WO2018113435A1 - 样本承载系统 - Google Patents

样本承载系统 Download PDF

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Publication number
WO2018113435A1
WO2018113435A1 PCT/CN2017/109968 CN2017109968W WO2018113435A1 WO 2018113435 A1 WO2018113435 A1 WO 2018113435A1 CN 2017109968 W CN2017109968 W CN 2017109968W WO 2018113435 A1 WO2018113435 A1 WO 2018113435A1
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WO
WIPO (PCT)
Prior art keywords
temperature control
temperature
control device
plate
carrying system
Prior art date
Application number
PCT/CN2017/109968
Other languages
English (en)
French (fr)
Inventor
郑焦
姜泽飞
周志良
颜钦
Original Assignee
深圳市瀚海基因生物科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市瀚海基因生物科技有限公司 filed Critical 深圳市瀚海基因生物科技有限公司
Publication of WO2018113435A1 publication Critical patent/WO2018113435A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00—Apparatus for enzymology or microbiology
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00—Apparatus for enzymology or microbiology
    • C12M1/34—Measuring or testing with condition measuring or sensing means, e.g. colony counters
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00—Apparatus for enzymology or microbiology
    • C12M1/36—Apparatus for enzymology or microbiology including condition or time responsive control, e.g. automatically controlled fermentors
    • C12M1/38—Temperature-responsive control

Definitions

  • the present invention relates to the field of sequencing, and in particular, to a sample carrying system.
  • the chip is used as a carrier for sample processing, and when these instruments are used, biochemical reactions are required in the chip, and finally, the processing of the sample is detected.
  • biochemical reaction of the sample due to the involvement of organic polymers such as enzymes, it is necessary to cool or raise the temperature of the chip, and these cooling and heating processes must be rapid, and the temperature control must be stable and accurate. Otherwise, the reaction rate is affected, which not only consumes time, but also may cause the sample to deteriorate, making the detection result inaccurate.
  • the present invention is directed to at least one of the technical problems existing in the related art or to provide a useful choice. To this end, the present invention is required to provide a sample carrying system.
  • a sample carrying system includes a bottom plate, a clamping platform, a temperature control device, and an elastic support assembly.
  • the clamping platform is fixed on the bottom plate and is provided with a receiving groove, and a bottom of the receiving groove is provided with a through hole.
  • the temperature control device is connected to the accommodating groove through the through hole.
  • the temperature control device is elastically supported on the bottom plate by the elastic support assembly.
  • the temperature control device is elastically supported on the bottom plate by the elastic supporting component, so that the chip is loaded into the receiving groove, and the contact between the chip and the temperature control device and the bottom plate is elastic contact, effectively preventing The chip assembly is damaged.
  • the elastic support assembly includes a guiding cylinder and an elastic member
  • the temperature control device includes a temperature control portion and a guiding column
  • the guiding column is disposed away from the receiving groove.
  • the guiding cylinder is fixed on the bottom plate, the guiding column passes through the elastic member and the guiding cylinder, and the elastic member elastically resists Between the temperature control portion and the guide cylinder.
  • the guiding cylinder is a linear bearing
  • the guiding post is in sliding contact with the ball of the linear bearing.
  • the temperature control device includes a fixing plate, a temperature conducting plate, a temperature control element, and a guiding column, and the temperature control element is sandwiched between the fixing plate and the temperature conducting plate.
  • the temperature control element is in contact with the temperature conduction plate and the fixing plate, and the temperature conduction plate is used for contacting with a chip loaded in the accommodating groove, and the guiding column is disposed away from the On the surface of the fixing plate of the temperature control element, the guiding column penetrates the elastic supporting component.
  • the temperature control device further includes a water bath disposed on a surface of the fixed plate remote from the temperature control element, the water bath being spaced from the guide post.
  • the temperature control device includes a temperature sensor disposed on the temperature conducting plate
  • the water bath includes a heat sink, a cover plate, a liquid inlet joint, and a liquid outlet joint.
  • the heat dissipation plate is provided with a flow channel groove, and the heat dissipation plate is in contact with the fixed plate.
  • the cover plate is connected to the heat dissipation plate and covers the flow channel groove to form a liquid cavity, the liquid cavity is for accommodating a cooling liquid, and the liquid inlet is connected to the liquid chamber And the liquid outlet.
  • the liquid inlet joint is connected to the liquid inlet.
  • the liquid outlet joint is connected to the liquid outlet.
  • the temperature control device includes a temperature controlled water bath device including a heat sink, an infusion pump, and a cooling device.
  • the fin ⁇ is provided with a flow path for the coolant to flow, and an inlet of the flow path is connected to the liquid outlet.
  • the infusion pump connects the outlet of the flow path and the inlet connection.
  • the cooling device is for cooling the heat sink.
  • the temperature control device includes a thermal insulation disposed between the temperature conductive plate and the fixed plate.
  • the temperature control device includes a surface for contacting the chip, the surface being a matt black surface.
  • the clamping platform includes a clamping frame and a support base, the clamping frame is rotatably connected to the supporting base, and the supporting base is provided with the receiving a slot, the support seat is disposed on the bottom plate.
  • FIG. 1 is a perspective view of a sample carrying system according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a sample carrying system according to an embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of a temperature control device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a water bath and a temperature-controlled water bath device according to an embodiment of the present invention.
  • FIG. 5 is a partially exploded perspective view of a sample carrying system according to an embodiment of the present invention.
