WO2018099062A1 - 显示基板及制备方法、显示装置 - Google Patents
显示基板及制备方法、显示装置 Download PDFInfo
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- WO2018099062A1 WO2018099062A1 PCT/CN2017/090895 CN2017090895W WO2018099062A1 WO 2018099062 A1 WO2018099062 A1 WO 2018099062A1 CN 2017090895 W CN2017090895 W CN 2017090895W WO 2018099062 A1 WO2018099062 A1 WO 2018099062A1
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- pixel defining
- substrate
- defining layer
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- organic light
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- At least one embodiment of the present disclosure is directed to a display substrate, a method of fabricating the same, and a display device.
- a pixel defining layer is used to define the shape of the pixel and store the ink.
- the surface of the pixel defining layer must have strong lyophobic properties, and at the same time, a small amount of offset falling ink droplets (for example, ink droplets falling on the inner edge of the pixel) are rolled down to In the pixel pit, the pixel defining layer needs to be configured as a lower layer lyophilic, upper layer lyophobic structure.
- there are interface problems between the two-layer structure (the lyophilic portion and the lyophobic portion) of the pixel-defining layer obtained by the current method and delamination occurs between each other, which cannot meet the requirements in the actual process.
- At least one embodiment of the present disclosure provides a display substrate including: a substrate substrate; a pixel defining layer pattern disposed on the substrate substrate, wherein the pixel defining layer pattern includes a substrate adjacent to the substrate substrate And a body layer and an oxide layer remote from the substrate, the body layer and the oxide layer being obtained by partially oxidizing a material layer for preparing the pixel defining layer pattern.
- the body layer is configured to have lyophilic properties
- the oxide layer is configured to have lyophobic properties
- the material for preparing the pixel defining layer pattern includes a siloxane-based organic material including hydroxylated polydimethylsiloxane.
- Alkylene or polystyrene block polydimethylsiloxane.
- the thickness of the oxidized portion of the pixel defining layer pattern is 30 to 80% of the total thickness of the pixel defining layer.
- the pixel defining layer pattern has a thickness of 1 to 2 ⁇ m in a direction perpendicular to a surface of the substrate substrate.
- the display substrate provided by at least one embodiment of the present disclosure may further include an organic light emitting device disposed in a pixel region defined by the pixel defining layer pattern.
- the organic light emitting device includes a first electrode on the substrate, an organic light emitting layer disposed on the first electrode, and a second electrode on the organic light-emitting layer.
- At least one embodiment of the present disclosure also provides a display device including any of the above display substrates.
- At least one embodiment of the present disclosure further provides a method of fabricating a display substrate, comprising: providing a substrate; forming a pixel defining layer on the substrate; performing oxidation processing on the pixel defining layer, wherein the pixel A side of the defining layer remote from the substrate substrate is partially oxidized, thereby causing the pixel defining layer to include a body layer proximate the substrate substrate and an oxide layer remote from the substrate substrate; defining the pixels
- the layer is subjected to a curing molding process, and a patterning process is performed on the pixel defining layer to form a pixel defining layer pattern.
- the body layer formed has lyophilic properties
- the formed oxide layer has lyophobic properties
- the material of the pixel defining layer pattern includes a siloxane-based organic material including a hydroxylated polydimethylsiloxane.
- polystyrene block polydimethylsiloxane is another material that is used as a siloxane-based organic material.
- the pixel defining layer is partially oxidized using ultraviolet rays or ozone.
- the thickness of the oxidized portion of the pixel defining layer pattern is 30 to 80% of the total thickness of the pixel defining layer.
- the pixel defining layer pattern has a thickness of 1 to 2 ⁇ m in a direction perpendicular to a surface of the substrate substrate.
- the temperature at which the pixel defining layer is subjected to a curing molding process ranges from 25 to 100 °C.
- the curing forming process of the pixel defining layer ranges from 0.5 to 6 hours.
- an organic light emitting device is formed in a pixel region defined by the pixel defining layer pattern.
- forming the organic light emitting device may include: forming a first electrode on the base substrate; forming an organic light emitting layer on the first electrode; A second electrode is formed on the organic light emitting layer.
- the organic light-emitting layer is formed using inkjet printing.
- FIG. 1 is a schematic structural diagram of a display substrate according to an embodiment of the present disclosure
- 2a-2g are process diagrams of a method of fabricating a display substrate according to an embodiment of the present disclosure.
