WO2018187964A1

WO2018187964A1 - Circuit board for electronic device having heat dissipation function

Info

Publication number: WO2018187964A1
Application number: PCT/CN2017/080230
Authority: WO
Inventors: 张清霞
Original assignee: 深圳市源畅通科技有限公司
Priority date: 2017-04-12
Filing date: 2017-04-12
Publication date: 2018-10-18

Abstract

A circuit board for an electronic device having a heat dissipation function, comprising a circuit board body (4) and a mounting panel body (1). The middle of the upper surface of the mounting panel body (1) is fixedly connected to the bottom of the circuit board body (4). Threaded tubes (6) are fixedly embedded in all four corners of the mounting panel body (1). The upper surface of the mounting panel body (1) is provided with two symmetrical first heat dissipation grooves (2) and two symmetrical second heat dissipation grooves (5) separately, and the two first heat dissipation grooves (2) and the two second heat dissipation grooves (5) are arranged in a square pattern. The circuit board for an electronic device having a heat dissipation function can form a simple convection channel, ensure quick air flow, drive the heat around the circuit board body to flow quickly, effectively avoid heat accumulation and burning loss of the circuit board, have good heat dissipation performance, effectively accelerate the flow velocity of air in a cavity, provide a better heat dissipation effect, effectively block dust, and effectively ensure normal use of the circuit board.

Description

Description: A circuit board for an electronic device having a heat dissipation function

[0001] The present invention relates to the technical field of electronic devices, and specifically relates to a circuit board for an electronic device having a heat dissipation function.

Background technique

[0002] Electronic Information Engineering is a discipline that uses modern technologies such as computers for electronic information control and information processing. It mainly studies the acquisition and processing of information, the design, bursting, application and integration of electronic equipment and information systems, and electronic information engineering. It has covered many aspects of society, such as how to deal with various telephone signals in the telephone exchange, how mobile phones transmit our voices and even images, how the networks around us transmit data, and even how information flows in the military. Confidentiality and other aspects must involve the application technology of electronic information engineering. The circuit board is an important component of electronic equipment, and the service life of the circuit board determines the service life of the electronic equipment.

technical problem

[0003] Existing circuit boards for electronic devices generate a certain amount of heat under the operation of long turns, and heat dissipation may cause burnout of the circuit board, which seriously affects the normal use of the circuit board, and has limited heat dissipation performance. Problem solution

Technical solution

[0004] In view of the deficiencies of the prior art, the present invention provides a circuit board for an electronic device having a heat dissipation function, which solves the problem of poor heat dissipation performance.

[0005] In order to achieve the above object, the present invention provides the following technical solutions: A circuit board for an electronic device having a heat dissipation function, comprising a circuit board body and a mounting board body, the middle portion of the upper surface of the mounting board body and the circuit board body The bottom of the mounting plate body is fixedly embedded with a threaded pipe, and the upper surface of the mounting plate body is respectively provided with two symmetrical first heat dissipation slots and two symmetrical numbers. The second heat dissipation slot, and the two first heat dissipation slots and the two second heat dissipation slots are arranged in a mouth shape.

[0006] The interior of the mounting plate body is provided with a cavity, and the inner top wall of the cavity is fixedly connected with two symmetrical first air filters and two symmetrical second air filters. a fixed connection on the inner side wall of the cavity There are two symmetrical third air filters.

[0007] The inner bottom wall of the cavity is fixedly connected with a heat dissipating fan, and the inner bottom wall of the cavity is also fixedly connected with the strut arranged equidistantly, and one side of the top end of each strut passes through the pin shaft The outer surface of each of the rotating rings is fixedly coupled with the blades arranged in a circular row.

[0008] Preferably, the mounting plate body and the circuit board body have a rectangular cross section, and the mounting plate body has a cross section larger than the circuit board body cross section.

[0009] Preferably, the inside of the threaded pipe is screwed with a screw, and the vertical length of the screw is greater than the vertical length of the threaded pipe.

[0010] Preferably, the outer side surface of the mounting plate body is provided with two sets of symmetrical heat dissipation holes, and the number of the heat dissipation holes of each group is at least five.

[0011] Preferably, the heat dissipation hole is in communication with the cavity, and each of the first heat dissipation slots and each of the second heat dissipation slots are in communication with the cavity, and the two third air filters are respectively associated with the two groups. The vents correspond.

[0012] Preferably, the two first air filters are respectively located directly below the two first heat dissipation slots, and the size of the first air filter is larger than the size of the first heat dissipation slots, and the two second defenses The dust nets are respectively located directly below the two second heat sinks, and the size of the second air filter is larger than the size of the second heat sink.

