WO2018149252A1 - Composant et terminal d'identification d'empreintes digitales - Google Patents

Composant et terminal d'identification d'empreintes digitales Download PDF

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Publication number
WO2018149252A1
WO2018149252A1 PCT/CN2018/071726 CN2018071726W WO2018149252A1 WO 2018149252 A1 WO2018149252 A1 WO 2018149252A1 CN 2018071726 W CN2018071726 W CN 2018071726W WO 2018149252 A1 WO2018149252 A1 WO 2018149252A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint recognition
mounting portion
fingerprint
recognition module
fingerprint identification
Prior art date
Application number
PCT/CN2018/071726
Other languages
English (en)
Chinese (zh)
Inventor
张文真
Original Assignee
广东欧珀移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2018149252A1 publication Critical patent/WO2018149252A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor

Definitions

  • the present invention relates to the field of terminals, and in particular, to a fingerprint identification component and a terminal.
  • the fingerprint recognition component includes a flexible circuit board and a fingerprint identification module
  • the flexible circuit board includes a mounting portion
  • the fingerprint recognition module is disposed on the mounting portion and electrically connected to the flexible circuit board, in order to prevent water from flowing into the mounting portion and fingerprint recognition
  • the gap between the modules causes a short circuit of the flexible circuit board, and a sealant is applied on the periphery of the mounting portion to seal the gap between the mounting portion and the fingerprint recognition module.
  • the sealant may flow from the mounting portion to other parts of the flexible circuit board and adhere to the flexible circuit board to cause the flexible circuit board to harden, which is disadvantageous to the deformation of the flexible circuit board and affects the normal use of the flexible circuit board.
  • Embodiments of the present invention provide a fingerprint identification component and a terminal.
  • a fingerprint identification component of an embodiment of the present invention includes a flexible circuit board including a mounting portion and a protruding portion connecting the mounting portion, and a fingerprint recognition module, wherein the fingerprint recognition module is disposed on the mounting portion
  • the protruding portion protrudes from the mounting portion toward an outer side of the fingerprint recognition module, the protruding portion includes a surface opposite to the fingerprint recognition module, and the surface is provided with a glue layer, the sparse layer
  • the glue layer is disposed adjacent to or in contact with the mounting portion.
  • the terminal of the embodiment of the present invention includes the fingerprint recognition component described above.
  • the glue-repellent layer can prevent the sealant on the periphery of the mounting portion from adhering to other parts of the flexible circuit board, thereby preventing the flexible circuit board from becoming hard and facilitating the deformation of the flexible circuit board. Normal use.
  • FIG. 1 is a perspective view of a fingerprint recognition component according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a fingerprint identification component according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of a fingerprint recognition assembly according to an embodiment of the present invention.
  • FIG. 4 is a schematic plan view of a terminal according to an embodiment of the present invention.
  • a flexible circuit board 10 a mounting portion 12, a protruding portion 14, a surface 142, an extension portion 144, a connecting portion 146;
  • Fingerprint identification module 20 fingerprint identification chip 22, package body 24, mounting surface 26, first pad 28;
  • the glue layer 30 The glue layer 30;
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • the fingerprint identification component 100 of the embodiment of the present invention includes a flexible circuit board 10 and a fingerprint identification module 20.
  • the flexible circuit board 10 includes a mounting portion 12 and a protruding portion 14 that connects the mounting portion 12.
  • the fingerprint recognition module 20 is disposed on the mounting portion 12.
  • the extension 14 projects from the mounting portion 12 to the outside of the fingerprint recognition module 20.
  • the protrusion 14 includes a surface 142 opposite to the fingerprint recognition module 20, and the surface 142 is provided with a glue layer 30 disposed adjacent to or in contact with the mounting portion 12.
  • the glue release layer 30 can prevent the sealant on the periphery of the mounting portion 12 from adhering to other portions of the flexible circuit board 10, thereby preventing the flexible circuit board 10 from becoming hard and facilitating the flexible circuit.
  • the board 10 is deformed and used normally.
  • a circuit is formed on the flexible circuit board 10, and the flexible circuit board 10 can be connected to an external device through a connector to enable the external device to have a fingerprint recognition function.
  • the fingerprint recognition module 20 is substantially oblong.
  • the fingerprint recognition module 20 can be designed into other shapes such as a cylindrical shape, a rectangular parallelepiped shape, and an elliptical shape according to actual conditions.
  • the glue release layer 30 includes a silk screen ink layer and/or a fluoride layer.
  • the glue releasing effect of the glue layer 30 is good, so that the sealant can be prevented from adhering to the surface 142.
  • the screen printing ink layer and the fluoride are less adhesive, the protruding portion 14 is less likely to be strongly bonded to the fingerprint recognition module 20, so that the protruding portion 14 can be easily deformed and easily connected to an external device.
  • the fluoride is an organic or inorganic compound containing a negative fluorine.
  • the fingerprint recognition assembly 100 includes a sealant 40.
  • the sealant 40 seals the gap between the mounting portion 12 and the fingerprint recognition module 20, and the glue layer 30 is disposed adjacent to or in contact with the sealant 40.
  • the sealant 40 can prevent water from entering the gap between the mounting portion 12 and the fingerprint recognition module 20 and affecting the electrical connection function between the mounting portion 12 and the fingerprint recognition module 20.
  • the glue release layer 30 can prevent the sealant 40 from flowing along the extension 14 to other locations of the flexible circuit board 10.
