna trace 202.
  • the metal casing 10 is used for signal radiation, and in some antenna loops, the antenna traces 202 are used for signal radiation.
  • the antenna trace 202 is formed on the non-metallic antenna blocking area of the metal casing 10, that is, the plastic strip 102.
  • the metal layer includes the antenna trace 202
  • the antenna trace 202 is used for signal radiation, which can save the space occupied by the corresponding PCB and FPC. It is possible to make ultra-thin electronic devices.
  • the antenna trace 202 as shown in FIG. 10c can be formed by a spraying process, that is, in this case, the metal layer includes only the antenna traces. 202.
  • the antenna trace 202 is used for signal radiation, which can save the space occupied by the corresponding PCB and FPC. It is possible to make ultra-thin electronic devices. Relatively using the CNC process to fabricate a structure for radiating signals inside the metal casing 10, the arrangement of the antenna traces 202 can be reduced due to The cost of fabricating the structure using the CNC process.
  • phosphor bronze has higher corrosion resistance, oxidation resistance, wear resistance, and fatigue resistance
  • phosphor bronze can be used as the material of the metal layer.
  • the shielding layer 301 is removed by an ultrasonic water washing process.
  • Ultrasonic water washing adds ultrasonic vibration to an aqueous solution to cause a "cavitation effect" in the liquid.
  • the ultrasonic wave is sparse, bubbles are generated, and when it is squeezed, the air bubbles are crushed, and a mechanical impact force is generated around to remove the shielding layer.
  • the ultrasonic layer is used to remove the shielding layer without affecting the metal casing 10.
  • the preparation method further includes: S24, removing the metal exposed by the shielding layer 301 by a laser engraving process. An oxide layer on the inner surface of the casing 10. In order to ensure that the metal layer is electrically connected to the metal portion of the metal casing 10 covered thereby.
