WO2018148901A1 - 指纹按键结构、按键压力检测方法和电子设备 - Google Patents

指纹按键结构、按键压力检测方法和电子设备 Download PDF

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Publication number
WO2018148901A1
WO2018148901A1 PCT/CN2017/073772 CN2017073772W WO2018148901A1 WO 2018148901 A1 WO2018148901 A1 WO 2018148901A1 CN 2017073772 W CN2017073772 W CN 2017073772W WO 2018148901 A1 WO2018148901 A1 WO 2018148901A1
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WIPO (PCT)
Prior art keywords
layer
button structure
fingerprint
fingerprint button
support plate
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PCT/CN2017/073772
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English (en)
French (fr)
Inventor
蔡军
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深圳市汇顶科技股份有限公司
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Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN201780000074.7A priority Critical patent/CN107077619B/zh
Priority to PCT/CN2017/073772 priority patent/WO2018148901A1/zh
Publication of WO2018148901A1 publication Critical patent/WO2018148901A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/964—Piezoelectric touch switches

Definitions

  • the embodiments of the present invention belong to the field of electronics, and in particular, to a fingerprint button structure, a button pressure detecting method, and an electronic device.
  • the fingerprint button of the existing smart terminal is a Dome (wafer) mechanical button at the bottom of the fingerprint recognition module to realize fingerprint recognition and pressing functions.
  • the design of the Dome mechanical button at the bottom of the fingerprint recognition module to achieve fingerprint recognition and pressing has at least the following problems:
  • the pressure that can be achieved by this design method is only one level, correspondingly only corresponding to a single operation, and the functions that can be defined are limited;
  • buttons configured are high-frequency buttons, and the mechanical buttons are easily damaged;
  • an embodiment of the present invention provides a fingerprint button structure, a button pressure detecting method, and an electronic device.
  • an embodiment of the present invention provides a fingerprint button structure, including: a laminated structure, wherein the laminated structure includes a cover plate, a chip layer, a wiring layer, a filling layer, and a support plate electrode which are sequentially stacked, A pressure sensor is disposed at the bottom of the wiring layer, and the pressure sensor forms a capacitance with the electrode of the support plate.
  • the fingerprint button structure further includes a metal ring, the metal ring is at least partially sleeved outside the laminated structure, wherein the end of the metal ring is the branch
  • the struts are adjacent to each other, and an inner wall of the metal ring is adjacent to a side surface of the cover plate, and a gap is formed between an inner wall of the metal ring and the chip layer, the wiring layer, and the filling layer.
  • the metal ring and the support plate electrode are fixedly connected by laser welding or gluing.
  • the gap is also filled with an elastomeric seal.
  • one end of the metal ring connected to the electrode of the support plate is provided with a notch, and the electrode of the support plate is provided with a corresponding notch, and the non-notched portion of the lower end of the metal ring is The non-notched portions of the support plate electrodes are correspondingly connected.
  • the wiring layer includes a circuit board layer and a pressure sensor layer stacked in this order from top to bottom, and the pressure sensor is disposed under the pressure sensor layer.
  • the circuit board layer is a flexible circuit board
  • the wiring layer further includes a reinforcing layer, and the reinforcing layer is located between the circuit board layer and the pressure sensor layer.
  • the filling layer is an elastic material filling layer.
  • the filling layer has a thickness of 0.2 to 0.3 mm.
  • the embodiment of the present invention further provides a button pressure detecting method, where the button pressure detecting method is applied to the fingerprint button structure, and the method includes:
  • the chip calculates a pressure value received by the fingerprint button structure according to a capacitance value or a capacitance change amount of the capacitor.
  • an embodiment of the present invention further provides an electronic device, where the electronic device includes the fingerprint button structure described above.
  • the pressure sensing scheme on the fingerprint button is designed according to the single pressure level of the traditional Dome machine, and can realize multiple levels of pressure, thereby being defined Different button functions;
  • the fingerprint button design of the embodiment the fingerprint button can be made thinner and takes up less space.
  • the button has a longer service life.
  • FIG. 1 is a schematic diagram of a first embodiment of a fingerprint button structure provided by the present invention
  • FIG. 2 is a schematic diagram of a second embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 3 is a schematic diagram of a third embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 4 is a schematic diagram of a fourth embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 5 is another schematic diagram of a fourth embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 6 is a schematic diagram of a fifth embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 7 is another schematic diagram of a fifth embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 8 is still another schematic diagram of a fifth embodiment of a fingerprint button structure provided by the present invention.
  • FIG. 9 is a schematic diagram of a fingerprint button pressing process provided by the present invention.
  • FIG. 10 is a schematic diagram of an electronic device provided by the present invention.
  • references to "an embodiment” herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the invention.
  • the appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
  • the fingerprint button structure includes a laminated structure 1 in which the stacked structure 1 includes a stack a cover plate 10, a chip layer 20, a wiring layer 30, a filling layer 40 and a support plate electrode 50, a pressure sensor is disposed at the bottom of the wiring layer 30, and the support plate electrode 50 is a supporting steel sheet, in a specific embodiment
  • the pressure sensor at the bottom of the wiring layer 30 may be specifically a pressure sensing electrode that is parallel to the support plate electrode 50.
