WO2018196060A1 - 微结构基板及制造方法、显示装置 - Google Patents

微结构基板及制造方法、显示装置 Download PDF

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WO2018196060A1
WO2018196060A1 PCT/CN2017/085087 CN2017085087W WO2018196060A1 WO 2018196060 A1 WO2018196060 A1 WO 2018196060A1 CN 2017085087 W CN2017085087 W CN 2017085087W WO 2018196060 A1 WO2018196060 A1 WO 2018196060A1
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Prior art keywords
substrate
microstructure
silicon dioxide
fingerprint
layer
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English (en)
French (fr)
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杨勇
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/536,079 priority Critical patent/US20190086586A1/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • G02B5/0221—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having an irregular structure
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a microstructure substrate, a manufacturing method, and a display device.
  • the anti-glare treatment method commonly used by panel manufacturers is to prepare an uneven surface on the surface of a glass or plastic substrate, and the image quality of the anti-glare substrate after being attached to the high-resolution substrate is blurred. The actual resolution of the panel is degraded. Therefore, such an anti-glare substrate is often used only for panels that do not require high resolution.
  • the invention provides a microstructure substrate, a manufacturing method and a display device, which can improve the influence of the microstructure on the image quality of the high-resolution panel, reduce the blurring degree of the image quality, and make it possible to use the substrate on the high-resolution panel.
  • a display device including a microstructure substrate, the microstructure substrate including: a substrate substrate; a fingerprint resistant film layer, The anti-fingerprint film layer is coated on the base substrate; the silicon dioxide layer covers the anti-fingerprint film layer, and includes a plurality of arc-shaped recessed microstructures; wherein the anti-fingerprint film
  • the material of the layer is a mixed liquid of silica, water-soluble resin, wax and auxiliary agent; the microstructure has a width of 5 ⁇ m to 25 ⁇ m, a ratio of depth to width is 0.05 to 0.15, and an angle between a tangent of the curved surface and the horizontal direction It is 5° to 20°.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a microstructure substrate, which comprises: coating a layer of a fingerprint resistant film on a substrate; A silicon dioxide layer is sputtered on the fingerprint film layer; the silicon dioxide layer is wet etched to prepare a silicon dioxide layer having a plurality of arcuate recessed microstructures.
  • a microstructure substrate which includes: a substrate substrate; a fingerprint resistant film layer, and the fingerprint resistant film layer is coated on the substrate On the substrate substrate; a silicon dioxide layer covering the fingerprint resistant film layer, including Multiple arc-shaped recessed microstructures.
  • the invention has the beneficial effects that the invention can prepare an anti-glare microstructure with a circular arc depression on the substrate by using an etching process, and can improve the microstructure to the high-resolution panel.
  • the effect of image quality reduces the blurring of image quality, making it possible to use substrates on high-resolution panels.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for fabricating a microstructured substrate of the present invention
  • FIG. 2 is a schematic structural view of an embodiment of a process for preparing a microstructured substrate of the present invention
  • FIG. 3 is a schematic view showing an embodiment of a sputtering direction of a silicon dioxide and a substrate of the present invention
  • FIG. 4 is a schematic structural view showing an embodiment of an angle between a tangent line and a horizontal direction of a curved surface of a microstructure according to the present invention
  • FIG. 5 is a schematic structural view of an embodiment of a microstructure according to the present invention.
  • FIG. 6 is a schematic diagram of simulation of a microstructure substrate of the present invention.
  • Fig. 7 is a schematic structural view of an embodiment of a display device of the present invention.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for fabricating a microstructured substrate according to the present invention.
  • FIG. 2 is a schematic structural view of an embodiment of a process for fabricating a microstructured substrate according to the present invention, and the method includes the following steps:
  • the substrate may be a transparent material, and may be any substrate of any form such as glass, ceramic substrate or transparent plastic, which is not specifically limited herein. And the substrate needs to be cleaned before starting the process.
  • the anti-fingerprint is a mixed liquid of silicon dioxide, a water-soluble resin, a wax and related additives, and the mixed liquid is a water-soluble resin organic material.
  • the anti-fingerprint layer has better acid resistance and can prevent the etching of the etching liquid, so that the microstructure in the subsequent etching process can not have an excessive aspect ratio (described later).
