WO2018196679A1 - 半导体制冷模组及制冷设备 - Google Patents

半导体制冷模组及制冷设备 Download PDF

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Publication number
WO2018196679A1
WO2018196679A1 PCT/CN2018/083811 CN2018083811W WO2018196679A1 WO 2018196679 A1 WO2018196679 A1 WO 2018196679A1 CN 2018083811 W CN2018083811 W CN 2018083811W WO 2018196679 A1 WO2018196679 A1 WO 2018196679A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
semiconductor refrigeration
heat insulating
insulating bracket
conducting seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/083811
Other languages
English (en)
French (fr)
Inventor
王定远
裴玉哲
卞伟
刘杰
王晔
张立臣
赵建芳
胡成
李新远
孟令博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Special Refrigerator Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Original Assignee
Qingdao Haier Special Refrigerator Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Special Refrigerator Co Ltd, Qingdao Haier Smart Technology R&D Co Ltd filed Critical Qingdao Haier Special Refrigerator Co Ltd
Publication of WO2018196679A1 publication Critical patent/WO2018196679A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042—Air treating means within refrigerated spaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14—Collecting or removing condensed and defrost water; Drip trays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D25/00—Charging, supporting, and discharging the articles to be cooled
    • F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
    • F25D25/024—Slidable shelves
    • F25D25/025—Drawers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/002—Liquid coolers, e.g. beverage cooler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04—Treating air flowing to refrigeration compartments
    • F25D2317/041—Treating air flowing to refrigeration compartments by purification
    • F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04—Treating air flowing to refrigeration compartments
    • F25D2317/041—Treating air flowing to refrigeration compartments by purification
    • F25D2317/0413—Treating air flowing to refrigeration compartments by purification by humidification

Definitions

  • the present invention relates to a refrigeration device, and more particularly to a semiconductor refrigeration module and a refrigeration device.
  • Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration device that uses a cold amount generated by a semiconductor refrigeration chip to achieve refrigeration.
  • the semiconductor refrigerating chip includes a cold end for releasing cold and a hot end for releasing heat.
  • the cold end of the semiconductor refrigerating chip releases the cooling amount into the refrigerating compartment of the refrigerating device through the cold end radiator, and the semiconductor refrigerating unit
  • the hot end of the chip needs to dissipate heat to the outside through the hot end heat sink.
  • the cold end and the hot end of the semiconductor refrigerating chip are disposed opposite each other, the cold end heat sink and the hot end heat sink are adjacent to each other, and the cold end heat sink and the hot end heat sink are prone to heat exchange.
  • the loss of cooling capacity results in lower cooling efficiency and increased energy consumption of the refrigeration equipment.
  • the present invention provides a semiconductor refrigeration module and a refrigeration device, which can reduce the amount of cooling loss of a semiconductor refrigeration module, thereby improving the refrigeration efficiency of the refrigeration device and reducing energy consumption.
  • a semiconductor refrigeration module includes a semiconductor refrigeration chip and a heat pipe, the semiconductor refrigeration chip including a cold end surface that releases a cold amount and a heat end surface that releases heat, and further includes an assembly module, wherein the assembly module includes a first heat insulation a bracket, a second heat insulating bracket, a hot end heat conducting seat and a cold end heat conducting seat, wherein the first heat insulating bracket is fixed on the second heat insulating bracket, the first heat insulating bracket and the second heat insulating Forming a mounting cavity between the brackets, the first heat insulating bracket is provided with a mounting hole that communicates with the mounting cavity, the semiconductor cooling chip is located in the mounting hole, and the cold end heat conducting seat is disposed in the Installed in the cavity and with the The cold end contact of the semiconductor refrigeration chip is disposed on the first heat insulating bracket and is in contact with the hot end surface of the semiconductor refrigeration chip, and the heat pipe is connected to the cold end heat conducting seat.
  • the assembly module includes a first heat insulation a bracket, a
  • the outer surface of the first heat insulating bracket is provided with a heat insulating groove around the mounting hole, and the heat insulating groove is provided with heat insulating cotton; the hot end surface of the semiconductor refrigeration chip is convex outward Out of the outer surface of the first insulated support.
  • the outer surface of the first heat insulating bracket is further provided with a wiring groove, and the wiring groove is in communication with the mounting hole.
