CN108620704B - Clamping system and welding method - Google Patents
Clamping system and welding method Download PDFInfo
- Publication number
- CN108620704B CN108620704B CN201710160007.3A CN201710160007A CN108620704B CN 108620704 B CN108620704 B CN 108620704B CN 201710160007 A CN201710160007 A CN 201710160007A CN 108620704 B CN108620704 B CN 108620704B
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- clamp
- circuit board
- positioning groove
- clamping system
- base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a clamping system, comprising: a base; and at least one set of clamping devices mounted on the base. Each set of clamping device comprises a first clamp, and a first positioning groove suitable for containing and positioning the circuit board is formed in the first clamp. When the first clamp is installed on the base, the bottom surface of the first positioning groove and the horizontal surface of the base form a first included angle which is larger than zero degree and smaller than degree, so that the circuit board positioned in the first positioning groove forms an inclined angle relative to the horizontal surface of the base. In the invention, because the clamping system can obliquely hold the circuit board at the preset position, the melted welding flux can automatically flow downwards along the oblique circuit board during welding, the fluidity of the welding flux is improved, the coverage rate of the welding flux can be improved, and the surface of a welding point after welding can be smooth and flat, thereby improving the welding quality.
Description
Technical Field
The present invention relates to a clamping system, and more particularly to a clamping system adapted to clamp a circuit board and a wire to be soldered to the circuit board. The invention also relates to a soldering method for soldering a conductor to a circuit board.
Background
In the field of electronic device manufacturing, it is often necessary to solder wires to pads on a circuit board. To ensure the quality of soldering, it is necessary to align the end conductors of the wires with the pads on the circuit board and to press the end conductors of the wires tightly against the pads on the circuit board before soldering. At the time of soldering, the flux provided at the pad may be heated by an iron so that the flux is melted, whereby the end conductor of the wire is soldered to the pad on the circuit board by the flux.
However, in the prior art, the circuit board is generally horizontally placed at the time of soldering. Therefore, the molten flux does not easily flow at the time of soldering, which may reduce the coverage of the flux, resulting in that the end conductors of the wires cannot be completely soldered to the pads of the circuit board, degrading the soldering quality. In addition, since the molten flux does not easily flow, the surface of the welded joint after welding is also uneven, further degrading the welding quality.
Disclosure of Invention
An object of the present invention is to solve at least one of the above problems and disadvantages in the prior art.
According to an object of the present invention, there is provided a clamping system capable of holding a circuit board at a predetermined position obliquely so that molten solder can automatically flow down along the oblique circuit board at the time of soldering, improving fluidity of the solder.
According to an aspect of the present invention, there is provided a clamping system comprising: a base; and at least one set of clamping devices mounted on the base. Each set of clamping device comprises a first clamp, and a first positioning groove suitable for containing and positioning the circuit board is formed in the first clamp. When the first clamp is installed on the base, the bottom surface of the first positioning groove and the horizontal surface of the base form a first included angle which is larger than zero degree and smaller than degree, so that the circuit board positioned in the first positioning groove forms an inclined angle relative to the horizontal surface of the base.
According to an exemplary embodiment of the present invention, each set of the clamping devices further comprises a second clamp having a second positioning slot formed thereon adapted to receive and position a wire; when the second clamp is installed on the base, a second included angle which is larger than zero degrees and smaller than degrees is formed between the bottom surface of the second positioning groove and the horizontal surface of the base.
According to another exemplary embodiment of the present invention, a sum of the first included angle and the second included angle is equal to degrees, that is, a bottom surface of the first positioning groove is perpendicular to a bottom surface of the second positioning groove when the first jig and the second jig are mounted on the base.
According to another exemplary embodiment of the present invention, the end conductor of the wire is bent by a degree with respect to the wire; when the circuit board and the wires are positioned in the first and second positioning grooves, respectively, the end conductors of the wires are aligned with the solder pads on the circuit board and abut against the surfaces of the solder pads.
