WO2018149239A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
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- WO2018149239A1 WO2018149239A1 PCT/CN2017/119678 CN2017119678W WO2018149239A1 WO 2018149239 A1 WO2018149239 A1 WO 2018149239A1 CN 2017119678 W CN2017119678 W CN 2017119678W WO 2018149239 A1 WO2018149239 A1 WO 2018149239A1
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- WIPO (PCT)
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- electronic device
- light
- lcm
- circuit board
- metal
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
Definitions
- the present disclosure relates to the field of electronic technologies, and in particular, to an electronic device.
- Flash is the most common device that increases the exposure of a mobile phone camera.
- the flash will brighten the surrounding scene in the dark, thus making up for the lack of light and improving the brightness of the picture.
- ordinary white LED flashes are not suitable for self-timer.
- One of the problems is that it can cause serious color cast problems, leaving the skin dark and eclipsed.
- the second problem is that at such a close distance, a concentrated, intense flash will leave a noticeable spot on the face, sometimes causing "red-eye” problems. Therefore, a soft light is set in the mobile phone to fill the light, and the light of the soft light is divergent and very soft, and the diffused light can be uniformly placed on the surrounding objects, and the photographed color temperature is stable and the details are clear. The color is realistic. When the soft light is applied to the self-timer, the skin color is softer, more natural, more delicate, and there is no strong stimulation to the eyes.
- the current is usually increased compared to ordinary LED lights, and some even increase by a factor of two.
- the current increases, causing the junction temperature of the soft light to rise.
- the junction temperature is too high, affecting reliability and even burning.
- the soft lamp is mainly radiated by increasing the area and thickness of the copper plating layer in the flexible circuit board FPC.
- the heat dissipation effect is poor.
- the embodiments of the present disclosure provide an electronic device to solve the problem that the heat dissipation effect of the light source is poor.
- an embodiment of the present disclosure provides an electronic device including a liquid crystal module LCM metal bracket and a light module.
- One side of the liquid crystal module LCM metal bracket is recessed to receive the light module.
- the light module is located in the receiving cavity and is fixedly connected to the liquid crystal module LCM metal bracket; wherein the light module and the liquid crystal module LCM metal bracket can perform heat transfer.
- the receiving cavity is disposed on the metal frame of the liquid crystal module LCM for accommodating and fixing the light module
- the light module can be effectively dissipated by using the LCM metal bracket with a large area, thereby effectively reducing the light module.
- the junction temperature of the lighting module while preventing the temperature from being concentrated in the same area, the present disclosure improves the heat dissipation effect of the light source.
- FIG. 1 is a structural diagram of an electronic device according to an embodiment of the present disclosure
- Figure 2 is a cross-sectional structural view taken along line A-A of Figure 1;
- Figure 3 is an enlarged structural view of B in Figure 2;
- FIG. 4 is a structural diagram of an electronic device according to an embodiment of the present disclosure.
- the electronic device provided by the present disclosure includes a liquid crystal module (LCM) metal bracket 10 and a light module 20 , and one side of the LCM metal bracket 10 is recessed to receive the light module 20 .
- the light module 20 is located in the receiving cavity 101 and is fixedly connected to the LCM metal bracket 10; wherein the light module 20 and the LCM metal bracket 10 can perform heat transfer.
- the electronic device provided by the embodiment of the present disclosure may include at least one of a mobile phone, a tablet computer, a laptop portable computer, an in-vehicle computer, and a smart television.
- This embodiment uses a mobile phone as an example for detailed description.
- the light module 20 is a front fill light of the mobile phone, and can be used for the user to fill light during the self-timer.
- the light module 20 can include a flexible circuit board 201 and a light source 202 disposed on the flexible circuit board. The opposite sides of the flexible circuit board 201 are respectively The light source 202 is fixedly connected to the bottom surface of the receiving cavity 101.
- the light source 202 can be a common LED light. In this embodiment, the light source 202 is a soft light.
- the light source 202 can be soldered and fixed on the flexible circuit board 201.
- the flexible circuit board 201 can be bonded and fixedly connected to the bottom surface of the receiving cavity 101, and can be locked and fixed by providing a snap structure, which is not further limited herein. .