  • the optical layer laser engraving machine can be used to remove the oxide layer on the inner surface of the metal casing 10 exposed by the shielding layer 301.
  • Embodiment 2 provides a method for preparing a metal casing, as shown in FIG. 12, including:
  • the mask film 30 is attached to the inner surface of the metal casing 10.
  • the area exposed by the shielding layer 301 can be referred to FIG. 9a to FIG. 9c.
  • the shielding film 30 to be formed in the metal layer region may be removed by using a CO 2 laser laser engraving machine to form the shielding layer 301.
  • the metal layer can refer to FIG. 10a to FIG. 10c and related descriptions.
  • phosphor bronze Since phosphor bronze has higher corrosion resistance, oxidation resistance, wear resistance, and fatigue resistance, phosphor bronze can be used as the material of the metal layer.
  • the preparation method further includes: S34, removing the inner surface of the metal casing 10 exposed by the shielding layer 301 by a laser engraving process. Oxide layer. In order to ensure that the metal layer is electrically connected to the metal portion of the metal casing 10 covered thereby.
  • the optical layer laser engraving machine can be used to remove the oxide layer on the inner surface of the metal casing 10 exposed by the shielding layer 301.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Details Of Aerials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种金属外壳及其制备方法、电子设备，涉及电子设备技术领域，可提高天线信号的稳定性。该金属外壳的制备方法包括：在金属壳体（10）的内表面形成遮蔽层（301），遮蔽层（301）露出部分区域（S10）；采用喷涂工艺喷涂耐磨耐氧化型金属材料，在遮蔽层（301）所露出的金属壳体（10）内表面的区域，形成紧密附着于金属壳体（10）内表面上的金属层，金属层为天线结构的一部分（S11）；去除遮蔽层（S12）。

Description

一种金属外壳及其制备方法、电子设备 技术领域
本申请涉及电子设备技术领域，尤其涉及一种金属外壳及其制备方法、电子设备。
背景技术
随着无线通信技术的日益发展和普及，目前大多电子设备均采用内置天线来实现无线通信。天线在电子设备中的作用是将电路板产生的射频信号发射出去以及将接收到的射频信号传递至电路板，以实现语音信号、视频信号、数据信号等的无线双向传输。
在此基础上，在电子设备领域，特别是移动终端设备，金属外壳由于其优良的手感、质感以及耐磨、抗冲击特性，越来越受到消费者的偏爱和追捧。
而在采用金属外壳的电子设备中，越来越多电子设备都将金属外壳作为天线的一部分来参与信号辐射，但是天线信号的稳定性也是目前普遍存在的问题。
发明内容