  • the fingerprint recognition module 20 when the fingerprint recognition component 100 is assembled, the fingerprint recognition module 20 may be first mounted on the mounting portion 12, and then the glue layer 30 is applied to the portion of the surface 142 near the mounting portion 12, and then at the mounting portion 12. A sealant 40 is applied to the fingerprint recognition module 20 to seal the gap between the mounting portion 12 and the fingerprint recognition module 20.
  • the sealant 40 When the sealant 40 is applied, the sealant 40 is liquid and has high fluidity. However, since the sealant 40 is not bonded to the glue release layer 30, it is possible to prevent the sealant from adhering to other positions of the flexible circuit board 10. 40, thereby preventing the sealant 40 from flowing to other locations of the flexible circuit board 10.
  • the fingerprint identification module 20 includes a fingerprint identification chip 22 and a package 24 encasing the fingerprint identification chip 22 .
  • the mounting portion 12 is electrically connected to the fingerprint recognition chip 22 .
  • the fingerprint recognition module 20 can implement the function of fingerprint recognition through the fingerprint recognition chip 22.
  • the fingerprint identification chip 22 is provided with a sensing pixel array facing the surface of the user's finger.
  • the finger can be placed at a position corresponding to the fingerprint identification chip 22, and the sensing pixel array can collect the user's fingerprint.
  • the pattern is followed by matching the fingerprint pattern of the user with the pre-stored fingerprint pattern. If the matching is successful, the fingerprint recognition is successful.
  • the encapsulation of the fingerprint recognition chip 22 by the package body 24 can reduce the influence of the interference signal on the fingerprint array when the fingerprint array is collected, so as to improve the accuracy of the fingerprint recognition module 20 in recognizing the fingerprint.
  • the fingerprint identification module 20 includes a mounting surface 26 opposite the mounting portion 12, the mounting surface 26 is formed with a first pad 28, and the first pad 28 can be connected to the fingerprint identification chip 22 by a gold wire.
  • the surface of the mounting portion 12 opposite to the fingerprint recognition module 20 is formed with a second pad (not shown), the second pad corresponds to the first pad 28, and the second pad is soldered together with the first pad 28 to achieve mounting.
  • the portion 12 is electrically connected to the fingerprint recognition chip 22.
  • the protrusion 14 includes an extension 144 and a connection 146.
  • the extension 144 extends outwardly from the edge of the fingerprint recognition module 20.
  • the connecting portion 146 is connected to the extending portion 144 and the mounting portion 12 .
  • the connecting portion 146 is opposite to the fingerprint recognition module 20 , and the surface of the connecting portion 146 opposite to the fingerprint recognition module 20 is provided with a glue releasing layer 30 .
  • the adhesive layer 30 is disposed on the surface of the connecting portion 146 opposite to the fingerprint recognition module 20, and the area of the glue layer 30 can be disposed on the smaller flexible circuit board 10, thereby saving the glue layer 30 to reduce the cost of the fingerprint recognition assembly 100.
  • the mounting portion 12 is substantially rectangular, the connecting portion 146 is connected to the long edge of the mounting portion 12, and the dimension L1 of the connecting portion 146 to the mounting portion 12 is smaller than the length L2 of the mounting portion 12, that is, L1 ⁇ L2.
  • the connecting portion 146 is small in size and easily deformed, so that the fingerprint recognition assembly 100 is easily connected to an external device.
  • the sealant 40 is annular and located at the periphery of the mounting portion 12, and the adhesive layer 30 extends from the mounting portion 12 in the extending direction of the protruding portion 14.
  • the absorbent layer 30 has an extension W1 larger than the ring.
  • the width of the sealant 40 is W2, that is, W1>W2. This allows all of the sealant 40 to not adhere to other locations on the flexible circuit board 10.
  • the fingerprint recognition component 100 includes a reinforcing sheet 50 disposed on the mounting portion 12, and the reinforcing sheet 50 and the fingerprint recognition module 20 are respectively disposed on opposite sides of the mounting portion 12.
  • the reinforcing sheet 50 can improve the strength of the mounting portion 12, and avoid the looseness of the flexible circuit board 10 and the fingerprint recognition module 20, resulting in poor electrical contact and affecting the fingerprint recognition function of the fingerprint recognition component 100.
  • the reinforcing sheet 50 is, for example, a steel sheet, so that the strength of the reinforcing sheet 50 can be ensured even when the thickness of the reinforcing sheet 50 is thin.
  • the reinforcing piece 50 is fitted to the mounting portion 12, and for example, the shape of the reinforcing piece 50 is substantially the same as the shape of the mounting portion 12. In the present embodiment, both the reinforcing sheet 50 and the mounting portion 12 are substantially rectangular. In addition, the size of the reinforcing sheet 50 is slightly smaller than the size of the mounting portion 12.
  • the fingerprint recognition component 100 includes a cover plate 60 overlaid on the fingerprint recognition module 20, and the cover plate 60 and the flexible circuit board 10 are respectively disposed on opposite sides of the fingerprint recognition module 20.
  • the cover 60 can prevent the fingerprint recognition module 20 from being damaged by impact.
  • the cover plate 60 is made of, for example, a harder material such as sapphire or ceramic to improve the impact resistance of the cover plate 60.
  • the cover plate 60 can be fixed to the fingerprint recognition module 20, for example, by an adhesive.
  • the terminal 200 of the embodiment of the present invention includes the fingerprint identification component 100 of any of the above embodiments.
  • the terminal 200 includes electronic devices such as a mobile phone, a tablet computer, and a smart wearable device.
  • the glue releasing layer 30 can prevent the sealant 40 around the periphery of the mounting portion 12 from adhering to other portions of the flexible circuit board 10, thereby preventing the flexible circuit board 10 from becoming hard and facilitating the flexible circuit board. 10 deformation and normal use.