- the LCM metal bracket 10 is located inside the mobile phone and constitutes a bracket of the mobile phone casing, and the lighting module 20 is a front fill light of the mobile phone.
- a liquid crystal module display screen and a touch screen 30 are disposed above the LCM metal bracket 10, and the touch screen 30 is provided with a light exit hole (not shown), and the LCM metal bracket 10 corresponds to the light exit hole of the touch screen.
- the light receiving module 101 is recessed inwardly to form the receiving cavity 101.
- the light module 20 is received in the receiving cavity 101, so that the light emitted by the light module 20 can be emitted through the light exiting hole on the touch screen 30.
- the depth of the recessed cavity of the receiving cavity 101 can be set according to actual needs, as long as the light module 20 can be placed and the light module 20 is not in contact with the touch screen 30, no further limitation is provided herein. .
- the heat of the light module 20 will be transmitted to the LCM metal bracket 10, and the heat is dissipated through the LCM metal bracket 10 to prevent the junction temperature of the light module 20 from being high.
- the electronic device includes the LCM metal bracket 10 and the light module 20, and one side of the LCM metal bracket 10 is recessed to form a receiving cavity 101 for receiving the light module 20, the light
- the module 20 is located in the receiving cavity 101 and is fixedly connected to the LCM metal bracket 10 .
- the light module 20 and the LCM metal bracket 10 can perform heat transfer. Since the receiving cavity 101 is disposed on the LCM metal bracket 10 for accommodating and fixing the light module 20, the light module 20 can be effectively dissipated by using the LCM metal bracket 10 with a large area, thereby effectively reducing the light module 20
- the junction temperature while preventing the temperature from being concentrated in the same area the present disclosure improves the heat dissipation effect of the light source.
- the light module 20 further includes a metal plate 203 disposed on a side of the flexible circuit board 201 facing away from the light source 202.
- One side of the metal plate 203 is fixedly connected to the flexible circuit board 201, and One side is fixedly connected to the bottom surface of the receiving cavity 101.
- the metal plate 203 is disposed, and the size of the metal plate 203 can be It is consistent with the size of the flexible circuit board 201 and is made of thermal conductivity. Specifically, during the heat transfer process, the heat of the light source 202 will be transmitted to the metal plate 203 through the flexible circuit board 201, and then transferred to the LCM metal support 10 by the metal plate 203.
- the metal plate 203 is adhesively and fixedly connected to the bottom surface of the receiving cavity 101.
- a thermally conductive double-sided tape may be provided to bond the fixed connection of the metal plate 203, that is, a heat-conductive double-sided tape (not shown) for adhesively fixing is disposed between the metal plate 203 and the bottom surface of the receiving cavity 101.
- a portion of the metal plate 203 and the bottom surface of the receiving cavity 101 may be provided with a thermally conductive double-sided adhesive, so that the heat transfer between the metal plate 203 and the LCM metal support 10 is improved, thereby increasing the light source 202. heat radiation.
- the flexible circuit board 201 is coated with a metal heat conductive layer (not shown) corresponding to the position at which the light source 202 is mounted.
- the material of the metal heat conduction layer can be set according to actual needs. For example, a copper layer can be formed by using copper. Since a metal heat conduction layer is disposed on the flexible circuit board 201, the heat dissipation effect of the light source 202 can be increased. Further, in order to increase the heat dissipation effect of the light source 202, the flexible circuit board 201 is provided with at least one through hole (not shown) at a position of the metal heat conduction layer, and the through hole passes through the metal heat conduction layer.
- the material of the LCM metal bracket described above may be set according to actual needs, for example, the LCM metal bracket is made of magnesium alloy or aluminum alloy.
- FIG. 4 is a structural diagram of an electronic device provided by an implementation of the present disclosure.
- the electronic device 400 includes a radio frequency (RF) circuit 410, a memory 420, an input unit 430, a display unit 440, a processor 450, an audio circuit 460, a communication module 470, a power source 480, an LCM metal bracket, and Lighting module.
