WO2018166045A1 - 射频器件及其腔体 - Google Patents

射频器件及其腔体 Download PDF

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Publication number
WO2018166045A1
WO2018166045A1 PCT/CN2017/081979 CN2017081979W WO2018166045A1 WO 2018166045 A1 WO2018166045 A1 WO 2018166045A1 CN 2017081979 W CN2017081979 W CN 2017081979W WO 2018166045 A1 WO2018166045 A1 WO 2018166045A1
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WIPO (PCT)
Prior art keywords
cavity
radio frequency
circuit board
frequency device
bosses
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PCT/CN2017/081979
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English (en)
French (fr)
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游建军
邱建源
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京信通信系统（中国）有限公司
京信通信技术(广州)有限公司
京信通信系统（广州）有限公司
天津京信通信系统有限公司
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Publication of WO2018166045A1 publication Critical patent/WO2018166045A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/18—Phase-shifters

Definitions

  • the present invention relates to the field of radio frequency communication technologies, and in particular, to a radio frequency device cavity and a radio frequency device using the radio frequency device cavity.
  • the cavity and the PCB which are extruded by the same section adopt a card slot insertion type assembly method, and the cavity of the radio frequency communication device is usually built by pultrusion technology, and the PCB is inserted into the symmetric card slot of the cavity.
  • the height of the card slot in the cavity is also required to meet the corresponding fitting size, so that the PCB is tightly assembled into the cavity.
  • the groove having a groove height of 1 mm cannot be formed because the mold material having a thickness of 1 mm or less is easily deformed or even broken.
  • a PCB having a thickness of 0.8 mm is often inserted in a card slot having a groove height of more than 1 mm, resulting in improper size matching, which in turn causes the PCB to sway in the cavity during use, affecting the electrical performance of the RF device.
  • a primary object of the present invention is to provide a radio frequency device cavity that is simple in construction and that is used to securely insert a small thickness RF circuit board.
  • Another object of the present invention is to provide a radio frequency device which employs the above-described radio frequency device cavity and thus has excellent electrical characteristics.
  • a radio frequency device cavity includes a cavity body having an accommodating space for accommodating a radio frequency circuit board, the cavity including oppositely disposed top and bottom walls, and a pair of side walls supported therebetween .
  • the fixing support assembly includes a first boss and a second boss respectively connected to the top wall and the bottom wall, and the first and second bosses are dislocated and disposed in the cavity.
  • the height direction of the body defines a gap for gripping the RF circuit board that is stuck therein.
  • the invention can reduce the process difficulty by dislocating the first and second bosses, and can define a small gap, so that the stuck RF circuit board is stable and does not shake in the cavity, and the thin RF circuit board is improved.
  • the assembly stability in the cavity, in addition, the first and second bosses also have the function of supporting the RF circuit board, and can prevent the RF circuit board from being broken in the cavity to some extent.
  • the first and second bosses are integrally formed with the top or bottom wall.
  • the integrated molding process is relatively strong, and the first and second bosses are not easily damaged, thereby contributing to improving the stability of the RF device cavity and prolonging the service life.
  • first and second bosses are separate components disposed on the top and bottom walls.
  • the at least two sets of securing support assemblies are evenly distributed within the cavity.
  • the RF circuit board can be evenly supported to avoid breakage of the RF circuit board.
  • the at least two sets of snap support assemblies are discretely distributed within the cavity to avoid critical component placement on the circuit board.
  • the at least two sets of fastening support assemblies are disposed adjacent to the sidewall of the cavity.
  • first bosses extend toward the inner side of the sidewall, and the second boss is disposed adjacent to the first boss to further stabilize the inserted RF circuit board.
  • the first and second bosses extend along a longitudinal direction of the cavity, and the first and second bosses are elongated.
  • the cavity is formed by a pultrusion process.
  • the cavity further includes a partition separating the cavity into an upper cavity and a lower cavity from a height direction, and at least two sets of the fastening are respectively disposed in the upper cavity and the lower cavity Support assembly.
  • an embodiment of the present invention provides a radio frequency device including a cavity and a radio frequency circuit board disposed in the cavity, wherein the cavity is the radio frequency device cavity, and the side of the radio frequency circuit board Constrained in a gap formed between the first boss and the second boss.
  • the radio frequency circuit board includes a circuit substrate and a communication power disposed on the circuit substrate The circuit substrate is inserted into the gap.
  • the radio frequency device further includes a medium interposed between the cavity and the radio frequency circuit board.
  • FIG. 1 is a perspective view of a cavity of a radio frequency device according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a cavity of a radio frequency device in accordance with one embodiment of the present invention.
  • FIG 3 is a perspective view of a radio frequency device according to an embodiment of the present invention, showing an assembly relationship between a cavity and a radio frequency circuit.
  • FIG. 4 is a cross-sectional view of a cavity of a radio frequency device in accordance with one embodiment of the present invention.
  • FIG. 1 is a perspective view of a radio frequency device cavity 1000 of one embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the radio frequency device cavity 1000 of FIG.
  • the present invention provides a radio frequency device cavity 1000, including a cavity body having an accommodating space for accommodating a radio frequency circuit board 400.
  • the radio frequency device cavity 1000 includes oppositely disposed. a top wall 200 and a bottom wall 100, and a pair of side walls 300 supported therebetween, the top wall 200, the bottom wall 100 and the side wall 300 together define a cavity for receiving a radio frequency circuit Plate 400 and other components, such as dielectric components.
