WO2018157179A2 - Effecteur terminal robotique atmosphérique - Google Patents

Effecteur terminal robotique atmosphérique Download PDF

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Publication number
WO2018157179A2
WO2018157179A2 PCT/US2018/024226 US2018024226W WO2018157179A2 WO 2018157179 A2 WO2018157179 A2 WO 2018157179A2 US 2018024226 W US2018024226 W US 2018024226W WO 2018157179 A2 WO2018157179 A2 WO 2018157179A2
Authority
WO
WIPO (PCT)
Prior art keywords
end effector
disposed
actuator
housing
robotic
Prior art date
Application number
PCT/US2018/024226
Other languages
English (en)
Other versions
WO2018157179A3 (fr
Inventor
Thomas Walton
Michael Dailey
Manon LEMOINE
Joe Garcia
Original Assignee
Fabworx Solutions, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fabworx Solutions, Inc. filed Critical Fabworx Solutions, Inc.
Publication of WO2018157179A2 publication Critical patent/WO2018157179A2/fr
Publication of WO2018157179A3 publication Critical patent/WO2018157179A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present application relates generally to robotic end effectors, and more particularly to methodologies for reducing the level of particle contaminants originating from such end effectors, and to end effectors produced in accordance with those methodologies.
  • a single wafer may be exposed to a number of sequential processing steps including, but not limited to, chemical vapor deposition (CVD), physical vapor deposition (PVD), etching, planarization, and ion implantation.
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • etching planarization
  • ion implantation ion implantation
  • FIG. 1 is an illustration of a 300mm Yaskawa robot with its robotic arm shown in an extended position.
  • FIG. 2 is an image of a 300mm Yaskawa robot with its robotic arm shown in a retracted position.
  • FIG. 3 is an image of the end effector blade of the robot of FIG. 1.
  • FIG. 4 is an image of a portion of the end effector of FIG. 3 with the housing removed to show the various components thereof.
  • FIG. 5 is a magnified view of the actuator utilized in the end effector of the robot of FIG. 4.
  • FIG. 6 is a view of the pneumatic tube utilized in the end effector of the robot of FIG. 2.
  • FIGs. 7(a), 7(b) and 7(c) are images of a test chamber designed to simulate an Equipment Front End Module (EFEM).
  • EFEM Equipment Front End Module
  • the EFEM-like test chamber is equipped with a Fan Filter Unit (FFU) to provide laminar flow, and was used for the particle counter measurements described herein.
  • FFU Fan Filter Unit
  • FIG. 8 is a graph of particle count as a function of particle size obtained during validation testing conducted with the test chamber of FIG. 7.
  • FIGS. 9(a) and 9(b) are graphs of particle count as a function of particle size obtained during validation testing conducted with the test chamber of FIG. 7.
  • the graph in FIG. 9(a) was obtained during an ATM blade pressure change, while that in FIG. 9(b) was obtained during changes in CDA pressure.
  • FIG. 10 is a series of illustrations indicating the effect of pad wear on the pads of the end effector blade of FIG. 3.
  • FIG. 10(a) shows the profile of a pad that has undergone wafer abrasion.
  • FIG. 10(b) shows the profile of a new pad for comparison.
  • FIG. 11 is an image of a wafer mounted on the end effector blade of FIG. 3.
  • FIG. 12 is an image of various components of the end effector of the robot of FIG. 2.
  • FIG. 12(a) depicts a pneumatic pump
  • FIG. 12(b) depicts a portion of a metal flag showing the installation thereof
  • FIG. 12(c) depicts a pneumatic flag.
  • FIG. 13 is a first embodiment of a particle guard in accordance with the teachings herein in which the particle barrier is mounted to the front of the actuator in the end effector of a robot of the type depicted in FIG. 2.
  • FIG. 14 is a second embodiment of a particle guard in accordance with the teachings herein in which the particle barrier is mounted to the front of the actuator in the end effector of a robot of the type depicted in FIG. 2.