According to another exemplary embodiment of the present invention, the first jig includes a first jig main body, and the first positioning groove is formed on an inclined side surface of the first jig main body.
According to another exemplary embodiment of the present invention, the second clamp includes: a second jig main body, the second positioning groove being formed on an inclined side surface of the second jig main body; and a cover pivotally connected to the second clamp body and rotatable between an open position and a closed position, wherein a wire can be clamped and secured in the second detent when the cover is in the closed position.
According to another exemplary embodiment of the invention, the second clamp further comprises: a locking device disposed on the second clamp body adapted to lock the cover in the closed position.
According to another exemplary embodiment of the present invention, one end of the cover is pivotally connected to one end of the second clamp body; the locking device is provided at the other end of the second clamp body and adapted to be locked to the other end of the cover.
According to another exemplary embodiment of the present invention, the locking device comprises: a lock pivotally connected to the second clamp body and rotatable between a locked position and an unlocked position; and a spring provided on the second clamp body and adapted to push the locking piece to the locking position, the spring pushing the locking piece to the locking position when the cover is rotated to the closed position, thereby locking the cover in the closed position.
According to another exemplary embodiment of the present invention, when the cover is rotated to the closed position, the spring pushes against one end of the locking member so that the other end of the locking member presses against the other end of the cover, thereby locking the cover in the closed position.
According to another exemplary embodiment of the present invention, when a pressing force opposite to the pushing force applied by the spring is applied to one end of the locking member, the locking member may be rotated to the unlocking position so that the locking member is separated from the cover.
According to another exemplary embodiment of the invention, the clamping system further comprises a support frame on which the second clamp is supported obliquely.
According to another exemplary embodiment of the present invention, the end conductor of the wire is pressed against the surface of the pad by the own weight of the second jig, and holds the circuit board in the first positioning groove.
According to another exemplary embodiment of the present invention, the circuit board has a row of pads thereon, and the second positioning groove is adapted to receive and position a row of wires adapted to be soldered to the row of pads on the circuit board.
According to another exemplary embodiment of the present invention, a row of V-shaped or U-shaped grooves for positioning the row of wires is formed on a bottom surface of the second positioning groove.
According to another aspect of the present invention, there is provided a method of soldering a wire to a circuit board, comprising the steps of:
s100: providing the clamping system;
s200: clamping and positioning a circuit board and a wire in the first positioning groove and the second positioning groove, respectively;
s300: heating flux on a circuit board so that the flux melts, thereby soldering the end conductor of the wire to a pad of the circuit board by the flux;
wherein, during soldering, the molten solder can flow downwards along the surface of the circuit board obliquely arranged on the base under the action of the dead weight.
In the foregoing respective exemplary embodiments according to the present invention, since the clamping system can hold the circuit board at the predetermined position obliquely, so that the molten solder can automatically flow down along the oblique circuit board at the time of soldering, the fluidity of the solder is improved, the coverage of the solder can be improved, and the surface of the soldered dot after soldering can be made smooth and flat, thereby improving the soldering quality.
Other objects and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings, and may assist in a comprehensive understanding of the invention.
Drawings
FIG. 1 shows a perspective schematic view of a clamping system according to an example embodiment of the invention;
FIG. 2 is a perspective view of the first clamp of the clamping system of FIG. 1, wherein the circuit board has not yet been positioned in the first positioning slot;
FIG. 3 shows a perspective view of a first clamp of the clamping system of FIG. 1, wherein a circuit board has been positioned into a first positioning slot;
FIG. 4 shows a perspective view of a second clamp of the clamping system of FIG. 1, wherein the wire has not yet been positioned in a second positioning slot;
FIG. 5 shows a perspective view of a second clamp of the clamping system of FIG. 1, wherein the wire has been positioned into the second detent, but the cover is not closed;
FIG. 6 shows a perspective view of a second clamp of the clamping system shown in FIG. 1, wherein the wire has been positioned into a second detent and the cover has been closed;
fig. 7 shows a longitudinal section of the clamping system shown in fig. 1.