- a pixel defining layer is formed by using two layers of different wettability materials for accurately ink jet printing and uniform thickness formation of a solution of an organic electroluminescent material.
- Organic electroluminescent material film when preparing a pixel defining layer It is necessary to first make an inorganic lyophilic material layer, prepare an organic lyophobic material layer on the inorganic lyophilic material layer, and then form two layers of materials into a pixel defining layer by a patterning process.
- a method of forming a two-layered pixel defining layer on a substrate has a high surface energy (lyophilic material) and a low second layer (upper layer) by using plasma treatment.
- At least one embodiment of the present disclosure provides a display substrate, a method of fabricating the same, and a display device.
- the display substrate includes a substrate substrate and a pixel defining layer pattern, wherein the pixel defining layer passes through a modified siloxane-based material such as hydroxylated PDMS (or polystyrene block polydimethylsiloxane and The derivative is formed, and then the surface thereof is subjected to oxidation treatment, and a film layer having a lyophobic property, such as a silicon dioxide film layer, is formed on the side of the oxidation treatment direction, and the surface layer of the pixel defining layer is transformed by the oxidation treatment portion.
- a modified siloxane-based material such as hydroxylated PDMS (or polystyrene block polydimethylsiloxane and The derivative is formed, and then the surface thereof is subjected to oxidation treatment, and a film layer having a lyophobic property, such as a
- the unoxidized portion adjacent to the substrate substrate is still a body layer having lyophilic properties, and then the layer is patterned to define a pixel defining layer pattern, and the pixel defining layer pattern is displayed. Subsequent preparation process steps of the substrate. Thereby, the pixel defining layer, the display substrate and the display device can be prepared in a simple process.
- the lyophilic property and the infusion property are determined by the nature of the object itself, and can be determined, for example, by the state of contact between the two substances. If the surface of a substance is easily wetted by the liquid medium, the substance has a pro Liquid properties, and vice versa.
- the body layer of the pixel defining layer pattern can adsorb ink so that the ink is not easily separated from the body layer, and the body layer has lyophilic properties; and the ink falls on the pixel.
- the oxide layer defining the layer pattern is rolled down to other positions (for example, rolling down to the position where the body layer is located), the ink is automatically separated from the oxide layer, that is, the oxide layer has lyophobic properties.
- FIG. 1 is a schematic structural view of the display substrate.
- the display substrate includes a base substrate 101 and a pixel defining layer pattern 104 formed over the substrate substrate 101.
- the pixel defining layer pattern 104 can be formed by a one-time film forming and patterning process from a lyophilic material layer, and the preparation process is simple; after the pixel defining layer is prepared using a material having lyophilic properties, the pixel defining layer is oxidized, and the oxidized portion is oxidized. Conversion to an oxide layer having lyophobic properties, while the unoxidized portion is still a host layer having lyophilic properties, and then subjected to a patterning process, A pixel defining layer pattern is obtained.
- the pixel defining layer pattern 104 structure thus obtained has no interface problem between the main body layer 1041 and the oxide layer 1042, and delamination is less likely to occur, and the stability of the structure of the pixel defining pattern 104 can be improved.
- the body layer 1041 having lyophilic properties and the oxide layer 1042 having lyophobic properties constitute a lyophilic-lyophobic two-layer structure of the pixel defining layer 104, when a subsequent process for preparing a display substrate such as an organic functional material (including organic light-emitting) is performed During the inkjet printing process of the material, a liquid such as ink falling on the pixel defining layer pattern 104 (or dripping on the edge of the pixel defining layer pattern 104) will fall to the pixel due to the presence of the lyophobic oxide layer 1042.
- a liquid such as ink that falls within the pixel region region (or dripped on the edge of the pixel defining layer pattern 104) is adsorbed in the pixel definition
- the pixel pattern is defined by the layer pattern 104.
- the preparation material of the pixel defining layer pattern 104 includes a siloxane-based organic material which can be modified by, for example, a hydrophilic functional group (for example, modified from lyophobic to lyophilic).
- a hydrophilic functional group for example, modified from lyophobic to lyophilic.
- polydimethylsiloxane (PDMS) has electrical insulation and high and low temperature resistance. It can be used for a long time at -50 ° C to +250 ° C. It has high compression ratio, low surface tension and good lyophobic liquid. Properties, and PDMS has a low surface energy property, and after it is in a fluid state, it is easy to achieve a smooth and uniform state during its coating process.