  • the silica in the fingerprint-resistant film layer can enhance the bonding ability between the fingerprint-resistant film layer and the substrate, improve the adhesion and scratch resistance of the film layer, and the auxiliary agent mainly acts as a dispersion to make the mixed liquid.
  • the organic component and the inorganic component exhibit a dispersion state of micron or even nanometer order, and also ensure the stability of storage and use of the mixed liquid.
  • the water-soluble resin is a bonded matrix material of the film layer, and is a host material of the film layer, and the wax has The self-lubricating function improves the processing properties of the mixed liquid.
  • a silicon dioxide layer having a thickness of 1 ⁇ m to 3 ⁇ m may be sputtered on the anti-fingerprint layer, and in other embodiments, the silicon dioxide layer may be disposed in other manners.
  • the fingerprint-resistant film layer it is not specifically limited herein.
  • FIG. 3 is a second embodiment of the present invention.
  • the silicon dioxide layer after the silicon dioxide layer is sputtered, it needs to be etched.
  • a wet etching technique is employed, and in other embodiments, dry etching may also be employed.
  • Technology which is not specifically limited here.
  • the etching solution is a mixed acid solution mainly composed of hydrofluoric acid.
  • other etching liquids which can etch the silicon dioxide layer may be used, and are not specifically limited herein.
  • the etching conditions include at least one of the etching liquid concentration, the etching time, and the etching liquid flow rate.
  • the etching conditions are controlled by the process to obtain a silicon dioxide layer having a plurality of arc-shaped recessed microstructures.
  • the width L of the circular concave microstructure may be 5 ⁇ m to 25 ⁇ m
  • the ratio of the depth h to the width L may be 0.05 to 0.15
  • the angle between the tangent of the curved surface and the horizontal direction is 5° to 20°, see FIG. 4.
  • the substrate having the circular concave microstructure prepared by the above method can improve the influence of the microstructure on the high-resolution panel image quality and reduce the blurring degree of the image quality by controlling the microstructure morphology and structural parameters.
  • a circle is prepared on the substrate.
  • the anti-glare microstructure of the arc recess can improve the influence of the microstructure on the image quality of the high-resolution panel, reduce the blurring of the image quality, and make it possible to use the substrate on the high-resolution panel.
  • FIG. 5 is a schematic structural view of an embodiment of a microstructure according to the present invention.
  • the microstructure substrate 10 includes a base substrate 11, a fingerprint-resistant film layer 12, and a silicon dioxide layer 13.
  • the substrate 11 may be a transparent material, and may be any substrate such as a glass, a ceramic substrate, or a transparent plastic. The invention is not limited thereto.
  • the fingerprint-resistant film layer 12 is coated on the base substrate 11.
  • the anti-fingerprint film layer may be a mixed liquid of silica, a water-soluble resin, a wax and related additives, and a water-soluble resin organic material is mainly used.
  • a silicon dioxide layer 13 covering the fingerprint-resistant film layer 12 includes a plurality of arc-shaped recessed microstructures A.
  • the width L of the arc-shaped recessed microstructure may be 5 ⁇ m to 25 ⁇ m, and the ratio of the depth h to the width L may be 0.05 to 0.15, and the angle ⁇ between the tangent of the curved surface and the horizontal direction is 5° to 20°.
  • FIG. 6 is a schematic diagram of a simulation of a microstructured substrate according to the present invention.
  • FIG. 7 is a test picture, that is, a standard sinusoidal raster picture.
  • Figure b) shows the morphology of the microstructured substrate with a circular arc.
  • the microstructure widths of AG1, AG2 and AG3 are both 20 ⁇ m, and the aspect ratios are 0.1, 0.2 and 0.3 respectively.
  • BG is a substrate with no microstructure. From the simulation results, the microstructure is relatively small in width and width. The sharpness and contrast of the image are not significantly reduced, and the fidelity of the image quality is improved. As the aspect ratio increases, the sharpness and contrast of the image sharply decrease, and the image quality is blurred, that is, the small depth and width are small.