本申请提供一种金属外壳及其制备方法、电子设备,可提高天线信号的稳定性。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，提供一种金属外壳，包括金属壳体，还包括喷涂于金属壳体内表面上的金属层，金属层为天线结构的一部分；金属层紧密附着于金属壳体的内表面上，且金属层的材料为耐磨耐氧化型材料。当紧密附着于金属壳体上的金属层位于金属壳体的金属部分时，由于金属层以及其所覆盖的金属壳体的金属部分二者电连接可看做一体，且金属层的材料为耐磨耐氧化型材料，因而可提高该金属层所处区域的抗磨损、抗氧化等特性，相对不设置金属层，相应区域的金属部分存在氧化、磨损而导致天线信号的稳定性降低的问题，本申请可提高天线信号的稳定性；当金属层位于金属壳体的非金属天线隔断区时，由于金属层的材料为耐磨耐氧化型材料，因而也可提高天线信号的稳定性。
结合第一方面，在第一方面的第一种可能的实现方式中，金属壳体包括馈电点区域；金属层包括天线桥接，天线桥接位于馈电点区域且覆盖馈电点区域。相对不在馈电点区域设置天线桥接，由于在长期使用过程中，金属壳体上馈电点区域与金属弹片振动摩擦，会导致金属壳体上馈电点区域氧化、磨损而使接触电阻增大，从而导致天线回路电连接性能降低，天线信号的稳定性下降，因而，本申请在馈电点区域设置天线桥接，可改善此问题。
结合第一方面的第一种可能的实现方式，在第一方面的第二种可能的实现方式中，金属层还包括天线走线。相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线，使天线走线用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。
结合第一方面，在第一方面的第三种可能的实现方式中，金属层还包括天线走线。相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当 金属层包括天线走线，使天线走线用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。相对采用CNC工艺在金属壳体内部制作出用于辐射信号的结构，天线走线的设置方式，可降低由于采用CNC工艺制作该结构的成本。
结合第一方面以及第一方面上述的任一种可能的实现方式，在第一方面的第四种可能的实现方式中，金属层的材料包括磷青铜。由于磷青铜具有更高的耐蚀性、耐氧化、耐磨损、抗疲劳性，因此，本申请中可采用磷青铜作为金属层的材料。
第二方面，提供一种电子设备，包括第一方面以及第一方面的任一种实现方式的金属外壳。其中的金属外壳具有与第一方面相同的技术效果，在此不再赘述。
第三方面，提供一种金属外壳的制备方法，包括：在金属壳体的内表面形成遮蔽层，遮蔽层露出部分区域；采用喷涂工艺喷涂耐磨耐氧化型金属材料，在遮蔽层所露出的金属壳体内表面的区域，形成紧密附着于金属壳体内表面上的金属层；金属层为天线结构的一部分；去除遮蔽层。通过预先形成遮蔽层，使遮蔽层露出待形成金属层的区域，可在采用喷涂工艺形成金属层的过程中，不会对金属壳体的其他区域产生影响，而且通过控制喷涂工艺，可使金属层与被遮蔽层所露出的金属壳体紧密接触，避免在使用过程中金属层脱落。在此基础上，当紧密附着于金属壳体上的金属层位于金属壳体的金属部分时，由于金属层以及其所覆盖的金属壳体的金属部分二者电连接可看做一体，且金属层的材料为耐磨耐氧化型材料，因而可提高该金属层所处区域的抗磨损、抗氧化等特性，相对不设置金属层，相应区域的金属部分存在氧化、磨损而导致天线信号的稳定性降低的问题，本申请可提高天线信号的稳定性；当金属层位于金属壳体的非金属天线隔断区时，由于金属层的材料为耐磨耐氧化型材料，因而也可提高天线信号的稳定性。
结合第三方面，在第三方面的第一种可能的实现方式中，金属壳体包括馈电点区域；金属层包括天线桥接，天线桥接位于馈电点区域且覆盖馈电点区域。相对不在馈电点区域形成天线桥接，由于在长期使用过程中，金属壳体上馈电点区域与金属弹片振动摩擦，会导致金属壳体上馈电点区域氧化、磨损而使接触电阻增大，从而导致天线回路电连接性能降低，天线信号的稳定性下降，因而，本申请在馈电点区域形成天线桥接，可改善此问题。
结合第三方面的第一种可能的实现方式，在第三方面的第二种可能的实现方式中，金属层还包括天线走线。相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线202，使天线走线202用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。
结合第三方面，在第三方面的第三种可能的实现方式中，金属层包括天线走线。相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线，使天线走线用于信号辐射时，可节省出相应的PCB、FPC所 占据的空间，为制作超薄电子设备提供了可能。相对采用CNC工艺在金属壳体内部制作出用于辐射信号的结构，天线走线的设置方式，可降低由于采用CNC工艺制作该结构的成本。
