JP2005294252A - Electronic circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device capable of simply aligning a bus bar terminal to an electronic component terminal, and for welding the electronic component terminal to the bus bar terminal without sandwiching them by a clip. <P>SOLUTION: The electronic component 1 is mounted to a resin case 2 in which the bus bar terminal 12 is incorporated, and the bus bar terminal 12 is electrically connected to a lead terminal 6 in the electronic component 1 while they are nearly, orthogonally crossed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connection between a bus bar terminal and an electronic component terminal of an electronic circuit device in which the electronic component is mounted on a resin case in which the bus bar terminal is inserted.

  Conventionally, a bus bar terminal and an electronic component terminal are connected electrically and mechanically by bending the bus bar terminal and the electronic component terminal at right angles and welding the folded terminals together. Yes.

  However, since the bus bar terminals and the terminals of the electronic parts are thin, it is difficult to align and superimpose them. Moreover, even if it aligns well, both a bus-bar terminal and the terminal of an electronic component will bend. For this reason, as shown in FIG. 6, for example, lead terminals 52 of electronic components 51 such as capacitors and bus bar terminals 54 provided on a resin case 53 for mounting these electronic components 51 are connected to, for example, clips and pliers. It was necessary to weld while being clamped by the clamp member 55, and welding was difficult.

Therefore, a method has been proposed in which the bus bar terminal and the electronic component terminal are provided with irregularities, and the bus bar terminal and the electronic component terminal are connected by fitting and welding them (for example, see Patent Document 1). According to this method, the bus bar terminal and the electronic component terminal can be easily aligned, but both the bus bar terminal and the electronic component terminal need to be processed. Moreover, the operation | work which fits an unevenness | corrugation is needed. There is a problem that it can be used only when the electronic component terminal is of a wide type.
JP 2000-90993 A

  The present invention provides an electronic circuit device that allows easy positioning of a bus bar terminal and an electronic component terminal and that can be welded without sandwiching the electronic component terminal and the bus bar terminal with a clip.

  The present invention employs the following configuration in order to solve the above problems. That is, the electronic circuit device of the present invention is an electronic circuit device in which an electronic component is mounted on a resin case containing a bus bar terminal, and the bus bar terminal and the electronic component terminal of the electronic component are electrically connected. And the electronic component terminal are electrically connected in a state of being substantially orthogonal to each other.

  According to the present invention, when the electronic component is mounted on the resin case, the electronic component terminal and the bus bar terminal are brought into contact with each other in a substantially perpendicular manner. Here, since the electronic component terminal or the bus bar terminal is inclined toward the bottom surface of the resin case by its own weight, the bus bar terminal and the electronic component terminal are more likely to come into contact with each other without a gap. Therefore, when connecting a bus-bar terminal and an electronic component terminal, the clamp member which clamps both is not required, and both can be connected easily.

Further, in the electronic circuit device of the present invention, the bus bar terminal is provided so as to protrude substantially perpendicularly to the bottom surface of the resin case, and the electronic component terminal extends substantially parallel to the bottom surface of the resin case, It is preferable to be placed at the tip of the bus bar terminal.
According to the present invention, when the electronic component is mounted on the resin case, the electronic component terminal is inclined toward the front end of the bus bar terminal by its own weight. As a result, the bus bar terminal and the electronic component terminal can be easily in contact with each other without any gap as described above, and both can be easily connected.

Moreover, it is preferable that the front-end | tip part of the said bus-bar terminal is bifurcated and the said electronic component terminal is engaged between these bifurcated.
According to the present invention, the electronic component terminal comes into contact with the center of the tip of the bus bar terminal, so that the electronic component terminal can be easily positioned. Therefore, the connection between the electronic component terminal and the bus bar terminal is facilitated.

In the electronic circuit device of the present invention, a flat portion that is substantially parallel to the length direction of the electronic component terminal is provided at a tip portion of the bus bar terminal, and the electronic component terminal is in surface contact with the flat portion. Preferably it is.
According to the present invention, even when the electronic component terminal is displaced, the contact state with the flat portion can be maintained, and the connection can be easily made.

In the electronic circuit device of the present invention, it is preferable that a stress absorbing portion that absorbs mechanical stress is provided along one of the bus bar terminal and the electronic component terminal along the length direction thereof. .
According to this invention, when the electronic component terminal and the bus bar terminal are connected, heat is applied to both of them, and even if one or both of them expands and contracts and mechanical stress is applied, the stress absorbing portion Absorbs stress. Therefore, the connection between the electronic component terminal and the bus bar terminal can be stabilized.

According to the electronic circuit device of the present invention, the following effects can be obtained.
1. By bending only one of the bus bar terminal and the electronic component terminal, both can be connected and manufacturing is easy.
2. When connecting, it is not necessary to hold it with a clamp member such as a clip.
3. It was possible to absorb mechanical stress.