  • the pressure sensor is disposed opposite to the support plate electrode 50 to form a capacitor, that is, a pressure sensing capacitor.
  • the pressure sensor compresses the filling layer 40 under the pressing action of the finger to cause a change in the capacitance value of the pressure sensing capacitor, wherein the pressure
  • the amount of change in the capacitance value of the sensing capacitor corresponds to the pressure applied when the finger presses the fingerprint button structure.
  • the filling layer 40 can serve as a dielectric layer of the capacitor, and it can be made of an elastic material such as an elastic foam or an elastic glue.
  • the cover plate 10 may be a rigid ordinary glass cover plate, a sapphire cover plate or a ceramic cover plate, or may be a coating layer or the like, and the material selected for the cover plate 10 may be transparent or opaque.
  • at least one fingerprint pressure chip is disposed in the chip layer 20, and the fingerprint pressure chip can be used for fingerprint detection and identification and pressure sensing processing; or, in other alternative embodiments, the chip layer 2 can be set.
  • a fingerprint sensing chip the fingerprint sensing chip is mainly used for detecting a finger fingerprint pressing the fingerprint button structure and obtaining corresponding fingerprint data, and detecting the pressure sensing capacitance
  • the processing of the measured pressure data can be implemented in other functional components.
  • the cover 10, the chip layer 20, the wiring layer 30, the filling layer 40, and the support plate electrode 50 are sequentially stacked, and a fixed connection may be adopted between the layers, wherein the chip layer 20 and The support plate electrode 50 may be electrically connected to the wiring layer 30; optionally, the chip layer 20 is disposed adjacent to the wiring layer 30, and the chip layer 20 may be directly connected through a pad disposed at a bottom thereof To the wiring layer 30.
  • the wiring layer 30 may include a circuit board unit having a circuit layer, such as a flexible circuit board; taking a flexible circuit board as an example, the flexible circuit board may carry and electrically connect the chip layer 20 on the one hand, and the other Other peripheral circuits such as auxiliary capacitors or other auxiliary chips can also be provided.
  • the bottom surface of the flexible circuit board may further be provided with the pressure sensing electrode such that the pressure sensing electrode is opposite to the support plate electrode to form a pressure sensing capacitor.
  • the fingerprint button structure further includes a metal ring 2, and the metal ring 2 is at least partially sleeved outside the laminated structure 1, wherein
  • the metal ring 2 may include a support portion and an annular portion, wherein the annular portion may be sleeved on a periphery of the cover plate 10, the chip layer 20, the wiring layer 30, and the filling layer 40,
  • the support portion may extend vertically outward from the floor of the annular portion and be fixedly disposed on the surface of the support plate electrode 50.
  • the bottom surface of the support portion of the metal ring 2 It is flush with the support plate electrode 50.
  • the bottom surface of the support portion of the metal ring 2 and the support plate electrode 50 are fixedly connected, and specifically, the fixed connection may be performed by laser welding or gluing.
  • the inner wall of the metal ring 2 is adjacent to the side surface of the cover plate 10.
  • the cover plate 10 moves downward along the inner wall of the metal ring 2, that is, toward the support plate.
  • the direction of the electrode 50 is moved so that relative motion with the metal ring 2 will occur.
  • a gap 60 may be formed between the inner wall of the metal ring 2 and the chip layer 20, the wiring layer 30, and the filling layer 40.
  • the chip layer 20 is formed.
  • the wiring layer 30 and the filling layer 40 have the same width, and the stacked structure formed thereof forms a gap 60 with the inner wall of the metal ring 2.
  • FIG. 3 shows a fingerprint button junction provided by the present invention.
  • the elastic sealing member 70 may specifically be an elastic sealing ring, such as an elastic sealing ring made of waterproof elastic glue or other waterproof elastic material, and the elastic sealing member 70 can play a waterproof and dustproof function, and the elastic sealing member 70 is disposed.
  • the elastic sealing member 70 In the gap 60 adjacent to the position of the cover plate 10, when the cover plate 10 is pressed, the elastic sealing member 70 is subjected to pressure to move downward together with the cover plate 10, that is, toward the support plate.
  • the direction of movement of the electrode 50; alternatively, the elastomeric seal 70 can be configured to fill the entire gap 60.
  • FIG. 4 is a schematic diagram of a fourth embodiment of a fingerprint button structure according to the present invention.
  • the wiring layer 30 can adopt a multi-layer structure, for example,
  • the wiring layer 30 includes a circuit board layer 301 and a pressure sensor layer 302 stacked in this order from top to bottom.
  • the circuit board layer 301 and the pressure sensor layer 302 are electrically connected, and the pressure sensor layer 302 includes pressure sensing as described above.
  • An electrode, the pressure sensing electrode and the support plate electrode 50 form a pressure sensing capacitor, wherein a filling layer 40 between the pressure sensor layer 302 and the support plate electrode 50 serves as a dielectric layer of the pressure sensing capacitor; Since the filling layer 40 is made of an elastic material, it can undergo a shape change when subjected to externally applied pressure, so that the capacitance value of the pressure sensing capacitor changes correspondingly with the pressure, even if The pressure sensing capacitor is a variable capacitor.