  • FIG. 15 is a set of images showing the original equipment manufacturer (OEM) flag (FIG. 15(a)) for the actuator in the end effector of a robot of the type depicted in FIG. 2, and a modified flag (FIG. 15(b)) in accordance with the teachings herein.
  • the modified flag may be used as a replacement form the OEM flag.
  • FIG. 16 is an image of a pressure regulator valve (FIG. 16(a)) and speed controllers (FIG. 16(b)) which may be utilized in the end effectors disclosed herein.
  • FIG. 17 is a set of images illustrating some differences between the OEM fang and a preferred embodiment of the fangs disclosed herein.
  • FIG. 17(b) shows an embodiment of a fang in accordance with the present disclosure
  • FIG. 17(a) shows a side-by-side comparison of an OEM fang and the Fang of FIG. 17(b).
  • FIG. 18 is a set of images comparing an embodiment of an end effector in accordance with the teachings herein (FIG. 18(b)) to the original OEM version (FIG. 18(a)). The end effectors in both images are shown with the housing removed to reveal the inner components of the actuators.
  • FIG. 19 is a set of graphs illustrating the difference in particle contaminant levels between an OEM end effector for the robot of FIG. 2 (FIG. 19(a)) and an end effector made in accordance with the teachings herein (FIG. 19(b)).
  • FIG. 20 is a set of images showing top (FIG. 20(a)) and bottom (FIG. 20(b)) views of a particle barrier and actuator in accordance with the teachings herein, with the parts separated.
  • FIG. 21 is a set of images showing top (FIG. 21 (a)) and bottom (FIG. 21 (b)) views of a particle barrier and actuator in accordance with the teachings herein, with the parts joined.
  • FIG. 22 is a set of illustrations of an actuator used in an embodiment of an end effector made in accordance with the teachings herein.
  • FIG. 22(a) is a side view of the actuator
  • FIG. 22(b) is a front view of the actuator.
  • FIG. 23 is a set of illustration of an OEM actuator corresponding to the actuator of FIG. 22.
  • FIG. 23(a) is a side view of the actuator
  • FIG. 23(b) is a front view of the actuator
  • FIG. 23(c) is a rear view of the actuator.
  • FIGs. 24-27 are illustrations of a particular, non-limiting embodiment of a flag in accordance with the teachings herein.
  • FIGs. 28-42 are perspective illustrations of a particular, non-limiting embodiment of a tab (or fang) in accordance with the teachings herein.
  • a robotic end effector which comprises (a) an end effector blade; (b) a housing disposed on a first end of said end effector blade; (c) an actuator disposed within said housing; and (d) a plurality of tabs disposed on said blade adjacent to said housing; wherein each of said plurality of tabs includes a first portion adapted to receive a semiconductor wafer thereon, and a second portion which is raised with respect to said first portion, and wherein said each of said plurality of tabs comprises a polyaryletherketone.
  • the polyaryletherketone is preferably polyether ether ketone (PEEK).
  • a robotic end effector which comprises (a) an end effector blade; (b) a housing disposed on a first end of said end effector blade; (c) an actuator disposed within said housing; and (d) a plurality of tabs disposed on said blade adjacent to said housing; wherein each of said plurality of tabs includes a first portion adapted to receive a semiconductor wafer thereon, and a second portion which is raised with respect to said first portion and which is separated therefrom by way of a vertical wall, wherein the first portion of each tab is equipped with a front edge which is parallel to said wall and first and second lateral edges, and wherein said front edge adjoins said first lateral edge by way of a first beveled edge.
  • a robotic end effector which comprises (a) an end effector blade; (b) a housing which is equipped with a front wall and which is releasably attached to a first end of said end effector blade; (c) an actuator disposed within said housing, said actuator having a protrusion which extends through an aperture in said front wall; and (d) a closed-cell foam barrier disposed within said housing and adjacent to said front wall.
