WO2018167232A1

WO2018167232A1 - Fixing system and method of soldering wire

Info

Publication number: WO2018167232A1
Application number: PCT/EP2018/056585
Authority: WO
Inventors: Yingcong Deng; Xiaojun ZHONG; Ke Ning; Xiaocong Li; Guiqin TAN; Yun Liu; Dandan Zhang; Lvhai Hu; Qinglong Zeng
Original assignee: Tyco Electronics (Shanghai) Co. Ltd.; Measurement Specialties (China) Ltd.; Shenzhen Ami Technology Co., Ltd.; Tyco Electronics Uk Ltd
Priority date: 2017-03-17
Filing date: 2018-03-15
Publication date: 2018-09-20
Also published as: CN108620704B; CN108620704A

Abstract

The present invention discloses a fixing system comprising a base (1) and at least one set of clamping devices (2) mounted on the base. Each set of clamping devices includes a first fixture (100), in which a first positioning groove (111), adapted to accommodate and position a circuit board (10) is formed. When the first fixture is mounted on the base, a first angle defined between a bottom surface (111a) of the first positioning groove and a horizontal surface of the base is more than 0 degree and less than 90 degrees, so that the circuit board positioned in the first positioning groove is inclined with respect to the horizontal surface of the base. Because the fixing system is adapted to hold the circuit board obliquely in a predetermined position, during soldering, the melted solder may flow downward automatically along the inclined circuit board, increasing the coverage rate of the solder and making the soldered surfaces smooth and flat.

Description

Fixing System And Method Of Soldering Wire

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application No.201710160007.3 filed on March 17, 2017 in the State Intellectual Property Office of China, the whole disclosure of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

Embodiments of the present invention relate to a fixing system, and particularly to a fixing system adapted to fix a circuit board and wires soldered to the circuit board. Additionally, embodiments of the present invention relate to a method for soldering wires to a circuit board.

Description of the Related Art

In the field of manufacturing electronic device, it is frequently required to weld wires to solder pads of a circuit board. In order to guarantee soldering quality, it is necessary to align end conductors of the wires with the solder pads of the circuit board, and press the end conductors of the wires tightly against the solder pads of the circuit board before soldering. During soldering, it is possible to heat the solder disposed at the solder pads by a soldering iron so that the solder is melted, thereby soldering the end conductors of the wires to the solder pads of the circuit board, respectively.

In the prior art, however, the circuit board is usually laid horizontally during soldering. Therefore, the melted solder is apt to not flow during soldering, which will decrease the coverage rate of the solder, and thus result in that the end conductors of the wires cannot be completely soldered to the solder pads of the circuit board, reducing the soldering quality. Moreover, since the melted solder is apt to not flow, it will leads to unsmooth surfaces of the soldered points, which further reduce the soldering quality.

SUMMARY OF THE INVENTION

An object of the present invention is to solve at least one aspect of the aforementioned problems and defects existed in the prior art.

An embodiment of the present invention provides a fixing system constructed to hold the circuit board obliquely in a predetermined position.

According to an aspect of the present invention, it provides a fixing system comprising a base and at least one set of clamping devices mounted on the base. Each set of clamping devices includes a first fixture, in which a first positioning groove is formed for accommodating and positioning a circuit board. When the first fixture is mounted on the base, a first angle defined between a bottom surface of the first positioning groove and a horizontal surface of the base is more than 0 degree and less than 90 degrees, so that the circuit board positioned in the first positioning groove is inclined with respect to the horizontal surface of the base..

According to an exemplary embodiment of the present invention, each set of clamping devices further includes a second fixture, in which a second positioning groove is formed for accommodating and positioning at least one wire. When the second fixture is mounted on the base, a second angle defined between a bottom surface of the second positioning groove and the horizontal surface of the base is more than 0 degree and less than 90 degrees.

According to another exemplary embodiment of the present invention, a sum of the first angle and the second angle is about 90 degrees, so that the bottom face of the first positioning groove is substantially perpendicular to the bottom face of the second positioning groove when the first fixture and the second fixture are mounted on the base.

According to another exemplary embodiment of the present invention, an end conductor of the wire is bent by about 90 degrees with respect to the wire; the end conductors of the wires are aligned with solder pads on the circuit board and are attached on surfaces of the solder pads, respectively, when the circuit board and the wires are positioned in the first positioning groove and the second positioning groove, respectively.