- RF radio frequency
- One side of the LCM metal bracket is recessed to form a receiving cavity for receiving the light module, and the light module is located in the receiving cavity and is fixedly connected to the LCM metal bracket; wherein the light mode The group and the LCM metal bracket can carry out heat transfer.
- the light module comprises a light source and a flexible circuit board, and opposite sides of the flexible circuit board are respectively fixedly connected to the bottom surface of the light source and the receiving cavity.
- the light module further includes a metal plate disposed on a side of the flexible circuit board facing away from the light source, one side of the metal plate is fixedly connected to the flexible circuit board, and the other side is The bottom surface of the receiving cavity is fixedly connected.
- the metal plate is adhesively and fixedly connected to the bottom surface of the receiving cavity.
- a heat-conductive double-sided tape for bonding and fixing is disposed between the metal plate and the bottom surface of the receiving cavity.
- the flexible circuit board is coated with a metal heat conductive layer corresponding to a position where the light source is mounted.
- the flexible circuit board is provided with at least one through hole at a position of the metal heat conduction layer, and the through hole passes through the metal heat conduction layer.
- the light source is a soft light.
- the LCM metal bracket is made of a magnesium alloy or an aluminum alloy.
- the input unit 430 can be configured to receive numeric or character information input by the user, and generate a signal input related to user settings and function control of the electronic device 400.
- the input unit 430 may include a touch panel 431.
- the touch panel 431 also referred to as a touch screen, can collect touch operations on or near the user (such as the operation of the user using any suitable object or accessory such as a finger or a stylus on the touch panel 431), and according to the preset The programmed program drives the corresponding connection device.
- the touch panel 431 may include two parts: a touch detection device and a touch controller.
- the touch detection device detects the touch orientation of the user, and detects a signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts the touch information into contact coordinates, and sends the touch information.
- the processor 450 is provided and can receive commands from the processor 450 and execute them.
- the touch panel 431 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves.
- the input unit 430 may further include other input devices 432, which may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and the like. One or more of them.
- the display unit 440 can be used to display information input by the user or information provided to the user and various menu interfaces of the electronic device 400.
- the display unit 440 can include a display panel 441.
- the display panel 441 can be configured in the form of an LCD or an Organic Light-Emitting Diode (OLED).
- the touch panel 431 can cover the display panel 441 to form a touch display screen, and when the touch display screen detects a touch operation on or near it, it is transmitted to the processor 450 to determine the type of the touch event, and then the processor 450 provides a corresponding visual output on the touch display depending on the type of touch event.
- the touch display includes an application interface display area and a common control display area.
- the arrangement manner of the application interface display area and the display area of the common control is not limited, and the arrangement manner of the two display areas can be distinguished by up-and-down arrangement, left-right arrangement, and the like.
- the application interface display area can be used to display the interface of the application. Each interface can contain interface elements such as at least one application's icon and/or widget desktop control.
- the application interface display area can also be an empty interface that does not contain any content.
- the common control display area is used to display controls with high usage, such as setting buttons, interface numbers, scroll bars, phone book icons, and the like.
- the processor 450 is a control center of the electronic device 400, and connects various parts of the entire mobile phone by using various interfaces and lines, by running or executing software programs and/or modules stored in the first memory 421, and calling the second storage.
- the data within the memory 422 performs various functions and processing data of the electronic device 400 to thereby perform overall monitoring of the electronic device 400.
- the processor 450 can include one or more processing units.
- the electronic device includes at least one of a mobile phone, a tablet computer, a laptop portable computer, a car computer, and a smart TV.