  • a robotic end effector which comprises (a) an end effector blade; (b) an actuator disposed within said housing, said actuator having a protrusion which advances and retracts along a first axis, said protrusion being equipped on a terminal end thereof with a resilient mass, and wherein said resilient mass traces out a three-dimensional space as said protrusion advances and retracts along said first axis; (c) a control unit; and (d) a flag having a first end which is attached to said actuator, and having a second end which is magnetically coupled to said control unit; wherein said flag has first and second segments that are adjoined at an angle, wherein said first end of said flag is disposed on said first segment, and wherein said second end of said flag is disposed on said second segment; and wherein said first segment is equipped with a first portion having a first major surface which is essentially parallel to said first axis, and wherein said first segment is further equipped with a second major surface which is essentially perpen
  • a robotic end effector which comprises (a) a housing; (b) an end effector blade; (c) an actuator disposed within said housing, said actuator having a protrusion which advances and retracts along a first axis, said protrusion being equipped on a terminal end thereof with a resilient mass, and wherein said resilient mass traces out a three-dimensional space as said protrusion advances and retracts along said first axis; (d) a control unit; and (e) a flag having a first end which is attached to said actuator, and having a second end which is magnetically coupled to said control unit; wherein said flag has first and second segments that are adjoined at an angle, wherein said first end of said flag is disposed on said first segment, and wherein said second end of said flag is disposed on said second segment; and wherein said first segment is equipped with a first portion having a first major surface which is essentially parallel to said first axis, and wherein said first segment is further equipped with a second
  • a robotic end effector which comprises (a) a housing; (b) an end effector blade; (c) an actuator disposed within said housing, said actuator having a protrusion which advances and retracts from said housing along a first axis; and (d) a rigid, polymeric particle barrier disposed between said housing and said end effector blade, said particle barrier having an aperture therein through which said protrusion expands and retracts.
  • Robotic end effectors are a crucial component of cluster tools. These devices are tasked with the actual handling and placement of semiconductor wafers within the tool. Ideally, robotic end effectors operate in a repeatable, high speed manner to provide high tool throughput and high product yields.
  • Particle contamination is a serious issue which must be dealt with during semiconductor manufacturing, and which can adversely affect product yield.
  • great care is taken in these processes to avoid the introduction of external particle contaminants, and to reduce or eliminate particle contaminants arising from the semiconductor processes themselves.
  • various processes have been introduced in the art to reduce or eliminate particle contamination arising from the use of abrasive particles or the generation of abraded materials during chemical mechanical polishing (CMP).
  • CMP chemical mechanical polishing
  • the 300mm Yaskawa atmospheric robot 101 includes a hub 103 having a first arm 105 rotatably attached thereto, and a second arm 107 is rotatably attached to the first arm 105.
  • a third arm 109 is rotatably attached on one end thereof to the second arm 107, and is attached on the opposing end thereof to an end effector 111.
  • the robot is further equipped with a connector panel 113. During operation, the robot commonly moves between an extended configuration such as that depicted in FIG. 1, and a retracted position such as that depicted in FIG. 2.
  • the end effector 111 includes a blade 121 with a housing 123 disposed on one end thereof which houses an actuator 125 (see FIG. 4; note that the actuator 125 is removed in FIG. 3).
  • the end effector blade 121 is equipped with a plurality of pads 126 that support a wafer 122 on the end effector blade 121 as shown in FIG. 11.
  • the actuator 125 comprises a resilient wheel 127 (shown up close in FIG. 5) disposed on the end of a metal rod 129.
  • the rod 129 is driven by a pneumatic piston 131 (shown in greater detail in FIG. 6) which is controlled by a controller 133.
  • a seal 135 is provided around the rod 129 to prevent air flow from the pneumatic pump 131 from reaching the wafer.