  • the fingerprint button structure when the fingerprint button structure is pressed by a user's finger, pressure applied by the finger is conducted through the cover 10, the chip layer 20, and the wiring layer 30 and applied to the filling layer 40, resulting in The filling layer 40 is elastically deformed. At this time, the capacitance value of the pressure sensing capacitor changes, and the pressure received by the fingerprint button structure can be obtained by detecting the capacitance value of the pressure sensing capacitor or the amount of change thereof.
  • the elastic deformation variable of the filling layer 40 may be divided into a plurality of ranges, each range corresponding to one pressure level, so that pressure detection for a plurality of different pressure levels may be achieved, and further, if each pressure is to be The levels correspond to one button function, that is, the above-mentioned detection results according to different pressure levels can correspondingly implement multiple button functions.
  • the circuit board layer 301 is a printed circuit board or a flexible circuit board.
  • the wiring layer 30 may further include a reinforcing layer 303, and the reinforcing layer 303 is a reinforcing steel sheet.
  • the reinforcing layer 303 is located between the circuit board layer 301 and the pressure sensor layer 302. The reinforcing layer 303 and the circuit board layer 301 can be fixedly connected to the pressure sensor layer 302 by bonding.
  • FIG. 6 a schematic diagram of a fifth embodiment of the present invention is shown.
  • One end of the metal ring 2 connected to the support plate electrode 50 is provided with a notch, and the support plate electrode 50 is provided with a corresponding The notch, the non-notched portion of the lower end of the metal ring 2 is correspondingly connected to the non-notched portion of the support plate electrode 50.
  • the lower end of the metal ring 2 is provided with a notch.
  • the notch is located on one side of the stack structure of the chip layer 20, the wiring layer 30, the filling layer 40 and the support plate electrode 50.
  • the non-notched portion at the lower end of the metal ring 2 is connected to the support plate electrode 50, and the notch is located on the side of the support plate electrode 50.
  • the width of the wiring layer 30 and the filling layer 40 may be smaller than the chip layer 20 and offset from the center of the chip layer 20 (ie, adopt an eccentric design), for example, the wiring layer 30.
  • the filling layer 40 may be disposed on a side of the chip layer 50 to further enlarge the space of the notch.
  • the electronic component in the electronic terminal can be accommodated in the notch.
  • the LCM Liquid Crystal Display Module
  • the lower portion extends into the gap, and the screen ratio of the electronic device can be increased in this manner; of course, it should be understood that the notch provides a avoidance space for the liquid crystal display module, in other alternative embodiments,
  • the gap may also accommodate other electronic components of the electronic terminal to meet the internal space requirements of the thinning of the electronic terminal.
  • the fifth embodiment may have various modifications, as shown in FIG. 7 and FIG. 8.
  • the chip layer 20 has substantially the same width as the wiring layer 30 and the filling layer 40, so that the outer sides of the three are substantially flush, and the chip layer 20 is
  • the wiring layer 30 and the filling layer 40 are similarly designed to be eccentric, that is, the chip layer 20, the wiring layer 30, and the filling layer 40 are disposed away from the center of the cover 10; The gap extends directly to the bottom of the cover 10 so that a larger accommodation space can be provided.
  • the wiring layer 30 also includes a circuit board layer 301 and a pressure sensor layer 302 which are sequentially stacked.
  • a reinforcing layer 303 may also be disposed between the circuit board layer 301 and the pressure sensor layer 302, similar to the embodiment illustrated in FIG.
  • the filling layer 40 is an elastic material filling layer, and the elastic material may be an elastic foam or an elastic rubber; alternatively, the filling layer 40 has a thickness of 0.2 to 0.3 mm.
  • the fingerprint button structure provided by the above embodiments of the present invention, by adding a pressure sensor on the basis of fingerprint recognition, the fingerprint recognition and the pressure sensing are integrated, and the fingerprint and pressure sensing functions are integrated in one fingerprint button.
  • the utility model can solve the problem that the traditional fingerprint mechanical button is easy to be damaged, and on the other hand, can realize multiple levels of pressure detection, thereby realizing multiple button functions, and the fingerprint button provided by the present embodiment is thinner and takes up less space; in addition, by setting Elastomeric seals can achieve waterproof and dustproof seals; by providing a gap in the metal ring, the space occupied by the fingerprint button structure can be further reduced, and thus other electronic components can be accommodated, such as avoiding the LCM, thereby increasing the screen ratio of the electronic device. .
  • the embodiment of the present invention further provides a button pressure detecting method, wherein the button pressure detecting method is applied to the fingerprint button structure described in the above embodiments.
  • the button pressure detecting method includes:
  • fingerprint buttons of an electronic device such as a smart terminal adopt the respective embodiments as described above.
  • the fingerprint button structure when the user presses the fingerprint button of the electronic device through the finger thereof, the pressure of the finger is applied to the cover 10 of the fingerprint button structure, and is transmitted to the fingerprint button through the cover 10 a laminated structure of the structure, the cover 10 of the fingerprint button, the chip layer 20, and the wiring layer 30 will move down together under the pressure, and press the filling layer 40, thereby making the filling layer 40 is compressed and deformed.
  • the thickness of the filling layer 40 changes, for example, the thickness changes from D1 to D2, that is, the distance between the pressure sensing electrode and the supporting plate electrode 50 changes from D1 to D2.