  • the sample carrying system 100 the bottom plate 10, the clamping platform 20, the clamping frame 22, the support base 24, the receiving groove 242, the through hole 2422, the panel 244, the button through hole 2442, the button 246, the flange 2462, and the card Buckle 248, temperature control device 30, temperature control portion 32, fixing plate 321, temperature conducting plate 322, temperature control element 323, water bath 324, heat sink 3242, cover plate 3244, inlet connector 3246, outlet connector 3248, temperature The sensor 325, the temperature control water bath device 326, the heat sink 3262, the infusion pump 3264, the cooling device 3266, the heat insulator 327, the surface 328, the guide post 34, the elastic support assembly 40, the guiding cylinder 42, the elastic member 44, the chip 50 .
  • Embodiments of the invention Embodiments of the invention
  • the sample carrying system 100 of the embodiment of the present invention includes a bottom plate 10, an interposing platform 20, a temperature control device 30, and an elastic support assembly 40.
  • the clamping platform 20 is fixed on the bottom plate 10 and is provided with a receiving groove 242.
  • the bottom of the receiving groove 242 is provided with a through hole 2422.
  • the temperature control device 30 is connected to the accommodating groove 2 42 through the through hole 2422 and elastically supported on the bottom plate 10 by the elastic supporting member 40.
  • the temperature control device 30 is elastically supported on the bottom plate 10 by the elastic support assembly 40, so that the chip 50 is loaded into the receiving groove 242, the chip 50 and the temperature control device 30 are
  • the contact of the bottom plate 10 is an elastic contact, which effectively prevents the chip 50 from being damaged by assembly.
  • the elastic supporting component 40 pushes the temperature control device 30 toward the receiving groove 242, so that the temperature control device 30 protrudes relative to the bottom surface of the receiving groove 242.
  • the chip 50 is loaded into the receiving groove 242
  • the chip 50 is pressed against the temperature control device 30 by the clamping frame 22 of the clamping platform 20, and at the same time, the pressed temperature control device 30 compresses the elastic supporting member 40 downward.
  • the elastic support assembly 40 is caused to generate an elastic force, and finally the chip 50 is locked on the clamping platform 20. After the entire process of loading the chip 50 and the chip 50 are locked, the chip 50 and the temperature control device 30 are in elastic contact with the bottom plate 10, effectively preventing damage during assembly and sequencing of the chip 50.
  • the elastic support assembly 40 includes a guiding cylinder 42 and a resilient member 44.
  • the temperature control device 30 includes a temperature control portion 32 and a guiding post 34.
  • the guiding post 34 is disposed away from the receiving slot 242.
  • the guiding cylinder 42 is fixed on the bottom plate 10.
  • the guiding post 34 passes through the elastic member 44 and the guiding cylinder 42, and the elastic member 44 elastically abuts against the temperature control portion 32 and the guiding cylinder 42. between.
  • the elastic member 44 can provide an elastic force, and the cooperation of the guiding cylinder 42 and the guiding post 34 can also ensure that the movement of the temperature control device 30 is relatively stable.
  • the chip 50 is loaded into the accommodating groove 242 ⁇ , is in contact with the temperature control device 30 and is pressed down, the ⁇ elastic member 44 is compressed, and the reaction force after the elastic member 44 is compressed is the chip 50 and the temperature control device. 30 provides sufficient Contact, at the same time, the resilient contact provided by the resilient member 44 ensures that the chip 50 is not susceptible to damage during the pressing process.
  • the resilient member 44 can be a spring, as such, which can reduce the manufacturing cost of the sample carrier system 100.
  • the elastic member 44 may be an elastic member such as a rubber cylinder, and is not limited thereto.
  • the guide barrel 42 is a linear bearing
  • the guide post 34 is in sliding contact with the ball of the linear bearing.
  • the linear bearing can also reduce the resistance of the temperature control device 30 when the temperature control device 30 is moved.
  • the temperature control device 30 is pressed downward, that is, the guiding column 34 needs to slide downward, and the ball of the linear bearing is directed at the guiding column 34. Slide down to reduce friction.
  • the temperature control device 30 includes a fixing plate 321, a temperature conducting plate 322, a temperature control element 323, and a guiding post 34.
  • the temperature controlling element 323 is sandwiched between the fixing plate 321 and Between the temperature-conducting plates 322, the temperature-control elements 323 are in contact with the temperature-conducting plate 322 and the fixing plate 321 for contacting the chip 50 loaded in the accommodating groove 242, and the guiding column 34 is disposed away from the temperature control.
  • the guiding post 34 is passed through the elastic supporting assembly 40.
  • the function of the temperature control device 30 is realized with a relatively simple structure, and the cost of the sample carrying system 100 is reduced.
  • the fixing plate 321 provides support for the temperature control element 323, and the temperature conduction plate 322 transmits the temperature generated by the temperature control element 323 to the chip 50, thereby realizing the control of the temperature of the chip 50.
  • the guide post 34 is threaded through the elastic support assembly 40, and the elastic force of the elastic support assembly 40 causes the chip 50 and the temperature control device 30 to be in close contact.
  • the temperature conducting plate 322 and the fixing plate 321 may be made of a metal material for guiding the temperature of the temperature control element 323.
  • the temperature control element 323 is a Peltier. With the Peltier effect, the temperature control element 323 can achieve cooling and heating. For example, by applying a current in a different direction to the temperature control element 323, the upper surface of the temperature control element 32 3 is cooled, the lower surface is heated, or the upper surface of the temperature control element 323 is heated, and the lower surface is cooled. versus The temperature conducting plate 322 contacting the upper surface of the temperature control element 323 conducts the temperature of the upper surface of the temperature controlling element 323 to the chip 50, thereby achieving temperature control of the chip 50.