  • the cold-end heat-conducting seat is provided with a avoidance notch
  • the first heat-insulating bracket, the second heat-insulating bracket and the hot-end heat-conducting seat are respectively provided with through holes, and the bolts are pierced In the corresponding through hole, the bolt passes through a region formed by the avoidance notch.
  • the cold-end heat conducting seat comprises a first heat conducting plate and a second heat conducting plate connected together, and the heat pipe is sandwiched between the first heat conducting plate and the second heat conducting plate.
  • the inner surface of the first heat conducting plate is provided with a first mounting groove disposed laterally
  • the inner surface of the second heat conducting plate is provided with a second mounting groove disposed longitudinally
  • the heat pipe is divided into a lateral flat heat pipe and a longitudinal flat heat pipe
  • the horizontal flat heat pipe is disposed in the first installation groove
  • the longitudinal flat heat pipe is disposed in the second installation groove
  • the flat heat pipes are in contact with each other.
  • an inner surface of the first heat insulating bracket is provided with a first pipe groove for mounting the heat pipe, and an edge of the second heat insulating bracket is provided with a gap or a through hole for the heat pipe to pass through Hole or second tube slot
  • an outer surface of the first heat insulating bracket is disposed with a plurality of positioning baffles around the outer side of the mounting hole, and the hot end heat conducting seat is disposed between the plurality of positioning baffles.
  • the semiconductor refrigeration module includes a plurality of the semiconductor refrigeration chips, and the assembly module is configured with the hot end heat conduction seat and the cold end heat conduction seat corresponding to the semiconductor refrigeration chip, and
  • the first heat insulating bracket is provided with the mounting hole corresponding to the semiconductor cooling chip.
  • the present invention also provides a refrigeration apparatus including a liner, and further comprising the above semiconductor refrigeration module; the heat pipe of the semiconductor refrigeration module is attached to a surface of the inner tank.
  • the advantages and positive effects of the present invention are: installing a cold-end heat-conducting seat by using a mounting cavity formed between two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat
  • the effective insulation interval of the heat-insulating bracket can greatly reduce the amount of heat exchange between the cold-end heat-conducting seat and the hot-end heat-conducting seat, effectively reduce the loss of cooling capacity, and improve the cooling efficiency and energy of the refrigeration equipment. Consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, and ensures the good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat to ensure the heat conduction between the hot end surface and the hot end of the semiconductor refrigeration chip. Good contact, ensuring rapid heat dissipation and improved reliability.
  • FIG. 1 is a schematic structural view of an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 2 is a front structural view of a first heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 3 is a schematic view showing the reverse structure of a first heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 4 is a front structural view of a second heat insulating bracket of an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 5 is a schematic diagram showing the reverse structure of a second heat insulating bracket in an embodiment of a semiconductor refrigeration module according to the present invention
  • FIG. 6 is a schematic structural view of a first heat conducting plate in an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 7 is a schematic structural view of a second heat conducting plate in an embodiment of a semiconductor refrigeration module according to the present invention.
  • FIG. 8 is an exploded view of an embodiment of a semiconductor refrigeration module of the present invention.
  • FIG. 9 is a reference diagram of a use state of an embodiment of a semiconductor refrigeration module according to the present invention.
  • the semiconductor refrigeration module of the present embodiment includes a semiconductor refrigerating chip 1 and a heat pipe 2, and the semiconductor refrigerating chip 1 includes a cold end surface that releases a cooling amount and a hot end surface that releases heat.
  • the module 3 includes a first heat insulating bracket 31, a second heat insulating bracket 32, a hot end heat conducting seat 33 and a cold end heat conducting seat 34, and the first heat insulating bracket 31 is fixed to the second partition.
  • the first cavity 311 and the second groove 321 are formed in the mounting cavity having the temperature isolation function between the first heat insulating bracket 31 and the second heat insulating bracket 32.
  • the semiconductor refrigerating chip 1 is located in the mounting hole 312, and the cold end heat conducting seat 34 is disposed in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigerating chip 1
  • the hot end heat conducting seat 33 is disposed on the first heat insulating bracket 31 and is in contact with the hot end surface of the semiconductor refrigerating chip 1, and the heat pipe 2 is connected to the cold end heat conducting seat 34.