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- Liquid Crystal (AREA)
Abstract
一种电子设备,该电子设备包括液晶模组LCM金属支架(10)和灯光模组(20),LCM金属支架(10)的一侧凹陷形成用于收容灯光模组(20)的收容腔(101)内,灯光模组(20)位于收容腔(101)内且与液晶模组LCM金属支架(10)固定连接。其中,灯光模组(20)与液晶模组LCM金属支架(10)可进行热传递。
Description
相关申请的交叉引用
本申请主张在2017年2月20日在中国提交的中国专利申请号No.201710090234.3的优先权,其全部内容通过引用包含于此。
本公开涉及电子技术领域,尤其涉及一种电子设备。
闪光灯是最常见的增加手机相机曝光量的设备。闪光灯在暗光环境下会打亮周围景物,从而弥补光线不足,提升画面亮度。然而,普通的白色LED闪光灯却不适用于自拍。问题之一是它会产生严重的偏色问题,让皮肤变得暗黄失色。问题之二是在如此近的距离下,集中、强烈的闪光,会在脸上留下明显的光斑,有时也会造成“红眼”问题。因此,在手机中设置了柔光灯进行补光,柔光灯的光线是发散的,且非常的柔和,能将漫射光均匀的投放在周围物体上,拍摄出的画面色温稳定,细节清晰,色彩逼真。当柔光灯应用到自拍时,就会把肤色展现的更加柔和、自然、细腻,而且对眼睛也没有强烈的刺激。
当柔光灯发出均匀、柔和光线时,电流通常比普通LED灯有所增加,有的甚至增加至两倍之多。电流增加,导致柔光灯的结温升高。结温过高,影响可靠性,甚至烧毁。
在相关技术中,主要通过增加柔性电路板FPC中的镀铜层的面积以及厚度对柔光灯进行散热。但是由于FPC面积和厚度有限制,所以散热效果较差。
发明内容
本公开实施例提供一种电子设备,以解决光源散热效果较差的问题。
第一方面,本公开实施例提供了一种电子设备,包括液晶模组LCM金属支架和灯光模组,所述液晶模组LCM金属支架的一侧凹陷形成用于收容所述 灯光模组的收容腔内,所述灯光模组位于所述收容腔内且与所述液晶模组LCM金属支架固定连接;其中,所述灯光模组与液晶模组LCM金属支架可进行热传递。
在本公开实施例中,由于在液晶模组LCM金属支架上设置收容腔用于收容并固定灯光模组,从而可以有效利用面积较大的LCM金属支架对灯光模组进行散热,进而可以有效降低灯光模组的结温,同时防止温度集中在同一区域,因此本公开提高了光源的散热效果。
为了更清楚地说明本公开实施例的技术方案,下面将对本公开实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获取其他的附图。
图1是本公开实施例提供的电子设备的结构图;
图2是图1中沿A-A线截取的剖面结构图;
图3是图2中B处的放大结构图;以及
图4是本公开实施例提供的电子设备的结构图。
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获取的所有其他实施例,都属于本公开保护的范围。
参照图1至图3,本公开提供的电子设备包括液晶模组(LCM)金属支架10和灯光模组20,所述LCM金属支架10的一侧凹陷形成用于收容所述灯光模组20的收容腔101内,所述灯光模组20位于所述收容腔101内且与所述LCM金属支架10固定连接;其中,所述灯光模组20与LCM金属支架10可进行热传递。
本公开实施例提供的电子设备可以包括手机、平板电脑、膝上型便携计 算机、车载电脑、智能电视机中的至少一项。本实施例以手机为例进行详细说明。具体的,上述灯光模组20为手机的前置补光灯,可以用于用户在自拍时进行补光。
上述灯光模组20的结构可以根据实际需要进行设置,例如该灯光模组20可以包括柔性电路板201和设置在该柔性电路板上的光源202,该柔性电路板201的两相对侧分别与所述光源202和收容腔101的底面固定连接。其中光源202可以为普通LED灯,本实施例中,该光源202为柔光灯。该光源202可以焊接固定在柔性电路板201上,柔性电路板201可以与收容腔101的底面进行粘合固定连接,还可以通过设置卡扣结构进行卡合固定连接,在此不做进一步的限定。