  • the change in the distance causes the capacitance value of the pressure sensing capacitor to also change.
  • the corresponding pressure value can be calculated by an algorithm according to the change in the capacitance value.
  • the elastic deformation variable of the filling layer 40 can be divided into a plurality of ranges, each of which corresponds to a pressure level, so that pressure detection for a plurality of different pressure levels can be achieved.
  • different functions may be further adapted according to different pressure levels, so that different button functions are correspondingly implemented according to different button pressures.
  • multiple levels of pressure detection can be realized, thereby implementing a plurality of key functions.
  • an embodiment of the present invention further provides an electronic device, where the electronic device includes a fingerprint button structure.
  • the button structure includes a laminated structure, wherein the stacked structure includes stacked layers. a cover plate 10, a chip layer 20, a wiring layer 30, a filling layer 40 and a supporting plate electrode 50.
  • a pressure sensor is disposed at the bottom of the wiring layer 30. In a specific embodiment, the pressure sensor at the bottom of the wiring layer 30 may be specific. It is a pressure sensing electrode that is parallel to the support plate electrode 50, and the pressure sensor forms a capacitance with the support plate electrode 50, that is, a pressure sensing capacitor.
  • the pressure sensor compresses the filling layer 40 under the pressing action of the finger to cause a change in the capacitance value of the pressure sensing capacitor, wherein the pressure The amount of change in the capacitance value of the sensing capacitor corresponds to the pressure applied when the finger presses the fingerprint button structure.
  • the fingerprint button structure further includes a metal ring 2 at least partially sleeved outside the laminated structure, wherein the metal ring 2 may include a support portion and a ring portion, wherein the The annular portion may be sleeved on the cover plate 10, the chip layer 20, and the The wiring layer 30 and the periphery of the filling layer 40, the supporting portion may extend perpendicularly outward from the ground of the annular portion and be fixedly disposed on a surface of the supporting plate electrode 50, the metal ring 2
  • the inner wall is adjacent to the side surface of the cover plate 10.
  • the bottom surface of the support portion of the metal ring 2 is flush with the support plate electrode 50.
  • a gap is formed between the inner wall of the metal ring 2 and the chip layer 20, the wiring layer 30, and the filling layer 40.
  • the metal ring 2 and the support plate electrode 50 are fixedly connected by laser welding or gluing.
  • the gap is also filled with an elastic seal.
  • the lower end of the metal ring 2 is provided with a notch, and the notch correspondingly forms a gap, and the non-notched portion of the lower end of the metal ring 2 is connected to the support plate electrode 50.
  • the wiring layer 30 includes a circuit board layer and a pressure sensor layer stacked in order from top to bottom, and the pressure sensor is disposed under the pressure sensor layer.
  • the circuit board layer is a printed circuit board or a flexible circuit board.
  • the wiring layer 30 further includes a reinforcing layer, where the reinforcing layer is located Between the board layer and the pressure sensor layer.
  • the filling layer 40 is an elastic material filling layer, and the elastic material may be an elastic foam or an elastic rubber; optionally, the filling layer 40 has a thickness of 0.2-0.3 mm.
  • the electronic device may be a terminal device such as a smart phone or a tablet computer.
  • the fingerprint button structure described in this embodiment is the fingerprint button structure described in the foregoing embodiment of the present invention, and details are not described herein again.
  • the electronic device by adding a pressure sensor on the basis of fingerprint recognition, the fingerprint recognition and the pressure sensing are integrated, and the fingerprint and pressure sensing functions are integrated into one fingerprint button.
  • the traditional fingerprint mechanical button is easy to be damaged, on the other hand, it can realize multiple levels of pressure detection, thereby realizing multiple button functions, and the fingerprint button provided by the present embodiment is thinner and takes up less space;
  • the sealing member can realize waterproof and dustproof sealing; the gap occupied by the fingerprint button structure can be further reduced by providing a gap in the metal ring.

