WO2018149016A1 - 一种移动设备的金属壳及其制备方法、移动设备 - Google Patents

一种移动设备的金属壳及其制备方法、移动设备 Download PDF

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Publication number
WO2018149016A1
WO2018149016A1 PCT/CN2017/078156 CN2017078156W WO2018149016A1 WO 2018149016 A1 WO2018149016 A1 WO 2018149016A1 CN 2017078156 W CN2017078156 W CN 2017078156W WO 2018149016 A1 WO2018149016 A1 WO 2018149016A1
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Prior art keywords
slit
slits
conductive film
mobile device
metal shell
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PCT/CN2017/078156
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English (en)
French (fr)
Inventor
郭文平
尹帮实
罗建红
郭阳
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201780018362.5A priority Critical patent/CN108780944B/zh
Publication of WO2018149016A1 publication Critical patent/WO2018149016A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith

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  • the present application relates to the field of electronic devices, and in particular, to a metal case for a mobile device, a method for preparing the same, and a mobile device.
  • the micro-slit antenna can reduce the splitting feeling of the antenna of the mobile phone antenna, improve the beauty of the mobile phone, and gradually become the mainstream demand for the design.
  • the current mobile phone micro-seam design is mainly based on the removal of part of the metal on the metal back shell by CNC machine tool or laser cutting to obtain a plurality of parallel micro-seams, and then the metal micro-seam is filled by the nano-injection or glue injection scheme, through the plastic Or the insulation of the glue realizes that the middle and lower sections of the back cover of the mobile phone are not connected, and the electrical requirements of the mobile phone antenna signal for the rear case are achieved.
  • the micro-sewing process is complicated, and at the same time, the injection molding is difficult, and the injection molding is incomplete, which is not conducive to improving the yield rate and increasing the production cost.
  • the present invention provides a metal shell of a mobile device, a preparation method thereof, and a mobile device, which are used to solve the problem that the micro-seam processing is difficult, the injection molding is difficult, the injection molding is incomplete, and the yield of the mobile device is improved.
  • the present application provides a metal casing of a mobile device, the metal casing of the mobile device includes a casing, the casing is provided with at least one first slit, and the at least one first slit divides the casing into at least Two parts of electrical insulation, each of which is filled with an insulator;
  • the method further includes a conductive film covering the surface of the casing, and for each of the at least one first slit, the conductive film is provided with at least two parallel and connected with the first slit a second slit, the at least two second slits dividing the conductive film into a plurality of electrically insulating portions, each of the second slits being filled with an insulator.
  • the width of each of the first slits is greater than the width of each of the second slits corresponding to the first slit, that is, the metal shell of the mobile device is provided with a wider first slit on the housing.
  • a narrow second slit is disposed on the conductive film, thereby reducing the difficulty of processing the gap and the filling difficulty, and improving the yield of the mobile device; and the conductive film covers the first gap of the wider surface of the casing to make the first gap Not visible in appearance, the narrow second slit on the conductive film can reduce the cracking feeling of the metal shell at the slit and enhance the appearance effect of the metal shell.
  • At least one of the second slits falls into the first slit at a vertical projection portion of the surface of the housing.
  • the conductive film may be a metal film or a non-metal film having electrical conductivity.
  • the conductive film is a metal film, and the metal film has a metallic texture and can improve the metal shell. The appearance of the body.
  • the thickness of the metal film is between 1 um and 50 um, such as 1 um, 10 um, 25 um, 40 um, and 50 um.
  • each of the first slits has a width of between 1.0 mm and 3.0 mm, and each of the second strips
  • the width of the slit is between 0.1mm and 1.0mm, for example, the width of each first slit is 1.5mm, the width of each second slit is 0.5mm, or the width of each first slit is 1.8mm, each strip The width of the second slit is taken to be 0.4 mm.
  • the present application also provides a method for preparing a metal shell of the above mobile device, the preparation method comprising:
  • An insulator is filled in each of the second slits.
  • the width of each of the first slits is greater than the width of each of the second slits corresponding to the first slits. Since the casing is thick, when the gap is cut on the surface of the casing, the width of the first slit is wide, which is advantageous for reducing the difficulty of cutting and the difficulty of filling, and avoiding incomplete filling; when cutting the gap on the surface of the conductive film, The width of the two slits is relatively narrow. Since the conductive film itself is relatively thin, the cutting and filling of the second slit are relatively easy, and at the same time, it is advantageous to improve the splitting feeling of the metal shell at the slit.
  • At least one first slit for each of the at least one first slit, cutting at least two second slits parallel to and communicating with the first slit on the conductive film, at least one second slit in the shell A vertical projection portion of the body surface falls within the first gap.
  • a metal film is plated on the surface of the casing by an electroplating process.
  • the present application further provides a mobile device, the mobile device includes a device body and a metal case according to any one of the above items, and an antenna disposed on the device body, wherein At least a portion of the two portions of the metal shell that are at least electrically insulated is used as a radiating element of the antenna.
  • the metal shell of the mobile device is provided with a wider first slit on the casing, and a narrow second slit is disposed on the conductive film, which reduces the difficulty of processing the gap and the filling difficulty, and improves the movement. a yield rate of the device; and each of the first slits communicates with the at least two second slits such that the insulator in the first slit is integrated with the insulator in the second slit, and the metal shell is at least divided into electricity
  • the two parts of the insulation, at least a part of the two parts of the metal case which are electrically insulated, serve as a radiating element of the antenna, thereby avoiding the shielding effect of the metal case on the antenna signal.