结合第三方面以及第三方面上述的任一种可能的实现方式，在第三方面的第四种可能的实现方式中，采用喷涂工艺喷涂金属材料，在遮蔽层所露出的金属壳体内表面的区域，形成紧密附着于金属壳体内表面上的金属层，包括：将磷青铜材料熔化喷射到金属壳体内表面上，在遮蔽层所露出的金属壳体内表面的区域，形成紧密附着于金属壳体内表面上的金属层。由于磷青铜具有更高的耐蚀性、耐氧化、耐磨损、抗疲劳性，因此，可采用磷青铜作为金属层的材料。
结合第三方面以及第三方面的第一到第四种任一种可能的实现方式，在第三方面的第五种可能的实现方式中，在金属壳体的内表面形成遮蔽层，包括：采用喷涂工艺形成覆盖金属壳体内表面的遮蔽薄膜；采用镭雕工艺去除待形成金属层区域的遮蔽薄膜，形成遮蔽层。通过简单的工艺便可形成遮蔽层。
结合第三方面以及第三方面的第一到第四种任一种可能的实现方式，在第三方面的第六种可能的实现方式中，在金属壳体的内表面形成遮蔽层，包括：采用覆膜工艺形成覆盖金属壳体内表面的遮蔽薄膜；采用镭雕工艺去除待形成金属层区域的遮蔽薄膜，形成遮蔽层。通过简单的工艺便可形成遮蔽层。
结合第三方面的第五种可能的实现方式或第六种可能的实现方式，在第三方面的第七种可能的实现方式中，金属壳体的内表经过阳极化处理；基于此，在采用镭雕工艺去除待形成金属层区域的遮蔽薄膜，形成遮蔽层之后，采用喷涂工艺形成金属层之前，该制备方法还包括：采用镭雕工艺去除遮蔽层所露出的金属壳体内表面的氧化层。这样可保证金属层与其所覆盖的金属壳体的金属部分电连接。
结合第三方面的第五种可能的实现方式，在第三方面的第八种可能的实现方式中，去除遮蔽层，包括：采用超声水洗工艺去除遮蔽层。采用超声水洗去除遮蔽层，可不会对金属壳体造成影响。
结合第三方面的第六种可能的实现方式，在第三方面的第九种可能的实现方式中，去除遮蔽层，包括：撕除遮蔽层。撕除遮蔽层，可不会对金属壳体造成影响且工艺简单。
结合第三方面，在第三方面的第十种可能的实现方式中，遮蔽层的材料包括油漆、油墨中的至少一种。由于油漆、油墨不与金属材料发生反应，且成本低、容易去除，因此，遮蔽薄膜的材料可选自油漆、油墨中的至少一种。
附图说明
图1为本申请提供的一种金属壳体的示意图一；
图2为本申请提供的一种金属壳体的示意图二；
图3为本申请提供的一种金属外壳的示意图一；
图4为本申请提供的一种金属外壳的示意图二；
图5为本申请提供的一种金属外壳的示意图三；
图6为本申请提供的一种制备金属外壳的流程示意图一；
图7为本申请提供的一种制备金属外壳的流程示意图二；
图8为本申请提供的一种在金属壳体上形成遮蔽薄膜的示意图；
图9a为本申请提供的一种在金属壳体上形成遮蔽层的示意图一；
图9b为本申请提供的一种在金属壳体上形成遮蔽层的示意图二；
图9c为本申请提供的一种在金属壳体上形成遮蔽层的示意图三；
图10a为在图9a的基础上形成天线桥接的示意图；
图10b为在图9b的基础上形成天线桥接和天线走线的示意图；
图10c为在图9c的基础上形成天线走线的示意图；
图11为本申请提供的一种制备金属外壳的流程示意图三；
图12为本申请提供的一种制备金属外壳的流程示意图四；
图13为本申请提供的一种制备金属外壳的流程示意图五。
附图标记：
10-金属壳体；101-金属部分；102-塑胶条；103-馈电点区域；104-天线走线区域；201-天线桥接；202-天线走线；30-遮蔽薄膜；301-遮蔽层。
具体实施方式
本申请提供一种金属外壳，包括金属壳体，还包括喷涂于金属壳体内表面上的金属层，金属层为天线结构的一部分；金属层紧密附着于金属壳体的内表面上，且该金属层的材料为耐磨耐氧化型材料。
其中，金属层的厚度可以控制在0.05～0.2mm范围内，例如可以控制在0.1mm左右。
此处，由于设计金属壳体时需考虑天线信号辐射因素，因此，本领域技术人员应该知道，金属壳体并非全部都是金属的，而需通过相关工艺，在全金属的壳本体上形成非金属天线隔断区，以使金属壳体也作为天线结构的一部分来参与信号辐射。基于此，本申请中金属壳体是指：对金属型材进行加工获得具有一定形状以及一定内部结构的壳本体，并对壳本体进行一系列工艺后所得到的包括非金属天线隔断区的金属壳体。
示例的，如图1所示，金属壳体10包括金属部分101，金属部分之间的隔断处设置有塑胶条102。图1中仅示意出金属部分101和塑胶条102，并未对金属壳体10内部的具体结构进行示意。
需要说明说明的是，第一，金属壳体10可以仅包括背盖，也可以包括背盖和侧板。当金属壳体10包括背盖和侧板时，背盖和侧板可以为一体化结构。
其中，金属层可设置在背板上，也可设置在侧板上，或同时设置在背板和侧板上。
金属壳体10的内表面是相对金属壳体10的外观面而言的，外观面即是当金属外壳应用于电子设备时，可被看到、触摸的面。
第二，天线结构起到将电子设备中电路板产生的射频信号发射出去，将接收到 的射频信号传递至电路板的作用，本申请不对天线结构进行限定，只要能使喷涂于金属壳体内表面的金属层作为天线结构的一部分，而使天线结构起到上述功能即可。
第三，可通过控制形成金属层时的喷涂工艺，来使金属层紧密附着于金属壳体的内表面上。