  • a metal flag 137 is disposed on the rod 129 adjacent to the wheel 127 to help control the motion of the rod 129, and to serve as a barrier to particulate contaminants generated within the housing 123.
  • the actuator 125 operates to extend and retract the wheel 127 so that it respectively engages and disengages a wafer disposed on the end effector blade 121 (see FIG. 3).
  • a test chamber 201 was created (see FIG. 7) to simulate an equipment front end module (EFEM) chamber.
  • the test chamber 201 was equipped with a fan filter unit (FFU) (not shown) to provide a laminar flow through the chamber.
  • FFU fan filter unit
  • a CyberOptics APS particle wafer 203 was utilized in these tests (with particle size up to 0.5u).
  • the findings of these studies were verified with a PMS Abacus 301 particle counter 205 (available commercially from Artisan Technology Group, Champaign, IL). Measurements were taken at various positions on the end effector 111 and at various compressed dry air (CD A) pressures.
  • CD A compressed dry air
  • each on and off sequence was roughly 3 minutes long.
  • BKM Best Known Method
  • OEM Original Equipment Manufacturer
  • wafer damage sometimes occurs to wafer edges in the vicinity of the end effector pads 126.
  • FIG. 11 depicts a wafer 122 disposed on the pads 126 of an end effector blade. Without wishing to be bound by theory, this is believed to be due to undercut wear on the end effector pads 126 (especially the front set of pads). Such undercut wear may be appreciated by comparing the profile of a worn pad 126b to that of a new pad 126a in FIG. 10. It has been observed that wafers occasionally catch on front pads during lift motion, due to such undercut wear. Pad (or fang) wear is found to occur, in part, as a result of excessive impact and lateral sliding during clamping.
  • particle generation may occur due to actuator leaks. It also suggested that the flag may act as a "particle pusher" due to its shape. The study further suggested that end-effector pads may become worn due to lateral wafer sliding, and found that high air pressures and fast piston action in the pneumatic actuators may lead to hard wafer impacts. The study further revealed that damage to the edge of a wafer may occur due to a high regulator set point of BKM. It was also determined that the OEM end-effector pad shape results in a large wafer contact area, which may contribute to particle generation.
  • FIG. 12 depicts in greater detail some of the components of the robotic end effector of FIG. 3, namely, the flag 137 and the piston 131.
  • the actuator piston 131 is preferably reduced in size compared to the OEM component.
  • the smaller form factor of this component provides additional room for a particle barrier (see below).
  • the particular actuator chose in one particular, non-limiting embodiment of this configuration is rated to 10 million cycles, and achieved good results in both low and high pressure tests.
  • FIG. 13 depicts an end effector 401 equipped with a first particular, non- limiting embodiment of particle barrier 403 in accordance with the teachings herein.
  • This particle barrier 403 is mounted to the front of the actuator 405.
  • the particle barrier 403 preferably comprises polytetrafluoroethylene (PTFE), such as that sold under the trademark Teflon ® .
  • the particle barrier 403 may be threaded onto the actuator 405 and is preferably self-aligning to insure that the piston 407 does not rub on the particle barrier 403.
  • the particle barrier 403 is preferably designed with a double wall that provides high probability particle containment in the event of a leaking valve seal. Aside from the particle barrier 401, the remaining components of the end effector 401 are similar to those depicted in FIG. 4.
  • FIGs. 20-23 show a preferred embodiment of the particle barrier 403 and piston 407 in greater detail.
  • FIG. 14 depicts an end effector 501 equipped with a second particular, non- limiting embodiment of a particle barrier 503 that may be utilized in the devices and methodologies disclosed herein.
  • This particle barrier 503 may be utilized to create a separation between the wafer and the various end effector particle sources.
  • This foam creates a second line of defense for possible polyline or actuator leakages and also from various other robot induced particles streaming to the wafer side of the blade.