  • FIG. 1 is an appearance view of a metal shell provided by an embodiment of the present application.
  • Figure 1.1 is a structural relationship diagram of a first slot and a second slot provided in Embodiment 1 of the present application;
  • Figure 1.2 is a structural relationship diagram of another first slit and a second slit provided in Embodiment 1 of the present application;
  • Figure 1.3 is a structural relationship diagram of a first slot and a second slot provided in Embodiment 2 of the present application;
  • Figure 1.4 is a structural relationship diagram of another first slit and a second slit provided in Embodiment 2 of the present application;
  • Figures 2.1 to 2.5 are process flow diagrams for preparing a metal shell having the structure shown in Figure 1.1.
  • the embodiment of the present invention provides a metal shell of a mobile device, which solves the problems of micro-sewing processing and micro-stitching on the metal shell in the prior art, and has the problems of high difficulty and low yield, and improves the yield of the mobile device.
  • the complete metal shell will generate electromagnetic shielding and block the transmission of electromagnetic waves, thereby affecting the communication function of the mobile device, it is necessary to process the gap on the metal shell and fill the gap with the insulator to form a partition, and process the conventional gap on the metal shell.
  • the width of the conventional slit is generally not less than 1.0 mm, the width of the conventional slit is large, so that the metal shell has a splitting feeling at the slit, which affects the appearance of the metal shell.
  • micro-processing is usually performed on the metal shell. The seam is to reduce the influence on the metal shell.
  • the width of the micro slit is narrow, and the width is generally between 0.01 and 1.0 mm.
  • the micro-seam processing and the micro-seam injection are difficult and easy. The problem of incomplete filling in the gap affects the quality of the metal shell.
  • FIG. 1 is an appearance effect diagram of the metal shell
  • FIG. 1.1 is a metal shell at AA.
  • a cross-sectional view of the metal casing includes a casing 10 having at least one first slit 11 and at least one first slit 11 dividing the casing 10 into at least two portions electrically insulated, each of the first slits 11
  • the interior is filled with an insulator 30 such as a caulk or an injection molded plastic.
  • first slits 11 may be cut on the casing 10, and the width of each of the first slits 11 is between 1.0 mm and 3.0 mm, for example, 1.0 mm, 1.5 mm, and 2.0. Mm, 2.5 mm, 3.0 mm; the first slit 11 on the casing 10 belongs to a conventional slit, and the width of the slit is large, and therefore, the first slit 11 is easy to process and injection molding is easily performed in the first slit 11.
  • the metal shell further includes a conductive film 20 covering the surface of the casing 10.
  • the conductive film 20 makes the first slit 11 invisible in appearance, thereby improving the appearance effect of the metal shell, and the conductive film 20 can be It is a metal film, such as a film of a metal such as aluminum, gold, silver, platinum, nickel, etc., the metal film has a metallic luster, which improves the texture and appearance of the metal shell.
  • the thickness of the metal film is between 1 um. Between 50 ⁇ m, such as 1 um, 10 um, 25 um, 40 um, 50 um, or the conductive film 20 may also be a non-metal film having electrical conductivity.
  • the conductive film 20 is further provided with a second slit 21, and for each of the first slits 11 in the at least one first slit 11 on the surface of the casing 10, the conductive film 20 is provided thereon.
  • At least two second slits 21 parallel to and communicating with the first slit 11, and at least two second slits 21 divide the conductive film 20 into a plurality of electrically insulating portions, each of the second slits 21 being filled with an insulator 30 , such as caulking or injection molding plastics and other insulation 30.
  • each of the first slits 11 and at least two second slits 21 that are parallel and in communication with the first slits 11 are divided into one slit unit, and one, two or more such ones may be disposed on the metal shell.
  • a slit unit in which each vertical projection of the second slit 21 on the surface of the housing 10 falls into the first slit 11, or at least one second slit 21 falls into the vertical projection portion of the surface of the housing 10.
  • the metal shell is provided with a slit unit, and the slit unit includes a first slit 11 and three second slits 21 , wherein the structural relationship between the first slit 11 and the second slit 21 has various arrangement manners.
  • the slit unit includes a first slit 11 and three second slits 21 , wherein the structural relationship between the first slit 11 and the second slit 21 has various arrangement manners.
  • the second slit 21a, the second slit 21b, and the second slit 21c are sequentially recorded, and each second slit 21 is
  • the first slits 11 are parallel and connected, and the vertical projections of the second slits 21 on the surface of the housing 10 all fall into the first slits 11.
  • the left of the second slits 21a The side edges coincide with the side edges on the same side of the first slit 11, in the second In the projection of the slit 21b, the two sides of the second slit 21b are interposed between the two sides of the first slit 11, and in the projection of the second slit 21c, the right side of the second slit 21c and the first slit
  • the sides on the same side of 11 overlap, or, as shown in FIG. 1.2, the vertical projections of the second slit 21a, the second slit 21b, and the second slit 21c on the surface of the casing 10 are both in the first slit 11 Between the sides.
  • At least two second slits 21 fall into the first slit 11 at a vertical projection portion of the surface of the casing 10.
  • each slit unit at least two second slits 21 are formed.
  • the vertical projection portion of the surface 10 falls into the first slit 11.
  • the three second slits 21 are arranged side by side on the conductive film 20.
  • the second slit 21a and the second slit 21c are respectively located at the two ends, and the second slit 21b is located between the second slit 21a and the second slit 21c.