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Abstract

一种指纹按键结构、按键压力检测方法和电子设备。所述指纹按键结构包括一叠层结构（1），其中，所述叠层结构（1）包括依次叠放的盖板（10）、芯片层（20）、布线层（30）、填充层（40）和支撑板电极（50），所述布线层底部设置有一压力传感器，所述压力传感器与所述支撑板电极（50）形成一电容。由此可实现多个等级压力，以定义不同的按键功能，同时指纹按键更薄，占用空间少，使用寿命更长。

Description

指纹按键结构、按键压力检测方法和电子设备 技术领域
本发明实施例属于电子领域，尤其涉及一种指纹按键结构、按键压力检测方法和电子设备。
背景技术
目前在智能终端领域，常常将指纹识别和按键结合在一起形成指纹按键，现有的智能终端的指纹按键是在指纹识别模块底部加上Dome(圆片)机械按键，以实现指纹识别和按压功能。采用在指纹识别模块底部加上Dome机械按键这种设计来实现指纹识别和按压功能至少存在下述问题：
1、这种设计方式可以实现的压力只有一级，相应地只能对应单一操作，能够定义的功能有限；
2、对于按键越来越少的智能终端，其配置的按键均属于高使用频次的按键，机械按键容易损坏；
3、采用在指纹识别模块底部加上Dome机械按键这种设计会导致按键结构整体较厚，占用较大空间，不能满足智能终端轻薄的要求。
发明内容
为了解决上述问题，本发明实施例提供一种指纹按键结构、按键压力检测方法和电子设备。
第一方面，本发明实施例提供一种指纹按键结构，包括：一叠层结构，其中，所述叠层结构包括依次叠放的盖板、芯片层、布线层、填充层和支撑板电极，所述布线层底部设置有一压力传感器，所述压力传感器与所述支撑板电极形成一电容。
作为本发明实施例的可选方案，所述指纹按键结构还包括金属环，所述金属环至少部分套接在所述叠层结构外面，其中，所述金属环的一端所述支 撑板电极邻接，所述金属环的内壁与所述盖板的侧面邻接，同时，所述金属环的内壁与所述芯片层、布线层、填充层之间形成间隙。
作为本发明实施例的可选方案，所述金属环和所述支撑板电极通过激光焊接或胶粘的方式固定连接。
作为本发明实施例的可选方案，所述间隙中还填充有弹性密封件。
作为本发明实施例的可选方案，所述金属环与所述支撑板电极连接的一端设置有缺口，且所述支撑板电极设置有对应的缺口，所述金属环下端的非缺口部分与所述支撑板电极的非缺口部分对应连接。
作为本发明实施例的可选方案，所述布线层包括由上至下依次堆叠的电路板层和压力传感器层，所述压力传感器层下方设置有所述压力传感器。
作为本发明实施例的可选方案，所述电路板层为柔性电路板，所述布线层还包括补强层，所述补强层位于所述电路板层和压力传感器层之间。
作为本发明实施例的可选方案，所述填充层为弹性材料填充层。
作为本发明实施例的可选方案，所述填充层的厚度为0.2～0.3毫米。
第二方面，本发明实施例还提供一种按键压力检测方法，所述按键压力检测方法应用于上述的指纹按键结构，所述方法包括：
当所述指纹按键结构受到外力按压时，检测所述布线层所包含的压力传感器与所述支撑板电极所形成电容的电容值是否发生变化；
当所述电容的电容值发生变化时，检测所述电容当前的电容值或电容变化量；
所述芯片根据所述电容的电容值或电容变化量计算所述指纹按键结构受到的压力值。
第三方面，本发明实施例还提供一种电子设备，所述电子设备包括上述的指纹按键结构。
通过本发明实施例提供的指纹按键结构、按键压力检测方法和电子设备，一方面指纹按键上增加压力感应的方案相对于传统的Dome机械单个压力等级设计，能实现多个等级压力，从而可以定义不同的按键功能；另一方面采 用本实施例指纹按键设计方案可以是的指纹按键变得更薄，占用空间更少，同时，采用本实施例中的设计方案，按键使用寿命更长。
附图说明
为了更清楚地说明本发明或现有技术中的方案，下面将对实施例或现有技术描述中所需要使用的附图作一个简单介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明提供的指纹按键结构的第一实施例的示意图；
图2为本发明提供的指纹按键结构的第二实施例的示意图；
图3为本发明提供的指纹按键结构的第三实施例的示意图；
图4为本发明提供的指纹按键结构的第四实施例的示意图；
图5为本发明提供的指纹按键结构的第四实施例的另一示意图；
图6为本发明提供的指纹按键结构的第五实施例的示意图；
图7为本发明提供的指纹按键结构的第五实施例的另一示意图；
图8为本发明提供的指纹按键结构的第五实施例的又一示意图；
图9为本发明提供的指纹按键按压过程的示意图；
图10为本发明提供的电子设备的示意图。
附图标记说明：1-堆叠结构，2-金属环，10-盖板，20-芯片层，30-布线层，40-填充层，50-支撑板电极，60-间隙，70-弹性密封件，301-电路板层，302-压力传感器层，303-补强层。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，附图中给出了本发明的较佳实施例。本发明可以以许多不同的形式来实现，并不限 于本文所描述的实施例，相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