  • the material used for this particle barrier is preferably semiconductor-grade, closed cell foam, and is not a particle source. Aside from the particle barrier 501, the remaining components of the end effector 401 are similar to those depicted in FIG. 4. [0051] FIG.
  • FIG. 15 provides a comparison between an OEM position flag 137 (FIG. 15(a)) and a particular, nonlimiting embodiment of a modified position flag 537 in accordance with the teachings herein (FIG. 15(b)).
  • the modified position flag 537 has been redesigned in comparison to the OEM position flag 137 to reduce the surface area of the front wall 139 seen on the OEM flag. Without wishing to be bound by theory, this is believed to reduce the surface area of the front wall 139, thus reducing the air turbulence that may be created when it is actuated. In particular, as the actuator is extended, it will push air forward across the wafer. The surface area of the front wall may add to the mass of air being pushed forward and may thus increase turbulence. This may agitate nearby particles, pushing them onto the wafer.
  • FIGs. 24-27 show the modified flag 537 in greater detail.
  • This flag may be utilized as a component of a robotic end effector comprising a control unit and an end effector blade, and an actuator having a protrusion which advances and retracts along a first axis.
  • the protrusion is equipped on a terminal end thereof with a resilient mass, which is preferably in the form of a wheel.
  • the resilient mass traces out a three-dimensional space as said protrusion advances and retracts along said first axis.
  • the flag has a first terminal portion which is attached to the actuator, and a second terminal portion which is magnetically coupled to the control unit.
  • the flag has first and second segments that are adj oined at an angle (preferably about 90°). The first terminal portion of the flag is disposed on the first segment, and the second terminal portion of the flag is disposed on the second segment.
  • the first segment is equipped with a first portion having a first maj or surface which is essentially parallel to the first axis, and a second major surface which is essentially perpendicular to the first major surface.
  • the second major surface of the first segment is preferably essentially rectangular in shape.
  • the second major surface of said first segment is preferably essentially rectangular in shape.
  • the resilient mass is a wheel having a diameter d w
  • the second major surface has a diameter d 2
  • the first segment is equipped with a first portion having a first major surface which is essentially parallel to said first axis, and is further equipped with a second major surface which is essentially perpendicular to said first major surface and which is wholly disposed within said three-dimensional space.
  • This configuration may be utilized to minimize the air turbulence created as the actuator extends and retracts, since the surface area of the flag does not appreciably add to the mass of air being pushed forward (because the second major surface of the first section is hidden behind then resilient mass). This may thus reduce or eliminate the agitation of any nearby particles, thus helping to reduce or eliminate these particles as a source of wafer contamination.
  • FIG. 18 depicts another particular, non-limiting embodiment of an end effector 601 in accordance with the teachings herein.
  • the OEM pressure regulator 651 (see FIG. 16(a)) is preferably replaced with a robust SMC valve 653 (see FIG. 16(b)) that is tamperproof.
  • the valve 653 may be set to specified pressure and locked. This will help to ensure no changes can be made without proper investigation.
  • the valve 653 may be mounted in current location of OEM valve 651.
  • a tamperproof speed controller is also preferably installed in the robot arms to allow speed control for both extension and retraction of the piston and to prevent impact with the wafer and with internal actuator seals. The controller is tamperproof to prevent unauthorized adjustment.
  • the particular embodiment of the end effector 601 depicted also includes particle barriers 651, 653 which are similar or identical in design and functionality to the particle barriers 403 and 503 in FIGs. 13 and 14, respectively.
  • This end effector 601 further includes a flag 655 which is similar or identical to the enhanced flag 537 depicted in FIG. 15.
  • the devices and methodologies disclosed herein preferably utilize a pad, fang or tab that has been modified compared to the OEM component.
  • Particular, non-limiting embodiments of the modified pad 701 are depicted in FIGs. 17-18, and in greater detail in FIGs. 30-44.
  • FIG. 17(a) depicts a prior art pad 703 side by side with the modified pad 701.