  • the second slit 21a falls into the first slit 11 at the vertical projection portion of the surface of the casing 10, that is, in the projection of the second slit 21a, the left side is located outside the first slit 11, and the right side is located in the first slit. 11; the vertical projection of the second slit 21b and the second slit 21c on the surface of the casing 10 falls into the first slit 11.
  • the second slit 21a falls into the first slit 11 at the vertical projection portion of the surface of the casing 10
  • the second slit 21c falls into the first slit 11 at the vertical projection portion of the surface of the casing 10. .
  • the width of each of the second slits 21 is smaller than the width of the first slits 11.
  • the width of the first slits 11 is between 1.0 mm and 3.0 mm
  • the width of each of the second slits 21 is The width is between 0.1 mm and 1.0 mm.
  • the width of the first slit 11 is 1.8 mm
  • the width of the second slit 21 is 0.4 mm
  • the adjacent two are second.
  • the distance between the slits 21 is taken to be 0.3 mm.
  • the first slit 11 and the second slit 21 may be linear slits or curved slits such as U-shaped slits.
  • the first slot 11 is parallel and in communication with the at least two second slots 21, that is, the width of the second slot 21 is smaller than the width of the first slot 11, and the narrow second slot 21 is Provided on the conductive film 20, since the thickness of the conductive film 20 is small, the second slit 21 is easy to process and the injection molding is easily completed in the second slit 21, and at the same time, the split feeling of the metal shell at the slit is improved; the wider first The slit 11 is disposed on the casing 10, which also reduces the processing difficulty and filling difficulty of the first slit 11, and the conductive film 20 covers the first slit 11 on the surface of the casing 10, so that the first slit 11 does not look good.
  • the appearance of the metal shell is improved.
  • the insulator 30 in the first slit 11 is integrally connected with the insulator 30 in the second slit 21, and a partition is formed on the metal shell, thereby preventing the shielding effect of the metal shell on the antenna signal.
  • the embodiment of the present application further provides a method for preparing the above metal shell, the preparation method comprising:
  • At least two second slits parallel to and communicating with the first slit are cut on the conductive film, and at least two second slits divide the conductive film into a plurality of electrical insulation part;
  • the insulator 30 is filled in each of the second slits 21.
  • the width of the first slit 11 is wide, which is advantageous for reducing the difficulty of cutting and the difficulty of filling, and avoiding incomplete filling;
  • a conductive film 20 is formed on the surface of the casing 10, and the conductive film 20 covers the first slit 11 on the surface of the casing 10.
  • the first slit 11 is not visible in appearance, and the appearance effect of the metal shell is improved.
  • the second slit 21 needs to be cut on the conductive film 20, and the first slit 11 is The second slit 21 communicates such that the first slit 11 and the second slit 21 can form a partition on the metal shell to satisfy the electrical requirements of the antenna signal for the metal shell.
  • the width of the second slit 21 is made narrow, since the conductive film 20 itself is thin, the cutting and filling of the second slit 21 are both It is relatively easy to ensure complete filling of the second slit 21 and to improve the appearance of the metal shell.
  • each of the first slits 11 is parallel and connected with at least two second slits 21, and a slit unit is formed, and one or two metal shells may be disposed. Or a plurality of such slit units, wherein in each of the slit units, the first slit 11 and the at least two second slits 21 communicating with the first slit 11 form a partition on the metal shell.
  • the first step as shown in FIG. 2.1, at least one first slit 11 is cut in the casing 10, and at least one first slit 11 divides the casing 10 into at least two portions which are electrically insulated.
  • the width of each of the first slits 11 is between 1.0 mm and 3.0 mm, for example, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm, and the first slit 11 belongs to a conventional slit, and the width of the slit is large. Reduce the difficulty of cutting the gap. Specifically, as shown in FIG.
  • a first slit 11 is cut on the surface of the casing 10 by a laser cutting technique, and the first slit 11 divides the casing 10 into two portions electrically insulated, and the width of the first slit 11 is 1.8. Mm.
  • each of the first slits 11 is filled with an insulator 30, such as a caulk or an injection molded plastic.
  • the first slit 11 is filled with the injection molding plastic. Since the first slit 11 is a regular slit, the width of the slit is wide, thereby reducing the filling difficulty, ensuring complete filling, and grinding the surface of the casing 10 after the injection molding plastic is cured. Polished and cleaned.
  • a conductive film 20 is formed on the surface of the casing 10.
  • the conductive film 20 covers the surface of the casing 10, so that the first slit 11 is not visible in appearance, and the conductive film 20 is a metal film or has electrical conductivity.
  • the non-metal film, and the conductive film 20 can be formed by processes such as PVD (physical vapor deposition), CVD (chemical vapor deposition), ion plating, physical spraying, electroplating, and the like.
  • a metal film is plated on the casing 10 by using an electroplating process, and the thickness of the metal film is between 1 um and 50 um, for example, 25 um.
  • a fourth step for each of the first slits 11 of the at least one first slit 11, at least two second slits 21 parallel to and communicating with the first slit 11 are cut on the conductive film 20, and at least The two second slits 21 divide the conductive film 20 into a plurality of electrically insulating portions. Specifically, for each of the first slits 11 and at least two second slits 21 that are parallel and connected with the first slit 11, the vertical projection of each of the second slits 21 on the surface of the casing 10 falls into the first A slit 11 or at least one second slit 21 falls into the first slit 10 at a vertical projection portion of the surface of the casing 10.