Advantageous effects of the invention

Beneficial effect

[0013] The utility model provides a circuit board for an electronic device having a heat dissipation function, which has the following beneficial effects

[0014] (1) The circuit board for an electronic device having a heat dissipation function can form a simple convection passage by providing a first heat dissipation groove, a second heat dissipation groove, a heat dissipation hole, and a cavity, thereby ensuring rapid flow of air. The utility model can drive the heat around the circuit board body to perform rapid flow, effectively avoiding the accumulation of heat, effectively avoiding the burning of the circuit board and having good heat dissipation performance.

[0015] (2) The circuit board for an electronic device having a heat dissipation function is provided with a heat dissipation fan, a pillar, a pin shaft, a rotating ring and a blade, and can drive the blade to perform flexible rotation, thereby effectively accelerating the air inside the cavity. The flow speed and the heat dissipation effect are better. By providing the first air filter, the second air filter and the third air filter, the dust can be effectively blocked, and the normal use of the circuit board is effectively ensured.

Brief description of the drawing DRAWINGS

1 is a top plan view of a top portion of a mounting plate body of the present invention;

Figure 2 is a cross-sectional view of the front view of the mounting plate of the present invention;

3 is a schematic view showing the internal structure of the cavity of the present invention.

[0019] In the figure: 1 mounting plate body, 2 first heat sink, 3 screw, 4 circuit board body, 5 second heat sink, 6 threaded tube, 7 heat sink hole, 8 third air filter, 9 second defense Dust net, 10 cooling fans, 11 pillars, 12 blades, 13 cavities, 14 pins, 15 rotating rings, 16 first dust screen.

Embodiments of the invention

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, instead of All embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts are within the scope of the present invention.

[0021] Referring to FIG. 1-3, the present invention provides a technical solution: a circuit board for an electronic device having a heat dissipation function, comprising a circuit board body 4 and a mounting board body 1, a mounting board body 1 and a circuit board body The cross section of the mounting plate 1 is larger than the cross section of the circuit board body 4, and the middle portion of the upper surface of the mounting board 1 is fixedly connected to the bottom of the circuit board body 4, which can effectively serve the circuit board body 4. Protection, the inside of the four corners of the mounting plate body 1 is fixedly embedded with a threaded pipe 6, the inside of the threaded pipe 6 is screwed with the screw 3, and the vertical length of the screw 3 is greater than the vertical length of the threaded pipe 6. The value of the mounting board 1 and the circuit board for the electronic device can be effectively installed. The upper surface of the mounting board 1 is respectively provided with two symmetrical first heat sinks 2 and two symmetrical heat sinks. The slot 5, and the two first heat sinks 2 and the two second heat sinks 5 are arranged in a mouth shape, and the outer side of the mounting board body 1 is provided with two sets of symmetrical heat dissipation holes 7, each of which is provided with a heat dissipation hole 7 The number of each is at least five, and the heat dissipation holes 7 are connected to the cavity 13 And each of the first heat dissipation slots 2 and each of the second heat dissipation slots 5 communicate with the cavity 13 to form a simple convection passage, which ensures a rapid flow of air and can drive the heat around the circuit board body 4 to be fast. The flow effectively avoids the accumulation of heat, effectively avoids the burning of the circuit board, and has good heat dissipation performance. The two third dustproof nets 8 respectively correspond to the two sets of heat dissipation holes 7, and the two first air filters 16 are located directly below the two first heat sinks 2, and first The size of the air filter 16 is larger than the size of the first heat sink 2, and the two second air filters 9 are located directly below the two second heat sinks 5, and the size of the second air filter 9 is larger than the second heat sink. The size of 5 can effectively block the dust, effectively ensuring the normal use of the board.

[0022] The inner side of the mounting plate body 1 is provided with a cavity 13, and the inner top wall of the cavity 13 is fixedly connected with two symmetrical first air filters 16 and two symmetrical second air filters. 9. The inner wall of the cavity 13 is fixedly connected with two symmetrical third air filters 8 to effectively block the dust, thereby effectively ensuring the normal use of the circuit board.