具体的,以手机为例,上述LCM金属支架10位于手机内部,构成手机外壳的支架,上述灯光模组20为手机的前置补光灯。具体的,如图所示,LCM金属支架10上方设置有液晶模组显示屏以及触摸屏30,该触摸屏30设有出光孔(图中未示出),上述LCM金属支架10对应触摸屏的出光孔的位置向内凹陷形成上述收容腔101,上述灯光模组20容置于该收容腔101内,从而使得灯光模组20发出的光线能够通过该触摸屏30上的出光孔射出。
应当说明的是,上述收容腔101凹陷的深度可以根据实际需要进行设置,只要能够放置灯光模组20,且使得灯光模组20不会与触摸屏30相接触即可,在此不做进一步的限定。
在灯光模组20正常工作的情况下,灯光模组20的热量将会传递到LCM金属支架10上,通过LCM金属支架10进行散热,以防止灯光模组20的结温较高。
这样,本公开实施例中,电子设备包括LCM金属支架10和灯光模组20,所述LCM金属支架10的一侧凹陷形成用于收容所述灯光模组20的收容腔101内,所述灯光模组20位于所述收容腔101内,且与所述LCM金属支架10固定连接。所述灯光模组20与LCM金属支架10可进行热传递。由于在LCM金属支架10上设置收容腔101用于收容并固定灯光模组20,从而可以有效利用面积较大的LCM金属支架10对灯光模组20进行散热,进而可以有效降低灯光模组20的结温,同时防止温度集中在同一区域,因此本公开提高 了光源的散热效果。
进一步的,上述灯光模组20还包括设于所述柔性电路板201背离所述光源202的一侧的金属板203,所述金属板203的一侧与所述柔性电路板201固定连接,另一侧与所述收容腔101的底面固定连接。
由于柔性电路板201为柔软结构,为了避免在安装过程中对柔性电路板201的损害,提高柔性电路板201固定的强度,本实施例中,设置上述金属板203,该金属板203的大小可以与柔性电路板201的大小一致,材质为具有导热性。具体的,在传热的过程中,光源202的热量将通过柔性电路板201传到金属板203上,再由金属板203传递到LCM金属支架10上。
具体的,上述金属板203与所述收容腔101的底面粘合固定连接。例如,可以设置导热双面胶对金属板203进行粘合固定连接,即上述金属板203与收容腔101的底面之间设有用于粘合固定的导热双面胶(图中未示出)。
此外,还可以在金属板203与收容腔101的底面之间未设置导热双面胶的部分设置导热硅胶,从而提高金属板203与LCM金属支架10之间的热传递效果,进而增加光源202的散热效果。
进一步的,基于上述实施例,上述柔性电路板201对应安装所述光源202的位置涂覆有金属导热层(图中未示出)。该金属导热层的材质可以根据实际需要进行设置,例如可以采用铜形成铜层,由于在柔性电路板201上设置金属导热层,可以增加光源202的散热效果。进一步的,为了增加光源202的散热效果,上述柔性电路板201在所述金属导热层的位置设有至少一通孔(图中未示出),所述通孔穿过所述金属导热层。
应当说明的是,上述所述LCM金属支架的材质可以根据实际需要进行设置,例如该LCM金属支架由镁合金或者铝合金制成。
请参阅图4,图4是本公开实施提供的电子设备的结构图。
如图4所示,电子设备400包括射频(Radio Frequency,RF)电路410、存储器420、输入单元430、显示单元440、处理器450、音频电路460、通信模块470、电源480、LCM金属支架和灯光模组。所述LCM金属支架的一侧凹陷形成用于收容所述灯光模组的收容腔内,所述灯光模组位于所述收容腔内且与所述LCM金属支架固定连接;其中,所述灯光模组与LCM金属支架 可进行热传递。
可选的,所述灯光模组包括光源和柔性电路板,所述柔性电路板的两相对侧分别与所述光源和收容腔的底面固定连接。
可选的,所述灯光模组还包括设于所述柔性电路板背离所述光源的一侧的金属板,所述金属板的一侧与所述柔性电路板固定连接,另一侧与所述收容腔的底面固定连接。
可选的,所述金属板与所述收容腔的底面粘合固定连接。
可选的,所述金属板与收容腔的底面之间设有用于粘合固定的导热双面胶。
可选的,所述柔性电路板对应安装所述光源的位置涂覆有金属导热层。
可选的,所述柔性电路板在所述金属导热层的位置设有至少一通孔,所述通孔穿过所述金属导热层。
可选的,所述光源为柔光灯。
可选的,所述LCM金属支架由镁合金或者铝合金制成。