  • the width of each of the second slits 21 is smaller than the width of the corresponding first slits 11.
  • the width of each of the second slits 21 is between 0.1 mm and 1.0 mm.
  • the second slit 21 is narrow and belongs to the micro slit. Since the conductive film 20 is thin, the processing and filling difficulty of the micro slit can be reduced, and the second slit 21 is advantageous for improving the splitting feeling of the metal shell at the slit.
  • each of the second slits 21 is cut on the conductive film 20 by a laser cutting technique, and each of the second slits 21 has a width of 0.4 mm and a distance between two adjacent second slits. It is 0.3 mm, such that a vertical projection of the two second slits 21 at the ends on the surface of the casing 10, wherein one side of each of the second slits 21 coincides with the side of the first slit 11 on the same side.
  • each of the second slits 21 is filled with an insulator 30, such as a caulk or an injection molded plastic.
  • the injection molding plastics are respectively filled in the three second slits 21, and since the conductive film 20 is thin, the second slit is lowered.
  • the filling difficulty in the gap 21 can ensure complete filling; after the plastic injection molding is cured, the surface of the conductive film 20 is polished, polished and cleaned.
  • the second slit 21 exposed on the surface of the metal shell has a narrow width, reduces the cracking feeling of the metal shell at the slit, improves the appearance effect of the metal shell, and the insulator 30 in the first slit 11 and the first slit 11
  • the insulators 30 in the three connected second slits 21 are integrally connected and form a partition on the metal shell, thereby avoiding the shielding effect of the metal shell on the antenna signal.
  • the embodiment of the present application further provides a mobile device, the mobile device includes the device body and the metal case of any one of the above items fixedly connected to the device body, and further includes an antenna disposed on the device body, wherein the metal is At least a portion of the two portions of the housing that are at least electrically insulated acts as a radiating element of the antenna.
  • the conductive film 20 covers the first slit 11 having a wider surface of the casing 10, so that the first slit 11 is not visible in appearance, and the conductive film 20 is narrower in the second.
  • the slit 21 can reduce the splitting feeling of the metal shell at the slit and enhance the appearance effect of the metal shell; wherein each of the first slits 11 communicates with at least two second slits 21, and the metal shell is at least divided into two parts of electrical insulation.