Detailed Description
The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention and should not be construed as limiting the invention.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
According to one general technical concept of the present invention, there is provided a clamping system including: a base; and at least one set of clamping devices mounted on the base. Each set of clamping device comprises a first clamp, and a first positioning groove suitable for containing and positioning the circuit board is formed in the first clamp. When the first clamp is installed on the base, the bottom surface of the first positioning groove and the horizontal surface of the base form a first included angle which is larger than zero degree and smaller than degree, so that the circuit board positioned in the first positioning groove forms an inclined angle relative to the horizontal surface of the base.
Fig. 1 shows a schematic perspective view of a clamping system according to an exemplary embodiment of the invention.
As shown in fig. 1, in the illustrated embodiment, the clamping system basically comprises a base 1 and at least one set of clamping means 2. At least one set of clamping means 2 is mounted on a horizontal surface of the base 1. In the illustrated embodiment, two sets of gripping devices 2 are mounted on the base 1. Of course, one, three or more sets of holding devices 2 may be mounted on the base 1 as desired.
Fig. 2 shows a perspective view of the first clamp 100 of the clamping system shown in fig. 1, wherein the circuit board 10 has not yet been positioned in the first positioning slot 111; fig. 3 shows a perspective view of the first clamp 100 of the clamping system shown in fig. 1, wherein the circuit board 10 has been positioned into the first positioning slot 111.
As shown in fig. 1, 2 and 3, in the illustrated embodiment, each set of gripping devices 2 comprises a first clamp 100. As shown in fig. 2 and 3, a first positioning groove 111 adapted to receive and position the circuit board 10 is formed on the first jig 100.
As shown in fig. 1, 2 and 3, in the illustrated embodiment, when the first jig 100 is mounted on the base 1, the bottom surface 111a of the first positioning groove 111 makes a first angle greater than zero degrees and less than 90 degrees with the horizontal surface of the base 1, so that the circuit board 10 positioned in the first positioning groove 111 makes an inclination with respect to the horizontal surface of the base 1.
FIG. 4 shows a perspective view of a second clamp 200 of the clamping system of FIG. 1, wherein the wire 20 has not yet been positioned in the second positioning slot 211; fig. 5 shows a perspective view of the second clamp 200 of the clamping system shown in fig. 1, wherein the wire 20 has been positioned into the second positioning slot 211, but the cover 220 is not closed.
As shown in fig. 1, 4 and 5, in the illustrated embodiment, each set of gripping devices 2 further comprises a second clamp 200. A second positioning groove 211 adapted to receive and position the wire 20 is formed on the second jig 200. When the second fixture 200 is mounted on the base 1, the bottom surface 211a of the second positioning groove 211 forms a second included angle greater than zero degrees and less than 90 degrees with the horizontal surface of the base 1.
Fig. 7 shows a longitudinal section of the clamping system shown in fig. 1.
In one embodiment of the present invention, as shown in fig. 1 and 7, the sum of the first angle and the second angle is equal to 90 degrees, that is, as shown in fig. 7, when the first jig 100 and the second jig 200 are mounted on the base 1, the bottom surface 111a of the first positioning groove 111 is perpendicular to the bottom surface 211a of the second positioning groove 211.
As shown in fig. 5 and 7, in the illustrated embodiment, the end conductor 21 of the wire 20 is bent 90 degrees with respect to the wire 20. As shown in fig. 7, when the circuit board 10 and the wire 20 are positioned in the first positioning groove 111 and the second positioning groove 211, respectively, the end conductor 21 of the wire 20 is aligned with the pad 11 on the circuit board 10 and abuts on the surface of the pad 11.
As shown in fig. 2 and 3, in the illustrated embodiment, the first clamp 100 includes a first clamp body 110. The first positioning groove 111 is formed on the inclined side surface of the first jig main body 110.
Fig. 6 shows a perspective view of the second clamp 200 of the clamping system shown in fig. 1, wherein the wire 20 has been positioned into the second positioning slot 211 and the cover 220 has been closed.