  • the semiconductor refrigerating module of the present embodiment embeds the semiconductor refrigerating chip 1 in the mounting hole 312 of the first heat insulating bracket 31, and the periphery of the semiconductor refrigerating chip 1 is wrapped by the first heat insulating bracket 31.
  • the hot end heat conducting seat 33 and the cold end heat conducting seat 34 are spaced apart by the first heat insulating bracket 31, so that the heat transfer between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 can be effectively reduced, thereby reducing the cold.
  • the cold-end heat-conducting seat 34 is wrapped in a mounting cavity formed by the first heat-insulating bracket 31 and the second heat-insulating bracket 32, and the cold-end heat conduction.
  • the cooling capacity generated by the semiconductor cooling chip 1 conducted by the seat 34 can be quickly transmitted to the required area through the heat pipe 2, thereby reducing the amount of cold loss of the cold-end heat conducting seat 34, and more effectively reducing the energy consumption and improving the cooling efficiency.
  • the inner surface of the first heat insulating bracket 31 and/or the inner surface of the second heat insulating bracket 32 are provided with a groove, and the mounting cavity is formed by the groove, for example: the inner surface of the first heat insulating bracket 31
  • the first recess 311 is disposed with a mounting hole 312 extending through the first heat insulating bracket 31, and the inner surface of the second heat insulating bracket 32 is provided with a second recess.
  • the groove 321 defines a mounting cavity between the first groove 311 and the second groove 321 .
  • the outer surface of the first heat insulating bracket 31 is provided with a heat insulating groove 313 around the mounting hole 312, and the heat insulating groove 313 is provided with heat insulating cotton (not labeled);
  • the hot end face of 1 protrudes outwardly from the outer surface of the first heat insulating bracket 31.
  • the heat insulating groove 313 can be provided with heat insulating cotton on the periphery of the semiconductor refrigeration chip 1, so that the heat insulating ring formed by the heat insulating cotton further reduces the cold amount of the cold end surface of the semiconductor refrigeration chip 1 to be lost, and also The heat of the hot end face of the semiconductor refrigeration chip 1 can be reduced into the mounting cavity to minimize the loss of the cooling capacity; and the thermal end face of the semiconductor refrigerating chip 1 is slightly higher than the outer surface of the first heat insulating support 31, on the one hand, the semiconductor The hot end face of the refrigerating chip 1 and the hot end heat conducting seat 33 can be in good contact with heat transfer. On the other hand, the hot end face of the semiconductor refrigerating chip 1 is separated from the mounting hole.
  • the heat can be reduced from the mounting hole 312 into the mounting cavity, and the loss of the cooling capacity can be effectively reduced.
  • the outer surface of the first heat insulating bracket 31 is further provided with a wiring groove 314, and the wiring groove 314 is in communication with the mounting hole 312.
  • the semiconductor refrigeration module of the present embodiment includes a plurality of the semiconductor refrigeration chips 1 according to the cooling capacity of the refrigeration device, and the assembly module 3 is provided with the hot-end heat conduction seat 33 corresponding to the semiconductor refrigeration chip 1. And the cold end heat conducting seat 34, and the first heat insulating bracket 31 is provided with the mounting hole 312 corresponding to the semiconductor refrigeration chip 1.
  • the cold end heat conducting seat 34 is provided with a avoidance notch 340, the first heat insulating A through hole (not labeled) is disposed on the bracket 31, the second heat insulating bracket 32 and the hot end heat conducting seat 33, and the bolt 35 is disposed in the corresponding through hole, and the bolt 35 passes through the The area formed by the notch 340 is described. Specifically, in the assembly process, the hot end heat conducting seat 33, the first heat insulating bracket 31, the cold end heat conducting seat 34 and the second heat insulating bracket 32 are sequentially assembled and fixed by bolts 35, and the bolts 35 are passed through.
  • the notch 340 avoids the cold end heat conducting seat 34, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 by the bolts 35 can be avoided.
  • the inner surface of the first heat insulating bracket 31 is provided with a first pipe groove 316 and a first pipe groove 317 for mounting the heat pipe 2, and an edge of the second heat insulating bracket 32 is provided for the heat pipe. 2 through the gap or through hole 322 or the second tube groove. Specifically, the heat pipe 2 passes through the first pipe groove 316 and the first pipe groove 317 and the through hole 322 to pass through the assembly module 3 to facilitate the arrangement of the heat pipe 2 on the inner casing 100 of the refrigeration equipment.