参阅图1，图示为本发明实施例所提供的一种指纹按键结构的第一实施例的示意图；所述指纹按键结构包括一叠层结构1，其中，所述叠层结构1包括依次叠放的盖板10、芯片层20、布线层30、填充层40和支撑板电极50，所述布线层30底部设置有一压力传感器，所述支撑板电极50为支撑钢片，在具体实施例中，所述布线层30底部的压力传感器可以具体是与所述支撑板电极50平行相对的压力感应电极，所述压力传感器与所述支撑板电极50相对设置形成一电容，即压力感应电容。当使用者通过其手指按压所述指纹按键结构时，所述压力传感器将在所述手指的按压作用下压缩所述填充层40从而导致所述压力感应电容的电容值发生变化，其中所述压力感应电容的电容值变化量与所述手指按压所述指纹按键结构时施加的压力相对应。所述填充层40可以作为所述电容的介质层，且其可以采用弹性材料制成，比如弹性泡棉或者弹性胶。
所述盖板10可以是硬性的普通玻璃盖板、蓝宝石盖板或者陶瓷盖板，也可以是涂布(Coating)层等，所述盖板10所选的材料透明或不透明均可。可选的，所述芯片层20中至少设置有一指纹压力芯片，所述指纹压力芯片可用于指纹检测及识别和压力感应的处理；或者，在其他替代实施例中，所述芯片层2可以设置指纹感应芯片，所述指纹感应芯片主要用于检测按压所述指纹按键结构的手指指纹并获得相应的指纹数据，而针对所述压力感应电容检 测得到的压力数据的处理可以放在其他功能部件来实现。
在本实施例中，所述依次叠放的盖板10、芯片层20、布线层30、填充层40和支撑板电极50，各层之间可采用固定连接，其中，所述芯片层20和支撑板电极50可以电性连接至所述布线层30；可选的，所述芯片层20与所述布线层30相邻设置，所述芯片层20可通过设置在其底部的焊盘直接连接至所述布线层30。
所述布线层30可以包括具有线路层的电路板单元，比如软性电路板；以软性电路板为例，所述软性电路板一方面可以承载且电连接所述芯片层20，另一方面还可以设置有其他外围电路，比如辅助电容或者其他辅助芯片。在具体实施例中，所述软性电路板的底面还可以设置有上述压力感应电极，以使所述压力感应电极与所述支撑板电极相对而形成压力感应电容。
参阅图2所示的所述指纹按键结构的第二实施例的示意图，所述指纹按键结构还包括一金属环2，所述金属环2至少部分套接在所述叠层结构1外面，其中，所述金属环2可以包括支撑部和环形部，其中所述环形部可以套设在所述盖板10、所述芯片层20、所述布线层30和所述填充层40的外围，所述支撑部可以从所述环形部的地面垂直向外延伸而成，并固定设置在所述支撑板电极50的表面，可选的，如图2所示，所述金属环2的支撑部底面与所述支撑板电极50邻接处齐平。作为本实施例的可选方案，所述金属环2的支撑部底面和所述支撑板电极50之间进行固定连接，具体可通过激光焊接的方式或者胶粘的方式进行固定连接。所述金属环2的内壁与所述盖板10的侧面邻接，当用户按压所述盖板10时，所述盖板10沿着金属环2的内壁向下移动，即朝着所述支撑板电极50的方向进行移动，从而与所述金属环2将产生相对运动。可选的，如图2所示，所述金属环2的内壁与所述芯片层20、布线层30、填充层40之间可以形成有间隙60，在本实施例中，所述芯片层20、布线层30、填充层40的宽度一致，其形成的堆叠结构与所述金属环2的内壁形成间隙60。
参阅图3，基于图2所示的实施例，图3所示为本发明提供的指纹按键结 构的第三实施例的示意图，其中，在所述金属环2的内壁与所述芯片层20、布线层30、填充层40之间形成的间隙60中还可以填充有弹性密封件70，所述弹性密封件70具体可以为弹性密封圈，比如采用防水弹性胶水或者其他防水弹性材料制作的弹性密封圈，所述弹性密封件70可起到防水防尘的作用，所述弹性密封件70设置在所述间隙60中临近所述盖板10的位置，当按压所述盖板10时，所述弹性密封件70受到压力随着所述盖板10一同向下运动，即朝所述支撑板电极50的方向运动；可选的，所述弹性密封件70可以设置为填充整个间隙60。
参阅图4，基于上述实施例，图4所示为本发明所述的指纹按键结构的第四实施例的示意图，在本实施例中，所述布线层30可以采用多层结构，比如，所述布线层30包括由上至下依次堆叠的电路板层301和压力传感器层302，所述电路板层301和压力传感器层302电性连接，所述压力传感器层302包括如上所述的压力感应电极，所述压力感应电极与所述支撑板电极50形成一压力感应电容，其中位于所述压力传感器层302和所述支撑板电极50之间填充层40作为所述压力感应电容的介质层；由于所述填充层40是采用弹性材料制成的，因此其可以在受到外界施加的压力时发生形状变化，从而使得所述压力感应电容的电容值随着压力的变化而发生相应的变化，即使得所述压力感应电容为一个可变电容。
具体地，当所述指纹按键结构受到使用者的手指按压时，手指施加的压力通过所述盖板10、所述芯片层20和所述线路层30传导并施加至所述填充层40，导致所述填充层40发生弹性形变，此时，所述压力感应电容的电容值将发生变化，通过检测所述压力感应电容的电容值或者其变化量可获取所述指纹按键结构所受到的压力。可选的，可将所述填充层40的弹性形变量划分成多个范围，每个范围对应一个压力等级，从而可以实现针对多个不同压力等级的压力检测，进一步地，若将每一个压力等级分别对应于一个按键功能，即上述根据不同压力等级的检测结果可以对应实现多个按键功能。