Hereinafter, a first embodiment of an electronic circuit device according to the present invention will be described with reference to the drawings.
As shown in FIG. 1, the electronic circuit device according to the present embodiment includes an electronic component 1 such as a semiconductor device and a resin case 2 in which the electronic component 1 is arranged.

The electronic component 1 includes a semiconductor element (not shown) such as a transistor formed by a semiconductor process, a package resin 5 covering the semiconductor element, and lead terminals connected to the semiconductor element and projecting from three locations of the package resin 5 (Electronic component terminal) 6. And the electronic component 1 is arrange | positioned and fixed to the electronic component mounting recessed part 11 provided in the resin case 2 later mentioned.
The package resin 5 has a flat plate shape having a rectangular shape in plan view, and has a through hole 7 that can be easily fixed to the resin case 2 with screws.
The lead terminals 6 are provided in the same direction as the planar direction of the package resin 5. The lead terminal 6 is configured to be parallel to the bottom surface of the package resin 5 when the electronic component 1 is disposed and fixed in the electronic component mounting recess 11.

The resin case 2 is formed by resin injection molding, and three bus bars electrically connected to the electronic component mounting recess 11 in which the electronic component 1 is disposed and the lead terminal 6 of the disposed electronic component 1. And a terminal 12.
The electronic component mounting recess 11 is constituted by a recess provided in accordance with the shape of the package resin 5 of the electronic component 1.
In addition to tough pitch copper, which is widely used as a copper material, the bus bar terminal 12 is made of oxygen-free copper, phosphorous deoxidized copper, red copper (copper / zinc alloy), brass, phosphor bronze, or white (copper / nickel / zinc alloy). ), Copper-based materials such as beryllium copper for springs, copper phosphates for springs, and whites for springs are applicable. The bus bar terminal 12 is formed with a bent portion that is bent at a right angle to the base end, and is fixed to the resin case 2 so as to protrude perpendicularly to the bottom surface of the resin case 2. It is provided as follows. Moreover, the front-end | tip part of the bus-bar terminal 12 is bifurcated.
Here, when the electronic component 1 is disposed in the electronic component mounting recess 11, the tip of the lead terminal 6 of the electronic component 1 is configured to coincide with the bifurcated center formed at the tip of the bus bar terminal 12. . And the front-end | tip of the bus-bar terminal 12 and the lead terminal 6 are joined by laser welding.
In addition to the electronic component 1, other electronic components and the like can be appropriately disposed in the resin case 2, and a wiring pattern (not shown) for electrically connecting them is provided. And an electronic circuit apparatus is comprised by combining these.

Thereafter, the electronic component 1 is fitted into the electronic component mounting recess 11. Here, the electronic component mounting recess 11 is formed so that the tip of the lead terminal 6 coincides with the bus bar terminal 12 according to the shape of the electronic component 1, so that the tip of the bus bar terminal 12 and the lead terminal 6 can be easily formed. The tip can be brought into contact. At this time, the tip of the lead terminal 6 is slightly inclined toward the bottom surface of the resin case 2 due to its own weight. As a result, the lead terminal 6 and the bus bar terminal 12 are aligned with each other without forming a gap between the tip of the lead terminal 6 and the tip of the bus bar terminal 12. Further, the lead terminal 6 is positioned by making the tip of the bus bar terminal 12 bifurcated and positioning the tip of the lead terminal 6 at the center of the tip of the bus bar terminal 12.
Then, the lead terminal 6 and the bus bar terminal 12 are joined by laser welding. Thereafter, similarly, other electronic components and the like are appropriately arranged to manufacture an electronic circuit device.

  As described above, according to the electronic circuit device of the present embodiment, the leading end of the bus bar terminal 12 and the leading end of the lead terminal 6 coincide with each other due to the weight of the lead terminal 6, so that clamping is performed using a clamp member such as a clip or pliers. Both can be easily joined. In addition, since the front end of the bus bar terminal 12 has a bifurcated shape, the lead terminal 6 can be easily positioned at the time of joining.

Next, a second embodiment will be described with reference to FIGS. In the following description, the same reference numerals are given to the components described in the above embodiment, and the description thereof is omitted.
The difference between the second embodiment and the first embodiment is that a curved portion (stress absorbing portion) 22 is formed on the bus bar terminal 21 in the electronic circuit device according to the second embodiment.
As shown in FIGS. 2 and 3, the bus bar terminal 21 has a curved portion 22 formed by a curved surface in the middle thereof.

  The electronic circuit device according to the present embodiment has the same operations and effects as those of the first embodiment described above. However, since the curved portion 22 is provided on the bus bar terminal 21, the lead terminal 6 of the electronic component 1 is provided. The bending portion 22 can absorb the expansion and contraction of the lead terminal 6 and / or the bus bar terminal 21 generated when the bus bar terminal 21 and the bus bar terminal 21 are welded. Therefore, the connection state between the lead terminal 6 and the bus bar terminal 21 can be stabilized.