本申请提供一种金属外壳，当紧密附着于金属壳体10上的金属层位于金属壳体10的金属部分时，由于金属层以及其所覆盖的金属壳体10的金属部分二者电连接可看做一体，且金属层的材料为耐磨耐氧化型材料，因而可提高该金属层所处区域的抗磨损、抗氧化等特性，相对不设置金属层，相应区域的金属部分存在氧化、磨损而导致天线信号的稳定性降低的问题，本申请可提高天线信号的稳定性；当金属层位于金属壳体10的非金属天线隔断区时，由于金属层的材料为耐磨耐氧化型材料，因而也可提高天线信号的稳定性。
可选的，如图2所示，金属壳体10包括馈电点区域103；如图3所示，金属层包括天线桥接201，该天线桥接201位于馈电点区域103且覆盖馈电点区域103。
其中，由于天线桥接201以及其所覆盖的金属壳体10上馈电点区域103的金属部分电连接，因此，二者共同构成馈电点。
由于金属壳体10作为天线结构的一部分参与信号辐射，因此需要通过馈电点与电路板上的连接部件实现电连接，以形成通信、无线局域网(Wireless Fidelity，简称WiFi)、全球定位系统(Global Positioning System，简称GPS)等天线回路。其中，电路板上的连接部件可以为金属弹片(例如为镀金弹片)，通过弹片与馈电点直接接触，实现连接部件与馈电点的导通。
需要说明的是，为使金属壳体10作为天线结构的一部分参与信号辐射，需在金属壳体10内部制作出用于辐射信号的结构，其中，可采用数控加工(Computer Numerical Control，简称CNC)工艺在金属壳体10内部制作出用于辐射信号的结构。
相对不在馈电点区域103设置天线桥接201，由于在长期使用过程中，金属壳体10上馈电点区域103与金属弹片振动摩擦，会导致金属壳体10上馈电点区域103氧化、磨损而使接触电阻增大，从而导致天线回路电连接性能降低，天线信号的稳定性下降，因而，本申请在馈电点区域103设置天线桥接201，可改善此问题。
进一步的，在金属层包括天线桥接201的基础上，金属层还可以包括天线走线202(如图4所示)。
其中，天线走线202设置在金属壳体10的非金属天线隔断区，即塑胶条102上。
此处，天线走线202直接与电路板上的连接部件实现电连接，以形成天线回路。电路板上的连接部件可以为金属弹片(例如为镀金弹片)，通过弹片与天线走线202直接接触，实现连接部件与天线走线的导通，从而可使天线走线用于信号辐射。
即，部分天线回路中采用金属壳体10进行信号辐射，部分天线回路中采 用天线走线202进行信号辐射。
相对采用在印制电路板(Printed Circuit Board，简称PCB)上设置走线实现，或者采用柔性电路板(Flexible Printed Circuit，简称FPC)实现信号辐射，当金属层包括天线走线202，使天线走线202用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。
可选的，如图5所示，金属层包括天线走线202。
相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线202，使天线走线202用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。相对采用CNC工艺在金属壳体10内部制作出用于辐射信号的结构，天线走线202的设置方式，可降低由于采用CNC工艺制作该结构的成本。
由于磷青铜具有更高的耐蚀性、耐氧化、耐磨损、抗疲劳性，因此，本申请中可采用磷青铜作为金属层的材料。
本申请提供一种电子设备，包括上述的金属外壳。
示例性的，该电子设备可以为手机、平板电脑、数码相机或者上网本。
其中，电子设备中的电路板需设置连接部件，该连接部件可以为镀金弹片等，用于与天线桥接201、天线走线202直接接触导通。
本申请还提供一种金属外壳的制备方法，如图6所示，包括：
S10、在金属壳体10的内表面形成遮蔽层，遮蔽层露出部分区域。
此处，由于设计金属壳体10时需考虑天线信号辐射因素，因此，本领域技术人员应该知道，金属壳体10并非全部都是金属的，而需通过相关工艺，在全金属的壳本体上形成非金属天线隔断区，以使金属壳体10也作为天线结构的一部分来参与信号辐射。基于此，本申请中金属壳体10是指：经过金属材料加工获得具有一定形状以及一定内部结构的壳本体，并对壳本体进行一系列工艺后所得到的包括非金属天线隔断区的金属壳体10。