  • the cavity body 100 is provided with at least two sets of fastening support assemblies, and the at least two sets of the fastening support assemblies are respectively disposed on two sides of the lateral direction of the cavity, and each set of the fastening support components includes a top and a top a first boss 110 and a second boss 120 connected to the wall 200 and the bottom wall 100, the first and the first The two bosses are misaligned and define a gap for clamping the RF circuit board 400 that is inserted therein in the height direction of the cavity. When the RF circuit board 400 is inserted into the cavity, the RF circuit board 400 spans.
  • the second boss 120 is disposed on the second boss 120, and the side edges thereof are disposed in the gap defined by the first and second bosses.
  • the clamping support assembly has a supporting effect on the RF circuit board 400, and those skilled in the art can understand that at least two sets of the clamping support assembly 400 are required to ensure the balance of the RF circuit board 400 sandwiched in the gap, and At least one set of fastening support assemblies are disposed on both sides of the lateral direction of the cavity.
  • the first and second bosses are offset and can meet the requirements of mold forming.
  • the snap support assembly can securely hold the RF circuit board 400 of a very thin thickness while also supporting the RF circuit board 400, reducing the span of the RF circuit board 400 in the cavity.
  • the invention can reduce the process difficulty by dislocating the first and second bosses, and can define a small gap, so that the stuck RF circuit board 400 is stable in the cavity and does not shake, thereby improving the thinner RF circuit.
  • the stability of the board 400 in the cavity facilitates assembly of the RF circuit board 400, and at the same time solves the problem of sloshing of the RF circuit board 400 during use, especially for the RF circuit board 400 having a thickness of less than 1 mm.
  • the first and second bosses also have the function of supporting, which can prevent the RF circuit board 400 from being bent and deformed or broken in the cavity to a certain extent, thereby ensuring the electrical performance of the RF device cavity 1000.
  • the distance between the first and second bosses can be adjusted according to actual needs to define different sizes of gaps, thereby being used to limit the RF board 400 of different thicknesses, especially Suitable for RF board 400 with very small thickness.
  • other flat objects such as a media board, can also be inserted.
  • the first and second bosses are integrally formed with the top wall 200 or the bottom wall 100 such that the first and second bosses are firmly connected to the inner wall of the cavity, and the first and second bosses are not easily damaged. This helps to improve the stability of RF device performance and extend the service life.
  • first and second bosses are disposed on the top wall 200 and the bottom wall 100 as separate components.
  • the first and second bosses are set as separate components for easy disassembly, replacement and adjustment.
  • the first and second bosses can be replaced to define gaps of different heights for clamping different thicknesses.
  • RF circuit board 400 can be replaced to define gaps of different heights for clamping different thicknesses.
  • gaps defined between the first and second bosses of the different snap support assemblies may be different for defining the RF circuit board 400 having an irregular thickness.
  • the at least two sets of snap support assemblies are evenly distributed within the cavity, in particular, the lateral distance between adjacent snap support assemblies is equal. In another embodiment of the invention, the at least two sets of securing support assemblies are discretely distributed within the cavity to facilitate avoiding important electrical components on the radio frequency circuit board 400.
  • the at least two sets of fastening support assemblies are disposed adjacent the cavity sidewalls 300 to reserve sufficient space within the cavity for providing a media element, such as a dielectric plate.
  • the opposing first bosses 110 extend toward the inner side of the cavity sidewalls 300, and the second bosses 120 are disposed adjacent to the first bosses 110 to further stabilize the inserted RF circuit board 400.
  • the second protrusions 120 extend toward the inner side of the side wall 300, and the first protrusions 110 are disposed adjacent to the second protrusions 120, and the card of the radio frequency circuit board 400 can also be implemented. Solid support purpose.
  • the RF device cavity 1000 is formed by a pultrusion process or a die casting process.
  • the first and second bosses extend along the longitudinal direction of the cavity, and the first and second bosses are elongated and can be formed by a pultrusion process to simplify the manufacturing process and enhance the cavity. performance.
  • first and second bosses may also be configured in a cylindrical shape, a square column shape, or the like in the cavity as long as they can define a suitable gap, and secure and support the RF circuit board 400. Just fine.
  • the cavity further includes a partition 500 that separates the cavity into an upper cavity and a lower cavity from a height direction, and at least two sets of the cards are respectively disposed in the upper cavity and the lower cavity
  • the solid support assembly has the at least two sets of fastening support assemblies in each cavity disposed on opposite sides of the cavity.
  • an embodiment of the present invention further provides a radio frequency device including the cavity 1000 and a radio frequency circuit board 400 disposed in the cavity, and the side of the radio frequency circuit board 400 It is constrained in the gap formed between the first boss 110 and the second boss 120. Due to the use of the above cavity 1000, the thinner RF circuit board 400 can be fixed inside the RF device without swaying This ensures the electrical performance of the RF device while simplifying the manufacturing process and extending the life of the RF device.
  • the radio frequency circuit board 400 includes a circuit substrate and a communication circuit disposed on the circuit substrate, and the circuit substrate is inserted into the gap.
  • the RF device cavity 1000 can be designed as any multi-layered cavity, wherein the top wall 200 and the bottom wall 100 of each layer of the cavity can be configured with a snap support assembly.
  • a dielectric plate interposed between the cavity and the RF circuit board 400 may be further disposed in the cavity to constitute a phase shifter.

