WO2018199084A1 - Substrat de câblage et son procédé de fabrication - Google Patents

Substrat de câblage et son procédé de fabrication Download PDF

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Publication number
WO2018199084A1
WO2018199084A1 PCT/JP2018/016589 JP2018016589W WO2018199084A1 WO 2018199084 A1 WO2018199084 A1 WO 2018199084A1 JP 2018016589 W JP2018016589 W JP 2018016589W WO 2018199084 A1 WO2018199084 A1 WO 2018199084A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
metal foil
stretchable
insulating layer
conductive
Prior art date
Application number
PCT/JP2018/016589
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English (en)
Japanese (ja)
Inventor
裕之 関本
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018199084A1 publication Critical patent/WO2018199084A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a wiring board and a manufacturing method thereof.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2016-143763
  • a stretchable base material is prepared, a stretchable wiring having a desired pattern is formed on the stretchable base material, and an electronic component is mounted on the stretchable base material. It is written to do so.
  • a silicone rubber sheet is cited as an example of a stretchable substrate. Since the stretchable base material is rubbery at normal temperature, it is generally easily deformed. In addition, since the stretchable base material is a rubber-like member, it shrinks greatly when heated compared to a normal printed wiring board or the like. Therefore, a dimensional change or the like is likely to occur during each process of the manufacturing method, and it is difficult to suppress undesired deformation during manufacturing.
  • an object of the present invention is to provide a wiring board that can suppress undesired deformation during manufacturing, and a method for manufacturing the wiring board, although the wiring board has elasticity.
  • a wiring board comprises an insulating layer that is a laminate of two or more layers using a stretchable insulating material as a main material and a stretchable conductive material as a main material, and the insulation in the laminate.
  • a conductive layer disposed at a boundary between the layers, and at least one disposed so as to cover at least a part of a main surface located on the outermost side of the stacked body and facing a direction parallel to the stacking direction of the stacked body A metal foil pattern.
  • the manufacturing method of the wiring board in Embodiment 2 based on this invention it is the 1st explanatory drawing of the process performed when screen printing is employ
  • Wiring substrate 101 in the present embodiment includes insulating layers 2a and 2b forming laminate 1 with two or more layers of a stretchable insulating material as a main material, and insulating layers in laminate 1 using a stretchable conductive material as a main material.
  • the wiring board in the present embodiment includes the laminate 1 having elasticity by using a stretchable insulating material as a main material, and the conductive layer 7 disposed on the surface of the insulating layer also has elasticity, as a whole A wiring board having elasticity can be obtained.
  • the metal foil pattern 4 is provided on the main surface 1u of the laminate 1 while having elasticity as described above, the metal foil that is the source of the metal foil pattern 4 can be used as a support plate during manufacturing. . That is, since it can be manufactured by a manufacturing method as will be described later, undesired deformation during manufacturing can be suppressed. As described above, according to the present embodiment, it is possible to provide a wiring board that can suppress undesired deformation during manufacturing, although it is a wiring board having elasticity.
  • the metal foil pattern 4 provided on the surface of the wiring board can be used as a land on which components can be mounted. Since the connection with other substrates and components can be made through the metal foil pattern 4, it is possible to make a reliable connection as compared with the case where the connection is made through the pattern formed of the stretchable conductive material. it can.
  • the stretchable conductive material except the conductive component has the same main composition as the stretchable insulating material.
  • the method for manufacturing a wiring board in the present embodiment is a manufacturing method for obtaining the wiring board described in the first embodiment.
  • FIG. 2 shows a flowchart of a method for manufacturing a wiring board in the present embodiment.
  • the first surface of the metal foil is stretched by applying a stretchable insulating material paste to the main surface of the metal foil and drying the paste.
  • It includes a step S3 of forming a stretchable second insulating layer by applying and drying a paste of an insulating material, and a step S4 of forming a metal foil pattern by patterning the metal foil.
  • a metal foil 14 is prepared.
  • the metal foil 14 is rigid to such an extent that it can support its posture even if it is not supported by other objects.
  • the metal foil 14 may have a recognition hole 15.
  • the metal foil 14 is a copper foil, for example.
  • the metal foil 14 is a copper foil produced by, for example, electrolytic plating.