Next, a third embodiment will be described with reference to FIG. In the following description, the same reference numerals are given to the components described in the above embodiment, and the description thereof is omitted.
The difference between the third embodiment and the first embodiment is that the bus bar terminal 12 in the first embodiment has a bifurcated tip, but the electronic circuit device in the third embodiment has a bus bar terminal. This is that a flat surface portion 32 is formed at the tip of 31.
As shown in FIG. 4, the bus bar terminal 31 is provided with a flat portion 32 that is bent so as to be parallel to the lead terminal 6 at the tip end portion. The flat portion 32 and the tip of the lead terminal 6 are in surface contact.

  According to the electronic circuit device of the present embodiment, even when the lead terminal 6 is displaced, the contact state with the flat surface portion 32 can be maintained, so the same action as in the first embodiment described above, Has an effect. Further, by fitting the electronic component 1 into the electronic component mounting recess 11, the front end portion of the bus bar terminal 12 in the first embodiment described above is bifurcated, and the front end of the lead terminal 6 is brought to the center of the front end of the bus bar terminal 12. The same positioning as that of positioning the lead terminals 6 can be performed.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, the lead terminal and the bus bar terminal are arranged so as to be orthogonal to each other, but the tip of the bus bar terminal is made higher than the tip of the lead terminal, and the tip of the bus bar terminal is moved by the elastic force of the lead terminal. The structure which arrange | positions so that it may press may be sufficient. By doing so, a gap between the lead terminal and the tip of the bus bar terminal is less likely to be formed, and the lead terminal and the bus bar terminal can be connected in a more stable state.
In the above embodiment, the lead terminal and the bus bar terminal are welded and electrically connected by laser welding, but TIG (Tungsten Inert Gas) welding or spot welding may be used. You may connect using. Here, by using TIG welding, the connection can be made stronger than the solder connection, and the connection is easy even when the welding area is large compared to laser welding.
Moreover, in the said embodiment, although it joins, after cutting | disconnecting the excessive part of a lead terminal beforehand so that the front-end | tip of a lead terminal may correspond to the front-end | tip of a bus-bar terminal, you may cut | disconnect an excessive part after joining.
Moreover, you may attach a radiation fin to the upper surface of an electronic component. By doing in this way, the heat_generation | fever from an electronic component can be thermally radiated efficiently.

  In the first and second embodiments, only the front end of the bus bar terminal has a bifurcated shape. However, a bifurcated shape may be similarly formed on other portions of the bus bar terminal. By doing in this way, the connection strength of a bus-bar terminal and a lead terminal can be improved.

  In the second embodiment, the curved portion is provided only on the bus bar terminal, but the same curved portion may be provided on the lead terminal, or the curved portion may be formed on only one of them. Furthermore, in the third embodiment, similarly to the second embodiment, stress absorbing portions may be formed on the lead terminals and / or the bus bar terminals. Here, the shape of the stress absorbing portion is not limited to the curved portion formed by the curved portion described above, but may be formed by a bent portion bent into a square shape as shown in FIG. 5 (b) and may be formed by providing a notch as shown in FIG. 5 (c).

1 is a perspective view showing an electronic circuit device according to a first embodiment of the present invention. It is a perspective view which shows the electronic circuit apparatus in the 2nd Embodiment of this invention. It is a side view which shows the bus-bar terminal of FIG. It is a perspective view which shows the electronic circuit apparatus in the 3rd Embodiment of this invention. It is a side view which shows the other bus-bar terminal which can apply this invention. It is explanatory drawing which shows the conventional connection method.

Explanation of symbols

1 Electronic component 2 Resin case 6 Lead terminal (electronic component terminal)
12, 21, 31 Busbar terminal 22 curved portion (stress absorbing portion)
32 Plane section

Claims (5)

In an electronic circuit device in which an electronic component is mounted on a resin case containing a bus bar terminal, and the bus bar terminal and the electronic component terminal of the electronic component are electrically connected,
The electronic circuit device, wherein the bus bar terminal and the electronic component terminal are electrically connected in a state of being substantially orthogonal to each other. The bus bar terminal is provided so as to protrude substantially perpendicular to the bottom surface of the resin case,
2. The electronic circuit device according to claim 1, wherein the electronic component terminal extends substantially parallel to a bottom surface of the resin case and is placed at a front end of the bus bar terminal.   3. The electronic circuit device according to claim 2, wherein a front end portion of the bus bar terminal is bifurcated, and the electronic component terminal is engaged between the bifurcated portions.   The flat part which becomes substantially parallel to the length direction of the said electronic component terminal is provided in the front-end | tip part of the said bus-bar terminal, The said electronic component terminal is surface-contacting to this flat part. The electronic circuit device described. The stress absorption part which absorbs a mechanical stress is provided in the one or both of the said bus-bar terminal and the said electronic component terminal along the length direction, The any one of Claim 1 to 4 characterized by the above-mentioned. 2. An electronic circuit device according to item 1.

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