As shown in fig. 4 to 6, in the illustrated embodiment, the second jig 200 mainly includes a second jig main body 210 and a cover 220. The second positioning groove 211 is formed on the inclined side of the second clamp body 210. The cover 220 is pivotally connected to the second clamp body 210 to be rotatable between an open position shown in fig. 5 and a closed position shown in fig. 6.
As shown in fig. 6, the wire 20 may be retained and secured in the second retaining groove 211 when the cover 220 is in the closed position.
As shown in fig. 4 to 6, in the illustrated embodiment, the second clamp 200 further includes locking means 230, 233, the locking means 230, 233 being provided on the second clamp body 210, adapted to lock the cover 220 in the closed position.
As shown in fig. 4 to 6, in the illustrated embodiment, one end 221 of the cover 220 is pivotally connected to one end of the second clamp body 210. Locking means 230, 233 are provided at the other end of the second jig main body 210, adapted to be locked to the other end 222 of the cover 220.
As shown in fig. 4 to 6, in the illustrated embodiment, the locking device 230, 233 mainly includes a locking member 230 and a spring 233. The locking member 230 is pivotally connected to the second clamp body 210 to be rotatable between a locking position and an unlocking position. A spring 233 is provided on the second clamp body 210, adapted to urge the locking member 230 to the locking position. When the lid 220 is rotated to the closed position, the spring 233 urges the locking member 230 to the locked position, thereby locking the lid 220 in the closed position.
As shown in fig. 4 to 6, in the illustrated embodiment, when the cover 220 is rotated to the closed position, the spring 233 pushes against the one end 231 of the locking member 230, so that the other end 232 of the locking member 230 presses against the other end 222 of the cover 220, thereby locking the cover 220 in the closed position.
As shown in fig. 4 to 6, in the illustrated embodiment, when a pressing force opposite to the pushing force applied by the spring 233 is applied to the one end 231 of the locking member 230, the locking member 230 may be rotated to the unlocking position, so that the locking member 230 is separated from the cover 220.
As shown in fig. 1 and 7, in the illustrated embodiment, the clamping system further includes a support stand 300. The second clamp 200 is inclinedly supported on the support 300. Accordingly, the end conductor 21 of the wire 20 may be pressed against the surface of the pad 11 by the own weight of the second jig 200 and hold the circuit board 10 in the first positioning groove 111. Thus, it is unnecessary to provide the first jig 100 with an additional pressing plate for holding the circuit board 10 in the first positioning groove 111, so that the structure of the clamping system can be simplified.
As shown in fig. 3 and 5, in the illustrated embodiment, the circuit board 10 has an array of pads 11 thereon. The second positioning slot 211 is adapted to receive and position a row of wires 20. A row of wires 20 is adapted to be soldered to a row of pads 11 of the circuit board 10.
Although not shown, in one embodiment of the present invention, a row of V-shaped or U-shaped grooves for positioning a row of wires 20 may be formed on the bottom surface 211a of the second positioning groove 211.
In another exemplary embodiment of the present invention, a method of soldering a wire 20 to a circuit board 10 is also disclosed, comprising the steps of:
s100: providing the clamping system;
s200: the circuit board 10 and the conductive wires 20 are clamped and positioned in the first and second positioning grooves 111 and 211, respectively;
s300: the solder on the circuit board 10 is heated so that the solder melts, whereby the end conductors 21 of the wires 20 are soldered to the pads 11 of the circuit board 10 by the solder.
At the time of soldering, since the circuit board 10 is obliquely disposed on the horizontal surface of the base 1 in the aforementioned step S300, the molten solder flows down along the surface of the circuit board 10 obliquely disposed on the base 1 by its own weight. Thus, the fluidity of the flux can be improved, the coverage rate of the flux can be improved, and the surface of a welding spot after welding can be smooth and flat, so that the welding quality is improved.