  • a thermally conductive layer can be disposed between the temperature conducting plate 322 and the temperature controlling element 323, and the thermally conductive layer conducts the temperature of the temperature controlling element 323 to the temperature conducting plate.
  • the thermally conductive layer is a layer of silica gel.
  • the temperature control device 30 further includes a water bath 324 disposed on a surface of the fixed plate 321 remote from the temperature control element 323, the water bath 324 being spaced from the guide arch I column 34.
  • the water bath 324 can pass the temperature control element 3 through the fixing plate 321 and the crucible 3
  • the temperature control device 30 includes a temperature sensor 325 disposed on the temperature conducting plate 322.
  • the sample carrying system 100 operates. Since the temperature conducting plate 322 and the chip 50 are in close contact, the temperature of the temperature conducting plate 322 is equivalent to the temperature of the chip 50, so the temperature sensor 325 can obtain the temperature of the chip 50 and feed back to The external control device, such that the external control device can control the temperature of the chip 50 based on the feedback of the temperature sensor 325.
  • the temperature conducting plate 322 can be provided with a receiving hole, and the temperature sensor 325 is disposed in the receiving hole, so that the temperature of the chip 50 can be more accurately monitored.
  • the sample carrying system 100 can achieve a surface temperature accuracy of the chip 50 of ⁇ 0.5 ° C; the surface temperature fluctuation of the chip 50 is not more than 0.5 ° C; from room temperature 25 ° C to 65 ° C temperature rise time More than lmin, from 65 ° C to room temperature 25 ° C cooling time is not more than 1.5 min. Accurate sample temperature control, can improve biochemical reaction efficiency, reduce test time
  • the water bath 324 includes a heat sink 3242, a cover 3244, a liquid inlet 3246, and a liquid outlet 3248.
  • the heat dissipation plate 3242 is provided with a flow path groove, and the heat dissipation plate 3242 is in contact with the fixed plate 321.
  • the cover plate 3244 is connected to the heat dissipation plate 3242 and covers the flow channel groove forming liquid chamber.
  • the liquid chamber is for accommodating the cooling liquid, and the cover plate 3244 is provided with a liquid inlet port and a liquid outlet port which communicate with the liquid chamber.
  • the inlet connector 3246 is connected to the inlet port.
  • the liquid outlet connector 3248 is connected to the liquid outlet.
  • the water bath 324 is used to provide a coolant circulation that is used to dissipate heat from the lower surface of the temperature control element 323 that is in contact with the fixed plate 321 .
  • the flow channel groove provided on the heat dissipation plate 3242 can increase the contact area of the heat dissipation plate 3242 and the fixed plate 321 to improve heat dissipation efficiency.
  • the cooling liquid can be water. As such, the cost of the sample carrier system 100 can be reduced.
  • the cooling liquid may be a specially prepared cooling liquid, and is not limited herein. Specially designed coolants ensure a good thermal conductivity.
  • the temperature control device 30 includes a temperature controlled water bath device 326 that includes a heat sink 3262, an infusion pump 3264, and a cooling device 3266.
  • the heat sink 3262 is provided with a flow path for the coolant to flow, and the inlet of the flow path is connected to the liquid outlet joint 3248.
  • the infusion pump 3264 connects the outlet of the flow path to the inlet connection 3246.
  • Cooling device 3266 is used to cool fins 3262.
  • the heat of the water bath 324 can be taken to the temperature controlled water bath device 326 and dissipated through the heat sink 3262.
  • the temperature-controlled water bath device 326 is used to accelerate the heat exchange between the coolant and the external environment, thereby ensuring rapid cooling of the coolant.
  • the heat sink 3262 is used to exchange heat between the coolant and the external environment
  • the infusion pump 326 4 is used to promote circulation of the coolant
  • the cooling device 3266 is used to accelerate the heat exchange of the coolant in the fins 3262.
  • the cooling device 3266 can be a fan.
  • the fan is blown to the fins 3262 to increase the convection of the air, thereby accelerating the heat exchange of the coolant in the fins 3262.
  • the temperature control device 30 includes a thermal barrier 327.
  • the heat insulator 327 is disposed between the temperature conducting plate 322 and the fixing plate 321 .
  • the temperature conducting plate 322 and the fixing plate 321 are respectively in contact with two different faces of the temperature control element 323, and the temperatures of the two faces are different during the operation of the temperature controlling element 323.
  • the temperature transfer between the temperature conducting plate 322 and the fixing plate 321 is blocked by the heat insulating member 327, thereby ensuring that the temperature of the temperature conducting plate 322 is not Subject to solidification The effect of the temperature of the fixed plate 321 .
  • the insulation 327 can be an insulating cotton. Insulation cotton can be used to achieve insulation
  • the temperature control device 30 includes a surface 328 for contacting the chip 50, the surface 328 being a matt black surface.
  • the flow path in the chip 50 is transparent, and the sample carrying system 100 is operated, and a laser is emitted to the chip 50 to excite the sample in the chip 50 to emit fluorescence, and an image of the sample is formed by collecting fluorescence.
  • a laser is emitted to the chip 50 to excite the sample in the chip 50 to emit fluorescence, and an image of the sample is formed by collecting fluorescence.