在一种可选的实施例中，所述电路板层301为印制电路板或柔性电路板， 当所述电路板层301为柔性电路板时，参阅图5所示的指纹按键结构的示意图，所述布线层30还可以包括补强层303，所述补强层303为补强钢片，所述补强层303位于所述电路板层301和压力传感器层302之间，所述补强层303与所述电路板层301可通过粘接的方式和压力传感器层302固定连接。
参阅图6，图示为本发明实施例提供的第五实施例的示意图，所述金属环2与所述支撑板电极50相连接的一端设置有缺口，且所述支撑板电极50设置有对应的缺口，所述金属环2下端的非缺口部分与所述支撑板电极50的非缺口部分对应连接。具体的，所述金属环2下端设置有缺口，如图6所示，所述缺口位于所述芯片层20、布线层30、填充层40和支撑板电极50组成的堆叠结构的一侧，所述金属环2下端的非缺口部分与所述支撑板电极50连接，所述缺口位于所述支撑板电极50一侧。在本实施例中，所述布线层30和所述填充层40的宽度可以小于所述芯片层20并且偏离所述芯片层20的中心设置(即采用偏心设计)，比如，所述布线层30和所述填充层40可以偏向所述芯片层50的一侧设置，从而进一步扩大所述缺口的空间。在本实施例中，所述缺口中可以容纳电子终端内部的其他电子部件，比如，如图6所示，采用所述按键结构的电子设备的LCM(Liquid Crystal Display Module，LCD显示模组)的下部延伸至所述缺口中，采用这种方式可提高电子设备的屏幕占比；当然，应当理解，所述缺口除了给所述液晶显示模组提供避让空间以外，在其他替代实施例中，所述缺口也可以来容纳所述电子终端的其他电子元部件，以满足电子终端的轻薄化对内部空间的需求。
可选的，基于上述实施例，本实施例五可以有多种变形，具体如图7和图8所示。
在图7所示的替代实施例中，所述芯片层20与所述布线层30和所述填充层40具有基本相同的宽度，因此三者的外侧基本平齐，并且所述芯片层20与所述布线层30和所述填充层40采用相类似地采用偏心设计，即所述芯片层20、所述布线层30和所述填充层40偏离所述盖板10的中心设置；由此，所述缺口直接延伸到所述盖板10的底部，从而可以提供更大的容纳空间。
可选地，在图7所示的替代实施例中，与图4所示的实施例相类似，所述布线层30同样包括依次堆叠的电路板层301和压力传感器层302。在图8所示的替代实施例中，所述电路板层301和压力传感器层302之间还可以设置有补强层303，与图5所示的实施例相类似。
在本发明上述实施例中，所述填充层40为弹性材料填充层，所述弹性材料可以是弹性泡棉或者弹性胶；可选的，所述填充层40的厚度为0.2～0.3毫米。
根据本发明上述实施例提供的指纹按键结构，通过在指纹识别的基础上增设压力传感器，将指纹识别和压力感应采用一体化的设计，实现指纹、压力感应功能集成在一个指纹按键中，一方面可以解决传统指纹机械按键容易损坏的问题，另一方面可以实现多个等级的压力检测，从而实现多个按键功能，同时本实施提供的指纹按键结构更薄，占用空间更小；此外，通过设置弹性密封件，可以实现密封防水防尘；通过在金属环设置缺口，可以进一步减少指纹按键结构所占用的空间，进而可以容纳其他电子部件，比如避开LCM，由此提高电子设备的屏幕占比。
本发明实施例还提供一种按键压力检测方法，所述按键压力检测方法应用上述各实施例所述的指纹按键结构，具体的，所述按键压力检测方法包括：
S101、当所述指纹按键结构受到外力按压时，检测所述布线层30所包含的压力传感器与所述支撑板电极50所形成电容的电容值是否发生变化；
S102、当所述电容的电容值发生变化时，获取所述电容当前的电容值或电容变化量；
S103、根据所述电容的电容值或电容变化量计算所述指纹按键结构受到的压力值。得到所述压力值后，可以根据所述压力值获取对应的按键操作。
为更好地理解上述按键压力检测方法，以下通过一个具体例子，来介绍本发明实施例所提供的按键压力检测方法的实现过程。
具体地，假设智能终端等电子设备的指纹按键采用如上所述各个实施例 的指纹按键结构，当使用者通过其手指按压所述电子设备的指纹按键时，手指的压力将施加到所述指纹按键结构的盖板10，并通过所述盖板10传递到所述指纹按键结构的叠层结构，所述指纹按键的盖板10、芯片层20、布线层30将在所述压力的作用下一起往下移动，并挤压所述填充层40，从而使得所述填充层40发生压缩变形，参阅图9所示的按压示意图，此时所述填充层40的厚度发生变化，比如厚度从D1变为D2，即压力感应电极与支撑板电极50的距离从D1变化为D2,所述距离变化导致压力感应电容的电容值也会改变，当检测到所述压力感应电容的电容值的变化之后，根据所述电容值变化量可以通过算法处理可以推算出对应的压力值，可将所述填充层40的弹性形变量划分成多个范围，每个范围分别对应一个压力等级，从而可以实现针对多个不同压力等级的压力检测。并且，在所述电子设备中，可以进一步根据不同压力等级可以对应不同的功能，从而根据不同按键压力来对应实现不同的按键功能。
根据本发明上述实施例提供的按键压力检测方法，可以实现多个等级的压力检测，从而实现多个按键功能。