  • the ratio structure helps to improve the image quality clarity, combined with the anti-glare effect of the microstructure, and it is verified that the aspect ratio of the circular concave microstructure is 0.05 ⁇ 0.15, and the simulation is consistent with the practice.
  • FIG. 7 is a schematic structural diagram of an embodiment of a display device according to the present invention.
  • the display device 20 includes the microstructure substrate B of any of the above structures, or a microstructure substrate prepared by any of the above methods, and the specific method is as described above. The embodiments are not described herein again.
  • the present invention provides a microstructure substrate, a manufacturing method, and a display device, and an anti-glare microstructure having a circular arc depression is prepared on a substrate by using an etching process. It can improve the influence of microstructure on the image quality of high-resolution panels, reduce the blurring of image quality, and make it possible to use the substrate on high-resolution panels.

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Abstract

提供了一种微结构基板及制造方法、显示装置，方法包括：在衬底基板（11）上涂布一层耐指纹膜层（12）；在耐指纹膜层（12）上溅射二氧化硅层（13）；对二氧化硅层（13）进行蚀刻，以制备出具有多个圆弧凹陷微结构的二氧化硅层（13），能够改善微结构对高解析度面板画质的影响，减少画质的模糊程度，使得基板在高解析度面板上使用成为可能。

Description

微结构基板及制造方法、显示装置 【技术领域】
本发明涉及显示技术领域，特别是涉及一种微结构基板及制造方法、显示装置。
【背景技术】
目前，面板厂商常用的抗眩(anti-glare)处理方式是在玻璃或塑胶基板表面制备凹凸不平的形貌，而此种抗眩基板贴合高解析度基板之后会显示的画质模糊，造成面板实际解析度的下降。因此，此种抗眩基板多数情况下仅用于对解析度要求不高的面板上。
【发明内容】
本发明提供一种微结构基板及制造方法、显示装置，能够改善微结构对高解析度面板画质的影响，减少画质的模糊程度，使得基板在高解析度面板上使用成为可能。
为解决上述技术问题，本发明采用的又一种技术方案是：提供一种显示装置，所述显示装置包括微结构基板，所述微结构基板包括：衬底基板；耐指纹膜层，所述耐指纹膜层涂布于所述衬底基板上；二氧化硅层，所述二氧化硅层覆盖于所述耐指纹膜层，包括多个圆弧凹陷微结构；其中，所述耐指纹膜层的材料为二氧化硅、水溶性树脂、蜡及助剂的混合液体；所述微结构宽度为5μm～25μm，深度和宽度之比为0.05～0.15，弧面的切线与水平方向的夹角为5°～20°。