It will be appreciated by those skilled in the art that the embodiments described above are exemplary and can be modified by those skilled in the art, and that the structures described in the various embodiments can be freely combined without conflict in structure or principle.
Although the present invention has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to be illustrative of preferred embodiments of the present invention and should not be construed as limiting the invention.
Although a few embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the appended claims and their equivalents.
It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. Furthermore, any reference signs in the claims shall not be construed as limiting the scope of the invention.
Claims (14)
1. A clamping system, comprising:
a base (1); and
at least one set of clamping devices (2) arranged on the base (1),
the method is characterized in that:
each set of clamping devices (2) comprises a first clamp (100), and a first positioning groove (111) suitable for containing and positioning a circuit board (10) is formed on the first clamp (100);
when the first jig (100) is mounted on the base (1), the bottom surface (111a) of the first positioning groove (111) forms a first included angle of more than zero degrees and less than 90 degrees with the horizontal surface of the base (1), so that the circuit board (10) positioned in the first positioning groove (111) forms an inclined angle with respect to the horizontal surface of the base (1);
each set of clamping devices (2) further comprises a second clamp (200), and a second positioning groove (211) suitable for containing and positioning the conducting wire (20) is formed on the second clamp (200); the clamping system further includes a support frame (300), the second clamp (200) is obliquely supported on the support frame (300), and the end conductor (21) of the wire (20) is pushed against the surface of the pad (11) of the circuit board (10) by the self-weight of the second clamp (200) and holds the circuit board (10) in the first positioning groove (111).
2. The clamping system of claim 1, wherein:
when the second clamp (200) is installed on the base (1), a second included angle which is larger than zero degrees and smaller than 90 degrees is formed between the bottom surface (211a) of the second positioning groove (211) and the horizontal surface of the base (1).
3. The clamping system of claim 2, wherein:
the sum of the first included angle and the second included angle is equal to 90 degrees, namely, when the first clamp (100) and the second clamp (200) are installed on the base (1), the bottom surface (111a) of the first positioning groove (111) is perpendicular to the bottom surface (211a) of the second positioning groove (211).
4. Clamping system according to claim 2 or 3, wherein:
the end conductor (21) of the wire (20) is bent by 90 degrees with respect to the wire (20);
when the circuit board (10) and the lead (20) are positioned in the first positioning groove (111) and the second positioning groove (211), respectively, the end conductor (21) of the lead (20) is aligned with a pad (11) on the circuit board (10) and abuts against the surface of the pad (11).
5. The clamping system of claim 4, wherein:
the first clamp (100) includes a first clamp body (110), and the first positioning groove (111) is formed on an inclined side surface of the first clamp body (110).
6. Clamping system according to claim 5, characterized in that the second clamp (200) comprises:
a second clamp main body (210), the second positioning groove (211) being formed on an inclined side of the second clamp main body (210); and
a cover (220) pivotally connected to the second clamp body (210) rotatable between an open position and a closed position,
wherein a wire (20) can be clamped and secured in the second detent (211) when the cover (220) is in the closed position.
7. The clamping system of claim 6, wherein the second clamp (200) further comprises:
locking means (230, 233) provided on the second clamp body (210) adapted to lock the cover (220) in the closed position.
8. The clamping system of claim 7, wherein:
one end (221) of the cover (220) is pivotally connected to one end of the second clamp body (210);
the locking means (230, 233) is provided at the other end of the second jig main body (210) and adapted to be locked to the other end (222) of the cover (220).
9. Clamping system according to claim 8, wherein the locking device (230, 233) comprises:
a lock (230) pivotally connected to the second clamp body (210) rotatable between a locked position and an unlocked position; and
a spring (233) provided on the second jig main body (210) and adapted to urge the locking piece (230) to the locking position,
when the lid (220) is rotated to the closed position, the spring (233) urges the locking member (230) to the locking position, thereby locking the lid (220) in the closed position.
10. The clamping system of claim 9, wherein:
when the lid (220) is rotated to the closed position, the spring (233) pushes against one end (231) of the locking member (230) so that the other end (232) of the locking member (230) presses against the other end (222) of the lid (220), thereby locking the lid (220) in the closed position.
