JP2005042170A - Printed circuit board plating fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board plating fixture in which width dimensions can be adjusted in accordance with the size of a printed circuit board, and with which a plating film thickness can be made uniform over the whole face of the printed circuit board. <P>SOLUTION: In the printed circuit board plating fixture, a carriage 1 sliding by a carrier mechanism C provided on the side of a plating device body is provided with: supporting members 4a and 4b holding a printed circuit board W; shielding boards 2 and 3 arranged closely to both the sides of the printed circuit board W held by the supporting members 4a and 4b; and a position adjustment mechanism 5 adjusting the positions of the shielding boards 2 and 3 and adjusting the positions of the supporting members 4a and 4b holding the printed circuit board W between the shielding boards 2 and 3 in accordance with the width dimensions of the printed circuit board W. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a printed wiring board plating jig for plating while holding and transporting a printed wiring board in a copper sulfate plating tank, and more specifically, the plating film thickness can be uniformly applied to the entire surface of the printed wiring board. The present invention relates to a printed wiring board plating jig with a variable shielding plate.

  Conventionally, as shown in FIGS. 6A and 6B, a plating jig for copper sulfate plating is provided with a copper frame 10 made of a copper frame and having a V-shaped cross section on a suspension member. A jig in which the frame 10 is positioned on both sides of the printed wiring board W and the printed wiring board W is sandwiched and fixed in the groove portion of the V-shaped frame 11 is mainly used. Further, as shown in FIGS. 7A and 7B, a jig provided with upper and lower holding clamps 13 and 14 on a rectangular frame 12, and a jig for sandwiching the printed wiring board W between the frames 15 and 16. There is. (For example, see Patent Document 1)

  In addition, a plating apparatus developed and put on the market in recent years is usually called a rackless vertical continuous conveyance plating apparatus. This apparatus does not use a plating jig, and a uniform plating film is formed on the entire surface of the printed wiring board. In order to form the thickness, there is an apparatus for bringing the printed wiring boards close to each other and feeding them into a copper sulfate plating tank so as to prevent the current concentration from occurring on both sides of the printed wiring board and to form the film thickness uniformly.

  In the plating jig for copper sulfate plating in FIG. 6, plating is performed by bringing the printed wiring board W into contact with the groove portion of the V-shaped frame 11. In this printed wiring board W, the contact portion and the vicinity thereof are unplated. There was a defect that the film was not in a state or the plating film thickness was not formed as specified. Further, in the plating jigs of FIGS. 7 (a) and 7 (b), there is a problem that the portion sandwiched between the frames is in an unplated state, the mounting work of the printed wiring board is complicated, and the printed wiring There was a drawback that it was necessary to manufacture a jig to match the size of the plate.

  In addition, although the rackless vertical continuous transport plating apparatus has the advantage of not using a plating jig, in such an apparatus, it is necessary to provide a special mechanism for the printed circuit board corresponding to several sizes in the apparatus body. However, the existing equipment cannot be used, and there is a drawback that the equipment cost for constructing a new equipment increases. In addition, as a result, the manufacturing cost of the printed wiring board increases, which is not preferable.

JP 2001-234400 A (paragraph numbers [0006] to [0011] in the specification, FIG. 5 of the drawings)

  The present invention has been made in view of the above-described problems, and the width dimension can be adjusted according to the size of the printed wiring board, and the plating film thickness can be made uniform over the entire surface of the printed wiring board. An object of the present invention is to provide a printed wiring board plating jig that can be used.

  In the present invention, the above-described problem has been achieved, and the invention of claim 1 includes a holding member that holds a printed wiring board on a transfer body that slides by a transfer mechanism provided on the plating apparatus main body side, and the holding member A shielding plate arranged close to both side surfaces of the printed wiring board held by the step, and setting the position of the shielding plate according to the width dimension of the printed wiring board and holding the printed wiring board A printed wiring board plating jig comprising a position adjusting mechanism for setting a position of a member.

  According to a second aspect of the present invention, in the first aspect, the position adjusting mechanism is provided with the shielding plate provided in proximity to both side surfaces of the printed wiring board and the clamping member for holding the printed wiring board. And a second position variable rack, and a position variable pinion that meshes with the first and second position variable racks, and the shielding plate is adjusted according to the dimension width of the printed wiring board by the position adjusting mechanism. The printed wiring board plating jig according to claim 1, wherein the printed wiring board plating jig is a mechanism for performing the above.