  • surface 328 is the surface of temperature conducting plate 322 that is in contact with chip 50.
  • the clamping platform 20 includes a clamping frame 22 and a support base 24, and the clamping frame 22 is rotatably connected to the supporting base 24.
  • the supporting base 24 is provided with a receiving groove 242 for supporting The seat 24 is disposed on the bottom plate 10.
  • the chip 50 when the chip 50 is placed in the accommodating groove 242, the chip 50 can be rotated to the temperature control device 30 by the rotational connection of the framing frame 22 and the support base 24, thereby ensuring the chip 50. Full contact with the temperature control device 30. Thereafter, the clamping frame 22 is locked to the support base 24 by snapping to press the chip 50 to ensure the stability of the chip 50 during the sequencing process.
  • the clamping frame 22 can be provided with a torsion spring at the joint of the support base 24, and the torsion spring can drive the clamping frame 22 to smash relative to the support base 24 when the clamping frame 22 is unlocked.
  • the support base 24 is provided with a button 246, and the button 246 is coupled to the buckle 248.
  • the movement state of the buckle 248 can be controlled by the button 246, and the locking state of the rest support 24 of the clamp frame 22 can be released, so that the clamp frame 22 can be unlocked.
  • the button 246 can move the buckle 248 away from the clamping frame 22 by means of a lever connection, thereby unlocking the locking state of the clamping frame 22 and the buckle 248, which can be realized. Assembly or disassembly of the chip 50.
  • the button 246 is loosened, the buckle 248 loses its external force and the buckle 248 is reset.
  • the clamping frame 22 is closed, the clamping frame 22 is again snapped onto the buckle 248 to lock the clamping frame 22.
  • the support base 24 includes a panel 244, the panel 244 is provided with a button through hole 2442, and the button 246 is provided with a button through hole 2442.
  • the bottom of the button 246 is convexly disposed.
  • the flange 2462, the flange 2462 is in contact with the lower surface of the panel 244.
  • the panel 244 can be pressed against the flange 2462 to allow the button 246 to be pressed and reset more smoothly, and the button 246 can be reset and restricted from running out.
  • installation should be understood broadly, unless specifically defined and defined, for example, may be a fixed connection. , can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal connection of two elements or The interaction of the two components.