[0023] The inner bottom wall of the cavity 13 is fixedly connected with a heat dissipating fan 10, and the inner bottom wall of the cavity 13 is also fixedly connected with the strut 11 arranged equidistantly, and one side of the top end of each strut 11 passes through the pin shaft 14. It is hinged with the rotating ring 15 to ensure the flexible rotation of the rotating ring 15. The outer surface of each rotating ring 15 is fixedly connected with the blades 12 arranged in a circular row, and the cooling fan 10 is connected with the power source matched with the electronic device. The cooling fan 10 rotates and drives the air in the cavity 13 to flow, so that the blade 12 can be blown, and the rotation of the blade 12 accelerates the air flow inside and outside the cavity 13, thereby forming a simple air convection and dissipating heat. Good performance.

[0024] In summary, the circuit board for an electronic device having a heat dissipation function can form a simple convection passage by providing the first heat dissipation groove 2, the second heat dissipation groove 5, the heat dissipation hole 7, and the cavity 13. It ensures the rapid flow of air, can drive the heat around the circuit board 4 to flow quickly, effectively avoids the accumulation of heat, effectively avoids the burning of the circuit board, and has good heat dissipation performance. The pillar 1 1 , the pin 14 , the rotating ring 15 and the blade 12 can drive the blade 12 to flexibly rotate, effectively speeding up the flow of air inside the cavity 13 , and the heat dissipation effect is better, and the first air filter is provided through the first air filter. 16. The second air filter 9 and the third air filter 8 can effectively block the dust, and effectively ensure the normal use of the circuit board.

[0025] It should be noted that, in this context, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities. There is any such actual relationship or order between operations. Furthermore, the terms "including", "comprising" or "comprising" or "comprising" are intended to encompass a non-exclusive inclusion, such that a process, method, article, or device that includes a plurality of elements includes not only those elements but also Other elements, or elements that are inherent to such a process, method, item, or device. In the absence of more restrictions. By the statement "includes a ... defined element, does not exclude the inclusion of the element There are additional identical elements in the process, method, item or device."

While the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art The scope of the invention is defined by the appended claims and their equivalents.

Claims

Claim

A circuit board for an electronic device having a heat dissipation function, comprising a circuit board body (4) and a mounting board body (1), characterized in that: a middle portion of the upper surface of the mounting board body (1) and a circuit board body (4) The bottom of the mounting plate body (1) is fixedly embedded with a threaded pipe (6) at the four corners, and the upper surface of the mounting plate body (1) is respectively provided with two symmetrical numbers. a first heat sink (2) and two symmetrical heat sinks (5), wherein the two first heat sinks (2) and the two second heat sinks (5) are arranged in a square shape;

The inner side of the mounting plate body (1) is provided with a cavity (13), and the inner top wall of the cavity (13) is fixedly connected with two symmetrical first air filters (16) and two a symmetrical symmetrical second air filter (9), the inner side wall of the cavity (13) is fixedly connected with two symmetrical third air filters (8);

The inner bottom wall of the cavity (13) is fixedly connected with a heat dissipating fan (10), and the inner bottom wall of the cavity (13) is also fixedly connected with equidistantly arranged pillars (11), each of which is One side of the top end of the pillar (11) is hinged to the rotating ring (15) through a pin (14), and the outer surface of each of the rotating ring (15) is fixedly connected with a blade arranged in a circular row (12) . The circuit board for an electronic device having a heat dissipation function according to claim 1, wherein: the mounting plate body (1) and the circuit board body (4) have a rectangular cross section, and the mounting plate body (1) The size of the cross section is larger than the cross section of the board body (4).

A circuit board for an electronic device having a heat dissipation function according to claim 1, wherein: the threaded tube (6) is internally screwed with a screw (3), and the vertical length of the screw (3) The value is greater than the vertical length of the threaded pipe (6).

The circuit board for an electronic device having a heat dissipation function according to claim 1, wherein: the outer side of the mounting plate body (1) is provided with two sets of symmetrical heat dissipation holes (7), each set The number of the heat dissipation holes (7) is at least five.

The circuit board for an electronic device having a heat dissipation function according to claim 1 or 4, wherein: the heat dissipation hole (7) is in communication with the cavity (13), and each of the first heat dissipation grooves (2) And each of the second heat sinks (5) is in communication with the cavity (13), and the two third air filters (8) respectively correspond to the two sets of heat dissipation holes (7). [Claim 6] A circuit board for an electronic device having a heat dissipation function according to claim 1, wherein: the two first air filters (16) are respectively located in two first heat dissipation slots (2) Directly below, and the size of the first air filter (16) is larger than the size of the first heat sink (2), and the two second air filters (9) are respectively located in the two second heat sinks (5) Directly below, and the size of the second air filter (9) is larger than the size of the second heat sink (5).