示例的，金属壳体10可至少通过如下过程制作形成：首先，对金属型材进行加工获得的具有一定形状以及一定内部结构的壳本体，壳本体的材料可采用例如铝合金、镁铝合金、不锈钢、钛合金、铜合金等金属材料；由于铝合金比重低、比屈服强度高、阳极氧化后外观可装饰性优异，因此可采用铝合金作为壳本体的材料。之后，对壳本体进行处理，获得镂空结构，镂空结构可包括天线隔断槽、耳机孔、通用串行总线(Universal Serial Bus，简称USB)孔和扬声器孔等。之后，可采用纳米注塑工艺，对镂空结构进行注塑；其中，对于天线隔断槽，塑胶可填满该天线隔断槽，形成如图1所示隔断用塑胶条102，将隔开的金属部分101连为一体；对于摄像孔、耳机孔、USB孔、扬声器孔(图1中未示出)等功能开孔时，可先将塑胶填充满摄像孔、耳机孔、USB孔、扬声器孔等，而后采用铣削工艺去除部分塑胶，形成具有塑胶内表面的摄像孔、耳机孔、USB孔、扬声器孔等。在此基础上，还可至少对得到的金属壳体10的外观面进行表面处理例如喷砂、阳极化处理等。
为了对遮蔽层所覆盖区域的金属壳体进行保护，该遮蔽层的材料应不与金属壳体10的金属材料发生反应，且在去除时，不影响金属壳体10以及形成的金属层。
S11、采用喷涂工艺喷涂耐磨耐氧化型金属材料，在遮蔽层所露出的金属壳体10内表面的区域，形成紧密附着于金属壳体10内表面上的金属层；金属层为天线结构的一部分。
金属喷涂的原理为：利用热源将固体的金属材料加热到熔化状态，借助焰流或外加推力将熔滴雾化或推动熔粒成喷射的粒束，以一定的速度撞击金属壳体10表面，冷却后粘附到金属壳体10的表面，形成金属层。
具体可通过喷枪将金属线材熔化、并雾化成粒子，喷射到金属壳体10的表面，形成金属层。在喷涂过程中，通过控制工艺可使金属层紧密附着于金属壳体10的内表面上。
其中，金属喷涂具有对金属壳体10影响小，不会影响金属的金相组织和机械性能，还能使所形成金属层具有耐磨、耐腐、耐氧化、耐高温、导电等性能。
S12、去除遮蔽层。
本申请提供一种金属外壳的制备方法，通过预先形成遮蔽层，使遮蔽层露出待形成金属层的区域，可在采用喷涂工艺形成金属层的过程中，不会对金属壳体10的其他区域产生影响，而且通过控制喷涂工艺，可使金属层与被遮蔽层所露出的金属壳体10紧密接触，避免在使用过程中金属层脱落。在此基础上，当紧密附着于金属壳体10上的金属层位于金属壳体10的金属部分时，由于金属层以及其所覆盖的金属壳体10的金属部分二者电连接可看做一体，且金属层的材料为耐磨耐氧化型材料，因而可提高该金属层所处区域的抗磨损、抗氧化等特性，相对不设置金属层，相应区域的金属部分存在氧化、磨损而导致天线信号的稳定性降低的问题，本申请可提高天线信号的稳定性；当金属层位于金属壳体10的非金属天线隔断区时，由于金属层的材料为耐磨耐氧化型材料，因而也可提高天线信号的稳定性。
下面提供两个实施例以具体说明金属外壳的制备方法。
实施例一，提供一种金属外壳的制备方法，如图7所示，包括：
S20、如图8所示，采用喷涂工艺形成覆盖金属壳体10内表面的遮蔽薄膜30。
由于油漆、油墨不与金属材料发生反应，且成本低、容易去除，因此，遮蔽薄膜30的材料可选自油漆、油墨中的至少一种。
S21、如图9a、图9b和图9c所示，采用镭雕工艺去除待形成金属层区域的遮蔽薄膜30，形成遮蔽层301。
具体的，当金属壳体10包括馈电点区域103时，金属层可包括天线桥接201，基于此，如图9a所示，遮蔽层301需露出馈电点区域103。
进一步的，金属层还可包括天线走线202，基于此，如图9b所示，遮蔽层301除露出馈电点区域103外，还露出天线走线区域104。
或者，金属层可仅包括天线走线202，基于此，如图9c所示，遮蔽层301 露出天线走线区域104。
其中，可采用二氧化碳(CO2)激光镭雕机去除待形成金属层区域的遮蔽薄膜30，形成遮蔽层301。
S22、采用喷涂工艺喷涂耐磨耐氧化型金属材料，在遮蔽层301所露出的金属壳体10内表面的区域，形成紧密附着于金属壳体10内表面上的金属层。
具体的，如图9a所示，当遮蔽层301仅露出馈电点区域103时，通过喷涂工艺，可形成如图10a所示的天线桥接201，即，在此情况下，金属层仅包括天线桥接201，天线桥接201位于馈电点区域103且覆盖馈电点区域103。
其中，由于天线桥接201以及其所覆盖的金属壳体10上馈电点区域103的金属部分电连接，因此，二者共同构成馈电点。
由于金属壳体10作为天线结构的一部分参与信号辐射，因此需要通过馈电点与电路板上的连接部件实现电连接，以形成通信、WiFi、GPS等天线回路。其中，电路板上的连接部件可以为金属弹片(例如为镀金弹片)，通过弹片与馈电点直接接触，实现连接部件与馈电点的导通。
需要说明的是，为使金属壳体10作为天线结构的一部分参与信号辐射，需在金属壳体10内部制作出用于辐射信号的结构，其中，可采用CNC工艺在金属壳体10内部制作出用于辐射信号的结构。
相对不在馈电点区域103形成天线桥接201，由于在长期使用过程中，金属壳体10上馈电点区域103与金属弹片振动摩擦，会导致金属壳体10上馈电点区域103氧化、磨损而使接触电阻增大，从而导致天线回路电连接性能降低，天线信号的稳定性下降，因而，本申请在馈电点区域103形成天线桥接201，可改善此问题。
如图9b所示，当遮蔽层301除露出馈电点区域103外，还露出天线走线区域104时，通过喷涂工艺，可形成如图10b所示的天线桥接201和天线走线202，即，在此情况下，金属层包括天线桥接201和天线走线202。