- the PDMS polymer can be modified, for example, hydroxylated, and can be converted into a lyophilic hydroxylated PDMS. After oxidizing the hydroxylated PDMS with lyophilic properties, for example, it is converted into an inorganic one with lyophobic properties.
- the silicon oxide layer can thereby satisfy the requirement of forming a lyophilic-lyophobic two-layer structure for the pixel defining layer pattern 104.
- the siloxane-based organic material used in at least one embodiment of the present disclosure is not limited to hydroxylated polydimethylsiloxane, and the polystyrene block polydimethylsiloxane and derivatives thereof also have lyophilic properties. However, it can also be converted into a lyophobic inorganic silica layer after being oxidized, and the same technical effect can be obtained.
- the thickness of the oxide layer 1042 as shown in FIG. 1 may be 30 to 80% of the total thickness of the pixel defining layer pattern 104.
- the proportion of oxide layer 1042 in pixel defining layer pattern 104 is determined by the process conditions and structural requirements for preparing the display substrate.
- the pixel area defined by the pixel defining layer pattern is used to store, for example, "ink” for printing in a display substrate preparation process such as inkjet printing, that is, a liquid material for forming an organic functional layer, so the pixel defining layer pattern needs to be certain Thickness, for example, provided in embodiments of the present disclosure
- the pixel defining layer pattern 104 may have a thickness of 1 to 2 ⁇ m in a direction perpendicular to the surface of the substrate 101.
- the display substrate may further include an organic light emitting device disposed in a pixel region defined by the pixel defining layer pattern 104 (not shown in the figure).
- the organic light-emitting device includes, for example, a first electrode 102, an organic light-emitting layer 105, and a second electrode 106 which are sequentially disposed on the base substrate 101.
- the first electrode 102 and the second electrode 106 control the electroluminescence properties of the organic light-emitting layer 105 in the corresponding pixel region by the voltage applied thereto.
- the first electrode 102 may be formed between the base substrate 101 and the pixel defining layer pattern 104, or the first electrode 102 may not be formed at a position where the pixel defining layer pattern 104 is formed on the base substrate 101 (eg, the first electrode 102) It may be formed in a region defined by the pixel defining layer pattern 104).
- the organic light-emitting device may include, for example, a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, a hole blocking layer, an electron blocking layer, or any of them, in addition to the organic light-emitting layer, as needed. combination.
- the second electrode 106 is not limited to being disposed only in the pixel region, and as shown in FIG. 1, it may be disposed as a common electrode on a side of the pixel defining layer pattern 104 away from the substrate 101.
- the display substrate further includes a pixel circuit layer 107 disposed between the substrate substrate 101 and the pixel defining layer pattern 104 , the pixel circuit layer 107 .
- a driver thin film transistor includes a driver thin film transistor.
- a source or a drain (not shown) of the driving thin film transistor is connected to the first electrode for applying a driving voltage, thereby controlling light emission of the organic light emitting layer 105 between the first electrode 102 and the second electrode 106. status.
- the pixel circuit layer 107 may further include a circuit configuration of a switching transistor, a storage capacitor, and the like.
- At least one embodiment of the present disclosure also provides a display device including the display substrate provided in the above embodiment.
- the display device may further include a structure such as a display driving unit, a power supply unit, or a touch unit.
- a structure such as a display driving unit, a power supply unit, or a touch unit.
- the display device may be a display device, a tablet, a mobile phone, a television, a camera, a navigation device, or the like having a display function.
- a method of preparing the display substrate includes: providing a substrate; forming a pixel defining layer on the substrate; Oxidizing the pixel defining layer, wherein a side of the pixel defining layer remote from the substrate substrate is partially oxidized, thereby causing the pixel defining layer to include a body layer adjacent to the substrate substrate and an oxide layer away from the substrate substrate; The defining layer is subjected to a curing molding process, and a patterning process is performed on the pixel defining layer to form a pixel defining layer pattern.
- the pixel defining layer included in the display substrate is formed of a lyophilic material by one film formation, and the oxidized portion is converted into a lyophobic material by oxidizing the surface layer thereof, thereby simplifying the pixel defining layer and Corresponding to the preparation process of the substrate and the display device and reducing the cost, and the inside of the pixel defining layer formed by the method does not have an interface problem, the layering is not easy to occur, and the stability of the pixel defining layer can be improved.