  • detachable connection or integrally connected
  • can be mechanical connection can also be electrical connection or can communicate with each other
  • can be directly connected can also be indirectly connected through an intermediate medium, can be the internal connection of two elements or The interaction of the two components.

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Abstract

本发明公开了一种样本承载系统。所述样本承载系统包括底板、夹装平台、温控装置和弹性支撑组件。夹装平台设置在底板上并设有容置槽，容置槽底部设有通孔。温控装置通过通孔与容置槽相连接并通过弹性支撑组件弹性支撑在底板上。本发明的样本承载系统中，温控装置通过弹性支撑组件弹性支撑在底板上，使得芯片装载到容置槽中时，芯片和温控装置与底板的接触为弹性接触，有效防止芯片装配时被损坏。

Description

样本承载系统 技术领域
[0001] 本发明涉及测序领域， 特别涉及一种样本承载系统。
背景技术
[0002] 在生物化学技术领域中， 例如样本制备、 样本处理检测、 基因测序领域等， 需 要使用温控装置进行制冷、 制热的操作， 对样本、 试剂和 /或这个反应体系等进 行温度控制。
[0003] 在基因测序仪、 杂交仪、 样本制备仪等仪器设备中， 芯片作为样本处理的载体 ， 使用这些仪器设备吋， 都需要在芯片中进行生化反应， 最终实现对样本的处 理检测， 在样本的生化反应过程中， 由于涉及到酶等有机高分子的参与， 需要 对芯片进行降温或者升温的操作， 而且这些降温、 升温的操作过程必须迅速， 同吋需要保证温度控制的稳定、 准确， 否则影响反应速率， 不但耗费吋间， 还 有可能导致样本变质， 使得检测结果不准确。 另外， 有很多物质在不同反应阶 段所需的温度也是不同的， 同样也要求设备仪器能够迅速转变温度。
技术问题
[0004] 本发明旨在至少解决相关技术中存在的技术问题之一或者提供一种有用的选择 。 为此， 本发明需要提供一种样本承载系统。
问题的解决方案
技术解决方案
[0005] 本发明实施方式的一种样本承载系统包括底板、 夹装平台、 温控装置和弹性支 撑组件。
[0006] 所述夹装平台固定在所述底板上并设有容置槽， 所述容置槽的底部设有通孔。
[0007] 所述温控装置通过所述通孔与所述容置槽相连接。
[0008] 所述温控装置通过所述弹性支撑组件弹性支撑在所述底板上。
[0009] 本发明的样本承载系统中， 温控装置通过弹性支撑组件弹性支撑在底板上， 使 得芯片装载到容置槽中吋， 芯片和温控装置与底板的接触为弹性接触， 有效防 止芯片装配吋损坏。
[0010] 在某些实施方式中， 所述弹性支撑组件包括导引筒和弹性件， 所述温控装置包 括温控部和导引柱， 所述导引柱设置在远离所述容置槽的所述温控部的一侧上 ， 所述导引筒固定在所述底板上， 所述导引柱穿设所述弹性件和所述导引筒， 所述弹性件弹性抵触在所述温控部和所述导引筒之间。
[0011] 在某些实施方式中， 所述导引筒为直线轴承， 所述导引柱与所述直线轴承的滚 珠滑动接触。
[0012] 在某些实施方式中， 所述温控装置包括固定板、 温度传导板、 温控元件和导引 柱， 所述温控元件夹设在所述固定板和所述温度传导板之间， 所述温控元件均 与所述温度传导板和所述固定板接触， 所述温度传导板用于与装载在所述容置 槽中的芯片接触， 所述导引柱设置在远离所述温控元件的所述固定板的表面上 ， 所述导引柱穿设所述弹性支撑组件。
[0013] 在某些实施方式中， 所述温控装置还包括设置在远离所述温控元件的所述固定 板的表面上的水浴室， 所述水浴室与所述导引柱间隔设置。
[0014] 在某些实施方式中， 所述温控装置包括设置在所述温度传导板上的温度传感器
[0015] 在某些实施方式中， 所述水浴室包括散热板、 盖板、 进液接头和出液接头。
[0016] 所述散热板上设置有流道槽， 所述散热板与所述固定板接触。
[0017] 所述盖板与所述散热板连接并覆盖所述流道槽以形成液腔， 所述液腔用于容纳 冷却液， 所述盖板上设置连通所述液腔的进液口和出液口。
[0018] 所述进液接头连接所述进液口。
[0019] 所述出液接头连接所述出液口。
[0020] 在某些实施方式中， 所述温控装置包括温控水浴装置， 所述温控水浴装置包括 散热片、 输液泵和冷却装置。
[0021] 所述散热片幵设有用于供所述冷却液流过的流路， 所述流路的进口连接所述出 液接头。
[0022] 所述输液泵连接所述流路的出口和所述进液接头。
[0023] 所述冷却装置用于冷却所述散热片。 [0024] 在某些实施方式中， 所述温控装置包括设置在所述温度传导板和所述固定板之 间的隔热件。
[0025] 在某些实施方式中， 所述温控装置包括用于与所述芯片接触的表面， 所述表面 为亚光黑表面。
[0026] 在某些实施方式中， 所述夹装平台包括夹装框与支撑座， 所述夹装框可转动地 连接在所述支撑座上， 所述支撑座幵设有所述容置槽， 所述支撑座设置在所述 底板上。
发明的有益效果
有益效果
[0027] 本发明实施方式的附加方面和优点将在下面的描述中部分给出， 部分将从下面 的描述中变得明显， 或通过本发明的实践了解到。
对附图的简要说明
附图说明
[0028] 本发明的上述和 /或附加的方面和优点从结合下面附图对实施方式的描述中将 变得明显和容易理解， 其中：
[0029] 图 1是本发明实施方式的样本承载系统的立体示意图。
[0030] 图 2是本发明实施方式的样本承载系统的分解示意图。
[0031] 图 3是本发明实施方式的温控装置的分解示意图。
[0032] 图 4是本发明实施方式的水浴室和温控水浴装置的结构示意图。