为解决上述技术问题，本发明采用的另一种技术方案是：提供一种微结构基板的制造方法，所述方法包括：在衬底基板上涂布一层耐指纹膜层；在所述耐指纹膜层上溅射二氧化硅层；对所述二氧化硅层进行湿蚀刻，以制备出具有多个圆弧凹陷微结构的二氧化硅层。
为解决上述技术问题，本发明采用的又一种技术方案是：提供一种微结构基板，所述微结构基板包括：衬底基板；耐指纹膜层，所述耐指纹膜层涂布于所述衬底基板上；二氧化硅层，所述二氧化硅层覆盖于所述耐指纹膜层，包括 多个圆弧凹陷微结构。
本发明的有益效果是：区别于现有技术的情况，本发明通过采用蚀刻的工艺方式，在衬底基板上制备出具有圆弧凹陷的抗眩微结构，能够改善微结构对高解析度面板画质的影响，减少画质的模糊程度，使得基板在高解析度面板上使用成为可能。
【附图说明】
图1是本发明微结构基板制造方法一实施例的流程示意图；
图2是本发明微结构基板制备过程一实施方式的结构示意图；
图3是本发明二氧化硅与衬底基板的溅射方向一实施方式的示意图；
图4是本发明微结构弧面的切线与水平方向的夹角一实施方式的结构示意图；
图5是为本发明微结构一实施方式的结构示意图；
图6是本发明微结构基板一仿真模拟示意图；
图7是本发明显示装置一实施方式的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1为本发明微结构基板制造方法一实施例的流程示意图，图2为本发明微结构基板制备过程一实施方式的结构示意图，且该方法包括如下步骤：
S1，在衬底基板上涂布一层耐指纹膜层。
可进一步参见图2中a)，其中，所述衬底基板可以为透明材质，具体可以是玻璃、陶瓷基板或者透明塑料等任意形式的基板，此处本发明不做具体限定。且在开始该工艺之前，需将该衬底基板清洗干净。
在本发明一应用场景中，该耐指纹膜层(anti-fingerprint)为二氧化硅、水溶性树脂、蜡及相关助剂的混合液体，该混合液体中以水溶性树脂有机材料 为主，且该耐指纹膜层具有较好的耐酸性，可以阻止蚀刻液的侵蚀，因此可以保证后续的蚀刻工艺中微结构不会具有过高的深宽比(详见后文描述)。其中，该耐指纹膜层中二氧化硅可以增强耐指纹膜层与衬底基板之间的结合能力，提高膜层的粘附性和抗刮伤性，助剂主要起分散作用，使得混合液体中有机成分与无机成分呈现微米级甚至纳米级的分散状态，同时也保证混合液体的储存和使用的稳定性，水溶性树脂为膜层的粘结骨架材料，为膜层的主体材料，蜡具有自润滑功能，可以提高混合液体的加工性能。
S2，在耐指纹膜层上溅射二氧化硅层。
可进一步参见图2中b)，在上述的耐指纹膜层上溅射一层厚度可以为1μm～3μm的二氧化硅层，在其它实施例中，该二氧化硅层也可以采用其它方式设置于耐指纹膜层上，此处不做具体限定。
其中，在溅射该二氧化硅层时，还需要调整靶材(二氧化硅)与衬底基板的溅射方向，且该溅射方向与衬底基板法线方向的夹角θ设定为75°～85°，以使得该溅射层为拥有较大孔隙密度的二氧化硅层，在后续蚀刻工艺中蚀刻速率较快，提升制备效率，具体可以参见图3，图3为本发明二氧化硅与衬底基板的溅射方向一实施方式的示意图。
S3，对二氧化硅层进行蚀刻，以制备出具有多个圆弧凹陷微结构的二氧化硅层。
可进一步参见图2中c)，在溅射完二氧化硅层后，需要对其进行蚀刻，在本发明具体实施例中采用的是湿蚀刻技术，在其它实施例中也可以采用干蚀刻等技术，此处不做具体限定。其中，蚀刻液采用的是以氢氟酸为主的混合酸液，在其它实施例中，也可以采用其它可以侵蚀该二氧化硅层的蚀刻液，此处也不做具体限定。
在蚀刻过程中，需要控制蚀刻条件来保证得到需要的微结构，且该蚀刻条件至少包括蚀刻液浓度、蚀刻时间以及蚀刻液流动速率中的一种。通过工艺上对蚀刻条件进行控制，以得到具有多个圆弧凹陷微结构的二氧化硅层。其中，该圆弧凹陷微结构的宽度L可以为5μm～25μm，深度h和宽度L之比可以为0.05～0.15，弧面的切线与水平方向的夹角β为5°～20°，参见图4。
由上述方法制备的具有圆弧凹陷微结构的基板，通过控制其微结构形貌和结构参数，可以改善微结构对高解析度面板画质的影响，减少画质的模糊程度。
上述实施方式中，通过采用蚀刻的工艺方式，在衬底基板上制备出具有圆 弧凹陷的抗眩微结构，能够改善微结构对高解析度面板画质的影响，减少画质的模糊程度，使得基板在高解析度面板上使用成为可能。
请参阅图5，图5为本发明微结构一实施方式的结构示意图。如图5，该微结构基板10包括：衬底基板11，耐指纹膜层12以及二氧化硅层13。