  According to a third aspect of the present invention, the position adjusting mechanism includes a position variable pinion, first and second position variable racks that are disposed opposite to each other so as to mesh with the position variable pinion and are variable in a bilaterally symmetric direction. The first and second position variable racks are provided with the shielding plate disposed close to both sides of the printed wiring board, and the clamping member for holding the printed wiring board is provided. And the second position variable rack can be varied in the left-right symmetrical direction so that the shielding plate can be positioned according to the dimension width of the printed wiring board, and at the same time, the printed wiring board is held by the clamping member. The printed wiring board plating jig according to claim 1.

  In the present invention, the shielding plate preferably has a V-shaped cross section, but may be U-shaped. Since the printed wiring board is arranged close to the V-shaped or U-shaped groove portion of the shielding plate, and the printed wiring board is shaken by the flow of the plating solution, it is restricted to the range of the groove portion. There is an advantage that the plating film thickness is not affected. Further, in the case of a U-shaped shielding plate, there is an advantage that the plating film thickness on the side surface of the printed wiring board can be made more uniform by forming a large number of openings in the shielding plate. The same applies to the shape.

  According to the first aspect of the present invention, the conveyance body that is slid by the conveyance mechanism provided on the plating apparatus main body side, the clamping member that holds the printed wiring board, and the both sides of the printed wiring board that are clamped by the clamping member Since it is a printed wiring board plating jig provided with a shielding plate arranged close to each other and a position adjusting mechanism for adjusting the position of the shielding plate according to the width dimension of the printed wiring board, various sizes of the printed wiring board are available. Even if the width dimension of the printed wiring board is adjusted by the position adjusting mechanism according to the width dimension, the printed wiring board is arranged between the shielding boards and held by the holding member, thereby being printed. There is an advantage that the mounting to the plating jig can be completed in a short time, and it is possible to easily adjust to the width dimension of the printed wiring board by the position adjustment mechanism, and it is matched to the size of the printed wiring board There is no need to manufacture a new jig, the manufacturing cost can be reduced, and the shield plate can be placed close to the side wall surface of the printed wiring board, avoiding excessive current concentration on the side surface of the printed wiring board. There is an advantage that a uniform plating film thickness can be formed on both sides of the printed wiring board.

  According to the invention of claim 2, the position adjusting mechanism is provided with the shielding plate provided in proximity to both sides of the printed wiring board and the clamping member for holding the printed wiring board. The position adjusting mechanism includes first and second position variable racks and position variable pinions that mesh with the first and second position variable racks, and the position adjusting mechanism causes the shielding plate to correspond to the dimension width of the printed wiring board. Therefore, the first and second position-variable racks can be expanded and contracted in the printed wiring board surface direction (symmetrical direction), and the first and second racks can be adjusted according to the width dimension of the printed wiring board. 2 position-movable racks can be moved in the left-right symmetric direction to adjust the distance between the shielding plates, and there is an advantage that it is not necessary to manufacture a jig that matches the width of the printed wiring board, and the manufacturing cost is reduced. Can also be reduced Is advantageous adjustment is easy to fit the width of the wiring board. The position adjusting mechanism is provided on the transport body, and the first and second position variable racks are held by the transport body so that the first and second position variable racks are slidably movable in the left-right symmetric direction. It has a very simple structure with a variable position pinion in between, and has an advantage that the manufacturing cost can be reduced compared to manufacturing a plating jig in accordance with the size of the printed wiring board.

  According to a third aspect of the present invention, the position adjustment mechanism includes a position variable pinion and first and second position variable positions that are opposed to each other in mesh with the position variable pinion and are variable in the left-right symmetric direction. The first and second position-variable racks are provided with the shielding plate disposed close to both sides of the printed wiring board, and the clamping member for holding the printed wiring board is provided. The first and second position variable racks are varied in the left-right symmetric direction to position the shielding plate according to the dimension width of the printed wiring board, and at the same time, the printed wiring board is held by the holding member. Since the printed wiring board plating jig can be used, the first and second position variable racks can be moved in the left-right symmetric direction, and the distance between the shielding plates can be adjusted according to the width dimension of the printed wiring board. When In addition, the position of the clamping member is also moved, the printed wiring board is inserted between the shielding plates, and the printed wiring board is fixed by the clamping member, so that the preparation for the plating process can be completed easily and the plating process can be completed in a short time. There is an advantage that the printed wiring board can be attached and detached very easily.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. 1 is a perspective view showing an embodiment of a printed wiring board plating jig of the present invention, FIG. 2 is a perspective view of a main part of a position adjusting mechanism of the present embodiment, and FIG. 3 is a perspective view of a main part of a clamping member. FIG. 4 is a cross-sectional view of the main part showing the positional relationship between the printed wiring board and the shielding plate, and FIG.