  • the thickness of the metal foil 14 is, for example, not less than 6 ⁇ m and not more than 70 ⁇ m. More preferably, the thickness of the metal foil 14 is 12 ⁇ m or more and 18 ⁇ m or less.
  • the surface of the copper foil preferably has a surface roughness Rz of 0.5 ⁇ m or more and 2.5 ⁇ m or less.
  • a paste 12 of a stretchable insulating material is applied to one surface of the metal foil 14 as shown in FIG.
  • the stretchable insulating material is preferably one that does not break even when stretched by 50%. In particular, those that do not break even when stretched by 500% or more are preferable.
  • the stretchable insulating material is preferably rubber or resin.
  • the stretchable insulating material is preferably classified as an elastomer among rubber or resin.
  • Examples of rubbers or resins classified as elastomers include NBR (nitrile rubber), CR (chloroprene rubber), EPDM (ethylene propylene rubber), Si (silicone rubber), IIR (butyl rubber), SBR (styrene rubber), U ( Urethane rubber), CSM (hypalon), FKM (fluoro rubber), epoxy resin, and the like are applicable.
  • an insulating layer 2a as a first insulating layer is formed as shown in FIG.
  • a hot air oven may be used for drying.
  • Via holes 9 are formed in the insulating layer 2a by laser processing.
  • FIG. 5 shows a state after the via hole 9 is formed.
  • the method of forming the via hole 9 is not limited to laser processing.
  • printing may be used instead of laser processing.
  • the printing here is, for example, screen printing.
  • the metal foil 14 is placed on the printing stage 20, and the screen plate 21 is placed on the upper side of the metal foil 14.
  • the screen plate 21 has an opening 22.
  • the paste 12 is placed on the upper side of the screen plate 22 and is rubbed with a squeegee 23.
  • the paste 12 passes through the opening 22 and adheres to the upper surface of the metal foil 14.
  • FIG. 8 when the screen plate 21 is removed, the paste 12 is placed on the upper surface of the metal foil 14.
  • the via hole 9 can be formed at a desired position by screen printing. If very high accuracy is not required for the via hole 9, the via hole 9 may be formed by screen printing in this way.
  • a conductive layer 7 having stretchability is formed by printing a paste of a stretchable conductive material on the surface of the insulating layer 2a as the first insulating layer.
  • the stretchable conductive material only needs to be a stretchable conductor.
  • a conductive polymer material typified by polyacetylene, poly (p-phenylene), poly (p-phenylene vinylene), polypyrrole, polythiophene, PEDOT, polyaniline, polyacene, graphene, or the like may be used. .
  • a material obtained by kneading a one-dimensional conductor represented by Ag nanowire, carbon nanotube, or the like to the above-described stretchable insulating material may be used as the stretchable conductive material.
  • the metal filler for example, a spherical or flaky material can be used.
  • the material of the metal filler may be, for example, any of Ag, Cu, Au, Ni, Zn, Sn, Al, or an alloy thereof.
  • a material of the metal filler a material having high conductivity is preferable.
  • the volume resistivity of the metal filler is preferably 10 ⁇ 5 ⁇ cm or less.
  • the conductive layer 7 In order to dry the conductive layer 7, for example, it is heated at 170 ° C. for 5 minutes in a hot air oven.
  • the formation of the insulating layer by printing the stretchable insulating material paste and the formation of the conductive layer by printing the stretchable conductive material paste are alternately repeated as many times as necessary. By repeating many times, a laminate having a large number of layers can be manufactured. In this embodiment mode, only one conductive layer 7 is provided, but a plurality of conductive layers 7 may be formed.
  • the paste 12 of a stretchable insulating material is apply
  • an insulating layer 2b as a second insulating layer having elasticity is formed as shown in FIG.
  • the paste 12 is dried by heating at 170 ° C. for 5 minutes using, for example, a hot air oven.
  • the cover film 3 is affixed on the upper side of the insulating layer 2b.
  • the cover film 3 may be a PET film, for example.
  • the cover film 3 is preferably any heat resistant film.
  • the metal foil pattern 4 is formed by patterning the metal foil 14.
  • the wiring board 101 shown in FIG. 1 is obtained.
  • a photolithography technique can be used for the patterning of the metal foil 14. That is, for example, a photosensitive resin layer is formed on the surface of the metal foil 14, a desired mask pattern is formed by exposure, and the metal foil 14 is etched using ferric chloride. Thus, a desired metal foil pattern 4 can be formed.
