WO2018187964A1 - Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur - Google Patents

Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur Download PDF

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Publication number
WO2018187964A1
WO2018187964A1 PCT/CN2017/080230 CN2017080230W WO2018187964A1 WO 2018187964 A1 WO2018187964 A1 WO 2018187964A1 CN 2017080230 W CN2017080230 W CN 2017080230W WO 2018187964 A1 WO2018187964 A1 WO 2018187964A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
heat
cavity
electronic device
Prior art date
Application number
PCT/CN2017/080230
Other languages
English (en)
Chinese (zh)
Inventor
张清霞
Original Assignee
深圳市源畅通科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市源畅通科技有限公司 filed Critical 深圳市源畅通科技有限公司
Priority to PCT/CN2017/080230 priority Critical patent/WO2018187964A1/fr
Publication of WO2018187964A1 publication Critical patent/WO2018187964A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to the technical field of electronic devices, and specifically relates to a circuit board for an electronic device having a heat dissipation function.
  • Electronic Information Engineering is a discipline that uses modern technologies such as computers for electronic information control and information processing. It mainly studies the acquisition and processing of information, the design, bursting, application and integration of electronic equipment and information systems, and electronic information engineering. It has covered many aspects of society, such as how to deal with various telephone signals in the telephone exchange, how mobile phones transmit our voices and even images, how the networks around us transmit data, and even how information flows in the military. Confidentiality and other aspects must involve the application technology of electronic information engineering.
  • the circuit board is an important component of electronic equipment, and the service life of the circuit board determines the service life of the electronic equipment.
  • the present invention provides a circuit board for an electronic device having a heat dissipation function, which solves the problem of poor heat dissipation performance.
  • a circuit board for an electronic device having a heat dissipation function comprising a circuit board body and a mounting board body, the middle portion of the upper surface of the mounting board body and the circuit board body
  • the bottom of the mounting plate body is fixedly embedded with a threaded pipe, and the upper surface of the mounting plate body is respectively provided with two symmetrical first heat dissipation slots and two symmetrical numbers.
  • the second heat dissipation slot, and the two first heat dissipation slots and the two second heat dissipation slots are arranged in a mouth shape.
  • the interior of the mounting plate body is provided with a cavity, and the inner top wall of the cavity is fixedly connected with two symmetrical first air filters and two symmetrical second air filters. a fixed connection on the inner side wall of the cavity There are two symmetrical third air filters.
  • the inner bottom wall of the cavity is fixedly connected with a heat dissipating fan, and the inner bottom wall of the cavity is also fixedly connected with the strut arranged equidistantly, and one side of the top end of each strut passes through the pin shaft
  • the outer surface of each of the rotating rings is fixedly coupled with the blades arranged in a circular row.
  • the mounting plate body and the circuit board body have a rectangular cross section, and the mounting plate body has a cross section larger than the circuit board body cross section.
  • the inside of the threaded pipe is screwed with a screw, and the vertical length of the screw is greater than the vertical length of the threaded pipe.
  • the outer side surface of the mounting plate body is provided with two sets of symmetrical heat dissipation holes, and the number of the heat dissipation holes of each group is at least five.
  • the heat dissipation hole is in communication with the cavity, and each of the first heat dissipation slots and each of the second heat dissipation slots are in communication with the cavity, and the two third air filters are respectively associated with the two groups.
  • the vents correspond.
  • the two first air filters are respectively located directly below the two first heat dissipation slots, and the size of the first air filter is larger than the size of the first heat dissipation slots, and the two second defenses The dust nets are respectively located directly below the two second heat sinks, and the size of the second air filter is larger than the size of the second heat sink.
  • the utility model provides a circuit board for an electronic device having a heat dissipation function, which has the following beneficial effects
  • the circuit board for an electronic device having a heat dissipation function can form a simple convection passage by providing a first heat dissipation groove, a second heat dissipation groove, a heat dissipation hole, and a cavity, thereby ensuring rapid flow of air.
  • the utility model can drive the heat around the circuit board body to perform rapid flow, effectively avoiding the accumulation of heat, effectively avoiding the burning of the circuit board and having good heat dissipation performance.
  • the circuit board for an electronic device having a heat dissipation function is provided with a heat dissipation fan, a pillar, a pin shaft, a rotating ring and a blade, and can drive the blade to perform flexible rotation, thereby effectively accelerating the air inside the cavity.
  • the flow speed and the heat dissipation effect are better.
  • FIG. 1 is a top plan view of a top portion of a mounting plate body of the present invention
  • Figure 2 is a cross-sectional view of the front view of the mounting plate of the present invention.
  • FIG. 3 is a schematic view showing the internal structure of the cavity of the present invention.
  • a circuit board for an electronic device having a heat dissipation function comprising a circuit board body 4 and a mounting board body 1, a mounting board body 1 and a circuit board body