- the method of preparing the display substrate may further include forming an organic light emitting device in a pixel region defined by the pixel defining layer pattern.
- forming the organic light emitting device includes forming a first electrode, forming an organic light emitting layer on the first electrode, and forming a second electrode on the organic light emitting layer.
- a first electrode may be formed between the base substrate and the pixel defining layer pattern, and then a pixel defining layer pattern may be formed, and then the organic light emitting layer and the second electrode may be formed, or after the pixel defining layer is formed on the base substrate And forming a first electrode, an organic light-emitting layer, and a second electrode in this order.
- the method of preparing the display substrate further includes: forming a thin film transistor on the base substrate, wherein the thin film transistor may be located between the base substrate and the first electrode, and the first electrode is electrically connected to the source or drain of the thin film transistor pole.
- the specific structure of the prepared display substrate can be referred to the related content in the foregoing embodiment (for the embodiment of the display substrate), and the disclosure is not described herein.
- FIGS. 2a-2g are process diagrams of a method of fabricating a display substrate according to an embodiment of the present disclosure.
- FIG. 2a-2g one example of a display substrate preparation process provided by at least one embodiment of the present disclosure includes the following steps.
- a base substrate 101 is provided and a pixel circuit layer 107 including a driving thin film transistor is formed on the base substrate.
- a pixel defining layer 103 is formed on the base substrate 101 on which the pixel circuit layer 107 is formed, and then the surface of the pixel defining layer 103 is subjected to oxidation treatment.
- the pixel defining layer 103 is prepared, for example, of a siloxane-based material including, for example, a hydroxylated polydimethylsiloxane or a polystyrene block polydimethylsiloxane.
- a siloxane-based material including, for example, a hydroxylated polydimethylsiloxane or a polystyrene block polydimethylsiloxane.
- the alkane material is converted to a material having lyophobic properties, such as silica having lyophobic properties, after oxidation treatment.
- the surface of the pixel defining layer 103 is oxidized using ultraviolet rays or ozone.
- ultraviolet light UV
- the surface portion of the oxidized side of the pixel defining layer 103 is formed as a layer of a slightly harder than the PDMS film.
- the silicon film, the silicon dioxide film thus formed, has a lyophobic property.
- the proportion of the thickness of the oxidized portion in the total thickness of the pixel defining layer 103 is determined by actual needs. For example, controlling the oxidation processing time can control the proportion of the thickness of the oxidized portion in the total thickness of the pixel defining layer 103, for example, using 185.
- Ultraviolet light (UV) of -253 nm is treated for the pixel defining layer 103 composed of the hydroxylated PDMS material for 15 seconds (s) to 20 minutes (min), and the proportion of the thickness of the oxidized portion in the total thickness of the pixel defining layer 103 Can reach 30 to 80%.
- the oxidized portion of the pixel defining layer 103 is a lyophobic layer 1032 having lyophobic properties, and the portion not oxidized is still a lyophilic material, that is, the lyophilic layer 1031, and then the pixel
- the defining layer 103 is subjected to a curing molding process to form a solid form.
- the temperature of the curing process of the pixel defining layer 103 is in the range of 25 to 100 ° C; the curing process of the pixel defining layer 103 is performed in the range of 0.5 to 6 hours (h), and the curing molding process is performed.
- Time is related to temperature and materials.
- the pixel defining layer 103 composed of the hydroxylated PDMS material is subjected to a curing molding process at 60 ° C, and the processing time may be 4 h.
- a pixel defining layer 103 (including the lyophilic layer 1031 and the lyophobic layer 1032) is patterned to form a pixel defining layer pattern 104, wherein the lyophilic layer 1031 forms a corresponding body layer 1041, a lyophobic layer 1032 forms a corresponding oxide layer 1042, which together constitutes a lyophilic-lyophobic two-layer structure of the pixel defining layer pattern 104.
- the patterning process is a photolithographic patterning process, which includes, for example, coating a photoresist layer on a structure layer to be patterned, exposing the photoresist layer using a mask, and developing the exposed photoresist layer to A photoresist pattern is obtained, the structural layer is etched using a photoresist pattern, and then the photoresist pattern is optionally removed.
- an organic light emitting device (not shown) is formed in a defined region thereof, and the organic light emitting device includes, for example, a first electrode, an organic light emitting layer, and a first Two electrodes.
- the preparation process of the organic light-emitting device is shown in Figures 2e to 2g.