  • the paste 12 or the conductive layer 7 may be printed by inkjet printing.
  • UV curing by irradiation with ultraviolet light may be used.
  • curing by electron beam irradiation may be used.
  • the metal foil 14 having sufficient rigidity is first prepared and each layer is formed on the surface of the metal foil 14, undesired deformation at the time of manufacture can be suppressed. That is, the wiring board can be manufactured while using the metal foil 14 as a support to stabilize the overall posture.
  • the metal foil 14 eventually becomes a part of the wiring board 101 as the metal foil pattern 4.
  • the metal foil pattern 4 can be used as a wiring or an electrode of the wiring board 101. In the present embodiment, a part of the metal foil 14 can be effectively used as described above.
  • each step of the manufacturing method may be performed in the state of an aggregate substrate as shown in FIG.
  • the collective substrate here is one large-sized substrate including portions corresponding to a plurality of products.
  • a plurality of products can be efficiently manufactured collectively.
  • a plurality of individual products can be obtained from the aggregate substrate.
  • a plurality of openings 43 are arranged in a matrix while being surrounded by an outer frame 41, and the products 42 are arranged in an island shape inside each opening 43.
  • the product 42 corresponds to one wiring board.
  • the laminate 1 and the cover film 3 extend in a state of overlapping.
  • the metal foil pattern 4 is formed inside the product 42.
  • the recognition holes 15 are provided at both left and right ends. However, in the collective board, the recognition holes 15 are not provided in one product 42, but the outer frame 41. It is good also as providing in.
  • the wiring board 101 has the cover film 3 on the lower surface.
  • the cover film 3 protects the lower surface of the wiring board 101 and handles the posture of the wiring board 101 during handling, transportation, and storage, for example.
  • the main purpose is to maintain.
  • the cover film 3 may be removed when the wiring substrate 101 is actually used.
  • the cover film 3 may be peeled off and used as the wiring board 101a.
  • the cover film 3 can be peeled off.
  • the wiring board 101a after the cover film 3 is removed may be used alone as it is, or may be used by being attached to the surface of an arbitrary object, for example.
  • the step of attaching carrier film As shown in the second embodiment, before the step S4 of forming the metal foil pattern, the step of attaching the carrier film to the main surface opposite to the metal foil 14 and forming the metal foil pattern S4 after this, the wiring board is preferably supported by the carrier film.
  • the carrier film is, for example, the cover film 3.
  • the metal foil 14 has a first surface and a second surface having a surface roughness larger than that of the first surface, and the main surface of the metal foil 14 on the side where the insulating layer 2a as the first insulating layer is formed.
  • the surface is preferably the second surface.
  • a material obtained by removing the conductive component from the stretchable conductive material preferably has the same composition as the stretchable insulating material.
  • the first and second embodiments have been described based on an example in which the stacked body 1 has a two-layer structure including the insulating layers 2a and 2b. Actually, the stacked body 1 may have a structure including a larger number of insulating layers. With reference to FIG. 15, description will be given of wiring board 102 according to the third embodiment of the present invention.
  • the laminate 1 has a four-layer structure including insulating layers 2a, 2b, 2c, and 2d.
  • the laminated body 1 may have a three-layer structure or a structure having five or more layers.
  • the conductive layer 7 is distributed and arranged at two or more positions in the stacking direction 94 determined by the boundary between the insulating layers in the stacked body 1.
  • the number of layers of the stacked body 1 is large, and the conductive layer 7 is distributed and arranged at two or more positions in the stacking direction 94, so that the degree of freedom in design is increased.
  • the interlayer connection conductor 11 that electrically connects the conductive layers 7 at different positions in the stacking direction 94 through the insulating layer.
  • an electrical path can be set across different layers.
  • the interlayer connection conductor 11 is preferably made of the same material as the conductive layer 7. In this way, if the same material is used, the physical properties can be made substantially the same between the conductive layer 7 and the interlayer connection conductor 11, so that the reliability of connection between the two can be improved.
  • FIGS. 16 to 18 A plan view of the wiring substrate 103 in this embodiment is shown in FIG. 16, and a side view thereof is shown in FIG.
  • the wiring board 103 is basically the same as the wiring board 101 described in the first embodiment, but differs in the following points from the wiring board 101.