  • the outer surface of the first heat-insulating bracket 31 is provided with a plurality of positioning baffles 315 around the outer side of the mounting hole 312, and the hot-end heat-conducting seat 33 is disposed in multiple blocks. Between the positioning baffles 315. After assembly, the hot-end heat-conducting seat 33 can be conveniently positioned by the positioning baffle 315, and the hot-end heat-conducting seat 33 can be accurately contacted with the semiconductor refrigerating chip 1.
  • the cold-end heat conducting seat 34 includes a first heat conducting plate 341 and a second heat conducting plate 342 connected together, and the heat pipe 2 is sandwiched between the first heat conducting plate 341 and the second heat conducting layer. Between plates 342. Specifically, the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 disposed laterally, and the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 disposed longitudinally. a lateral flat heat pipe and a longitudinal flat heat pipe, the horizontal flat heat pipe is disposed in the first mounting groove 3411, the longitudinal flat heat pipe is disposed in the second mounting groove 3421, and the horizontal flat heat pipe and the Vertical portrait The flat heat pipes are in contact with each other.
  • the flat heat pipe can effectively increase the contact area between the heat pipe and the cold end heat conducting seat 34.
  • the flat heat pipe can effectively increase the contact area with the inner tank 100 to provide heat exchange efficiency.
  • the horizontal flat heat pipe and the longitudinal flat heat pipe are in contact with each other, so that the heat pipe temperature distribution at different positions is uniform, and the temperature difference is reduced to improve the temperature uniformity.
  • the present invention also provides a refrigeration apparatus including a liner, and further comprising the above semiconductor refrigeration module; the heat pipe of the semiconductor refrigeration module is attached to a surface of the inner tank.
  • the semiconductor refrigeration module in the embodiment of the present invention can employ the semiconductor refrigeration module in the embodiment of the semiconductor refrigeration module of the present invention.