[0033] 图 5是本发明实施方式的样本承载系统的部分分解示意图。
[0034] 主要元件符号说明：
[0035] 样本承载系统 100、 底板 10、 夹装平台 20、 夹装框 22、 支撑座 24、 容置槽 242、 通孔 2422、 面板 244、 按钮通孔 2442、 按钮 246、 凸缘 2462、 卡扣 248、 温控装置 30、 温控部 32、 固定板 321、 温度传导板 322、 温控元件 323、 水浴室 324、 散热 板 3242、 盖板 3244、 进液接头 3246、 出液接头 3248、 温度传感器 325、 温控水浴 装置 326、 散热片 3262、 输液泵 3264、 冷却装置 3266、 隔热件 327、 表面 328、 导 引柱 34、 弹性支撑组件 40、 导引筒 42、 弹性件 44、 芯片 50。 本发明的实施方式
[0036] 具体实施方式
[0037] 下面详细描述本发明的实施方式， 所述实施方式的实施方式在附图中示出， 其 中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的 元件。
[0038] 请一并参阅图 1和图 2， 本发明实施方式的样本承载系统 100包括底板 10、 夹装 平台 20、 温控装置 30和弹性支撑组件 40。 夹装平台 20固定在底板 10上并设有容 置槽 242， 容置槽 242的底部设有通孔 2422。 温控装置 30通过通孔 2422与容置槽 2 42相连接并通过弹性支撑组件 40弹性支撑在底板 10上。
[0039] 本发明实施方式的样本承载系统 100中， 温控装置 30通过弹性支撑组件 40弹性 支撑在底板 10上， 使得芯片 50装载到容置槽 242中吋， 芯片 50和温控装置 30与底 板 10的接触为弹性接触， 有效防止芯片 50装配吋损坏。
[0040] 具体地， 当夹装平台 20还没装置芯片 50吋， 弹性支撑组件 40将温控装置 30顶向 容置槽 242， 使温控装置 30相对于容置槽 242的底面凸出。 当芯片 50装载至容置 槽 242吋， 通过夹装平台 20的夹装框 22将芯片 50压向温控装置 30， 与此同吋， 被 压的温控装置 30向下压缩弹性支撑组件 40， 使弹性支撑组件 40产生弹性力， 最 后将芯片 50锁紧在夹装平台 20上。 在芯片 50装载的整个过程和芯片 50被锁紧吋 ， 芯片 50和温控装置 30与底板 10为弹性接触， 有效防止芯片 50装配及测序过程 中的损坏。
[0041] 在某些实施方式中， 弹性支撑组件 40包括导引筒 42和弹性件 44， 温控装置 30包 括温控部 32和导引柱 34， 导引柱 34设置在远离容置槽 242的温控部 32的一侧上， 导引筒 42固定在底板 10上， 导引柱 34穿设弹性件 44和导引筒 42， 弹性件 44弹性 抵触在温控部 32和导引筒 42之间。
[0042] 如此， 弹性件 44能够提供弹性力， 同吋， 导引筒 42和导引柱 34的配合也能够保 证温控装置 30的移动较为稳定。
[0043] 可以理解， 芯片 50装载到容置槽 242吋， 与温控装置 30接触并下压， 此吋弹性 件 44被压缩， 弹性件 44被压缩后的反作用力为芯片 50和温控装置 30提供充分的 接触， 与此同吋， 弹性件 44提供的弹性接触确保芯片 50在下压过程中不容易损 坏。
[0044] 在某些实施方式中， 弹性件 44可以是弹簧， 如此， 能够降低样本承载系统 100 的制造成本。
[0045] 在某些实施方式中， 弹性件 44可以是橡胶圆柱等具备弹性的元件， 在此不做任 何限制。
[0046] 在某些实施方式中， 导引筒 42为直线轴承， 导引柱 34与直线轴承的滚珠滑动接 触。
[0047] 如此， 直线轴承在导引温控装置 30移动的同吋， 也能减少温控装置 30移动吋的 阻力。
[0048] 可以理解， 在芯片 50下压过程中， 温控装置 30会被压着向下移动， 也即是说， 导引柱 34需要向下滑动， 直线轴承的滚珠在导引柱 34向下滑动吋， 可以减小摩 擦。
[0049] 请参阅图 3， 在某些实施方式中， 温控装置 30包括固定板 321、 温度传导板 322 、 温控元件 323和导引柱 34， 温控元件 323夹设在固定板 321和温度传导板 322之 间， 温控元件 323均与温度传导板 322和固定板 321接触， 温度传导板 322用于与 装载在容置槽 242的芯片 50接触， 导引柱 34设置在远离温控元件 323的固定板 321 的表面上， 导引柱 34穿设弹性支撑组件 40。
[0050] 如此， 利用较简单的结构实现了温控装置 30的功能， 降低了样本承载系统 100 的成本。
[0051] 可以理解， 固定板 321为温控元件 323提供支撑， 温度传导板 322将温控元件 323 产生的温度传递至芯片 50， 从而实现芯片 50温度的控制。 导引柱 34穿设弹性支 撑组件 40， 利用弹性支撑组件 40的弹力使得芯片 50和温控装置 30紧密接触。
[0052] 在某些实施方式中， 温度传导板 322和固定板 321可以由金属材料制成， 用于传 导温控元件 323的温度。
[0053] 在一个例子中， 温控元件 323是珀尔帖。 利用珀尔帖效应， 温控元件 323可以实 现制冷制热。 例如， 通过对温控元件 323施加不同方向的电流， 使得温控元件 32 3的上表面制冷， 下表面制热， 或温控元件 323的上表面制热， 下表面制冷。 与 温控元件 323的上表面接触的温度传导板 322将温控元件 323的上表面温度传导至 芯片 50， 进而实现对芯片 50的温度控制。
[0054] 在某些实施方式中， 温度传导板 322和温控元件 323之间可以设置导热层， 导热 层将温控元件 323的温度传导至温度传导板。 如此， 提高了温控元件 323与温度 传导板 322之间的热传导率。 在一个例子中， 导热层是硅胶层。
[0055] 在某些实施方式中， 温控装置 30还包括设置在远离温控元件 323的固定板 321的 表面上的水浴室 324， 水浴室 324与导弓 I柱 34间隔设置。