  • the insulator 30 in the first slit 11 is integrated with the insulator 30 in the second slit 21 to form a partition on the metal shell, thereby avoiding the shielding effect of the metal shell on the antenna signal.
  • the embodiment provided by the present application provides a narrow second slit 21 on the conductive film 20 by providing a wider first slit 11 on the casing 10, thereby reducing the processing difficulty and filling of the slit. Difficulty, the yield of the mobile device is improved; and, the conductive film 20 covers the wider first slit 11 of the surface of the casing 10, so that the first slit 11 is not visible in appearance, and the second slit is narrow on the conductive film 20.
  • each of the first slits 11 communicates with the at least two second slits 21, so that the insulator 30 in the first slit 11 and The insulators 30 in the second slit 21 can be integrally connected and form a partition on the metal shell, thereby avoiding the shielding effect of the metal shell on the antenna signal.

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Abstract

一种移动设备的金属壳及其制备方法、移动设备。该金属壳包括壳体(10),壳体(10)上设有至少一条第一缝隙(11),至少一条第一缝隙(11)将壳体(10)至少分成电绝缘的两部分,每条第一缝隙(11)内填充有绝缘物(30);还包括一层覆盖壳体(10)表面的导电膜(20),对于至少一条第一缝隙(11)中的每条缝隙,导电膜(20)上设有与该第一缝隙(11)平行且连通的至少两条第二缝隙(21),至少两条第二缝隙(21)将导电膜(20)分成多个电绝缘的部分,每条第二缝隙(21)内填充有绝缘物(30)。该移动设备的金属壳通过在壳体(10)上设置较宽的第一缝隙(11),在导电膜(20)上设置较窄的第二缝隙(21),从而降低了缝隙的加工难度以及填充难度,提高了移动设备的可靠性。

Description

一种移动设备的金属壳及其制备方法、移动设备
本申请要求在2017年02月16日提交中国专利局、申请号为201710084594.2、发明名称为“一种微缝天线加工方法及微缝天线”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备领域,尤其涉及一种移动设备的金属壳及其制备方法、移动设备。
背景技术
在当前消费者对于手机的外观多样性具有更多追求的情况下,微缝天线能够减少手机天线缝处的割裂感,提升手机美感,逐渐成为了外观设计的主流需求。目前的手机微缝设计主要是基于在金属后壳上通过数控机床或激光切割去除部分金属,得到多条平行的微缝,然后通过纳米注塑或胶水注入的方案将金属微缝进行填充,通过塑胶或胶水的绝缘性实现手机后壳上中下三段不连通,达到手机天线信号对于后壳的电学要求。但是,微缝加工过程复杂,同时注塑困难,容易出现注塑不完整的情况,不利于提高良品率,造成生产成本攀升。
发明内容
本申请提供了一种移动设备的金属壳及其制备方法、移动设备,用以解决现有技术中微缝加工困难、注塑困难、容易出现注塑不完整的问题,提高移动设备的良品率。
本申请提供了一种移动设备的金属壳,该移动设备的金属壳包括壳体,所述壳体上设有至少一条第一缝隙,且所述至少一条第一缝隙将所述壳体至少分成电绝缘的两部分,每条第一缝隙内填充有绝缘物;
还包括一层覆盖在所述壳体表面的导电膜,对于所述至少一条第一缝隙中的每条第一缝隙,所述导电膜上设有与该第一缝隙平行且连通的至少两条第二缝隙,所述至少两条第二缝隙将所述导电膜分成多个电绝缘的部分,每条第二缝隙内填充有绝缘物。
上述实施例中,每条第一缝隙的宽度大于与该第一缝隙相对应的每条第二缝隙的宽度,即该移动设备的金属壳通过在壳体上设置较宽的第一缝隙,在导电膜上设置较窄的第二缝隙,从而降低了缝隙的加工难度以及填充难度,提高了移动设备的良品率;并且,导电膜将壳体表面较宽的第一缝隙覆盖,使第一缝隙在外观上不可见,导电膜上较窄的第二缝隙能够减少金属壳在缝隙处的割裂感,提升金属壳的外观效果。
在具体设置第一缝隙与第二缝隙时,与所述每条第一缝隙平行且连通的至少两条第二缝隙中,每条第二缝隙在所述壳体表面的垂直投影落入该第一缝隙内。
或者,与所述每条第一缝隙平行且连通的至少两条第二缝隙中,至少一条第二缝隙在所述壳体表面的垂直投影部分落入该第一缝隙内。
在具体设置覆盖壳体的导电膜时,导电膜可以为金属膜或具有导电性能的非金属膜,在一个具体的实施方式中,导电膜为金属膜,金属膜具有金属质感,能够提高金属壳体的外观效果。