- a first electrode film is deposited in a region defined by the pixel defining layer pattern 104, and a patterning process is performed to form a first electrode 102 located in a display region defined by the pixel defining layer pattern, and the first electrode
- the electricity 102 is electrically connected to the source or the drain of the thin film transistor 107.
- the first electrode 102 may be formed of a transparent conductive material or a metal material.
- the material forming the first electrode 102 includes indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), and oxidation.
- ITO indium tin oxide
- IZO indium zinc oxide
- IGO indium gallium oxide
- GZO gallium zinc oxide
- ZnO indium oxide
- In 2 O 3 aluminum zinc oxide
- AZO aluminum zinc oxide
- carbon nanotubes carbon nanotubes.
- an organic light-emitting layer 105 is formed on the first electrode 102.
- the method of forming the organic light-emitting layer is inkjet printing.
- the lyophilic body layer 1041 adsorbs an inkjet printed liquid such as ink in a pixel region defined by the pixel defining layer pattern 104, and the lyophobic oxide layer 1042 will The liquid, such as ink, falling thereon repels into the pixel area defined by the pixel defining layer pattern 104.
- the organic light-emitting layer 105 may be a single layer or a composite structure composed of a plurality of different layers.
- a hole injection layer, a hole transport layer, an electroluminescent material layer may be formed as needed. Structures such as an electron transport layer and an electron injection layer.
- the preparation process of forming the organic light-emitting layer 105 on the first electrode 102 specifically includes: forming a hole injection layer on the first electrode 102; and forming a hole transmission on the hole injection layer. a layer; an organic light-emitting layer formed on the hole transport layer; an electron transport layer formed on the organic light-emitting layer; and an electron injection layer formed on the electron transport layer.
- a second electrode 106 is formed on the organic light-emitting layer 105.
- the second electrode 106 may be formed using a metal such as Ag, Al, Ca, In, Li, or Mg or an alloy thereof (for example, Mg-Ag magnesium silver alloy), for example, a material forming the second electrode 106 includes indium oxide. Tin (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO) or carbon nanotubes.
- a metal such as Ag, Al, Ca, In, Li, or Mg or an alloy thereof (for example, Mg-Ag magnesium silver alloy)
- a material forming the second electrode 106 includes indium oxide. Tin (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO) or carbon nanotubes.
- the second electrode 106 is not limited to being disposed only in the pixel region defined by the pixel defining layer pattern 104, and as shown in FIG. 2g, it may be disposed as a common electrode on the side of the pixel defining layer pattern 104 away from the substrate substrate 101.
- a first electrode may be deposited on the substrate a layer film, which is subjected to a patterning process to obtain a first electrode, and then a pixel defining layer is formed on the substrate, and then sequentially subjected to oxidation treatment, solidification molding, and patterning process to form a desired pixel defining layer pattern, and then Continue the subsequent preparation process.
- Embodiments of the present disclosure provide a display substrate, a preparation method, and a display device, and have at least one of the following beneficial effects:
- At least one embodiment of the present disclosure provides a display substrate and a method of fabricating the same, the pixel defining layer pattern preparation process included in the display substrate, comprising: forming a pixel defining layer by a lyophilic material such as a siloxane-based material, The surface layer is oxidized, and the oxidized portion is converted into a lyophobic material, and the unoxidized portion is still a lyophilic material. After the solidification molding and patterning process, the formed pixel defining layer pattern has a lyophilic-lyophobic two-layer structure, which is simplified. The preparation process and the production cost are reduced.