  • the modified pad 701 comprises a polyaryletherketone, and more preferably, the modified pad 701 comprises a polyether ether ketone (PEEK), such as that sold under the tradename Ketron ® .
  • PEEK polyether ether ketone
  • the PEEK is preferably not carbon filled. This material provides excellent chemical resistance, very low moisture absorption and inherently good wear and abrasion resistance, and is unaffected by continuous exposure to environments.
  • the modified pad 701 is preferably modified in comparison to the OEM pad 703 to provide a smaller contact area, and no corner contact.
  • the modified pad 701 preferably dimensionally matches the OEM. It has been found that the modified pad 701 exhibits a longer lifetime than the OEM pad 703, and lower wear properties (e.g., over 3 million cycles with no discernible wear).
  • the OEM pad 703 is a carbon-filled polymer with a large wafer contact area. The OEM pad 703 exhibits high wear properties, showing signs of wear after 800K cycles and severe wear at 1 million cycles.
  • the modified pad 701 or tab includes a first portion 703 which is adapted to receive a semiconductor wafer thereon, and a second portion 705 which is raised with respect to said first portion and which is separated therefrom by way of a vertical wall 707.
  • the first portion 703 of each pad 701 is equipped with a front edge 709 which is parallel to the wall 707, and first 711 and second 713 lateral edges.
  • the front edge 709 adjoins the first lateral edge by way of a first beveled edge 715.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Effecteur terminal robotique qui comprend un boîtier, une lame d'effecteur terminal et un actionneur disposé dans le boîtier. L'actionneur comporte une saillie qui avance et se rétracte le long d'un axe. La saillie est équipée, sur une extrémité terminale de celle-ci, d'une masse élastique. L'effecteur terminal est en outre équipé d'une unité de commande, et d'une indicateur. L'indicateur a une première extrémité qui est fixée à l'actionneur, et une seconde extrémité qui est accouplée magnétiquement à l'unité de commande. L'indicateur a un profil qui réduit la production de particules.
PCT/US2018/024226 2017-02-24 2018-03-24 Effecteur terminal robotique atmosphérique WO2018157179A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762462934P 2017-02-24 2017-02-24
US62/462,934 2017-02-24

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WO2018157179A2 true WO2018157179A2 (fr) 2018-08-30
WO2018157179A3 WO2018157179A3 (fr) 2018-10-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020074719A1 (fr) * 2018-10-12 2020-04-16 Syddansk Universitet Système de tri d'objets
WO2023150732A3 (fr) * 2022-02-03 2023-11-09 Greene, Tweed Technologies, Inc. Effecteurs terminaux et patins d'effecteur terminaux ayant des polymères réticulés pour des applications de semi-conducteur visant à assurer une vitesse de fabrication améliorée et leurs procédés de fabrication et d'utilisation

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW321192U (en) * 1995-12-23 1997-11-21 Samsung Electronics Co Ltd A arm of robot for transporting semiconductor wafer
US7039498B2 (en) * 2003-07-23 2006-05-02 Newport Corporation Robot end effector position error correction using auto-teach methodology
CN102449754B (zh) * 2009-05-15 2015-10-21 恩特格林斯公司 具有聚合物突出物的静电吸盘
US8985935B2 (en) * 2012-02-17 2015-03-24 Novellus Systems, Inc. Mass damper for semiconductor wafer handling end effector
US9061423B2 (en) * 2013-03-13 2015-06-23 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020074719A1 (fr) * 2018-10-12 2020-04-16 Syddansk Universitet Système de tri d'objets
WO2023150732A3 (fr) * 2022-02-03 2023-11-09 Greene, Tweed Technologies, Inc. Effecteurs terminaux et patins d'effecteur terminaux ayant des polymères réticulés pour des applications de semi-conducteur visant à assurer une vitesse de fabrication améliorée et leurs procédés de fabrication et d'utilisation

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