  The present invention relates to a printed wiring board plating jig used in a plating apparatus. As shown in FIG. 1, a feed mechanism C and a work rail R are provided on the upper part of a copper sulfate plating tank. The printed wiring board plating jig is configured as a transport body (hereinafter referred to as a work carrier) 1 for immersing and transferring the inside of the plating tank while sliding the work rail R by the feed mechanism C. The work carrier 1 includes shielding plates 2 and 3 provided close to both side surfaces of the printed wiring board W, clamping members (hereinafter referred to as clamps) 4a and 4b for holding the printed wiring board W, and shielding. Prints provided with position adjustment mechanisms 5 including position variable pinions 6 and position variable racks 7 and 8, which are provided with plates 2 and 3 and clamps 4 a and 4 b and can be adjusted in position according to the width of the printed wiring board W. This is a wiring board jig. The shielding plates 2 and 3 are suspended from the support rods 7a and 8a at the outer ends of the position variable racks 7 and 8, respectively.

  The work carrier 1 will be described with reference to FIG. 2. A straddle portion 1a that slides on the work rail R is provided, and a protrusion 1b is formed on the top of the straddle portion 1a. The work carrier 1 is moved by being pushed by a pusher Ca provided in the feed mechanism C, and suspended portions 1c and 1d are provided below both sides of the straddle portion 1a. The front shape of the work carrier 1 is substantially U-shaped, and the through-holes 1e and 1f are provided in the suspension part 1c, and the through-holes 1g and 1h are provided in the suspension part 1d, respectively. A position adjusting mechanism 5 is formed on the suspended portions 1 c and 1 d of the work carrier 1.

  The position adjusting mechanism 5 is configured by position variable racks 7 and 8 and a position variable pinion 6 which are installed on the work carrier 1 and are opposed to each other. The position variable racks 7 and 8 mesh with the position variable pinion 6 and are moved to the left and right. It is provided so as to be extendable in the symmetric direction, that is, in the direction of the printed wiring board W surface. Specifically, the position variable rack 7 is inserted into the through holes 1e and 1g, and the position variable rack 8 is inserted into the through holes 1f and 1h and provided in the shape of a penetrating tree. The variable pinion 6 is configured to mesh and slide in a bilaterally symmetric direction (equal to opposite directions). The position variable pinion 6 is pivotally supported by a bridging member or the like provided on the work carrier 1 (not shown). On the outer ends of the position variable racks 7, 8, shielding plates 2, 3 arranged close to both side surfaces of the printed wiring board W are fixed, respectively. Furthermore, clamps 4a and 4b are fixed to the position variable racks 7 and 8 on the inner side of the position where the shielding plate 3 is fixed. When the position variable racks 7 and 8 are slid, the position variable pinion 6 can be rotated to arbitrarily set the interval between the shielding plates 2 and 3, and the position variable racks 7 and 8 are slid in the left-right symmetrical direction. As it moves, the clamps 4a and 4b also move.

The clamps 4a and 4b are provided on the position variable racks 7 and 8, and sandwich and hold the printed wiring board W, which also serves as a cathode electrode. As shown in FIG. 3, one end of the plate member 4 ₁ is fixed to each of the variable position racks 7,8, the movable plate piece 4 ₂ is rotatably supported by a support member 4 ₃ to the plate-like member 4 _1, plate Jo member 4 ₁ and the movable plate piece 4 ₂ Togaita spring 4 ₄ and the compression spring 4 ₅ is provided, the electrode member 4 ₆ are each provided at the tip of the plate-like member 4 ₁ and the movable plate piece 4 ₂ . Clamp 4a, the 4b, the printed wiring board W can be held rigidly clamped electrode member 4 _6.

  In this way, the position variable racks 7 and 8 are slid in the left-right symmetrical direction, and the shielding plates 2 and 3 are positioned close to both side surfaces of the printed wiring board W in accordance with the width dimension of the printed wiring board W. At the same time, the positions of the clamps 4a and 4b are variable, and the printed wiring board W can be held by the clamps 4a and 4b.