[0056] 如此， 当温控元件 323工作吋， 水浴室 324能够通过固定板 321及吋将温控元件 3
23的热量带走。
[0057] 在某些实施方式中， 温控装置 30包括设置在温度传导板 322上的温度传感器 325
[0058] 如此， 能够实现对温度传导板 322的温度检测， 有利于对芯片 50的精确温度控 制。
[0059] 具体地， 样本承载系统 100工作吋， 由于温度传导板 322和芯片 50紧密接触， 温 度传导板 322的温度相当于芯片 50的温度， 所以温度传感器 325可以获得芯片 50 的温度并反馈至外部控制装置， 从而外部控制装置可以根据温度传感器 325的反 馈控制芯片 50的温度。
[0060] 在本发明实施方式中， 温度传导板 322可幵设有容置孔， 温度传感器 325穿设在 容置孔， 这样能更准确地监控芯片 50的温度。 在一个具体实施方式中， 样本承 载系统 100能够实现芯片 50表面温度准确度为 ±0.5°C; 芯片 50表面温度波动度不 大于 0.5°C; 从室温 25°C到 65°C升温吋间不大于 lmin， 从 65°C降至室温 25°C降温 吋间不大于 1.5min。 样本温度控制精准， 能够提升生化反应效率， 减少测试吋间
[0061] 请参阅图 4， 在某些实施方式中， 水浴室 324包括散热板 3242、 盖板 3244、 进液 接头 3246和出液接头 3248。 散热板 3242上设置有流道槽， 散热板 3242与固定板 3 21接触。 盖板 3244与散热板 3242连接并覆盖流道槽形成液腔， 液腔用于容纳冷 却液， 盖板 3244上设置连通液腔的进液口和出液口。 进液接头 3246连接进液口 。 出液接头 3248连接出液口。 [0062] 如此， 实现了高效的水浴室 324散热结构。
[0063] 可以理解， 水浴室 324用于提供冷却液循环， 利用冷却液为与固定板 321接触的 温控元件 323的下表面散热。 散热板 3242上设置的流道槽可以增大散热板 3242和 固定板 321的接触面积， 从而提高散热的效率。
[0064] 在某些实施方式中， 冷却液可以是水。 如此， 能够降低样本承载系统 100的成 本。
[0065] 在某些实施方式中， 冷却液可以是专门制作的冷却液， 在此不做任何限制。 专 门制作的冷却液可保证导热能力达到较为理想的状态。
[0066] 请再次参阅图 4， 在某些实施方式中， 温控装置 30包括温控水浴装置 326， 温控 水浴装置 326包括散热片 3262、 输液泵 3264和冷却装置 3266。 散热片 3262幵设有 用于供冷却液流过的流路， 流路的进口连接出液接头 3248。 输液泵 3264连接流 路的出口和进液接头 3246。 冷却装置 3266用于冷却散热片 3262。
[0067] 如此， 能够将水浴室 324的热量带到温控水浴装置 326并通过散热片 3262散发掉
[0068] 具体地， 温控水浴装置 326用于加速冷却液和外部环境的热交换， 从而确保冷 却液的快速降温。 散热片 3262用于使冷却液和外部环境进行热交换， 输液泵 326 4用于促进冷却液的循环， 冷却装置 3266用于加速散热片 3262中的冷却液的热交 换。
[0069] 在某些实施方式中， 冷却装置 3266可以是风扇。 通过风扇向散热片 3262吹风， 增加空气的对流， 从而实现加速散热片 3262中的冷却液的热交换。
[0070] 在某些实施方式中， 温控装置 30包括隔热件 327。 隔热件 327设置在温度传导板 322和固定板 321之间。
[0071] 如此， 能够避免温度传导板 322受固定板 321的温度干扰而导致对芯片 50的温度 控制不准确。
[0072] 具体地， 温度传导板 322和固定板 321分别与温控元件 323的两个不同面接触， 两个面的温度在温控元件 323工作过程中产生的温度不一样。 为了保证温度传导 板 322准确地将温控元件 323的温度传导至芯片 50， 所以利用隔热件 327隔断温度 传导板 322和固定板 321之间的温度传递， 从而确保温度传导板 322的温度不受固 定板 321的温度的影响。
[0073] 在某些实施方式中， 隔热件 327可以是隔热棉。 隔热棉可以在实现隔热的同吋
， 避免损坏温度传导板 322和固定板 321之间的温控元件 323。
[0074] 在某些实施方式中， 温控装置 30包括用于与芯片 50接触的表面 328， 表面 328为 亚光黑表面。
[0075] 如此， 可防止样本承载系统 100工作吋发出的激光反射对芯片 50的样片成像带 来负面影响。
[0076] 具体地， 芯片 50中的流道是透明的， 样本承载系统 100工作吋， 需发射激光至 芯片 50， 以激发芯片 50中的样品发出荧光， 并通过采集荧光来形成样品的图像 。 通过将与芯片 50接触的表面 328设置为亚光黑表面， 有效地减少了激光的反射
[0077] 在本发明实施方式中， 表面 328为与芯片 50接触的温度传导板 322的表面。
[0078] 在某些实施方式中， 夹装平台 20包括夹装框 22与支撑座 24， 夹装框 22可转动地 连接在支撑座 24上， 支撑座 24幵设有容置槽 242， 支撑座 24设置在底板 10上。
[0079] 如此， 通过夹装框 22相对于支撑座 24的转动， 可方便芯片 50的装载和卸载。
[0080] 具体地， 当芯片 50放置到容置槽 242中吋， 利用夹装框 22和支撑座 24的转动连 接可以转动夹装框 22将芯片 50压向温控装置 30， 从而确保芯片 50和温控装置 30 的充分接触。 之后， 夹装框 22通过卡扣的方式锁紧在支撑座 24， 以压紧芯片 50 ， 保证芯片 50在测序过程中的稳定性。 夹装框 22余支撑座 24的连接处可设置有 扭簧， 在夹装框 22解锁吋， 扭簧可驱动夹装框 22相对于支撑座 24打幵。
[0081] 请参阅图 5， 在某些实施方式中， 支撑座 24上设置有按钮 246， 按钮 246连接卡 扣 248。