According to another exemplary embodiment of the present invention, the first fixture includes a first fixture body, wherein the first positioning groove is formed on an inclined side face of the first fixture body.

According to another exemplary embodiment of the present invention, the second fixture includes: a second fixture body, the second positioning groove being formed on an inclined side face of the second fixture body; and a cover that is pivotally connected to the second fixture body and is rotatable between an opened position and a closed position. The wires are clamped and fixed in the second positioning groove when the cover is in the closed position.

According to another exemplary embodiment of the present invention, the second fixture further includes a locking device that is provided on the second fixture body and is adapted to lock the cover in the closed position.

According to another exemplary embodiment of the present invention, one end of the cover is pivotally connected to one end of the second fixture body; and the locking device is provided on the other end of the second fixture body and is adapted to lock the other end of the cover.

According to another exemplary embodiment of the present invention, the locking device includes: a locking member that is pivotally connected to the second fixture body and is rotatable between a locked position and an unlocked position; and a spring that is provided on the second fixture body and is adapted to hold the locking member in the locked position. The spring is constructed to push the locking member to the locked position when the cover is rotated to the closed position and hold the cover in the closed position.

According to another exemplary embodiment of the present invention, the spring pushes one end of the locking member when the cover is rotated to the closed position, so that the other end of the locking member is pressed on the other end of the cover, thereby holding the cover in the closed position.

According to another exemplary embodiment of the present invention, when a pressing force, which is opposite to a pushing force applied by the spring, is applied on the end of the locking member, the locking member is driven to rotate to the unlocked position so that the locking member is disengaged from the cover.

According to another exemplary embodiment of the present invention, the fixing system further comprises a support frame, on which the second fixture is supported obliquely.

According to another exemplary embodiment of the present invention, the end conductors of the wires are pressed against the surfaces of the solder pads, respectively, due to the gravity of the second fixture itself, and the circuit board is kept in the first positioning groove.

According to another exemplary embodiment of the present invention, the circuit board has a row of solder pads, the second positioning groove is adapted to accommodate and position a row of wires, and the row of wires are adapted to be soldered to the row of solder pads on the circuit board.

According to another exemplary embodiment of the present invention, a row of V-shaped or U-shaped recesses are formed on the bottom surface of the second positioning groove so as to position the row of wires, respectively.

According to another aspect of the present invention, it provides a method of soldering a wire to a circuit board, comprising steps of:

SI 00: providing the fixing system as according to any one of the aforementioned embodiments;

S200: fixing and positioning the circuit board and the wires in the first positioning groove and the second positioning groove, respectively; and

S300: heating the solder on the circuit board to melt the solder so as to solder end conductors of the wires onto the solder pads of the circuit board by the melted solder, respectively,

wherein during soldering, the melted solder flows downward along the surface of the circuit board provided obliquely on the base due to the gravity of the solder itself.

In the aforementioned embodiments of the present invention, the fixing system may hold the circuit board obliquely in a predetermined position with respect to the horizontal surface of the base, therefore during soldering, the melted solder may flow downward automatically along the inclined circuit board, thereby increasing the fluidity of the solder. Thus, it may increase the coverage rate of the solder, and make the soldered surfaces smooth and flat, thereby improving the soldering quality.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

FIG. 1 shows a schematic perspective view of a fixing system according to an exemplary embodiment of the present invention;

FIG. 2 shows a schematic perspective view of a first fixture of the fixing system shown in FIG. 1, wherein no circuit board has been positioned in the first positioning groove;

FIG. 3 shows a schematic perspective view of the first fixture of the fixing system shown in FIG. 1, wherein a circuit board has been positioned in the first positioning groove;

FIG. 4 shows a schematic perspective view of a second fixture of the fixing system shown in FIG. 1, wherein no wire has been positioned in the second positioning groove;

FIG. 5 shows a schematic perspective view of the second fixture of the fixing system shown in FIG. 1, wherein the wires have been positioned in the second positioning groove, but a cover of the second fixture has not been closed;

FIG. 6 shows a schematic perspective view of the second fixture of the fixing system shown in FIG. 1, wherein the wires have been positioned in the second positioning groove, and the cover has been closed; and

FIG. 7 shows a longitudinal sectional view of the fixing system shown in FIG. 1.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art.