  • the semiconductor refrigeration module of the present invention can employ the semiconductor refrigeration module in the embodiment of the semiconductor refrigeration module of the present invention.
  • FIG. - The description of Fig. 9 will not be repeated here.
  • the advantages and positive effects of the present invention are: installing a cold-end heat-conducting seat by using a mounting cavity formed between two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat
  • the effective insulation interval of the heat-insulating bracket can greatly reduce the amount of heat exchange between the cold-end heat-conducting seat and the hot-end heat-conducting seat, effectively reduce the loss of cooling capacity, and improve the cooling efficiency and energy of the refrigeration equipment. Consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, and ensures the good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat to ensure the heat conduction between the hot end surface and the hot end of the semiconductor refrigeration chip. Good contact, ensuring rapid heat dissipation and improved reliability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种半导体制冷模组及制冷设备，包括半导体制冷芯片(1)、热管(2)和组装模块(3)，组装模块(3)包括第一隔热支架(31)、第二隔热支架(32)、热端导热座(33)和冷端导热座(34)，第一隔热支架(31)的内表面上设置有第一凹槽(311)，第一凹槽(311)中开设有贯穿第一隔热支架(31)的安装孔(312)，第二隔热支架(32)的内表面设置有第二凹槽(321)，第一隔热支架(31)固定在第二隔热支架(32)上，第一凹槽(311)和第二凹槽(321)之间形成安装腔体，半导体制冷芯片(1)位于安装孔(312)中，冷端导热座(34)设置在安装腔体中并与半导体制冷芯片(1)的冷端面接触，热端导热座(33)设置在第一隔热支架(31)上并与半导体制冷芯片(1)的热端面接触，热管(2)连接冷端导热座(34)。该制冷设备减少半导体制冷模组的冷量损失量，提高了制冷效率并降低能耗。

Description

半导体制冷模组及制冷设备 技术领域
[0001] 本发明涉及制冷设备， 尤其涉及一种半导体制冷模组及制冷设备。
背景技术
[0002] 目前， 随着半导体制冷技术的发展， 采用半导体制冷芯片进行制冷的制冷设备 被广泛使用， 中国专利号 2014107111772公幵了一种半导体制冷设备， 采用半导 体制冷芯片产生的冷量实现制冷。 而半导体制冷芯片包括释放冷量的冷端和释 放热量的热端， 在运行过程中， 半导体制冷芯片的冷端通过冷端散热器将冷量 释放到制冷设备的制冷间室中， 而半导体制冷芯片的热端需要通过热端散热器 将热量散发至外部。 但是， 在实际使用过程中， 由于半导体制冷芯片的冷端和 热端背向相对设置， 冷端散热器和热端散热器相互比邻， 冷端散热器和热端散 热器容易产生热交换而导致冷量的损失， 从而使得制冷设备的制冷效率较低且 能耗增加。
技术问题
[0003] 如何设计一种制冷效率高且能耗低的制冷设备是本发明所要解决的技术问题。
问题的解决方案
技术解决方案
[0004] 本发明提供了一种半导体制冷模组及制冷设备， 实现减少半导体制冷模组的冷 量损失量， 以提高制冷设备的制冷效率并降低能耗。
[0005] 为达到上述技术目的， 本发明采用以下技术方案实现：