  • the cross section of the mounting plate 1 is larger than the cross section of the circuit board body 4, and the middle portion of the upper surface of the mounting board 1 is fixedly connected to the bottom of the circuit board body 4, which can effectively serve the circuit board body 4. Protection, the inside of the four corners of the mounting plate body 1 is fixedly embedded with a threaded pipe 6, the inside of the threaded pipe 6 is screwed with the screw 3, and the vertical length of the screw 3 is greater than the vertical length of the threaded pipe 6.
  • the value of the mounting board 1 and the circuit board for the electronic device can be effectively installed.
  • the upper surface of the mounting board 1 is respectively provided with two symmetrical first heat sinks 2 and two symmetrical heat sinks.
  • the slot 5, and the two first heat sinks 2 and the two second heat sinks 5 are arranged in a mouth shape, and the outer side of the mounting board body 1 is provided with two sets of symmetrical heat dissipation holes 7, each of which is provided with a heat dissipation hole 7
  • the number of each is at least five, and the heat dissipation holes 7 are connected to the cavity 13
  • each of the first heat dissipation slots 2 and each of the second heat dissipation slots 5 communicate with the cavity 13 to form a simple convection passage, which ensures a rapid flow of air and can drive the heat around the circuit board body 4 to be fast.
  • the flow effectively avoids the accumulation of heat, effectively avoids the burning of the circuit board, and has good heat dissipation performance.
  • the two third dustproof nets 8 respectively correspond to the two sets of heat dissipation holes 7, and the two first air filters 16 are located directly below the two first heat sinks 2, and first The size of the air filter 16 is larger than the size of the first heat sink 2, and the two second air filters 9 are located directly below the two second heat sinks 5, and the size of the second air filter 9 is larger than the second heat sink.
  • the size of 5 can effectively block the dust, effectively ensuring the normal use of the board.
  • the inner side of the mounting plate body 1 is provided with a cavity 13, and the inner top wall of the cavity 13 is fixedly connected with two symmetrical first air filters 16 and two symmetrical second air filters. 9.
  • the inner wall of the cavity 13 is fixedly connected with two symmetrical third air filters 8 to effectively block the dust, thereby effectively ensuring the normal use of the circuit board.
  • the inner bottom wall of the cavity 13 is fixedly connected with a heat dissipating fan 10, and the inner bottom wall of the cavity 13 is also fixedly connected with the strut 11 arranged equidistantly, and one side of the top end of each strut 11 passes through the pin shaft 14. It is hinged with the rotating ring 15 to ensure the flexible rotation of the rotating ring 15.
  • the outer surface of each rotating ring 15 is fixedly connected with the blades 12 arranged in a circular row, and the cooling fan 10 is connected with the power source matched with the electronic device.
  • the cooling fan 10 rotates and drives the air in the cavity 13 to flow, so that the blade 12 can be blown, and the rotation of the blade 12 accelerates the air flow inside and outside the cavity 13, thereby forming a simple air convection and dissipating heat. Good performance.
  • the circuit board for an electronic device having a heat dissipation function can form a simple convection passage by providing the first heat dissipation groove 2, the second heat dissipation groove 5, the heat dissipation hole 7, and the cavity 13. It ensures the rapid flow of air, can drive the heat around the circuit board 4 to flow quickly, effectively avoids the accumulation of heat, effectively avoids the burning of the circuit board, and has good heat dissipation performance.
  • the pillar 1 1 , the pin 14 , the rotating ring 15 and the blade 12 can drive the blade 12 to flexibly rotate, effectively speeding up the flow of air inside the cavity 13 , and the heat dissipation effect is better, and the first air filter is provided through the first air filter. 16.
  • the second air filter 9 and the third air filter 8 can effectively block the dust, and effectively ensure the normal use of the circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne une carte de circuit imprimé pour un dispositif électronique ayant une fonction de dissipation de chaleur, comprenant un corps de carte de circuit imprimé (4) et un corps de panneau de montage (1). Le milieu de la surface supérieure du corps de panneau de montage (1) est relié de manière fixe au fond du corps de carte de circuit imprimé (4). Des tubes filetés (6) sont incorporés de manière fixe dans tous les quatre coins du corps de panneau de montage (1). La surface supérieure du corps de panneau de montage (1) est pourvue de deux premières rainures de dissipation de chaleur symétriques (2) et de deux secondes rainures de dissipation de chaleur symétriques (5) séparément, et les deux premières rainures de dissipation de chaleur (2) et les deux secondes rainures de dissipation de chaleur (5) sont agencées selon un motif carré. La carte de circuit imprimé pour un dispositif électronique ayant une fonction de dissipation de chaleur peut former un simple canal de convection, assurer un écoulement d'air rapide, entraîner la chaleur autour du corps de carte de circuit pour qu'elle s'écoule rapidement, éviter efficacement une accumulation de chaleur et une perte de combustion de la carte de circuit imprimé, avoir de bonnes performances de dissipation de chaleur, accélérer efficacement la vitesse d'écoulement de l'air dans une cavité, assurer un meilleur effet de dissipation de chaleur, bloquer efficacement la poussière, et assurer efficacement une utilisation normale de la carte de circuit imprimé.
PCT/CN2017/080230 2017-04-12 2017-04-12 Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur WO2018187964A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/080230 WO2018187964A1 (fr) 2017-04-12 2017-04-12 Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/080230 WO2018187964A1 (fr) 2017-04-12 2017-04-12 Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur