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

According to a general concept of the present invention, it provides a fixing system comprising a base and at least one set of clamping devices mounted on the base. Each set of clamping devices includes a first fixture, in which a first positioning groove is formed for accommodating and positioning a circuit board. When the first fixture is mounted on the base, a first angle defined between a bottom surface of the first positioning groove and a horizontal surface of the base is more than 0 degree and less than 90 degrees, so that the circuit board positioned in the first positioning groove is inclined with respect to the horizontal surface of the base.

FIG. 1 shows a schematic perspective view of a fixing system according to an exemplary embodiment of the present invention.

As shown in FIG. 1, in the illustrated embodiment, the fixing system mainly comprises a base 1 and at least one set of clamping devices 2 mounted on a horizontal surface of the base 1. In the illustrated embodiment, two sets of clamping devices 2 are mounted on the base 1. It is appreciated to mount one, three, or more sets of clamping devices 2 on the base 1 as required.

FIG. 2 shows a schematic perspective view of a first fixture 100 of the fixing system shown in FIG. 1, wherein a circuit board 10 has not been positioned in a first positioning groove 111; FIG. 3 shows a schematic perspective view of the first fixture 100 of the fixing system shown in FIG. 1, wherein the circuit board 10 has been positioned in the first positioning groove 111.

As shown in FIGS. 1, 2 and 3, in the illustrated embodiment, each set of clamping devices 2 includes a first fixture 100. As shown in FIGS. 2 and 3, a first positioning groove 111 is formed in the first fixture 100 for accommodating and positioning the circuit board 10.

As shown in FIGS. 1, 2, 3 and 7, in the illustrated embodiment, when the first fixture 100 is mounted on the base 1, a first angle a defined between a bottom surface 111a of the first positioning groove 111 and the horizontal surface of the base 1 is more than 0 degree and less than 90 degrees, so that the circuit board 10 positioned in the first positioning groove 111 is inclined with respect to the horizontal surface of the base 1.

FIG. 4 shows a schematic perspective view of a second fixture 200 of the fixing system shown in FIG. 1, wherein no wire 20 has been positioned in a second positioning groove 211; FIG. 5 shows a schematic perspective view of the second fixture 200 of the fixing system shown in FIG. 1, wherein the wires 20 have been positioned in the second positioning groove 211, but a cover 220 of the second fixture has not been closed.

As shown in FIGS. 1, 4, 5 and 7, in the illustrated embodiment, each set of clamping devices 2 further includes a second fixture 200, in which a second positioning groove 211 is formed for accommodating and positioning at least one wire 20. When the second fixture 200 is mounted on the base 1, a second angle β defined between a bottom face 211a of the second positioning groove 211 and the horizontal surface of the base 1 is more than 0 degree and less than 90 degrees.

In an embodiment of the present invention, as shown in FIGS. 1 and 7, a sum of the first angle a and the second angle β is about 90 degrees, i.e., as shown in FIG. 7, the bottom surface 111a of the first positioning groove 111 is perpendicular to the bottom surface 211a of the second positioning groove 211 when the first fixture 100 and the second fixture 200 are mounted on the base 1.

As shown in FIGS. 5 and 7, in the illustrated embodiment, end conductors 21 of the wires 20 are bent by 90 degrees with respect to the wires 20, respectively. As shown in FIG. 7, the end conductors 21 of the wires 20 are aligned with solder pads 11 on the circuit board 10 and are abutted against surfaces of the solder pads 11 when the circuit board 10 and the wires 20 are positioned in the first positioning groove 111 and the second positioning groove 211, respectively.

As shown in FIGS. 2 and 3, in the illustrated embodiment, the first fixture 100 includes a first fixture body 110 having an inclined side surface in which the first positioning groove 111 is formed.

FIG. 6 shows a schematic perspective view of the second fixture 200 of the fixing system shown in FIG. 1, wherein the wires 20 have been positioned in the second positioning groove 211, and the cover 220 has been closed.

As shown in FIGS. 4 to 6, in the illustrated embodiment, the second fixture 200 mainly includes a second fixture body 210 and a cover 220. The second positioning groove 211 is formed in an inclined side face of the second fixture body 210. The cover 220 is pivotally connected to the second fixture body 210, and is rotatable between an opened position shown in FIG. 5 and a closed position shown in FIG. 6.

As shown in FIG. 6, the wires (20) are clamped and fixed in the second positioning groove 211 when the cover 220 is in the closed position.

As shown in FIGS. 4 to 6, in the illustrated embodiment, the second fixture 200 further includes a locking device 230, 233 provided on the second fixture body 210 and adapted to lock the cover 220 in the closed position.