即，部分天线回路中采用金属壳体10进行信号辐射，部分天线回路中采用天线走线202进行信号辐射。
其中，天线走线202形成在金属壳体10的非金属天线隔断区，即塑胶条102上。
相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线202，使天线走线202用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。
如图9c所示，当遮蔽层301仅露出天线走线区域104时,通过喷涂工艺，可形成如图10c所示的天线走线202，即，在此情况下，金属层仅包括天线走线202。
相对采用在PCB上设置走线实现，或者采用FPC实现信号辐射，当金属层包括天线走线202，使天线走线202用于信号辐射时，可节省出相应的PCB、FPC所占据的空间，为制作超薄电子设备提供了可能。相对采用CNC工艺在金属壳体10内部制作出用于辐射信号的结构，天线走线202的设置方式，可降低由于 采用CNC工艺制作该结构的成本。
在上述基础上，由于磷青铜具有更高的耐蚀性、耐氧化、耐磨损、抗疲劳性，因此，可采用磷青铜作为金属层的材料。
S23、采用超声水洗工艺去除遮蔽层301。
超声波水洗是将超声振动加到水溶液中，使液体产生“空化效应”。当超声波稀疏时生成气泡，挤压时压碎气泡，在周围产生机械冲击力，用以清除遮蔽层。
采用超声水洗去除遮蔽层，可不会对金属壳体10造成影响。
在此基础上，由于金属壳体10的外观面一般都需进行阳极氧化，以具有保护作用，且还可进行染色获得装饰效果，而在对金属壳体10外观面进行阳极氧化时，也可能同时对金属壳体10内表面的金属部分进行阳极氧化，因此，如图11所示，在S21之后，S22之前，该制备方法还包括：S24、采用镭雕工艺去除遮蔽层301所露出的金属壳体10内表面的氧化层。以保证金属层与其所覆盖的金属壳体10的金属部分电连接。
具体的，可采用光纤镭雕机去除遮蔽层301所露出的金属壳体10内表面的氧化层。
实施例二，提供一种金属外壳的制备方法，如图12所示，包括：
S30、采用覆膜工艺形成覆盖金属壳体内表面的遮蔽薄膜30。
即，将遮蔽薄膜30贴附于金属壳体10内表面。
S31、采用镭雕工艺去除待形成金属层区域的遮蔽薄膜30，形成遮蔽层301。
具体的，遮蔽层301所露出的区域可参考图9a～图9c。
其中，可采用CO2激光镭雕机去除待形成金属层区域的遮蔽薄膜30，形成遮蔽层301。
S32、采用喷涂工艺喷涂耐磨耐氧化型金属材料，在遮蔽层301所露出的金属壳体10内表面的区域，形成紧密附着于金属壳体10内表面上的金属层。
具体的，金属层可参考图10a～图10c及相关描述。
由于磷青铜具有更高的耐蚀性、耐氧化、耐磨损、抗疲劳性，因此，可采用磷青铜作为金属层的材料。
S33、撕除遮蔽层301。
由于金属壳体10的外观面一般都需进行阳极氧化，以具有保护作用，且还可进行染色获得装饰效果，而在对金属壳体10外观面进行阳极氧化时，也可能同时对金属壳体10内表面的金属部分进行阳极氧化，因此，如图13所示，在S31之后，S32之前，该制备方法还包括：S34、采用镭雕工艺去除遮蔽层301所露出的金属壳体10内表面的氧化层。以保证金属层与其所覆盖的金属壳体10的金属部分电连接。
具体的，可采用光纤镭雕机去除遮蔽层301所露出的金属壳体10内表面的氧化层。

Claims (15)

  1. 一种金属外壳，其特征在于，包括金属壳体，还包括喷涂于所述金属壳体内表面上的金属层，所述金属层为天线结构的一部分；
    所述金属层紧密附着于所述金属壳体的内表面上，且所述金属层的材料为耐磨耐氧化型材料。
  2. 根据权利要求1所述的金属外壳，其特征在于，所述金属壳体包括馈电点区域；
    所述金属层包括天线桥接，所述天线桥接位于所述馈电点区域且覆盖所述馈电点区域。
  3. 根据权利要求1或2所述的金属外壳，其特征在于，所述金属层包括天线走线。
  4. 根据权利要求1-3任一项所述的金属外壳，其特征在于，所述金属层的材料包括磷青铜。
  5. 一种电子设备，其特征在于，包括权利要求1-4任一项所述的金属外壳。
  6. 一种金属外壳的制备方法，其特征在于，包括：
    在金属壳体的内表面形成遮蔽层，所述遮蔽层露出部分区域；
    采用喷涂工艺喷涂耐磨耐氧化型金属材料，在所述遮蔽层所露出的所述金属壳体内表面的区域，形成紧密附着于所述金属壳体内表面上的金属层；所述金属层为天线结构的一部分；
    去除所述遮蔽层。
  7. 根据权利要求6所述的制备方法，其特征在于，所述金属壳体包括馈电点区域；
    所述金属层包括天线桥接，所述天线桥接位于所述馈电点区域且覆盖所述馈电点区域。
  8. 根据权利要求6或7所述的制备方法，其特征在于，所述金属层包括天线走线。