其中,金属膜的厚度介于1um~50um之间,如取1um、10um、25um、40um、50um。
上述实施方式中,每条所述第一缝隙的宽度介于1.0mm~3.0mm之间,每条所述第二 缝隙的宽度介于0.1mm~1.0mm之间,如每条第一缝隙的宽度取1.5mm,每条第二缝隙的宽度取0.5mm,或每条第一缝隙的宽度取1.8mm,每条第二缝隙的宽度取0.4mm。
本申请还提供了一种上述移动设备的金属壳的制备方法,该制备方法包括:
在所述壳体上切割至少一条第一缝隙,且所述至少一条第一缝隙将所述壳体至少分成电绝缘的两部分;
在每条所述第一缝隙内填充绝缘物;
在所述壳体表面形成一层导电膜;
对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,且所述至少两条第二缝隙将所述导电膜分成多个电绝缘的部分;
在每条所述第二缝隙内填充绝缘物。
上述实施例中,每条第一缝隙的宽度大于与该第一缝隙相对应的每条第二缝隙的宽度。由于壳体较厚,在壳体表面切割缝隙时,使第一缝隙的宽度较宽,这有利于降低切割难度以及填充难度,避免填充不完全的情况;在导电膜表面切割缝隙时,使第二缝隙的宽度较窄,由于导电膜本身较薄,因此,第二缝隙的切割以及填充都比较容易,同时有利于改善金属壳在缝隙处的割裂感。
在具体制备第一缝隙和第二缝隙时,对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,每条第二缝隙在所述壳体表面的垂直投影落入该第一缝隙内;
或者,对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,至少一条第二缝隙在所述壳体表面的垂直投影部分落入该第一缝隙内。
在具体制备覆盖壳体的导电膜时,通过电镀工艺在所述壳体表面镀一层金属膜。
本申请还提供了一种移动设备,该移动设别包括设备本体以及与所述设备本体固定连接的上述任一项所述的金属壳,还包括设置在所述设备本体上的天线,其中,将所述金属壳中至少电绝缘的两部分中的至少一部分作为所述天线的辐射单元。
上述实施例中,该移动设备的金属壳通过在壳体上设置较宽的第一缝隙,在导电膜上设置较窄的第二缝隙,这降低了缝隙的加工难度以及填充难度,提高了移动设备的良品率;并且,每条第一缝隙与至少两条第二缝隙相连通,从而使得第一缝隙中的绝缘物与第二缝隙中的绝缘物连为一体,并将金属壳至少分成电绝缘的两部分,金属壳中至少电绝缘的两部分中的至少一部分作为天线的辐射单元,从而避免了金属壳对天线信号的屏蔽作用。
附图说明
图1为本申请实施例提供的金属壳的外观效果图;
图1.1为本申请实施例1提供的第一缝隙与第二缝隙的结构关系图;
图1.2为本申请实施例1提供的另一种第一缝隙与第二缝隙的结构关系图;
图1.3为本申请实施例2提供的第一缝隙与第二缝隙的结构关系图;
图1.4为本申请实施例2提供的另一种第一缝隙与第二缝隙的结构关系图;
图2.1~图2.5为制备具有图1.1所示结构的金属壳的加工流程图。
具体实施方式
本申请实施例提供了一种移动设备的金属壳,用以解决现有技术中金属壳上进行微缝加工和微缝注塑存在难度大、良品率低的问题,提高移动设备的良品率。
由于完整的金属壳会产生电磁屏蔽,阻断电磁波的传输,从而影响移动设备的通讯功能,因此需要在金属壳上加工缝隙并在缝隙中填充绝缘物以形成隔断,在金属壳上加工常规缝隙时(常规缝隙的宽度一般不小于1.0mm),由于常规缝隙的宽度较大,使得金属壳在缝隙处具有割裂感,影响金属壳的外观效果,现有技术中,通常在金属壳上加工微缝来降低对金属壳造成的影响,微缝的宽度较窄,宽度一般介于0.01~1.0mm之间,但由于金属壳本身的厚度较大,使得微缝加工以及微缝注塑比较困难,容易造成缝隙中不完全填充的问题,影响金属壳的质量。
鉴于现有技术的不足,本申请实施例提供了一种移动设备的金属壳,如图1、图1.1所示,其中,图1为金属壳的外观效果图,图1.1为金属壳在A-A处的剖面图,该金属壳包括壳体10,壳体10上设有至少一条第一缝隙11,且至少一条第一缝隙11将壳体10分成至少电绝缘的两部分,每条第一缝隙11内填充有绝缘物30,如填缝胶或注塑塑胶等。具体设置时,可以在壳体10上切割一条、两条或多条第一缝隙11,每条第一缝隙11的宽度介于1.0mm~3.0mm之间,如取1.0mm、1.5mm、2.0mm、2.5mm、3.0mm;壳体10上的第一缝隙11属于常规缝隙,缝隙的宽度较大,因此,第一缝隙11容易加工并且在第一缝隙11中容易完成注塑。
如图1.1所示,该金属壳还包括一层覆盖在壳体10表面的导电膜20,导电膜20使第一缝隙11在外观上不可见,提高了金属壳的外观效果,导电膜20可以为金属膜,如铝、金、银、铂、镍等金属的薄膜,金属膜具有金属光泽,提高了金属壳的质感与外观效果,在一个具体的实施例中,金属膜的厚度介于1um~50um之间,如取1um、10um、25um、40um、50um,或者,导电膜20也可以为具有导电性能的非金属膜。为了满足天线信号对金属壳的电学要求,导电膜20上还设有第二缝隙21,且对于壳体10表面至少一条第一缝隙11中的每条第一缝隙11,导电膜20上设有与该第一缝隙11平行且连通的至少两条第二缝隙21,且至少两条第二缝隙21将导电膜20分成多个电绝缘的部分,每条第二缝隙21中填充有绝缘物30,如填缝胶或注塑塑胶等绝缘物30。这样,每条第一缝隙11和与该第一缝隙11相连通的至少两条第二缝隙21在金属壳上形成隔断,避免了金属壳对天线信号的屏蔽作用。
为了便于理解,将每条第一缝隙11和与该第一缝隙11平行且连通的至少两条第二缝隙21划分为一个缝隙单元,在金属壳上可以设置一个、两个或多个这样的缝隙单元,每个缝隙单元中,每条第二缝隙21在壳体10表面的垂直投影全部落入第一缝隙11内,或至少一条第二缝隙21在壳体10表面的垂直投影部分落入第一缝隙11内。如图1所示,该金属壳设有一个缝隙单元,该缝隙单元包括一条第一缝隙11以及三条第二缝隙21,其中,第一缝隙11与第二缝隙21的结构关系有多种设置方式,以下列举几个具体的实施例详细说明。
实施例1