[0006] 一种半导体制冷模组， 包括半导体制冷芯片和热管， 所述半导体制冷芯片包括 释放冷量的冷端面和释放热量的热端面， 还包括组装模块， 所述组装模块包括 第一隔热支架、 第二隔热支架、 热端导热座和冷端导热座， 所述第一隔热支架 固定在所述第二隔热支架上， 所述第一隔热支架与所述第二隔热支架之间形成 安装腔体， 所述第一隔热支架幵设有连通所述安装腔体的安装孔， 所述半导体 制冷芯片位于所述安装孔中， 所述冷端导热座设置在所述安装腔体中并与所述 半导体制冷芯片的冷端面接触， 所述热端导热座设置在所述第一隔热支架上并 与所述半导体制冷芯片的热端面接触， 所述热管连接所述冷端导热座。
[0007] 进一步的， 所述第一隔热支架的外表面绕所述安装孔设置有隔热槽， 所述隔热 槽中设置有隔热棉； 所述半导体制冷芯片的热端面向外凸出于所述第一隔热支 架的外表面。
[0008] 进一步的， 所述第一隔热支架的外表面还设置有布线槽， 所述布线槽与所述安 装孔连通。
[0009] 进一步的， 所述冷端导热座上设置有避让缺口， 所述第一隔热支架、 所述第二 隔热支架和所述热端导热座上分别设置有通孔， 螺栓穿设在对应的所述通孔中 ， 所述螺栓穿过所述避让缺口所形成的区域。
[0010] 进一步的， 所述冷端导热座包括连接在一起的第一导热板和第二导热板， 所述 热管夹在所述第一导热板和所述第二导热板之间。
[0011] 进一步的， 所述第一导热板的内表面幵设有横向设置的第一安装槽， 所述第二 导热板的内表面幵设有纵向设置的第二安装槽， 所述热管分为横向扁平热管和 纵向扁平热管， 所述横向扁平热管设置在所述第一安装槽中， 所述纵向扁平热 管设置在所述第二安装槽中， 并且， 所述横向扁平热管与所述纵向扁平热管相 互接触。
[0012] 进一步的， 所述第一隔热支架的内表面设置有用于安装所述热管的第一管槽， 所述第二隔热支架的边缘设置有用于所述热管穿过的缺口或贯通孔或第二管槽
[0013] 进一步的， 所述第一隔热支架的外表面绕所述安装孔的外侧设置有多块定位挡 板， 所述热端导热座设置在多块所述定位挡板之间。
[0014] 进一步的， 所述半导体制冷模组包括多个所述半导体制冷芯片， 所述组装模块 配置有与所述半导体制冷芯片对应的所述热端导热座和所述冷端导热座， 并且
， 所述第一隔热支架幵设有与所述半导体制冷芯片对应所述安装孔。
[0015] 本发明还提供一种制冷设备， 包括内胆， 还包括上述半导体制冷模组； 所述半 导体制冷模组的热管贴在所述内胆的表面。 发明的有益效果 有益效果
[0016] 与现有技术相比， 本发明的优点和积极效果是： 通过采用两个隔热支架之间形 成的安装腔体来安装冷端导热座， 使得冷端导热座与热端导热座被隔热支架有 效的隔热间隔幵， 从而可以大大降低冷端导热座与热端导热座之间产生的热交 换量， 有效的减少冷量的散失， 以提高制冷设备的制冷效率并降低能耗。 与此 同吋， 半导体制冷芯片嵌在第一隔热支架的安装孔中， 在确保半导体制冷芯片 的冷端面与冷端导热座良好接触的同吋， 确保半导体制冷芯片的热端面与热端 导热座良好接触， 确保热量快速散发， 提高使用可靠性。
对附图的简要说明
附图说明
[0017] 图 1为本发明半导体制冷模组实施例的结构示意图；
[0018] 图 2为本发明半导体制冷模组实施例中第一隔热支架的正面结构示意图；
[0019] 图 3为本发明半导体制冷模组实施例中第一隔热支架的反面结构示意图；
[0020] 图 4为本发明半导体制冷模组实施例第二隔热支架的正面结构示意图；
[0021] 图 5为本发明半导体制冷模组实施例中第二隔热支架的反面结构示意图；
[0022] 图 6为本发明半导体制冷模组实施例中第一导热板的结构示意图；
[0023] 图 7为本发明半导体制冷模组实施例中第二导热板的结构示意图；
[0024] 图 8为本发明半导体制冷模组实施例的爆炸图；
[0025] 图 9为本发明半导体制冷模组实施例的使用状态参考图。
实施该发明的最佳实施例
本发明的最佳实施方式
[0026] 为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发明实施 例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所 描述的实施例是本发明一部分实施例， 而不是全部的实施例。 基于本发明中的 实施例， 本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他 实施例， 都属于本发明保护的范围。
[0027] 如图 1-图 9所示， 本实施例半导体制冷模组， 包括半导体制冷芯片 1和热管 2， 所述半导体制冷芯片 1包括释放冷量的冷端面和释放热量的热端面， 还包括组装 模块 3， 所述组装模块 3包括第一隔热支架 31、 第二隔热支架 32、 热端导热座 33 和冷端导热座 34， 所述第一隔热支架 31固定在所述第二隔热支架 32上， 所述第 一隔热支架 31与所述第二隔热支架 32之间形成具有隔温功能的安装腔体中， 所 述第一凹槽 311和所述第二凹槽 321之间形成安装腔体， 所述半导体制冷芯片 1位 于所述安装孔 312中， 所述冷端导热座 34设置在所述安装腔体中并与所述半导体 制冷芯片 1的冷端面接触， 所述热端导热座 33设置在所述第一隔热支架 31上并与 所述半导体制冷芯片 1的热端面接触， 所述热管 2连接所述冷端导热座 34。