As shown in FIGS. 4 to 6, in the illustrated embodiment, one end 221 of the cover 220 is pivotally connected to one end of the second fixture body 210. The locking device 230, 233 is provided on the other end of the second fixture body 210 and is adapted to lock the other end 222 of the cover 220.

As shown in FIGS. 4 to 6, in the illustrated embodiment, the locking device 230, 233 mainly includes a locking member 230 and a spring 233. The locking member 230 is pivotally connected to the second fixture body 210 and is rotatable between a locked position and an unlocked position. The spring 233 is provided on the second fixture body 210 and is adapted to hold the locking member 230 in the locked position. The spring 233 is constructed to push the locking member 230 to the locked position when the cover 220 is rotated to the closed position, thereby holding the cover 220 in the closed position.

As shown in FIGS. 4 to 6, in the illustrated embodiment, the spring 233 pushes one end 231 of the locking member 230 when the cover 220 is rotated to the closed position, so that the other end 232 of the locking member 230 is pressed on the other end 222 of the cover 220, thereby holding the cover 220 in the closed position.

As shown in FIGS. 4 to 6, in the illustrated embodiment, when a pressing force, which is opposite to a pushing force applied by the spring 233, is applied on the end 231 of the locking member 230, the locking member 230 is driven to rotate to the unlocked position so that the locking member 230 is disengaged from the cover 220.

As shown in FIGS. 1 and 7, in the illustrated embodiment, the fixing system further comprises a support frame 300, on which the second fixture 200 is supported obliquely. Therefore, the end conductors 21 of the wires 20 are pressed against the surfaces of the solder pads 11, respectively, due to the gravity of the second fixture 200 itself, and the circuit board 10 is kept in the first positioning groove 111. In this way, it may not need to provide an additional pressing plate for the first fixture 100 for holding the circuit board 10 in the first positioning groove 111, simplifying the configuration of the fixing system.

As shown in FIGS. 3 and 5, in the illustrated embodiment, the circuit board 10 has a row of solder pads 11. The second positioning groove 211 is adapted to accommodate and position a row of wires 20. The row of wires 20 is adapted to be soldered to the row of solder pads 11 on the circuit board 10, respectively.

Although it has not been shown, in an embodiment of the present invention, it is appreciated to form a row of V-shaped or U-shaped recesses on the bottom surface 211a of the second positioning groove 211 so as to position a row of wires 20, respectively.

In another embodiment of the present invention, it discloses a method of soldering the wires 20 to the circuit board 10, comprising the following steps:

SI 00: providing the fixing system as set forth in any one of the aforementioned embodiments;

S200: fixing and positioning the circuit board 10 and the wires 20 in the first positioning groove 111 and the second positioning groove 211, respectively; and

S300: heating the solder on the circuit board 10 to melt the solder so as to solder end conductors 21 of the wires 20 onto the solder pads 11 of the circuit board 10 by the melted solder, respectively.

During soldering, in the aforementioned step S300, because the circuit board 10 is provided obliquely on the horizontal surface of the base 1, the melted solder will flow downward along a surface of the circuit board 10 provided obliquely on the base 1 due to the gravity of the solder itself. In this way, it is possible to increase the fluidity of the melted solder. Thus, it may increase the coverage rate of the solder and make the soldered surfaces smooth and flat, thereby improving the soldering quality.

It should be appreciated for those skilled in this art that the above embodiments are intended to be illustrated, and not restrictive. For example, many modifications may be made to the above embodiments by those skilled in this art, and various features described in different embodiments may be freely combined with each other without conflicting in configuration or principle.

Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.

As used herein, an element recited in the singular and proceeded with the word "a" or "an" should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to "one embodiment" of the present invention are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments "comprising" or "having" an element or a plurality of elements having a particular property may include additional such elements not having that property.

Claims

WHAT IS CLAIMED IS:

1. A fixing system, comprising:

a base (1); and

at least one set of clamping devices (2) mounted on the base (1),

characterized in that:

each set of clamping devices (2) includes a first fixture (100), in which a first positioning groove (111), adapted to accommodate and position a circuit board (10), is formed; and

a first angle defined between a bottom surface (111a) of the first positioning groove (111) and a horizontal surface of the base (1) is more than 0 degree and less than 90 degrees when the first fixture (100) is mounted on the base (1), so that the circuit board (10) positioned in the first positioning groove (111) is inclined with respect to the horizontal surface of the base (1).