  9. 根据权利要求6-8任一项所述的制备方法，其特征在于，采用喷涂工艺喷涂金属材料，在所述遮蔽层所露出的所述金属壳体内表面的区域，形成紧密附着于所述金属壳体内表面上的金属层，包括：
    将磷青铜材料熔化喷射到所述金属壳体内表面上，在所述遮蔽层所露出的所述金属壳体内表面的区域，形成紧密附着于所述金属壳体内表面上的金属层。
  10. 根据权利要求6-9任一项所述的制备方法，其特征在于，在金属壳体的内表面形成遮蔽层，包括：
    采用喷涂工艺形成覆盖所述金属壳体内表面的遮蔽薄膜；
    采用镭雕工艺去除待形成所述金属层区域的所述遮蔽薄膜，形成所述遮蔽层。
  11. 根据权利要求6-9任一项所述的制备方法，其特征在于，在金属壳体 的内表面形成遮蔽层，包括：
    采用覆膜工艺形成覆盖所述金属壳体内表面的遮蔽薄膜；
    采用镭雕工艺去除待形成所述金属层区域的所述遮蔽薄膜，形成所述遮蔽层。
  12. 根据权利要求10或11所述的制备方法，其特征在于，所述金属壳体的内表经过阳极化处理；
    在采用镭雕工艺去除待形成所述金属层区域的所述遮蔽薄膜，形成所述遮蔽层之后，采用喷涂工艺形成所述金属层之前，所述方法还包括：
    采用镭雕工艺去除所述遮蔽层所露出的所述金属壳体内表面的氧化层。
  13. 根据权利要求10所述的制备方法，其特征在于，去除所述遮蔽层，包括：
    采用超声水洗工艺去除所述遮蔽层。
  14. 根据权利要求11所述的制备方法，其特征在于，去除所述遮蔽层，包括：
    撕除所述遮蔽层。
  15. 根据权利要求6所述的制备方法，其特征在于，所述遮蔽层的材料包括油漆、油墨中的至少一种。
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CN109465169A (zh) * 2018-12-28 2019-03-15 深圳市金中瑞通讯技术有限公司 一种防静电涂层的喷涂方法
CN109628873A (zh) * 2018-12-28 2019-04-16 深圳市金中瑞通讯技术有限公司 一种馈电点的喷涂方法
CN110581344B (zh) * 2019-08-16 2021-06-29 华为技术有限公司 移动终端的壳体、移动终端和壳体的制备方法
CN111786076A (zh) * 2020-07-07 2020-10-16 深圳市杰瑞表面技术有限公司 天线盖板及通信设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101466214A (zh) * 2007-12-20 2009-06-24 神基科技股份有限公司 电子装置的壳体结构
CN201282185Y (zh) * 2008-09-19 2009-07-29 耀登科技股份有限公司 集成电路封装天线
US20090278757A1 (en) * 2008-05-06 2009-11-12 Samsung Electronics Co. Ltd. Mobile terminal having metal case and antenna structure
CN103079366A (zh) * 2011-10-25 2013-05-01 青岛长弓塑模有限公司 以喷涂及激光雕刻制造具电路的机壳的方法
CN105071023A (zh) * 2015-08-12 2015-11-18 宇龙计算机通信科技(深圳)有限公司 手机天线

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101257140A (zh) * 2007-03-02 2008-09-03 耀登科技股份有限公司 通过激光雕刻制造天线模组的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101466214A (zh) * 2007-12-20 2009-06-24 神基科技股份有限公司 电子装置的壳体结构
US20090278757A1 (en) * 2008-05-06 2009-11-12 Samsung Electronics Co. Ltd. Mobile terminal having metal case and antenna structure
CN201282185Y (zh) * 2008-09-19 2009-07-29 耀登科技股份有限公司 集成电路封装天线
CN103079366A (zh) * 2011-10-25 2013-05-01 青岛长弓塑模有限公司 以喷涂及激光雕刻制造具电路的机壳的方法
CN105071023A (zh) * 2015-08-12 2015-11-18 宇龙计算机通信科技(深圳)有限公司 手机天线

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