11. The clamping system of claim 10, wherein:
when a pressing force opposite to the pushing force exerted by the spring 233 is exerted on one end 231 of the locking member 230, the locking member 230 may be rotated to the unlocking position so that the locking member 230 is separated from the cover 220.
12. The clamping system of claim 4, wherein:
the circuit board (10) is provided with a row of welding pads (11), the second positioning groove (211) is suitable for containing and positioning a row of conducting wires (20), and the row of conducting wires (20) is suitable for being welded to the row of welding pads (11) of the circuit board (10).
13. The clamping system of claim 12, wherein:
a row of V-shaped or U-shaped grooves are formed on the bottom surface (211a) of the second positioning groove (211) for positioning the row of wires (20).
14. A method of soldering a wire to a circuit board, comprising the steps of:
s100: providing the clamping system of claim 4;
s200: clamping and positioning a circuit board (10) and a wire (20) in the first positioning groove (111) and the second positioning groove (211), respectively;
s300: heating the solder on the circuit board (10) so that the solder melts, thereby soldering the end conductor (21) of the wire (20) to the pad (11) of the circuit board (10) by the solder,
wherein, during soldering, the molten solder flows down along the surface of the circuit board (10) obliquely arranged on the base (1) under the action of the self-weight.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710160007.3A CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
| PCT/EP2018/056585 WO2018167232A1 (en) | 2017-03-17 | 2018-03-15 | Fixing system and method of soldering wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710160007.3A CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108620704A CN108620704A (en) | 2018-10-09 |
| CN108620704B true CN108620704B (en) | 2021-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710160007.3A Active CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108620704B (en) |
| WO (1) | WO2018167232A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110142480A (en) * | 2019-05-21 | 2019-08-20 | 格力电器（武汉）有限公司 | Fixed device |
| CN111853566B (en) * | 2020-07-28 | 2023-11-21 | 安徽蓝锐电子科技有限公司 | Wire separating device |
| CN112894050A (en) * | 2020-12-29 | 2021-06-04 | 昆山信方达电子有限公司 | 5G filter welding set |
| CN113038733B (en) * | 2021-03-10 | 2023-04-14 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN115430878A (en) * | 2022-09-06 | 2022-12-06 | 江西弘耀达通讯有限公司 | Be used for assembling workshop circuit board welding set |
| CN115255548B (en) * | 2022-09-15 | 2023-06-23 | 深圳市艾贝特电子科技有限公司 | Circuit board welding fixture and operation method thereof |
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| CN205551732U (en) * | 2016-01-21 | 2016-09-07 | 北京兴科迪科技有限公司 | Be used for microphone pencil automatic weld to fix frock |
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| US20140076956A1 (en) * | 2012-09-20 | 2014-03-20 | Tyco Electronics Corporation | Soldering machine and method of soldering |
| CN105817731A (en) * | 2016-05-17 | 2016-08-03 | 杭州泛亚卫浴股份有限公司 | Circumferential automatic brazing welding equipment for pipes |
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| CN1216212A (en) * | 1997-01-23 | 1999-05-05 | 罗姆股份有限公司 | Printed board, mfg. method therefor and structure for connecting conductor elements to printed board |
| JPH11104820A (en) * | 1997-09-30 | 1999-04-20 | Pentel Kk | Positioning jig for soldering |
| CN101765333A (en) * | 2009-11-05 | 2010-06-30 | 海洋王照明科技股份有限公司 | Circuit board welding tool |
| CN205551732U (en) * | 2016-01-21 | 2016-09-07 | 北京兴科迪科技有限公司 | Be used for microphone pencil automatic weld to fix frock |
| CN205834548U (en) * | 2016-05-30 | 2016-12-28 | 白云飞 | A kind of welding tooling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108620704A (en) | 2018-10-09 |
| WO2018167232A1 (en) | 2018-09-20 |
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