2. The fixing system of claim 1, wherein,

each set of clamping devices (2) further includes a second fixture (200), in which a second positioning groove (211), adapted to accommodate and position at least one wire (20), is formed;

a second angle defined between a bottom surface (211a) of the second positioning groove (211) and the horizontal surface of the base (1) is more than 0 degree and less than 90 degrees when the second fixture (200) is mounted on the base (1).

3. The fixing system of claim 2, wherein,

a sum of the first angle and the second angle is about 90 degrees, so that the bottom surface (111a) of the first positioning groove (111) is substantially perpendicular to the bottom face (211a) of the second positioning groove (211) when the first fixture (100) and the second fixture (200) are mounted on the base (1).

4. The fixing system of claim 2 or 3, wherein,

an end conductor (21) of each wire (20) is bent by about 90 degrees with respect to the wire (20); and

the end conductors (21) of the wires (20) are aligned with solder pads (11) on the circuit board (10) and are abutted against surfaces of the solder pads (11), respectively, when the circuit board (10) and the wires (20) are positioned in the first positioning groove (111) and the second positioning groove (211), respectively.

5. The fixing system of claim 4, wherein,the first fixture (100) includes a first fixture body (110) having an inclined side face in which the first positioning groove (111) is formed.

6. The fixing system of claim 5, wherein the second fixture (200) includes:

a second fixture body (210) having an inclined side face in which the second positioning groove (211) is formed; and

a cover (220) that is pivotally connected to the second fixture body (210) and is rotatable between an opened position and a closed position, and

wherein the wires (20) are clamped and fixed in the second positioning groove (211) when the cover (220) is in the closed position.

7. The fixing system of claim 6, wherein, the second fixture (200) further includes: a locking device (230, 233) provided on the second fixture body (210) and adapted to lock the cover (220) in the closed position.

8. The fixing system of claim 7, wherein,

one end (221) of the cover (220) is pivotally connected to one end of the second fixture body (210); and

the locking device (230, 233) is provided on the other end of the second fixture body (210) and is adapted to lock the other end (222) of the cover (220).

9. The fixing system of claim 8, wherein, the locking device (230, 233) includes: a locking member (230) that is pivotally connected to the second fixture body (210) and is rotatable between a locked position and an unlocked position; and

a spring (233) provided on the second fixture body (210) and adapted to hold the locking member (230) in the locked position, and

wherein the spring (233) is constructed to push the locking member (230) to the locked position when the cover (220) is rotated to the closed position and hold the cover (220) in the closed position.

10. The fixing system of claim 9, wherein,the spring (233) pushes one end (231) of the locking member (230) when the cover (220) is rotated to the closed position, so that the other end (232) of the locking member (230) is pressed on the other end (222) of the cover (220), thereby holding the cover (220) in the closed position.

11. The fixing system of claim 10, wherein,when a pressing force, which is opposite to a pushing force applied by the spring (233), is applied on the end (231) of the locking member (230), the locking member (230) is driven to rotate to the unlocked position so that the locking member (230) is disengaged from the cover (220).

12. The fixing system of any one of claims 6-11, wherein,the fixing system further comprises a support frame (300), on which the second fixture (200) is supported obliquely.

13. The fixing system of claim 12, wherein,the end conductors (21) of the wires (20) are pressed against the surfaces of the solder pads (11), respectively, due to the gravity of the second fixture (200) itself, and the circuit board (10) is kept in the first positioning groove (111).

14. The fixing system of any one of claims 4-13, wherein,the circuit board (10) has a row of solder pads (11), the second positioning groove (211) is adapted to accommodate and position a row of wires (20), and the row of wires (20) are adapted to be soldered to the row of solder pads (11) on the circuit board (10).

15. The fixing system of claim 14, wherein,a row of V-shaped or U-shaped recesses are formed on the bottom surface (211a) of the second positioning groove (211) so as to position the row of wires (20), respectively.

16. A method of soldering a wire to a circuit board, characterized in that comprises steps of:

S100: providing the fixing system of claim 4;

S200: fixing and positioning the circuit board (10) and the wires (20) in the first positioning groove (111) and the second positioning groove (211), respectively; and

S300: heating the solder on the circuit board (10) to melt the solder so as to solder end conductors (21) of the wires (20) onto the solder pads (11) of the circuit board (10) by the melted solder, respectively,

wherein during soldering, the melted solder flows downward along the surface of the circuit board (10) provided obliquely on the base (1) due to the gravity of the solder itself.