  • at least one metal foil pattern or a protective pattern 30 as a plate-like rigid body is disposed on the main surface of the laminate 1, thereby forming a non-extension part.
  • non-extendable portion refers to a portion where the elongation is significantly smaller than other portions even when a tensile force is applied.
  • the protective pattern 30 is disposed on the lowermost surface of the multilayer body 1.
  • the protective pattern 30 may be a kind of the metal foil pattern 4 formed by patterning the metal foil 14. In this case, for example, one protective pattern 30 may be one metal foil pattern 3. Alternatively, the protective pattern 30 may be some plate-like rigid body attached later.
  • the protective pattern 30 may be a conductor or an insulator.
  • the protective pattern 30 may be a metal foil pattern that does not play the role of wiring.
  • FIG. 18 shows a state where a tensile force is applied to the wiring board 103.
  • the laminated body 1 is extended.
  • the part where the protective pattern 30 overlaps the laminated body 1 it becomes a non-extension part by suppressing extension.
  • the protective pattern 30 is formed of an insulator, the degree of freedom in design increases. Since it can avoid that the protective pattern 30 causes the short circuit defect between wiring, it is preferable. As shown in this embodiment, if a region in which deformation is suppressed even when stretched is formed and a desired wiring pattern is arranged so as to overlap this region, the resistance that tends to be caused by deformation in this wiring pattern It is possible to prevent a change in value, and it is also possible to prevent disconnection that may occur in the wiring pattern due to deformation. As described above, the region in which the deformation is suppressed even when the metal foil pattern or the plate-like rigid body is arranged can be used as a region for protecting the wiring pattern.
  • FIG. 19 A plan view of the wiring board 104 in this embodiment is shown in FIG. 19, and a cross-sectional view is shown in FIG. FIG. 21 shows an enlarged part of FIG.
  • the wiring board 104 has the same basic configuration as the wiring board 101 described in the first embodiment, but differs in the following points from the wiring board 101.
  • the conductive layer 7 and the metal foil pattern 4 are connected by a connection conductor 6 that penetrates and electrically connects the insulating layer 2 a, and the connection conductor 6 connects the outer edge 4 e of the metal foil pattern 4. It is connected to the metal foil pattern 4 at a portion that is avoided.
  • connection conductor 6 is connected to the metal foil pattern 4 at a site that is recessed inward by a distance A from the outer edge 4 e of the metal foil pattern 4.
  • the portion 25 of the insulating layer 2 a extends between the metal foil pattern 4 and the conductive layer 7 beyond the outer edge 4 e of the metal foil pattern 4.
  • FIG. 22 shows a part of the wiring board 104 when a tensile force 92 is applied to the wiring board 104.
  • FIG. 22 shows the same part as shown in FIG.
  • the connection conductor 6 is preferably formed of a stretchable conductive material like the conductive layer 7.
  • the metal foil pattern 4 is a rigid body and acts as a non-extension part when a tensile force acts on the wiring board 104.
  • the metal foil pattern 4 hardly extends, but the conductive layer 7 is formed of a stretchable conductive material, and thus greatly extends.
  • an interface having a greatly different degree of elongation occurs at any location between the elongated portion and the non-extended portion, and stress is concentrated.
  • due to the concentration of stress there is a possibility that the connection portion is broken and the electrical connection is broken.
  • connection conductor 6 is connected to the metal foil pattern 4 at a portion that is recessed inward by the distance A from the outer edge 4e of the metal foil pattern 4, the outer edge 4e of the metal pattern 4 itself. Then, stress concentration hardly occurs.
  • connection conductor 6 when a tensile force is applied, the connection conductor 6 is deformed.
  • the connection conductor 6 if the connection conductor 6 is made of a stretchable conductive material, the connection conductor 6 can be greatly elastically deformed. Even if a positional shift occurs between the metal pattern 4 and the conductive layer 7, it is possible to avoid breaking as much as possible by deforming the connection conductor 6.
  • FIG. 23 shows a wiring board 104i.
  • the wiring board 104i has the same structure as the wiring board 104, but the metal foil pattern 4 is divided into two.
  • the electronic component 10 is mounted on the wiring board 104i using the two metal foil patterns 4 as lands.
  • the metal foil pattern 4 is in a non-extension part.