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

L'invention concerne un composant d'identification d'empreintes digitales (100) ainsi qu'un terminal (200). Le composant d'identification d'empreintes digitales (100) comprend une carte de circuit souple (10) et un module d'identification d'empreintes digitales (20). La carte de circuit souple (10) comprend une partie d'installation (12) et une partie en saillie (14) fixée à celle-ci. Le module d'identification d'empreintes digitales (20) est disposé au-dessus de la partie d'installation (12). La partie en saillie (14) fait saillie à partir de la partie d'installation (12) et hors du module d'identification d'empreintes digitales (20). La partie en saillie (14) comprend une surface (142) disposée à l'opposé du module d'identification d'empreintes digitales (20). Une couche de colle (30) est disposée sur la surface (142). La couche de colle (30) est disposée à proximité de la partie d'installation (12) ou en contact avec la partie d'installation (12).
PCT/CN2018/071726 2017-02-16 2018-01-08 Composant et terminal d'identification d'empreintes digitales WO2018149252A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710084185.2A CN106897684A (zh) 2017-02-16 2017-02-16 指纹识别组件及终端
CN201710084185.2 2017-02-16

Publications (1)

Publication Number Publication Date
WO2018149252A1 true WO2018149252A1 (fr) 2018-08-23

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Application Number Title Priority Date Filing Date
PCT/CN2018/071726 WO2018149252A1 (fr) 2017-02-16 2018-01-08 Composant et terminal d'identification d'empreintes digitales

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CN (1) CN106897684A (fr)
WO (1) WO2018149252A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106897684A (zh) * 2017-02-16 2017-06-27 广东欧珀移动通信有限公司 指纹识别组件及终端
CN107548227A (zh) * 2017-08-30 2018-01-05 景旺电子科技(龙川)有限公司 一种指纹识别技术用fpc的钢片压制方法
CN107748861A (zh) * 2017-09-15 2018-03-02 南昌欧菲生物识别技术有限公司 指纹识别模组及电子装置

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
CN204576536U (zh) * 2015-03-06 2015-08-19 南昌欧菲生物识别技术有限公司 指纹识别装置、设有该装置的触摸屏及终端设备
CN106127195A (zh) * 2016-08-30 2016-11-16 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
CN205899562U (zh) * 2016-05-31 2017-01-18 维沃移动通信有限公司 一种指纹识别模组及终端设备
CN106897684A (zh) * 2017-02-16 2017-06-27 广东欧珀移动通信有限公司 指纹识别组件及终端

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629346B (zh) * 2013-01-21 2018-07-11 肯提克有限公司 在多成分表面上之表面預處理及液滴散佈控制
CN108319834B (zh) * 2016-08-16 2020-10-09 Oppo广东移动通信有限公司 输入组件和终端

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
CN204576536U (zh) * 2015-03-06 2015-08-19 南昌欧菲生物识别技术有限公司 指纹识别装置、设有该装置的触摸屏及终端设备
CN205899562U (zh) * 2016-05-31 2017-01-18 维沃移动通信有限公司 一种指纹识别模组及终端设备
CN106127195A (zh) * 2016-08-30 2016-11-16 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
CN106897684A (zh) * 2017-02-16 2017-06-27 广东欧珀移动通信有限公司 指纹识别组件及终端

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