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Abstract

本发明提供了一种射频器件腔体，包括具有用于收容射频电路板的容置空间的腔体本体，所述腔体包括相对设置的顶壁和底壁，以及支撑在二者之间的一对侧壁，所述腔体内设有至少两组卡固支撑组件，所述至少两组卡固支撑组件分别设置于腔体横向的两侧，所述卡固支撑组件包括分别与顶壁和底壁连接的第一凸台和第二凸台，所述第一、第二凸台错位设置并且于腔体的高度方向限定出用于夹住卡入其内的射频电路板的间隙。本发明提高了较薄的射频电路板在腔体内的装配稳定性，避免了射频电路板在腔体内晃动或断裂。

Description

射频器件及其腔体 技术领域
本发明涉及射频通信技术领域，特别涉及一种射频器件腔体及采用该射频器件腔体的射频器件。
背景技术
一般地，由相同截面拉挤成型的腔体与PCB采用卡槽插入式装配方式，通常采用拉挤成型技术构建射频通信器件腔体，PCB插装进腔体内的对称卡槽内。
此装配方式中，当插入厚度较小的PCB板材，比如0.8mm，或者更薄0.5mm时，要求腔体内卡槽的高度也要满足相应的配合尺寸，才能使得PCB较为紧密地装配至腔体内。然而，在实际生产中，当对铝型材进行腔体拉挤成型时，对于1mm以内槽高的槽无法成型，这是由于厚度在1mm以内的模具料容易变形甚至断裂而造成的。现有生产工艺中，厚度为0.8mm的PCB往往插置在槽高大于1mm的卡槽中，导致尺寸配合不合适，进而导致使用过程中PCB在腔体内晃动，影响射频器件的电气性能。
发明内容
本发明的首要目的在于提供一种结构简单、并用于紧固地插装较小厚度射频电路板的射频器件腔体。
本发明的另一目的在于提供一种射频器件，其采用上述射频器件腔体，因而具有电气性能优异的特点。
为实现该目的，本发明采用如下技术方案：
一种射频器件腔体，包括具有用于收容射频电路板的容置空间的腔体本体，所述腔体包括相对设置的顶壁和底壁，以及支撑在二者之间的一对侧壁。
所述腔体内设有至少两组卡固支撑组件，所述至少两组卡固支撑组件分 别设置于腔体横向的两侧，所述卡固支撑组件包括分别与顶壁和底壁连接的第一凸台和第二凸台，所述第一、第二凸台错位设置并且于腔体的高度方向上限定出用于夹住卡入其内的射频电路板的间隙。
本发明通过错位设置第一、第二凸台，能够降低工艺难度，同时能够限定出较小的间隙，使得卡入的射频电路板在腔体内稳定不晃动，提高了较薄的射频电路板在腔体内的装配稳定性，另外，第一、第二凸台还有支撑射频电路板的作用，能够在一定程度上避免射频电路板在腔体内断裂。
优选地，在本发明一个实施例中，所述第一、第二凸台与顶壁或底壁一体成型。本领域内技术人员能够理解，一体成型的工艺较为坚固，所述第一、第二凸台不易损坏，从而有助于提高射频器件腔体的稳定性，延长使用寿命。
在本发明的另一个实施例中，所述第一、第二凸台为设置于所述顶壁和底壁上的独立部件。
在本发明其中一个实施例中，所述至少两组卡固支撑组件均匀地分布在所述腔体内。当所述卡固支撑组件均匀设置时，能够对所述射频电路板均匀支撑，从而避免所述射频电路板断裂损伤。
在本发明的另一个实施例中，所述至少两组卡固支撑组件离散地分布于所述腔体内，以避开电路板上的关键元器件设置。
优选地，所述至少两组卡固支撑组件靠近腔体侧壁设置。