本发明实施例还提供一种电子设备，所述电子设备包括一指纹按键结构，参阅图10所示的示意图，所述按键结构包括一叠层结构，其中，所述叠层结构包括依次叠放的盖板10、芯片层20、布线层30、填充层40和支撑板电极50，所述布线层30底部设置有一压力传感器，在具体实施例中，所述布线层30底部的压力传感器可以具体是与所述支撑板电极50平行相对的压力感应电极，所述压力传感器与所述支撑板电极50形成一电容，即压力感应电容。当使用者通过其手指按压所述指纹按键结构时，所述压力传感器将在所述手指的按压作用下压缩所述填充层40从而导致所述压力感应电容的电容值发生变化，其中所述压力感应电容的电容值变化量与所述手指按压所述指纹按键结构时施加的压力相对应。可选的，所述指纹按键结构还包括金属环2，所述金属环2至少部分套接在所述叠层结构外面，其中，所述金属环2可以包括支撑部和环形部，其中所述环形部可以套设在所述盖板10、所述芯片层20、所 述布线层30和所述填充层40的外围，所述支撑部可以从所述环形部的地面垂直向外延伸而成，并固定设置在所述支撑板电极50的表面，所述金属环2的内壁与所述盖板10的侧面邻接，可选的，所述金属环2的支撑部底面与所述支撑板电极50邻接处齐平。同时，所述金属环2的内壁与所述芯片层20、布线层30、填充层40之间形成间隙。可选的，所述金属环2和所述支撑板电极50通过激光焊接或胶粘的方式固定连接。可选的，所述间隙中还填充有弹性密封件。可选的，所述金属环2下端设置有缺口，所述缺口对应形成一空隙，所述金属环2下端的非缺口部分与所述支撑板电极50连接。可选的，所述布线层30包括由上至下依次堆叠的电路板层和压力传感器层，所述压力传感器层下方设置有所述压力传感器。可选的，所述电路板层为印制电路板或柔性电路板，当所述电路板层为柔性电路板时，所述布线层30还包括补强层，所述补强层位于所述电路板层和压力传感器层之间。可选的，所述填充层40为弹性材料填充层，所述弹性材料可以是弹性泡棉或者弹性胶；可选的，所述填充层40的厚度为0.2～0.3毫米。
可选的，所述电子设备可以是智能手机、平板电脑等终端设备。
本实施例中所描述的指纹按键结构为本发明上述实施例中所述的指纹按键结构，在此不再赘述。
根据本发明上述实施例提供的电子设备，通过在指纹识别的基础上增设压力传感器，将指纹识别和压力感应采用一体化的设计，实现指纹、压力感应功能集成在一个指纹按键中，一方面可以解决传统指纹机械按键容易损坏的问题，另一方面可以实现多个等级的压力检测，从而实现多个按键功能，同时本实施提供的指纹按键结构更薄，占用空间更小；此外，通过设置弹性密封件，可以实现密封防水防尘；通过在金属环设置缺口，可以进一步减少指纹按键结构所占用的空间。
以上仅为本发明的实施例，但并不限制本发明的专利范围，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来而言，其依然可以对前述各具体实施方式所记载的技术方案进行修改，或者对其中部分 技术特征进行等效替换。凡是利用本发明说明书及附图内容所做的等效结构，直接或间接运用在其他相关的技术领域，均同理在本发明专利保护范围之内。

Claims (10)

  1. 一种指纹按键结构，其特征在于，包括一叠层结构，其中，所述叠层结构包括依次叠放的盖板、芯片层、布线层、填充层和支撑板电极，所述布线层底部设置有一压力传感器，所述压力传感器与所述支撑板电极形成一电容。
  2. 根据权利要求1所述的指纹按键结构，其特征在于，所述指纹按键结构还包括金属环，所述金属环至少部分套接在所述叠层结构外面，其中，所述金属环的一端与所述支撑板电极邻接，所述金属环的内壁与所述盖板的侧面邻接，同时，所述金属环的内壁与所述芯片层、布线层、填充层之间形成间隙。
  3. 根据权利要求2所述的指纹按键结构，其特征在于，所述金属环和所述支撑板电极通过激光焊接或者胶粘的方式固定连接。
  4. 根据权利要求2所述的指纹按键结构，其特征在于，所述间隙中还填充有弹性密封件。
  5. 根据权利要求2～4任一项所述的指纹按键结构，其特征在于，所述金属环与所述支撑板电极连接的一端设置有缺口，且所述支撑板电极设置有对应的缺口，所述金属环下端的非缺口部分与所述支撑板电极的非缺口部分对应连接。
  6. 根据权利要求1所述的指纹按键结构，其特征在于，所述布线层包括由上至下依次堆叠的电路板层和压力传感器层，所述压力传感器层下方设置有所述压力传感器。
  7. 根据权利要求6所述的指纹按键结构，其特征在于，所述电路板层为柔性电路板，所述布线层还包括补强层，所述补强层位于所述电路板层和压力传感器层之间。
  8. 根据权利要求1所述的指纹按键结构，其特征在于，所述填充层为弹性材料填充层。
  9. 一种按键压力检测方法，所述按键压力检测方法应用于权利要求1～8任一项所述的指纹按键结构，其特征在于，所述方法包括：
    当所述指纹按键结构受到外力按压时，检测所述布线层所包含的压力传感器与所述支撑板电极所形成电容的电容值是否发生变化；
    当所述电容的电容值发生变化时，检测所述电容当前的电容值或电容变化量；
    所述芯片根据所述电容的电容值或电容变化量计算所述指纹按键结构受到的压力值。
  10. 一种电子设备，其特征在于，所述电子设备包括权利要求1～8任一项所述的指纹按键结构。
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