  • the connection conductor 6 is connected to the metal foil pattern 4 at a portion where the outer edge 4e of the metal foil pattern 4 is avoided, the stress concentration is reduced, and as a result, the bonded portion Can be avoided as much as possible.
  • the wiring board 105 includes the insulating layer 2a as the only insulating layer.
  • the wiring substrate 105 has a stretchable insulating material as a main material, an insulating layer 2a having one and the other main surfaces, and a conductive material that has a stretchable conductive material as a main material and is disposed on the one main surface of the insulating layer 2a.
  • the same effect as in the first embodiment can be obtained without stacking the insulating layer 2a.
  • the metal foil pattern 4 can be used as a wiring or an electrode of the wiring board 105. In this embodiment mode, since the insulating layer is not a stacked body, the whole can be thinned.
  • the wiring board 106 includes only one layer of the insulating layer 2a as an insulating layer.
  • the wiring board 107 may be attached to the step of the member 34.
  • the wiring board 107 includes an insulating layer having a single-layer structure or a stacked structure using a stretchable insulating material as a main material, and a conductive layer disposed on at least one surface of the insulating layer using a stretchable conductive material as a main material. Therefore, it is flexible and rich in elasticity as a whole. Accordingly, the wiring substrate 107 can be attached to such a step along the shape of the step.
  • a member having a simple step is exemplified as the member 34, but the member 34 may have a more complicated three-dimensional shape.
  • Member 34 may be part of some device, for example.
  • a card-shaped wiring board 108 is also conceivable.
  • the wiring board 108 can be bent flexibly as shown in FIG.
  • the wiring board 108 includes two land electrodes and one coil-like portion, which is schematically shown as an example only, and the position, size, number, and the like of the metal foil pattern to be formed are Not exclusively.
  • the wiring board 109 includes a wristband 120 and a sensor 110.
  • the wiring board 109 is attached to the human hand 35.
  • a control unit 130 is disposed on the wristband 120.
  • the sensor 110 is disposed near the tip of the finger 36.
  • the finger 36 is extended substantially straight, but the finger 36 may be bent as shown in FIG. Even when the finger 36 is bent in this way, the wiring board 109 can follow flexibly without being damaged.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un substrat de câblage (101) comprenant : deux couches d'isolation (2a, 2b), ou plus, comprenant un matériau isolant expansible en tant que matériau principal et formant un corps stratifié (1) ; une couche électroconductrice (7) comprenant un matériau électroconducteur expansible en tant que matériau principal et disposée au niveau d'une limite entre les couches d'isolation dans le corps stratifié (1) ; et au moins un motif de feuille métallique (4) qui est positionné sur le côté le plus externe du corps stratifié (1) et qui est disposé de manière à recouvrir au moins une partie d'une surface principale (1u) orientée dans une direction parallèle à une direction de stratification du corps stratifié (1).
PCT/JP2018/016589 2017-04-28 2018-04-24 Substrat de câblage et son procédé de fabrication WO2018199084A1 (fr)

Applications Claiming Priority (2)

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JP2017-090379 2017-04-28
JP2017090379 2017-04-28

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WO2018199084A1 true WO2018199084A1 (fr) 2018-11-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020213681A1 (fr) * 2019-04-18 2020-10-22 パナソニックＩｐマネジメント株式会社 Stratifié étirable, matériau pour dispositif étirable, et dispositif étirable

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013187380A (ja) * 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
WO2015186589A1 (fr) * 2014-06-03 2015-12-10 三井金属鉱業株式会社 Feuille métallique pourvue de couche de résine antiadhésive, et carte de câblage imprimée
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
JP2016219782A (ja) * 2015-05-25 2016-12-22 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013187380A (ja) * 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
WO2015186589A1 (fr) * 2014-06-03 2015-12-10 三井金属鉱業株式会社 Feuille métallique pourvue de couche de résine antiadhésive, et carte de câblage imprimée
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
JP2016219782A (ja) * 2015-05-25 2016-12-22 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020213681A1 (fr) * 2019-04-18 2020-10-22 パナソニックＩｐマネジメント株式会社 Stratifié étirable, matériau pour dispositif étirable, et dispositif étirable
US11864310B2 (en) 2019-04-18 2024-01-02 Panasonic Intellectual Property Management Co., Ltd. Stretchable laminate, material for stretchable device, and stretchable device

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