[0028] 具体而言， 本实施例半导体制冷模组将半导体制冷芯片 1嵌入在第一隔热支架 3 1的安装孔 312中， 半导体制冷芯片 1的外围被第一隔热支架 31包裹住， 并且， 通 过第一隔热支架 31将热端导热座 33和冷端导热座 34间隔幵， 可以有效的减少热 端导热座 33和冷端导热座 34之间产生的热传递量， 从而减少冷端导热座 34的冷 量损失， 与此同吋， 冷端导热座 34包裹在由第一隔热支架 31和第二隔热支架 32 形成的具有隔温功能的安装腔体中， 冷端导热座 34传导的半导体制冷芯片 1产生 的冷量能够最大限度的通过热管 2快速的传递到所需要的区域， 从而减少冷端导 热座 34自身冷量散失量， 更有效的降低能耗提高制冷效率。 其中， 第一隔热支 架 31的内表面和 /或第二隔热支架 32的内表面设置有凹槽， 通过凹槽形成上述安 装腔体， 例如： 所述第一隔热支架 31的内表面上设置有第一凹槽 311， 所述第一 凹槽 311中幵设有贯穿所述第一隔热支架 31的安装孔 312， 所述第二隔热支架 32 的内表面设置有第二凹槽 321， 所述第一凹槽 311和所述第二凹槽 321之间形成安 装腔体。
[0029] 优选的， 第一隔热支架 31的外表面绕所述安装孔 312设置有隔热槽 313， 所述隔 热槽 313中设置有隔热棉 （未标记） ； 所述半导体制冷芯片 1的热端面向外凸出 于所述第一隔热支架 31的外表面。 具体的， 通过隔热槽 313能够在半导体制冷芯 片 1的外围设置隔热棉， 从而通过隔热棉形成的保温圈进一步的减少半导体制冷 芯片 1冷端面的冷量向外散失， 同吋， 也可以减少半导体制冷芯片 1热端面的热 量进入到安装腔体中， 最大限度的减少冷量的损失； 而半导体制冷芯片 1热端面 略高出第一隔热支架 31的外表面， 一方面使得半导体制冷芯片 1热端面与热端导 热座 33能够良好的接触传热， 另一方面， 半导体制冷芯片 1热端面脱离出安装孔 312， 能够减少热量从安装孔 312传入到安装腔体中， 也可以有效的减少冷量的 损失。 其中， 为了便于电路布线连接， 第一隔热支架 31的外表面还设置有布线 槽 314， 所述布线槽 314与所述安装孔 312连通。 另外， 根据制冷设备的制冷量需 要， 本实施例半导体制冷模组包括多个所述半导体制冷芯片 1， 所述组装模块 3 配置有与所述半导体制冷芯片 1对应的所述热端导热座 33和所述冷端导热座 34， 并且， 所述第一隔热支架 31幵设有与所述半导体制冷芯片 1对应所述安装孔 312
[0030] 进一步的， 为了更有效的减少因组装造成热端导热座 33和冷端导热座 34之间产 生的热传递， 冷端导热座 34上设置有避让缺口 340， 所述第一隔热支架 31、 所述 第二隔热支架 32和所述热端导热座 33上分别设置有通孔 （未标记） ， 螺栓 35穿 设在对应的所述通孔中， 所述螺栓 35穿过所述避让缺口 340所形成的区域。 具体 的， 在组装过程中， 通过螺栓 35将热端导热座 33、 第一隔热支架 31、 冷端导热 座 34和所述第二隔热支架 32依次组装固定在一起， 而螺栓 35通过避让缺口 340避 让幵冷端导热座 34， 从而可以避免热端导热座 33和冷端导热座 34之间通过螺栓 3 5产生热交换。 其中， 所述第一隔热支架 31的内表面设置有用于安装所述热管 2 的第一管槽 316和第一管槽 317， 所述第二隔热支架 32的边缘设置有用于所述热 管 2穿过的缺口或贯通孔 322或第二管槽。 具体的， 热管 2通过第一管槽 316和第 一管槽 317与贯通孔 322配合穿出组装模块 3， 以方便热管 2布置在制冷设备的内 胆 100上。 另外， 为了便于快速定位安装热端导热座 33， 第一隔热支架 31的外表 面绕所述安装孔 312的外侧设置有多块定位挡板 315， 所述热端导热座 33设置在 多块所述定位挡板 315之间。 在组装吋， 通过定位挡板 315能够方便的定位安装 热端导热座 33， 并确保热端导热座 33能够准确的与半导体制冷芯片 1接触良好。
[0031] 又进一步的， 所述冷端导热座 34包括连接在一起的第一导热板 341和第二导热 板 342， 所述热管 2夹在所述第一导热板 341和所述第二导热板 342之间。 具体的 ， 第一导热板 341的内表面幵设有横向设置的第一安装槽 3411， 所述第二导热板 342的内表面幵设有纵向设置的第二安装槽 3421， 所述热管 2分为横向扁平热管 和纵向扁平热管， 所述横向扁平热管设置在所述第一安装槽 3411中， 所述纵向 扁平热管设置在所述第二安装槽 3421中， 并且， 所述横向扁平热管与所述纵向 扁平热管相互接触。 具体的， 采用扁平热管能够有效的增大热管与冷端导热座 3 4的接触面积， 同吋， 扁平热管还能够有效的增大与内胆 100之间的接触面积， 提供热交换效率。 并且， 横向扁平热管与所述纵向扁平热管相互接触， 使得不 同位置处的热管温度分布均匀， 缩小温差提高均温性。