- a lyophilic material such as a siloxane-based material
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Abstract
Description
Claims (19)
- 一种显示基板,包括:衬底基板;像素界定层图案,其设置于所述衬底基板上,其中,所述像素界定层图案包括靠近所述衬底基板的主体层和远离所述衬底基板的氧化层,所述主体层和所述氧化层通过对制备所述像素界定层图案的材料层进行部分氧化得到。
- 根据权利要求1所述的显示基板,其中,所述主体层配置为具有亲液性质,所述氧化层配置为具有疏液性质。
- 根据权利要求1或2所述的显示基板,其中,制备所述像素界定层图案的材料包括硅氧烷类有机材料,所述硅氧烷类有机材料包括羟基化的聚二甲基硅氧烷或聚苯乙烯嵌段的聚二甲基硅氧烷。
- 根据权利要求1-3任一项所述的显示基板,其中,所述像素界定层图案被氧化部分的厚度为像素界定层图案总厚度的30~80%。
- 根据权利要求1-4任一项所述的显示基板,其中,在垂直于所述衬底基板所在面的方向上,所述像素界定层图案的厚度为1~2μm。
- 根据权利要求1-5任一所述的显示基板,还包括设置于所述像素界定层图案所限定的像素区域中的有机发光器件。
- 根据权利要求6所述的显示基板,其中,所述有机发光器件包括位于所述衬底基板上的第一电极、设置在所述第一电极上的有机发光层和设置在所述有机发光层上的第二电极。
- 一种显示装置,包括权利要求1-7中任一项所述的显示基板。
- 一种显示基板的制备方法,包括:提供衬底基板;在所述衬底基板上形成像素界定层;对所述像素界定层进行氧化处理,其中,所述像素界定层的远离所述衬底基板的一侧被部分氧化,由此使得所述像素界定层包括靠近所述衬底基板的主体层和远离所述衬底基板的氧化层;对所述像素界定层进行固化成型处理,并对所述像素界定层进行构图工艺以形成像素界定层图案。
- 根据权利要求9所述的制备方法,其中,形成的所述主体层具有亲液性质,形成的所述氧化层具有疏液性质。
- 根据权利要求9或10所述的制备方法,其中,所述像素界定层图案的材料包括硅氧烷类有机材料,所述硅氧烷类有机材料包括羟基化的聚二甲基硅氧烷或聚苯乙烯嵌段的聚二甲基硅氧烷。
- 根据权利要求9-11任一所述的制备方法,其中,使用紫外线或臭氧对所述像素界定层进行部分氧化。
- 根据权利要求9-12任一所述的制备方法,其中,所述像素界定层图案被氧化部分的厚度为像素界定层总厚度的30~80%。
- 根据权利要求9-13任一项所述的显示基板,其中,在垂直于所述衬底基板所在面的方向上,所述像素界定层图案的厚度为1~2μm。
- 根据权利要求9-14任一所述的制备方法,其中,对所述像素界定层进行固化成型处理的温度范围为25~100℃。
- 根据权利要求9-15任一所述的制备方法,其中,对所述像素界定层进行固化成型处理的时间范围为0.5~6小时。
- 根据权利要求9-16任一所述的制备方法,还包括:在所述像素界定层图案所限定的像素区域中形成有机发光器件。
- 根据权利要求17所述的制备方法,其中,形成所述有机发光器件包括:在所述衬底基板上形成第一电极;在所述第一电极上形成有机发光层;和在所述有机发光层上形成第二电极。
- 根据权利要求18所述的制备方法,其中,使用喷墨打印形成所述有机发光层。
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CN107331788B (zh) | 2017-06-26 | 2019-01-25 | 京东方科技集团股份有限公司 | Oled器件、oled显示装置及oled器件的制备方法 |
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CN107565063B (zh) * | 2017-07-24 | 2019-04-30 | 武汉华星光电半导体显示技术有限公司 | Oled背板的制作方法与oled面板的制作方法 |
JP6878744B2 (ja) * | 2017-09-26 | 2021-06-02 | エルジー・ケム・リミテッド | ディスプレイ画素転写用パターンフィルムおよびこれを用いたディスプレイの製造方法 |
CN108847135B (zh) | 2018-06-13 | 2021-04-23 | 云谷(固安)科技有限公司 | 一种可拉伸的柔性显示面板及其制备方法 |
CN109148516A (zh) * | 2018-07-20 | 2019-01-04 | 深圳市华星光电技术有限公司 | 像素界定结构及其制备方法、oled器件 |
CN109273509B (zh) * | 2018-10-15 | 2021-03-16 | 深圳市华星光电半导体显示技术有限公司 | 柔性显示装置 |
CN112420968B (zh) * | 2019-08-21 | 2023-02-03 | 咸阳彩虹光电科技有限公司 | 一种显示面板的制造方法、显示面板及显示装置 |
KR20210023720A (ko) * | 2019-08-21 | 2021-03-04 | 시앤양 차이훙 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | 표시 패널의 제조 방법, 표시 패널 및 표시장치 |
CN112420967A (zh) * | 2019-08-21 | 2021-02-26 | 咸阳彩虹光电科技有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
CN112201675B (zh) * | 2020-09-15 | 2022-09-27 | 云谷(固安)科技有限公司 | 显示基板及其制备方法 |
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