  Next, the present embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view of the printed wiring board side portion and the shielding plate. The shielding plates 2 and 3 are made of copper and have a V shape so as to cover both sides of the printed wiring board W. Thus, the printed wiring board W is disposed close to both side surfaces, and both side surfaces of the printed wiring board W are covered with the shielding plates 2 and 3. The shielding plates 2 and 3 are arranged so as not to contact the printed wiring board W. The horizontal dimension A of the V-shaped shielding plates 2 and 3 is 30 to 40 mm, and the distance B from the side surface of the printed wiring board W is 5 to 10 mm. The angles θ of the shielding plates 2 and 3 are set to 60 to 90 °, respectively. The shielding plates 2 and 3 are not limited to the V shape, and may be formed into a U shape by bending a copper plate (not shown). In the case of a U-shaped shielding plate, an opening or a notch is formed in the bent piece bent into a U-shape as necessary, such as a round hole, a long hole, or a slit-like hole, and current concentration on the side surface of the printed wiring board The plating thickness may be uniform (not shown) by adjusting so as not to occur. Also in the case of this shielding plate, the printed wiring board is disposed so as to be close to the side so as not to contact the U-shaped shielding plate. Even when the printed wiring board W is shaken with the flow of the etching solution, only the lower end portion of the printed wiring board W is in contact with the V-shaped or U-shaped shielding plate. Can be supported with little contact with the shielding plates 2 and 3, and a uniform plating film thickness is formed on the entire surface of the printed wiring board.

Next, the operation when the printed wiring board W is mounted on the printed wiring board plating jig of this embodiment will be described with reference to FIG. As shown in FIG. 5A, when the position variable racks 7 and 8 are extended outwardly as indicated by an arrow X, the position variable pinion 6 rotates counterclockwise Xa, and the shielding plates 2 and 8 are rotated. It is possible to mount a printed wiring board W having an arbitrary width between the shielding plates 2 and 3. As shown in FIG. 5B, when the position variable racks 7 and 8 are contracted inward as indicated by the arrow Y, the position variable pinion 6 is rotated clockwise Ya and the shielding plates 2 and 2 are rotated. The dimension between 3 is narrowed, and the distance between the shielding plates 2 and 3 is set to a dimension according to the width dimension of the printed wiring board W. The printed wiring board W is inserted between the shielding plates 2 and 3, and as shown in FIG. 5C, the printed wiring board W is lifted up to the positions of the clips 4a and 4b, and the upper portion of the printed wiring board W is clipped to the clip 4a. , 4b, and the preparation to put into the plating tank is completed. Thereafter, as shown in FIGS. 1 and 2, the work carrier 1 is placed on the work rail R, and the printed wiring board W is immersed in the plating tank by the feed mechanism C to perform plating. When the printed wiring board was plated with the printed wiring board plating jig of this embodiment, a uniform plating film thickness was formed on the entire surface. Moreover, it is very easy to attach and detach the printed wiring board to and from the printed wiring board plating jig.

  Although the printed wiring board plating jig of the present invention has been described with respect to copper plating in the above embodiment, it is apparent that the present invention can be applied to plating of any other metal without being limited to copper plating.

It is a perspective view which shows embodiment of the printed wiring board plating jig | tool of this invention. It is a principal part perspective view of the position adjustment mechanism of this embodiment. It is a principal part perspective view of the clamping member of this embodiment. It is principal part sectional drawing which shows the positional relationship of the printed wiring board of this embodiment, and a shielding board. (A)-(c) is a figure for demonstrating the operation | movement at the time of hold | maintaining a printed wiring board in this embodiment. (A) is a top view of the conventional printed wiring board plating jig, (b) is AA sectional drawing. (A) is a perspective view of a conventional example, (b) is a perspective view of another conventional example.

Explanation of symbols

1 Carrier (work carrier)
2,3 Shield plate 4a, 4b Clamping member (clamp)
5 Position adjustment mechanism 6 Position variable pinion 7, 8 Position variable rack C Transport mechanism R Work rail W Printed wiring board

Claims (3)

  A holding member that holds a printed wiring board on a transfer body that slides by a transfer mechanism provided on the plating apparatus main body side, and a shielding plate that is arranged close to both side surfaces of the printed wiring board held by the holding member, And a position adjusting mechanism for setting the position of the clamping member for holding the printed wiring board and for setting the position of the shielding board according to the width dimension of the printed wiring board. Plating jig.   First and second position variable racks in which the position adjusting mechanism is provided with the shielding plate provided in proximity to both sides of the printed wiring board and the clamping member for holding the printed wiring board; It comprises a position variable pinion that meshes with the first and second position variable racks, and the shielding plate is a mechanism that adjusts according to the dimension width of the printed wiring board by the position adjusting mechanism. The printed wiring board plating jig of Claim 1.   The position adjusting mechanism is composed of a position variable pinion and first and second position variable racks that are arranged opposite to each other in mesh with the position variable pinion and are variable in a bilaterally symmetric direction. The two position variable racks are provided with the shielding plate disposed close to both sides of the printed wiring board and the holding member for holding the printed wiring board. 2. The printed wiring board according to claim 1, wherein the shielding board can be positioned in accordance with a dimension width of the printed wiring board while being varied in a symmetric direction, and at the same time the printed wiring board is held by the holding member. Plate plating jig.

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