其中,输入单元430可用于接收用户输入的数字或字符信息,以及产生与电子设备400的用户设置以及功能控制有关的信号输入。具体地,本公开实施例中,该输入单元430可以包括触控面板431。触控面板431,也称为触摸屏,可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板431上的操作),并根据预先设定的程序驱动相应的连接装置。可选的,触控面板431可包括触摸检测装置和触摸控制器两个部分。其中,触摸检测装置检测用户的触摸方位,并检测触摸操作带来的信号,将信号传送给触摸控制器;触摸控制器从触摸检测装置上接收触摸信息,并将它转换成触点坐标,再送给该处理器450,并能接收处理器450发来的命令并加以执行。此外,可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板431。除了触控面板431,输入单元430还可以包括其他输入设备432,其他输入设备432可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆等中的一种或多种。
其中,显示单元440可用于显示由用户输入的信息或提供给用户的信息 以及电子设备400的各种菜单界面。显示单元440可包括显示面板441,可选的,可以采用LCD或有机发光二极管(Organic Light-Emitting Diode,OLED)等形式来配置显示面板441。
应注意,触控面板431可以覆盖显示面板441,形成触摸显示屏,当该触摸显示屏检测到在其上或附近的触摸操作后,传送给处理器450以确定触摸事件的类型,随后处理器450根据触摸事件的类型在触摸显示屏上提供相应的视觉输出。
触摸显示屏包括应用程序界面显示区及常用控件显示区。该应用程序界面显示区及该常用控件显示区的排列方式并不限定,可以为上下排列、左右排列等可以区分两个显示区的排列方式。该应用程序界面显示区可以用于显示应用程序的界面。每一个界面可以包含至少一个应用程序的图标和/或widget桌面控件等界面元素。该应用程序界面显示区也可以为不包含任何内容的空界面。该常用控件显示区用于显示使用率较高的控件,例如,设置按钮、界面编号、滚动条、电话本图标等应用程序图标等。
其中处理器450是电子设备400的控制中心,利用各种接口和线路连接整个手机的各个部分,通过运行或执行存储在第一存储器421内的软件程序和/或模块,以及调用存储在第二存储器422内的数据,执行电子设备400的各种功能和处理数据,从而对电子设备400进行整体监控。可选的,处理器450可包括一个或多个处理单元。
电子设备包括手机、平板电脑、膝上型便携计算机、车载电脑、智能电视机中的至少一项。
以上,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以权利要求的保护范围为准。
Claims (10)
- 一种电子设备,包括液晶模组LCM金属支架和灯光模组,其中,所述液晶模组LCM金属支架的一侧凹陷形成用于收容所述灯光模组的收容腔内,所述灯光模组位于所述收容腔内,且与所述液晶模组LCM金属支架固定连接;,所述灯光模组与LCM金属支架可进行热传递。
- 根据权利要求1所述的电子设备,其中,所述光灯模组包括光源和柔性电路板,所述柔性电路板的两相对侧分别与所述光源和收容腔的底面固定连接。
- 根据权利要求2所述的电子设备,其中,所述灯光模组还包括设于所述柔性电路板背离所述光源的一侧的金属板,所述金属板的一侧与所述柔性电路板固定连接,另一侧与所述收容腔的底面固定连接。
- 根据权利要求3所述的电子设备,其中,所述金属板与所述收容腔的底面粘合固定连接。
- 根据权利要求4所述的电子设备,其中,所述金属板与收容腔的底面之间设有用于粘合固定的导热双面胶。
- 根据权利要求2所述的电子设备,其中,所述柔性电路板对应安装所述光源的位置涂覆有金属导热层。
- 根据权利要求6所述的电子设备,其中,所述柔性电路板在所述金属导热层的位置设有至少一通孔,所述通孔穿过所述金属导热层。
- 根据权利要求2所述的电子设备,其中,所述光源为柔光灯。
- 根据权利要求1至8中任一项所述的电子设备,其中,所述液晶模组LCM金属支架由镁合金或者铝合金制成。
- 根据权利要求1至8中任一项所述的电子设备,其中,所述电子设备包括手机、平板电脑、膝上型便携计算机、车载电脑、智能电视机中的至少一项。
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