如图1.1所示,为了便于描述,以图1.1中的排列方式为参考,从左到右,依次记为第二缝隙21a、第二缝隙21b、第二缝隙21c,每条第二缝隙21与第一缝隙11平行且连通,且每条第二缝隙21在壳体10表面的垂直投影全部落入第一缝隙11内,具体的,在第二缝隙21a的投影中,第二缝隙21a的左侧边与第一缝隙11中位于同一侧的侧边重合,在第二 缝隙21b的投影中,第二缝隙21b的两个侧边介于第一缝隙11的两个侧边之间,在第二缝隙21c的投影中,第二缝隙21c的右侧边与第一缝隙11中位于同一侧的侧边重合,或者,如图1.2所示,第二缝隙21a、第二缝隙21b、第二缝隙21c在壳体10表面的垂直投影都介于第一缝隙11的两个侧边之间。
实施例2
如图1.3、图1.4所示,至少两条第二缝隙21在壳体10表面的垂直投影部分落入第一缝隙11内,具体的,在每个缝隙单元中,至少两条第二缝隙21在导电膜20上并排排列,其中,位于一端的一条第二缝隙21在壳体10表面的垂直投影部分落入第一缝隙11内,或者,分别位于两端的两条第二缝隙21在壳体10表面的垂直投影部分落入第一缝隙11内。如图1.3所示,三条第二缝隙21在导电膜20上并排排列,第二缝隙21a、第二缝隙21c分别位于两端,第二缝隙21b位于第二缝隙21a、第二缝隙21c之间,并且,第二缝隙21a在壳体10表面的垂直投影部分落入第一缝隙11内,即在第二缝隙21a的投影中,左侧边位于第一缝隙11外,右侧边位于第一缝隙11内;第二缝隙21b、第二缝隙21c在壳体10表面的垂直投影都落入第一缝隙11内。或者,如图1.4所示,第二缝隙21a在壳体10表面的垂直投影部分落入第一缝隙11内,且第二缝隙21c在壳体10表面的垂直投影部分落入第一缝隙11内。
另外,上述结构中,每条第二缝隙21的宽度小于该第一缝隙11的宽度,具体设置时,第一缝隙11的宽度介于1.0mm~3.0mm之间,每条第二缝隙21的宽度介于0.1mm~1.0mm之间,在如图1.1所示的结构关系中,第一缝隙11的宽度取1.8mm,第二缝隙21的宽度取0.4mm,且相邻的两条第二缝隙21之间的距离取0.3mm。另外,第一缝隙11和第二缝隙21可以为直线形缝隙,也可以为U形缝隙等曲线形缝隙。
上述实施例中,在每个缝隙单元中,第一缝隙11与至少两条第二缝隙21平行且连通,即第二缝隙21的宽度小于第一缝隙11的宽度,较窄的第二缝隙21设置在导电膜20上,由于导电膜20的厚度小,使得第二缝隙21容易加工并且在第二缝隙21中容易完成注塑,同时改善了金属壳在缝隙处的割裂感;较宽的第一缝隙11设置在壳体10上,这同样降低了第一缝隙11的加工难度与填充难度,并且,导电膜20将壳体10表面的第一缝隙11覆盖,使第一缝隙11在外观上不可见,提高了金属壳的外观效果。在每个缝隙单元中,第一缝隙11中的绝缘物30与第二缝隙21中的绝缘物30连为一体,并在金属壳上形成隔断,从而避免了金属壳对天线信号的屏蔽作用。
本申请实施例还提供了一种上述金属壳的制备方法,该制备方法包括:
在壳体10上切割至少一条第一缝隙11,且至少一条第一缝隙11将壳体10至少分成电绝缘的两部分;
在每条第一缝隙11内填充绝缘物30;
在壳体10表面形成一层导电膜;
对于至少一条第一缝隙中的每条第一缝隙,在导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,且至少两条第二缝隙将导电膜分成多个电绝缘的部分;
在每条第二缝隙21内填充绝缘物30。
上述实施例中,在壳体10表面切割缝隙时,由于壳体10较厚,使第一缝隙11的宽度较宽,这有利于降低切割难度以及填充难度,避免填充不完全的情况;第一缝隙11填充完成后,在壳体10表面形成一层导电膜20,导电膜20将壳体10表面的第一缝隙11覆盖, 使第一缝隙11在外观上不可见,提高了金属壳的外观效果,但为了避免金属壳对天线信号的屏蔽作用,需要在导电膜20上切割第二缝隙21,并使第一缝隙11与第二缝隙21连通,从而使得第一缝隙11与第二缝隙21能够在金属壳上形成隔断,满足天线信号对金属壳的电学要求。在导电膜20表面切割第二缝隙21时,为了改善金属壳在缝隙处的割裂感,使第二缝隙21的宽度较窄,由于导电膜20本身较薄,第二缝隙21的切割以及填充都比较容易,能够保证第二缝隙21的完全填充,同时有利于改善金属壳的外观效果。这样在第一缝隙11与第二缝隙21的结构关系中,使每条第一缝隙11与至少两条第二缝隙21平行且连通,并形成一个缝隙单元,金属壳上可以设置一个、两个或多个这样的缝隙单元,每个缝隙单元中,第一缝隙11和与该第一缝隙11连通的至少两条第二缝隙21在金属壳上形成隔断。
具体设置时,第一步,如图2.1,壳体10上切割至少一条第一缝隙11,至少一条第一缝隙11将壳体10至少分成电绝缘的两部分,在一个具体的实施例中,每条第一缝隙11的宽度介于1.0mm~3.0mm之间,如取1.0mm、1.5mm、2.0mm、2.5mm、3.0mm,第一缝隙11属于常规缝隙,缝隙的宽度较大,这降低了缝隙的切割难度。具体的,如图2.1中,通过激光切割技术在壳体10表面切割一条第一缝隙11,该第一缝隙11将壳体10分成电绝缘的两部分,且该第一缝隙11的宽度为1.8mm。
第二步,如图2.2,在每条第一缝隙11内填充绝缘物30,如填缝胶或注塑塑胶等。具体的,在第一缝隙11中填充注塑塑胶,由于第一缝隙11为常规缝隙,缝隙的宽度较宽,因此降低了填充难度,能够保证完全填充,注塑塑胶固化后对壳体10表面进行打磨、抛光处理并清洗。
第三步,如图2.3,在壳体10表面形成一层导电膜20,导电膜20覆盖壳体10表面,使第一缝隙11在外观上不可见,导电膜20为金属膜或具有导电性能的非金属膜,并且,导电膜20可以通过PVD(物理气相沉积)、CVD(化学气相沉积)、离子镀、物理喷射、电镀等工艺形成。具体的,采用电镀工艺在壳体10上镀一层金属膜,金属膜的厚度介于1um~50um之间,如取25um。
第四步,如图2.4,对于至少一条第一缝隙11中的每条第一缝隙11,在导电膜20上切割与该第一缝隙11平行且连通的至少两条第二缝隙21,且至少两条第二缝隙21将导电膜20分成多个电绝缘的部分。具体设置时,对于每条第一缝隙11,与该第一缝隙11平行且连通的至少两条第二缝隙21中,每条第二缝隙21在壳体10表面的垂直投影全部落入该第一缝隙11内,或至少一条第二缝隙21在壳体10表面的垂直投影部分落入该第一缝隙10内。这种设置方式中,每条第二缝隙21的宽度小于相对应的第一缝隙11的宽度,在一个具体的实施例中,每条第二缝隙21的宽度介于0.1mm~1.0mm之间,第二缝隙21较窄,属于微缝,由于导电膜20较薄,因此能够降低微缝的加工以及填充难度,且第二缝隙21有利于改善金属壳在缝隙处的割裂感。