进一步地，相对的两个所述第一凸台沿侧壁内侧相向延伸，所述第二凸台靠近所述第一凸台设置，以进一步稳定插入的射频电路板。
优选地，所述第一、第二凸台沿腔体纵长方向延伸，所述第一、第二凸台呈长条状。
优选地，所述腔体由拉挤成型工艺成型。
进一步地，所述腔体还包括从高度方向将所述腔体隔离成上腔体和下腔体的隔板，所述上腔体和下腔体中分别设有至少两组所述卡固支撑组件。
另一方面，本发明一个实施例中还提供了一种射频器件，包括腔体和设于腔体内的射频电路板，所述腔体为上述射频器件腔体，所述射频电路板的侧边被约束在所述第一凸台和第二凸台之间形成的间隙中。
具体地，所述射频电路板包括电路基板和布设在该电路基板上的通信电 路，所述电路基板插入所述间隙中。
该射频器件还进一步包括介于腔体和射频电路板之间的介质。
本发明附加的方面和优点将在下面的描述中部分给出，这些将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1为本发明一个实施例的射频器件腔体的立体图。
图2为本发明一个实施例的射频器件腔体的截面图。
图3为本发明一个实施例的射频器件的立体图，示出了腔体与射频电路的装配关系。
图4为本发明一个实施例的射频器件腔体的截面图。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
图1示出了本发明一种实施例的射频器件腔体1000的立体图，图2为图1所示的射频器件腔体1000的截面图。如图1、图2所示，本发明提供了一种射频器件腔体1000，包括具有用于收容射频电路板400的容置空间的腔体本体，所述射频器件腔体1000包括相对设置的顶壁200和底壁100，以及支撑在二者之间的一对侧壁300，所述顶壁200、底壁100和侧壁300共同限定出空腔，该空腔用于容置射频电路板400和其他部件，比如介质元件。
其中，所述腔体本体100内设有至少两组卡固支撑组件，所述至少两组卡固支撑组件分别设置于腔体横向的两侧，每组所述卡固支撑组件包括分别与顶壁200和底壁100连接的第一凸台110和第二凸台120，所述第一、第 二凸台错位设置并且于腔体的高度方向上限定出用于夹住卡入其内的射频电路板400的间隙，当往该腔体内插置射频电路板400时，射频电路板400横跨设置在所述第二凸台120上，且其侧边夹设在第一、第二凸台限定出的间隙中。
所述的卡固支撑组件对射频电路板400具有支撑作用，本领域内技术人员能够理解，至少需要两组卡固支撑组件400才能保证夹在所述间隙中的射频电路板400的平衡，且在腔体横向的两侧均至少设置有一组卡固支撑组件。
在本发明的实施例中，第一、第二凸台错位设置，能够满足模具成型的要求。因而，所述卡固支撑组件可以紧固地固定住厚度很薄的射频电路板400，同时还对射频电路板400有支撑作用，减少了射频电路板400在腔体内的横跨悬空长度。
本发明通过将第一、第二凸台错位设置，能够降低工艺难度，同时能够限定出较小的间隙，使得卡入的射频电路板400在腔体内稳定不晃动，提高了较薄的射频电路板400在腔体内的稳定性，便于射频电路板400装配，同时解决了使用过程中射频电路板400的晃动问题，尤其对于厚度小于1mm的射频电路板400具有良好的适用性。另外，第一、第二凸台还有支撑的作用，能够在一定程度上避免射频电路板400在腔体内向下弯折变形、甚至断裂，保证了射频器件腔体1000的电气性能。