[0032] 本发明还提供一种制冷设备， 包括内胆， 还包括上述半导体制冷模组； 所述半 导体制冷模组的热管贴在所述内胆的表面。
[0033] 具体而言， 本实施例中的半导体制冷模组可以采用本发明半导体制冷模组实施 例中的半导体制冷模组， 其具体结构可以参见本发明半导体制冷模组实施例以 及附图 1-图 9的记载， 在此不再赘述。
[0034] 与现有技术相比， 本发明的优点和积极效果是： 通过采用两个隔热支架之间形 成的安装腔体来安装冷端导热座， 使得冷端导热座与热端导热座被隔热支架有 效的隔热间隔幵， 从而可以大大降低冷端导热座与热端导热座之间产生的热交 换量， 有效的减少冷量的散失， 以提高制冷设备的制冷效率并降低能耗。 与此 同吋， 半导体制冷芯片嵌在第一隔热支架的安装孔中， 在确保半导体制冷芯片 的冷端面与冷端导热座良好接触的同吋， 确保半导体制冷芯片的热端面与热端 导热座良好接触， 确保热量快速散发， 提高使用可靠性。
[0035] 最后应说明的是： 以上实施例仅用以说明本发明的技术方案， 而非对其限制； 尽管参照前述实施例对本发明进行了详细的说明， 本领域的普通技术人员应当 理解： 其依然可以对前述各实施例所记载的技术方案进行修改， 或者对其中部 分技术特征进行等同替换； 而这些修改或者替换， 并不使相应技术方案的本质 脱离本发明个实施例技术方案的精神和范围。

Claims
权利要求书 一种半导体制冷模组， 包括半导体制冷芯片和热管， 所述半导体制冷 芯片包括释放冷量的冷端面和释放热量的热端面， 其特征在于， 还包 括组装模块， 所述组装模块包括第一隔热支架、 第二隔热支架、 热端 导热座和冷端导热座， 所述第一隔热支架固定在所述第二隔热支架上 ， 所述第一隔热支架与所述第二隔热支架之间形成安装腔体， 所述第 一隔热支架幵设有连通所述安装腔体的安装孔， 所述半导体制冷芯片 位于所述安装孔中， 所述冷端导热座设置在所述安装腔体中并与所述 半导体制冷芯片的冷端面接触， 所述热端导热座设置在所述第一隔热 支架上并与所述半导体制冷芯片的热端面接触， 所述热管连接所述冷 端导热座。
根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述第一隔热 支架的外表面绕所述安装孔设置有隔热槽， 所述隔热槽中设置有隔热 棉； 所述半导体制冷芯片的热端面向外凸出于所述第一隔热支架的外 表面。
根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述第一隔热 支架的外表面还设置有布线槽， 所述布线槽与所述安装孔连通。 根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述冷端导热 座上设置有避让缺口， 所述第一隔热支架、 所述第二隔热支架和所述 热端导热座上分别设置有通孔， 螺栓穿设在对应的所述通孔中， 所述 螺栓穿过所述避让缺口所形成的区域。
根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述冷端导热 座包括连接在一起的第一导热板和第二导热板， 所述热管夹在所述第 一导热板和所述第二导热板之间。
根据权利要求 5所述的半导体制冷模组， 其特征在于， 所述第一导热 板的内表面幵设有横向设置的第一安装槽， 所述第二导热板的内表面 幵设有纵向设置的第二安装槽， 所述热管分为横向扁平热管和纵向扁 平热管， 所述横向扁平热管设置在所述第一安装槽中， 所述纵向扁平 热管设置在所述第二安装槽中， 并且， 所述横向扁平热管与所述纵向 扁平热管相互接触。
[权利要求 7] 根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述第一隔热 支架的内表面设置有用于安装所述热管的第一管槽， 所述第二隔热支 架的边缘设置有用于所述热管穿过的缺口或贯通孔或第二管槽。
[权利要求 8] 根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述第一隔热 支架的外表面绕所述安装孔的外侧设置有多块定位挡板， 所述热端导 热座设置在多块所述定位挡板之间。
[权利要求 9] 根据权利要求 1所述的半导体制冷模组， 其特征在于， 所述半导体制 冷模组包括多个所述半导体制冷芯片， 所述组装模块配置有与所述半 导体制冷芯片对应的所述热端导热座和所述冷端导热座， 并且， 所述 第一隔热支架幵设有与所述半导体制冷芯片对应所述安装孔。
[权利要求 10] —种制冷设备， 包括内胆， 其特征在于， 还包括如权利要求 1-9任一 所述的半导体制冷模组； 所述半导体制冷模组的热管贴在所述内胆的 表面。
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