具体的,如图2.4所示,通过激光切割技术在导电膜20上切割三条第二缝隙21,每条第二缝隙21的宽度为0.4mm,且相邻的两条第二缝隙之间的距离为0.3mm,这样,对于位于端部的两条第二缝隙21在壳体10表面的垂直投影,其中每条第二缝隙21一个侧边与第一缝隙11中位于同一侧的侧边重合。
第五步,如图2.5,在每条第二缝隙21中填充绝缘物30,如填缝胶或注塑塑胶等。具体的,在三条第二缝隙21中分别填充注塑塑胶,由于导电膜20较薄,因此降低了第二缝 隙21中的填充难度,能够保证完全填充;注塑塑胶固化后对导电膜20表面进行打磨、抛光处理并清洗。表露在金属壳表面的第二缝隙21宽度较窄,减少了金属壳在缝隙处的割裂感,提高了金属壳的外观效果,并且第一缝隙11中的绝缘物30和与该第一缝隙11相连通的三条第二缝隙21中的绝缘物30连为一体,并在金属壳上形成隔断,从而避免了金属壳对天线信号的屏蔽作用。
本申请实施例还提供了一种移动设备,该移动设别包括设备本体以及与设备本体固定连接的上述任一项所述的金属壳,还包括设置在设备本体上的天线,其中,将金属壳中至少电绝缘的两部分中的至少一部分作为天线的辐射单元。
上述实施例中,该移动设备的金属壳上,导电膜20将壳体10表面较宽的第一缝隙11覆盖,使第一缝隙11在外观上不可见,导电膜20上较窄的第二缝隙21能够减少金属壳在缝隙处的割裂感,提升金属壳的外观效果;其中,每条第一缝隙11与至少两条第二缝隙21相连通,并将金属壳至少分成电绝缘的两部分,第一缝隙11中的绝缘物30与第二缝隙21中的绝缘物30连为一体,在金属壳上形成隔断,从而避免了金属壳对天线信号的屏蔽作用。
通过以上描述可以发现,本申请提供的实施例通过在壳体10上设置较宽的第一缝隙11,在导电膜20上设置较窄的第二缝隙21,从而降低了缝隙的加工难度以及填充难度,提高了移动设备的良品率;并且,导电膜20将壳体10表面较宽的第一缝隙11覆盖,使第一缝隙11在外观上不可见,导电膜20上较窄的第二缝隙21能够减少金属壳在缝隙处的割裂感,提升金属壳的外观效果,同时,每条第一缝隙11与至少两条第二缝隙21相连通,从而使得第一缝隙11中的绝缘物30与第二缝隙21中的绝缘物30能够连为一体,并在金属壳上形成隔断,从而避免了金属壳对天线信号的屏蔽作用。
显然,本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请的精神和范围。这样,倘若本申请实施例的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。

Claims (10)

  1. 一种移动设备的金属壳,其特征在于,包括壳体,所述壳体上设有至少一条第一缝隙,且所述至少一条第一缝隙将所述壳体至少分成电绝缘的两部分,每条第一缝隙中填充有绝缘物;
    还包括一层覆盖所述壳体表面的导电膜,且对于所述至少一条第一缝隙中的每条第一缝隙,所述导电膜上设有与该第一缝隙平行且连通的至少两条第二缝隙,所述至少两条第二缝隙将所述导电膜分成多个电绝缘的部分,每条第二缝隙内填充有绝缘物。
  2. 如权利要求1所述的移动设备的金属壳,其特征在于,与所述每条第一缝隙平行且连通的至少两条第二缝隙中,每条第二缝隙在所述壳体表面的垂直投影落入该第一缝隙内。
  3. 如权利要求1所述的移动设备的金属壳,其特征在于,与所述每条第一缝隙平行且连通的至少两条第二缝隙中,至少一条第二缝隙在所述壳体表面的垂直投影部分落入该第一缝隙内。
  4. 如权利要求1所述的移动设备的金属壳,其特征在于,所述导电膜为金属膜。
  5. 如权利要求4所述的移动设备的金属壳,其特征在于,所述金属膜的厚度介于1um~50um之间。
  6. 如权利要求1~5任一项所述的移动设备的金属壳,其特征在于,所述每条第一缝隙的宽度介于1.0mm~3.0mm之间,所述每条第二缝隙的宽度介于0.1mm~1.0mm之间。
  7. 一种如权利要求1所述的移动设备的金属壳的制备方法,其特征在于,包括以下步骤:
    在所述壳体上切割至少一条第一缝隙,且所述至少一条第一缝隙将所述壳体至少分成电绝缘的两部分;
    在每条第一缝隙内填充绝缘物;
    在所述壳体表面形成一层导电膜;
    对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,且所述至少两条第二缝隙将所述导电膜分成多个电绝缘的部分;
    在每条第二缝隙内填充绝缘物。
  8. 如权利要求7所述的制备方法,其特征在于,所述对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,具体为:
    对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,且每条第二缝隙在所述壳体表面的垂直投影落入该第一缝隙内;
    或对于所述至少一条第一缝隙中的每条第一缝隙,在所述导电膜上切割与该第一缝隙平行且连通的至少两条第二缝隙,且至少一条第二缝隙在所述壳体表面的垂直投影部分落入该第一缝隙内。
  9. 如权利要求7所述的制备方法,其特征在于,所述在所述壳体表面形成一层导电膜具体为:通过电镀工艺在所述壳体表面镀一层金属膜。
  10. 一种移动设备,其特征在于,包括设备本体以及与所述设备本体固定连接的如权利要求1~6任一项所述的金属壳,还包括设置在所述设备本体上的天线,其中,将所述金属壳中至少电绝缘的两部分中的至少一部分作为所述天线的辐射单元。
PCT/CN2017/078156 2017-02-16 2017-03-24 一种移动设备的金属壳及其制备方法、移动设备 WO2018149016A1 (zh)

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