具体地，在本发明的实施例中，第一、第二凸台之间的距离可以根据实际需求调整，以限定出不同大小的间隙，进而用于限制住不同厚度的射频电路板400，尤其适用于极小厚度的射频电路板400。在其他实施例中，还可以插装其他平板物体，例如介质板。
优选地，所述第一、第二凸台与顶壁200或底壁100一体成型，以使第一、第二凸台与腔体内壁的连接较为坚固，第一、第二凸台不易损坏，从而有助于提高射频器件性能的稳定性，延长使用寿命。
在其他实施例中，所述第一、第二凸台为独立部件设置于所述顶壁200和底壁100上。将第一、第二凸台设为独立部件，以便于拆卸、更换和调整，例如，可以通过更换所述第一、第二凸台，限定出不同高度的间隙，以用于卡住不同厚度的射频电路板400。
此外，不同卡固支撑组件的第一、第二凸台之间限定的间隙也可以不同，以用于限定厚度不规则的射频电路板400。
在本发明的一个实施例中，所述至少两组卡固支撑组件均匀地分布在所述腔体内，具体地，相邻卡固支撑组件之间的横向距离相等。在本发明的另一个实施例中，所述至少两组卡固支撑组件离散地分布于所述腔体内，以便于避开所述射频电路板400上的重要电气元件。
优选地，所述至少两组卡固支撑组件靠近腔体侧壁300设置，以在腔体内预留出足够的空间，以用于设置介质元件，比如介质板。
具体地，相对的所述第一凸台110沿腔体侧壁300内侧相向延伸，所述第二凸台120靠近所述第一凸台110设置，以进一步稳定插入的射频电路板400。
当然，在其他实施方式中，所述第二凸台120沿侧壁300内侧相向延伸，所述第一凸台110靠近所述第二凸台120设置，也能实现对射频电路板400的卡固支撑目的。
优选地，所述射频器件腔体1000由拉挤工艺或压铸工艺成型。
优选地，所述第一、第二凸台沿腔体纵长方向延伸，所述第一、第二凸台呈长条状，可通过拉挤成形工艺成形，以简化制造工艺，提升腔体性能。
在其他实施例中，所述第一、第二凸台还可以在腔体中设定成圆柱型、方柱型等结构，只要其能够限定出适宜的间隙、卡固并支撑射频电路板400即可。
进一步地，所述腔体还包括从高度方向将所述腔体隔离成上腔体和下腔体的隔板500，所述上腔体和下腔体中分别设有至少两组所述卡固支撑组件，每个腔体内的所述至少两组卡固支撑组件分设于腔体两侧。通过在腔体内设置隔板，可以实现两个或两个以上射频器件共腔体壁设计，有利于缩小腔体的体积。
另一方面，参见图3、图4，本发明一个实施例中还提供了一种射频器件，包括上述腔体1000及设于腔体内的射频电路板400，所述射频电路板400的侧边被约束在所述第一凸台110和第二凸台120之间形成的间隙中。由于采用了上述腔体1000，较薄的射频电路板400能够固定在该射频器件内部不晃 动，进而保证了射频器件的电气性能，同时简化了制造工艺，延长了射频器件的使用寿命。
具体地，所述射频电路板400包括电路基板和布设在该电路基板上的通信电路，所述电路基板插入所述间隙中。
在其他实施例中，所述射频器件腔体1000可以设计成任意多层腔体，其中每层腔体的顶壁200和底壁100都可设定有卡固支撑组件。
此外，腔体内还可进一步设置介于腔体和射频电路板400之间的介质板，以构成移相器。
以上所述仅是本发明的部分实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (9)