[0082] 如此， 通过按钮 246可以控制卡扣 248的运动状态， 解除夹装框 22余支撑座 24的 锁紧状态， 从而可以将夹装框 22解锁。
[0083] 具体地， 在按钮 246被按下吋， 按钮 246可以通过杠杆连接的方式带动卡扣 248 远离夹装框 22运动， 从而解锁夹装框 22与卡扣 248的锁紧状态， 可以实现芯片 50 的装配或拆卸。 在按钮 246被松幵吋， 卡扣 248失去外力作用， 卡扣 248复位。 当 夹装框 22关闭吋， 夹装框 22再次与卡扣 248卡上而锁紧夹装框 22。 [0084] 请再次参阅图 5， 在某些实施方式中， 支撑座 24包括面板 244， 面板 244上幵设 有按钮通孔 2442， 按钮 246穿设按钮通孔 2442， 按钮 246的底部凸设有凸缘 2462 ， 凸缘 2462与面板 244的下表面抵触。
[0085] 如此， 面板 244可紧压凸缘 2462， 从而使得按钮 246的按下和复位较顺畅， 而且 能使得按钮 246复位吋得到限制， 不会跑出。
[0086] 在本发明的实施方式的描述中， 需要说明的是， 除非另有明确的规定和限定， 术语"安装"、 "相连"、 "连接 "应做广义理解， 例如， 可以是固定连接， 也可以是 可拆卸连接， 或一体地连接； 可以是机械连接， 也可以是电连接或可以相互通 讯； 可以是直接相连， 也可以通过中间媒介间接相连， 可以是两个元件内部的 连通或两个元件的相互作用关系。 对于本领域的普通技术人员而言， 可以根据 具体情况理解上述术语在本发明的实施方式中的具体含义。
[0087] 在本说明书的描述中， 参考术语"一个实施方式"、 "某些实施方式"、 "示意性实 施方式"、 "示例"、 "具体示例"或"一些示例"等的描述意指结合所述实施方式或 示例描述的具体特征、 结构、 材料或者特点包含于本发明的至少一个实施方式 或示例中。 在本说明书中， 对上述术语的示意性表述不一定指的是相同的实施 方式或示例。 而且， 描述的具体特征、 结构、 材料或者特点可以在任何的一个 或多个实施方式或示例中以合适的方式结合。
[0088] 尽管上面已经示出和描述了本发明的实施例， 可以理解的是， 上述实施例是示 例性的， 不能理解为对本发明的限制， 本领域的普通技术人员在本发明的范围 内可以对上述实施方式进行变化、 修改、 替换和变型。

Claims

权利要求书
[权利要求 1] 一种样本承载系统， 其特征在于， 包括：
底板；
固定在所述底板上的夹装平台， 所述夹装平台设有容置槽， 所述容置 槽的底部设有通孔；
温控装置， 所述温控装置通过所述通孔与所述容置槽相连接； 弹性支撑组件， 所述温控装置通过所述弹性支撑组件弹性支撑在所述 底板上。
[权利要求 2] 如权利要求 1所述的样本承载系统， 其特征在于， 所述弹性支撑组件 包括导引筒和弹性件， 所述温控装置包括温控部和导引柱， 所述导引 柱设置在远离所述容置槽的所述温控部的一侧上， 所述导引筒固定在 所述底板上， 所述导引柱穿设所述弹性件和所述导引筒， 所述弹性件 弹性抵触在所述温控部和所述导引筒之间。
[权利要求 3] 如权利要求 2所述的样本承载系统， 其特征在于， 所述导引筒为直线 轴承， 所述导引柱与所述直线轴承的滚珠滑动接触。
[权利要求 4] 如权利要求 1所述的样本承载系统， 其特征在于， 所述温控装置包括 固定板、 温度传导板、 温控元件和导引柱， 所述温控元件夹设在所述 固定板和所述温度传导板之间， 所述温控元件均与所述温度传导板和 所述固定板接触， 所述温度传导板用于与装载在所述容置槽中的芯片 接触， 所述导引柱设置在远离所述温控元件的所述固定板的表面上， 所述导引柱穿设所述弹性支撑组件。
[权利要求 5] 如权利要求 4所述的样本承载系统， 其特征在于， 所述温控装置还包 括设置在远离所述温控元件的所述固定板的表面上的水浴室， 所述水 浴室与所述导引柱间隔设置。
[权利要求 6] 如权利要求 4或 5所述的样本承载系统， 其特征在于， 所述温控装置包 括设置在所述温度传导板上的温度传感器。
[权利要求 7] 如权利要求 5所述的样本承载系统， 其特征在于， 所述水浴室包括： 散热板， 所述散热板上设置有流道槽， 所述散热板与所述固定板接触 盖板， 所述盖板与所述散热板连接并覆盖所述流道槽以形成液腔， 所 述液腔用于容纳冷却液， 所述盖板上设置连通所述液腔的进液口和出 液口；
进液接头， 所述进液接头连接所述进液口； 和
出液接头， 所述出液接头连接所述出液口。
[权利要求 8] 如权利要求 7所述的样本承载系统， 其特征在于， 所述温控装置包括 温控水浴装置， 所述温控水浴装置包括：
散热片， 所述散热片幵设有用于供所述冷却液流过的流路， 所述流路 的进口连接所述出液接头；
输液泵， 所述输液泵连接所述流路的出口和所述进液接头； 冷却装置， 所述冷却装置用于冷却所述散热片。
[权利要求 9] 如权利要求 4-8任意一项所述的样本承载系统， 其特征在于， 所述温 控装置包括设置在所述温度传导板和所述固定板之间的隔热件。
[权利要求 10] 如权利要求 1所述的样本承载系统， 其特征在于， 所述温控装置包括 用于与所述芯片接触的表面， 所述表面为亚光黑表面。
[权利要求 11] 如权利要求 1所述的样本承载系统， 其特征在于， 所述夹装平台包括 夹装框与支撑座， 所述夹装框可转动地连接在所述支撑座上， 所述支 撑座幵设有所述容置槽， 所述支撑座设置在所述底板上。
PCT/CN2017/109968 2016-12-21 2017-11-08 样本承载系统 WO2018113435A1 (zh)

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CN108018195B (zh) * 2018-01-23 2021-10-26 深圳市真迈生物科技有限公司 承载模块、核酸加载装置及用途
CN114247493B (zh) * 2020-10-20 2023-06-27 深圳铭毅智造科技有限公司 一种用于化学反应的芯片的固定装置

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