Publications (1)

Publication Number Publication Date
WO2018187964A1 true WO2018187964A1 (fr) 2018-10-18

Family

ID=63792194

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/080230 WO2018187964A1 (fr) 2017-04-12 2017-04-12 Carte de circuit imprimé pour dispositif électronique ayant une fonction de dissipation de chaleur

Country Status (1)

Country Link
WO (1) WO2018187964A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116667024A (zh) * 2023-06-29 2023-08-29 深圳市鑫鹏博电子科技有限公司 用于连接新能源电动汽车电路板的接线端子

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6837057B2 (en) * 2002-12-31 2005-01-04 Intel Corporation Docking station to cool a computer
CN203117881U (zh) * 2013-03-18 2013-08-07 北京市鑫全盛商贸有限公司 笔记本电脑散热器
CN104659687A (zh) * 2013-11-18 2015-05-27 无锡市金力电力成套设备有限公司 电力配电箱的加强散热型底座
CN205900628U (zh) * 2016-07-21 2017-01-18 北京新能源汽车股份有限公司 动力电池和具有其的汽车

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6837057B2 (en) * 2002-12-31 2005-01-04 Intel Corporation Docking station to cool a computer
CN203117881U (zh) * 2013-03-18 2013-08-07 北京市鑫全盛商贸有限公司 笔记本电脑散热器
CN104659687A (zh) * 2013-11-18 2015-05-27 无锡市金力电力成套设备有限公司 电力配电箱的加强散热型底座
CN205900628U (zh) * 2016-07-21 2017-01-18 北京新能源汽车股份有限公司 动力电池和具有其的汽车

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116667024A (zh) * 2023-06-29 2023-08-29 深圳市鑫鹏博电子科技有限公司 用于连接新能源电动汽车电路板的接线端子
CN116667024B (zh) * 2023-06-29 2024-03-19 深圳市鑫鹏博电子科技有限公司 用于连接新能源电动汽车电路板的接线端子

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