其中，衬底基板11可以为透明材质，具体可以是玻璃、陶瓷基板或者透明塑料等任意形式的基板，此处本发明不做具体限定。
耐指纹膜层12，该耐指纹膜层12涂布于衬底基板11上。且该耐指纹膜层可以为二氧化硅、水溶性树脂、蜡及相关助剂的混合液体，其中以水溶性树脂有机材料为主。
二氧化硅层13，该二氧化硅层13覆盖于耐指纹膜层12，包括多个圆弧凹陷微结构A。其中，该圆弧凹陷微结构的宽度L可以为5μm～25μm，深度h和宽度L之比可以为0.05～0.15，弧面的切线与水平方向的夹角θ为5°～20°。
请参阅图6，图6为本发明微结构基板一仿真模拟示意图，如图所示，图a)为测试图片，即标准正弦光栅图片。图b)为具有圆弧凹陷微结构基板形貌，通过模拟3种不同高度h和宽度L之比微结构形貌，得到如图c)所示的光强分布曲线。
其中，其中AG1、AG2及AG3微结构宽度L均为20μm，宽高比分别为0.1，0.2和0.3，BG为无微结构的衬底基板，从仿真模拟结果来看，微结构深宽比较小时，图像锐度和对比度均无明显下降，画质的保真度加好，随着深宽比的增加，图像锐度和对比度急剧下降，画质模糊不清，也就是说较小的深宽比结构有助于改善画质清晰度，结合微结构的抗眩效果，验证了该圆弧凹陷微结构的深宽比在0.05～0.15较为适宜，仿真模拟和实践相一致。
请参阅图7，图7为本发明显示装置一实施方式的结构示意图，该显示装置20包括上述任意结构的微结构基板B，或者由上述任一方法所制备的微结构基板，具体方法如上述各实施方式，此处不再赘述。
综上所述，本领域技术人员容易理解，本发明提供一种微结构基板及制造方法、显示装置，通过采用蚀刻的工艺方式，在衬底基板上制备出具有圆弧凹陷的抗眩微结构，能够改善微结构对高解析度面板画质的影响，减少画质的模糊程度，使得基板在高解析度面板上使用成为可能。
以上仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用 本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种显示装置，其中，所述显示装置包括微结构基板，所述微结构基板包括：
    衬底基板；
    耐指纹膜层，所述耐指纹膜层涂布于所述衬底基板上；
    二氧化硅层，所述二氧化硅层覆盖于所述耐指纹膜层，包括多个圆弧凹陷微结构；
    其中，所述耐指纹膜层的材料为二氧化硅、水溶性树脂、蜡及助剂的混合液体；
    所述微结构宽度为5μm～25μm，深度和宽度之比为0.05～0.15，弧面的切线与水平方向的夹角为5°～20°。
  2. 一种微结构基板的制造方法，其中，所述方法包括：
    在衬底基板上涂布一层耐指纹膜层；
    在所述耐指纹膜层上溅射二氧化硅层；
    对所述二氧化硅层进行蚀刻，以制备出具有多个圆弧凹陷微结构的二氧化硅层。
  3. 根据权利要求1所述的制造方法，其中，所述在所述耐指纹膜层上溅射二氧化硅层包括：调整二氧化硅与所述衬底基板的溅射方向，所述溅射方向与所述衬底基板法线方向的夹角设定为75°～85°。
  4. 根据权利要求3所述的制造方法，其中，所述二氧化硅层的厚度为1μm～3μm。
  5. 根据权利要求2所述的制造方法，其中，所述对所述二氧化硅层进行蚀刻包括：控制蚀刻条件，其中，所述蚀刻条件至少包括蚀刻液浓度、蚀刻时间以及蚀刻液流动速率中的一种。
  6. 根据权利要求2所述的制造方法，其中，所述微结构宽度为5μm～25μm。
  7. 根据权利要求2所述的制造方法，其中，所述微结构深度和宽度之比为0.05～0.15。
  8. 根据权利要求2所述的制造方法，其中，所述微结构弧面的切线与水平方向的夹角为5°～20°。
  9. 根据权利要求2所述的制造方法，其中，所述耐指纹膜层的材料为二氧化硅、水溶性树脂、蜡及助剂的混合液体。
  10. 一种微结构基板，其中，所述微结构基板包括：
    衬底基板；
    耐指纹膜层，所述耐指纹膜层涂布于所述衬底基板上；
    二氧化硅层，所述二氧化硅层覆盖于所述耐指纹膜层，包括多个圆弧凹陷微结构。
PCT/CN2017/085087 2017-04-24 2017-05-19 微结构基板及制造方法、显示装置 Ceased WO2018196060A1 (zh)

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