  1. 一种射频器件腔体，包括具有用于收容射频电路板的容置空间的腔体本体，所述腔体包括相对设置的顶壁和底壁，以及支撑在二者之间的一对侧壁，其特征在于：
    所述腔体内设有至少两组卡固支撑组件，所述至少两组卡固支撑组件分别设置于腔体横向的两侧，所述卡固支撑组件包括分别与顶壁和底壁连接的第一凸台和第二凸台，所述第一、第二凸台错位设置并且于腔体的高度方向上限定出用于夹住卡入其内的射频电路板的间隙。
  2. 根据权利要求1所述的射频器件腔体，其特征在于：所述第一、第二凸台与顶壁或底壁一体成型，或者所述第一、第二凸台为设置于所述顶壁和底壁上的独立部件。
  3. 根据权利要求1所述的射频器件腔体，其特征在于：所述至少两组卡固支撑组件靠近腔体侧壁设置。
  4. 根据权利要求3所述的射频器件腔体，其特征在于：相对的两个所述第一凸台沿侧壁内侧相向延伸，所述第二凸台靠近所述第一凸台设置。
  5. 根据权利要求1所述的射频器件腔体，其特征在于：所述第一、第二凸台沿腔体纵长方向延伸。
  6. 根据权利要求1所述的射频器件腔体，其特征在于：所述腔体由拉挤工艺或压铸成型。
  7. 根据权利要求1至6任一项所述的射频器件腔体，其特征在于：所述腔体还进一步包括从高度方向将所述腔体隔离成上腔体和下腔体的隔板，所述上腔体和下腔体中分别设有至少两组分设于腔体两侧的所述卡固支撑组件。
  8. 一种射频器件，包括腔体和设于腔体内的射频电路板，其特征在于：所述腔体为权利要求1至7中任一项所述的射频器件腔体，所述射频电路板的侧边被约束在所述第一凸台和第二凸台之间形成的间隙中。
  9. 根据权利要求8所述的射频器件，其特征在于，还包括介于腔体和射频电路板之间的介质。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201616495U (zh) * 2010-02-09 2010-10-27 东莞市晖速天线技术有限公司 一种集成式可变相位移相器
US20110140805A1 (en) * 2009-12-16 2011-06-16 Wha Yu Industrial Co., Ltd. Phase shifter
CN203119062U (zh) * 2012-12-31 2013-08-07 华为技术有限公司 安装组件
CN206532852U (zh) * 2017-03-16 2017-09-29 京信通信系统（中国）有限公司 射频器件及其腔体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202514190U (zh) * 2012-04-16 2012-10-31 浙江百诺电气有限公司 一种带有pcb固定装置的外壳

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110140805A1 (en) * 2009-12-16 2011-06-16 Wha Yu Industrial Co., Ltd. Phase shifter
CN201616495U (zh) * 2010-02-09 2010-10-27 东莞市晖速天线技术有限公司 一种集成式可变相位移相器
CN203119062U (zh) * 2012-12-31 2013-08-07 华为技术有限公司 安装组件
CN206532852U (zh) * 2017-03-16 2017-09-29 京信通信系统（中国）有限公司 射频器件及其腔体

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